A dry etching apparatus

Abstract

The application belongs to the technical field of dry etching and specifically discloses a dry etching device, which comprises a frame body, clamping ends fixedly connected to two ends of the frame body, an air extraction ring fixedly connected to the middle part of the frame body, a connecting pipe fixedly connected to the outer side of the frame body, a plug-in pipe sleeved with the lower end of the connecting pipe, an air extraction assembly fixedly connected to the lower end of the plug-in pipe, an air extraction pipe fixedly connected to the part of the frame body close to the clamping end, an inner cavity of the air extraction pipe being communicated with an inner cavity of the air extraction ring, an abutting ring embedded on the frame body, heat dissipation strips fixedly connected to the abutting ring, the heat dissipation strips being distributed in the inner part of the air extraction pipe, the bottom of one of the clamping ends being fixedly connected with an air extraction box, and a dust collection cavity being formed in the air extraction box. When the clamping end in the etching device is used to place the wafer body to be processed on the processing table in cooperation with the abutting ring, the connecting pipe can use the dust extraction pipe to extract the dust on the processing table into the inner part of the air extraction box, so that the wafer body to be processed can be prevented from contacting the dust on the processing table.

Description

Technical Field

[0001] This invention belongs to the field of dry etching technology, and specifically discloses a dry etching device. Background Technology

[0002] Dry etching is a semiconductor manufacturing technology that uses gas plasma to achieve precise material removal. Its core principle is to controllably etch the wafer surface in a vacuum environment through the synergistic effect of physical bombardment and chemical reaction. During the controllable etching of the wafer surface, the clamping disk (also known as the carrier disk or electrode) will move the wafer inside the reaction chamber, thereby completing the wafer loading and unloading operation.

[0003] Currently, the clamping disks used for wafers are usually clamping structures with rings at both ends. The lower part of the clamping structure is connected to a transport structure. When the transport structure drives the clamping structure to transport the etched wafer, the wafer to be etched will move synchronously to the fixed fixture, thereby realizing the dry etching process of the wafer to be etched.

[0004] However, while such clamping disks do provide good transport performance for wafers in practical use, they also have some shortcomings, such as:

[0005] The clamping disk does not have a good dust cleaning structure, and dust easily adheres to the clamping disk. This dust mainly comes from reaction byproducts in the etching process, particles from physical sputtering, and contaminants from previous processes. If it cannot be effectively controlled, it will cause defects in the wafer during etching, resulting in a decrease in the performance of the etched wafer.

[0006] To address this issue, we propose a dry etching apparatus to solve the problem of dust easily adhering to the wafer clamping pads. Summary of the Invention

[0007] In view of this, the object of the present invention is to provide a dry etching apparatus to solve the problems mentioned above.

[0008] To achieve the above objectives, the present invention provides a dry etching apparatus, comprising a frame and clamping ends fixedly connected to both ends of the frame. An air extraction ring is fixedly connected to the middle of the frame, and a connecting pipe is fixedly connected to the outer side of the frame. A insertion pipe is sleeved at the lower end of the connecting pipe, and an extraction assembly is fixedly connected to the lower end of the insertion pipe.

[0009] An air extraction pipe is fixedly connected to the part of the frame near the clamping end. The inner cavity of the air extraction pipe is connected to the inner cavity of the air extraction ring. An abutment ring is embedded in the frame. A heat dissipation strip is fixedly connected to the abutment ring. The heat dissipation strip is distributed inside the air extraction pipe. An air extraction box is fixedly connected to the bottom of one of the clamping ends. A dust collection chamber is opened on the air extraction box. A dust collection hole is opened on the dust collection chamber. A discharge funnel is fixedly connected to the dust collection hole. A suction pipe is fixedly connected between the discharge funnel and the connecting pipe.

[0010] In the above technical solution, a clamping block is further provided through the clamping end. The clamping end has a hollow structure. A pushing magnetic block is fixedly connected to one end of the clamping block inside the clamping end. A reset spring is connected between the pushing magnetic block and the clamping end. A strip electromagnet is fixedly connected to the inside of the clamping end and the part opposite to the pushing magnetic block. The clamping end has an open annular structure. The clamping end clamps the wafer body through the clamping block.

[0011] In the above technical solution, a gap is further provided between the abutment ring and the exhaust pipe, and a connecting mesh plate is fixedly connected to one end of the heat dissipation strip near the exhaust ring, and the connecting mesh plate is distributed inside the exhaust pipe.

[0012] In the above technical solution, the bottom surface of the suction ring is fixedly connected to a gas collecting hood, the lower end of the gas collecting hood is fixedly connected to a connecting pipe, and the inner cavity of the gas collecting hood is connected to the inner cavity of the suction ring and the connecting pipe.

[0013] In the above technical solution, a hydraulic cylinder is further connected between the connecting pipe and the insertion pipe, a heat dissipation mesh plate is fixedly connected to the outer wall and inner wall of the lower end of the insertion pipe, and a transmission plate is fixedly connected to the insertion pipe.

[0014] In the above technical solution, a transmission screw runs through the transmission plate, one end of the transmission screw is connected to a transmission motor, a support plate is rotatably connected to the transmission screw, and the support plate is fixedly connected to the collection pipe.

[0015] In the above technical solution, the extraction and drainage assembly further includes a collection pipe, a sliding cover is slidably inserted into the collection pipe, and a drainage structure is connected to one end of the collection pipe.

[0016] In the above technical solution, two plug-in pieces are fixedly connected to the middle of the inner cavity of the air extraction box, and a heat dissipation plate is inserted into the cavity formed by the two plug-in pieces. Heat dissipation fins are fixedly connected to the surface of the heat dissipation plate.

[0017] In the above technical solution, the top surface of the heat sink is fixedly connected to an abutment plate, which is fixedly connected to the clamping end, and the cavity formed by the two plug-in pieces is connected to the inner cavity of the discharge funnel.

[0018] In the above technical solution, a processing table is further provided below the frame, and the processing table includes a heat dissipation ring, the outer wall of which can abut against the gas collection hood.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] When the clamping end of the etching equipment, together with the abutment ring, places the wafer to be processed on the processing table, the connecting tube can use the dust suction tube to absorb the dust on the processing table into the inside of the vacuum box, which can prevent the wafer to be processed from coming into contact with the dust on the processing table.

[0021] 2. In this etching equipment, after the clamping end and the abutment ring place the wafer body to be processed on the processing table, the wafer body can be etched on the processing table. At this time, the outer wall of the gas collection shroud can abut against the heat dissipation ring, and the heat on the heat dissipation ring can be quickly dissipated through the gas collection shroud, which can prevent the heat on the wafer body from being quickly dissipated.

[0022] 3. After the wafer body in the etching equipment is processed on the processing table, the suction ring can remove the dust on the wafer body in advance. Then, when the clamping end and the abutment ring clamp the wafer body to be processed, the dust and heat on the wafer body can be removed again through the suction pipe, which can avoid the dust generated by the etching of the wafer body from affecting the subsequent processing of the wafer body.

[0023] 4. When the clamping end of the etching equipment clamps the wafer body, the dust generated during the etching of the wafer body will come into contact with the water flowing inside the collection tube. This can achieve water-liquid mixing and dust discharge, preventing the dust generated during the etching of the wafer body from evaporating in the air and facilitating the subsequent centralized treatment of the dust generated during the etching of the wafer body by subsequent staff. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the implementation state of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the present invention;

[0026] Figure 3 This is a schematic diagram showing the distribution of the clamping ring and the suction ring in this invention;

[0027] Figure 4 This is a schematic diagram showing the distribution of the transmission components and the collection pipe in this invention;

[0028] Figure 5 This is a diagram showing the connection structure between the abutment ring and the extraction pipe in this invention;

[0029] Figure 6 This is a diagram showing the connection structure between the abutment ring and the heat sink in this invention;

[0030] Figure 7 This is a diagram showing the connection structure between the clamping end and the vacuum box in this invention;

[0031] Figure 8 This is a schematic diagram showing the separation of the heat sink and the air extraction box in this invention;

[0032] Figure 9 This is a through-structure diagram of the clamping block and clamping end in this invention.

[0033] 1. Clamping end; 11. Clamping block; 12. Abutment ring; 13. Heat sink; 14. Connecting mesh plate; 15. Pushing magnet; 16. Return spring; 17. Bar electromagnet; 2. Wafer body; 3. Vacuum box; 31. Dust suction pipe; 32. Abutment plate; 33. Heat sink plate; 34. Insertion piece; 35. Discharge funnel; 36. Heat sink fins; 37. Dust collection hole; 38. Dust collection chamber; 4. Frame; 5. Vacuum ring; 6. Vacuum hood; 61. Vacuum pipe; 62. Connecting pipe; 63. Heat sink mesh plate; 64. Insertion pipe; 7. Hydraulic cylinder; 8. Processing table; 81. Heat sink ring; 9. Collection pipe; 91. Drainage structure; 92. Transmission plate; 93. Sliding cover; 94. Transmission motor; 95. Support plate; 10. Transmission screw. Detailed Implementation

[0034] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Numerous specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the invention is not limited to the specific embodiments disclosed below.

[0036] Existing etching equipment lacks a proper dust cleaning structure on the clamping plate, making it prone to dust accumulation. This dust primarily originates from reaction byproducts during the etching process, particles from physical sputtering, and contaminants from previous processes. If not effectively controlled, this can lead to defects in the wafer during etching, resulting in a decline in wafer performance. To address these issues, we propose the following structure.

[0037] Example 1: Please refer to Figure 1-6 As shown, the present invention provides a technical solution:

[0038] The present invention is a dry etching device, including a frame 4 and clamping ends 1 fixedly connected to both ends of the frame 4. A suction ring 5 is fixedly connected to the middle of the frame 4, and a connecting pipe 62 is fixedly connected to the outer side of the frame 4. A plug pipe 64 is sleeved at the lower end of the connecting pipe 62, and a suction and discharge assembly is fixedly connected to the lower end of the plug pipe 64.

[0039] The suction ring 5 is a hollow ring structure with multiple holes on its inner wall. In actual use, the suction ring 5 can collect external dust through the holes.

[0040] A suction pipe 61 is fixedly connected to the part of the frame 4 near the clamping end 1. The inner cavity of the suction pipe 61 is connected to the inner cavity of the suction ring 5. An abutment ring 12 is embedded in the frame 4. A heat dissipation strip 13 is fixedly connected to the abutment ring 12. The heat dissipation strip 13 is distributed inside the suction pipe 61. A suction box 3 is fixedly connected to the bottom of one of the clamping ends 1. A dust collection chamber 38 is opened on the suction box 3. A dust collection hole 37 is opened on the dust collection chamber 38. A discharge funnel 35 is fixedly connected to the dust collection hole 37. A suction pipe 31 is fixedly connected between the discharge funnel 35 and the connecting pipe 62.

[0041] Since both ends of the frame 4 are provided with clamping ends 1, and the bottom of one of the clamping ends 1 is fixedly connected to the vacuum box 3, in actual use, the clamping end 1 connected to the vacuum box 3 is used to transport the wafer body to be etched, while the clamping end 1 not connected to the vacuum box 3 is used to transport the etched wafer body 2. This allows the frame 4 to move the clamping end 1 once, and the frame 4 can simultaneously transport the two wafer bodies 2 by moving the clamping ends 1 at both ends.

[0042] Example 2: Please refer to Figure 1-9 As shown, based on Embodiment 1, the present invention provides a technical solution. Unlike Embodiment 1, the exhaust pipe 61 and exhaust ring 5 in this embodiment can dissipate the heat and dust generated during the processing of the wafer body 2 to the inside of the collection pipe 9, which can avoid excessive dust and heat affecting the subsequent processing of the wafer body 2.

[0043] A clamping block 11 passes through the clamping end 1. The clamping end 1 has a hollow structure. A pushing magnetic block 15 is fixedly connected to one end of the clamping block 11 inside the clamping end 1. A reset spring 16 is connected between the pushing magnetic block 15 and the clamping end 1. A strip electromagnet 17 is fixedly connected to the part of the clamping end 1 opposite to the pushing magnetic block 15. The clamping end 1 has an open annular structure. The clamping end 1 clamps the wafer body 2 through the clamping block 11.

[0044] Multiple clamping blocks 11 are distributed, and there is a gap between every two clamping blocks 11. The clamping blocks 11 can be made of high-temperature resistant materials available on the market. In actual use, the clamping end 1 clamps the wafer body 2 through the clamping blocks 11, which can prevent the heat on the wafer body 2 from being directly transferred to the clamping end 1, and at the same time, the heat on the wafer body 2 can be dissipated through the gap between two adjacent clamping blocks 11.

[0045] The magnetic poles of the bar electromagnet 17 and the push magnet 15 repel each other. When the clamping block 11 needs to clamp the wafer body 2, the bar electromagnet 17 works. At this time, the repulsive force generated by the bar electromagnet 17 on the push magnet 15 will drive the clamping block 11 to clamp the wafer body 2. At the same time, the reset spring 16 stores energy. When the bar electromagnet 17 does not work, the repulsive force generated by the reset spring 16 will drive the clamping block 11 to reset, thereby realizing the separation of the wafer body 2 from the clamping end 1.

[0046] A gap is provided between the abutment ring 12 and the exhaust pipe 61. A connecting mesh plate 14 is fixedly connected to one end of the heat sink 13 near the exhaust ring 5. The connecting mesh plate 14 is distributed inside the exhaust pipe 61.

[0047] The connecting mesh 14 can support the heat sink 13. When the external airflow enters the interior of the suction ring 5 through the gap between the abutment ring 12 and the suction pipe 61, the heat sink 13 will drive the heat on the abutment ring 12 to dissipate quickly, which can realize the rapid dissipation of the heat generated during the etching of the wafer body 2.

[0048] A gas collecting hood 6 is fixedly connected to the bottom surface of the suction ring 5, and a connecting pipe 62 is fixedly connected to the lower end of the gas collecting hood 6. The inner cavity of the gas collecting hood 6 is connected to the inner cavity of the suction ring 5 and the connecting pipe 62.

[0049] The dust sucked up by the suction ring 5 will enter the interior of the connecting tube 62 through the gas collection hood 6, which can prevent a lot of dust from accumulating on the wafer body 2.

[0050] A hydraulic cylinder 7 is connected between the connecting pipe 62 and the insertion pipe 64. A heat dissipation mesh plate 63 is fixedly connected to the outer and inner walls of the lower end of the insertion pipe 64. A transmission plate 92 is fixedly connected to the insertion pipe 64.

[0051] The hydraulic cylinder 7 can drive the connecting pipe 62 to slide on the insertion pipe 64, which can realize the adjustment of the working height of the vacuum ring 5.

[0052] A transmission screw 10 passes through the transmission plate 92. One end of the transmission screw 10 is connected to a transmission motor 94. A support plate 95 is rotatably connected to the transmission screw 10. The support plate 95 and the collection pipe 9 are fixedly connected.

[0053] The pumping assembly includes a collection pipe 9, a sliding cover 93 is slidably inserted into the collection pipe 9, and a drainage structure 91 is connected to one end of the collection pipe 9.

[0054] In actual use, water will be continuously injected into the inside of the collection tube 9. Since the collection tube 9 is connected to the drainage structure 91, when the drainage structure 91 is working, the water inside the collection tube 9 will be quickly discharged from the inside of the collection tube 9. At the same time, the inside of the collection tube 9 is under negative pressure. The airflow inside the insertion tube 64 will drive the dust generated during the etching of the wafer body 2 to flow into the inside of the collection tube 9.

[0055] The collection pipe 9 is connected to an external water pump, which can transport water to the inside of the collection pipe 9. The drainage structure 91 can adopt a common propeller structure. In this document, its function is to quickly discharge the water inside the collection pipe 9. An external motor is connected to the drainage structure 91, which can drive the drainage structure 91 to work.

[0056] A slot is provided on the collection pipe 9 near the sliding cover 93. The sliding cover 93 can block the slot of the collection pipe 9. The insertion pipe 64 can discharge the dust collected by the gas collection hood 6 into the inside of the collection pipe 9 through the slot.

[0057] When the drive motor 94 drives the drive screw 10 to rotate on the support plate 95, the drive screw 10 can drive the sliding cover 93 to slide on the collection tube 9 through the drive plate 92, thereby realizing the position movement of the clamping end 1 and the wafer body 2. In actual use, the gap between the sliding cover 93 and the collection tube 9 can be sealed with a rubber ring to prevent external air from entering the interior of the collection tube 9 through the gap between the sliding cover 93 and the collection tube 9.

[0058] Two plug-in pieces 34 are fixedly connected to the middle of the inner cavity of the air extraction box 3. A heat sink 33 is inserted into the cavity formed by the two plug-in pieces 34. Heat sink fins 36 are fixedly connected to the surface of the heat sink 33.

[0059] A contact plate 32 is fixedly connected to the top surface of the heat sink 33. The contact plate 32 is fixedly connected to the clamping end 1. The insert plate 34 is a mesh structure. The cavity formed by the two insert plates 34 is connected to the inner cavity of the discharge funnel 35. When the air inside the discharge funnel 35 carries the dust into the dust suction pipe 31, the insert plate 34 will filter the dust. At the same time, the air inside the suction box 3 that filters the dust will contact the heat sink 33. This allows the heat on the clamping end 1 to be discharged through the cavity formed by the two insert plates 34, avoiding the residual heat transferred from the wafer structure 2 at the clamping end 1.

[0060] Example 3: Please refer to Figure 1-3As shown, based on Embodiment 1, the present invention provides a technical solution. Unlike Embodiment 1, the outer wall of the heat dissipation ring 81 in this embodiment can abut against the gas collection shroud 6, which can enable the heat dissipation ring 81 to quickly dissipate the heat on the processing table 8, and avoid the presence of heat generated during the etching of the wafer body 2 on the processing table 8.

[0061] The abutment plate 32 can quickly transfer the heat on the clamping end 1 to the heat sink 33, while the heat sink fins 36 can quickly dissipate the heat on the heat sink 33 into the interior of the plug-in piece 34.

[0062] A processing table 8 is distributed below the frame 4. The processing table 8 includes a heat dissipation ring 81. The outer wall of the heat dissipation ring 81 can abut against the air collection shroud 6.

[0063] When the air inside the gas collecting hood 6 quickly enters the inside of the collecting pipe 9 through the connecting pipe 62 and the insertion pipe 64, the temperature on the gas collecting hood 6 will drop rapidly. Since the outer wall of the heat dissipation ring 81 can abut against the gas collecting hood 6, the heat dissipation ring 81 can drive the heat on the processing table 8 to dissipate rapidly.

[0064] Working principle: In actual use, the clamping end 1 connected to the vacuum box 3 can move the wafer body 2 to be etched onto the processing stage 8. Before the clamping end 1 places the wafer body 2 onto the processing stage 8, the vacuum box 3 will be close to the clamping part of the processing stage 8. At this time, the drainage structure 91 will work. Since the external water pump will continuously inject water into the inside of the collection tube 9, and the drainage structure 91 is connected to the collection tube 9, when the drainage structure 91 is working, the water inside the collection tube 9 will quickly flow out from the inside of the collection tube 9. The dust generated during the etching of the wafer body 2 is discharged, and the inside of the collection tube 9 is under negative pressure. The airflow inside the insertion tube 64 will drive the dust generated during the etching of the wafer body 2 into the collection tube 9. At the same time, the inside of the connecting tube 62 and the dust suction tube 31 is also under negative pressure. At this time, the dust in the clamping part of the processing table 8 will enter the inside of the suction box 3 through the dust collection hole 37. Finally, the dust inside the suction box 3 will pass through the discharge funnel 35 and the dust suction tube 31 into the inside of the connecting tube 62, which can prevent the wafer body 2 to be etched from contacting the dust on the processing table 8.

[0065] When the wafer body 2 is fixed on the processing table 8, the drive motor 94 drives the drive plate 92 to reset through the drive screw 10. At this time, the suction ring 5 will be distributed directly above the processing table 8. Then, the hydraulic cylinder 7 drives the suction ring 5 to move down through the connecting pipe 62. During this process, since the external water pump will continuously supply water to the inside of the collection pipe 9, the drainage structure 91 will not work, and the water inside the collection pipe 9 will continue to be discharged. At the same time, the gas collection hood 6 will abut against the heat dissipation ring 81. The heat generated during the etching of the wafer body 2 will be transferred to the gas collection hood 6 through the heat dissipation ring 81. The water flowing inside the collection pipe 9 will carry away the heat transferred by the connecting pipe 62 on the insertion pipe 64 through the heat dissipation mesh plate 63. This can achieve the rapid dissipation of heat on the heat dissipation ring 81 through the heat dissipation mesh plate 63, thereby avoiding a lot of heat from concentrating on the processing table 8.

[0066] After the wafer body 2 is processed on the processing table 8, the drainage structure 91 drives the water inside the collection pipe 9 to be discharged at high speed. At this time, the inside of the insertion pipe 64, the connecting pipe 62 and the suction ring 5 is under negative pressure. The dust generated during the etching of the wafer body 2 will be sucked into the inside of the suction ring 5. Then the transmission screw 10 drives the transmission plate 92 to move towards the drainage structure 91. The clamping end 1 of the part not connected to the suction box 3 will fall above the etched wafer body 2. Then the output end of the hydraulic cylinder 7 will drive the clamping end 1 to move down through the connecting pipe 62. This can achieve the clamping end 1 of the part not connected to the suction box 3 to clamp the etched wafer body 2. At the same time, the clamping end 1 of the part connected to the suction box 3 will also clamp the wafer body 2 to be etched.

[0067] When the wafer body 2 is clamped on the clamping end 1, due to the gap between the abutment ring 12 and the exhaust pipe 61, the dust and heat on the wafer body 2 will enter the interior of the exhaust pipe 61 through the gap between the abutment ring 12 and the exhaust pipe 61. This allows the dust and heat on the wafer body 2 to dissipate quickly, which facilitates the rapid processing of the wafer body 2. During this process, the gas collection shroud 6 no longer contacts the heat dissipation ring 81. As the drainage structure 91 continuously drives the water inside the collection pipe 9 to be discharged at high speed, the exhaust ring 5 will also continuously drive the dust and air above the processing table 8 into the interior of the gas collection shroud 6. At this time, a high-speed airflow will continuously pass through the interior of the gas collection shroud 6, which will allow the heat on the gas collection shroud 6 to diffuse into the interior of the high-speed airflow.

[0068] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A dry etching apparatus, comprising a frame (4) and clamping ends (1) fixedly connected to both ends of the frame (4), characterized in that: A suction ring (5) is fixedly connected to the middle of the frame (4), and a connecting pipe (62) is fixedly connected to the outer side of the frame (4). A plug pipe (64) is sleeved on the lower end of the connecting pipe (62), and a suction assembly is fixedly connected to the lower end of the plug pipe (64). A suction pipe (61) is fixedly connected to the part of the frame (4) near the clamping end (1). The inner cavity of the suction pipe (61) is connected to the inner cavity of the suction ring (5). An abutment ring (12) is embedded in the frame (4). A heat dissipation strip (13) is fixedly connected to the abutment ring (12). The heat dissipation strip (13) is distributed inside the suction pipe (61). A suction box (3) is fixedly connected to the bottom of one of the clamping ends (1). A dust collection chamber (38) is opened on the suction box (3). A dust collection hole (37) is opened on the dust collection chamber (38). A discharge funnel (35) is fixedly connected to the dust collection hole (37). A suction pipe (31) is fixedly connected between the discharge funnel (35) and the connecting pipe (62). A gas collecting hood (6) is fixedly connected to the bottom surface of the gas collecting ring (5), and a connecting pipe (62) is fixedly connected to the lower end of the gas collecting hood (6). The inner cavity of the gas collecting hood (6) is connected to the inner cavity of the gas collecting ring (5) and the connecting pipe (62). A hydraulic cylinder (7) is connected between the connecting pipe (62) and the insertion pipe (64). A heat dissipation mesh plate (63) is fixedly connected to the outer and inner walls of the lower end of the insertion pipe (64). A transmission plate (92) is fixedly connected to the insertion pipe (64). A transmission screw (10) passes through the transmission plate (92). A transmission motor (94) is connected to one end of the transmission screw (10). A support plate (95) is rotatably connected to the transmission screw (10). The support plate (95) is fixedly connected to the collection pipe (9). The extraction and drainage assembly includes a collection pipe (9). A sliding cover (93) is slidably inserted into the collection pipe (9). A drainage structure (91) is connected to one end of the collection pipe (9).

2. The dry etching equipment according to claim 1, characterized in that, A clamping block (11) runs through the clamping end (1). The clamping end (1) is a hollow structure. A pushing magnetic block (15) is fixedly connected to one end of the clamping block (11) inside the clamping end (1). A reset spring (16) is connected between the pushing magnetic block (15) and the clamping end (1). A bar electromagnet (17) is fixedly connected to the part of the clamping end (1) opposite to the pushing magnetic block (15). The clamping end (1) is an open annular structure. The clamping end (1) clamps the wafer body (2) through the clamping block (11).

3. The dry etching equipment according to claim 1, characterized in that, A gap is provided between the abutment ring (12) and the exhaust pipe (61). A connecting mesh plate (14) is fixedly connected to one end of the heat dissipation strip (13) near the exhaust ring (5). The connecting mesh plate (14) is distributed inside the exhaust pipe (61).

4. The dry etching equipment according to claim 1, characterized in that, Two plug-in pieces (34) are fixedly connected to the middle of the inner cavity of the air extraction box (3). A heat sink plate (33) is inserted into the cavity formed by the two plug-in pieces (34). Heat sink fins (36) are fixedly connected to the surface of the heat sink plate (33).

5. The dry etching apparatus according to claim 4, characterized in that, The top surface of the heat sink (33) is fixedly connected to an abutment plate (32), which is fixedly connected to the clamping end (1). The cavity formed by the two plug-in pieces (34) is connected to the inner cavity of the discharge funnel (35).

6. The dry etching apparatus according to claim 1, characterized in that, A processing table (8) is distributed below the frame (4). The processing table (8) includes a heat dissipation ring (81). The outer wall of the heat dissipation ring (81) can abut against the gas collection hood (6).

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