Manufacturing method and processing equipment of stepped electrode structure and electrode structure

Abstract

The invention discloses a manufacturing method and processing equipment of a stepped electrode structure and the stepped electrode structure, the stepped electrode structure comprises a plurality of substrate layers and a plurality of conducting layers, one conducting layer is formed between every two adjacent substrate layers, and the lengths of the substrate layers and the conducting layers are gradually reduced in the stacking direction. According to the stepped electrode structure, through the design that the lengths of the substrate layer and the conducting layers are gradually reduced in the stacking direction, the substrate layer and the conducting layers are arranged at intervals, and the edges of the conducting layers are located in the isolation gaps, the distance between the edges of the conducting layers is effectively increased, and the insulation performance between the conducting layers is enhanced; the probability of short circuit of the conducting layer is greatly reduced, the yield of electrode production is improved, normal work of a biosensor or implantable medical equipment is guaranteed, potential risks in the health monitoring and treatment process are reduced, and compared with a traditional multi-layer planar electrode design, remarkable improvement is achieved.

Description

Technical Field

[0001] This application relates to the field of electrode structure processing, specifically to a method for manufacturing a stepped electrode structure, processing equipment, and the electrode structure. Background Technology

[0002] In the field of biosensor technology, especially the design and fabrication of electrode structures for biosensors or implantable medical devices, has always been a key focus in the industry. For multi-layer electrode designs requiring high precision and stability, such as implantable blood glucose monitoring devices, the performance and fabrication quality of the electrode structure directly affect the overall performance and reliability of the device.

[0003] Currently, in existing biosensors or implantable medical devices, the traditional electrode structure generally adopts a multi-layer planar electrode design. This design can meet the basic functional requirements of the device to a certain extent. However, there are serious problems in the processing of multi-layer electrode structures through patterned laser cutting. The flexible substrate material used is prone to carbonization and chipping under the high temperature generated by the laser. This phenomenon is particularly pronounced at the electrode edges, and carbonization and chipping can easily cause short circuits between electrodes. In traditional laser cutting processes, the splashing distance of carbonized debris at the edge of the conductive layer can reach 1.5-3 times the cutting width, leading to an exponential increase in the risk of short circuits between adjacent electrodes.

[0004] For example, patent CN116288426A discloses a method for constructing a multilayer biofilm electrode and the multilayer biofilm electrode itself. During the processing of its multilayer electrode structure, the multilayer planar electrode suffers from a short circuit rate as high as 10%-30% due to the splashing of carbonized debris from laser cutting, which greatly reduces the yield rate of electrode production.

[0005] Short circuits not only reduce electrode production yield but can also cause equipment malfunctions, affecting the normal operation of biosensors or implantable medical devices, thus posing potential risks to health monitoring and treatment. Therefore, developing a novel electrode structure and its manufacturing method that can avoid these problems is of significant practical importance. Summary of the Invention

[0006] In order to solve the technical problems in the prior art, this application provides A method for manufacturing a stepped electrode structure, characterized by comprising the following steps: S1. A multilayer electrode structure is provided, which is composed of multiple substrate layers stacked together, and a conductive layer is printed on each substrate layer, wherein the upper surface of the conductive layer is covered by the adjacent substrate layer. S2. Step-by-step processing of the multilayer electrode structure; Step S2 includes laser cutting and negative pressure suction. The laser cutting operation includes cutting the base layer and conductive layer of the multilayer electrode structure layer by layer. Along the stacking downward direction, the length of each base layer and conductive layer gradually increases to form a stepped electrode structure with exposed stepped electrode ends. At the same time as laser cutting, the conductive debris generated by the conductive layer during the cutting process is directionally extracted and discharged by negative pressure suction. Before laser cutting, the electrode end pattern width W1 of the conductive layer (120) and the electrode end pattern width W2 of the predetermined bottom base layer (110) satisfy W1 / W2≤0.9 in the predetermined area of ​​the exposed stepped electrode ends. At the exposed stepped electrode ends, the step horizontal distance D between the length side of the electrode end pattern of the conductive layer (120) after laser cutting and the length side of the electrode end pattern of the bottom base layer is greater than or equal to twice the thickness of the conductive layer and the bottom base layer (110).

[0007] In some embodiments, the laser cutting pattern on the conductive layer is smaller or narrower than the laser cutting pattern on the substrate layer beneath the conductive layer, so as to form an isolation gap between the stepped electrode and the cutting edge of the substrate layer to prevent conductive debris from adhering to the lower conductive layer; in step S2, the negative pressure suction rate V and the laser cutting speed S satisfy V / S≥0.5m / s, and the suction negative pressure P≥50kPa.

[0008] In some embodiments, the laser cutting is specifically a high-precision laser engraving technique, and further includes: locally removing each conductive layer from the edge of the stepped electrode, wherein the thickness of the removed edge is between 5 and 10 micrometers.

[0009] This application also provides a processing device for the manufacturing method of the aforementioned stepped electrode structure. The processing device includes a laser cutting mechanism and a negative pressure suction mechanism. The laser cutting mechanism performs a stepped processing of the multi-layer electrode structure by cutting each layer layer by layer. Along the stacking upward direction, the length of each base layer and conductive layer decreases layer by layer to form a stepped electrode structure. At the same time, the negative pressure suction mechanism performs directional suction and removal of conductive debris generated by the conductive layer during the cutting process. The processing device also includes a housing and a supporting mechanism. The supporting mechanism includes a supporting plate and a first suction pump. The supporting plate is disposed in the housing, and a suction cavity is formed below the supporting plate. The inlet of the negative pressure suction mechanism is connected to the suction cavity. The supporting plate has a plurality of adsorption holes and suction holes, and the inlet of the first suction pump is connected to each of the adsorption holes.

[0010] In some embodiments, the linkage control of the laser cutting mechanism and the negative pressure suction mechanism satisfies the following: when the laser power P≥10W, the negative pressure suction flow rate Q≥2L / min; when the cutting speed V≥5mm / s, the purge air pressure≥0.3MPa; the supporting mechanism further includes a gas collection box, which is fixed to the supporting plate. The gas collection box has an air inlet and an air outlet. The air inlet is connected to each of the adsorption holes, and the inlet of the first suction pump is connected to the air outlet via a connecting pipe.

[0011] In some embodiments, an air extraction hole communicating with the suction chamber is provided on the side wall of the housing. The negative pressure suction mechanism includes a filter box and a second suction pump. The inlet of the filter box is communicating with the air extraction hole, and the outlet of the filter box is communicating with the inlet of the second suction pump. An air inlet is provided on the side wall of the housing. The processing equipment also includes a purging mechanism, which includes a blower, a hose, a jet nozzle, a distance detection device, and a horizontal position adjustment device. The inlet of the blower is connected to the air inlet, and the outlet of the blower is connected to the inlet of the jet nozzle via the hose. The jet nozzle is positioned facing the support plate. The distance detection device is installed inside the housing and is used to detect the horizontal distance between the inner side wall of the housing and the laser cutting mechanism. The fixed end of the horizontal position adjustment device is installed on the side wall of the housing, and the movable end of the horizontal position adjustment device is connected to the jet nozzle. The horizontal position adjustment device is used to control the horizontal position of the jet nozzle according to the horizontal distance between the inner side wall of the housing and the laser cutting mechanism. The bottom surface of the box is provided with a discharge hole, and the lower end of the box is provided with a discharge box with an opening at the top, the upper opening of the discharge box communicating with the discharge hole; the support plate is rotatably mounted in the box via a rotating shaft; The lower end of the box is also provided with a discharge valve, which includes a valve plate and a discharge drive component. The valve plate is slidably disposed at the discharge hole. The discharge drive component is connected to the valve plate and is used to drive the valve plate to move horizontally so that the valve plate closes the discharge hole or makes the valve plate offset from the discharge hole. The processing equipment also includes a flipping mechanism, which includes a flipping motor, a driving gear, and a driven gear. The output end of the flipping motor is coaxially and fixedly connected to the driving gear. The driving gear meshes with the driven gear, and the driven gear is fixedly sleeved on the rotating shaft.

[0012] In some embodiments, the laser cutting mechanism includes a lateral moving member, a longitudinal moving member, and a laser emitter. The fixed end of the lateral moving member is fixed to the inner top wall of the housing, the fixed end of the longitudinal moving member is fixed to the movable end of the lateral moving member, and the laser emitter is fixed to the movable end of the longitudinal moving member. The laser emitter is used to emit a laser beam toward the support plate.

[0013] This application also provides a stepped electrode structure, which is fabricated based on the manufacturing method of the stepped electrode structure described above. The stepped electrode structure includes multiple substrate layers and multiple conductive layers. A conductive layer is formed between each pair of adjacent substrate layers. Along the stacking direction, the length of each substrate layer and each conductive layer gradually decreases to expose the electrode terminals of the conductive layers in a stepped manner. The substrate layer is a flexible thin film substrate layer.

[0014] In some embodiments, the edge of each conductive layer is located within the isolation gap formed by two adjacent base layers.

[0015] In summary, this application includes at least one of the following beneficial technical effects: 1. The stepped electrode structure, through the design of the base layer and conductive layer gradually decreasing in length along the stacking direction, and the structure of the base layer and conductive layer being spaced apart with the edge of the conductive layer located within the isolation gap, effectively increases the distance between the edges of the conductive layers, enhances the insulation performance between the conductive layers, greatly reduces the probability of short circuit in the conductive layer, and improves the yield of electrode production; 2. The laser cutting mechanism can precisely cut multi-layer electrodes, ensuring the accuracy of the gradual reduction in the length of each electrode layer. The negative pressure suction mechanism can promptly remove the carbonaceous debris generated during cutting, preventing debris accumulation from causing electrode short circuits. 3. After cutting is completed, the bearing plate can be flipped by the flipping mechanism, the discharge valve can be opened, the first suction pump can be closed, and the stepped electrode structure on the bearing plate falls into the discharge box under the action of gravity, which facilitates the collection of the processed stepped electrode structure. The interlayer short circuit rate is ≤0.1%, which is 3 orders of magnitude higher than the traditional planar electrode structure; the effective reaction area retention rate of the electrode is ≥92%. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a multilayer electrode structure and a stepped electrode structure provided in an embodiment of this application; Figure 2 This is a schematic diagram of the manufacturing method of the multilayer electrode structure provided in this application.

[0017] Figure 3 This is a schematic diagram of the structure of a processing device provided in one embodiment of this application; Figure 4yes Figure 3 A schematic diagram of the supporting mechanism in the middle; Figure 5 yes Figure 4 A magnified view of a portion of region A in the middle; Figure 6 yes Figure 3 A schematic diagram of the structure of the processing equipment during unloading; Figure 7 yes Figure 3 A three-dimensional structural diagram of the laser cutting mechanism in the image; Explanation of reference numerals in the attached drawings: 100a, multi-layer electrode structure; 100b, stepped electrode structure; 110, substrate layer; 120, conductive layer; 300, processing equipment; 310, laser cutting mechanism; 311, lateral moving part; 312, longitudinal moving part; 313, laser emitter; 320, negative pressure suction mechanism; 321, filter box; 322, second suction pump; 330, housing; 331, air extraction port; 332, air inlet; 333, discharge port; 334, discharge box; 335, discharge valve; 3351, valve plate; 33 52. Discharge drive component; 3353. Guide block; 3354. Guide rod; 340. Bearing mechanism; 341. Bearing plate; 3411. Rotating shaft; 3412. Adsorption hole; 3413. Suction hole; 342. First suction pump; 343. Air collection box; 344. Connecting pipe; 350. Blowing mechanism; 351. Blower; 352. Hose; 353. Jet nozzle; 354. Distance detection component; 355. Horizontal position adjustment component; 360. Tilting mechanism; 361. Tilting motor; 362. Drive gear; 363. Driven gear. Detailed Implementation

[0018] The following is in conjunction with the appendix Figures 1-7 This application will be described in further detail.

[0019] This application mainly adopts a multi-layer electrode stacked into a stepped structure, which achieves the effect of avoiding electrode short circuits and improving production yield. The following is a further detailed description of this application.

[0020] Example 1 Please refer to Figure 1Embodiment 1 of this application provides a stepped electrode structure 100b, including multiple substrate layers 110 and multiple conductive layers 120. A conductive layer 120 is formed between each pair of adjacent substrate layers 110. Along the stacking direction, the length of each substrate layer 110 and each conductive layer 120 gradually decreases, exposing the electrode terminals of the conductive layer 120 in a stepped manner. The substrate layer 110 is a flexible thin film substrate layer, which effectively avoids edge contact between the conductive layers 120, reduces the risk of short circuits, and improves the stability of the electrode structure and the production yield. Because as the length of the substrate layer 110 and the conductive layer 120 gradually decreases, the spacing between the edges of the conductive layer 120 increases, reducing the possibility of short circuits caused by carbonization and chipping.

[0021] Specifically, the substrate layer 110 is a flexible substrate material, such as PET, PI, or biocompatible silicone. These materials have good flexibility and insulation properties, providing support and isolation for the conductive layer 120. Of course, other insulating materials can also be used for the substrate layer 110. The conductive layer 120 is generally made of metallic materials, such as gold, silver, or copper, which have good electrical conductivity. The conductive layer 120 can be attached to the substrate layer 110 through processes such as electroplating or sputtering. The substrate layer 110 and the conductive layer 120 are tightly bonded together through methods such as lamination or pressing.

[0022] The edges of each conductive layer 120 are located within the isolation gap formed by two adjacent substrate layers 110. This arrangement further enhances the insulation performance between the conductive layers 120. The isolation gap formed by the two adjacent substrate layers 110 prevents carbonized and flaking particles at the edges of the conductive layers 120 from coming into contact with each other, thereby better preventing short circuits.

[0023] The implementation principle of this embodiment is as follows: The stepped electrode structure 100b, through the design of the base layer 110 and the conductive layer 120 gradually decreasing in length along the stacking direction to expose the electrode terminals of the conductive layer 120 in a stepped manner, and the structure in which the base layer 110 and the conductive layer 120 are spaced apart and the edge of the conductive layer 120 is located within the isolation gap, effectively increases the distance between the edges of the conductive layer 120, enhances the insulation performance between the conductive layers 120, greatly reduces the probability of short circuit of the conductive layer 120, improves the yield of electrode production, ensures the normal operation of biosensors or implantable medical devices, and reduces potential risks in the process of health monitoring and treatment. Compared with the traditional multilayer planar electrode design, it has been significantly improved and enhanced.

[0024] Example 2 Please refer to Figure 1 and Figure 2 Embodiment 2 of this application provides a method for manufacturing a stepped electrode structure, including the following steps: S1. A multilayer electrode structure 100a is provided, which is composed of multiple substrate layers 110 stacked together. A conductive layer 120 is printed on each substrate layer 110, and the upper surface of the conductive layer 120 is covered by the adjacent substrate layer 110. The substrate layer 110 can be a rigid silicon wafer or a flexible polymer film. The printing of the conductive layer 120 on the substrate layer 110 can be performed by screen printing, which can be completed by screen printing equipment. This process is simple to operate and has low cost.

[0025] Preferably, the preliminary multilayer electrode structure 100a is processed using high-precision laser engraving technology to remove a certain thickness (e.g., 5-10 micrometers) from the edge portion of each conductive layer 120, forming an isolation gap.

[0026] S2. A stepped manufacturing process is performed on the multilayer electrode structure 100a. The stepped manufacturing method includes laser cutting and negative pressure suction. The laser cutting operation includes cutting the base layer 110 and the conductive layer 120 of the multilayer electrode structure 100a layer by layer. Along the stacking downward direction, the length of each base layer 110 and conductive layer 120 gradually increases to form a stepped electrode structure 100b with exposed stepped electrode terminals. During laser cutting, negative pressure suction is used to directionally remove conductive debris generated by the conductive layer 120 during the cutting process. Specifically, before laser cutting, the electrode terminal pattern width W1 of the conductive layer 120 and the predetermined electrode terminal pattern width W2 of the bottom base layer 110 at a predetermined area of ​​the exposed stepped electrode terminals satisfy W1 / W2≤0.9. At the exposed stepped electrode terminals, the horizontal step distance D between the length side of the electrode terminal pattern of the conductive layer 120 after laser cutting and the length side of the electrode terminal pattern of the bottom base layer is greater than or equal to twice the thickness of the conductive layer and the bottom base layer 110.

[0027] In this embodiment, the laser cutting mechanism 310 can accurately cut each base layer 110 and conductive layer 120, ensuring the accuracy of the gradual reduction in length of each base layer 110 and conductive layer 120. The negative pressure suction mechanism 320 can promptly remove the carbonaceous debris generated during cutting, preventing debris accumulation from causing a short circuit in the conductive layer 120.

[0028] Preferably, the laser cutting pattern of the conductive layer 120 is smaller or narrower than the laser cutting pattern of the substrate layer 110 beneath the conductive layer 120, so as to form an isolation gap between the stepped electrode and the cutting edge of the substrate layer 110, so as to prevent the conductive debris from the upper layer from adhering to the lower conductive layer 120.

[0029] Preferably, the laser cutting is a high-precision laser engraving technique, and further includes: locally removing the edges of each conductive layer 120 at the stepped electrode, wherein the thickness of the removed edges is between 5 and 10 micrometers.

[0030] Example 3 The difference between Example 3 and Example 2 is that W1 / W2 = 0.8 and D = 2 times the layer thickness. In this example, the interlayer breakdown voltage reaches 500V / mm, while the traditional structure is only 150V / mm.

[0031] Example 4 Please refer to Figures 2-7 This application also provides a processing device for the manufacturing method of the aforementioned stepped electrode structure. The processing device includes a laser cutting mechanism 310 and a negative pressure suction mechanism 320. The laser cutting mechanism 310 performs a stepped processing of the multilayer electrode structure 100a by cutting each layer layer by layer. Along the stacking upward direction, the length of each base layer 110 and conductive layer 120 decreases layer by layer to form a stepped electrode structure 100b. At the same time, the negative pressure suction mechanism 320 removes the conductive layer 120 generated during the cutting process. The processing equipment 300 also includes a housing 330 and a support mechanism 340. The support mechanism 340 includes a support plate 341 and a first suction pump 342. The support plate 341 is disposed inside the housing 330. A suction chamber is formed below the support plate 341. The inlet of the negative pressure suction mechanism 320 is connected to the suction chamber. The support plate 341 is provided with a plurality of adsorption holes 3412 and suction holes 3413. The inlet of the first suction pump 342 is connected to each of the adsorption holes 3412.

[0032] In this embodiment, the support plate 341 is used to place the multilayer electrode structure 100a to be processed. The adsorption hole 3412 can generate an adsorption force under the action of the first suction pump 342, which can firmly fix the multilayer electrode structure 100a on the support plate 341 and prevent the electrode structure from shifting during the cutting process. The suction hole 3413 is connected to the suction chamber, which facilitates the negative pressure suction mechanism 320 to extract carbonaceous debris.

[0033] Specifically, please refer to Figures 3-6 The supporting mechanism 340 also includes a gas collecting box 343, which is fixed to the supporting plate 341. The gas collecting box 343 has an air inlet and an air outlet. The air inlet is connected to each adsorption hole 3412, and the inlet of the first suction pump 342 is connected to the air outlet via a connecting pipe 344. The gas collecting box 343 plays the role of collecting gas, making the adsorption force of the adsorption holes 3412 more uniform and ensuring the stability of the multilayer electrode structure 100a.

[0034] Specifically, please refer to Figures 3-6The side wall of the housing 330 has an air extraction port 331 that communicates with the suction chamber. The negative pressure suction mechanism 320 includes a filter box 321 and a second suction pump 322. The inlet of the filter box 321 is connected to the air extraction port 331, and the outlet of the filter box 321 is connected to the inlet of the second suction pump 322. The filter box 321 can filter the extracted carbonaceous debris to prevent the debris from entering the second suction pump 322 and damaging the equipment. The second suction pump 322 provides suction power to extract the carbonaceous debris from the suction chamber.

[0035] Specifically, please refer to Figures 3-6 The housing 330 has an air inlet 332 on its side wall. The processing equipment 300 also includes a blowing mechanism 350, which includes a blower 351, a hose 352, a jet nozzle 353, a distance detection element 354, and a horizontal position adjustment element 355. The inlet of the blower 351 is connected to the air inlet 332, and the outlet of the blower 351 is connected to the inlet of the jet nozzle 353 via the hose 352. The jet nozzle 353 is positioned facing the support plate 341. The distance detection element 354 is installed inside the housing 330 and is used to detect the horizontal distance between the inner side wall of the housing 330 and the laser cutting mechanism 310. The fixed end of the horizontal position adjustment element 355 is installed on the side wall of the housing 330, and the movable end of the horizontal position adjustment element 355 is connected to the jet nozzle 353. The horizontal position adjustment element 355 is used to control the horizontal position of the jet nozzle 353 according to the horizontal distance between the inner side wall of the housing 330 and the laser cutting mechanism 310. The blowing mechanism 350 can blow air into the cutting area during laser cutting to blow up the carbonaceous debris generated during cutting, making it easier for the negative pressure suction mechanism 320 to remove it. At the same time, the horizontal position adjustment component 355 can adjust the position of the jet head 353 according to the position of the laser cutting mechanism 310, so that the jet head 353 is always kept at a preset distance near the cutting position during the cutting process to ensure the blowing effect.

[0036] Specifically, please refer to Figures 3-6The bottom surface of the housing 330 is provided with a discharge hole 333, and the lower end of the housing 330 is provided with a discharge box 334 with an upper opening, the upper opening of the discharge box 334 communicating with the discharge hole 333; the support plate 341 is rotatably disposed inside the housing 330 via a rotating shaft 3411; the lower end of the housing 330 is also provided with a discharge valve 335, the discharge valve 335 including a valve plate 3351 and a discharge driving component 3352, the valve plate 3351 is slidably disposed at the discharge hole 333, the discharge driving component 3352 is connected to the valve plate 3351 and is used to drive the valve plate 3351 to move horizontally, so that the valve plate 3351 is closed. The discharge hole 333 or the valve plate 3351 is offset from the discharge hole 333. In this embodiment, the discharge drive 3352 is a discharge drive electric rod. The fixed end of the discharge drive electric rod is fixed inside the housing 330, and the output end of the discharge drive electric rod is fixedly connected to the valve plate 3351. In addition, a guide rod 3354 is fixed inside the discharge box 334, and a guide block 3353 is fixed on the valve plate 3351. The guide block 3353 is provided with a guide hole that cooperates with the guide rod 3354, so as to guide the movement of the valve plate 3351 and improve the stability of the valve plate 3351 during the movement process.

[0037] The processing equipment 300 also includes a flipping mechanism 360, which includes a flipping motor 361, a driving gear 362, and a driven gear 363. The output end of the flipping motor 361 is coaxially and fixedly connected to the driving gear 362. The driving gear 362 meshes with the driven gear 363, and the driven gear 363 is fixedly sleeved on the rotating shaft 3411. After cutting is completed, the carrying plate 341 can be flipped by the flipping mechanism 360, the discharge valve 335 is opened, and the first suction pump 342 is closed. The stepped electrode structure 100b on the carrying plate 341 falls into the discharge box 334 under the action of gravity, which facilitates the collection of the processed stepped electrode structure 100b.

[0038] Specifically, please refer to Figure 3 and Figure 7 The laser cutting mechanism 310 includes a transverse moving member 311, a longitudinal moving member 312, and a laser emitter 313. The fixed end of the transverse moving member 311 is fixed to the inner top wall of the housing 330, the fixed end of the longitudinal moving member 312 is fixed to the movable end of the transverse moving member 311, and the laser emitter 313 is fixed to the movable end of the longitudinal moving member 312. The laser emitter 313 is used to emit a laser beam towards the support plate 341. The transverse moving member 311 and the longitudinal moving member 312 can drive the laser emitter 313 to move in the horizontal and vertical directions, realizing precise cutting of the multilayer electrode structure 100a. The laser emitter 313 can adjust the cutting depth, thereby precisely controlling the cutting of the multilayer substrate layer 110 and the conductive layer 120. In this embodiment, the transverse moving member 311 is a transverse linear motor, and the longitudinal moving member 312 is a longitudinal linear motor, and the two are arranged perpendicularly.

[0039] The implementation principle of this embodiment is as follows: This manufacturing method forms a preliminary multilayer electrode structure 100a by printing or depositing on a substrate layer. Then, using a laser cutting mechanism 310 and a negative pressure suction mechanism 320, the multilayer electrode structure 100a is cut into a stepped structure, and carbonaceous debris is promptly removed. Simultaneously, the supporting mechanism 340, the blowing mechanism 350, the discharge mechanism, and the laser cutting mechanism 310 work together to improve processing accuracy and efficiency, reduce the impact of carbonaceous debris on the electrode structure, lower the risk of electrode short circuits, and improve the yield rate of electrode production. This represents a significant improvement compared to traditional manufacturing methods.

[0040] In summary, the beneficial effects of the technical solution provided by this invention include: 1. The stepped electrode structure 100b, through the design of the base layer 110 and the conductive layer 120 gradually decreasing in length along the stacking direction, and the structure of the base layer 110 and the conductive layer 120 being spaced apart with the edge of the conductive layer 120 located within the isolation gap, effectively increases the distance between the edges of the conductive layer 120, enhances the insulation performance between the conductive layers 120, greatly reduces the probability of short circuit in the conductive layer 120, improves the yield of electrode production, ensures the normal operation of biosensors or implantable medical devices, and reduces potential risks in health monitoring and treatment. Compared with the traditional multilayer planar electrode design, it has achieved significant improvement and enhancement. 2. The laser cutting mechanism 310 can accurately cut the multi-layer electrode structure 100a, while the negative pressure suction mechanism 320 can promptly remove the carbonaceous debris generated during cutting, preventing debris accumulation from causing electrode short circuits; the short circuit rate can still be maintained at ≤0.5% when the cutting speed in step S2 is ≥20mm / s, which is significantly better than the ≤10mm / s cutting speed limit disclosed in the prior art. 3. After cutting is completed, the bearing plate 341 can be flipped by the flipping mechanism 360, the discharge valve 335 is opened, the first suction pump 342 is closed, and the stepped electrode structure 100b on the bearing plate 341 falls into the discharge box 334 under the action of gravity, which facilitates the collection of the processed stepped electrode structure 100b.

[0041] Example 4 When the cutting spacing D=30μm and the suction negative pressure P=80kPa, the interlayer breakdown voltage reaches 500V / mm.

[0042] Example 5 By employing a dual-laser-beam cross-cutting process, the height of the cutting burrs can be reduced to below 2μm.

[0043] This application utilizes a stepped structure design that emphasizes the length of the electrode end to create spatial isolation, combined with a negative pressure suction system for splash-proof dynamic cleaning. Under the precise control of dimensional proportions, this collaborative innovation breaks through the limitations of a single technical means.

[0044] Regarding the correlation of process parameters, there is a dynamic balance relationship between the "cutting-suction-purging" process parameters, such as: the matching relationship between cutting speed and negative pressure flow rate (V / S threshold); the correspondence between laser energy density and debris particle size; the quantitative relationship between isolation gap width and breakdown voltage; and the structure-function mapping relationship.

[0045] This application establishes a functional chain of "stepped height gradient → electric field distribution optimization → signal-to-noise ratio improvement" to prove the scientific nature of the structural design. Simulation data shows that the stepped structure reduces the electric field distortion rate by more than 40%.

[0046] The stepped electrode structure of this application can be applied to various medical scenarios (such as blood glucose / uric acid detection). Its exposed needle-like stepped electrode tip has the following effects: 1. Suppression of crosstalk in multi-parameter integrated detection; 2. Long-term stability under dynamic physiological conditions. The stepped electrode structure of this application is suitable for various medical scenarios (such as blood glucose and uric acid detection), and its exposed needle-like stepped electrode tip exhibits the following advantages: firstly, it effectively suppresses crosstalk problems in multi-parameter integrated detection; secondly, it maintains long-term stability under dynamic physiological conditions.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A method for manufacturing a stepped electrode structure, characterized in that, Includes the following steps: S1. A multilayer electrode structure (100a) is provided, which is composed of multiple substrate layers (110) stacked together. A conductive layer (120) is printed on each substrate layer (110), and the upper surface of the conductive layer (120) is covered by the adjacent substrate layer (110). S2. Step-by-step processing of the multilayer electrode structure (100a); Step S2 includes laser cutting and negative pressure suction. The laser cutting operation includes cutting the base layer (110) and conductive layer (120) of the multilayer electrode structure (100a) layer by layer. Along the stacking downward direction, the length of each base layer (110) and conductive layer (120) gradually increases to form a step-by-step electrode structure (100b) with exposed step-shaped electrode terminals. During laser cutting, negative pressure suction is used to process the electrode structure formed by the conductive layer during the cutting process. (120) The conductive debris generated is directionally removed, wherein, before laser cutting, the width W1 of the electrode pattern of the conductive layer (120) and the width W2 of the electrode pattern of the predetermined bottom substrate layer (110) satisfy W1 / W2≤0.9 in the predetermined area of ​​the exposed stepped electrode; at the exposed stepped electrode, the step horizontal distance D between the length side of the electrode pattern of the conductive layer (120) after laser cutting and the length side of the electrode pattern of the bottom substrate layer is greater than or equal to twice the thickness of the conductive layer and the bottom substrate layer (110).

2. The method for manufacturing the stepped electrode structure according to claim 1, characterized in that, The laser cutting pattern on the conductive layer (120) is smaller or narrower than the laser cutting pattern on the substrate layer (110) beneath the conductive layer (120), so that an isolation gap is formed between the stepped electrode and the cutting edge of the substrate layer (110) to prevent conductive debris from adhering to the lower conductive layer (120); in step S2, the negative pressure suction rate V and the laser cutting speed S satisfy V / S≥0.5m / s, and the suction negative pressure P≥50kPa.

3. The method for manufacturing the stepped electrode structure according to claim 1, characterized in that, The laser cutting is specifically a high-precision laser engraving technology, which also includes: locally removing each layer of the conductive layer (120) at the edge of the stepped electrode, with the thickness of the removed edge being between 5 and 10 micrometers.

4. A processing device, characterized in that, The manufacturing method of the stepped electrode structure according to claim 1, wherein the processing equipment includes a laser cutting mechanism (310) and a negative pressure suction mechanism (320), wherein the laser cutting mechanism (310) performs a stepped processing of the multilayer electrode structure (100a) by cutting layer by layer, wherein the length of each base layer (110) and conductive layer (120) decreases layer by layer in the stacking upward direction to form a stepped electrode structure (100b), and the negative pressure suction mechanism (320) performs directional suction and discharge of conductive debris generated by the conductive layer (120) during the cutting process; The processing equipment (300) also includes a housing (330) and a support mechanism (340). The support mechanism (340) includes a support plate (341) and a first suction pump (342). The support plate (341) is disposed inside the housing (330). A suction chamber is formed below the support plate (341). The inlet of the negative pressure suction mechanism (320) is connected to the suction chamber. A plurality of adsorption holes (3412) and suction holes (3413) are provided on the support plate (341). The inlet of the first suction pump (342) is connected to each of the adsorption holes (3412).

5. The processing equipment according to claim 4, characterized in that, The linkage control of the laser cutting mechanism (310) and the negative pressure suction mechanism (320) satisfies the following: when the laser power P≥10W, the negative pressure suction flow rate Q≥2L / min; when the cutting speed V≥5mm / s, the purge air pressure≥0.3MPa; the bearing mechanism (340) also includes a gas collection box (343), which is fixed to the bearing plate (341). The gas collection box (343) is provided with an air inlet and an air outlet. The air inlet is connected to each of the adsorption holes (3412), and the inlet of the first suction pump (342) is connected to the air outlet via a connecting pipe (344).

6. The processing equipment according to claim 4, characterized in that, The side wall of the housing (330) is provided with an air extraction hole (331) that communicates with the suction chamber. The negative pressure suction mechanism (320) includes a filter box (321) and a second suction pump (322). The inlet of the filter box (321) is connected to the air extraction hole (331), and the outlet of the filter box (321) is connected to the inlet of the second suction pump (322). An air inlet (332) is provided on the side wall of the housing (330). The processing equipment (300) also includes a purging mechanism (350), which includes a blower (351), a hose (352), a jet nozzle (353), a distance detection element (354), and a horizontal position adjustment element (355). The inlet of the blower (351) is connected to the air inlet (332), and the outlet of the blower (351) is connected to the inlet of the jet nozzle (353) via the hose (352). The jet nozzle (353) faces the support plate (341). The distance detection component (354) is installed inside the housing (330) and is used to detect the horizontal distance between the inner wall of the housing (330) and the laser cutting mechanism (310). The fixed end of the horizontal position adjustment component (355) is installed on the side wall of the housing (330), and the movable end of the horizontal position adjustment component (355) is connected to the jet head (353). The horizontal position adjustment component (355) is used to control the horizontal position of the jet head (353) according to the horizontal distance between the inner wall of the housing (330) and the laser cutting mechanism (310). The bottom surface of the box (330) is provided with a discharge hole (333), and the lower end of the box (330) is provided with a discharge box (334) with an upper opening, the upper opening of the discharge box (334) communicating with the discharge hole (333); the support plate (341) is rotatably disposed inside the box (330) via a rotating shaft (3411); The lower end of the housing (330) is also provided with a discharge valve (335). The discharge valve (335) includes a valve plate (3351) and a discharge drive component (3352). The valve plate (3351) is slidably disposed at the discharge hole (333). The discharge drive component (3352) is connected to the valve plate (3351) and is used to drive the valve plate (3351) to move horizontally so that the valve plate (3351) closes the discharge hole (333) or makes the valve plate (3351) offset from the discharge hole (333). The processing equipment (300) further includes a flipping mechanism (360), which includes a flipping motor (361), a driving gear (362), and a driven gear (363). The output end of the flipping motor (361) is coaxially and fixedly connected to the driving gear (362). The driving gear (362) meshes with the driven gear (363), and the driven gear (363) is fixedly sleeved on the rotating shaft (3411).

7. The processing equipment according to claim 4, characterized in that, The laser cutting mechanism (310) includes a transverse moving part (311), a longitudinal moving part (312), and a laser emitter (313). The fixed end of the transverse moving part (311) is fixed to the inner top wall of the housing (330). The fixed end of the longitudinal moving part (312) is fixed to the movable end of the transverse moving part (311). The laser emitter (313) is fixed to the movable end of the longitudinal moving part (312). The laser emitter (313) is used to emit a laser beam toward the support plate (341).

8. A stepped electrode structure, characterized in that, The stepped electrode structure is fabricated according to the manufacturing method of the stepped electrode structure as described in claim 1. The stepped electrode structure includes multiple substrate layers (110) and multiple conductive layers (120). A conductive layer (120) is formed between each two adjacent substrate layers (110). Along the stacking direction, the length of each substrate layer (110) and each conductive layer (120) gradually decreases to expose the electrode terminals of the conductive layer (120) in a stepped manner. The substrate layer (110) is a flexible thin film substrate layer.

9. The stepped electrode structure according to claim 8, characterized in that, The edge of each conductive layer (120) is located within the isolation gap formed by the two adjacent base layers (110).

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