Wafer clamping and overturning mechanism and control method thereof

Abstract

The invention discloses a wafer clamping and overturning mechanism and a control method thereof, and relates to the technical field of wafer clamps, the wafer clamping and overturning mechanism comprises an operation part, a mounting part, a positioning part and a driving part for driving the positioning part to move, the positioning part is provided with a clamping hole, the clamping hole is provided with a clamping part, and the positioning part is arranged in a mounting hole of the mounting part; in the clamping stage, the positioning piece moves to the clamping position, the positioning piece is partially exposed out of the outer contour of the mounting piece to enable the positioning piece to sleeve the wafer, and the clamping piece acts to clamp the wafer; in the overturning stage, the positioning piece is overturned to enable the wafer to be overturned; and in the discharging stage, at least part of the positioning piece is exposed out of the outer contour of the mounting piece, so that the clamping hole is matched with the placement position of the wafer, and the clamping piece acts to release the wafer. The invention provides a wafer clamping and overturning mechanism and a control method thereof, and aims to solve the technical problems that an existing wafer clamping and overturning mechanism is poor in adaptability to a containing space where a wafer is located, and the wafer deflects due to insufficient positioning precision in the clamping and overturning process.

Description

Technical Field

[0001] This application belongs to the field of wafer clamping technology, specifically relating to a wafer clamping and flipping mechanism and its control method. Background Technology

[0002] In existing technologies, wafers need to be flipped during wafer processing. For example, when cleaning a wafer, both sides of the wafer need to be cleaned. In photolithography, etching, and other processes, both sides of the wafer need to be processed by flipping the wafer. At the same time, wafers are often flipped in the wafer inspection and packaging stages to allow for comprehensive inspection and processing of both sides, ensuring product quality and performance.

[0003] A wafer flipping clamping device is provided, comprising a handle, a pair of clamping arms, a clamping and pushing mechanism, and a flipping mechanism. The clamping and pushing mechanism includes a rotating support plate and a central spindle. Both the clamping arms and the rotating support plate are provided with wafer adsorption slots. The flipping clamping device includes a central spindle and two secondary spindles respectively hinged to the tails of the two clamping arms. One end of the two secondary spindles is hinged to the central spindle. The central spindle is threadedly connected to the rotating support plate. The spindle is controlled to move up or down by a motor, thereby bringing the two clamping arms closer or further apart. The spindle moves down to control the two clamping arms to move further apart and open to their maximum and limit positions. When clamping a wafer, the spindle is controlled to move up to bring the clamping arms closer together and bring the three wafer adsorption slots closer to the wafer. By venting air into the wafer adsorption slots, the wafer is adsorbed into the slots, achieving wafer clamping. Then, by controlling a side rotary motor to drive the wafer clamping arms and the wafer to rotate, the wafer is flipped. This device requires sufficient space in three directions on the horizontal plane where the wafer is located to allow the clamping arms to move smoothly. Therefore, it is difficult to adapt to processing scenarios with tight spaces, such as inside small wafer processing equipment, multi-process integrated production lines, or working environments with complex auxiliary components. Often, the space on the horizontal plane where the wafer is located is insufficient, causing the clamping arms to be unable to open and close smoothly. At the same time, the existing device cannot guarantee precise alignment between the wafer slot and the wafer, which may lead to clamping misalignment. The device relies on the suction slots of the two clamping arms to approach the wafer and fix it with suction force. If there is a deviation in the initial position, one of the wafer slots may contact the wafer first, causing the wafer to move and deflect, making it impossible to clamp the wafer smoothly. This requires frequent adjustments to the position of the clamping device, resulting in low clamping efficiency. Summary of the Invention

[0004] This application provides a wafer clamping and flipping mechanism and its control method to solve the technical problems of poor adaptability of existing wafer clamping and flipping mechanisms to the wafer's accommodating space and wafer deflection caused by insufficient positioning accuracy during clamping and flipping.

[0005] The primary objective of this application is to provide a wafer clamping and flipping mechanism, the technical solution of which is as follows: A wafer clamping and flipping mechanism includes an operating part and a clamping part connected to the operating part; The clamping part includes a mounting component, a driving component, and a positioning component. The positioning component has a clamping hole, and multiple clamping components for clamping the wafer are provided in the clamping hole. The multiple clamping components are arranged sequentially at intervals along the circumference of the clamping hole. The mounting component has a mounting hole, and the positioning component is disposed in the mounting hole and can move along the axis of the mounting hole. The driving component is used to drive the positioning component to move. The positioning element has working states for picking up and placing wafers, including: During the clamping phase, the positioning element moves to the clamping position, and the positioning element at least partially exposes the outer contour of the mounting element, so that the positioning element fits the wafer, and multiple clamping elements move to clamp the wafer. During the flipping stage, multiple clamping elements hold the wafer, and flipping positioning elements flip the wafer to make it flip over; During the unloading stage, the positioning components move, at least partially exposing the outer contour of the mounting components, so that the clamping holes match the placement position of the wafer, and multiple clamping components move to release the wafer.

[0006] The wafer clamping and flipping mechanism in the first objective of this application also includes the following additional technical features: The positioning element can rotate relative to the mounting element. The wafer clamping and flipping mechanism also includes a rotating element for driving the positioning element to rotate. The rotating element is disposed in the mounting hole and can move along the axis of the mounting hole. The driving element drives the positioning element to move through the rotating element. During the flipping stage, the positioning element moves to the flipping position, and the rotating element drives the positioning element to rotate about a radial axis perpendicular to the axis of the mounting hole, so as to flip the wafer.

[0007] There are two rotating parts, and the wall of the mounting hole has two oppositely arranged guide channels. The rotating parts and the guide channels are arranged in a one-to-one correspondence, and the rotating parts can move along the guide channels. The positioning part is connected to the two rotating parts, and the guide channels extend along the axis of the mounting hole.

[0008] The drive component is equipped with a telescopic rod, which is connected to the rotating component. The telescopic rod drives the rotating component to move along the guide channel.

[0009] The wafer clamping and flipping mechanism also includes a support for placing the wafer. The support has a support platform that matches the contour of the wafer, and a positioning groove that matches the contour of the positioning member along the circumference of the support platform. During the clamping stage and the unloading stage, the end of the positioning member engages with the positioning groove.

[0010] The clamping hole has a positioning groove on its wall. The clamping component includes a power component disposed in the positioning groove and a gripper that is telescopically disposed in the power component. When the gripper extends under the drive of the power component, it can abut against the outer contour of the wafer to achieve clamping. When it retracts, it releases the clamping of the wafer.

[0011] The grippers are equipped with gripping ends that are adapted to the outer contour of the wafer. The gripping ends are equipped with elastic buffers. When the grippers abut against the wafer, the elastic buffers can make flexible contact with the edge of the wafer.

[0012] The second objective of this application is to provide a control method for a wafer clamping and flipping mechanism, applied to the wafer clamping and flipping mechanism described in the first objective, the control method comprising: During the clamping stage, the position information of the wafer and the clamping part is acquired, and the position of the operating part is adjusted according to the position information of the wafer and the clamping part to align the wafer with the center of the clamping hole. The driving component is controlled to drive the positioning component to move relative to the mounting component so that the positioning component can fit the wafer. After the positioning component fits the wafer, the clamping component is controlled to apply a corresponding clamping force to clamp the wafer. During the flipping stage, after the clamping component holds the wafer, the distance information between the positioning component and the wafer is obtained. Based on the distance information, the positioning component is controlled to move to the flipping position, and the positioning component is flipped after it reaches the flipping position. During the unloading stage, the position information of the placement position and the positioning component is obtained. Based on the position information of the placement position and the positioning component, the wafer is controlled to align with the placement position. The positioning component is controlled to move so that the clamping hole matches the placement position. The clamping component is controlled to release the wafer.

[0013] The wafer flipping mechanism in the second objective of this application also includes: The positioning element is rotatably mounted relative to the mounting element. The wafer clamping and flipping mechanism also includes a rotating element that can drive the positioning element to rotate. The rotating element is moved along the axis of the mounting hole and is mounted in the mounting hole. The driving element drives the positioning element to move through the rotating element. During the flipping stage, the positioning element moves to the flipping position, and the rotating element can drive the positioning element to rotate so that the wafer is flipped. Controlling the positioning element to move to the flipping position according to distance information includes: The flipping position information is determined based on the placement location and the position information of the positioning component; The movement information of the rotating component and the prompt information of the operating unit are determined based on the information of the flip position; Control the movement of rotating components based on movement information; Adjust the position of the control unit according to the prompts.

[0014] The information used to determine the flipping position based on the placement location and the position information of the positioning component includes: Obtain the dimensional parameters of the wafer and the structural parameters of the positioning component; determine the rotation axis of the positioning component based on the structural parameters, and determine the rotation radius of the positioning component after clamping the wafer based on the rotation axis and the dimensional parameters; Based on the placement location, the position information of the positioning component, and the rotation radius, a safe area is determined in which the positioning component will not interfere with the placement surface of the wafer during rotation. The position within the safe area that meets the rotation radius requirement is the information of the flip position.

[0015] Due to the adoption of the above technical solution, the beneficial effects achieved by this application are as follows: 1. This application utilizes a positioning element positioned within a mounting hole and moving along its axis. The mounting hole guides the movement of the positioning element, thereby improving its accuracy. Simultaneously, during the clamping phase, moving the positioning element exposes the outer contour of the mounting component, allowing for rapid wafer placement using the exposed portion. Throughout the clamping process, the wafer clamping and flipping mechanism does not require expanding the clamping space circumferentially around the wafer. Instead, it fully utilizes the unused space above the wafer, completing clamping and initial positioning solely through the vertical movement of the positioning element above the wafer. This significantly reduces the wafer clamping and flipping mechanism's circumferential space requirements, making it particularly suitable for applications with compact internal spaces and densely packed components in wafer processing equipment. Furthermore, by using the positioning element to position the wafer, the contour of the clamping hole enables initial positioning of the wafer. The wafer is positioned within the clamping hole, providing margin for error during operation. The clamping elements, arranged circumferentially along the clamping hole, apply balanced constraint forces to the wafer from multiple directions, correcting any offset during the positioning process and ensuring precise alignment between the wafer and the center of the clamping hole. During the wafer flipping stage, there is no need to disassemble or transfer the wafer; simply flipping the positioning element flips the wafer, eliminating the wafer transfer and repositioning steps required in traditional mechanisms and significantly improving wafer flipping efficiency. Moreover, since the entire flipping action is completed above the wafer placement position, there is no need to extend the flipping space below or circumferentially, further reducing the circumferential space requirements for the wafer placement position and greatly enhancing the applicability and compatibility of the wafer clamping and flipping mechanism in different equipment environments. During the unloading stage, the positioning component moves to expose the outer contour of the mounting component. The clamping hole matches the wafer placement position to achieve wafer positioning. Then, the wafer is released through the action of multiple clamping components, so that the wafer can be accurately placed in the placement position, improving the wafer placement accuracy.

[0016] 2. As a preferred embodiment of this application, by setting the positioning member to move to the flipping position along the axis of the mounting hole, sufficient operating space is reserved so that the rotating member drives the positioning member to rotate around the radial axis perpendicular to the axis of the mounting hole, preventing the wafer from colliding and interfering with the mounting member during the flipping process, and improving the operational flexibility of the wafer clamping and flipping mechanism in a small space.

[0017] 3. In a preferred embodiment of this application, by setting two rotating components to move synchronously along a guide channel positioned opposite each other on the wall of the mounting hole, symmetrical support and drive are provided for the positioning component, preventing tilting or jamming and ensuring smooth linear movement along the axis of the mounting hole, significantly improving movement accuracy. By setting the guide channel to extend along the axis of the mounting hole, precise movement trajectory constraints are provided for the rotating components, making the movement direction of the rotating components parallel to the axis of the mounting hole, preventing the rotating components from deviating from their movement. When the positioning component reaches the flipping position, the axis of the positioning component coincides with the radial and circumferential directions of the mounting hole, ensuring the positional accuracy after the wafer is flipped.

[0018] 4. As a preferred embodiment of this application, by providing a telescopic rod, the telescopic rod can provide a continuous and stable driving force, which can directly overcome the gravity of the positioning component and the wafer, as well as the friction during the movement, ensuring stable movement even under loads such as clamping. The telescopic rod has a compact structure, and its telescopic movement can be perfectly matched with the extension direction of the guide channel, without requiring additional lateral space.

[0019] Furthermore, by setting the positioning groove of the support component to match the contour of the positioning component, a concave-convex mechanical positioning constraint is formed during the clamping and unloading stages, further improving the placement accuracy of the positioning component. The positioning component can accurately fit the wafer, ensuring that the clamping hole is precisely aligned with the wafer center. The clamping component can apply a balanced clamping force to the concentric wafer from multiple directions, ensuring that the wafer's posture is stable and without deviation during clamping. The further cooperation between the positioning component and the positioning groove ensures precise alignment between the clamping hole and the support platform. When the clamping component releases the wafer, the wafer can fall smoothly into the support platform in a preset posture, avoiding wafer collisions or misalignment caused by unloading position deviations, thus improving the reliability and consistency of accuracy throughout the entire wafer handling process.

[0020] 5. As a preferred embodiment of this application, by setting a positioning groove to provide built-in installation space for the power component, the clamping component is embedded in the wall of the clamping hole, avoiding the clamping claw from protruding from the hole wall when it retracts, and ensuring that there is no additional protrusion interference between the hole wall and the wafer when the positioning component is set up. This not only expands the fault tolerance space during setting up, but also provides a smooth channel for the wafer to enter the clamping hole.

[0021] Furthermore, by adapting the clamping ends to the outer contour of the wafer, the contact area between the clamps and the wafer is increased. Combined with the micro-deformation capability of the elastic buffer, this not only accommodates the minute dimensional tolerances that may exist at the wafer edge, but also disperses the clamping force by increasing the contact area, avoiding excessive local stress. At the same time, the friction of the elastic material can reduce the risk of wafer slippage during clamping and flipping.

[0022] 6. In the control method of this application, by first acquiring the position information of the wafer and the clamping part during the clamping stage, and then adjusting the operating part to align their centers, it is possible to ensure that the clamping force of the clamping component on the wafer is evenly distributed, avoiding excessive local force due to positional deviation. Simultaneously, applying clamping force after the positioning component is placed on the wafer further ensures the stability of the clamping process, preventing the wafer from slipping or misaligning in the initial clamping stage, laying a precise initial foundation for the subsequent flipping and unloading stages, and improving the reliability of the wafer clamping process. During the flipping stage, by first acquiring the distance information between the positioning component and the wafer placement position, and then controlling the positioning component to move to the flipping position, and then performing the flipping action after the positioning component reaches the designated position, it is possible to ensure that the movement trajectory of the flipping process is controllable, reducing the impact of the flipping action on the connection stability between the wafer and the positioning component, further ensuring the structural integrity of the wafer during the flipping stage, and improving the consistency of the flipping operation. During the unloading stage, precise alignment of the wafer with the placement position can be achieved by acquiring the position information of the placement position and the positioning component. At the same time, controlling the movement of the positioning component to align the clamping hole with the placement position before releasing the wafer allows the wafer to land smoothly, reducing the impact when the wafer contacts the placement surface and preventing surface scratches or performance damage. In addition, precise unloading positioning provides a standard initial position for subsequent processes, avoiding rework in subsequent processes due to unloading deviations, ensuring the continuity and efficiency of the entire production process, and indirectly improving overall production efficiency. Attached Figure Description The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a front view of a wafer clamping and flipping mechanism according to one embodiment of this application; Figure 2 This is a bottom view of a wafer clamping and flipping mechanism according to one embodiment of this application; Figure 3 This is a schematic diagram of the installation of the positioning member and the support member according to one embodiment of this application; Figure 4 for Figure 3 Enlarged view of part A in the middle; Figure 5 This is a schematic diagram of the installation of the driving component according to one embodiment of this application; Figure 6 for Figure 5 Enlarged view of part B in the middle; Figure 7 This is a flowchart illustrating a control method for a wafer clamping and flipping mechanism according to one embodiment of this application.

[0023] List of components and reference numerals: 1. Operations Department; 2. Clamping part; 21. Mounting component; 211. Mounting hole; 212. Guide channel; 213. Guide groove; 214. Connecting plate; 215. Annular connector; 22. Driving component; 221. Telescopic rod; 222. Rotating cylinder; 223. First gear; 224. First bevel gear; 225. Transmission component; 226. Threaded rod; 23. Positioning component; 231. Clamping hole; 232. Clamping component; 2321. Power component; 2322. Gripper; 2323. Clamping end; 233. Positioning groove; 3. Rotating parts; 4. Support components; 41. Support platform; 42. Positioning groove. Detailed Implementation

[0024] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0025] Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of this application and the features thereof can be combined with each other.

[0026] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] like Figure 1 , Figure 2 , Figure 5 As shown, a wafer clamping and flipping mechanism includes an operation part 1 and a clamping part 2 connected to the operation part 1; The clamping part 2 includes a mounting member 21, a driving member 22, and a positioning member 23. The positioning member 23 is provided with a clamping hole 231, and a plurality of clamping members 232 for clamping the wafer are provided in the clamping hole 231. The plurality of clamping members 232 are arranged sequentially at intervals along the circumference of the clamping hole 231. The mounting member 21 is provided with a mounting hole 211, and the positioning member 23 is disposed in the mounting hole 211 and can move along the axis of the mounting hole 211. The driving member 22 is used to drive the positioning member 23 to move. Positioning element 23 has working states for picking up and placing wafers, including: During the clamping phase, the positioning member 23 moves to the clamping position, and the positioning member 23 at least partially exposes the outer contour of the mounting member 21, so that the positioning member 23 fits the wafer, and the multiple clamping members 232 clamp the wafer. During the flipping stage, multiple clamping members 232 clamp the wafer, and the flipping positioning member 23 flips the wafer. During the unloading stage, the positioning member 23 moves, and at least part of the positioning member 23 exposes the outer contour of the mounting member 21, so that the clamping hole 231 matches the placement position of the wafer, and multiple clamping members 232 move to release the wafer.

[0028] This application utilizes a positioning element 23 positioned within and moving along the axis of the mounting hole 211. The mounting hole 211 guides the movement of the positioning element 23, thereby improving its movement accuracy. Simultaneously, during the clamping phase, moving the positioning element 23 exposes the outer contour of the mounting element 21, allowing for rapid wafer placement using the exposed portion of the positioning element 23. Throughout the clamping process, the wafer clamping and flipping mechanism does not require expanding the clamping space circumferentially around the wafer. Instead, it fully utilizes the unused space above the wafer, completing both clamping and initial positioning simply by moving the positioning element 23 vertically above the wafer. This significantly reduces the wafer clamping and flipping mechanism's circumferential space requirements, making it particularly suitable for applications with compact internal spaces and densely packed components in wafer processing equipment. Furthermore, by positioning the wafer with the positioning element 23, the contour of the clamping hole 231 enables initial positioning of the wafer. The wafer is positioned within the clamping hole 231, providing margin for error during operation. The clamping element 232, arranged circumferentially along the clamping hole 231, applies balanced constraint force to the wafer from multiple directions, correcting any offset during the positioning process and ensuring precise alignment between the wafer and the center of the clamping hole 231. During the wafer flipping stage, there is no need to disassemble or transfer the wafer; simply flipping the positioning element 23 directly flips the wafer, eliminating the wafer transfer and repositioning steps required in traditional mechanisms and significantly improving wafer flipping efficiency. Moreover, since the entire flipping action is completed in the space above the wafer placement position, there is no need to extend the flipping space below or circumferentially, further reducing the circumferential space requirements for the wafer placement position and greatly enhancing the applicability and compatibility of the wafer clamping and flipping mechanism in different equipment environments. During the unloading stage, the positioning component 23 moves to expose the outer contour of the mounting component 21, and the clamping hole 231 cooperates with the wafer placement position to achieve wafer positioning. Then, the wafer is released through the action of multiple clamping components 232, so that the wafer can be accurately placed in the placement position and improve the wafer placement accuracy.

[0029] In this application, the flipping configuration of the positioning element 23 can be any of the following embodiments: Implementation method one: such as Figure 1 , Figure 3 , Figure 4 , Figure 5 As shown, the positioning member 23 can rotate relative to the mounting member 21. The wafer clamping and flipping mechanism also includes a rotating member 3 for driving the positioning member 23 to rotate. The rotating member 3 is disposed in the mounting hole 211 and can move along the axis of the mounting hole 211. The driving member 22 drives the positioning member 23 to move through the rotating member 3. During the flipping stage, the positioning member 23 moves to the flipping position, and the rotating member 3 drives the positioning member 23 to rotate around a radial axis perpendicular to the axis of the mounting hole 211, so that the wafer is flipped.

[0030] By setting the positioning element 23 to move to the flipping position along the axis of the mounting hole 211, and reserving sufficient operating space, the rotating element 3 drives the positioning element 23 to rotate around a radial axis perpendicular to the axis of the mounting hole 211, preventing the wafer from colliding and interfering with the mounting element 21 during the flipping process, and improving the operational flexibility of the wafer clamping and flipping mechanism in a small space.

[0031] Implementation Method Two: (e.g.) Figure 5 , Figure 6 As shown, the operating part 1 is a handheld part. By holding the operating part 1 and flipping it, the positioning member 23 is flipped. Further, there are two rotating members 3. The wall of the mounting hole 211 has two oppositely arranged guide channels 212. The rotating members 3 are correspondingly arranged with the guide channels 212, and the rotating members 3 can move along the guide channels 212. The positioning member 23 is connected to the two rotating members 3. The guide channels 212 extend along the axis of the mounting hole 211. There are two driving members 22, each corresponding to one of the two rotating members 3. A threaded rod 226 is provided inside the guide channel 212. The driving member 22 is integrally formed with the rotating members 3. The driving member 22 includes a rotating cylinder 222 that is threadedly engaged with the threaded rod 226. The rotating cylinder 222 is rotatably disposed in the driving member 22 and fixed in the shaft hole of the first gear 223. The output shaft of the driving member 22 is connected to the first bevel gear 224. The first bevel gear 224 drives the first gear 223 to rotate through the transmission member 225. The transmission component 225 includes a second bevel gear meshing with the first bevel gear, a second gear meshing with the first gear, and a connecting component connecting the second bevel gear and the second gear. The rotation of the rotating cylinder 222 drives the rotating component 3 to move along the threaded rod 226.

[0032] In embodiment one, the rotating member 3 can be configured in any of the following embodiments: Example 1: As Figure 1 , Figure 3 , Figure 4As shown, there are two rotating parts 3, and the wall of the mounting hole 211 is provided with two oppositely arranged guide channels 212. The rotating parts 3 and the guide channels 212 are arranged one-to-one, and the rotating parts 3 can move along the guide channels 212. The positioning part 23 is connected to the two rotating parts 3, and the guide channels 212 extend along the axis of the mounting hole 211. There are two driving parts 22, which correspond to the two rotating parts 3 respectively.

[0033] By setting two rotating parts 3 to move synchronously along the guide channel 212 positioned opposite each other on the wall of the mounting hole 211, symmetrical support and drive are provided for the positioning part 23, preventing tilting or jamming of the positioning part 23 and ensuring its smooth linear movement along the axis of the mounting hole 211, significantly improving the movement accuracy. By setting the guide channel 212 to extend along the axis of the mounting hole 211, precise movement trajectory constraints are provided for the rotating parts 3, making the movement direction of the rotating parts 3 parallel to the axis of the mounting hole 211, preventing the rotating parts 3 from deviating from their movement. When the positioning part 23 reaches the flip position, the axis of the positioning part 23 coincides with the radial and circumferential directions of the mounting hole 211, ensuring the positional accuracy after the wafer is flipped.

[0034] Example 2: This example is not shown. A rotating component is provided, and the wall of the mounting hole has two opposing guide channels. The rotating component is positioned in one of the guide channels, and a mating component is located in the other guide channel. The mating component is rotatably connected to a positioning component, and the positioning component is connected to the rotating component. The guide channels extend along the axis of the mounting hole. Two driving components are provided, one corresponding to the rotating component and the other corresponding to the mating component.

[0035] In Embodiment 1, the driving component 22 can be configured in any of the following specific examples: Specific example 1: if Figure 1 , Figure 3 , Figure 4 As shown, the driving component 22 is located at the top of the mounting component. The driving component 22 is provided with a telescopic rod 221, which is connected to the rotating component 3. The telescopic rod 221 drives the rotating component 3 to move along the guide channel 212.

[0036] By incorporating the telescopic rod 221, a continuous and stable driving force can be provided, directly overcoming the gravity of the positioning component 23 and the wafer, as well as the frictional force during movement, ensuring stable movement even under loads such as clamping. The telescopic rod 221 has a compact structure, and its telescopic movement can perfectly match the extension direction of the guide channel 212 without requiring additional lateral space.

[0037] Specific Example 2: This specific example 2 is not shown in the figure. The driving component is provided with a rotating rod, and the rotating component is provided with a rotating hole. The rotating rod is threadedly connected to the rotating hole. By rotating the rotating rod, the rotating component is driven to move along the guide channel.

[0038] Specific example 3: if Figure 5 , Figure 6 As shown, a threaded rod 226 is provided within the guide channel 212. The driving component 22 and the rotating component 3 are integrally formed. The driving component 22 includes a rotating cylinder 222 that is threadedly engaged with the threaded rod 226. The rotating cylinder 222 is rotatably mounted on the driving component 22 and fixed in the shaft hole of the first gear 223. The output shaft of the driving component 22 is connected to the first bevel gear 224. The first bevel gear 224 drives the first gear 223 to rotate via the transmission component 225. The transmission component 225 includes a second bevel gear meshing with the first bevel gear, a second gear meshing with the first gear, and a connecting component connecting the second bevel gear and the second gear. Furthermore, one of the guide channel 212 and the rotating component 3 is provided with a guide protrusion, and the other is provided with a guide groove 213.

[0039] In this application, the positioning configuration of the clamping hole 231 for housing the wafer can be any of the following embodiments: Implementation Method 3: For example Figure 1 , Figure 3 , Figure 4 As shown, the wafer clamping and flipping mechanism also includes a support member 4 for placing the wafer. The support member 4 is provided with a support platform 41 that matches the contour of the wafer, and a positioning groove 42 that matches the contour of the positioning member 23 is provided along the circumference of the support platform 41. During the clamping stage and the unloading stage, the end of the positioning member 23 cooperates with the positioning groove 42.

[0040] By setting the positioning groove 42 of the support member 4 to mate with the contour of the positioning member 23, a mechanical positioning constraint with a concave-convex fit is formed during the clamping and unloading stages, further improving the placement accuracy of the positioning member 23. The positioning member 23 can accurately fit the wafer, so that the clamping hole 231 can be accurately aligned with the center of the wafer. The clamping member 232 can apply a balanced clamping force to the concentric wafer from multiple directions, ensuring that the wafer posture is stable and without deviation during the clamping process. The further cooperation between the positioning member 23 and the positioning groove 42 ensures that the clamping hole 231 and the support platform 41 are accurately aligned. When the clamping member 232 releases the wafer, the wafer can fall smoothly into the support platform 41 in a preset posture, avoiding wafer collisions or misalignment caused by unloading position deviations, and improving the reliability and accuracy consistency of the entire wafer pick-and-place process.

[0041] Implementation Method 4: This implementation method is not illustrated. The wafer clamping and flipping mechanism further includes an auxiliary positioning component disposed at the end of the positioning component. The auxiliary positioning component is equipped with multiple light sensors, which are distributed in a ring around the circumference of the clamping hole. The light sensors emit light towards the axis of the clamping hole, and the intersection of the multiple light sensors is located on the outer side of the positioning component. When the positioning component moves the auxiliary positioning component closer to the wafer, the light will form a ring-shaped light spot on the wafer surface. If the wafer and the clamping hole are concentric, the ring-shaped light spot will evenly cover the inner edge of the wafer, and the light from each sensor will be blocked by the same length, resulting in a complete and symmetrical ring outline. If the wafer is offset, the light in the offset direction will be blocked in advance, while the light on the opposite side will not be blocked sufficiently. The direction and degree of offset can be intuitively judged by the deformed shape of the ring. When the gap between the ring-shaped light spot and the edge of the wafer is uniform along the circumference, it indicates that the two are accurately aligned and clamping action is feasible. Those skilled in the art will understand that the mounting hole 211 and the clamping hole 231 are concentrically arranged, and the auxiliary positioning component can be disposed at the bottom end of the mounting component 21.

[0042] Embodiment 5: This embodiment 5 is not illustrated. The wafer clamping and flipping mechanism further includes a positioning bracket disposed below the operating unit. One end of the positioning bracket is connected to the operating unit, and the other end is telescopically disposed relative to the operating unit and used to abut against the worktable to facilitate the placement of the wafer clamping and flipping mechanism. The positioning bracket includes a vertical support member connected to the operating unit and a horizontal support member disposed at the end of the vertical support member opposite to the operating unit. The horizontal support member abuts against the worktable and includes two horizontal support arms disposed at a distance from each other along a preset direction. The mounting member is located between the two horizontal support arms.

[0043] As a preferred embodiment of this application, such as: Figure 1 , Figure 3 , Figure 4 As shown, the clamping hole 231 has a positioning groove 233 on its wall. The clamping member 232 includes a power member 2321 disposed in the positioning groove 233 and a gripper 2322 telescopically disposed in the power member 2321. When the gripper 2322 extends under the drive of the power member 2321, it can abut against the outer contour of the wafer to achieve clamping. When it retracts, it releases the clamping of the wafer. Preferably, the clamping member 232 is arc-shaped. Further, the clamping member 232 is movably disposed in the positioning groove 233. The positioning groove 233 is provided with a displacement drive member that drives the clamping member 232 to move, so as to adjust the clamping position of the clamping member 232 on the wafer.

[0044] By setting the positioning groove 233 to provide built-in installation space for the power component 2321, the clamping component 232 is embedded in the wall of the clamping hole 231, which prevents the clamping claw 2322 from protruding from the hole wall when it retracts. This ensures that there is no additional protrusion interference between the hole wall and the wafer when the clamping hole 231 is used to set the wafer, which not only expands the fault tolerance space during setting, but also provides a smooth channel for the wafer to enter the clamping hole 231.

[0045] Furthermore, such as Figure 1 , Figure 3 , Figure 4 As shown, the gripper 2322 is provided with a gripping end 2323 adapted to the outer contour of the wafer. The gripping end 2323 is provided with an elastic buffer. When the gripper 2322 abuts against the wafer, the elastic buffer can flexibly contact the edge of the wafer.

[0046] By adapting the clamping end 2323 to the outer contour of the wafer, the contact area between the gripper 2322 and the wafer is increased. Combined with the micro-deformation capability of the elastic buffer, this not only accommodates the minute dimensional tolerances that may exist at the wafer edge, but also disperses the clamping force by increasing the contact area, avoiding excessive local stress. At the same time, the friction of the elastic material can reduce the risk of wafer slippage during clamping and flipping.

[0047] In this application, the mounting component 21 can be installed in any of the following embodiments: Implementation method seven: such as Figure 1 , Figure 2 As shown, the mounting component 21 includes: a plurality of connecting plates 214, each connecting plate 214 having an edge region and a middle region, the middle region being located in the region of the connecting plate away from its edge; At least one annular connector 215 is provided, which has a circumferentially closed ring structure. The annular connector 215 is fixedly or detachably connected to the middle area of ​​each connecting plate 214 to integrate multiple connecting plates 214 into one unit and form a mounting hole 211. A clearance space is formed between two adjacent connecting plates 214. When the worktable supports the wafer by providing support protrusions at circumferential intervals, the support protrusions can enter the clearance space when the clamping part 2 moves toward the wafer, improving the applicability of the wafer clamping and flipping mechanism and facilitating the fitting of the wafer into the clamping hole 231.

[0048] Implementation Method 8: This implementation method 7 is not illustrated. The mounting component is cylindrical and hollow to form a mounting hole.

[0049] This application also discloses a control method for a wafer clamping and flipping mechanism, which is applied to the wafer clamping and flipping mechanism disclosed in this application, such as... Figure 5 As shown, the control methods include: During the clamping stage, the position information of the wafer and the clamping part is acquired, and the position of the operating part is adjusted according to the position information of the wafer and the clamping part to align the wafer with the center of the clamping hole. The driving component is controlled to drive the positioning component to move relative to the mounting component so that the positioning component can fit the wafer. After the positioning component fits the wafer, the clamping component is controlled to apply a corresponding clamping force to clamp the wafer. During the flipping stage, after the clamping component holds the wafer, the distance information between the positioning component and the wafer is obtained. Based on the distance information, the positioning component is controlled to move to the flipping position, and the positioning component is flipped after it reaches the flipping position. During the unloading stage, the position information of the placement position and the positioning component is obtained. Based on the position information of the placement position and the positioning component, the wafer is controlled to align with the placement position. The positioning component is controlled to move so that the clamping hole matches the placement position. The clamping component is controlled to release the wafer.

[0050] In the control method of this application, by first acquiring the position information of the wafer and the clamping part during the clamping stage, and then adjusting the operating part to align their centers, it is possible to ensure that the clamping force of the clamping component on the wafer is evenly distributed, avoiding excessive local force due to positional deviation. Simultaneously, applying clamping force after the positioning component is placed on the wafer further ensures the stability of the clamping process, preventing the wafer from slipping or misaligning in the initial clamping stage, laying a precise initial foundation for the subsequent flipping and unloading stages, and improving the reliability of the wafer clamping process. During the flipping stage, by first acquiring the distance information between the positioning component and the wafer placement position, and then controlling the positioning component to move to the flipping position, and then performing the flipping action after the positioning component reaches the designated position, it is possible to ensure that the movement trajectory of the flipping process is controllable, reducing the impact of the flipping action on the connection stability between the wafer and the positioning component, further ensuring the structural integrity of the wafer during the flipping stage, and improving the consistency of the flipping operation. During the unloading stage, precise alignment of the wafer with the placement position can be achieved by acquiring the position information of the placement position and the positioning component. At the same time, controlling the movement of the positioning component to align the clamping hole with the placement position before releasing the wafer allows the wafer to land smoothly, reducing the impact when the wafer contacts the placement surface and preventing surface scratches or performance damage. In addition, precise unloading positioning provides a standard initial position for subsequent processes, avoiding rework in subsequent processes due to unloading deviations, ensuring the continuity and efficiency of the entire production process, and indirectly improving overall production efficiency.

[0051] Obtaining the position information of the wafer and the clamping part includes: The wafer's position information is acquired in real time by capturing images of the wafer using a camera device installed on the mounting or positioning component. The wafer's position information is then acquired in real time through these images. A positioning sensor is installed on the mounting component to acquire the current position information of the clamping part and the positioning component.

[0052] Adjust the position of the operating unit based on the position information of the wafer and the clamping part: Based on the position information of the wafer and the clamping part, the guiding information, the movement information of the positioning element, and the clamping information of the clamping element are determined; the guiding information includes the movement direction and movement distance of the operating part; The moving direction and moving distance of the operating unit are determined based on the position information of the wafer and the position information of the positioning component. The position of the operating unit is adjusted according to the guidance information to align the wafer with the center of the clamping hole. The position information of the positioning component in the mounting hole and the maximum distance that the positioning component can move at present are obtained. The difference between the maximum distance and the distance between the positioning component and the wafer placement surface is determined. The moving direction and moving distance of the operating unit are determined based on the difference, so that the operating unit is positioned above the wafer and the positioning component can fit the wafer within the moving range. When the operating unit is a handheld unit, the operating unit is equipped with a display screen that displays the guidance information. The mobile information control drive unit moves the positioning unit relative to the mounting unit so that the positioning unit can fit the wafer. Based on the current position information of the positioning component and the wafer position information, the distance between the positioning component and the wafer is determined, and the moving distance of the positioning component is determined. The driving component moves the positioning component by this distance until it reaches the clamping position, where it places the wafer. By determining the distance between the positioning component and the wafer twice, it is ensured that the clamping hole can accurately place the wafer. Those skilled in the art will understand that the distance between the positioning component and the wafer can be directly obtained by setting a distance sensor.

[0053] The clamping components are controlled to move according to the clamping information. After the wafer is placed on the positioning component, the clamping components are controlled to apply the corresponding clamping force to clamp the wafer. Clamping information includes clamping force, which is determined based on the wafer's specifications. The clamping device applies a corresponding clamping force to hold the wafer. Preferably, the clamping device includes a power unit and a jaw that extends and retracts from the power unit. The extension distance of the jaw and the output power of the power unit are determined according to the wafer's specifications, the diameter of the clamping hole, and the clamping force. The wafer's specifications and clamping force can also be manually input or obtained by capturing images of the wafer using a camera device installed on the mounting or positioning component.

[0054] Obtaining distance information between the positioning component and the wafer placement position includes having a distance sensor at the end of the positioning component facing the placement position, and obtaining distance information between the positioning component and the placement position through the distance sensor.

[0055] Furthermore, such as Figure 1 , Figure 3 , Figure 4 As shown, the positioning member 23 is rotatably disposed relative to the mounting member 21. The wafer clamping and flipping mechanism also includes a rotating member 3 that can drive the positioning member 23 to rotate. The rotating member 3 is movably disposed in the mounting hole 211 along the axis of the mounting hole 211. The driving member 22 drives the positioning member 23 to move through the rotating member 3. During the flipping stage, the positioning member 23 moves to the flipping position, and the rotating member 3 can drive the positioning member 23 to rotate so that the wafer is flipped. Controlling the positioning member to move to the flipping position according to the distance information includes: The flipping position information is determined based on the placement location and the position information of the positioning component; The movement information of the rotating component and the prompt information of the operating unit are determined based on the information of the flip position; Control the movement of rotating components based on movement information; Adjust the position of the control unit according to the prompts.

[0056] The information used to determine the flipping position based on the placement location and the position information of the positioning component includes: Obtain the dimensional parameters of the wafer and the structural parameters of the positioning components; The rotation axis of the positioning component is determined based on the structural parameters, and the rotation radius of the positioning component after clamping the wafer is determined based on the rotation axis and dimensional parameters. Based on the position information of the placement location and the positioning component, as well as the rotation radius, a safe zone is determined in which the positioning component will not interfere with the placement surface of the wafer during rotation. The position within the safe zone that meets the rotation radius requirement is the information of the flip position. The information of the flip position includes the relative distance between the positioning component and the placement surface of the wafer.

[0057] The movement information of the rotating component and the prompt information of the operating unit are determined based on the information of the flip position, including: The distance between the positioning component and the wafer placement surface is the clearance distance. When the positioning component moves to the top of the mounting hole, the clearance distance is at its maximum value. The relationship between the maximum value of the clearance distance and the rotation radius is determined. If the maximum value of the clearance distance is greater than the rotation radius, the movement information is: control the rotating component to move so that the clearance distance is less than the maximum value and greater than the rotation radius. The prompt information is: keep the current position of the operating part unchanged. When the maximum clearance is less than or equal to the rotation radius, the movement information is: control the rotating part to move so that the clearance is less than the maximum value, calculate the difference between the clearance and the rotation radius as the compensation distance, and prompt the operating part to move vertically towards the side away from the wafer placement surface to compensate the distance.

[0058] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0059] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0060] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.

Claims

1. A wafer clamping and flipping mechanism, characterized in that, Includes an operating part and a clamping part connected to the operating part; The clamping part includes a mounting component, a driving component, and a positioning component. The positioning component has a clamping hole, and multiple clamping components for clamping the wafer are provided in the clamping hole. The multiple clamping components are arranged sequentially at intervals along the circumference of the clamping hole. The mounting component has a mounting hole, and the positioning component is disposed in the mounting hole and can move along the axis of the mounting hole. The driving component is used to drive the positioning component to move. The positioning element has a working state for picking up and placing the wafer, the working state including: During the clamping phase, the positioning member moves to the clamping position, at least partially exposing the outer contour of the mounting member, so that the positioning member fits onto the wafer, and the plurality of clamping members clamp the wafer. During the flipping phase, the plurality of clamping members clamp the wafer, and the positioning member is flipped to flip the wafer over; During the unloading stage, the positioning member moves, at least partially exposing the outer contour of the mounting member, so that the clamping hole matches the placement position of the wafer, and the multiple clamping members move to release the wafer.

2. The wafer clamping and flipping mechanism according to claim 1, characterized in that, The positioning member is rotatable relative to the mounting member. The wafer clamping and flipping mechanism further includes a rotating member for driving the positioning member to rotate. The rotating member is disposed in the mounting hole and can move along the axis of the mounting hole. The driving member drives the positioning member to move through the rotating member. During the flipping stage, the positioning member moves to the flipping position, and the rotating member drives the positioning member to rotate about a radial axis perpendicular to the axis of the mounting hole, so as to flip the wafer.

3. The wafer clamping and flipping mechanism according to claim 2, characterized in that, Two rotating components are provided, and the wall of the mounting hole is provided with two oppositely arranged guide channels. The rotating component and the guide channel are arranged in a one-to-one correspondence, and the rotating component can move along the guide channel. The positioning component is connected to the two rotating components, and the guide channel extends along the axis of the mounting hole.

4. The wafer clamping and flipping mechanism according to claim 3, characterized in that, The driving component is equipped with a telescopic rod, which is connected to the rotating component. The telescopic rod drives the rotating component to move along the guide channel.

5. A wafer clamping and flipping mechanism according to claim 1, characterized in that, The wafer clamping and flipping mechanism further includes a support member for placing the wafer. The support member has a support platform that matches the contour of the wafer, and a positioning groove that matches the contour of the positioning member is provided along the circumference of the support platform. During the clamping stage and the unloading stage, the end of the positioning member engages with the positioning groove.

6. A wafer clamping and flipping mechanism according to claim 1, characterized in that, The clamping hole has a positioning groove in its wall. The clamping member includes a power member disposed in the positioning groove and a gripper that is telescopically disposed in the power member. When the gripper extends under the drive of the power member, it can abut against the outer contour of the wafer to achieve clamping. When it retracts, it releases the clamping of the wafer.

7. A wafer clamping and flipping mechanism according to claim 6, characterized in that, The gripper has a clamping end adapted to the outer contour of the wafer, and the clamping end has an elastic buffer. When the gripper abuts against the wafer, the elastic buffer can flexibly contact the edge of the wafer.

8. A control method for a wafer clamping and flipping mechanism, applied to the wafer clamping and flipping mechanism according to any one of claims 1 to 7, characterized in that, The control method includes: During the clamping stage, the position information of the wafer and the clamping part is acquired, and the position of the operating part is adjusted according to the position information of the wafer and the clamping part so that the wafer is aligned with the center of the clamping hole. The driving member is controlled to drive the positioning member to move relative to the mounting member so that the positioning member fits the wafer. After the positioning member fits the wafer, the clamping member is controlled to apply a corresponding clamping force to clamp the wafer. During the flipping stage, after the clamping member clamps the wafer, the distance information between the positioning member and the wafer is obtained. Based on the distance information, the positioning member is controlled to move to the flipping position, and the positioning member is flipped after reaching the flipping position. During the feeding stage, the position information of the placement position and the position information of the positioning component are obtained. Based on the position information of the placement position and the position information of the positioning component, the wafer is controlled to align with the placement position. The positioning component is controlled to move so that the clamping hole matches the placement position. The clamping component is controlled to release the wafer.

9. The control method for a wafer clamping and flipping mechanism according to claim 8, characterized in that: The positioning member is rotatably disposed relative to the mounting member. The wafer clamping and flipping mechanism further includes a rotating member capable of driving the positioning member to rotate. The rotating member is movably disposed in the mounting hole along the axis of the mounting hole. The driving member drives the positioning member to move through the rotating member. During the flipping stage, the positioning member moves to the flipping position, and the rotating member can drive the positioning member to rotate so that the wafer is flipped. The step of controlling the positioning member to move to the flipping position according to the distance information includes: The information of the flipping position is determined based on the placement position and the position information of the positioning component; The movement information of the rotating component and the prompting information of the operating unit are determined based on the information of the flipping position. The rotating component is controlled to move according to the movement information; Adjust the position of the operating unit according to the prompt information.

10. The control method for a wafer clamping and flipping mechanism according to claim 9, characterized in that: The information used to determine the flipping position based on the placement position and the position information of the positioning component includes: Obtain the dimensional parameters of the wafer and the structural parameters of the positioning element; determine the rotation axis of the positioning element based on the structural parameters; and determine the rotation radius of the positioning element after clamping the wafer based on the rotation axis and the dimensional parameters. Based on the placement position, the position information of the positioning element, and the rotation radius, a safe area is determined in which the positioning element does not interfere with the placement surface of the wafer during rotation. The position within the safe area that meets the rotation radius requirement is the information of the flip position.

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