Surface treatment tool, processing process and device

Abstract

The embodiment of the invention provides a surface treatment tool, a machining process and a device, which are used for solving the problems that the flow and distribution uniformity of a surface polishing solution of the surface treatment tool is poorer, and the polishing quality and the polishing efficiency of a to-be-machined workpiece are adversely affected. The surface treatment tool comprises a polishing layer and a groove structure, the groove structure is arranged on the surface of the polishing layer, the groove structure comprises multiple layers of grooves arranged in the radial direction of the polishing layer, each layer of groove comprises multiple groove units arranged in an array mode in the circumferential direction of the polishing layer, and every two adjacent groove units are connected end to end; in the two adjacent layers of grooves, the connection point of the two adjacent groove units of the groove located in the inner layer is connected with one groove unit of the groove located in the outer layer.

Description

Technical Field

[0001] This application relates to the field of surface processing technology, specifically to a surface treatment tool, processing technology, and device. Background Technology

[0002] During the process of using surface treatment tools to process workpieces, the tools serve functions such as storing and transporting polishing fluid, removing processing residues, transmitting mechanical loads, and maintaining the polishing environment. When the surface of the surface treatment tool is smooth, uneven surface pressure distribution and poor polishing fluid flow can easily lead to problems such as over-polishing and scratches on the workpiece surface. Currently, grooving the surface of the surface treatment tool is a common method to solve this problem.

[0003] In related technologies, common groove types include concentric circular grooves, radial grooves, logarithmic grooves, grid-like grooves, and Archimedean spiral grooves. However, due to the influence of groove shape and the centrifugal force during the rotation of the surface treatment tool, the residence time of the polishing slurry on different areas of the tool's surface varies significantly. This results in poor flow and distribution uniformity of the polishing slurry on the tool's surface, adversely affecting the polishing quality and efficiency of chemical mechanical polishing. Summary of the Invention

[0004] This application discloses a surface treatment tool, processing technology, and device to solve the problem that the poor flow and distribution uniformity of the surface polishing liquid in the surface treatment tool adversely affects the polishing quality and efficiency of the workpiece.

[0005] In a first aspect, this application provides a surface treatment tool, which includes: a polishing layer and a trench structure. The trench structure is disposed on the surface of the polishing layer and includes multiple trenches arranged radially along the polishing layer. Each trench layer includes multiple trench units arranged circumferentially along the polishing layer, with adjacent trench units connected end to end. In two adjacent trench layers, the connection point of two adjacent trench units in the inner trench layer is connected to one trench unit in the outer trench layer.

[0006] In the surface treatment tool involved in this application, on the one hand, each trench layer is composed of multiple trench units arranged in a circumferential array along the surface treatment tool, with adjacent trench units connected end-to-end to form a continuous circumferential annular flow channel structure. This ensures sufficient trench area and also helps to store polishing slurry, improving the residence time and utilization rate of the polishing slurry. On the other hand, adjacent trench layers are functionally connected through the connection points of the inner trench units and the outer trench units, constructing a guiding channel along the radial direction of the surface treatment tool. This allows the polishing slurry to flow across trench layers at different radii. Thus, during the rotation of the surface treatment tool, the trench structure can guide the polishing slurry from the inner side to the outer periphery in an orderly manner, so as to promptly discharge debris carried by the polishing slurry. Furthermore, it helps to improve the flow and distribution uniformity of the polishing slurry across the entire polishing surface, thereby improving the polishing quality and efficiency of the surface treatment tool.

[0007] In one possible implementation, the trench structure includes an adjacent first trench layer and a second trench layer, with the first trench layer located radially outside the second trench layer; The first trench layer includes adjacent first trench units and second trench units. The first trench unit includes a first endpoint and a second endpoint, and the second trench unit includes a third endpoint and a fourth endpoint. The second endpoint and the third endpoint are connected. The second trench layer includes adjacent and sequentially arranged third trench units, fourth trench units and fifth trench units. The fourth trench unit includes a fifth end point and a sixth end point. The third trench units are connected to the fifth end point and the fifth trench units are connected to the sixth end point. The fifth endpoint is connected to the first trench unit and is located between the first and second endpoints. The sixth endpoint is connected to the second trench unit and is located between the third and fourth endpoints.

[0008] In this way, the polishing slurry can flow from the inner trench unit into the two adjacent outer trench units through its two ends. The trench structure can provide a smooth radial flow channel for the polishing slurry. In addition, this is also conducive to improving the connectivity between the various parts of the trench structure. Even if a channel is blocked due to particle blockage in a local area, the polishing slurry can still flow through another channel.

[0009] In one possible implementation, the fifth endpoint connects to the midpoint of the first trench unit, and the sixth endpoint connects to the midpoint of the second trench unit. This improves the symmetry and balance of the trench structure, which in turn enhances the distribution and flow uniformity of the polishing fluid within the trench, thereby optimizing the polishing effect. Furthermore, this trench structure design facilitates manufacturing, thus reducing manufacturing costs.

[0010] In one possible implementation, the trench structure includes an adjacent third trench layer and a fourth trench layer, with the third trench layer located radially outside the fourth trench layer; the multiple trench units of the third trench layer are divided into multiple trench unit groups, each trench unit group including at least two trench units; the trench units of the fourth trench layer correspond one-to-one with the trench unit groups of the third trench layer and are arranged radially opposite to each other along the polished layer.

[0011] In this way, the setting of the groove unit group in the third groove layer is conducive to adjusting the uniformity of the groove structure and avoiding the formation of a groove blank area in the internal area defined by a single groove unit due to its large area. This would cause a sudden change in the groove contact area of ​​the workpiece during the polishing process, thereby improving the uniformity of pressure transmission and the consistency of material removal during the polishing process, so as to obtain a high-quality, high-flatness polished surface.

[0012] In one possible implementation, the third and fourth trench layers form a pair of trench layers, and the trench structure includes multiple pairs of trench layers arranged radially. In this way, the surface of the polishing layer can form a periodic, modularly distributed trench structure, and channels for the radial flow of polishing fluid can also be formed between the multiple pairs of trench layers.

[0013] In one possible implementation, in two adjacent pairs of trench layers, the third trench layer in the inner pair of trench layers includes a first trench unit group, the first trench unit group includes a sixth trench unit, and the fourth trench layer in the outer pair of trench layers includes an adjacent seventh trench unit and an eighth trench unit; the sixth trench unit is connected between the seventh trench unit and the eighth trench unit, and the trench units of the first trench unit group, except for the sixth trench unit, are individually connected to the seventh trench unit and / or the eighth trench unit.

[0014] In this way, an effective connection is formed between the outer trench of the inner trench pair and the inner trench of the outer trench pair. In addition, the connection between the inner and outer trenches of the inner trench pair enables effective communication between the inner trenches of the inner trench pair and the inner trenches of the outer trench pair, so that the polishing fluid can flow radially between different trench pairs.

[0015] In one possible implementation, the first trench unit group includes two adjacent trench units, one of which is a sixth trench unit, which is connected between the trisection points of the seventh trench unit and the trisection points of the eighth trench unit; the trench units of the first trench unit group other than the sixth trench unit are connected between the remaining two trisection points of the seventh trench unit; or, the trench units of the first trench unit group other than the sixth trench unit are connected between the remaining two trisection points of the eighth trench unit.

[0016] This also helps to improve the circumferential uniformity of the groove structure, which in turn helps to improve the flow and distribution uniformity of the polishing fluid, thereby improving the polishing quality and smoothness of the polished surface of the workpiece.

[0017] In one possible implementation, the trench structure includes a first trench group and a second trench group arranged radially along the polished layer, the first trench group being located radially outside the second trench group; the first trench group includes adjacent first trench layers and second trench layers; the second trench group includes multiple pairs of trench layers arranged radially along the polished layer, each pair of trench layers including adjacent third trench layers and fourth trench layers, the third trench layer being located radially outside the fourth trench layer, the multiple trench units of the third trench layer being divided into multiple trench unit groups, each trench unit group including at least two trench units, the trench units of the fourth trench layer and the trench unit groups of the third trench layer corresponding one-to-one and arranged opposite each other radially along the polished layer; the outermost third trench layer of the second trench group is formed as the innermost trench layer of the first trench group.

[0018] In this way, the grooves of the second groove group located radially inside the surface treatment tool are conducive to the rapid discharge of polishing fluid in the inner area where the linear velocity is low, while the grooves of the first groove unit group located radially outside the surface treatment tool are conducive to extending the residence time of polishing fluid in the outer area where the linear velocity is high. This results in a more uniform distribution of polishing fluid on the surface treatment tool, enabling a stable removal rate and a better flatness on the surface of the workpiece.

[0019] In one possible implementation, the groove units are formed as continuous curved segments, and the groove units arch from the outside to the inside along the radial direction of the polishing layer. In this way, the groove units do not obstruct the polishing fluid from draining radially outward, thus avoiding obstruction of the discharge of debris carried by the polishing fluid and preventing damage to the surface of the workpiece.

[0020] In one possible implementation, the groove unit is formed as a smooth curved segment. This eliminates inflection points and sharp corners on the groove unit, thereby avoiding localized turbulence or eddies in the polishing fluid caused by such points and corners, and improving the consistency of the polishing fluid flow velocity within the groove.

[0021] In one possible implementation, the groove elements are formed as arc segments, with adjacent groove elements being tangent. The geometric characteristics of the arc segments themselves help improve the curvature continuity and directional consistency of the polishing fluid flow path within the groove, thus helping to eliminate sources of flow disturbance and improving the fluid uniformity of the polishing fluid.

[0022] In one possible implementation, the surface of the polished layer has a central region, and the groove structure is arranged around the central region along the circumference of the polished layer. This helps to reduce the processing and manufacturing difficulty of the surface treatment tool, thereby reducing its production cost.

[0023] Secondly, this application also provides a processing method that uses the surface treatment tool of any of the above-mentioned technical solutions to process the workpiece. Since the processing method provided by this application uses the surface treatment tool of any of the above-mentioned technical solutions, both can solve the same technical problem and achieve the same effect.

[0024] Thirdly, this application also provides a device that is manufactured by surface treatment tools of any of the above-mentioned technical solutions. Since the device provided by this application is manufactured by surface treatment tools of any of the above-mentioned technical solutions, both can solve the same technical problem and achieve the same effect. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of a surface treatment tool provided for some embodiments of this application; Figure 2 This is a schematic diagram of a surface treatment tool provided for other embodiments of this application.

[0027] Explanation of reference numerals in the attached figures: 10-Surface treatment tools; 1- Polished layer; 11-Central Area; 2-Trench structure; 21-First trench group; 22-Second trench group; 23-First trench layer; 24-Second trench layer; 25-Third trench layer; 26-Fourth trench layer; 27-First trench unit group; 231 - First trench unit; 232 - Second trench unit; 241 - Third trench unit; 242 - Fourth trench unit; 243 - Fifth trench unit; 251 - Sixth trench unit; 261 - Seventh trench unit; 262 - Eighth trench unit. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0030] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0031] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0032] To facilitate the explanation of the technical solution of this application, before describing the surface treatment tool 10 in the embodiments of this application in detail, some concepts involved in this application will be explained first.

[0033] Chemical Mechanical Planarization (CMP) is a global planarization process widely used in the construction of multilayer metal interconnect structures. Its core objective is to achieve a high degree of planarization of the workpiece surface through the synergistic effect of chemical reaction and mechanical abrasion. CMP is widely used in semiconductor manufacturing to achieve a high degree of planarization of the wafer surface, providing ideal substrate conditions for subsequent photolithography, deposition, and other processes. Specifically, in the CMP process, chemical reagents in the slurry react with the wafer surface material to generate a softening layer or compound (such as oxide) that is easily removed. Then, pressure is applied through the relative movement between the surface treatment tool 10 and the wafer to grind and remove the reaction products, thereby achieving continuous material removal.

[0034] The specific embodiments involved in this application are described in detail below with reference to the accompanying drawings.

[0035] This application provides a surface treatment tool 10, which can be used in chemical mechanical polishing processes, such as surface planarization of wafers in the semiconductor manufacturing field. During chemical mechanical polishing, the surface treatment tool 10 can store and transport polishing slurry. The chemical reagents in the polishing slurry can react with the surface material of the workpiece to soften the surface. Furthermore, the surface treatment tool 10 removes the surface material of the workpiece by transferring a mechanical load to it.

[0036] Of course, the surface treatment tool 10 can also be used for other processing techniques, such as precision mechanical polishing of the surfaces of optical glass, sapphire, ceramics and other products. This application embodiment does not impose specific limitations on the specific application scenarios of the surface treatment tool 10.

[0037] The surface treatment tool 10 can be a polishing component, specifically, it can include, but is not limited to, a polishing pad, a polishing disc, or a polishing block. This application uses the surface treatment tool 10 as a polishing pad as an example for illustration, which does not constitute a special limitation on this application.

[0038] like Figure 1 As shown, Figure 1 This is a schematic diagram of a surface treatment tool 10 provided in some embodiments of this application. In some embodiments, the surface treatment tool 10 may include a polishing layer 1 and a groove structure 2, the groove structure 2 being disposed on the surface of the polishing layer 1.

[0039] Based on the above, optionally, the groove structure 2 can be distributed on the entire surface of the polishing layer 1, or the groove structure 2 can be distributed in a local area of ​​the surface of the polishing layer 1.

[0040] like Figure 1 As shown, in some embodiments, the surface of the polished layer 1 has a central region 11, and the trench structure 2 is disposed around the central region 11 along the circumference of the polished layer 1. That is, the central region 11 of the polished layer 1 is not covered by the trench structure 2. Of course, in other embodiments, if the processing technology of the surface treatment tool 10 allows, the trench structure 2 can also maximize the coverage of the entire surface of the polished layer 1, and this application does not impose specific limitations on this. Due to processing technology limitations, the remaining small area in the middle of the polished layer 1 that cannot be clearly observed does not belong to the aforementioned central region 11.

[0041] This helps to reduce the processing and manufacturing difficulty of the surface treatment tool 10, thereby reducing its production and manufacturing costs.

[0042] The shape of the polishing layer 1 may include, but is not limited to, being circular, elliptical, square, etc. In the embodiments of this application, the polishing layer 1 is formed as a circle for illustrative purposes, which does not constitute a special limitation on this application.

[0043] It should be noted that if the shape of polishing layer 1 is not a regular circle, the circumferential direction of polishing layer 1 can refer to the direction extending along the outer edge of polishing layer 1, and the radial direction of polishing layer 1 can refer to the direction from the outer edge of polishing layer 1 to the center of polishing layer 1.

[0044] To ensure that the surface treatment tool 10 maintains a uniform flow of the surface polishing fluid during the polishing process, thereby guaranteeing a stable removal rate and excellent flatness of the workpiece surface, such as... Figure 1 As shown, in some embodiments, the trench structure 2 includes multiple layers of trenches arranged radially along the polishing layer 1. Each trench layer includes multiple trench units arranged circumferentially along the polishing layer 1, with adjacent trench units connected end-to-end. In adjacent trench layers, the connection point of two adjacent trench units in the inner layer trench is connected to one trench unit in the outer layer trench.

[0045] It should be noted that in the embodiments of this application, "end-to-end connection" means that the endpoints of two adjacent trench units are connected to each other, and there is no common edge or overlapping area between the two adjacent trench units.

[0046] Based on the above, optionally, the connection point of two adjacent trench units in the inner layer can be connected to a trench unit in the outer layer. For example, the connection point of two adjacent trench units in the inner layer can be connected to the endpoint of a trench unit in the outer layer, that is, the trench units in the inner layer and the trench units in the outer layer are arranged opposite each other. As another example, the connection point of two adjacent trench units in the inner layer can be connected to any two or more equally spaced points of a trench unit in the outer layer. Optionally, the connection point of two adjacent trench units in the inner layer can also be connected to two trench units in the outer layer.

[0047] Based on this, on the one hand, each trench layer consists of multiple trench units arranged in a circumferential array along the polishing layer 1, with adjacent trench units connected end-to-end to form a continuous circumferential annular flow channel structure. This ensures sufficient trench area and also helps to store polishing fluid, improving the residence time and utilization rate of the polishing fluid. On the other hand, adjacent trench layers are functionally connected through the connection points of the inner trench units and the outer trench units, constructing a radial flow channel along the polishing layer 1. This allows the polishing fluid to flow across trench layers at different radii. Thus, during the rotation of the surface treatment tool 10, the trench structure 2 can guide the polishing fluid from the inner side to the outer periphery in an orderly manner, so as to promptly discharge debris carried by the polishing fluid. Furthermore, it helps to improve the flow and distribution uniformity of the polishing fluid on the entire polishing surface, thereby improving the polishing quality and efficiency of the surface treatment tool 10.

[0048] like Figure 1 As shown, in some embodiments, the trench unit can be formed as a continuous curved segment, and the trench unit arches from the outside to the inside along the radial direction of the polishing layer 1. Exemplarily, the trench unit can be formed as an arc segment or a continuous broken line segment, such as a circular arc segment, an elliptical arc segment, a double broken line segment, a triple broken line segment, etc.

[0049] When the surface treatment tool 10 rotates at high speed, the centrifugal force tends to throw the polishing liquid outward, while the inwardly arched groove unit forms a "reverse guidance" effect on the liquid, partially offsetting the centrifugal effect, causing the liquid to deflect inward or flow back during the flow process, prolonging the residence time of the polishing liquid and enhancing the fullness of the chemical reaction.

[0050] The groove unit arches from the outside to the inside along the radial direction of the polishing layer 1. The groove unit can provide a flow path from the inside to the outside for the polishing fluid. In this way, the groove unit will not block the polishing fluid from being discharged radially to the outside, thus avoiding the obstruction of the discharge of debris carried by the polishing fluid and causing damage to the surface of the workpiece.

[0051] like Figure 1As shown, in some embodiments, the groove unit can be formed as a smooth curved segment. For example, the groove unit can be formed as a circular arc segment, an elliptical arc segment, a parabolic segment, etc. In this way, there are no inflection points or sharp corners on the groove unit, thereby avoiding local turbulence or eddies of the polishing fluid caused by the presence of inflection points or sharp corners, which is beneficial to improving the consistency of the flow velocity of the polishing fluid in the groove.

[0052] like Figure 1 As shown, in some embodiments, the groove units are formed as arc segments, with adjacent groove units being tangent. The geometric characteristics of the arc segment structure itself help improve the curvature continuity and directional consistency of the polishing fluid flow path within the groove, which helps eliminate sources of flow disturbance and improves the fluid uniformity of the polishing fluid.

[0053] In the manufacturing process of the surface treatment tool 10, since the arc segments and tangential connections are standard geometric elements, they can be accurately modeled by CAD and easily realized by processes such as molding, photolithography or laser processing, which helps to reduce the molding difficulty of the groove structure 2 of the surface treatment tool 10.

[0054] The following embodiments are further descriptions based on the fact that the groove unit is formed as an arc segment, and should not be considered as a special limitation on the present application.

[0055] like Figure 1 As shown, in some optional embodiments, the groove unit of the outermost groove of the groove structure 2 extends to the edge of the surface treatment tool 10, which can ensure that debris and other contaminants mixed in the polishing fluid can be effectively discharged.

[0056] like Figure 1 As shown, in some embodiments, the trench structure 2 includes adjacent first trench layers 23 and second trench layers 24, with the first trench layer 23 located radially outside the second trench layer 24. The first trench layer 23 includes adjacent first trench units 231 and second trench units 232. The first trench unit 231 includes a first endpoint and a second endpoint, and the second trench unit 232 includes a third endpoint and a fourth endpoint, which are connected. The second trench layer 24 includes adjacent and sequentially arranged third trench units 241, fourth trench units 242, and fifth trench units 243. The fourth trench unit 242 includes a fifth endpoint and a sixth endpoint. The third trench unit 241 is connected to the fifth endpoint, and the fifth trench unit 243 is connected to the sixth endpoint. The fifth endpoint is connected to the first trench unit 231 and located between the first and second endpoints, and the sixth endpoint is connected to the second trench unit 232 and located between the third and fourth endpoints.

[0057] In this way, the polishing fluid can flow from the inner trench unit into the two adjacent outer trench units through its two ends. The trench structure 2 can provide a smooth radial flow channel for the polishing fluid. In addition, this is also conducive to improving the connectivity between the various parts of the trench structure 2. Even if a channel is blocked due to particle blockage in a local area, the polishing fluid can still flow through another channel.

[0058] Based on the above, the fifth endpoint can be connected to the midpoint of the first trench unit 231, and the sixth endpoint can be connected to the midpoint of the second trench unit 232.

[0059] When the fifth endpoint is connected to the midpoint of the first trench unit 231 and the sixth endpoint is connected to the midpoint of the second trench unit 232, the position where the polishing liquid enters the outer trench from the inner layer is exactly at the geometric center of its length direction, so that the liquid diffuses symmetrically from the midpoint to both ends, forming a bidirectional equidistant flow path, avoiding the uneven phenomenon of "fast flow on one side and slow flow on the other side" caused by eccentric liquid entry.

[0060] This design improves the symmetry and balance of the groove structure 2, which in turn enhances the distribution and flow uniformity of the polishing fluid within the groove, thereby optimizing the polishing effect and improving the smoothness of the workpiece surface. Furthermore, this design of the groove structure 2 facilitates manufacturing, thus reducing production costs.

[0061] Of course, the fifth endpoint can also be connected to other positions of the first trench unit 231. For example, the fifth endpoint can also be connected to the third or fourth division point of the first trench unit 231. The sixth endpoint can also be connected to other positions of the second trench unit 232. For example, the sixth endpoint can also be connected to the third or fourth division point of the second trench unit 232.

[0062] The surface treatment tool 10 of other embodiments of this application will now be described. For example... Figure 2 As shown, Figure 2 This is a schematic diagram of a surface treatment tool 10 provided for other embodiments of this application. In other embodiments, the surface treatment tool 10 includes a polishing layer 1 and a groove structure 2 disposed on the surface of the polishing layer 1, wherein this embodiment and the above-described Figure 1 The parts that are the same as those in the embodiments shown will not be described again; please refer to the above embodiments.

[0063] In other embodiments, the multi-layered trenches of the trench structure 2 can be divided into multiple groups of trenches arranged radially. For example, the trench structure 2 may include two, three, four or more groups of trenches. This application embodiment is illustrated by the example of the trench structure 2 including two groups of trenches, which does not constitute a special limitation on this application.

[0064] like Figure 2 As shown, in some other embodiments, the trench structure 2 includes a first trench group 21 and a second trench group 22 arranged radially along the polished layer 1, with the first trench group 21 located radially outside the second trench group 22.

[0065] The first trench group 21 includes adjacent first trench layer 23 and second trench layer 24, the structure of the first trench layer 23 and the second trench layer 24, and the connection relationship between them as described above. Figure 1 The embodiments shown are the same, and will not be described again in this application.

[0066] The second trench group 22 includes one or more pairs of trench layers arranged radially along the polishing layer 1. In this way, a periodic, modularly distributed trench structure 2 can be formed on the surface of the polishing layer 1, and channels for the flow of polishing fluid can also be formed between the multiple pairs of trench layers in the radial direction.

[0067] The following embodiments are further descriptions based on the second trench group 22 including multiple pairs of trench layers, and should not be considered as a special limitation of this application.

[0068] like Figure 2 As shown, each pair of trench layers includes an adjacent third trench layer 25 and a fourth trench layer 26, with the third trench layer 25 located radially outward from the fourth trench layer 26. The multiple trench units of the third trench layer 25 are divided into multiple trench unit groups, each trench unit group including at least two trench units. The trench units of the fourth trench layer 26 and the trench unit groups of the third trench layer 25 correspond one-to-one and are arranged radially opposite to each other along the polished layer 1.

[0069] Each trench unit group includes at least two trench units, which may include the following situations: for example, each trench unit group includes two trench units; or for example, each trench unit group includes more than two trench units, such as three, four or five, etc.

[0070] It should be noted that the term "relative arrangement" in the embodiments of this application can be understood as two relatively arranged structures being connected end to end, and one of them being located within the area defined by the other. That is to say, the relative arrangement of a trench unit of the fourth trench layer 26 and a trench unit group of the third trench layer 25 means that the trench unit group of the fourth trench layer 26 and the trench unit group of the third trench layer 25 are connected end to end, and the trench unit group is located within the arched area defined by the corresponding trench unit.

[0071] In this way, the arrangement of the groove unit group in the third groove layer 25 is conducive to adjusting the uniformity of the groove structure 2, and avoids the internal area defined by a single groove unit becoming a groove blank area due to its large area, which would cause a sudden change in the groove contact area of ​​the workpiece during the polishing process. This is conducive to improving the uniformity of pressure transmission and the consistency of material removal during the polishing process, so as to obtain a high-quality, high-flatness polished surface.

[0072] like Figure 2 As shown, in some other embodiments, in two adjacent pairs of trench layers, the third trench layer 25 in the inner pair of trench layers includes a first trench unit group 27, the first trench unit group 27 includes a sixth trench unit 251, and the fourth trench layer 26 in the outer pair of trench layers includes an adjacent seventh trench unit 261 and an eighth trench unit 262. The sixth trench unit 251 is connected between the seventh trench unit 261 and the eighth trench unit 262. The trench units of the first trench unit group 27, excluding the sixth trench unit 251, are individually connected to the seventh trench unit 261; or the trench units of the first trench unit group 27, excluding the sixth trench unit 251, are individually connected to the eighth trench unit 262; or some of the trench units of the first trench unit group 27, excluding the sixth trench unit 251, are individually connected to the seventh trench unit 261, and another part of the trench units of the first trench unit group 27, excluding the sixth trench unit 251, are individually connected to the eighth trench unit 262.

[0073] Based on the above, optionally, both the seventh trench unit 261 and the eighth trench unit 262 are divided into multiple equal parts, and the two ends of the sixth trench unit 251 are connected to the multiple division points of the seventh trench unit 261 and the eighth trench unit 262, respectively. The remaining trench units in the first trench unit group 27 located on one side of the sixth trench unit 251 can be connected to the remaining multiple division points of the seventh trench unit 261, and the remaining trench units in the first trench unit group 27 located on the other side of the sixth trench unit 251 can be connected to the remaining multiple division points of the eighth trench unit 262.

[0074] In this way, an effective connection is formed between the outer trench of the inner trench pair and the inner trench of the outer trench pair. In addition, the connection between the inner and outer trenches of the inner trench pair enables effective communication between the inner trenches of the inner trench pair and the inner trenches of the outer trench pair, so that the polishing fluid can flow radially between different trench pairs.

[0075] like Figure 2As shown, specifically, in some other embodiments, the first trench unit group 27 includes two trench units, one of which is the sixth trench unit 251. The sixth trench unit 251 is connected between the trisection points of the seventh trench unit 261 and the trisection points of the eighth trench unit 262, and the trench units of the first trench unit group 27 other than the sixth trench unit 251 are connected between the remaining two trisection points of the seventh trench unit 261.

[0076] Alternatively, the trench units of the first trench unit group 27, excluding the sixth trench unit 251, are connected between the remaining two trisection points of the eighth trench unit 262.

[0077] For example, the first trench unit group 27 includes two adjacent sixth trench units 251 and another trench unit. The seventh trench unit 261 and the eighth trench unit 262 are each divided into three equal regions, each with two trisection points, dividing the trench unit length into three segments. The trisection points of each of the seventh trench unit 261 and the eighth trench unit 262 are located at their respective one-third and two-thirds points. The sixth trench unit 251 is connected between the two-thirds point of the seventh trench unit 261 and the one-third point of the eighth trench unit 262, while the other trench unit is connected between the one-third and two-thirds points of the eighth trench unit 262 itself.

[0078] This also helps to improve the circumferential distribution uniformity of the groove structure 2, which in turn helps to improve the flow and distribution uniformity of the polishing fluid, thereby improving the polishing quality and flatness of the polished surface of the workpiece.

[0079] like Figure 2 As shown, in some other embodiments, the outermost third trench layer 25 of the second trench group 22 is formed as the innermost trench layer of the first trench group 21, so that the first trench group 21 and the second trench group 22 are continuous along the radial direction of the polishing layer 1 and maintain a certain arrangement pattern.

[0080] In this way, the grooves of the second groove group 22 located on the radial inner side of the polishing layer 1 are conducive to the rapid discharge of polishing liquid in the inner area with a lower linear velocity, while the grooves of the first groove unit group 27 located on the radial outer side of the polishing layer 1 are conducive to extending the residence time of polishing liquid in the outer area with a higher linear velocity. This makes the polishing liquid distribution on the surface treatment tool 10 more uniform, and enables a stable removal rate and a better flatness on the surface of the workpiece.

[0081] The surface treatment tool 10 of some embodiments of this application will now be described. In some embodiments, the surface treatment tool 10 includes a polishing layer 1 and a groove structure 2 disposed on the surface of the polishing layer 1, wherein this embodiment and the above-described Figure 2The parts that are the same as those in the embodiments shown will not be described again; please refer to the above embodiments.

[0082] In some other embodiments, the trench structure 2 is formed into a trench group by multiple layers of trenches along the radial direction of the polishing layer 1. The trench group may include multiple pairs of trench layers, each pair of trench layers may include an adjacent third trench layer 25 and a fourth trench layer 26.

[0083] Among them, the structure of the third trench layer 25 and the fourth trench layer 26, the relationship between them, and the relationship between two adjacent pairs of trench layers are described above. Figure 2 The embodiments shown are the same, and will not be described again in this application.

[0084] Some other embodiments of this application provide a processing technique that uses the surface treatment tools of any of the above-described technical solutions to process the workpiece. Since the processing technique provided in this application uses the surface treatment tools of any of the above-described technical solutions, both can solve the same technical problem and achieve the same effect.

[0085] For example, the processing technology may include chemical mechanical polishing or surface precision mechanical polishing.

[0086] Some other embodiments of this application provide a device that is manufactured by surface treatment tools of any of the above-described technical solutions. Since the device provided in this application is manufactured by surface treatment tools of any of the above-described technical solutions, both can solve the same technical problem and achieve the same effect.

[0087] For example, the device can be a semiconductor device, such as a wafer, which can be fabricated using the above-described processing technology with surface treatment tools.

[0088] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0089] The foregoing preferred embodiments have further illustrated the objectives, technical solutions, and advantages of the present invention. It should be understood that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface treatment tool, characterized in that, include: Polished layer; A groove structure is provided on the surface of the polished layer. The groove structure includes multiple layers of grooves arranged radially along the polished layer. Each layer of the groove includes multiple groove units arranged circumferentially along the polished layer. The groove units are formed as continuous curved segments and arch from the outside to the inside along the radial direction of the polished layer. Two adjacent groove units are connected end to end. In two adjacent trench layers, the junction of two adjacent trench units in the inner trench is connected to one trench unit in the outer trench.

2. The surface treatment tool according to claim 1, characterized in that, The trench structure includes an adjacent first trench layer and a second trench layer, wherein the first trench layer is located radially outside the second trench layer; The first trench layer includes adjacent first trench units and second trench units. The first trench unit includes a first endpoint and a second endpoint, and the second trench unit includes a third endpoint and a fourth endpoint. The second endpoint and the third endpoint are connected. The second trench layer includes a third trench unit, a fourth trench unit, and a fifth trench unit arranged adjacent to each other in sequence. The fourth trench unit includes a fifth endpoint and a sixth endpoint. The third trench unit is connected to the fifth endpoint, and the fifth trench unit is connected to the sixth endpoint. The fifth endpoint is connected to the first trench unit and located between the first endpoint and the second endpoint, and the sixth endpoint is connected to the second trench unit and located between the third endpoint and the fourth endpoint.

3. The surface treatment tool according to claim 2, characterized in that, The fifth endpoint is connected to the midpoint of the first trench unit, and the sixth endpoint is connected to the midpoint of the second trench unit.

4. The surface treatment tool according to claim 1, characterized in that, The trench structure includes an adjacent third trench layer and a fourth trench layer, wherein the third trench layer is located radially outside the fourth trench layer; The plurality of trench units in the third trench layer are divided into a plurality of trench unit groups, and each trench unit group includes at least two trench units; The groove units of the fourth groove layer and the groove unit groups of the third groove layer are in one-to-one correspondence and are arranged opposite each other along the radial direction of the polishing layer.

5. The surface treatment tool according to claim 4, characterized in that, The third trench layer and the fourth trench layer form a pair of trench layers, and the trench structure includes multiple pairs of trench layers arranged radially.

6. The surface treatment tool according to claim 5, characterized in that, In two adjacent pairs of trench layers, the third trench layer in the inner pair of trench layers includes a first trench unit group, the first trench unit group includes a sixth trench unit, and the fourth trench layer in the outer pair of trench layers includes an adjacent seventh trench unit and an eighth trench unit. The sixth trench unit is connected between the seventh trench unit and the eighth trench unit, and the trench units of the first trench unit group, excluding the sixth trench unit, are individually connected to the seventh trench unit and / or the eighth trench unit.

7. The surface treatment tool according to claim 6, characterized in that, The first trench unit group includes two adjacent trench units, one of which is the sixth trench unit, which is connected between the trisection points of the seventh trench unit and the trisection points of the eighth trench unit. The trench units of the first trench unit group, excluding the sixth trench unit, are connected between the remaining two trisection points of the seventh trench unit. Alternatively, the trench units of the first trench unit group, excluding the sixth trench unit, are connected between the remaining two trisection points of the eighth trench unit.

8. The surface treatment tool according to claim 2, characterized in that, The trench structure includes a first trench group and a second trench group arranged radially along the polished layer, wherein the first trench group is located radially outside the second trench group. The first trench group includes adjacent first trench layers and second trench layers; The second trench group includes multiple pairs of trench layers arranged radially along the polished layer. Each pair of trench layers includes an adjacent third trench layer and a fourth trench layer. The third trench layer is located radially outside the fourth trench layer. The multiple trench units of the third trench layer are divided into multiple trench unit groups. Each trench unit group includes at least two trench units. The trench units of the fourth trench layer and the trench unit groups of the third trench layer correspond one-to-one and are arranged opposite each other radially along the polished layer. The outermost third trench layer of the second trench group is formed as the innermost trench layer of the first trench group.

9. The surface treatment tool according to any one of claims 1-8, characterized in that, The groove unit is formed as a smooth curved segment.

10. The surface treatment tool according to claim 9, characterized in that, The groove unit is formed as an arc segment, and two adjacent groove units are tangent to each other.

11. The surface treatment tool according to any one of claims 1-8, characterized in that, The surface of the polished layer has a central region, and the groove structure is arranged around the central region along the circumference of the polished layer.

12. A processing technology, characterized in that, The processing technology uses the surface treatment tool described in any one of claims 1-11 to process the workpiece.

13. A device, characterized in that, The device is prepared by surface treatment using any one of claims 1-11.

Images