Ultra-wideband sum-difference device based on 90-degree 3dB bridge bare chip

Abstract

The invention relates to an ultra-wideband sum-difference device based on 90-degree 3dB bridge bare chips. The ultra-wideband sum-difference device comprises a sum port, an azimuth difference port, a pitching difference port, a load port, a first quadrant port, a second quadrant port, a third quadrant port, a fourth quadrant port, a PCB soft substrate, a + 90-degree phase shifter, a-90-degree phase shifter, a first 90-degree 3dB bare chip, a second 90-degree 3dB bare chip, a third 90-degree 3dB bare chip and a fourth 90-degree 3dB bare chip. According to the technical scheme, on the basis of the 90-degree 3dB bridge bare chip, the phase shifter and the PCB soft substrate are combined through the gold wire bonding technology and the like, the ultra-wideband sum-difference device of a new structure is formed, the sum-difference device with the relative bandwidth being 100% and the frequency (6-18 GHz) comprising the X frequency band and the Ku frequency band is achieved, and compared with an existing waveguide or strip line sum-difference device, the relative bandwidth is wide.

Description

Technical Field

[0001] This application relates to the field of sum and difference technology, and in particular to an ultrawideband sum and difference based on a 90° 3dB bridge bare chip. Background Technology

[0002] Existing sum and difference converter structures are generally waveguide sum and difference converters and stripline sum and difference converters. Their advantages are simple structure and ease of implementation. However, their disadvantage is that their relative bandwidth is relatively narrow, generally around 20%, which affects their use in some engineering applications. Summary of the Invention

[0003] To overcome, at least to some extent, the problem of relatively narrow bandwidth of sum and difference devices in related technologies, this application provides an ultrawideband sum and difference device based on a 90° 3dB bridge bare chip.

[0004] The proposed solution is as follows: An ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip includes: Azimuth difference port, pitch difference port, load port, first quadrant port, second quadrant port, third quadrant port, fourth quadrant port, PCB flexible substrate, +90° phase shifter, -90° phase shifter, first 90° 3dB bare chip, second 90° 3dB bare chip, third 90° 3dB bare chip and fourth 90° 3dB bare chip; The PCB flexible substrates include: A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate; The two ends of the A1PCB flexible substrate are respectively connected to the port and the first 90° 3dB bare chip; The two ends of the A2PCB flexible substrate are respectively connected to the pitch difference port and the third 90° 3dB bare chip; The two ends of the A3PCB flexible substrate are respectively connected to the load port and the third 90° 3dB bare chip; The two ends of the A4PCB flexible substrate are respectively connected to the azimuth difference port and the first 90° 3dB bare chip; The two ends of the B1PCB flexible substrate are respectively connected to the first 90° 3dB bare chip and the second 90° 3dB bare chip; The two ends of the B2PCB flexible substrate are respectively connected to the second 90° 3dB bare chip and the third 90° 3dB bare chip; The two ends of the B3PCB flexible substrate are respectively connected to the third 90° 3dB bare chip and the fourth 90° 3dB bare chip; The two ends of the B4PCB flexible substrate are respectively connected to the first 90° 3dB bare chip and the fourth 90° 3dB bare chip; The two ends of the C1PCB flexible substrate are respectively connected to a -90° phase shifter and a second 90° 3dB bare chip; The two ends of the C2PCB flexible substrate are respectively connected to a +90° phase shifter and a fourth 90° 3dB bare chip; The two ends of the D1PCB flexible substrate are respectively connected to the third quadrant port and the second 90° 3dB bare chip; The two ends of the D2PCB flexible substrate are respectively connected to the first quadrant port and the fourth 90° 3dB bare chip. The two ends of the E1PCB flexible substrate are respectively connected to the second quadrant port and the -90° phase shifter; The two ends of the E2PCB flexible substrate are connected to the fourth quadrant port and the +90° phase shifter, respectively.

[0005] Preferably, it further includes: a metal cavity; The PCB flexible substrate is disposed in the metal cavity.

[0006] Preferably, the A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are all L-shaped.

[0007] Preferably, the B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate and B4PCB flexible substrate are combined to form a square structure.

[0008] Preferably, the A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are combined to form a grid-shaped structure.

[0009] The technical solution provided in this application may include the following beneficial effects: This technical solution is based on a 90° 3dB bridge bare chip, and adds a phase shifter and a PCB soft substrate through processes such as gold wire bonding to form a new type of ultra-wideband sum and difference device. It achieves a sum and difference device with a relative bandwidth of 100% and a frequency (6-18GHz) that includes the X and Ku bands. Compared with existing waveguide or stripline sum and difference devices, it has a wider relative bandwidth.

[0010] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0011] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0012] Figure 1 This is a schematic diagram of the structure of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip provided in one embodiment of this application; Figure 2 This is an equivalent circuit diagram of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip provided in one embodiment of this application; Figure 3 This is a sum-differentiation waveform diagram of an ultrawideband sum-differentiation converter based on a 90° 3dB bridge bare chip, provided in one embodiment of this application; Figure 4 This application provides an embodiment of an ultrawideband sum and difference converter based on a 90° 3dB bridge bare chip, and its sum and difference amplitude diagram is shown. Figure 5 This application provides a phase diagram of the sum and difference port of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip, according to one embodiment of the present application. Figure 6 This application provides an embodiment of an azimuth difference amplitude diagram of an ultrawideband sum and differencer based on a 90° 3dB bridge bare chip; Figure 7 This application provides an embodiment of an azimuth difference phase diagram of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip; Figure 8 This is a pitch difference amplitude diagram of an ultrawideband sum and differencer based on a 90° 3dB bridge bare chip provided in one embodiment of this application; Figure 9 This is an embodiment of the present application providing a pitch difference phase diagram of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip.

[0013] Figure reference numerals: PCB flexible substrate-1; -90° phase shifter-2; first 90° 3dB bare chip-31; second 90° 3dB bare chip-32; third 90° 3dB bare chip-33; fourth 90° 3dB bare chip-34; +90° phase shifter-4; metal cavity-5. Detailed Implementation

[0014] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0015] Figure 1 This is a schematic diagram of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip, provided in one embodiment of this application. (Refer to...) Figure 1 An ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip includes: The components include: azimuth difference port, pitch difference port, load port, first quadrant port, second quadrant port, third quadrant port, fourth quadrant port, PCB flexible substrate 1, +90° phase shifter 4, -90° phase shifter 2, first 90° 3dB bare chip 31, second 90° 3dB bare chip 32, third 90° 3dB bare chip 33, and fourth 90° 3dB bare chip 34; The PCB flexible substrates include: A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate; The two ends of the A1PCB flexible substrate are respectively connected to the port and the first 90° 3dB bare chip 31; The two ends of the A2PCB flexible substrate are respectively connected to the pitch difference port and the third 90° 3dB bare chip 33; The two ends of the A3PCB flexible substrate are connected to the load port and the third 90° 3dB bare chip 33, respectively. The two ends of the A4PCB flexible substrate are respectively connected to the azimuth difference port and the first 90° 3dB bare chip 31; The two ends of the B1PCB flexible substrate are respectively connected to the first 90° 3dB bare chip 31 and the second 90° 3dB bare chip 32; The two ends of the B2PCB flexible substrate are respectively connected to the second 90° 3dB bare chip 32 and the third 90° 3dB bare chip 33; The two ends of the B3PCB flexible substrate are respectively connected to the third 90° 3dB bare chip 33 and the fourth 90° 3dB bare chip 34; The two ends of the B4PCB flexible substrate are respectively connected to the first 90° 3dB bare chip 31 and the fourth 90° 3dB bare chip 34; The two ends of the C1PCB flexible substrate are respectively connected to the -90° phase shifter 2 and the second 90° 3dB bare chip 32; The two ends of the C2PCB flexible substrate are connected to the +90° phase shifter 4 and the fourth 90° 3dB bare chip 34, respectively. The two ends of the D1PCB flexible substrate are respectively connected to the third quadrant port and the second 90° 3dB bare chip 32; The two ends of the D2PCB flexible substrate are connected to the first quadrant port and the fourth 90° 3dB bare chip 34, respectively. The two ends of the E1PCB flexible substrate are connected to the second quadrant port and the -90° phase shifter 2, respectively; The two ends of the E2PCB flexible substrate are connected to the fourth quadrant port and the +90° phase shifter 4, respectively.

[0016] In specific practice, refer to Figure 1 The A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are all L-shaped.

[0017] The B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate and B4PCB flexible substrate are combined to form a square structure.

[0018] The A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are combined to form a grid-shaped structure.

[0019] The main component for implementing the sum and difference function in this technical solution is a 90° 3dB bridge bare chip. The principle of the 90° 3dB bridge bare chip is the same as that of the 3dB branch line bridge. Figure 2 This application provides an equivalent circuit diagram of an ultrawideband sum and difference circuit based on a 90° 3dB bridge bare chip, as shown in one embodiment. Figure 2As shown, when a signal is input from ports 1 and 2, the power is evenly distributed to ports 3 and 4, and there is good isolation between ports 1 and 2. When a signal is input from port 1, the signal to port 4 is 90° ahead of the signal to port 3; when a signal is input from port 2, the signal to port 3 is 90° ahead of the signal to port 4. Due to the reciprocity of the branch bridge ports, the branch bridge has two symmetrical planes, one vertically and one horizontally, with ports 1 and 2 being reciprocal and ports 3 and 4 having completely identical characteristics.

[0020] In this technical solution, the amplitude and phase link RF signal is input from four quadrant subarrays, and the link is described below. Figure 1 The input signal in the first quadrant passes through the D2 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → B4 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → A1 PCB flexible substrate → and port; the input signal in the second quadrant passes through the E1 PCB flexible substrate → -90° phase shifter 2 (phase -90°) → C1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A1 PCB flexible substrate → and port; the input signal in the third quadrant passes through the D1 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A1 PCB flexible substrate → and port; the input signal in the fourth quadrant passes through the E2 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A1 PCB flexible substrate → and port; the input signal in the fourth quadrant passes through the E2 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A1 PCB flexible substrate → and port; the input signal in the fourth quadrant passes through the E2 PCB flexible substrate → 90° 3dB bridge bare chip (phase -9 ... PCB flexible substrate → +90° phase shifter 4 (phase +90°) → C2 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B4 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → A1 PCB flexible substrate → and port. The phase design and loss design of the PCB flexible substrates along the link are guaranteed to be consistent. Calculations show that the amplitude and phase of the four quadrant ports to the and port are equal and in phase, and the main lobe of the synthesized and port radiation pattern is pen-shaped.

[0021] In this technical solution, the azimuth difference amplitude phase link RF signal is input from four quadrant subarrays, and the link is shown below. Figure 1The input signal in the first quadrant passes through the D2 PCB flexible substrate → 90° 3dB bridge bare chip (0° phase) → B4 PCB flexible substrate → 90° 3dB bridge bare chip (0° phase) → A4 PCB flexible substrate → azimuth difference port; the input signal in the second quadrant passes through the E1 PCB flexible substrate → -90° phase shifter 2 (-90° phase) → C1 PCB flexible substrate → 90° 3dB bridge bare chip (0° phase) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (-90° phase) → A4 PCB flexible substrate → azimuth difference port; the input signal in the third quadrant passes through the D1 PCB flexible substrate → 90° 3dB bridge bare chip (-90° phase) → B1 PCB flexible substrate → 90° 3dB bridge bare chip (-90° phase) → A4 PCB flexible substrate → azimuth difference port; the input signal in the fourth quadrant passes through the E2 PCB flexible substrate → - ... PCB flexible substrate → +90° phase shifter 4 (phase +90°) → C2 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B4 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A4 PCB flexible substrate → azimuth difference port. The phase design and loss design of the PCB flexible substrates along the link are guaranteed to be consistent. Calculations show that due to the effect of the phase shifter and bridge, the phases of the second and third quadrants lag behind the phases of the first and fourth quadrants by 180°. When synthesizing the azimuth difference port, the subarray RF signals of the second and third quadrants are equal in amplitude and opposite in direction to the subarray RF signals of the first and fourth quadrants. The synthesized azimuth plane radiation pattern splits the main lobe into two lobes in the azimuth direction, forming the azimuth difference radiation pattern.

[0022] In this technical solution, the pitch difference amplitude-phase link RF signal is input from four quadrant subarrays, and the link is described below. Figure 1 The input signal in the first quadrant passes through the D2 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B3 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → A2 PCB flexible substrate → pitch difference port; the input signal in the second quadrant passes through the E1 PCB flexible substrate → -90° phase shifter 2 (phase -90°) → C1 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → B2 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A2 PCB flexible substrate → pitch difference port; the input signal in the third quadrant passes through the D1 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → B2 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → A2 PCB flexible substrate → azimuth difference port; The fourth quadrant input signal passes through E2 PCB flexible substrate → +90° phase shifter 4 (phase +90°) → C2 PCB flexible substrate → 90° 3dB bridge bare chip (phase 0°) → B3 PCB flexible substrate → 90° 3dB bridge bare chip (phase -90°) → A2 PCB flexible substrate → azimuth difference port. The phase design and loss design of the PCB flexible substrates along the link ensure consistency. Calculations show that, due to the phase shifter and bridge, the phases of the first and second quadrants lag behind the phases of the third and fourth quadrants by 180°. When synthesizing the radiation pattern at the elevation difference port, the subarray RF signals of the first and second quadrants are equal in amplitude and opposite in direction to the subarray RF signals of the third and fourth quadrants. The synthesized azimuth radiation pattern splits the main lobe of the elevation radiation pattern into two lobes in the azimuth direction, forming the elevation difference radiation pattern.

[0023] Through simulation design, the actual test data of the sum and difference converter after board deployment met the design expectations. The output amplitude of the sum and difference port was ±1.0B, the phase consistency of the port was ±10, and the standing wave ratio of the sum and difference port was ≤2. Figures 3-9 The measured parameter data and antenna pattern of the ultra-wideband sum and difference circuit based on the 90° 3dB bridge bare chip in this technical solution are shown.

[0024] This technical solution is based on a 90° 3dB bridge bare chip, and adds a phase shifter and a PCB soft substrate through processes such as gold wire bonding to form a new type of ultra-wideband sum and difference device. It achieves a sum and difference device with a relative bandwidth of 100% and a frequency (6-18GHz) that includes the X and Ku bands. Compared with existing waveguide or stripline sum and difference devices, it has a wider relative bandwidth.

[0025] It should be noted that the ultrawideband sum and difference circuit based on the 90° 3dB bridge bare chip also includes: a metal cavity 5; The PCB flexible substrate is placed in the metal cavity 5.

[0026] In this technical solution, the overall structure of the sum and difference device is set in the metal cavity 5.

[0027] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0028] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. An ultrawideband sum and difference converter based on a 90° 3dB bridge bare chip, characterized in that, include: Azimuth difference port, pitch difference port, load port, first quadrant port, second quadrant port, third quadrant port, fourth quadrant port, PCB flexible substrate, +90° phase shifter, -90° phase shifter, first 90° 3dB bare chip, second 90° 3dB bare chip, third 90° 3dB bare chip and fourth 90° 3dB bare chip; The PCB flexible substrates include: A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate; The two ends of the A1PCB flexible substrate are respectively connected to the port and the first 90° 3dB bare chip; The two ends of the A2PCB flexible substrate are respectively connected to the pitch difference port and the third 90° 3dB bare chip; The two ends of the A3PCB flexible substrate are respectively connected to the load port and the third 90° 3dB bare chip; The two ends of the A4PCB flexible substrate are respectively connected to the azimuth difference port and the first 90° 3dB bare chip; The two ends of the B1PCB flexible substrate are respectively connected to the first 90° 3dB bare chip and the second 90° 3dB bare chip; The two ends of the B2PCB flexible substrate are respectively connected to the second 90° 3dB bare chip and the third 90° 3dB bare chip; The two ends of the B3PCB flexible substrate are respectively connected to the third 90° 3dB bare chip and the fourth 90° 3dB bare chip; The two ends of the B4PCB flexible substrate are respectively connected to the first 90° 3dB bare chip and the fourth 90° 3dB bare chip; The two ends of the C1PCB flexible substrate are respectively connected to a -90° phase shifter and a second 90° 3dB bare chip; The two ends of the C2PCB flexible substrate are respectively connected to a +90° phase shifter and a fourth 90° 3dB bare chip; The two ends of the D1PCB flexible substrate are respectively connected to the third quadrant port and the second 90° 3dB bare chip; The two ends of the D2PCB flexible substrate are respectively connected to the first quadrant port and the fourth 90° 3dB bare chip. The two ends of the E1PCB flexible substrate are respectively connected to the second quadrant port and the -90° phase shifter; The two ends of the E2PCB flexible substrate are connected to the fourth quadrant port and the +90° phase shifter, respectively.

2. The ultrawideband sum and difference converter based on a 90° 3dB bridge bare chip according to claim 1, characterized in that, Also includes: Metal cavity; The PCB flexible substrate is disposed in the metal cavity.

3. The ultrawideband sum and difference converter based on a 90° 3dB bridge bare chip according to claim 1, characterized in that, The A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are all L-shaped.

4. The ultrawideband sum and difference converter based on a 90° 3dB bridge bare chip according to claim 3, characterized in that, The B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate and B4PCB flexible substrate are combined to form a square structure.

5. The ultra-wideband sum and difference converter based on a 90° 3dB bridge bare chip according to claim 3, characterized in that, The A1PCB flexible substrate, A2PCB flexible substrate, A3PCB flexible substrate, A4PCB flexible substrate, B1PCB flexible substrate, B2PCB flexible substrate, B3PCB flexible substrate, B4PCB flexible substrate, C1PCB flexible substrate, C2PCB flexible substrate, D1PCB flexible substrate, D2PCB flexible substrate, E1PCB flexible substrate and E2PCB flexible substrate are combined to form a grid-shaped structure.

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