Chip module and terminal

Abstract

The invention discloses a chip module and a terminal, and belongs to the technical field of semiconductor devices. The chip module comprises a system-on-chip (SoC), a printed circuit board (PCB) and a first device, wherein the first device is used for filtering; the top of the PCB is welded to the bottom of the SoC; the first device is embedded in the PCB, and the first device is conducted with devices inside and outside the PCB through metal conduction holes.

Description

Technical Field

[0001] This application belongs to the field of semiconductor device technology, specifically relating to a chip module and a terminal. Background Technology

[0002] As the performance of the SoC (System on Chip) within a mobile phone motherboard improves, the phone's heat generation also intensifies, leading to problems such as reduced thermal fatigue life of chip solder joints and excessively high junction temperatures causing performance degradation. The top of the SoC has thermally conductive materials and a heat dissipation layer to dissipate heat from above. However, the bottom of the SoC has surface-mount filter capacitors, whose poor thermal conductivity causes significant heat accumulation, resulting in ineffective heat dissipation for the SoC. Summary of the Invention

[0003] The purpose of this application is to provide a chip module and terminal that can improve the heat dissipation efficiency of the SoC.

[0004] In a first aspect, embodiments of this application provide a chip module, including:

[0005] The system-on-a-chip (SoC), the printed circuit board (PCB), and a first device, wherein the first device is used for filtering;

[0006] The top of the PCB is soldered to the bottom of the SoC;

[0007] The first device is embedded in the PCB and is connected to devices inside and outside the PCB through metal vias.

[0008] Secondly, embodiments of this application provide a terminal, including: a camera and the chip module described in the first aspect above.

[0009] In this embodiment, the chip module embeds the first device into the PCB. No other devices need to be soldered to the bottom of the PCB, allowing for direct bottom heat dissipation, which achieves rapid heat dissipation and improves the heat dissipation efficiency of the SoC. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a chip module provided in an embodiment of this application;

[0011] Figure 2 This is a schematic diagram of the PCB structure in the chip module provided in this application embodiment;

[0012] Figure 3 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0013] Figure 4This is a schematic diagram of another chip module provided in an embodiment of this application;

[0014] Figure 5 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0015] Figure 6 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0016] Figure 7 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0017] Figure 8 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0018] Figure 9 This is a schematic diagram of another chip module provided in an embodiment of this application;

[0019] Figure 10 This is a schematic diagram of the back of the SoC provided in the embodiments of this application.

[0020] 100-DDR SDRAM, 101-SoC, 102-PCB, 103-Top thermal conductive material, 104-Top heat dissipation material, 106-First device, 107-Second device, 200-Main board, 203-Bottom thermal conductive material, 301-Top shield, 302-Bottom shield, 401-Filter capacitor, 501-High thermal conductivity material, 601-Metal via, 602-Isolation layer, 603-Pure adhesive, 604-Cavity. Detailed Implementation

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The chip module, motherboard, and electronic device provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0026] Figure 1 A schematic diagram of a chip module provided in an embodiment of this application is shown. Figure 1 As shown, the chip module includes:

[0027] The system-on-a-chip (SoC) 101, the PCB (Printed Circuit Board) 102, and the first device 106 are used for filtering.

[0028] The top of the PCB is soldered to the bottom of the SoC 101, and the first device 106 is embedded in the PCB 102. The first device 106 is connected to the devices inside and outside the PCB 102 through the metal via 601.

[0029] SoC 101 refers to a system-on-a-chip that integrates functional modules such as baseband, modem, and application processor. PCB 102 consists of copper layers and dielectric materials.

[0030] In this embodiment of the application, the first device 106 may include at least one of the following: a passive device or an active device.

[0031] Passive components are those that operate without an external power source. They cannot amplify signals or provide gain, but can perform functions such as signal distribution, storage, filtering, or energy dissipation. Passive components include, but are not limited to, at least one of the following: resistors, capacitors, and inductors.

[0032] Active components refer to components that require an external power supply to operate. They amplify, switch, or control signals and typically exhibit nonlinear characteristics. Active components include, but are not limited to, at least one of the following: processors, memory, DDR SDRAM, PMIC (Power Management Integrated Circuit), sensor integrated circuits, etc.

[0033] In this embodiment of the application, if there are multiple first devices 106 embedded in the cavity 604 of PCB 102, they can all be passive devices, or all be active devices, or they can include both passive and active devices. This embodiment of the application does not make specific limitations in this regard.

[0034] In one embodiment of this application, a cavity 604 may be provided inside the PCB 102, and the first device 106 is fixedly encapsulated in the cavity 604 by filling it with pure glue 603.

[0035] The cavity 604 is a hollowed-out space inside the PCB 102, which can be achieved using PCB cavity technology. The thickness of the first device 106 is less than the thickness of the PCB 102. For example, the thickness of the PCB 102 is 0.6mm, and the thickness of the first device 106 is 0.2mm, 0.3mm, or 0.4mm, etc., which is not specifically limited.

[0036] The aforementioned metal via 601 can be generated by PCB processes such as laser blind via or mechanical drilling followed by copper plating. The metal via 601 can interconnect the first device 106 with the inner and outer layers of the PCB 102, and can also enable communication with devices outside the PCB 102.

[0037] In this embodiment, the first device 106 can specifically be a filter capacitor 401. The thickness of the filter capacitor 401 can be set as needed. For example, a thinner filter capacitor 401 can be selected to save the surface mount area of ​​the PCB 102. For example, the thickness of the filter capacitor 401 can be between 0.2mm and 0.35mm, including but not limited to 0.2mm, 0.25mm, or 0.3mm, etc., and is not specifically limited.

[0038] The first device 106 may include one filter capacitor 401 or multiple filter capacitors 401, which is not specifically limited.

[0039] Figure 2 This is a schematic diagram of the PCB structure in the aforementioned chip module. (Example:) Figure 2 As shown, the first device 106, which includes multiple filter capacitors 401, is used as an example for explanation. The PCB 102 has an internal cavity 604, within which multiple filter capacitors 401 are embedded; four are shown in the figure. The filter capacitors 401 are mutually fixed to each other and within the cavity 604 by adhesive filler 603. The filter capacitors 401 are electrically connected to other devices inside and outside the PCB 102 through metal vias 601.

[0040] In another embodiment of this application, a dielectric material is embedded between the upper and lower layers of PCB 102, and the upper layer of PCB 102, the dielectric material, and the lower layer of PCB 102 constitute the first device 106.

[0041] The aforementioned dielectric material can be fixed to the upper and lower metal layers inside the PCB 102 by filling with pure adhesive 603. In this scenario, the upper and lower metal layers inside the PCB 102 can serve as positive and negative electrodes, respectively, and together with the intermediate dielectric material, form the first device 106, which can also achieve a filtering effect.

[0042] In this embodiment, the PCB 102 may include multiple layers, such as 10 to 12 layers, with no specific number of layers limited. The cavity 604 may be located in the middle of the PCB 102, with at least one layer above and at least one layer below. For example, the PCB 102 may include 10 layers, with layers 4 to 6 being cavities; this embodiment does not specifically limit the number of layers.

[0043] In this embodiment of the application, when a cavity 604 is provided within the PCB 102, an isolation layer can be provided within the cavity 604 to prevent signal crosstalk. The isolation layer can be provided in at least one of the following two ways:

[0044] 1) An isolation layer 602 is formed above the cavity 604 by copper pouring to isolate it from the upper layers of the PCB 102. In this case, the isolation layer 602 can prevent signal crosstalk between the first device 106 in the cavity 604 and the signals of the upper layers of the PCB 102.

[0045] 2) A copper-plated isolation layer 602 is formed beneath cavity 604 to isolate it from the underlying layers of PCB 102. See [link / reference] Figure 2 The isolation layer 602 is located below the cavity 604. In this case, the isolation layer 602 can prevent signal crosstalk between the first device 106 in the cavity 604 and the signals of the lower layers in the PCB 102.

[0046] In this embodiment of the application, when a cavity 604 is provided in the PCB 102, a high thermal conductivity material 501 can also be embedded in the cavity 604. The high thermal conductivity material 501 is fixed to the first device 106 in the cavity 604 by filling with pure glue 603. The high thermal conductivity material 501 has metal through holes that are connected to the devices inside and outside the PCB 102. A high-density laser blind hole is provided between the top and bottom of the PCB 102 to realize heat exchange.

[0047] Metal vias can be generated using PCB manufacturing processes such as laser-engraved blind vias or mechanical vias. Metal vias can be located either above, below, or both above and below PCB 102 (e.g., ...). Figure 2 (As shown).

[0048] Because of the high-density laser-drilled blind vias between the top and bottom of PCB 102, rapid heat exchange can be achieved between the top and bottom of the PCB, thereby achieving heat dissipation and improving the heat dissipation effect of the chip module.

[0049] like Figure 3 As shown in the embodiment of this application, a thermally conductive material 103 and a heat dissipation layer 104 can be disposed above the SoC 101 to achieve rapid heat dissipation above the SoC 101. Shielding covers can also be disposed on the top and bottom of the PCB 102, wherein the bottom shielding cover 302 can also have an opening area, and a thermally conductive material 203 can also be disposed on the bottom of the PCB 102, with the thermally conductive material 203 opposite to the opening area.

[0050] In this embodiment, a second device 107 may be disposed in the non-central area at the bottom of the PCB 102. The second device 107 is used for filtering. In this scenario, the chip module includes multiple devices for filtering, specifically including a first device 106 embedded in the PCB 102 and a second device 107 disposed in the non-central area at the bottom of the PCB 102. Using multiple filtering devices can achieve better filtering effects and improve the performance of the chip module.

[0051] In the case where the first device 106 is embedded inside the PCB 102 and the second device 107 is arranged in the non-central area of ​​the bottom, the central area surface of the bottom of the PCB 102 can be free of solder resist ink and expose the copper surface, while the non-central area surface of the bottom of the PCB 102 can be covered with solder resist ink.

[0052] In one embodiment, where a first device 106 is embedded inside the PCB 102 and a second device 107 is arranged in the non-central area at the bottom, a thermally conductive material 203 is also arranged in the central area at the bottom of the PCB 102, and the second device 107 at the bottom of the PCB 102 is located on one or both sides of the thermally conductive material 203.

[0053] In another embodiment, where the first device 106 is embedded inside the PCB 102 and the second device 107 is arranged in the non-central area at the bottom, the chip module also includes a DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) 100, which is soldered in the central area at the bottom of the PCB 102, and the second device 107 at the bottom of the PCB 102 is located on one or both sides of the DDR SDRAM 100.

[0054] like Figure 4 As shown in this embodiment, a DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) 100 can be soldered to the top of the PCB 102. Furthermore, the shielding cover 302 at the bottom of the PCB 102 can have an opening area, and a thermally conductive material 203 is disposed at the bottom of the PCB 102, with the thermally conductive material 203 facing the opening area. In this case, the bottom of the SoC 101 dissipates heat faster than the top, resulting in better bottom heat dissipation.

[0055] like Figure 5 As shown, in Figure 4 Building upon this, with the shielding cover 302 having an opening area, a heat dissipation layer 204 can be provided below the thermally conductive material 203 at the bottom of the PCB 102. The heat dissipation layer 204 can be a metal sheet or a heat-dissipating graphite sheet. In this case, the heat generated by the chip module can be dissipated through the bottom of the PCB 102 via the thermally conductive material 203 and the heat dissipation layer 204, achieving bottom heat dissipation. Furthermore, combined with the heat dissipation from the top by the thermally conductive material 103 and the heat dissipation layer 104 above the SoC 101, a simultaneous top and bottom heat dissipation effect can be achieved, enabling rapid heat dissipation of the SoC 101 and improving the heat dissipation efficiency of the chip module.

[0056] In the embodiments of this application, such as Figure 6 As shown, with a thermally conductive material 103 and a heat dissipation layer 104 disposed above the SoC 101, and shielding covers disposed at the top and bottom, the aforementioned chip module may further include:

[0057] The DDR SDRAM 100 is soldered to the bottom of the PCB 102, inside the bottom shield 302.

[0058] Compared to soldering the DDR SDRAM 100 to the top of the PCB 102, the method of soldering the DDR SDRAM 100 to the bottom of the PCB 102 allows the heat generated by the SoC 101 during operation to be quickly dissipated directly through the thermal conductive material 103 and the heat dissipation layer 104, achieving the effect of rapid heat dissipation from the top and thus improving the heat dissipation efficiency of the SoC 101.

[0059] In one implementation, Figure 6 In the structure shown, a second device 107 for filtering can also be arranged in the non-central area at the bottom of the PCB 102. In this scenario, the first device 106 embedded inside the PCB 102 and the second device 107 arranged in the non-central area at the bottom are both used for filtering. A better filtering effect can be achieved by using multiple filtering devices, thereby improving the performance of the chip module.

[0060] like Figure 7 As shown in the embodiment of this application, when a DDR SDRAM 100 is soldered to the bottom of the PCB 102, a thermal conductive material 203 can also be provided at the bottom of the DDR SDRAM 100, and the shield 302 at the bottom of the PCB 102 has an opening area, with the thermal conductive material 203 opposite to the opening area, so that heat can be dissipated from the bottom through the thermal conductive material 203, thereby increasing the bottom heat dissipation effect.

[0061] like Figure 8 As shown, in Figure 7 Based on this, the diagram also shows the first device 106 embedded in the cavity 604 inside the PCB 102. The functions of each device in the diagram are the same as those described above, and will not be repeated here.

[0062] In this embodiment of the application, the second device 107 soldered to the bottom of the PCB 102 is located on one or both sides of the DDR SDRAM 100. In this way, the first device 106 embedded in the PCB 102 and the second device 107 soldered to the bottom are both used as filter capacitors for filtering, which can increase the capacitance value of the filter capacitor and meet the power supply characteristics.

[0063] One or more filter capacitors 401 may be soldered to one side (e.g., left or right) of the DDR SDRAM 100 on the bottom of the PCB 102, or one or more filter capacitors 401 may be soldered to both sides (e.g., left and right) of the DDR SDRAM 100. This embodiment of the application does not specifically limit this. Figure 8As shown in the figure, a filter capacitor 401 is soldered on the left and right sides of the DDR SDRAM 100 at the bottom of the PCB 102 to increase the capacitance to meet the power supply characteristics.

[0064] In one embodiment of this application, the bottom center area of ​​PCB 102 may be free of solder resist ink, exposing the copper surface. Normally, the surface of PCB 102 is integrally formed and has solder resist ink, which is a non-soldering area where other components are typically not soldered. By removing the solder resist ink, the copper surface of PCB 102 can be exposed, increasing the heat dissipation performance at the bottom.

[0065] like Figure 9 As shown, the area marked 206 on the bottom of PCB 102 is covered with solder resist ink. Since solder resist ink has a very low thermal conductivity, it affects heat dissipation performance. The area marked 205 on the bottom of PCB 102 has had the solder resist ink removed, exposing the copper surface, which can increase heat dissipation performance and improve heat dissipation effect and efficiency.

[0066] like Figure 10 The diagram shown is a rear view of the SoC 101. A DDR SDRAM 100 is soldered to the bottom of the PCB 102. The diagram shows a bottom view, with the SoC 101 obscured by the DDR SDRAM 100. The first device 106 (such as a filter capacitor) embedded in the cavity 604 of the PCB 102 is also obscured by the DDR SDRAM 100. Additionally, multiple surface-mount filter capacitors are soldered to other areas of the PCB 102 to increase capacitance, improving heat dissipation while still meeting power supply requirements.

[0067] In this embodiment, any of the aforementioned thermally conductive materials can be made of materials with high thermal conductivity and strong heat dissipation capacity, such as thermally conductive gel or thermally conductive silicone grease, and the specific method is not limited. Any of the aforementioned heat dissipation materials can be heat sinks or heat dissipation films to conduct heat from high-temperature areas to low-temperature areas, achieving cooling. Any of the aforementioned shielding covers are used to cover components, providing protection and shielding against interference. The aforementioned high thermal conductivity materials can be made of high-temperature ceramics, silicon nitride, copper blocks, or other high thermal conductivity materials. Any of the aforementioned pure adhesives is similar to the PCB dielectric layer material and can be a fiberglass-free epoxy resin-based thermosetting pure adhesive material. The aforementioned cavities are processed for the inner layer of the PCB and can be produced using milling cutters or laser forming methods, and the specific method is not limited.

[0068] The chip module provided in this application embeds a first device for filtering within a PCB. No other components need to be soldered to the bottom of the PCB, allowing for direct bottom heat dissipation and achieving rapid heat dissipation, thus improving the SoC's heat dissipation efficiency. Furthermore, combined with the thermally conductive material and heat dissipation layer above the SoC, top heat dissipation is achieved from both the top and bottom, realizing a bidirectional heat dissipation path and achieving rapid heat dissipation. This significantly improves the SoC's heat dissipation efficiency, thereby enhancing its computing performance and thermal fatigue life. Moreover, embedding the first device within the PCB cavity eliminates the need to stack the first device on the PCB, reducing the overall thickness of the chip module and enabling miniaturized design to meet the requirements of thinness and lightness.

[0069] In this embodiment of the application, a terminal is also provided, which may include a camera and the aforementioned chip module. The chip module can improve the heat dissipation efficiency of the terminal, thereby improving the performance of the terminal.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip module, characterized in that, include: The system-on-a-chip (SoC) (101), the printed circuit board (PCB) (102), and the first device (106) are provided, wherein the first device (106) is used for filtering. The top of the PCB is soldered to the bottom of the SoC (101); The first device (106) is embedded in the PCB (102), and the first device (106) is connected to devices inside and outside the PCB (102) through a metal through hole (601).

2. The chip module according to claim 1, characterized in that, The PCB (102) has a cavity (604) inside, and the first device (106) is fixedly encapsulated in the cavity (604) by filling it with pure glue (603).

3. The chip module according to claim 2, characterized in that, The cavity (604) is also embedded with a high thermal conductivity material (501), which is fixed to the first device (106) by filling with pure glue (603). The high thermal conductivity material (501) has metal through holes that are connected to the devices inside and outside the PCB (102). The PCB (102) has high-density laser-drilled blind vias between its top and bottom to enable heat exchange.

4. The chip module according to claim 1, characterized in that, A dielectric material is embedded between the upper and lower layers of the PCB (102); The upper layer of the PCB (102), the dielectric material, and the lower layer of the PCB (102) constitute the first device (106).

5. The chip module according to any one of claims 1-4, characterized in that, A second device (107) is also arranged in the non-central area at the bottom of the PCB (102), and the second device (107) is used for filtering.

6. The chip module according to claim 5, characterized in that, The bottom center area of ​​the PCB (102) is also provided with thermally conductive material (203); The second device (106) is located on one or both sides of the thermally conductive material (203).

7. The chip module according to claim 5, characterized in that, Also includes: Double data rate synchronous dynamic random access memory (DDR SDRAM) (100) is soldered in the center area of ​​the bottom of the PCB (102); The second device (107) is located on one or both sides of the DDR SDRAM (100).

8. The chip module according to claim 5, characterized in that, The bottom center area of ​​the PCB (102) has no solder resist ink and exposes the copper surface; The non-central area surface of the bottom of the PCB (102) is covered with solder resist ink.

9. The chip module according to claim 1, characterized in that, The first device (106) includes at least one of the following: a passive component and an active component.

10. A terminal, characterized in that, Includes a camera and the chip module as described in any one of claims 1-9.

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