一种压电调谐的麦克风传感器及制作方法

By using a piezoelectrically tuned microphone sensor fabrication method, the problems of low testing accuracy and complex processes of electrostatically driven MEMS optical microphones have been solved, achieving high sensitivity, low noise, and large operating bandwidth, and possessing the advantage of consistent production.

CN120957071BActive Publication Date: 2026-07-17SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
Filing Date
2025-09-25
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing electrostatically driven MEMS optical microphones suffer from low testing accuracy, complex manufacturing processes, and poor consistency in mass production.

Method used

The method for fabricating a microphone sensor using piezoelectric tuning includes forming an etch barrier layer, a diaphragm material layer, a sacrificial layer, a grating material layer, a first electrode material layer, a piezoelectric material layer, and a second electrode material layer on a substrate. A piezoelectric driving structure is formed by etching to control the distance between the grating structure and the diaphragm structure, avoiding the attraction effect caused by electrostatic driving. The grating structure and the diaphragm structure are then integrated through surface processing.

Benefits of technology

It improves the sensitivity and signal-to-noise ratio of the microphone sensor, reduces process complexity, achieves high integration and large operating bandwidth, avoids failures caused by electrostatic control, and has the advantage of mass production consistency.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明提供一种压电调谐的麦克风传感器及制作方法,采用压电驱动实现最优灵敏度调控,不仅具有低噪声、高灵敏度、高集成度和大工作带宽等优点,还可以避免静电调控导致的吸合效应造成失效,有着进一步提高信噪比和工作带宽的优势;另外,采用表面工艺完成光栅结构和振膜结构的一体化制备,无需键合,避免了键合工艺导致的精度对准问题和热应力问题,减小了工艺复杂度,无需后期组装,具有批量化一致性生产优势。
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