Detection probe, detection circuit and detection device

Abstract

The invention provides a detection probe, a detection circuit and a detection device, and relates to the technical field of micro light emitting diode detection. The detection probe comprises a base; the detection part is fixedly arranged on the surface of the base, and the detection part is used for being in contact with an electrode of a to-be-detected chip so as to input an excitation signal to the to-be-detected chip; the conductive film layer is arranged on the surface of the base and electrically connected with the detection part, the conductive film layer is used for transmitting an excitation signal to the detection part, the base is configured to generate elastic deformation in the vertical direction under the action of external force in the vertical direction, and the vertical direction represents the direction perpendicular to the surface of the chip to be detected. The detection circuit comprises a plurality of detection units, the plurality of detection units comprise a plurality of detection probes, and the plurality of detection units respectively correspond to a plurality of light emitting diode units; and the plurality of wires are electrically connected with the conductive film layers of the plurality of detection probes respectively.

Description

Technical Field

[0001] This invention relates to the field of micro light-emitting diode (LED) detection technology, and more specifically, to a detection probe, detection circuit, and detection device. Background Technology

[0002] The quality of the micro-light-emitting diode (Micro-LED) chip itself directly determines the quality of the micro-LED display screen. However, the detection efficiency and accuracy of the micro-LED chip quality are relatively low, which affects the mass production speed of the micro-LED chip and the overall yield rate of the micro-LED display screen. Summary of the Invention

[0003] In view of this, the present invention provides a detection probe, a detection circuit, and a detection device.

[0004] One aspect of the present invention provides a detection probe, the detection probe comprising: a base; a detection part fixedly disposed on the surface of the base, the detection part being used to contact the electrodes of a chip under test to input an excitation signal to the chip under test; and a conductive film layer disposed on the surface of the base and electrically connected to the detection part, the conductive film layer being used to transmit the excitation signal to the detection part, wherein the base is configured to generate elastic deformation along the vertical direction under the action of an external force in the vertical direction, the vertical direction being a direction perpendicular to the surface of the chip under test.

[0005] According to an embodiment of the present invention, the base is made of insulating material.

[0006] According to an embodiment of the present invention, the detection unit is made of a conductive metal material, and the area of ​​the contact surface between the detection unit and the electrode of the chip under test is less than or equal to the area of ​​the contact surface between the detection unit and the base.

[0007] Another aspect of the present invention provides a detection circuit for detecting an array of light-emitting diode chips based on packaged micro light-emitting diodes, the array of light-emitting diode chips including a plurality of light-emitting diode units arranged in a row-column interval, the detection circuit including: a plurality of detection units, each detection unit including a plurality of the above-mentioned detection probes, the plurality of detection units being arranged in a row-column interval and each of the plurality of detection units corresponding to a plurality of the above-mentioned light-emitting diode units; and a plurality of wires electrically connected to the conductive film layers of the plurality of detection probes respectively.

[0008] According to an embodiment of the present invention, the light-emitting diode unit includes a first light-emitting electrode of a first light-emitting element, a second light-emitting electrode of a second light-emitting element, a third light-emitting electrode of a third light-emitting element, and a cathode electrode shared by multiple light-emitting elements. The detection unit includes a plurality of detection probes, including a first detection probe, a second detection probe, a third detection probe, and a fourth detection probe. The detection portion of the first detection probe is used to contact the first light-emitting electrode, the detection portion of the second detection probe is used to contact the second light-emitting electrode, the detection portion of the third detection probe is used to contact the third light-emitting electrode, and the detection portion of the fourth detection probe is used to contact the cathode electrode.

[0009] According to an embodiment of the present invention, the plurality of the aforementioned wires include a plurality of first wires, a plurality of second wires, a plurality of third wires, and a plurality of fourth wires; wherein, the aforementioned first wires are respectively electrically connected to the conductive film layer of the first detection probe included in each of the plurality of aforementioned detection units located in the same row, the aforementioned second wires are respectively electrically connected to the conductive film layer of the second detection probe included in each of the plurality of aforementioned detection units located in the same row, the aforementioned third wires are respectively electrically connected to the conductive film layer of the third detection probe included in each of the plurality of aforementioned detection units located in the same row, and the aforementioned fourth wires are respectively electrically connected to the conductive film layer of the fourth detection probe included in each of the plurality of aforementioned detection units located in the same column.

[0010] According to an embodiment of the present invention, the detection circuit further includes a gating module for controlling the conduction and disconnection of multiple first wires, multiple second wires, multiple third wires and multiple fourth wires.

[0011] According to an embodiment of the present invention, the gating module is configured to control the conduction of a first target wire among a plurality of first wires, a plurality of second wires and a plurality of third wires under the control of a gating signal, and to control the conduction of a second target wire among a plurality of fourth wires, so as to form a conductive circuit of the target light-emitting element included in the target light-emitting diode unit through the first target wire and the second target wire, so as to drive the target light-emitting element to emit light.

[0012] Another aspect of the present invention provides a detection device for detecting an array of light-emitting diode chips based on packaged micro light-emitting diodes, characterized in that the detection device includes a sensing module, a processing module, and a detection circuit, wherein the sensing module is electrically connected to the processing module, the processing module is electrically connected to the detection circuit, and the detection circuit is used to detect the array of light-emitting diode chips.

[0013] According to an embodiment of the present invention, the processing module is used to provide a gating signal to the detection circuit; the detection circuit is used to control the target light-emitting element included in the target light-emitting diode unit in the light-emitting diode chip array to emit light under the control of the gating signal; the sensing module is used to collect the light emission data of the target light-emitting element to obtain a detection signal; the processing module is also used to obtain the detection result of the target light-emitting element based on the detection signal.

[0014] According to embodiments of the present invention, a detection probe is constructed using a base capable of elastic deformation, a detection section, and a conductive film layer of a thin metal film. This simplifies the structure and reduces wiring complexity. The base acts as a soft support, undergoing recoverable deformation. Under external force, this allows for better and more complete contact between the detection section and the electrodes of the chip under test, assisting the conductive film layer in transmitting excitation signals and improving the detection accuracy of the chip under test. The detection probe reduces the structural strength requirements of the conductive film layer and lowers the minimum size limit of the probe used to test the chip under test, thereby increasing the test point density of multiple chips under test and the number of test points, thus improving the detection efficiency of the chip under test. Therefore, the detection probe of the present application embodiment can improve the detection efficiency and accuracy of micro LED chips, thereby increasing the mass production speed of micro LED chips and the overall yield rate of micro LED displays. Attached Figure Description

[0015] The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0016] Figure 1 A schematic diagram of a detection probe according to an embodiment of the present invention is shown;

[0017] Figure 2 A schematic diagram of a light-emitting diode chip array according to an embodiment of the present invention is shown;

[0018] Figure 3 A schematic diagram of a detection circuit according to an embodiment of the present invention is shown;

[0019] Figure 4 A schematic diagram of the detection principle of the detection circuit according to an embodiment of the present invention is shown;

[0020] Figure 5 A schematic diagram of the detection circuit according to another embodiment of the present invention is shown;

[0021] Figure 6 A detection principle diagram of a detection circuit according to another embodiment of the present invention is shown; and

[0022] Figure 7A schematic diagram of a detection device according to an embodiment of the present invention is shown. Detailed Implementation

[0023] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the invention for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0024] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0025] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0026] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0027] Gallium nitride-based micro-light-emitting diodes (LEDs) are characterized by low power consumption, long lifespan, small size, and high reliability, making them suitable for applications in optical communication, solid-state lighting, and display technology. The quality of the micro-LED chip itself directly determines the quality of the micro-LED display screen. However, due to limitations in current processing technology and equipment, not all micro-LED chips meet the required optical and electrical parameters. Therefore, detecting and intercepting defective pixels during the micro-LED chip manufacturing process is crucial for improving the yield rate of micro-LED displays. MIP (Micro LED in Package) is a packaging architecture for the mass production of micro-LED chips. It integrates the micro-LED chips into an array within the package, allowing for the separate packaging of large-area display panels. For smaller package units, yield rates are easier to control. Furthermore, moving the testing process from the chip stage to the packaging stage reduces costs and increases production speed.

[0028] Testing methods for miniature light-emitting diode (LED) chips include contact electroluminescence detection. This method involves injecting current into the two electrodes of the miniature LED chip using a miniature electrical probe made of rigid metal material, and then recording the LED's electrical and luminescent properties. However, during production testing, due to the limitations of the metal probe's structure, its minimum size cannot match the electrode locations on the miniature LED chip. This results in a probe density at corresponding locations that is less than the number of test points, leading to a smaller number of test points per test and reduced testing speed.

[0029] During the testing process, the probe needs to contact the LED electrode to conduct and illuminate the LED. Since there is an unavoidable difference in flatness between the probe plane and the LED electrode plane, a longer stroke and greater pressure than the standard spacing are typically used when pressing the probe down to prevent poor contact due to surface unevenness and ensure no missed detections. However, given that the probe is made of rigid metal, applying excessive pressure to contact the LED may cause scratches and damage to the LED surface, reducing the yield of the miniature LED chip. It may also damage the probe structure due to deformation during contact, reducing its lifespan. Furthermore, for rigid probe testing, the input and output of the detection signal are achieved through wires connected to the tail of each probe. These wires are independent of each other, and each probe operates independently during the lighting test. Therefore, the complexity of the wiring needs to be considered when designing the miniature LED chip. As the probe density increases, the wiring difficulty increases, and the test signal becomes more susceptible to crosstalk.

[0030] Embodiments of the present invention provide a detection probe, a detection circuit, and a detection device.

[0031] Figure 1 A schematic diagram of a detection probe according to an embodiment of the present invention is shown.

[0032] like Figure 1 As shown, the detection probe includes a base 110, a detection part 120, and a conductive film layer 130.

[0033] A detection unit 120 is fixedly disposed on the surface of the base 110. The detection unit 120 is used to contact the electrode 140 of the chip under test to input an excitation signal to the chip under test. A conductive film layer 130 is disposed on the surface of the base 110 and electrically connected to the detection unit 120. The conductive film layer 130 is used to transmit the excitation signal to the detection unit 120. The base 110 is configured to produce elastic deformation in the vertical direction under the action of an external force F in the vertical direction, where the vertical direction refers to the direction perpendicular to the surface of the chip under test.

[0034] In one example, base 110 can be a flexible material substrate, such as a polymer like polydimethylsiloxane. Base 110 can also be a natural polymer material, such as bacterial cellulose. Base 110 can also be a composite substrate of organic polymers and inorganic materials.

[0035] In one example, the material of the detection unit 120 can be tungsten, rhenium-tungsten, beryllium copper, or palladium alloy, etc., which have high conductivity. The material of the conductive film layer 130 can be copper, silver, gold, aluminum, platinum, etc., which also have high conductivity. One end of the conductive film layer 130 is electrically connected to the detection unit 120, and the other end of the conductive film layer 130 can be connected to an external circuit to receive an excitation signal. The excitation signal can be a voltage or current signal, a clock signal or a reset signal, or a power supply signal. Under the action of the excitation signal, the internal circuit of the chip under test can undergo measurable responses such as flipping, amplification, or driving output. For example, if the chip under test is a light-emitting diode (LED) chip, the detection unit 120 of the detection probe contacts the electrodes of the LED chip, the external circuit provides a power supply signal, the conductive film layer 130 transmits the power supply signal, and the detection unit 120 inputs the power supply signal to the LED chip. The power supply signal can drive the LED on the LED chip to emit light. The quality of the LED chip can be detected by whether the LED emits light.

[0036] For multiple chips under test, the arrangement of multiple detection probes can be designed according to the arrangement of the multiple chips under test and the test points of the electrodes of the multiple chips under test.

[0037] In one example, the fabrication method of the detection probe may include: fabricating a base 110 by 3D printing or molding; fixing the base 110 onto a glass substrate by thermal processing; fabricating a copper detection part 120 on the top of the base 110 by photolithography; performing metal sputtering on the detection part 120 to form a hard metal protective layer with a thickness of micrometers on the surface of the detection part 120; fixing the detection part 120 onto the base 110 by ultraviolet light irradiation and thermal processing; and welding the detection part 120 to the conductive film layer 130 using anisotropic conductive adhesive to form the detection probe.

[0038] In one example, a sample of the detection probe can be tested and still shows no signal attenuation after millions of tests.

[0039] According to an embodiment of the present invention, a detection probe is constructed using a base 110 capable of elastic deformation, a detection unit 120, and a conductive film layer 130 of a thin metal film. This simplifies the structure and reduces wiring complexity. The base 110 acts as a soft support, undergoing recoverable deformation. Under the action of an external force F, the detection unit 120 makes closer and more complete contact with the electrode 140 of the chip under test, assisting the conductive film layer 130 in transmitting excitation signals and improving the detection accuracy of the chip under test. The detection probe reduces the structural strength requirements of the conductive film layer 130 and lowers the minimum size limit of the probe used to test the chip under test, thereby increasing the test point density of multiple chips under test and increasing the number of test points, thus improving the detection efficiency of the chip under test. Therefore, the detection probe of the present application embodiment can improve the detection efficiency and accuracy of micro LED chips, thereby increasing the mass production speed of micro LED chips and the overall yield of micro LED displays.

[0040] According to an embodiment of the present invention, for multiple chips under test, the detection probe with a soft support base can, under the action of external force, make the detection part of each detection probe more fully in contact with the electrode of each chip under test. This can reduce the missed detection caused by uneven contact surfaces, reduce scratches or damage to the electrode surface of the chip under test caused by excessive pressure, and reduce wear on the detection probe, thus extending the service life of the detection probe.

[0041] According to an embodiment of the present invention, the base 110 may be made of an insulating material.

[0042] According to an embodiment of the present invention, the detection unit 120 may be made of a conductive metal material, and the area of ​​the contact surface between the detection unit 120 and the electrode of the chip under test is less than or equal to the area of ​​the contact surface between the detection unit 120 and the base 110.

[0043] The present invention also provides a detection circuit that can be used to detect an array of LED chips based on packaged miniature LEDs.

[0044] Figure 2 A schematic diagram of a light-emitting diode chip array according to an embodiment of the present invention is shown.

[0045] like Figure 2 As shown, the light-emitting diode chip array 200 includes a plurality of light-emitting diode units 210 arranged in a row-column spacing manner.

[0046] Figure 3 A schematic diagram of a detection circuit according to an embodiment of the present invention is shown.

[0047] like Figure 3 As shown, the detection circuit 300 includes multiple detection units 310 and multiple wires. Each detection unit 310 includes multiple detection probes, and the multiple detection units 310 are arranged in a row-column interval.

[0048] Figure 4 A schematic diagram of the detection principle of the detection circuit according to an embodiment of the present invention is shown.

[0049] like Figure 4 As shown, each of the multiple detection units 310 corresponds to a multiple light-emitting diode unit 210. Multiple wires are electrically connected to the conductive film layers of the multiple detection probes.

[0050] like Figure 2 , Figure 3 , Figure 4 As shown, the light-emitting diode chip array 200 includes M rows and N columns of light-emitting diode units 210. M and N are positive integers. The corresponding detection circuit 300 may include M rows and N columns of detection units 310.

[0051] like Figure 2 As shown, the light-emitting diode unit 210 may include a first light-emitting electrode 211 of a first light-emitting element, a second light-emitting electrode 212 of a second light-emitting element, a third light-emitting electrode 213 of a third light-emitting element, and a cathode electrode 214 shared by multiple light-emitting elements. For example, the first light-emitting element may be a blue light-emitting diode, the second light-emitting element may be a green light-emitting diode, and the third light-emitting element may be a red light-emitting diode. The first light-emitting element, the second light-emitting element, the third light-emitting element, and the cathode are packaged together to form the light-emitting diode unit 210. Multiple light-emitting diode units 210 can be mounted on a printed circuit board, and multiple light-emitting diode units 210 can be connected to form a light-emitting diode chip array.

[0052] like Figure 3As shown, the detection unit 310 includes multiple detection probes, including a first detection probe 311, a second detection probe 312, a third detection probe 313, and a fourth detection probe 314.

[0053] like Figure 4 As shown, the detection part of the first detection probe 311 is used to contact the first light-emitting electrode 211, the detection part of the second detection probe 312 is used to contact the second light-emitting electrode 212, the detection part of the third detection probe 313 is used to contact the third light-emitting electrode 213, and the detection part of the fourth detection probe 314 is used to contact the cathode electrode 214.

[0054] According to an embodiment of the present invention, multiple light-emitting elements in each light-emitting diode unit 210 can be connected one-to-one with multiple detection probes in the corresponding detection unit 310, enabling detection with a monochromatic light-emitting element as the smallest detection unit.

[0055] like Figure 3 As shown, the multiple wires may include multiple first wires 321, multiple second wires 322, multiple third wires 323, and multiple fourth wires 324. The first wires 321 are electrically connected to the conductive film layer of the first detection probe 311 included in each of the multiple detection units 310 located in the same row. The second wires 322 are electrically connected to the conductive film layer of the second detection probe 312 included in each of the multiple detection units 310 located in the same row. The third wires 323 are electrically connected to the conductive film layer of the third detection probe 313 included in each of the multiple detection units 310 located in the same row. The fourth wires 324 are electrically connected to the conductive film layer of the fourth detection probe 314 included in each of the multiple detection units 310 located in the same column.

[0056] For example, the first wire 321 in the first row can be electrically connected to the conductive film layer of the first detection probe 311 included in each of the multiple detection units 310 in the first row. The first wire 321 in the m-th row can be electrically connected to the conductive film layer of the first detection probe 311 included in each of the multiple detection units 310 in the m-th row. The first wire 321 in the M-th row can be electrically connected to the conductive film layer of the first detection probe 311 included in each of the multiple detection units 310 in the M-th row, where 1 < m < M, and m is a natural number. Multiple wires can include M first wires 321, M second wires 322, M third wires 323, and N fourth wires 324.

[0057] Figure 5 A schematic diagram of the detection principle of a detection circuit according to another embodiment of the present invention is shown.

[0058] like Figure 3 and Figure 5As shown, the detection circuit 300 may further include a gating module 330. The gating module 330 can be used to control the conduction and disconnection of multiple first wires 321, multiple second wires 322, multiple third wires 323 and multiple fourth wires 324.

[0059] like Figure 3 and Figure 5 As shown, the detection circuit 300 may further include a power supply module 340 and a ground terminal 350, wherein the power supply module 340 can provide voltage. The gating module 330 may include a first gating unit 331 and a second gating unit 332. The first gating unit 331 can control the connection and disconnection of multiple first wires 321, multiple second wires 322, and multiple third wires 323 with the power supply module. The second gating unit 332 can control the connection and disconnection of multiple fourth wires 324 with the ground terminal.

[0060] According to an embodiment of the present invention, the gating module 330 can be configured to control the conduction of a first target wire among a plurality of first wires 321, a plurality of second wires 322 and a plurality of third wires 323 under the control of the gating signal, and to control the conduction of a second target wire among a plurality of fourth wires 324, so as to form a conductive circuit of the target light-emitting element included in the target light-emitting diode unit through the first target wire and the second target wire, so as to drive the target light-emitting element to emit light.

[0061] In one example, each of the multiple first wires 321, multiple second wires 322, multiple third wires 323, and multiple fourth wires 324 is configured with an independent input / output interface.

[0062] like Figure 5 As shown, the gating module 330 may further include a logic unit 333. The logic unit 333 can perform logical judgment on the gating signal, and input the first control signal and the second control signal into the first gating unit 331 and the second gating unit 332 respectively according to the logical judgment result. The first gating unit 331 controls the first target wire among the multiple first wires 321, multiple second wires 322 and multiple third wires 323 to be turned on, and the second gating unit 332 controls the second target wire among the multiple fourth wires 324 to be turned on, so as to realize the single-point detection function.

[0063] like Figure 2 , Figure 3 and Figure 5 As shown, in one example, the LED chip array 200 includes 16 LED units 210 arranged in 4 rows and 4 columns, and the corresponding detection circuit 300 can be designed with 16 detection units 310 arranged in 4 rows and 4 columns. The detection circuit 300 includes 4 first wires 321, 4 second wires 322, 4 third wires 323, and 4 fourth wires 324.

[0064] The first gating unit 331 can be a 1×12 single-channel gating switch. The 1×12 single-channel gating switch can be a 16-to-1 analog switch chip, using only the first 12 channels. The 1×12 single-channel gating switch can also be implemented through a multi-stage connection of multiple single-pole four-throw switches. The four first wires 321, four second wires 322, and four third wires 323 can be connected to the first gating unit 331 through their respective input / output interfaces.

[0065] The second gating unit 332 can be a 1×4 single-channel gating switch. The four fourth wires 324 can be connected to the second gating unit 332 through their respective input / output interfaces.

[0066] The first gating unit 331 of the gating module 330 can connect the input / output interface of the first target wire to the power module, controlling the first target wire to be connected to the power module, while disconnecting the other wires among the multiple first wires 321, multiple second wires 322, and multiple third wires 323 from the power module. The second gating unit 332 of the gating module 330 can connect the input / output interface of the second target wire to the ground terminal, controlling the second target wire to be connected to the ground terminal, while disconnecting the other wires among the multiple fourth wires 324 from the ground terminal. The power module, the first target wire, the target light-emitting element in the target light-emitting diode unit, the cathode electrode in the target light-emitting diode unit, and the second target wire form a conductive circuit for the target light-emitting element, and the target light-emitting element is lit.

[0067] For example, the gating module 330 performs a logical judgment on the gating signal through the logic unit 333 to obtain a first logical judgment result. The first logical judgment result is to light up the first light-emitting element of the LED unit at the detection point in the second row and third column. According to the first logical judgment result, the first control signal and the second control signal are respectively input to the first gating unit 331 and the second gating unit 332, so that the third switch 3313 of the first gating unit 331 is opened through the first gating unit 331, so that the first target wire connected to the third switch 3313 of the first gating unit 331 is conductive, and the second switch 3322 of the second gating unit 332 is opened through the second gating unit 332, so that the second target wire connected to the second switch 3322 of the second gating unit 332 is conductive, thereby making the first light-emitting element of the LED unit at the detection point in the second row and third column form a conductive circuit with the cathode electrode, so that the first light-emitting element of the LED unit at the detection point in the second row and third column is lit up, or is not lit up due to a fault in the first light-emitting element.

[0068] In another example, the first gating unit 331 can be a multiplexer switch, which can be a single-pole multi-throw analog switch or a digital switch such as a decoder. The second gating unit 332 can also be a multiplexer switch. The gating module 330 can perform logical judgment on the gating signal through the logic unit 333, and input the first control signal and the second control signal into the first gating unit 331 and the second gating unit 332 respectively according to the logical judgment result, so that the first gating unit 331 controls multiple wires among the multiple first wires 321, multiple second wires 322, and multiple third wires 323 to be simultaneously turned on, and the second gating unit 332 controls multiple wires among the multiple fourth wires 324 to be turned on, so as to realize the multi-point detection function.

[0069] For example, the gating module 330 performs a logical judgment on the gating signal through the logic unit 333 to obtain a second logical judgment result. The second logical judgment result is to light up all the light-emitting elements of the LED unit in the second row and third column of the detection point. According to the second logical judgment result, the first control signal and the second control signal are respectively input to the first gating unit 331 and the second gating unit 332, so that the first gating unit 331 controls the third switch 3313 of the first gating unit 331 to open, the seventh switch 3317 of the first gating unit 331 to open, and the eighth switch 3318 of the first gating unit 331 to open, so that the first wire 321 connected to the third switch 3313 of the first gating unit 331 is conductive, the second wire 322 connected to the seventh switch 3317 of the first gating unit 331 is conductive, and the first gating unit 331 is conductive. The third wire 323 connected to the eighth switch 3318 of 31 is turned on, and the second switch 3322 of the second selection unit 332 is controlled by the second selection unit 332, so that the fourth wire 324 connected to the second switch 3322 of the second selection unit 332 is turned on, thereby making the first light-emitting element, the second light-emitting element, and the third light-emitting element of the light-emitting diode unit at the detection point in the second row and the third column form a conductive circuit with the cathode electrode. The first light-emitting element, the second light-emitting element, and the third light-emitting element of the light-emitting diode unit at the detection point in the second row and the third column are lit up, or are not lit up due to a fault.

[0070] Figure 6 A schematic diagram of the detection principle of a detection circuit according to another embodiment of the present invention is shown.

[0071] like Figure 6As shown, in this embodiment, the detection circuit can be configured with four soldering pins, including three input terminals and one output terminal. All first wires 321 can be connected to the first input terminal 361, all second wires 322 can be connected to the second input terminal 362, all third wires 323 can be connected to the third input terminal 363, and all fourth wires 324 can be connected to the output terminal 364.

[0072] The first gating unit 331 can be a 1×4 single-channel gating switch. The second gating unit 332 can be a device that includes a switch.

[0073] For example, the gating module 330 performs a logical judgment on the gating signal through the logic unit 333 to obtain a third logical judgment result. The third logical judgment result is to light up the first light-emitting element in all the light-emitting diode units. According to the third logical judgment result, the first control signal and the second control signal are respectively input to the first gating unit 331 and the second gating unit 332, so that the first input terminal 361 is connected to the power module 340 through the first gating unit 331, so that all the first wires 321 are connected, and the output terminal 364 is connected to the ground terminal 350 through the second gating unit 332, so that all the fourth wires 324 are connected, thereby making all the first light-emitting elements form a conductive circuit, and all the first light-emitting elements are lit up, or not all of them are lit up due to the failure of some of the first light-emitting elements.

[0074] For example, the gating module 330 performs a logical judgment on the gating signal through the logic unit 333 to obtain a fourth logical judgment result. The fourth logical judgment result is to light up the second light-emitting elements in all the light-emitting diode units. According to the fourth logical judgment result, the first control signal and the second control signal are respectively input to the first gating unit 331 and the second gating unit 332, so that the first gating unit 331 controls the second input terminal 362 to connect to the power module 340, so that all the second wires 322 are connected, and the second gating unit 332 controls the output terminal 364 to connect to the ground terminal 350, so that all the fourth wires 324 are connected, thereby making all the second light-emitting elements form a conductive circuit, and all the second light-emitting elements are lit up, or not all of them are lit up due to the failure of some second light-emitting elements.

[0075] For example, the gating module 330 performs a logical judgment on the gating signal through the logic unit 333 to obtain a fifth logical judgment result. The fifth logical judgment result is to light up the third light-emitting element in all the light-emitting diode units. According to the fifth logical judgment result, the first control signal and the second control signal are respectively input to the first gating unit 331 and the second gating unit 332, so that the first gating unit 331 controls the third input terminal 363 to connect to the power module 340, so that all the third wires 323 are connected, and the second gating unit 332 controls the output terminal 364 to connect to the ground terminal 350, so that all the fourth wires 324 are connected, thereby making all the third light-emitting elements form a conductive circuit, and all the third light-emitting elements are lit up, or not all of them are lit up due to the failure of some third light-emitting elements.

[0076] According to an embodiment of the present invention, the detection circuit 300 can connect the electrodes of light-emitting elements of the same color to the same port through wiring layout, so that light-emitting elements of the same color can be lit up simultaneously in one lighting operation, realizing the common detection function of light-emitting elements of the same color.

[0077] The present invention also provides a detection device for detecting an array of light-emitting diode chips based on packaged micro light-emitting diodes.

[0078] Figure 7 A schematic diagram of a detection device according to an embodiment of the present invention is shown.

[0079] like Figure 7 As shown, the detection device 700 includes a sensing module 710, a processing module 720, and a detection circuit 300. The sensing module 710 is electrically connected to the processing module 720, and the processing module 720 is electrically connected to the detection circuit 300. The detection circuit 300 is used to detect the light-emitting diode chip array 200.

[0080] According to an embodiment of the present invention, the processing module 720 is used to provide a gating signal to the detection circuit 300. The detection circuit 300 is used to control the target light-emitting element included in the target light-emitting diode unit in the light-emitting diode chip array 200 to emit light under the control of the gating signal. The sensing module 710 is used to collect the emission data of the target light-emitting element to obtain a detection signal. The processing module 720 is also used to obtain a detection result of the target light-emitting element based on the detection signal.

[0081] In one example, the detection circuit has over 300 wires leading outwards, which can be connected to an external flexible circuit board via horizontal wires, thus establishing communication with the processing module 720. The sensing module 710 can obtain luminescence data by acquiring the light signal from the target luminescent element.

[0082] Markings, such as four alignment symbols, can be set on the detection circuit 300 to align the multiple detection units of the detection circuit 300 with the multiple light-emitting diode units of the light-emitting diode chip array 200.

[0083] The detection device 700 may further include a stage on which the LED chip array 200 is placed. The distance between the detection circuit 300 and the LED chip array 200 can be adjusted by adjusting the height of the stage. When the height of the LED chip array 200 is increased, the bases of the multiple detection probes of the detection circuit 300 are compressed until the detection parts of the multiple detection probes of the detection circuit 300 make full contact with the multiple corresponding electrodes of the LED chip array 200.

[0084] The processing module 720 can sequentially issue target point illumination gating signals according to the preset target point illumination program and the positions of multiple light-emitting elements in multiple light-emitting diode units of the LED chip array 200. The detection circuit 300, under the control of the target point illumination gating signals, addresses and controls the conduction of the first target wire and the second target wire, so that multiple light-emitting elements in the LED chip array 200 are illuminated sequentially and individually. The sensing module 710 can include a camera and a spectrometer. The camera can be used to capture images of the LED chip array 200 and collect the emission data of the target light-emitting elements. The spectrometer can be used to convert the emission data into digital signals to obtain detection signals. The processing module 720 is also used to obtain the detection result of the target light-emitting elements based on the detection signals.

[0085] The processing module 720 can issue a first lighting selection signal according to a preset first lighting program. The detection circuit 300, under the control of the first lighting selection signal, controls all first wires and all fourth wires in the LED chip array 200 to conduct, thereby lighting all first light-emitting elements in the LED chip array 200. The sensing module 710 can collect the light emission data of the first light-emitting elements of all LED units; for example, if all blue LEDs are lit, it outputs a detection signal. Based on the detection signal, the processing module 720 obtains a detection result indicating that all blue LEDs are functioning normally.

[0086] The processing module 720 can issue a second lighting selection signal according to a preset second lighting program. The detection circuit 300, under the control of the second lighting selection signal, controls all second wires and all fourth wires in the LED chip array 200 to be conductive, thus lighting up all second light-emitting elements in the LED chip array 200. The sensing module 710 can collect the light emission data of the second light-emitting elements of all LED units; for example, if all green LEDs are lit, it outputs a detection signal. Based on the detection signal, the processing module 720 obtains a detection result indicating that all green LEDs are functioning normally.

[0087] The processing module 720 can issue a third lighting selection signal according to a preset third lighting program. The detection circuit 300, under the control of the third lighting selection signal, controls all third wires and all fourth wires in the LED chip array 200 to conduct, thereby lighting all third light-emitting elements in the LED chip array 200. The sensing module 710 can collect the light emission data of the third light-emitting elements of all LED units; for example, if all red LEDs are lit, it outputs a detection signal. Based on the detection signal, the processing module 720 obtains a detection result indicating that all red LEDs are functioning normally.

[0088] The detection device 700 may also include an oscilloscope, which can be used to display the detection signal.

[0089] Those skilled in the art will understand that the features described in the various embodiments of the present invention can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments of the present invention can be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

[0090] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. A detection probe, characterized in that, The detection probe includes: Base; A detection unit, fixedly disposed on the surface of the base, is used to contact the electrodes of the chip under test (DUT) to input an excitation signal to the DUT; and A conductive film layer is disposed on the surface of the base and electrically connected to the detection unit. The conductive film layer is used to transmit the excitation signal to the detection unit. The base is configured to generate elastic deformation along the vertical direction under the action of an external force in the vertical direction, where the vertical direction refers to the direction perpendicular to the surface of the chip under test.

2. The detection probe according to claim 1, characterized in that, The base is made of insulating material.

3. The detection probe according to claim 1, characterized in that, The detection unit is made of a conductive metal material, and the area of ​​the contact surface between the detection unit and the electrode of the chip under test is less than or equal to the area of ​​the contact surface between the detection unit and the base.

4. A detection circuit for detecting an array of LED chips based on packaged micro LEDs, the LED chip array comprising a plurality of LED units arranged in a row-column spacing, characterized in that, The detection circuit includes: Multiple detection units, each detection unit comprising multiple detection probes as described in any one of claims 1 to 3, the multiple detection units arranged in a row-column interval, and each of the multiple detection units corresponding to a multiple of the light-emitting diode units; and Multiple wires are electrically connected to the conductive film layers of multiple detection probes, respectively.

5. The detection circuit according to claim 4, characterized in that, The light-emitting diode unit includes a first light-emitting electrode of a first light-emitting element, a second light-emitting electrode of a second light-emitting element, a third light-emitting electrode of a third light-emitting element, and a cathode electrode shared by multiple light-emitting elements. The detection unit includes multiple detection probes, including a first detection probe, a second detection probe, a third detection probe, and a fourth detection probe. The detection part of the first detection probe is used to contact the first light-emitting electrode, the detection part of the second detection probe is used to contact the second light-emitting electrode, the detection part of the third detection probe is used to contact the third light-emitting electrode, and the detection part of the fourth detection probe is used to contact the cathode electrode.

6. The detection circuit according to claim 5, characterized in that, The multiple conductors include multiple first conductors, multiple second conductors, multiple third conductors, and multiple fourth conductors; The first wire is electrically connected to the conductive film layer of the first detection probe included in each of the plurality of detection units located in the same row; the second wire is electrically connected to the conductive film layer of the second detection probe included in each of the plurality of detection units located in the same row; the third wire is electrically connected to the conductive film layer of the third detection probe included in each of the plurality of detection units located in the same row; and the fourth wire is electrically connected to the conductive film layer of the fourth detection probe included in each of the plurality of detection units located in the same column.

7. The detection circuit according to claim 6, characterized in that, The detection circuit further includes: The gating module is used to control the conduction and disconnection of multiple first wires, multiple second wires, multiple third wires and multiple fourth wires.

8. The detection circuit according to claim 7, characterized in that, The gating module is configured to, under the control of a gating signal, control the conduction of a first target wire among a plurality of first wires, a plurality of second wires, and a plurality of third wires, and control the conduction of a second target wire among a plurality of fourth wires, so as to form a conductive circuit of the target light-emitting element included in the target light-emitting diode unit through the first target wire and the second target wire, so as to drive the target light-emitting element to emit light.

9. A detection device for detecting an array of light-emitting diode chips based on packaged micro light-emitting diodes, characterized in that, The detection device includes a sensing module, a processing module, and a detection circuit as described in any one of claims 4 to 8. The sensing module is electrically connected to the processing module, and the processing module is electrically connected to the detection circuit. The detection circuit is used to detect the light-emitting diode chip array.

10. The detection device according to claim 9, characterized in that, The processing module is used to provide a gating signal to the detection circuit; The detection circuit is used to control the target light-emitting element included in the target light-emitting diode unit in the light-emitting diode chip array to emit light under the control of the gating signal; The sensing module is used to collect the emission data of the target light-emitting element and obtain a detection signal; The processing module is also used to obtain the detection result of the target light-emitting element based on the detection signal.

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