A lamp module circuit board performance test carrier

Abstract

The application relates to the technical field of circuit board detection, in particular to a lamp module circuit board performance test carrier which comprises a test seat and a control panel, a vertical plate is arranged on the test seat, an upper mold plate is vertically and slidably arranged on the vertical plate, a lower mold plate opposite to the upper mold plate is arranged on the test seat, a driving piece for driving the upper mold plate to move close to or away from the lower mold plate is arranged on the vertical plate, a circuit board is placed on the lower mold plate, a positioning piece for fixing the position of the circuit board is arranged on the lower mold plate, a plug electrically connected to the control panel is arranged on the upper mold plate, a fixing piece for fixing the position of the plug is arranged on the upper mold plate, and the plug is used for plug-in cooperation with a socket on the circuit board. The application has the effects of improving detection precision and improving the adaptability to different specifications of circuit boards.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board detection, in particular to a lamp module circuit board performance test carrier. BACKGROUND

[0002] The circuit board is an important electronic component, mainly including electronic components and connectors. The electronic components (such as transistors, integrated circuits, resistors and capacitors, etc.) are mainly used to realize the circuit function, and the connectors (such as the row needle and the socket, etc.) are mainly used for the connection between the circuit boards or with the external device.

[0003] The circuit board is the carrier of the electrical connection of the electronic components. At present, the LED lamp module generally adopts integrated circuit board design. In order to ensure that the LED lamp can work continuously and stably, the performance test of the LED lamp module needs to cover the indicators such as voltage stability, solder joint conductivity, signal response speed and temperature rise control.

[0004] In the early industry, the detection is usually carried out by hand-held multimeter or single-function tester in steps, which is low in efficiency and easy to miss detection. Therefore, in recent years, automatic test equipment has gradually been popularized. However, the general detection fixture on the market usually has poor adaptability, which leads to poor contact during detection, and finally makes the test data error of the circuit board larger, which has the shortcomings. SUMMARY

[0005] In order to improve the problem that the general detection fixture has larger test data error of the circuit board, the present application provides a lamp module circuit board performance test carrier.

[0006] The lamp module circuit board performance test carrier provided by the present application adopts the following technical scheme:

[0007] A lamp module circuit board performance test carrier, comprising a test seat and a control panel, a vertical plate is arranged on the test seat, an upper mold plate is vertically slidably arranged on the vertical plate, a lower mold plate opposite to the upper mold plate is arranged on the test seat, a driving member is arranged on the vertical plate to drive the upper mold plate to approach or move away from the lower mold plate, a circuit board is placed on the lower mold plate, a positioning member for fixing the position of the circuit board is arranged on the lower mold plate, a plug electrically connected to the control panel is arranged on the upper mold plate, a fixing member for fixing the position of the plug is arranged on the upper mold plate, and the plug is used for plug-in cooperation with a socket on the circuit board; the test seat is hollow inside, the lower mold plate comprises a moving mold plate and a static mold plate, a tension spring is arranged between the moving mold plate and the static mold plate, a plurality of expansion plates are arranged between the moving mold plate and the static mold plate, the plurality of expansion plates are arranged along the direction from the moving mold plate to the static mold plate, an expansion groove is formed in the test seat for sliding of the expansion plates, the expansion plates are inclined away from the static mold plate along the direction from top to bottom, one of the expansion plates closest to the static mold plate is fixed on the static mold plate, a sliding block is arranged on one side of the expansion plate, and a sliding groove is formed on the other side of the expansion plate for sliding of the sliding block on the adjacent expansion plate, a supporting plate is arranged in the test seat, the supporting plate is used for supporting the expansion plates, a driving inclined surface is formed at the bottom of the expansion plate, the driving inclined surface is inclined away from the moving mold plate along the direction from top to bottom, a push rod is slidably arranged on the test seat, the push rod is used for abutting and sliding cooperation with the driving inclined surface, when the bottom edge of the driving inclined surface of the expansion plate abuts the push rod, the top of the expansion plate is flush with the upper surface of the static mold plate, a sliding inclined surface is formed in the moving mold plate, the sliding inclined surface is inclined toward the static mold plate along the direction from top to bottom, the side of the expansion plate away from the static mold plate is used for abutting and sliding cooperation with the sliding inclined surface, and a moving rod member for driving the push rod to slide is arranged on the test seat.

[0008] Through the above technical scheme, the detection personnel drives the push rod to slide through the movable rod, the sliding push rod first abuts against the driving slope at the bottom of the expansion plate, and with the continuous sliding of the push rod, under the action of the sliding block and the sliding groove, the push rod pushes the reaction force of the driving slope to make the expansion plate vertically tilt and slide upward, until the edge of the driving slope at the bottom of the expansion plate abuts against the push rod, at this time, the top of the expansion plate is flush with the upper surface of the static mold plate, in this process, the side of the expansion plate away from the static mold plate will abut against the sliding slope on the movable mold plate, under the action of the reaction force of the expansion plate abutting against the sliding slope on the movable mold plate, the movable mold plate slides away from the static mold plate, and the tension spring is stretched, so as to complete the expansion of the lower mold plate in the length direction, so as to adapt to circuit boards of different lengths, and the expansion plate can support the bottom of the circuit board, reduce the possibility that the local circuit board is compressed and deformed, and further cause damage to the circuit board, thereby improving the accuracy of the detection result of the circuit board. The detection personnel places the circuit board to be detected on the lower mold plate, then fixes the position of the circuit board through the positioning piece, then plugs the plug into the socket on the circuit board, then drives the upper mold plate to approach the lower mold plate through the driving piece, and finally the detection personnel fixes the plug on the upper mold plate through the fixing piece. The control panel detects the performance indicators of the circuit board through the plug, and at the same time, the debugging process of the circuit board of this size is completed, then the circuit board of the same specification is placed on the lower mold plate, and the upper mold plate drives the plug to be plugged into the socket on the circuit board fixed on the lower mold plate through the driving piece, so as to improve the adaptability to circuit boards of different sizes.

[0009] Optionally, the upper mold plate comprises a first mounting plate and a second mounting plate, a separation column is arranged between the first mounting plate and the second mounting plate, the second mounting plate is located below the first mounting plate, the plug is arranged on the second mounting plate, a plurality of buffer columns are vertically slidably arranged on the second mounting plate, the buffer columns are distributed on the second mounting plate, a anti-dropping plate is arranged on the buffer columns between the first mounting plate and the second mounting plate, a glue column is arranged at one end of the buffer column away from the anti-dropping plate, the glue column is used for abutting against the circuit board, and a buffer compression spring is arranged between the second mounting plate and the glue column.

[0010] Through the above technical scheme, in the process that the second mounting plate approaches the circuit board, the glue column will first abut against the circuit board, with the continuous descending of the second mounting plate, the plug on the second mounting plate will be gradually plugged into the socket on the circuit board, so as to complete the electrical connection between the circuit board and the control panel, so that the control panel can directly detect the performance of the circuit board.

[0011] Optionally, the driving member comprises a push-pull quick clamp arranged on the vertical plate, the first mounting plate is arranged on the top head of the push-pull quick clamp, a vertical column is arranged on the test seat, and the second mounting plate is sleeved on the vertical column in a sliding mode.

[0012] By adopting the above technical scheme, the handle of the push-pull quick clamp is pulled by the detection personnel, and under the guidance of the vertical column, the top head of the push-pull quick clamp drives the second mounting plate to slide synchronously through the first mounting plate, the second mounting plate drives the plug to gradually approach the socket on the circuit board, and the plug is finally inserted into the socket.

[0013] Optionally, the second mounting plate is made of steel material, the fixing member comprises an adjusting seat, the plug is arranged on the adjusting seat, an electromagnet electrically connected to the control panel is arranged on the adjusting seat, the electromagnet is used for being adsorbed on the second mounting plate, and the adsorption force between the electromagnet and the second mounting plate is greater than the plug-in and plug-out force between the plug and the socket.

[0014] By adopting the above technical scheme, the detection personnel first inserts the plug on the adjusting seat into the socket on the circuit board, and then the worker gradually approaches the second mounting plate to the circuit board through the push-pull quick clamp, until the bottom of the second mounting plate abuts against the adjusting seat, and then the detection personnel starts the electromagnet through the control panel, the electromagnet generates an adsorption force and fixes the adjusting seat on the second mounting plate, so as to complete the accurate adjustment of the position of the plug, which is beneficial to improve the adaptability to different circuit boards, and at the same time, the accuracy of the plug to the socket is improved.

[0015] Optionally, the movable rod member comprises an ear plate arranged in the test seat, a screw rod is rotatably arranged on the ear plate, a guide rod with an axis parallel to the screw rod is arranged on the ear plate, a connecting block is arranged on the push rod, the connecting block is sleeved on the guide rod in a sliding mode, the connecting block is threadedly connected to the screw rod, and a driving motor electrically connected to the control panel is arranged on the ear plate, and the screw rod is coaxially arranged on the output shaft of the driving motor.

[0016] By adopting the above technical scheme, the control panel starts the driving motor, the output shaft of the driving motor drives the screw rod to rotate, under the guidance of the guide rod, the rotating screw rod drives the push rod to slide along the axis direction of the guide rod through the connecting block, so that the push rod can drive the expansion plate to slide.

[0017] Optionally, the positioning member comprises an angle pressing plate and a side pressing block, one of the angle pressing plates is rotationally arranged on the movable die plate and the static die plate, the two angle pressing plates are used to simultaneously limit the circuit board on the movable die plate and the static die plate, the movable die plate and the static die plate are both provided with an abutting plate, the abutting plate is slidably provided with a pressing column, the side pressing block is arranged on the pressing column, the abutting plate and the side pressing block are top supported by a tight spring, and the pressing column on the side away from the side pressing block of the abutting plate is provided with an anti-falling block.

[0018] By adopting the above technical scheme, when the movable die plate is adjusted, the detection personnel pulls the pressing column, the pressing column drives the side pressing block to press the tight spring on the abutting plate, the tight spring is compressed, the detection personnel places the circuit board on the movable die plate and the static die plate, then rotates the angle pressing plate, the angle pressing plate limits the circuit board on the movable die plate and the static die plate, then the detection personnel releases the pressing column, the tight spring restores the deformation and tightens the side edge of the circuit board through the side pressing block, and the fixing and positioning of the circuit board are completed through the side pressing block and the angle pressing plate, so that the plug can be smoothly inserted and pulled out of the socket.

[0019] Optionally, the movable die plate is provided with a guide rod, and the guide rod is in sliding cooperation with the static die plate.

[0020] By adopting the above technical scheme, the sliding direction of the movable die plate is guided and limited.

[0021] In summary, the present application has at least one of the following beneficial technical effects:

[0022] 1. The detection personnel first places the circuit board to be detected on the lower die plate, then fixes the position of the circuit board through the positioning member, then inserts the plug into the socket on the circuit board, then drives the upper die plate to move close to the lower die plate through the driving member, finally, the detection personnel fixes the plug on the upper die plate through the fixing member, the control panel detects the performance indicators of the circuit board through the plug, and at the same time, the debugging process of the circuit board of this size is completed, then the circuit board of the same specification is placed on the lower die plate, and the upper die plate drives the plug to be inserted into the socket on the circuit board fixed on the lower die plate through the driving member, so as to improve the adaptability to different sizes of circuit boards.

[0023] 2. The detection personnel first inserts the plug on the adjusting seat into the socket on the circuit board, then the worker gradually moves the second mounting plate close to the circuit board through the push-pull type quick clamp until the bottom of the second mounting plate abuts against the adjusting seat, then the detection personnel starts the electromagnet through the control panel, the electromagnet generates an attractive force and fixes the adjusting seat on the second mounting plate, so as to complete the accurate adjustment of the position of the plug, which is beneficial to improve the adaptability to different circuit boards, and at the same time, improves the accuracy of the plug to the socket.

[0024] 3. The detection personnel drives the push rod to slide through the moving lever, the sliding push rod first abuts against the driving slope at the bottom of the expansion plate, and as the push rod continues to slide, under the action of the sliding block and the sliding groove, the push rod pushes the reaction force of the driving slope to make the expansion plate vertically upwardly tilt and slide until the edge of the driving slope at the bottom of the expansion plate abuts against the push rod, at this time, the top of the expansion plate is flush with the upper surface of the static mold plate, in this process, the side of the expansion plate away from the static mold plate will abut against the sliding slope on the dynamic mold plate, under the action of the reaction force of the expansion plate abutting against the sliding slope on the dynamic mold plate, the dynamic mold plate slides away from the static mold plate, the tension spring is stretched, so as to complete the expansion of the lower mold plate in the length direction, so as to adapt to circuit boards of different lengths, at the same time, the expansion plate can support the bottom of the circuit board, reduce the possibility that the circuit board is locally compressed and deformed, and further cause damage to the circuit board, which is beneficial to improve the accuracy of the detection result of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic diagram of an embodiment of the present application.

[0026] Figure 2 is a structural schematic diagram of an embodiment of the present application for embodying the position relationship of the first mounting plate, the buffer column and the rubber column.

[0027] Figure 3 is a structural schematic diagram of an embodiment of the present application for embodying the position relationship of the angle pressing plate, the side pressing block and the static mold plate.

[0028] Figure 4 is a structural schematic diagram of an embodiment of the present application for embodying the position relationship of the supporting plate, the screw rod and the driving motor.

[0029] Figure 5 is a sectional view of an embodiment of the present application for embodying the position relationship of the expansion plate, the screw rod and the static mold plate.

[0030] Figure 6 is a structural schematic diagram of an embodiment of the present application for embodying the position relationship of the expansion plate and the sliding block.

[0031] Explanation of reference signs: 1, circuit board; 2, socket; 3, test seat; 4, control panel; 5, vertical plate; 6, upper mold plate; 61, first mounting plate; 62, second mounting plate; 63, isolation column; 64, buffer column; 65, anti-drop plate; 66, glue column; 67, buffer compression spring; 7, lower mold plate; 701, moving mold plate; 702, static mold plate; 703, tension spring; 704, expansion plate; 705, expansion groove; 706, sliding block; 707, sliding groove; 708, supporting plate; 709, driving slope; 710, push rod; 711, sliding slope; 8, driving piece; 81, push-pull type quick clamp; 82, vertical column; 9, positioning piece; 91, angle pressing plate; 92, side pressing block; 93, abutting plate; 94, pressing column; 95, abutting compression spring; 96, anti-drop block; 10, plug; 11, fixing piece; 111, adjusting seat; 112, electromagnet; 12, moving rod piece; 121, ear plate; 122, screw rod; 123, guide rod; 124, connecting block; 125, driving motor; 13, guide rod; 14, threading hole; 15, placing groove. DETAILED DESCRIPTION

[0032] The following will be described in detail in combination with the accompanying Figures 1-6 The present application is further described in detail.

[0033] The embodiment of the present application discloses a lamp module circuit board performance test carrier.

[0034] Referring to Figure 1 A lamp module circuit board performance test carrier comprises a hollow test seat 3, a control panel 4 is bolted on the test seat 3, a vertical plate 5 is welded on the test seat 3 in a vertical direction, an upper mold plate 6 is arranged on the vertical plate 5 in a vertical sliding manner, a lower mold plate 7 is arranged on the test seat 3 and below the upper mold plate 6, and the lower mold plate 7 is opposite to the upper mold plate 6, and a circuit board 1 is placed on the lower mold plate 7.

[0035] Referring to Figure 1 , Figure 2 and Figure 3 The upper mold plate 6 is arranged with a plug 10 electrically connected to the control panel 4, the plug 10 is used for plug-in cooperation with a socket 2 on the circuit board 1, the vertical plate 5 is arranged with a driving piece 8 for driving the upper mold plate 6 to be close to or away from the lower mold plate 7, and the upper mold plate 6 is arranged with a fixing piece 11 for fixing the position of the plug 10.

[0036] Referring to Figure 1 and Figure 2The upper die plate 6 comprises a first mounting plate 61 and a second mounting plate 62, the first mounting plate 61 is made of acrylic plate in the prior art, the second mounting plate 62 is made of steel material, a spacer column 63 is arranged between the first mounting plate 61 and the second mounting plate 62, the second mounting plate 62 is located below the first mounting plate 61, the plug 10 is arranged on the second mounting plate 62, and a plurality of buffer columns 64 are vertically slidably arranged on the second mounting plate 62.

[0037] With reference to Figure 1 And Figure 2 The plurality of buffer columns 64 are distributed on the second mounting plate 62, the buffer columns 64 between the first mounting plate 61 and the second mounting plate 62 are welded with anti-drop plates 65, one end of the buffer column 64 away from the anti-drop plate 65 is bolted with a rubber column 66, the rubber column 66 is made of rubber material, and the rubber column 66 is used for abutting against the upper surface of the circuit board 1. The second mounting plate 62 and the rubber column 66 are top-supported with a buffer compression spring 67.

[0038] With reference to Figure 2 The fixing member 11 comprises an adjusting seat 111, the plug 10 is bolted to the adjusting seat 111, the adjusting seat 111 is bolted with an electromagnet 112 electrically connected to the control panel 4, the electromagnet 112 is used for being adsorbed on the lower surface of the second mounting plate 62, the adsorption force between the electromagnet 112 and the second mounting plate 62 is greater than the plug-in and plug-out force between the plug 10 and the socket 2, and the second mounting plate 62 is vertically provided with a wire hole 14 through which the power line passes.

[0039] With reference to Figure 1 The driving member 8 comprises a push-pull type quick clamp 81 bolted to the vertical plate 5, the push-pull type quick clamp 81 is in the prior art, the first mounting plate 61 is bolted to the top head of the push-pull type quick clamp 81, the test seat 3 is welded with a vertical column 82, and the second mounting plate 62 is slidably sleeved on the vertical column 82.

[0040] When the circuit board 1 is fixed on the lower die plate 7, the tester pulls the handle of the push-pull type quick clamp 81, the top head of the push-pull type quick clamp 81 drives the second mounting plate 62 to approach the circuit board 1 through the first mounting plate 61, the second mounting plate 62 drives the buffer columns 64 to descend synchronously until the rubber column 66 abuts against the upper surface of the circuit board 1, and along with the continuous descending of the second mounting plate 62, the buffer compression spring 67 is compressed, and the descending speed of the second mounting plate 62 is slowed down.

[0041] Along with the continuous descending of the second mounting plate 62, the plug 10 on the adjusting seat 111 is gradually plugged into the socket 2 on the circuit board 1, then the tester controls the control panel 4, the control panel 4 detects the circuit board 1 through the connecting wire of the plug 10, so that the various performance indexes of the circuit board 1 are quickly obtained.

[0042] With reference toFigure 3 、 Figure 4 and Figure 5 The lower die plate 7 comprises a movable die plate 701 and a static die plate 702, and a placement slot 15 for placing the circuit board 1 is formed on the movable die plate 701 and the static die plate 702, the guide rod 13 is welded on the movable die plate 701 and is in sliding fit with the static die plate 702, the tension spring 703 is arranged between the movable die plate 701 and the static die plate 702, and the maximum size of the movable die plate 701 and the static die plate 702 after adjustment does not exceed the size of the first mounting plate 61.

[0043] Referring to Figure 3 、 Figure 5 and Figure 6 , a plurality of extension plates 704 are arranged between the movable die plate 701 and the static die plate 702, the plurality of extension plates 704 are arranged in sequence along the direction from the movable die plate 701 to the static die plate 702, and the extension slot 705 for the extension plate 704 to slide is formed on the test seat 3.

[0044] Referring to Figure 5 and Figure 6 , the extension plate 704 is inclined away from the static die plate 702 along the direction from top to bottom, one of the extension plates 704 closest to the static die plate 702 is fixed on the static die plate 702, the slide block 706 is welded on the side of the extension plate 704 close to the static die plate 702, and the slide groove 707 for the slide block 706 on the adjacent extension plate 704 to slide is formed on the other side of the extension plate 704.

[0045] Referring to Figure 4 and Figure 5 , the top wall of the test seat 3 is welded with the L-shaped cross-section supporting plate 708, the supporting plate 708 is used for supporting the extension plate 704, the driving inclined surface 709 is formed on the bottom of the extension plate 704, the driving inclined surface 709 is inclined away from the movable die plate 701 along the direction from top to bottom, and the push rod 710 is arranged in sliding fit in the test seat 3 and is used for abutting against and sliding with the driving inclined surface 709.

[0046] Referring to Figure 5 , when the bottom edge of the driving inclined surface 709 of the extension plate 704 abuts against the upper surface of the push rod 710, at this time, the top plane of the extension plate 704 on the upper surface of the push rod 710 is flush with the upper surface of the static die plate 702, and the extension plate 704 flush with the upper surface of the static die plate 702 is separated from the supporting plate 708.

[0047] Referring to Figure 5 , the sliding inclined surface 711 is formed on the movable die plate 701 and is inclined toward the static die plate 702 along the direction from top to bottom, and the side of the extension plate 704 away from the static die plate 702 is used for abutting against and sliding with the sliding inclined surface 711.

[0048] Referring to Figure 4The test seat 3 is provided with a movable rod 12 for driving the push rod 710 to slide, the movable rod 12 comprises an ear plate 121 welded to the top of the test seat 3, the ear plate 121 is rotationally connected with a screw rod 122, and the ear plate 121 is provided with a guide rod 123 which is parallel to the axis of the screw rod 122.

[0049] With reference to Figure 4 The push rod 710 is welded with a connecting block 124, the connecting block 124 is slidably sleeved on the guide rod 123, the connecting block 124 is threadedly connected with the screw rod 122, the ear plate 121 is bolted with a driving motor 125 which is electrically connected with the control panel 4, the driving motor 125 is a forward and reverse motor in the prior art, and the screw rod 122 is coaxially bolted with the output shaft of the driving motor 125.

[0050] With reference to Figure 3 The lower die plate 7 is provided with a positioning piece 9 for fixing the position of the circuit board 1, the positioning piece 9 comprises a pressing angle plate 91 and a side pressing block 92, the pressing angle plate 91 is rotationally connected with one on the movable die plate 701 and the static die plate 702, and the two pressing angle plates 91 are used for simultaneously limiting the circuit board 1 on the movable die plate 701 and the static die plate 702, and the movable die plate 701 and the static die plate 702 are both welded with an abutting plate 93.

[0051] With reference to Figure 3 The abutting plate 93 is slidably provided with a pressing column 94, the side pressing block 92 is welded on the pressing column 94, the side pressing block 92 and the abutting plate 93 are top-supported with a pressing spring 95, and the pressing column 94 on the side of the abutting plate 93 away from the side pressing block 92 is welded with an anti-falling block 96.

[0052] The detection personnel first measure the length of the circuit board 1 to be detected, and then start the driving motor 125 through the control panel 4, the output shaft of the driving motor 125 drives the screw rod 122 to rotate, under the guidance of the guide rod 123, the rotating screw rod 122 drives the connecting block 124 to slide, and the connecting block 124 drives the push rod 710 to slide along the axis direction of the guide rod 123.

[0053] The sliding push rod 710 first abuts against the driving inclined surface 709 at the bottom of the expansion plate 704, and as the push rod 710 continues to slide, under the action of the sliding block 706 and the sliding groove 707, the reaction force of the push rod 710 driving the driving inclined surface 709 makes the expansion plate 704 vertically slide upward, until the edge of the driving inclined surface 709 at the bottom of the expansion plate 704 abuts against the push rod 710, at this time, the top of the expansion plate 704 is flush with the upper surface of the static die plate 702.

[0054] In the process, the side of the expansion plate 704 away from the static die plate 702 abuts against the sliding slope 711 on the dynamic die plate 701, under the action of the reaction force of the expansion plate 704 abutting against the sliding slope 711 on the dynamic die plate 701, the dynamic die plate 701 slides away from the static die plate 702, the tension spring 703 is stretched, so as to increase the distance between the dynamic die plate 701 and the static die plate 702, so that the circuit board 1 to be detected can be placed between the dynamic die plate 701 and the static die plate 702.

[0055] When the adjustment of the dynamic die plate 701 is completed, the detection personnel pulls the pressing column 94, the pressing column 94 drives the side pressing block 92 to press the abutting spring 95 against the abutting plate 93, the abutting spring 95 is compressed, then the detection personnel places the circuit board 1 between the dynamic die plate 701 and the static die plate 702, at this time, the expansion plate 704 can support the bottom of the circuit board 1.

[0056] The detection personnel rotates the pressing angle plate 91, the rotating pressing angle plate 91 limits the circuit board 1 in the placing slot 15 opened on the dynamic die plate 701 and the static die plate 702, then the detection personnel releases the pressing column 94, the abutting spring 95 restores the deformation and abuts against the side edge of the circuit board 1 through the side pressing block 92, the fixing and positioning of the circuit board 1 are completed through the side pressing block 92 and the pressing angle plate 91, the detection personnel inserts the plug 10 on the adjusting seat 111 into the socket 2 on the fixed circuit board 1.

[0057] Then pull the handle of the push-pull type quick clamp 81, so that the top pressing head of the push-pull type quick clamp 81 drives the second mounting plate 62 to approach the adjusting seat 111, until the second mounting plate 62 abuts against the upper surface of the adjusting seat 111, at this time the detection personnel supplies power to the electromagnet 112 through the control panel 4, the energized electromagnet 112 fixes the adjusting seat 111 and the plug 10 on the second mounting plate 62, so as to complete the accurate positioning of the plug 10.

[0058] The implementation principle of the lamp module circuit board performance test carrier in the embodiment of the application is as follows: the detection personnel first measures the length size of the circuit board 1 to be detected, then starts the driving motor 125 through the control panel 4, the output shaft of the driving motor 125 drives the screw rod 122 to rotate, under the guidance of the guide rod 123, the rotating screw rod 122 drives the connecting block 124 to slide, the connecting block 124 drives the push rod 710 to slide along the axis direction of the guide rod 123.

[0059] The sliding push rod 710 first abuts against the driving slope 709 at the bottom of the expansion plate 704. As the push rod 710 continues to slide, the push rod 710 pushes the driving slope 709 under the action of the sliding block 706 and the sliding groove 707, and the reaction force of the driving slope 709 makes the expansion plate 704 vertically slide upward until the edge of the driving slope 709 at the bottom of the expansion plate 704 abuts against the push rod 710. At this time, the top of the expansion plate 704 is flush with the upper surface of the static mold plate 702.

[0060] During this process, the side of the expansion plate 704 away from the static mold plate 702 abuts against the sliding slope 711 on the dynamic mold plate 701. Under the action of the reaction force of the expansion plate 704 abutting against the sliding slope 711 on the dynamic mold plate 701, the dynamic mold plate 701 slides away from the static mold plate 702, and the tension spring 703 is stretched to increase the distance between the dynamic mold plate 701 and the static mold plate 702, so that the circuit board 1 to be detected can be placed between the dynamic mold plate 701 and the static mold plate 702.

[0061] When the adjustment of the dynamic mold plate 701 is completed, the detection personnel pull the compression column 94, and the compression column 94 drives the side pressing block 92 to compress the abutting spring 95 against the abutting plate 93. Then, the detection personnel places the circuit board 1 between the dynamic mold plate 701 and the static mold plate 702. At this time, the expansion plate 704 can support the bottom of the circuit board 1.

[0062] The detection personnel rotates the compression angle plate 91, and the rotating compression angle plate 91 limits the circuit board 1 in the placement slot 15 opened on the dynamic mold plate 701 and the static mold plate 702. Then, the detection personnel releases the compression column 94, and the abutting spring 95 restores the deformation and abuts against the side edge of the circuit board 1 through the side pressing block 92. The side pressing block 92 and the compression angle plate 91 complete the fixation and positioning of the circuit board 1, and the detection personnel plugs the plug 10 on the adjustment seat 111 into the socket 2 on the fixed circuit board 1.

[0063] Then the detection personnel pulls the handle of the push-pull type quick clamp 81, and the top pressing head of the push-pull type quick clamp 81 drives the second mounting plate 62 to approach the adjustment seat 111 until the second mounting plate 62 abuts against the upper surface of the adjustment seat 111. At this time, the detection personnel supplies power to the electromagnet 112 through the control panel 4, and the energized electromagnet 112 fixes the adjustment seat 111 and the plug 10 on the second mounting plate 62, thereby completing the accurate positioning of the plug 10.

[0064] After that, the same specification circuit board 1 is replaced. After the circuit board 1 is fixed on the lower mold plate 7 again, the detection personnel pulls the handle of the push-pull type quick clamp 81, and the top pressing head of the push-pull type quick clamp 81 drives the second mounting plate 62 to approach the circuit board 1 through the first mounting plate 61. The second mounting plate 62 drives the buffer column 64 to synchronously descend until the rubber column 66 abuts against the upper surface of the circuit board 1.

[0065] With the second mounting plate 62 continuing to descend, the buffer compression spring 67 will be compressed, the descending speed of the second mounting plate 62 will slow down, with the second mounting plate 62 continuously descending, the second mounting plate 62 will drive the plug 10 on the adjusting seat 111 to gradually plug into the socket 2 on the circuit board 1, then the detection personnel will control the control panel 4, the control panel 4 will detect the circuit board 1 through the wire connected with the plug 10, so as to quickly obtain the various performance indexes of the circuit board 1.

[0066] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: all equivalent changes made on the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A performance testing fixture for a lighting module circuit board, characterized in that: The test base (3) includes a test stand (3) and a control panel (4). The test stand (3) is provided with a vertical plate (5). An upper template (6) is vertically slidably provided on the vertical plate (5). The test stand (3) is provided with a lower template (7) opposite to the upper template (6). The vertical plate (5) is provided with a driving component (8) for driving the upper template (6) to move closer to or away from the lower template (7). The circuit board (1) is placed on the lower template (7). The lower template (7) is provided with a positioning component (9) for fixing the position of the circuit board (1). The upper template (6) is provided with a plug (10) electrically connected to the control panel (4). The upper template (6) is provided with a fixing component (11) for fixing the position of the plug (10). The plug (10) is used to connect and cooperate with the socket (2) on the circuit board (1). The test seat (3) is hollow inside. The lower template (7) includes a moving template (701) and a stationary template (702). A tension spring (703) is provided between the moving template (701) and the stationary template (702). Multiple extension plates (704) are arranged between the moving template (701) and the stationary template (702). The multiple extension plates (704) are arranged along the direction from the moving template (701) to the stationary template (702). The test seat (3) has openings. An expansion groove (705) is provided for the expansion plate (704) to slide. The expansion plate (704) is inclined away from the stationary template (702) in a downward direction. The expansion plate (704) closest to the stationary template (702) is fixed on the stationary template (702). A slider (706) is provided on one side of the expansion plate (704), and a groove (707) is provided on the other side for the slider (706) on the adjacent expansion plate (704) to slide. The test base (3) is provided with a support plate (708) for supporting the extension plate (704). The bottom of the extension plate (704) is inclined with a driving slope (709) on the side opposite to the moving template (701). A push rod (710) is slidably provided on the test base (3). The push rod (710) is used to abut against and slide with the driving slope (709). When the bottom edge of the driving slope (709) of the extension plate (704) is... When the push rod (710) is abutted, the top of the extension plate (704) is flush with the upper surface of the stationary template (702). The moving template (701) is inclined with a sliding slope (711) on the side facing the stationary template (702). The side of the extension plate (704) facing away from the stationary template (702) is used to abut and slide with the sliding slope (711). The test seat (3) is provided with a moving rod (12) that drives the push rod (710) to slide.

2. The lamp module circuit board performance testing carrier according to claim 1, characterized in that: The upper template (6) includes a first mounting plate (61) and a second mounting plate (62). An isolation column (63) is provided between the first mounting plate (61) and the second mounting plate (62). The second mounting plate (62) is located below the first mounting plate (61). The plug (10) is arranged on the second mounting plate (62). A plurality of buffer columns (64) are vertically slidably provided on the second mounting plate (62). The plurality of buffer columns (64) are distributed on the second mounting plate (62). An anti-detachment plate (65) is provided on the buffer column (64) located between the first mounting plate (61) and the second mounting plate (62). A glue column (66) is provided at the end of the buffer column (64) facing away from the anti-detachment plate (65). The glue column (66) is used to abut against the circuit board (1). A buffer spring (67) is supported between the second mounting plate (62) and the glue column (66).

3. The lamp module circuit board performance testing carrier according to claim 2, characterized in that: The driving component (8) includes a push-pull quick clamp (81) disposed on the upright plate (5), the first mounting plate (61) is disposed on the top clamp of the push-pull quick clamp (81), the test seat (3) is provided with a column (82), and the second mounting plate (62) is slidably sleeved on the column (82).

4. The lamp module circuit board performance testing carrier according to claim 3, characterized in that: The second mounting plate (62) is made of steel. The fixing member (11) includes an adjustment seat (111). The plug (10) is disposed on the adjustment seat (111). An electromagnet (112) electrically connected to the control panel (4) is disposed on the adjustment seat (111). The electromagnet (112) is used to attract to the second mounting plate (62). The attraction between the electromagnet (112) and the second mounting plate (62) is greater than the insertion and extraction force between the plug (10) and the socket (2).

5. The lamp module circuit board performance testing carrier according to claim 1, characterized in that: The moving rod (12) includes an ear plate (121) disposed in the test seat (3), a screw (122) rotatably disposed on the ear plate (121), a guide rod (123) with an axis parallel to the screw (122) arranged on the ear plate (121), a connecting block (124) disposed on the push rod (710), the connecting block (124) slidably sleeved on the guide rod (123), the connecting block (124) threadedly connected to the screw (122), a drive motor (125) electrically connected to the control panel (4) disposed on the ear plate (121), and the screw (122) coaxially disposed on the output shaft of the drive motor (125).

6. The lamp module circuit board performance testing carrier according to claim 1, characterized in that: The positioning component (9) includes a corner plate (91) and a side pressure block (92). One corner plate (91) is rotatably disposed on both the moving template (701) and the stationary template (702). The two corner plates (91) are used to simultaneously restrict the circuit board (1) on the moving template (701) and the stationary template (702). Both the moving template (701) and the stationary template (702) are provided with abutment plates (93). A pressing post (94) is slidably disposed on the abutment plate (93). The side pressure block (92) is disposed on the pressing post (94). A pressing spring (95) supports the side pressure block (92) and the abutment plate (93). An anti-detachment block (96) is disposed on the pressing post (94) on the side of the abutment plate (93) facing away from the side pressure block (92).

7. The lamp module circuit board performance testing fixture according to claim 1, characterized in that: The moving template (701) is provided with a guide rod (13), which slides in conjunction with the stationary template (702).

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