Manufacturing method of driving backboard, driving backboard, display panel and spliced screen

Abstract

The invention provides a manufacturing method of a driving back plate, the driving back plate, a display panel and a spliced screen, and relates to the technical field of driving back plates, the manufacturing method of the driving back plate comprises the steps that the driving back plate is provided, and the driving back plate comprises a first area and a second area located on at least one side of the first area; arranging a protective film covering the first area and exposing the second area; arranging a conductive layer, wherein the conductive layer comprises a first conductive part covering the protective film and a second conductive part covering the second area; removing the protective film to strip the first conductive part; arranging a packaging layer at least covering the second conductive part; and performing laser etching on the second conductive part to form a side line. In the design, the packaging layer covering the second conductive part is arranged after the protective film is removed, so that chips generated in the film tearing process can be fixed, and the short circuit of the side wiring caused by the chips is avoided.

Description

Technical Field

[0001] This application relates to the field of driver backplane technology, and more specifically, to a method for manufacturing a driver backplane, a driver backplane, a display panel, and a video wall. Background Technology

[0002] With the development of display device manufacturing technology, Mini LEDs and Micro-LEDs are widely used due to their superior advantages in brightness, resolution, contrast ratio, energy consumption, lifespan, response speed, and thermal stability. However, due to limitations in mass transfer technology, Mini LED or Micro-LED display panels cannot currently be manufactured into large-scale monolithic screens. Therefore, it is necessary to splice multiple smaller display panels into a larger screen. To achieve seamless splicing, side wiring is required to connect the front and back circuits of the screen. However, existing side wiring processes may cause short circuits or wire detachment. Summary of the Invention

[0003] To overcome the aforementioned shortcomings in the prior art, the purpose of this application is to provide a method for manufacturing a drive backplane, the method comprising:

[0004] A drive backplate body is provided, the drive backplate body including a first region and a second region located at least one side of the first region;

[0005] A protective film is provided that covers the first area and exposes the second area;

[0006] A conductive layer is provided, the conductive layer including a first conductive portion covering the protective film and a second conductive portion covering the second region;

[0007] Remove the protective film to peel off the first conductive part;

[0008] A packaging layer is provided that at least covers the second conductive portion;

[0009] The second conductive part is laser-etched to form a side trace.

[0010] Another object of this application is to provide a method for manufacturing a drive backplane, the method comprising:

[0011] A drive backplate body is provided, the drive backplate body including a first region and a second region located at least one side of the first region;

[0012] A protective film is provided that covers the first area and exposes the second area;

[0013] A conductive layer is provided, the conductive layer including a first conductive portion covering the protective film and a second conductive portion covering the second region;

[0014] A packaging layer is provided that at least covers the second conductive portion;

[0015] Remove the protective film to peel off the first conductive part;

[0016] The second conductive part is laser-etched to form a side trace.

[0017] In one possible implementation, the step of setting at least the encapsulation layer covering the second conductive portion includes:

[0018] The encapsulation layer is provided with an ink material that at least covers the second conductive portion.

[0019] The encapsulation layer is cured to cause cracks in the encapsulation layer at the junction of the protective film and the second region.

[0020] In one possible implementation, the drive backplate body includes a first surface, a second surface disposed opposite to the first surface, and a side surface connecting the first surface and the second surface; the step of setting a protective film covering the first region and exposing the second region includes:

[0021] A protective film is provided on the first surface and the second surface of the drive backplate body to cover the first area and expose the second area;

[0022] The step of setting a conductive layer covering the protective film and the second region includes:

[0023] A conductive layer is provided covering the protective film, the second region, and the side surface. The conductive layer includes a first conductive portion covering the protective film, a second conductive portion covering the second region, and a third conductive portion covering the side surface.

[0024] The step of laser etching the second conductive portion includes:

[0025] The second conductive portion and the third conductive portion are laser etched to form the side trace.

[0026] Another object of this application is to provide a drive backplane, the drive backplane comprising:

[0027] A drive backplate body, the drive backplate body including a first surface, a second surface disposed opposite to the first surface, and a side surface connecting the first surface and the second surface;

[0028] At least two side traces extending from the first surface through the side to the second surface, with a gap between adjacent two side traces;

[0029] The packaging unit covers at least the side traces located on the first surface and the second surface, and the packaging unit does not contact the drive backplane body.

[0030] In one possible implementation, the material of the encapsulation unit includes ink or epoxy resin.

[0031] In one possible implementation, the drive backplane body includes a first bonding contact located on the first surface and a second bonding contact located on the second surface, and the side trace extends from the first surface to the second surface and connects the first bonding contact and the second bonding contact.

[0032] In one possible implementation, the packaging unit covers the side traces located on the first surface, the second surface, and the side surface.

[0033] Another objective of this application is to provide a display panel, the display panel comprising a driving backplate manufactured by the manufacturing method of the driving backplate provided in this application or the driving backplate provided in this application and at least one light-emitting device disposed on one side of the driving backplate.

[0034] Another objective of this application is to provide a video wall, which is composed of multiple display panels provided in this application spliced ​​together.

[0035] Compared with the prior art, this application has the following beneficial effects:

[0036] The method for manufacturing the driving backplane, the driving backplane, the display panel, and the splicing screen provided in this application embodiment can first remove the protective film, then set an encapsulation layer that at least covers the second conductive part, and then perform laser etching on the second conductive part. In this way, the debris generated during the film removal process can be fixed, avoiding short circuits caused by debris in the side wiring and improving the pass rate of the side wiring.

[0037] Alternatively, an encapsulation layer can be first set to cover at least the second conductive part, then the protective film can be removed, and then the second conductive part can be laser etched. In this way, the second conductive part can be protected during the film removal process. Since the protective film covering the second conductive part has relatively greater hardness, when the protective film is removed, in addition to the adhesion between the second conductive part and the drive backplane, the encapsulation layer also applies a force to the second conductive part because the encapsulation layer does not tend to bend or break. This can reduce the risk of the second conductive part falling off due to the removal of the protective film and improve the pass rate of side wiring. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is one of the schematic diagrams of a method for manufacturing a drive backplane in the prior art;

[0040] Figure 2 This is the second schematic diagram of a method for manufacturing a drive backplane in the prior art;

[0041] Figure 3 This is the third schematic diagram of a method for manufacturing a drive backplane in the prior art;

[0042] Figure 4 One of the flowcharts illustrating a method for manufacturing a drive backplane provided in an embodiment of this application;

[0043] Figure 5 This is one of the structural schematic diagrams of the drive backplane provided in the embodiments of this application;

[0044] Figure 6 This is one of the structural schematic diagrams of the protective film provided in the embodiments of this application;

[0045] Figure 7 This is the second schematic diagram of the structure of the protective film provided in the embodiments of this application;

[0046] Figure 8 This is one of the structural schematic diagrams of the conductive layer provided in the embodiments of this application;

[0047] Figure 9 This is a second schematic diagram of the structure of the conductive layer provided in the embodiments of this application;

[0048] Figure 10 A schematic diagram of debris provided in an embodiment of this application;

[0049] Figure 11 This is one of the structural schematic diagrams of the encapsulation layer provided in the embodiments of this application;

[0050] Figure 12 This is a schematic diagram of the side routing structure provided in an embodiment of this application;

[0051] Figure 13 A second schematic flowchart illustrating the manufacturing method of the drive backplane provided in this application embodiment;

[0052] Figure 14 This is the second schematic diagram of the encapsulation layer provided in the embodiments of this application;

[0053] Figure 15 This is the third schematic diagram of the encapsulation layer provided in the embodiments of this application;

[0054] Figure 16 A schematic diagram of a sub-step of step S240 provided in an embodiment of this application.

[0055] Figure 17 This is a second schematic diagram of the structure of the drive backplane provided in the embodiments of this application;

[0056] Figure 18 This is the third schematic diagram of the drive backplane provided in the embodiments of this application.

[0057] Icons: 110 - First area; 120 - Second area; 100 - Drive backplane body; 210 - First surface; 220 - Second surface; 230 - Side; 300 - Protective film; 410 - Conductive layer; 411 - First conductive part; 412 - Second conductive part; 413 - Third conductive part; 420 - Encapsulation layer; 430 - Encapsulation unit; 500 - Side trace; 600 - Debris. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0059] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0060] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0061] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0062] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0063] The inventor discovered through research that... (Please refer to...) Figures 1 to 3 In existing side-wiring processes, a protective film 300' and a conductive layer 410' are typically first disposed on one side of the drive backplane body 100'. The conductive layer 410' may include a first conductive portion 411' covering the protective film 300' and a second conductive portion 412' not covered by the protective film 300', such as... Figure 1 As shown. Then, the protective film 300' is peeled off to remove the first conductive portion 411' covering the protective film 300', while retaining the second conductive portions 412' located on both sides of the drive backplate body 100', as shown. Figure 2 As shown. Next, the second conductive portion 412' is etched to form a side trace. Finally, an encapsulation layer 420' is applied to cover the side trace to protect it, as shown. Figure 3 As shown.

[0064] However, during the removal of the protective film 300', some movable debris may be generated. If this debris moves to the adjacent side trace and is fixed by the encapsulation layer 420' after laser etching of the second conductive part 412', it will cause a short circuit in the side trace.

[0065] In view of this, this embodiment provides a solution that can reduce the risks of the above-mentioned problems. The solution provided in this embodiment will be described in detail below.

[0066] Please refer to Figure 4 , Figure 4 Example: A flowchart illustrating the manufacturing method of the drive backplane provided in this embodiment. The manufacturing method of the drive backplane may include the following steps.

[0067] Step S110: A drive backplate body 100 is provided, the drive backplate body 100 including a first region 110 and a second region 120 located on at least one side of the first region 110.

[0068] In this embodiment, please refer to Figure 5 The drive backplate body 100 may include the first region 110 and the second region 120. The second region 120 may be located on one side of the first region 110 or on both sides of the first region 110.

[0069] It should be noted that, Figure 5 The shape of the drive backplate body 100 shown is only one possible implementation in this embodiment. In other implementations of this embodiment, the shape of the drive backplate body 100 can also be other polygons, such as square, rhombus, equilateral triangle, regular hexagon, etc.

[0070] Optionally, in this embodiment, please refer to Figure 6 The drive backplate body 100 may include a first surface 210, a second surface 220 disposed opposite to the first surface 210, and a side surface 230 connecting the first surface 210 and the second surface 220.

[0071] Specifically, the first surface 210 and the second surface 220 of the drive backplate body 100 may include the first region 110 and the second region 120, and the orthographic projection of the first region 110 and the second region 120 of the first surface 210 on the drive backplate body 100 and the orthographic projection of the first region 110 and the second region 120 of the second surface 220 on the drive backplate body 100 may completely coincide.

[0072] For example, if the second region 120 of the first surface 210 is located on one side of the first region 110 of the first surface 210, then the second region 120 of the second surface 220 is located on the same side of the first region 110 of the second surface 220. If the second region 120 of the first surface 210 is located on opposite sides of the first region 110 of the first surface 210, then the second region 120 of the second surface 220 is located on opposite sides of the first region 110 of the second surface 220.

[0073] The first region 110 of the first surface 210 may be provided with a driving electrode (not shown) for bonding with a light-emitting device. This driving electrode may be connected to a driving circuit within the driving backplate body 100 to transmit the driving voltage provided by the driving circuit to the light-emitting device. Both the first surface 210 and the second region 120 of the second surface 220 may be provided with bonding contacts for connecting with the side trace 500.

[0074] Step S120: Set a protective film 300 that covers the first region 110 and exposes the second region 120.

[0075] In this embodiment, please refer to Figure 7 The protective film 300 can be provided in the first region 110, and the protective film 300 can completely cover the first region 110 without covering the second region 120.

[0076] Optionally, please refer to again Figure 6 When setting a protective film 300 that covers the first region 110 and exposes the second region 120, the protective film 300 can be set on the first surface 210 and the second surface 220 of the drive backplate body 100. Specifically, the protective film 300 can be respectively set on the first region 110 of the first surface 210 and the first region 110 of the second surface 220, and the orthographic projection of the protective film 300 located on the first region 110 of the first surface 210 on the drive backplate body 100 can completely coincide with the orthographic projection of the protective film 300 located on the first region 110 of the second surface 220 on the drive backplate body 100.

[0077] Step S130: A conductive layer 410 is provided, the conductive layer 410 including a first conductive portion 411 covering the protective film 300 and a second conductive portion 412 covering the second region 120.

[0078] In this embodiment, please refer to Figure 8 After the protective film 300 is set, the conductive layer 410 can be set in the first region 110 and the second region 120 of the drive back plate body 100. The conductive layer 410 may include the first conductive part 411 covering the protective film 300 and the second conductive part 412 covering the second region 120.

[0079] Specifically, in this embodiment, the conductive layer 410 can be formed by sputtering, and the conductive layer 410 can completely cover the protective film 300 and the second region 120.

[0080] Please refer to Figure 9When providing a conductive layer 410 covering the protective film 300 and the second region 120, a conductive layer 410 covering the protective film 300, the second region 120, and the side surface 230 can be provided. The conductive layer 410 may include a first conductive portion 411 covering the protective film 300, a second conductive portion 412 covering the second region 120, and a third conductive portion 413 covering the side surface 230. Specifically, the conductive layer 410 may completely cover the first surface 210 and the second surface 220 of the drive backplate body 100, and cover at least a portion of the side surface 230 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220. For example, if the shape of the drive backplate body 100 is a cuboid, and the second region 120 of the first surface 210 is located on opposite sides of the long side of the cuboid, and the second region 120 of the second surface 220 is located on opposite sides of the long side of the cuboid, then the conductive layer 410 can completely cover the first surface 210, the second surface 220, and the two side surfaces 230 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220 of the drive backplate body 100.

[0081] Step S140: Remove the protective film 300 to peel off the first conductive part 411.

[0082] In this embodiment, the protective film 300 set in step S120 can be removed, and the first conductive part 411 set in step S130 can be peeled off.

[0083] Specifically, after the conductive layer 410 is applied, the protective film 300 can be removed. During the process of removing the protective film 300, the first conductive portion 411 attached to the protective film 300 can also be removed, thereby peeling off the first conductive portion 411 located in the first region 110 and retaining the second conductive portion 412 located in the second region 120.

[0084] Step S150: Set an encapsulation layer 420 that at least covers the second conductive portion 412.

[0085] In this embodiment, please refer to Figures 10 to 11 Even if some debris 600 may be generated during the removal of the protective film 300 and the first conductive part 411, the second conductive part 412 can be wrapped with ink material or epoxy resin material to form the encapsulation layer 420 covering the second area 120. The encapsulation layer 420 can fix the debris 600 generated in step S140, thereby avoiding short circuits in the wiring caused by the debris 600.

[0086] In step S160, the second conductive part 412 is laser etched to form the side trace 500.

[0087] In this embodiment, please refer to Figure 12 Laser etching can be performed on the encapsulation layer 420 and the second conductive portion 412 of the second region 120 to form the side trace 500, and the number of side traces 500 can be multiple.

[0088] When laser etching is performed on the second conductive portion 412, both the second conductive portion 412 and the third conductive portion 413 can be laser etched to form the side trace 500. Specifically, the encapsulation layer 420, the second conductive portion 412, and the third conductive portion 413 can be laser etched to form the side trace 500 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220.

[0089] Based on the above design, in the manufacturing method of the drive backplane provided in this embodiment, by setting the encapsulation layer 420 covering the second conductive part 412 after removing the protective film 300, the debris 600 generated during the film removal process can be fixed, thereby preventing the debris 600 from moving after laser etching. This avoids short circuits in the side traces 500 caused by the debris 600, improving the yield rate of the side traces 500. Furthermore, even if debris 600 falls onto the side traces 500 before encapsulation, it will not cause a short circuit.

[0090] In one possible implementation, the drive backplane body 100 may include bonding contacts located in the second region 120. These bonding contacts may include a first bonding contact located on the first surface 210 and a second bonding contact located on the second surface 220. There may be multiple first and second bonding contacts. The orthographic projections of the first and second bonding contacts on the drive backplane body 100 may completely coincide with the orthographic projections of the second bonding contacts on the drive backplane body 100, and the first bonding contacts on the first surface 210 and the second bonding contacts on the second surface 220 are arranged at equal intervals.

[0091] When laser etching is performed on the second conductive portion 412 and the third conductive portion 413, the second conductive portion 412 and the third conductive portion 413 can be removed by laser etching, forming a side trace 500 extending from the first surface 210 to the second surface 220 and connecting the first bonding contact and the second bonding contact. Specifically, there can be multiple side traces 500, and one side trace 500 can connect one first bonding contact on the first surface 210 and one second bonding contact on the second surface 220.

[0092] The inventor's research revealed that... (Please refer to...) Figures 1 to 3 In existing side-wiring processes, a protective film 300' and a conductive layer 410' are typically first disposed on one side of the drive backplane body 100'. The conductive layer 410' may include a first conductive portion 411' covering the protective film 300' and a second conductive portion 412' not covered by the protective film 300', such as... Figure 1 As shown. Then, the protective film 300' is peeled off to remove the first conductive portion 411' covering the protective film 300', while retaining the second conductive portions 412' located on both sides of the drive backplate body 100', as shown. Figure 2 As shown. Next, the second conductive portion 412 is etched to form a side trace. Finally, an encapsulation layer 420' is applied to cover the side trace to protect it, as shown. Figure 3 As shown. However, during the removal of the protective film 300', the first conductive part 411' attached to the protective film 300' may pull on the second conductive part 412' that needs to be retained, thereby causing the second conductive part 412' to partially fall off.

[0093] This application also provides a method for manufacturing a drive backplane, please refer to... Figure 13 The method for manufacturing the drive backplate may include the following steps.

[0094] Step S210: A drive backplate body 100 is provided, the drive backplate body 100 including a first region 110 and a second region 120 located on at least one side of the first region 110.

[0095] In this embodiment, the drive backplate body 100 may include the first region 110 and the second region 120. The second region 120 may be located on one side of the first region 110, or the second region 120 may be located on opposite sides of the first region 110.

[0096] Optionally, in this embodiment, the drive backplate body 100 may include a first surface 210, a second surface 220 disposed opposite to the first surface 210, and a side surface 230 connecting the first surface 210 and the second surface 220.

[0097] Specifically, the first surface 210 and the second surface 220 of the drive backplate body 100 may include the first region 110 and the second region 120, and the orthographic projection of the first region 110 and the second region 120 of the first surface 210 on the drive backplate body 100 and the orthographic projection of the first region 110 and the second region 120 of the second surface 220 on the drive backplate body 100 may completely coincide.

[0098] For example, if the second region 120 of the first surface 210 is located on one side of the first region 110 of the first surface 210, then the second region 120 of the second surface 220 is located on the same side of the first region 110 of the second surface 220. If the second region 120 of the first surface 210 is located on opposite sides of the first region 110 of the first surface 210, then the second region 120 of the second surface 220 is located on opposite sides of the first region 110 of the second surface 220.

[0099] The first region 110 of the first surface 210 may be provided with a driving electrode for bonding with a light-emitting device. This driving electrode may be connected to a driving circuit within the driving backplate body 100 to transmit the driving voltage provided by the driving circuit to the light-emitting device. Both the first surface 210 and the second region 120 of the second surface 220 may be provided with bonding contacts for connecting with the side trace 500.

[0100] Step S220: Set a protective film 300 that covers the first region 110 and exposes the second region 120.

[0101] In this embodiment, the protective film 300 can be provided in the first region 110, and the protective film 300 can completely cover the first region 110 without covering the second region 120.

[0102] Optionally, when providing a protective film 300 that covers the first region 110 and exposes the second region 120, the protective film 300 can be provided on the first surface 210 and the second surface 220 of the drive backplate body 100. Specifically, the protective film 300 can be provided on the first region 110 of the first surface 210 and the first region 110 of the second surface 220, respectively. The orthographic projection of the protective film 300 on the first region 110 of the first surface 210 onto the drive backplate body 100 can completely coincide with the orthographic projection of the protective film 300 on the first region 110 of the second surface 220 onto the drive backplate body 100.

[0103] Step S230: A conductive layer 410 is provided, the conductive layer 410 including a first conductive portion 411 covering the protective film 300 and a second conductive portion 412 covering the second region 120.

[0104] In this embodiment, after the protective film 300 is set, the conductive layer 410 can be set in the first region 110 and the second region 120 of the drive backplate body 100. The conductive layer 410 may include the first conductive portion 411 covering the protective film 300 and the second conductive portion 412 covering the second region 120.

[0105] Specifically, in this embodiment, the conductive layer 410 can be formed by sputtering, and the conductive layer 410 can completely cover the protective film 300 and the second region 120.

[0106] When providing a conductive layer 410 covering the protective film 300 and the second region 120, a conductive layer 410 covering the protective film 300, the second region 120, and the side surface 230 can be provided. The conductive layer 410 may include a first conductive portion 411 covering the protective film 300, a second conductive portion 412 covering the second region 120, and a third conductive portion 413 covering the side surface 230. Specifically, the conductive layer 410 may completely cover the first surface 210 and the second surface 220 of the drive backplate body 100, and cover at least a portion of the side surface 230 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220. For example, if the shape of the drive backplate body 100 is a cuboid, and the second region 120 of the first surface 210 is located on opposite sides of the long side of the cuboid, and the second region 120 of the second surface 220 is located on opposite sides of the long side of the cuboid, then the conductive layer 410 can completely cover the first surface 210, the second surface 220, and the two side surfaces 230 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220 of the drive backplate body 100.

[0107] Step S240: Set an encapsulation layer 420 that at least covers the second conductive portion 412.

[0108] In this embodiment, please refer to Figure 14 Before removing the protective film 300, the second conductive part 412 and the portion of the first conductive part 411 in contact with the second conductive part 412 can be encapsulated to form the encapsulation layer 420, which can cover the second region 120 and a portion of the first region 110.

[0109] Alternatively, please refer to Figure 15 The encapsulation layer 420 can cover a portion of the first conductive portion 411 of the first region 110, the second conductive portion 412 of the second region 120, and the third conductive portion 413 of the side surface 230. Specifically, the encapsulation layer 420 can completely cover the second conductive portion 412 of the first surface 210 and the second surface 220, the third conductive portion 413 of the side surface 230, and a portion of the first conductive portion 411 of the first surface 210 and the second surface 220.

[0110] Step S250: Remove the protective film 300 to peel off the first conductive part 411.

[0111] In this embodiment, the protective film 300 set in step S120 can be removed, and the first conductive portion 411 set in step S130 can be peeled off. Specifically, since the protective film 300 covering the second conductive portion 412 has relatively greater hardness, when the protective film 300 is peeled off, in addition to the adhesion between the second conductive portion 412 and the drive backplate 100, the encapsulation layer 420 also applies a force to the second conductive portion 412 because the encapsulation layer 420 does not tend to bend or break, thereby reducing the risk of the second conductive portion 412 falling off due to the removal of the protective film 300.

[0112] In step S260, the second conductive part 412 is laser etched to form the side trace 500.

[0113] In this embodiment, the encapsulation layer 420 and the second conductive portion 412 of the second region 120 can be laser-etched to form the side trace 500, and the number of side traces 500 can be multiple.

[0114] When laser etching is performed on the second conductive portion 412, both the second conductive portion 412 and the third conductive portion 413 can be laser etched to form the side trace 500. Specifically, the encapsulation layer 420, the second conductive portion 412, and the third conductive portion 413 can be laser etched to form the side trace 500 connecting the second region 120 of the first surface 210 and the second region 120 of the second surface 220.

[0115] Based on the above design, in the manufacturing method of the drive backplate provided in this embodiment, by providing an encapsulation layer 420 that covers at least the second conductive part 412 before removing the protective film 300, the second conductive part 412 can be protected during the film removal process. Since the protective film 300 covering the second conductive part 412 has relatively greater hardness, when the protective film 300 is removed, in addition to the adhesion between the second conductive part 412 and the drive backplate 100, the encapsulation layer 420 also applies a force to the second conductive part 412 because the encapsulation layer 420 does not tend to bend or break. This reduces the risk of the second conductive part 412 falling off due to the removal of the protective film 300 and improves the pass rate of the side wiring 500.

[0116] In one possible implementation, please refer to Figure 16 Step S240 may include the following sub-steps.

[0117] Step S241: Apply ink material that at least covers the second conductive portion 412 as the encapsulation layer 420.

[0118] Step S242: The encapsulation layer 420 is cured to cause cracks in the encapsulation layer 420 covering the junction of the protective film 300 and the second region 120.

[0119] In this embodiment, ink material can be used to encapsulate the second conductive part 412 and part of the first conductive part 411, and the encapsulation layer 420 can be cured. Due to the hard and brittle nature of the cured ink material, cracks are generated at the junction of the protective film 300 and the second region 120, causing the encapsulation layer 420 covering the protective film 300 and the encapsulation layer 420 covering the second region 120 to break apart, thereby reducing the impact on the tearing action of the protective film 300.

[0120] In one possible implementation, the drive backplane body 100 may include bonding contacts located in the second region 120. These bonding contacts may include a first bonding contact located on the first surface 210 and a second bonding contact located on the second surface 220. There may be multiple first and second bonding contacts. The orthographic projections of the first and second bonding contacts on the drive backplane body 100 may completely coincide with the orthographic projections of the second bonding contacts on the drive backplane body 100, and the first bonding contacts on the first surface 210 and the second bonding contacts on the second surface 220 are arranged at equal intervals.

[0121] When laser etching is performed on the second conductive portion 412 and the third conductive portion 413, the second conductive portion 412 and the third conductive portion 413 can be removed by laser etching, forming a side trace 500 extending from the first surface 210 to the second surface 220 and connecting the first bonding contact and the second bonding contact. Specifically, there can be multiple side traces 500, and one side trace 500 can connect one first bonding contact on the first surface 210 and one second bonding contact on the second surface 220.

[0122] This application also provides a driving backplane, please refer to... Figure 17 The drive backplane may include a drive backplane body 100, side traces 500, and a packaging unit 430.

[0123] The drive backplate body 100 may include a first surface 210, a second surface 220 disposed opposite to the first surface 210, and a side surface 230 connecting the first surface 210 and the second surface 220.

[0124] At least two side traces 500 extend from the first surface 210 through the side surface 230 to the second surface 220, with a gap between adjacent side traces 500. Specifically, the side traces 500 may be located on only one side of the drive backplate body 100, or on both sides of the drive backplate body 100, without specific limitation here.

[0125] The encapsulation unit 430 at least covers the side traces 500 located on the first surface 210 and the second surface 220, and the encapsulation unit 430 does not contact the drive backplane body 100.

[0126] Optionally, the driving backplane provided in this embodiment can be manufactured by the driving backplane manufacturing method described above in this embodiment. Based on this, since the encapsulation unit 430 and the side trace 500 are formed by etching after the encapsulation layer 420 is formed, the encapsulation layer 420 that directly covers the driving backplane body 100 is removed in the laser etching. The remaining encapsulation unit 430 can only cover the side trace 500 located on the first surface 210 and the second surface 220, without directly contacting the driving backplane body 100.

[0127] In one possible implementation, the material of the encapsulation unit 430 may include ink or epoxy resin.

[0128] In one possible implementation, the drive backplane body 100 may include a first bonding contact located on the first surface 210 and a second bonding contact located on the second surface 220, and the side trace 500 may extend from the first surface 210 to the second surface 220 and connect the first bonding contact and the second bonding contact.

[0129] In one possible implementation, please refer to Figure 18 The packaging unit 430 can cover the side traces 500 located on the first surface 210, the second surface 220 and the side surface 230.

[0130] Specifically, the packaging unit 430 can completely cover the side trace 500.

[0131] This application embodiment also provides a display panel, the display panel including a driving backplate manufactured by the above-described driving backplate manufacturing method provided in this embodiment or the above-described driving backplate provided in this embodiment and at least one light-emitting device disposed on one side of the driving backplate.

[0132] This application embodiment also provides a splicing screen, which can be composed of the display panels provided in this embodiment spliced ​​together.

[0133] In summary, the embodiments of this application provide a method for manufacturing a driving backplane, a driving backplane, a display panel, and a splicing screen. The method involves first removing the protective film, then setting an encapsulation layer that at least covers the second conductive part, and then performing laser etching on the second conductive part. This can fix the debris generated during the film removal process, prevent short circuits caused by debris in the side wiring, and improve the pass rate of the side wiring.

[0134] Alternatively, an encapsulation layer can be first set to cover at least the second conductive part, then the protective film can be removed, and then the second conductive part can be laser etched. In this way, the second conductive part can be protected during the film removal process. Since the protective film covering the second conductive part has relatively greater hardness, when the protective film is removed, in addition to the adhesion between the second conductive part and the drive backplane, the encapsulation layer also applies a force to the second conductive part because the encapsulation layer does not tend to bend or break. This can reduce the risk of the second conductive part falling off due to the removal of the protective film and improve the pass rate of side wiring.

[0135] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0136] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing a drive backplane, characterized in that, The method includes: A drive backplate body is provided, the drive backplate body including a first region and a second region located at least one side of the first region; A protective film is provided that covers the first area and exposes the second area; A conductive layer is provided, the conductive layer including a first conductive portion covering the protective film and a second conductive portion covering the second region; Remove the protective film to peel off the first conductive part; A packaging layer is provided that at least covers the second conductive portion; The second conductive part is laser-etched to form a side trace.

2. A method for manufacturing a drive backplane, characterized in that, The method includes: A drive backplate body is provided, the drive backplate body including a first region and a second region located at least one side of the first region; A protective film is provided that covers the first area and exposes the second area; A conductive layer is provided, the conductive layer including a first conductive portion covering the protective film and a second conductive portion covering the second region; A packaging layer is provided that at least covers the second conductive portion; Remove the protective film to peel off the first conductive part; The second conductive part is laser-etched to form a side trace.

3. The method for manufacturing the drive backplane according to claim 2, characterized in that, The step of setting an encapsulation layer that at least covers the second conductive portion includes: The encapsulation layer is provided with an ink material that at least covers the second conductive portion. The encapsulation layer is cured to cause cracks in the encapsulation layer at the junction of the protective film and the second region.

4. The method for manufacturing the drive backplane according to claim 1 or 2, characterized in that, The drive backplate body includes a first surface, a second surface disposed opposite to the first surface, and a side surface connecting the first surface and the second surface; The step of setting a protective film that covers the first region and exposes the second region includes: A protective film is provided on the first surface and the second surface of the drive backplate body to cover the first area and expose the second area; The step of setting a conductive layer covering the protective film and the second region includes: A conductive layer is provided covering the protective film, the second region, and the side surface. The conductive layer includes a first conductive portion covering the protective film, a second conductive portion covering the second region, and a third conductive portion covering the side surface. The step of laser etching the second conductive portion includes: The second conductive portion and the third conductive portion are laser etched to form the side trace.

5. A drive backplane, characterized in that, The drive backplate includes: A drive backplate body, the drive backplate body including a first surface, a second surface disposed opposite to the first surface, and a side surface connecting the first surface and the second surface; At least two side traces extending from the first surface through the side to the second surface, with a gap between adjacent two side traces; The packaging unit covers at least the side traces located on the first surface and the second surface, and the packaging unit does not contact the drive backplane body.

6. The drive backplane according to claim 5, characterized in that, The packaging unit is made of ink or epoxy resin.

7. The drive backplane according to claim 5, characterized in that, The drive backplane body includes a first bonding contact located on the first surface and a second bonding contact located on the second surface, and the side trace extends from the first surface to the second surface and connects the first bonding contact and the second bonding contact.

8. The drive backplane according to claim 5, characterized in that, The packaging unit covers the side traces located on the first surface, the second surface, and the side surface.

9. A display panel, characterized in that, The display panel includes a driving backplate manufactured by the method of manufacturing a driving backplate according to any one of claims 1-4 or the driving backplate according to any one of claims 5-8 and at least one light-emitting device disposed on one side of the driving backplate.

10. A video wall, characterized in that, It is composed of the display panels described in claim 9.

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