Sensor protection cover and preparation method thereof

Abstract

The invention relates to the technical field of sensors, and particularly provides a sensor protection cover and a preparation method thereof. The sensor protection cover comprises a cover body and a plurality of metal connecting pieces, the cover body comprises an elastic sealing layer, a metal grid layer and a fiber base material layer which are sequentially laminated and compounded from inside to outside, the metal connecting pieces are compounded on the side wall of the fiber base material layer, and the metal connecting pieces are used for fixing the sensor protection cover and external equipment. The preparation method is used for preparing the sensor protection cover. According to the sensor protection cover and the preparation method provided by the invention, good sealing performance, electromagnetic shielding performance and relatively good heat resistance are realized, and meanwhile, the sensor protection cover has excellent mechanical strength.

Description

Technical Field

[0001] This disclosure relates to the field of sensor technology, and in particular to a sensor protective cover and its preparation method. Background Technology

[0002] The driving environment for automobiles is complex and diverse, and the sensors of automotive electronic systems often have to withstand harsh conditions such as high temperature, high humidity, electromagnetic interference, mechanical vibration, and chemical corrosion. Therefore, automotive sensors need to be equipped with protective covers.

[0003] Currently, common sensor protective covers are mainly made of metal, engineering plastics, or liquid crystal polymers (LCP). Metal covers offer excellent mechanical strength and electromagnetic shielding, but their high density hinders vehicle weight reduction and makes them prone to sensor signal attenuation due to eddy current effects. Engineering plastic covers, while lightweight, have limited heat resistance and are susceptible to thermal deformation in the high temperatures of the engine compartment, leading to seal failure. They also offer almost no electromagnetic shielding capability and cannot withstand the strong electromagnetic interference within the engine compartment. While LCP film covers have good chemical resistance, they are brittle, have poor impact resistance, and cannot withstand the long-term vibrations and bumps of a vehicle. Summary of the Invention

[0004] This disclosure is made in view of the above-mentioned problems. This disclosure provides a sensor protective cover and its manufacturing method, achieving good sealing performance, electromagnetic shielding performance, and good heat resistance, while also possessing excellent mechanical strength.

[0005] According to a first aspect of this disclosure, a sensor protective cover is provided, comprising: a cover body and a plurality of metal connectors, the cover body comprising an elastic sealing layer, a metal mesh layer and a fiber substrate layer stacked sequentially from the inside to the outside, the sidewalls of the fiber substrate layer being laminated with the plurality of metal connectors, the plurality of metal connectors being used to fix the sensor protective cover to an external device.

[0006] According to a second aspect of this disclosure, a method for preparing a sensor protective cover is provided, comprising: A fiber substrate layer and a metal mesh layer are provided, and a preheated metal connector is placed at a predetermined position on the sidewall of the fiber substrate layer; The fiber substrate layer and the metal mesh layer are composited by hot pressing, while the material of the fiber substrate layer flows and embeds into the microporous structure of the metal connector to form a mechanical interlock, thus obtaining an intermediate composite. The sealing layer is formed on the surface of the intermediate composite material away from the fiber substrate layer, thereby obtaining the composite material; The composite material is molded to obtain the sensor protective cover.

[0007] Compared with existing technologies, in one or more technical solutions provided in this disclosure, the sensor protective cover includes a cover body, which comprises an elastic sealing layer, a metal mesh layer, and a fiber substrate layer stacked sequentially from the inside out. Therefore, when using this sensor protective cover, firstly, since the elastic sealing layer is located in the inner layer and directly contacts the sensor, it effectively blocks dust, moisture, and corrosive liquids from intruding into the sensor. Secondly, the middle metal mesh layer not only resists damage to the core components of the sensor from external impacts, but also reflects electromagnetic signals when there is electromagnetic interference in the environment, thereby significantly weakening the intensity of electromagnetic interference signals and preventing them from penetrating to the inner layer and contacting the sensor, ensuring the accuracy of the sensor's data acquisition and the stability of signal transmission. Next, the outer fiber substrate layer itself possesses excellent high-temperature resistance and chemical corrosion resistance, maintaining structural stability over a long period in the high-temperature and oily environment of the engine compartment. Simultaneously, both the metal mesh structure and the fiber substrate layer have pores, allowing air circulation between the inside and outside of the cover body, helping the sensor dissipate heat in a timely manner during operation, and preventing heat accumulation and excessively high sensor operating temperatures due to the fully sealed structure, which could affect performance stability.

[0008] Building upon this, multiple metal connectors are laminated to the sidewalls of the fiber substrate layer. These connectors secure the sensor cover to the external equipment. The interface between the metal connectors and the fiber substrate layer lacks the gaps found in traditional adhesives or riveters. Under stress, the fixing force from the external equipment is evenly distributed across the entire fiber substrate layer, rather than concentrating at localized points. Even under high-intensity vibration and impact conditions from the engine, the connectors remain securely attached to the cover, ensuring a stable connection between the sensor cover and the external equipment. This effectively prevents the risk of the cover shifting or the sensor being exposed due to loosening.

[0009] In summary, the three-layer composite structure of this embodiment achieves high-level sealing, effective electromagnetic shielding, and good heat resistance on a single protective cover. By directly bonding the metal connectors to the sidewall of the fiber substrate layer, a high-strength integrated structure is formed, enabling the protective cover to maintain the stability and reliability of the connection interface under high-intensity vibration, impact, and large-scale temperature cycling conditions, effectively preventing loosening or failure.

[0010] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0011] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0012] Figure 1 This is a schematic diagram of the structure of a sensor protective cover according to an exemplary embodiment of this disclosure; Figure 2 This is a schematic diagram of the structure of the cover according to an exemplary embodiment of this disclosure. Figure 3 This is a schematic diagram of the structure of the fiber substrate layer according to an embodiment of the present disclosure; Figure 4 This is a flowchart illustrating the fabrication process of a sensor protective cover according to an exemplary embodiment of this disclosure.

[0013] Figure label: 100-Cover, 110-Elastic sealing layer, 120-Metal mesh layer, 130-Fiber substrate layer, 131-Top dense layer, 132-Intermediate buffer layer, 133-Bottom contact layer, 200-Metal connector, 300-External equipment, 400-Sensor. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this disclosure more apparent, exemplary embodiments according to this disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this disclosure, and not all embodiments of this disclosure. It should be understood that this disclosure is not limited to the exemplary embodiments described herein.

[0015] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0016] In the description of this disclosure, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0017] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this disclosure should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0018] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0019] In automotive electronic systems, sensors play a crucial role, with their accurate measurements and stable operation directly impacting vehicle performance and safety. However, the driving environment is complex and variable, and sensors often face harsh conditions such as high temperature, high humidity, electromagnetic interference, mechanical vibration, and chemical corrosion. Therefore, automotive sensors require protective covers.

[0020] For example, temperatures inside a car's engine compartment can reach 150°C to 200°C. Traditional sensor protection materials may experience performance degradation at these high temperatures; for instance, plastic materials may soften and deform, compromising the sensor's seal and consequently affecting its measurement accuracy and lifespan. Furthermore, significant humidity fluctuations caused by driving in different climates can also impact sensors, with moisture intrusion potentially leading to short circuits and other problems.

[0021] Furthermore, the numerous electronic devices inside a car can generate electromagnetic interference that disrupts sensor signal transmission, causing deviations in the sensor's output signal. Additionally, the continuous vibrations and bumps during vehicle operation can cause mechanical damage to the sensors, and long-term accumulation may lead to loosening of sensor components, affecting their normal operation. Moreover, engine exhaust fumes and road-sprayed chemicals can also cause chemical corrosion to the sensors.

[0022] Currently, common sensor protective covers are mainly made of metal, engineering plastics, or LCP. Metal covers offer excellent mechanical strength and electromagnetic shielding performance, but their high density hinders vehicle lightweighting and makes them prone to sensor signal attenuation due to eddy current effects. Engineering plastic covers, while lightweight, have limited heat resistance and are prone to thermal deformation in the high temperatures of the engine compartment, leading to seal failure. They also offer almost no electromagnetic shielding capability and cannot cope with the strong electromagnetic interference within the engine compartment. While LCP film covers have good chemical resistance, they are brittle, have poor impact resistance, and cannot withstand the long-term vibrations and bumps of a vehicle.

[0023] To address the aforementioned issues, this disclosure provides a sensor protective cover and its fabrication method. Through a three-layer composite structure comprising an elastic sealing layer, a metal mesh layer, and a fiber substrate layer, it achieves improvements in sealing performance, electromagnetic shielding, heat dissipation, mechanical strength, and weight reduction under harsh environments. This effectively solves the multiple protection challenges faced by automotive sensors under complex and severe operating conditions, enhancing the reliability and safety of automotive electronic systems.

[0024] This disclosure provides a sensor protective cover. Figure 1 A schematic diagram of the structure of a sensor protective cover according to an exemplary embodiment of the present disclosure is shown, including a cover body 100. Figure 2 A schematic diagram of the structure of a cover 100, an exemplary embodiment of the present disclosure, is shown. The cover 100 includes an elastic sealing layer 110, a metal mesh layer 120, and a fiber substrate layer, which are stacked and composited from the inside out. It should be understood that the actual shape of the sensor protective cover can be designed according to actual needs. Figure 1 The shape of the sensor cover in this disclosure is only one example of what may be chosen in this disclosure, and is not limited thereto.

[0025] For example, the material of the elastic sealing layer 110 can be selected from silicone rubber, fluororubber, EPDM rubber or hydrogenated nitrile rubber, the material of the metal mesh layer 120 can include silver-plated copper, and the material of the fiber substrate layer 130 can include LCP fiber.

[0026] In practical applications, when using this sensor protective cover, firstly, the elastic sealing layer 110 effectively prevents dust, moisture, and corrosive liquids from intruding into the sensor. Secondly, the middle metal mesh layer 120 not only resists damage to the core components of the sensor from external impacts, but also reflects electromagnetic signals when there is electromagnetic interference in the environment, thereby significantly weakening the intensity of electromagnetic interference signals and preventing them from penetrating to the inner layer and contacting the sensor, ensuring the accuracy of the sensor's data acquisition and the stability of signal transmission. Next, the outer fiber substrate layer 130 itself possesses excellent high-temperature resistance and chemical corrosion resistance, maintaining structural stability over a long period in the high-temperature and oily environment of the engine compartment. Simultaneously, both the metal mesh structure and the fiber substrate layer 130 have pores, allowing air circulation between the inside and outside of the cover 100, helping the sensor dissipate heat promptly during operation and preventing heat accumulation and excessively high sensor operating temperatures due to the fully sealed structure, which could affect performance stability. Therefore, through the three-layer composite structure of this embodiment, high-level sealing, effective electromagnetic shielding, and good heat resistance are simultaneously achieved on a single protective cover.

[0027] In one feasible way, such as Figure 1 As shown, the sensor protective cover of this embodiment includes a plurality of metal connectors 200. The sidewall of the fiber substrate layer 130 is reinforced with a plurality of metal connectors 200, and the plurality of metal connectors 200 are used to fix the sensor protective cover to an external device.

[0028] It should be noted that, as Figure 1 As shown, the sensor protective cover of this embodiment is fixed to the external device 300 by a plurality of metal connectors 200 for protecting the sensor 400.

[0029] For example, multiple metal connectors 200 can be laminated to the sidewall of the fiber substrate layer 130 by hot pressing. The multiple metal connectors 200 are laminated to the sidewall of the fiber substrate layer 130 at predetermined positions.

[0030] In practical applications, the metal connector 200 is directly bonded to the side wall of the fiber substrate layer 130. Since there are no gaps in the bonding surface between the metal connector 200 and the fiber substrate layer 130 as in traditional adhesives or rivets, a high-strength integrated structure is formed. When under stress, the fixing force of the external equipment can be evenly distributed to the entire fiber substrate layer 130, rather than concentrated at local points. Even under the conditions of high-intensity vibration, impact and large temperature cycling of the engine, the stability and reliability of the connection interface can be maintained, preventing the connector from separating from the cover 100. This ensures that the sensor protective cover is always stably connected to the external equipment, effectively preventing the risk of the protective cover shifting and the sensor being exposed due to loose fixing.

[0031] In one feasible way Figure 3 A schematic diagram of the structure of the fiber substrate layer 130 according to an embodiment of the present disclosure is shown, as follows: Figure 3 As shown, the fiber substrate layer 130 of this embodiment has a gradient porosity structure, which includes a top dense layer 131, a middle buffer layer 132 and a bottom contact layer 133. The bottom contact layer 133 is located on the side close to the metal mesh layer 120. The porosity of the top dense layer 131 is ≤5%, the porosity of the middle buffer layer 132 is 15%~20%, and the bottom contact layer 133 is provided with a honeycomb through-hole array.

[0032] It is understood that the aforementioned gradient pore structure, including the top dense layer 131, the middle buffer layer 132, and the bottom contact layer 133, is defined based on the microstructure of the fiber substrate layer 130.

[0033] In practical applications, firstly, the extremely low porosity (≤5%) of the top dense layer 131 directly blocks the intrusion of oil, dust, and corrosive liquids from the external environment, preventing them from penetrating to the inner layer and affecting the metal mesh layer 120 or the sensor, thus providing a reliable first physical barrier for the protective cover. Secondly, the intermediate buffer layer 132, with a porosity of 15%~20%, can form an elastic buffer space while ensuring the structural strength of the protective cover. When the vehicle vibrates or there is a minor external impact, the intermediate buffer layer 132 can absorb the impact energy through the slight deformation of the pores, reducing the transmission of vibration to the sensor and lowering the risk of component loosening due to long-term vibration. Next, the honeycomb perforation array of the bottom contact layer 133 can form a tight nested structure with the metal mesh layer 120, increasing the contact area between the two and improving the interlayer bonding strength. At the same time, the perforations of the honeycomb structure can serve as air circulation channels, further optimizing the heat dissipation efficiency inside the cover 100 in conjunction with the pores of the metal mesh, and accelerating the dissipation of heat from the sensor's operation.

[0034] Building upon this, the top dense layer 131 creates a stable working environment for the middle and bottom layers by blocking external intrusion. Meanwhile, the middle buffer layer 132 alleviates vibration and thermal stress, preventing the top dense layer 131 from cracking due to excessive rigidity and the bottom contact layer 133 from being easily damaged due to its porous structure. The heat dissipation channels in the bottom contact layer 133 balance the heat dissipation limitations imposed by the top dense layer 131, ensuring that the enclosure 100 maintains good heat dissipation while achieving high sealing performance. These three elements work together to avoid the shortcomings of a single porous structure in terms of protection, buffering, and heat dissipation, and the gradient change in porosity allows the fiber substrate layer 130 to simultaneously meet the usage requirements of various scenarios.

[0035] In one example, the aperture of the aforementioned honeycomb through-hole array is 0.45mm~0.55mm, and the pore density is 20 pores / cm². 2 ~30 pieces / cm 2The porosity is 30%~40%. Among these, pore sizes of 0.45mm~0.55mm can form continuous heat dissipation channels, avoiding increased airflow resistance and decreased heat dissipation efficiency due to excessively small pore sizes, or localized structural strength reduction in the fiber substrate layer 130 due to excessively large pore sizes. 20 pores / cm 2 ~30 pieces / cm 2 The pore density and 30%~40% open area work together to balance the heat dissipation area and structural load-bearing capacity, with 20 pores / cm². 2 ~30 pieces / cm 2 The pore density provides sufficient heat dissipation channels per unit area, ensuring that the heat dissipation area meets the thermal management requirements of the sensor. The 30%~40% opening ratio limits the total proportion of channels, avoiding the decrease in the load-bearing capacity of the fiber substrate layer 130 due to too many openings, and also avoiding the problem of heat accumulation due to insufficient heat dissipation channels caused by too small an opening ratio.

[0036] Therefore, when the porosity is greater than 40%, the effective load-bearing area of ​​the fiber substrate layer 130 decreases, and the bonding strength with the metal connector 200 decreases, making it unable to withstand engine vibration and impact. Through the synergistic design of pore density and porosity, the bottom contact layer 133 can maintain sufficient structural strength while efficiently dissipating heat, adapting to the overall operating requirements of the protective cover.

[0037] In one feasible embodiment, the metal mesh layer 120 of this disclosure has a linewidth of 30μm to 80μm and an opening ratio of ≥85%. Designing the linewidth to 30μm to 80μm ensures that the metal mesh has sufficient tensile and impact resistance, making it less prone to breakage during engine vibration or minor collisions, maintaining the continuity of the electromagnetic shielding network. Simultaneously, it avoids excessively thick linewidths that would increase mesh weight, achieving lightweighting. Furthermore, it prevents excessively thick metal wires from obstructing the honeycomb perforations of the bottom contact layer 133, thus affecting the airflow efficiency of the heat dissipation channel. An opening ratio of ≥85% minimizes obstruction of airflow, allowing heat generated by the sensor to be quickly transferred through the metal mesh pores to the honeycomb channels of the bottom contact layer 133 and then discharged from the cover 100. At the same time, the high opening ratio also reduces the metal mesh's restriction on the deformation of the elastic sealing layer 110, ensuring that the sealing layer can fill gaps through its own deformation, maintaining high sealing performance.

[0038] In one alternative embodiment, the bonding strength between each metal connector 200 and the fiber substrate layer 130 in this disclosure is greater than or equal to 500N, enabling the metal connector 200 and the fiber substrate layer 130 to form a stable integrated structure, maintaining reliable connection under complex operating conditions. On the one hand, even under engine vibration, the connection interface will not loosen or develop micro-cracks, preventing the protective cover from losing its fixation due to the metal connector 200 detaching. On the other hand, it can offset the interfacial stress caused by the difference in thermal expansion and contraction of materials due to temperature fluctuations, preventing the metal connector 200 and the fiber substrate layer 130 from separating due to thermal stress, ensuring that the sensor protective cover remains stably attached to external equipment during long-term use.

[0039] In one feasible embodiment, this disclosure also provides a method for preparing a sensor protective cover. This method can be used to prepare the sensor protective cover according to embodiments of the present invention. Figure 4 A flowchart illustrating the fabrication process of the sensor protective cover according to an embodiment of this disclosure is shown, as follows: Figure 4 As shown, the method for preparing the sensor protective cover according to an embodiment of this disclosure includes: Step 401: Provide a fiber substrate layer 130 and a metal mesh layer 120, and place a preheated metal connector 200 at a predetermined position on the sidewall of the fiber substrate layer 130. It should be understood that the preheating temperature of the metal connector 200 is 170℃~190℃.

[0040] It should be noted that the aforementioned preset position is the stress-adaptation position when the metal connector 200 is fixed to the external equipment. Its determination must simultaneously meet the dimensional parameters of the external equipment mounting interface, the overall stress balance of the sensor protective cover, and the structural load-bearing capacity of the fiber substrate layer 130. Specifically, the preset position must be precisely aligned with the mounting holes of the external equipment (such as the engine block bracket or the electronic compartment mounting bracket). Furthermore, the preset position must avoid weak areas of the fiber substrate layer 130 (such as the dense area of ​​the honeycomb through-hole array in the bottom contact layer 133, or the interlayer composite joint), preferentially selecting the composite area of ​​the top dense layer 131 and the middle buffer layer 132. This area has high fiber packing density and excellent structural strength, better able to withstand the pressure transmitted by the metal connector 200, ensuring connection stability.

[0041] For example, the preparation method of the fiber substrate layer 130 includes: first, mixing LCP fibers, inorganic nanofillers, binders, and coupling agents to obtain a mixed slurry. Then, subjecting the mixed slurry to wet papermaking and stepped hot pressing to obtain an LCP fiber paper substrate. Next, processing one surface of the LCP fiber paper substrate into a honeycomb structure to obtain a pretreated substrate. Subsequently, subjecting the pretreated substrate to plasma activation treatment to obtain the fiber substrate layer 130.

[0042] For example, the inorganic nanofiller can be nano-silica or nano-alumina, the binder can be a fluoropolymer emulsion, such as polytetrafluoroethylene emulsion, and the coupling agent can be a silane coupling agent. The LCP fiber has a diameter of 2μm to 5μm, a melting point greater than or equal to 280℃, and a particle size of 10nm to 30nm.

[0043] In one example, the preparation method of the fiber substrate layer 130 includes: mixing LCP fibers, inorganic nanofillers, binders and coupling agents, feeding them into a high-speed disperser, adding deionized water to adjust the slurry concentration to 0.08%~0.15%, and stirring at a speed of 1500r / min~2000r / min for 30min~45min to uniformly disperse the components and obtain a mixed slurry. During wet papermaking, the mixed pulp is continuously formed using an inclined wire forming machine at a speed of 10m / min to 15m / min. After vacuum dehydration, the wet paper sheets are dried in a hot air dryer to remove moisture, followed by a stepped hot-pressing process: first, hot pressing at 120℃ to 140℃ and 2MPa to 3MPa for 2 to 3 minutes allows the fluoropolymer emulsion to initially form a film and fix the fiber structure; then, the temperature is increased to 250℃ to 280℃ and the pressure to 8MPa to 12MPa, at which point the LCP fiber surface slightly melts and forms a fusion bond with the fluoropolymer film, simultaneously completing densification and shaping. The paper is then naturally cooled to room temperature to obtain an LCP fiber paper substrate with a thickness of 0.3mm to 0.5mm. Next, one surface of the LCP fiber paper substrate is perforated by laser drilling or die punching to form a regular honeycomb through-hole array with a pore diameter of 0.5mm, resulting in a pretreated substrate. Subsequently, the pretreated substrate is subjected to plasma activation treatment using argon ion technology to obtain fiber substrate layer 130.

[0044] In the plasma activation process described above using argon ion treatment, the pretreated substrate is fixed on the stage of a vacuum plasma cleaner. After the cavity is closed, a vacuum is drawn, argon gas is introduced, the gas flow rate is adjusted, and the plasma power is set to 350~450W and the processing time to 60~120s. Argon ions, under the action of a high-frequency electric field, can form high-energy plasma, physically bombarding the surface of the pretreated substrate. On the one hand, this removes residual oil, dust, and other impurities from the surface; on the other hand, it breaks some chemical bonds on the substrate surface, forming a rough micro-surface. Simultaneously, it introduces active groups such as hydroxyl and carboxyl groups, significantly increasing the surface energy. This results in higher interlayer peel strength when subsequently combined with the metal mesh layer 120, effectively preventing interlayer separation under high temperature and vibration conditions, ultimately yielding a fiber substrate layer 130 that combines structural strength and interfacial bonding performance.

[0045] Specifically, the mass ratio of the LCP fiber, inorganic nanofiller, binder, and coupling agent is (70~80):(5~20):(3~10):(0.5~2). The LCP fiber, acting as the main skeleton, ensures the high-temperature resistance and mechanical support of the fiber substrate layer 130. The inorganic nanofiller fills the microscopic voids in the fiber, improving the material's density. Within this range, filler agglomeration can be avoided.

[0046] For example, the preparation method of the above-mentioned metal mesh layer 120 includes: first, providing a metal mesh; then, surface treating the metal mesh with a hydrophobic modifier solution to form the metal mesh layer 120. It should be understood that the metal mesh material can be copper plated with silver, the metal mesh linewidth is 30-80 μm, and the porosity is ≥85%. The hydrophobic modifier solution can be a fluorosilane solution.

[0047] Specifically, the aforementioned silver-plated copper mesh is immersed in the aforementioned fluorinated silane solution for 30 to 90 seconds, wherein the concentration of the fluorinated silane solution is 0.5 wt% to 1.5 wt%. After removal, excess solution is drained, and the mesh is dried in a hot air oven. During this process, silane molecules covalently bond with hydroxyl groups on the metal surface through silicon-oxygen bonds, forming hydrophobic groups, ensuring that the hydrophobic and antifouling properties are maintained even under long-term vibration and friction conditions.

[0048] In one example, the method for preparing the aforementioned metal connector 200 includes: treating the surface of stainless steel to form a porous structure with a pore size of 40μm~60μm and a pore depth of 150μm~250μm, thereby obtaining the metal connector 200. The stainless steel can be an austenitic stainless steel threaded insert, and the surface of the stainless steel can be treated with a laser to form a porous structure with a pore size of 40μm~60μm and a pore depth of 150μm~250μm.

[0049] Step 402: The fiber substrate layer 130 and the metal mesh layer 120 are composited by hot pressing, while the material of the fiber substrate layer 130 flows and is embedded in the microporous structure of the metal connector 200 to form a mechanical interlock, thus obtaining an intermediate composite.

[0050] For example, the honeycomb structure side of the fiber substrate layer 130 can be laid on the metal mesh layer 120, and then the preheated metal connector 200 can be placed at a preset position on the side wall of the fiber substrate layer 130. Then, the whole assembly is moved into a hot press, and the fiber substrate layer 130 and the metal mesh layer 120 are composited by hot pressing. At the same time, the material of the fiber substrate layer 130 is softened and flowed and embedded in the microporous structure of the metal connector 200 to form a mechanical interlock. After cooling, the metal connector 200 is firmly covered to obtain an intermediate composite.

[0051] For example, the process conditions for hot pressing include: hot pressing temperature of 250℃~270℃, hot pressing pressure of 7MPa~9MPa, and hot pressing time of 5min~10min. When the hot-pressing temperature is controlled between 250℃ and 270℃, the LCP fiber is in the transition zone from a highly elastic state to a viscous flow state. At this time, the fiber is not completely melted, the main skeleton structure can be maintained, but the mobility of the molecular chain segments is significantly enhanced. Combined with the softening and flow of the fluoropolymer binder, the fiber substrate layer 130 can soften and flow and embed into the microporous structure of the metal connector 200. This makes the bonding strength between the metal connector 200 and the fiber substrate layer 130 greater than or equal to 500N, achieving integrated molding and ensuring the strength of the metal connector 200 fixed to the external equipment. The fixing force can be evenly transmitted to the entire fiber substrate layer 130, avoiding structural damage caused by local stress concentration. Even under long-term vibration and temperature cycling conditions, the mechanical interlocking structure can ensure that the fixing strength between the metal connector 200 and the external equipment remains stable, ensuring the long-term reliability of the protective cover from a structural perspective.

[0052] Step 403: The intermediate composite is molded to obtain the composite material.

[0053] Specifically, the intermediate composite is molded to obtain the composite material, including: placing the intermediate composite in a suitable mold according to the actual shape requirements, and sequentially performing a preheating stage, a softening and holding pressure stage, and a setting stage for molding, followed by rapid cooling to 50℃~70℃ to obtain the composite material. The preheating stage process conditions include: a preheating temperature of 110℃~130℃ and a preheating time of 3min~6min. The softening and holding pressure stage process conditions include: a softening and holding pressure temperature of 170℃~190℃ and a softening and holding pressure time of 2min~4min. The setting stage process conditions include: a setting temperature of 210℃~230℃, a setting pressure of 9MPa~11MPa, and a setting time of 4min~6min. The rapid cooling time is 1.5min~2min.

[0054] In the above process, the preheating stage temperature is lower than the softening point of LCP fibers and the melting temperature of the binder, which avoids premature material flow leading to structural deformation. Simultaneously, slow heating ensures uniform temperature across the intermediate composite layers (fiber substrate layer 130, metal mesh layer 120, and metal connector 200), eliminating residual internal stress after hot-pressing. During the softening and pressure-holding stage, the fluoropolymer binder begins to soften, and the molecular chain mobility of the LCP fibers increases. Under the constraint of the mold cavity, the material initially conforms to the mold contour. At this stage, no high pressure is applied; only the mold closing pressure is maintained to prevent uneven linewidth in the metal mesh layer 120 due to drastic deformation. The shaping stage keeps the LCP fibers in a highly elastic state. Combined with a pressure of 9MPa~11MPa, the material fully conforms to the mold, while simultaneously promoting secondary fusion between the fiber and binder at the interface, improving the overall structural density. Finally, rapid cooling to 50℃~70℃ quickly locks the molecular chain structure, reducing shrinkage and deformation during cooling, ensuring the sensor protective cover substrate meets dimensional requirements while maintaining stable mechanical properties.

[0055] During the molding process, the surface of the fiber substrate layer 130 directly bears all the pressure from the molding process. The fibers on the surface are extremely compressed under high pressure, the interfaces between the fibers become blurred, and they diffuse and bond together, eliminating pores and forming a top dense layer 131 with a porosity of ≤5%. Then, since the top dense layer 131 has been compacted into a whole, the pressure transmission in the fiber substrate layer 130 follows the principle of pressure attenuation. Most of the pressure is absorbed and dissipated by the top dense layer 131, and the pressure transmitted to the middle layer has been significantly reduced. The reduced pressure is sufficient to make the middle layer fibers adhere and bond further, but not enough to completely eliminate the fiber network structure, thereby controlling the porosity within a suitable range of 15% to 20%, forming an intermediate buffer layer 132. Because one surface of the LCP fiber paper substrate is first processed into a honeycomb structure during the preparation of the fiber substrate layer 130, when the molding pressure is transmitted to one side of the bottom honeycomb pores, the cavity structure of the honeycomb pores further buffers the pressure. When the pressure, which has already been attenuated, acts on the honeycomb pore area, it can only drive the fibers to adhere and bond to the periphery of the pore wall, but cannot completely fill the cavity of the honeycomb pores. Ultimately, the bottom area retains the basic shape of the honeycomb pores, forming the bottom contact layer 133.

[0056] Step 404: Form an elastic sealing layer 110 on the surface of the composite material with metal mesh layer 120 away from the fiber substrate layer 130 to obtain a sensor protective cover.

[0057] Specifically, a 0.2mm~0.3mm thick layer of liquid silicone is sprayed onto the surface of the metal mesh layer 120 of the composite material, away from the fiber substrate layer 130. This is then cured at 75℃~85℃ for 25min~35min, forming an elastic sealing layer 110, thus obtaining the sensor protective cover. The liquid silicone has a Shore hardness of A40~A50. Liquid silicone with a Shore hardness of A40~A50 combines elasticity and support, allowing it to fill the tiny gaps between the protective cover and the mounting surface of external equipment through its own deformation, achieving IP67-level waterproof and dustproof performance. It also resists vibration and pressure from the engine compartment, preventing long-term deformation that could lead to seal failure.

[0058] In summary, the sensor protective cover and its manufacturing method disclosed in this embodiment achieve multi-dimensional technological breakthroughs through the synergistic innovation of pre-embedded microporous metal connectors 200, gradient pore design, and metal mesh. In terms of mechanical reliability, its pull-out force is >500N, and it can maintain zero failure of the connection interface under the vibration conditions of ISO16750-3 standard. Even after 500 thermal cycles from -40℃ to 150℃, the pull-out force retention rate of the metal connectors 200 can still be greater than 98%, solving the industry problem of easy loosening of traditional adhesive or snap-fit ​​structures. In terms of environmental adaptability, this protective cover achieves an IP67 sealing rating (without any corrosion after high-pressure water jet and 96-hour salt spray testing) and can suppress the operating temperature rise of the sensor to ≤8℃ in a high-temperature environment of 180℃, effectively solving the inherent contradiction between sealing performance and heat dissipation efficiency. In terms of signal integrity, its embedded metal mesh has an opening rate of ≥85%, which can achieve an electromagnetic shielding efficiency of 30dB. At the same time, it reduces the signal transmission attenuation at 1GHz frequency to only 0.2dB, which is 92% lower than that of traditional metal covers, providing stable support for the accurate monitoring of automotive electronic sensors under complex working conditions.

[0059] To verify the effectiveness of the sensor protective cover provided in the embodiments of the present invention, the embodiments of the present invention are demonstrated by comparing the embodiments with comparative examples.

[0060] Example 1 Embodiment 1 of this disclosure provides a method for preparing a sensor protective cover, which specifically includes the following steps: The first step involves mixing 70wt% LCP fiber, 20wt% inorganic nanofiller, 8wt% binder and 2wt% coupling agent, and putting the mixture into a high-speed disperser. Deionized water is added to adjust the slurry concentration to 0.08%~0.15%, and the mixture is stirred at a speed of 1500r / min~2000r / min for 30min~45min to ensure that the components are evenly dispersed and to obtain a mixed slurry. During wet papermaking, the mixed pulp is continuously formed using an inclined wire forming machine at a speed of 10m / min to 15m / min. After vacuum dehydration, the wet paper sheets are dried in a hot air dryer to remove moisture, followed by a stepped hot-pressing process: first, hot pressing at 120℃ and 2MPa for 2 minutes allows the fluoropolymer emulsion to initially form a film and fix the fiber structure; then, the temperature is increased to 250℃ and the pressure to 8MPa, at which point the LCP fiber surface slightly melts and forms a molten bond with the fluoropolymer film, simultaneously completing densification and shaping. The paper is then naturally cooled to room temperature to obtain an LCP fiber paper substrate with a thickness of 0.3mm. Next, one surface of the LCP fiber paper substrate is perforated by laser drilling or die punching to form a regular honeycomb through-hole array with a pore diameter of 0.5mm, resulting in a pretreated substrate. Subsequently, the pretreated substrate is subjected to plasma activation treatment using an argon ion process at a plasma power of 350W for 60 seconds to obtain the fiber substrate layer.

[0061] The second step involves immersing a copper-plated silver metal mesh in a fluorinated silane solution for 30 to 90 seconds to obtain a metal mesh layer.

[0062] The third step involves placing a preheated metal connector at a predetermined position on the side wall of the fiber substrate layer. The fiber substrate layer and the metal mesh layer are then combined using a hot-pressing process. Simultaneously, the material of the fiber substrate layer flows and embeds into the microporous structure of the metal connector, forming a mechanical interlock to obtain an intermediate composite. The hot-pressing temperature is 250°C, the hot-pressing pressure is 7 MPa, and the hot-pressing time is 5 minutes.

[0063] The fourth step involves molding the intermediate composite material through a preheating stage, a softening and holding pressure stage, and a setting stage, followed by rapid cooling to 50°C to obtain the composite material. The preheating temperature is 110°C for 3 minutes, the softening and holding pressure temperature is 170°C for 2 minutes, and the setting temperature is 210°C for 4 minutes at a pressure of 9 MPa. The rapid cooling time is 1.5 minutes.

[0064] The fifth step involves spraying a 0.2mm thick layer of liquid silicone onto the surface of the composite material's metal mesh layer away from the fiber substrate layer, curing it at 75°C for 25 minutes, and forming an elastic sealing layer after curing to obtain the sensor protective cover.

[0065] Example 2 Embodiment 2 of this disclosure provides a method for preparing a sensor protective cover, which specifically includes the following steps: The first step involves mixing 85wt% LCP fiber, 11.8wt% inorganic nanofiller, 3wt% binder and 0.2wt% coupling agent, putting the mixture into a high-speed disperser, adding deionized water to adjust the slurry concentration to 0.08%~0.15%, and stirring at a speed of 1500r / min~2000r / min for 30min~45min to ensure uniform dispersion of the components and obtain a mixed slurry. During wet papermaking, the mixed pulp is continuously formed using an inclined wire forming machine at a speed of 10m / min to 15m / min. After vacuum dehydration, the wet paper sheets are dried in a hot air dryer to remove moisture, followed by a stepped hot-pressing process: first, hot pressing at 140℃ and 2MPa for 2 minutes allows the fluoropolymer emulsion to initially form a film and fix the fiber structure; then, the temperature is increased to 280℃ and the pressure to 12MPa, at which point the LCP fiber surface slightly melts and forms a molten bond with the fluoropolymer film, simultaneously completing densification and shaping. The paper is then naturally cooled to room temperature to obtain an LCP fiber paper substrate with a thickness of 0.5mm. Next, one surface of the LCP fiber paper substrate is perforated by laser drilling or die punching to form a regular honeycomb through-hole array with a pore diameter of 0.5mm, resulting in a pretreated substrate. Subsequently, the pretreated substrate is subjected to plasma activation treatment using an argon ion process at a plasma power of 450W for 120s to obtain the fiber substrate layer.

[0066] The second step involves immersing a copper-plated silver metal mesh in a fluorinated silane solution for 90 seconds to obtain a metal mesh layer.

[0067] The third step involves placing a preheated metal connector at a predetermined position on the side wall of the fiber substrate layer. The fiber substrate layer and the metal mesh layer are then combined using a hot-pressing process. Simultaneously, the material of the fiber substrate layer flows and embeds into the microporous structure of the metal connector, forming a mechanical interlock to obtain an intermediate composite. The hot-pressing temperature is 270°C, the hot-pressing pressure is 9 MPa, and the hot-pressing time is 10 minutes.

[0068] The fourth step involves sequentially molding the intermediate composite material through a preheating stage, a softening and holding pressure stage, and a setting stage, followed by rapid cooling to 70°C to obtain the composite material. The preheating temperature is 130°C, and the preheating time is 6 minutes. The softening and holding pressure temperature is 190°C, and the softening and holding pressure time is 4 minutes. The setting temperature is 230°C, the setting pressure is 11 MPa, and the setting time is 6 minutes. The rapid cooling time is 2 minutes.

[0069] The fifth step involves spraying a 0.3mm thick layer of liquid silicone onto the surface of the composite material's metal mesh layer away from the fiber substrate layer, curing it at 85°C for 35 minutes, and forming an elastic sealing layer after curing to obtain the sensor protective cover.

[0070] Example 3 Embodiment 3 of this disclosure provides a method for preparing a sensor protective cover, which specifically includes the following steps: The first step involves mixing 80wt% LCP fiber, 10wt% inorganic nanofiller, 9wt% binder and 1wt% coupling agent, and putting the mixture into a high-speed disperser. Deionized water is added to adjust the slurry concentration to 0.08%~0.15%, and the mixture is stirred at a speed of 1500r / min~2000r / min for 30min~45min to ensure that the components are evenly dispersed and to obtain a mixed slurry. During wet papermaking, the mixed pulp is continuously formed using an inclined wire forming machine at a speed of 10m / min to 15m / min. After vacuum dehydration, the wet paper sheets are dried in a hot air dryer to remove moisture, followed by a stepped hot-pressing process: first, hot pressing at 130℃ and 3MPa for 2 minutes allows the fluoropolymer emulsion to initially form a film and fix the fiber structure; then, the temperature is increased to 265℃ and the pressure to 10MPa, at which point the LCP fiber surface slightly melts and forms a molten bond with the fluoropolymer film, simultaneously completing densification and shaping. The paper is then naturally cooled to room temperature to obtain an LCP fiber paper substrate with a thickness of 0.4mm. Next, one surface of the LCP fiber paper substrate is perforated by laser drilling or die punching to form a regular honeycomb through-hole array with a pore diameter of 0.5mm, resulting in a pretreated substrate. Subsequently, the pretreated substrate is subjected to plasma activation treatment using an argon ion process at a plasma power of 400W for 90 seconds to obtain the fiber substrate layer.

[0071] The second step involves immersing a copper-plated silver metal mesh in a fluorinated silane solution for 60 seconds to obtain a metal mesh layer.

[0072] The third step involves placing a preheated metal connector at a predetermined position on the sidewall of the fiber substrate layer. The fiber substrate layer and the metal mesh layer are then combined using a hot-pressing process. Simultaneously, the material of the fiber substrate layer flows and embeds into the microporous structure of the metal connector, forming a mechanical interlock to obtain an intermediate composite. The hot-pressing temperature is 260°C, the hot-pressing pressure is 8 MPa, and the hot-pressing time is 8 minutes.

[0073] The fourth step involves sequentially molding the intermediate composite material through a preheating stage, a softening and holding pressure stage, and a setting stage, followed by rapid cooling to 60°C to obtain the composite material. The preheating temperature is 120°C for 4 minutes, the softening and holding pressure temperature is 180°C for 3 minutes, and the setting temperature is 220°C with a setting pressure of 10 MPa for 5 minutes. The rapid cooling time is 1.8 minutes.

[0074] The fifth step involves spraying a 0.25mm thick layer of liquid silicone onto the surface of the composite material's metal mesh layer away from the fiber substrate layer, curing it at 80°C for 30 minutes, and forming an elastic sealing layer after curing to obtain the sensor protective cover.

[0075] Comparative Example 1 A sensor protective cover is provided, which is made of PPS engineering plastic.

[0076] Comparative Example 2 A sensor protective cover is provided, the material of which is copper.

[0077] Performance tests were conducted on the sensor protective covers of the above embodiments and comparative examples. Table 1 shows the test data of the sensor protective covers of the embodiments and comparative examples: Sealing performance: IP67 certified according to ISO20653 (no leakage in 1m water depth / 30min); Temperature rise test: Equipped with a Bosch LSU4.9 oxygen sensor, it was run at full load for 2 hours in an environment of 180℃, and the FLIRT840 infrared thermal imager recorded a temperature rise of 7.2℃. Vibration durability: ISO16750-3 Mechanical vibration test (frequency 5-2000Hz, amplitude ±2mm, 200h), insert displacement 0.018mm.

[0078] Table 1

[0079] As can be seen from the above-described Embodiment 1, Comparative Example 1, and Comparative Example 2, the sensor protective cover of this disclosure exhibits significant advantages in overall performance: compared to the PPS engineering plastic protective cover of Comparative Example 1, it has advantages in mechanical reliability, such as tensile strength, vibration displacement, thermal cycling durability, environmental adaptability, such as sealing, temperature rise, and corrosion resistance, signal transmission, such as attenuation and shielding balance, lightweight design, and assembly stability. Compared to the material of Comparative Example 2, the sensor protective cover of Embodiment 1, while maintaining excellent mechanical and environmental resistance performance, can balance lightweight design and signal transmission accuracy, avoiding the shortcomings of traditional metal covers with large signal attenuation or other materials with excessive weight, and is more suitable for the complex operating conditions of automotive electronic sensors.

[0080] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0081] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0082] Additionally, as used herein, the "or" used in a list of items beginning with "at least one" indicates a separate list, such that a list of, for example, "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Furthermore, the word "exemplary" does not imply that the described example is preferred or better than other examples.

[0083] It should also be noted that in the systems and methods of this disclosure, the components or steps can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions to this disclosure.

[0084] Various changes, substitutions, and modifications can be made to the technology described herein without departing from the teachings defined by the appended claims. Furthermore, the scope of the claims of this disclosure is not limited to the specific aspects of the processes, machines, manufactures, events, means, methods, and actions described above. Currently existing or later-developed processes, machines, manufactures, events, means, methods, or actions that perform substantially the same function or achieve substantially the same result as the corresponding aspects described herein can be utilized. Therefore, the appended claims include such processes, machines, manufactures, events, means, methods, or actions within their scope.

[0085] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0086] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A sensor protective cover, characterized in that, include: The cover and multiple metal connectors are provided. The cover includes an elastic sealing layer, a metal mesh layer and a fiber substrate layer stacked from the inside to the outside. The sidewalls of the fiber substrate layer are reinforced with multiple metal connectors, which are used to fix the sensor protective cover to external equipment.

2. The sensor protective cover according to claim 1, characterized in that, The fiber substrate layer has a gradient porosity structure, which includes a top dense layer, a middle buffer layer and a bottom contact layer. The bottom contact layer is located on the side close to the metal mesh layer. The porosity of the top dense layer is ≤5%, the porosity of the middle buffer layer is 15%~20%, and the bottom contact layer is provided with a honeycomb through-hole array.

3. The sensor protective cover according to claim 2, characterized in that, The honeycomb through-hole array has a pore size of 0.45mm~0.55mm and a pore density of 20 pores / cm². 2 ~30 pieces / cm 2 The open area ratio is 30%~40%.

4. The sensor protective cover according to claim 1, characterized in that, The linewidth of the metal mesh layer is 30μm~80μm, and the porosity of the metal mesh layer is ≥85%.

5. The sensor protective cover according to claim 1, characterized in that, The bonding strength between each of the metal connectors and the fiber substrate layer is greater than or equal to 500N.

6. A method for preparing a sensor protective cover according to any one of claims 1 to 5, characterized in that, include: A fiber substrate layer and a metal mesh layer are provided, and a preheated metal connector is placed at a predetermined position on the sidewall of the fiber substrate layer; The fiber substrate layer and the metal mesh layer are composited by hot pressing, while the material of the fiber substrate layer flows and embeds into the microporous structure of the metal connector to form a mechanical interlock, thus obtaining an intermediate composite. The intermediate composite material is obtained by compression molding. An elastic sealing layer is formed on the surface of the composite material away from the fiber substrate layer to obtain the sensor protective cover.

7. The method for preparing the sensor protective cover according to claim 6, characterized in that, The method further includes: LCP fibers, inorganic nanofillers, binders and coupling agents are mixed to obtain a mixed slurry; The mixed slurry is subjected to wet papermaking and stepped hot pressing to obtain LCP fiber paper substrate; One surface of the LCP fiber paper substrate is processed into a honeycomb structure to obtain a pretreated substrate; The pretreated substrate is subjected to plasma activation treatment to obtain the fiber substrate layer.

8. The method for preparing the sensor protective cover according to claim 6, characterized in that, The method further includes: Provide a metal mesh; The metal mesh is surface-treated using a hydrophobic modifier solution to form the metal mesh layer.

9. The method for preparing the sensor protective cover according to claim 6, characterized in that, The process conditions for the hot pressing process include: a hot pressing temperature of 250℃~270℃, a hot pressing pressure of 7MPa~9MPa, and a hot pressing time of 5min~10min.

10. The method for preparing the sensor protective cover according to claim 6, characterized in that, The intermediate composite is subjected to compression molding to obtain a composite material, comprising: The intermediate composite is placed in a mold and molded by sequentially passing through a preheating stage, a softening and holding stage, and a shaping stage. Then it is rapidly cooled to 50°C~70°C to obtain the sensor protective cover substrate.

11. The method for preparing the sensor protective cover according to claim 10, characterized in that, The process conditions for the preheating stage include: a preheating temperature of 110℃~130℃ and a preheating time of 3min~6min; The process conditions for the softening and holding pressure stage include: a softening and holding pressure temperature of 170℃~190℃ and a softening and holding pressure time of 2min~4min; The process conditions for the shaping stage include: a shaping temperature of 210℃~230℃, a shaping pressure of 9MPa~11MPa, and a shaping time of 4min~6min.

12. The method for preparing the sensor protective cover according to claim 6, characterized in that, The method further includes: The stainless steel surface is treated to form a porous structure with a pore size of 40μm~60μm and a pore depth of 150μm~250μm to obtain a metal connector.

Images