A heat dissipation structure for a high-power power supply board used for memory testing

Abstract

This invention relates to the field of power board heat dissipation technology, specifically disclosing a heat dissipation structure for a high-power power board used in memory testing. The structure includes a water-cooled plate installed between a lower and upper circuit board. A housing is installed outside the lower and upper circuit boards, and a circulating water tank is installed outside the housing. The circulating water tank is connected to the water-cooled plate. Two sets of flow channels are formed within the water-cooled plate, corresponding to the lower and upper circuit boards respectively. Several heat dissipation slots are formed at the top and bottom of the water-cooled plate. An exhaust fan is rotatably installed within each heat dissipation slot. Heat dissipation fins are provided within the heat dissipation slots, close to the flow channels. Several air vents are formed on the water-cooled plate, communicating with the heat dissipation slots. During heat dissipation, the exhaust fan draws heat generated on the upper and lower circuit boards into the heat dissipation slots through airflow. The high-temperature airflow contacts the heat dissipation fins, thereby achieving heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of power board heat dissipation technology, and in particular to a heat dissipation structure for a high-power power board used for memory testing. Background Technology

[0002] In the memory testing industry, with the development of DDR (Double Data Synchronous Dynamic Random Access Memory) and HBM (High Bandwidth Memory) related test chips, the chip speed and the number of concurrent tests have also increased, bringing higher speeds, larger currents, and more channel requirements. Whether in wafer testing or in the final testing test equipment, the power provided by traditional power boards is gradually becoming unable to fully meet the needs of high current and the number of concurrent tests for multiple channels. Therefore, it is necessary to develop a high-power power board that can meet these requirements.

[0003] Traditional high-current, multi-channel power supply boards have significant limitations in design and manufacturing. As current output capacity and the number of channels increase, the overall power of the board increases significantly, leading to a sharp increase in heat generation. In this situation, traditional air-cooling methods are insufficient to effectively control the board temperature, resulting in inefficient heat dissipation. Furthermore, because different power devices on the power supply board have different thermal characteristics, the temperature distribution is uneven. Traditional air-cooling solutions typically use a uniform heat dissipation strategy, failing to achieve precise, on-demand heat dissipation control for different temperature zones. This leads to the risk of localized overheating, affecting the board's operational stability and reliability. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a heat dissipation structure for a high-power power board used for memory testing, thereby solving the technical problems of insufficient air cooling capacity and inability to accurately control the temperature of different devices.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A heat dissipation structure for a high-power power supply board used for memory testing includes a water-cooled plate installed between a lower board and an upper board. A housing is installed outside the lower and upper boards, and a circulating water tank is installed outside the housing. The circulating water tank is connected to the water-cooled plate. Two sets of flow channels are formed inside the water-cooled plate, corresponding to the lower and upper boards respectively. Several heat dissipation slots are formed at the top and bottom of the water-cooled plate. An exhaust fan is rotatably installed inside each heat dissipation slot. Heat dissipation fins are provided inside the heat dissipation slots, close to the flow channels. Several vent holes are formed on the water-cooled plate, communicating with the heat dissipation slots.

[0007] As a preferred embodiment of the above technical solution, a connecting column is installed at the open end of the heat dissipation slot, and a heat-conducting seat is provided at the other end of the connecting column. Several sets of turbines are installed in the flow channel, and a speed regulating component is installed between the heat-conducting seat, the turbines and the exhaust fan. The speed regulating component is used to adjust the speed of the exhaust fan.

[0008] As a preferred embodiment of the above technical solution, the speed regulating component includes:

[0009] An airbag, which is installed inside a heat-conducting base;

[0010] A push plate is movably installed inside the heat-conducting seat, and the push plate abuts against the airbag;

[0011] A movable plate extends through and slides within a connecting column. A connecting rod connects the push plate and the movable plate. An elastic element connects the movable plate and the connecting column. The movable plate is U-shaped.

[0012] A universal joint is installed on the exhaust fan, and a conical column is provided on the universal joint;

[0013] The turbine's rotating shaft extends through into the heat dissipation groove. A drive wheel is mounted on the rotating shaft, and the drive wheel abuts against the conical column. Several guide plates are mounted on the rotating shaft, and the drive wheel moves along the guide plates. A U-shaped plate is mounted at the other end of the movable plate, and the drive wheel is fitted inside the U-shaped plate.

[0014] As a preferred embodiment of the above technical solution, the arc surface on the conical cylinder remains vertical.

[0015] As a preferred embodiment of the above technical solution, the opening end of the heat dissipation groove is provided with an inwardly concave conical plate, and a hole is opened at the center of the conical plate, with the connecting column installed at the center of the hole.

[0016] As a preferred embodiment of the above technical solution, an angle adjustment assembly is installed between the movable plate and the exhaust fan, the angle adjustment assembly comprising:

[0017] A sleeve, which is mounted on a conical plate;

[0018] A sleeve plate, which is movably fitted inside a sleeve;

[0019] The sleeve plate is provided with a circular ring plate;

[0020] A pull rod is provided on the annular plate. The fan blades on the exhaust fan are all in a rotating installation state. The other end of the pull rod is connected to the fan blade. The pull rod is used to pull the fan blade to rotate the fan blade, thereby adjusting the tilt angle of the fan blade.

[0021] The device includes a toothed plate 1, a toothed plate 2, and a gear. The sleeve plate is provided with a toothed plate 1, the movable plate is provided with a toothed plate 2, and the conical plate is equipped with a gear. The toothed plate 1 and the toothed plate 2 mesh with the gear.

[0022] As a preferred embodiment of the above technical solution, a telescopic cylinder is movably sleeved on the heat-conducting base, and several elastic elements are connected between the telescopic cylinder and the heat-conducting base.

[0023] As a preferred embodiment of the above technical solution, space is provided at the heat dissipation fins for installing a speed control component, and several through holes are provided on the heat dissipation fins.

[0024] The beneficial effects of this invention are as follows:

[0025] 1. In this invention, during heat dissipation, the flow of cooling water drives the turbine to rotate, which in turn drives the exhaust fan to rotate. The exhaust fan can draw the heat generated on the upper and lower circuit boards into the heat sink through airflow. The high-temperature airflow comes into contact with the heat sink fins, which absorb the heat in the airflow and then transfer the heat to the cooling water flowing in the channel, thereby achieving heat dissipation. After contacting and cooling the heat sink fins, the airflow is discharged into the space between the upper and lower circuit boards and the water-cooled plate through several vents. This allows for airflow circulation, enabling the airflow to carry the generated heat and contact the heat sink fins to achieve heat dissipation. At the same time, the heat of the airflow is absorbed after contacting the heat sink fins, and due to the cold radiation penetration of the cooling water, some heat sink fins are at a low temperature. The airflow temperature decreases after contacting the low-temperature heat sink fins. When the airflow is discharged through the vents, it comes into contact with the components on the upper or lower circuit boards, thereby achieving the purpose of cooling the components. This can further improve the overall heat dissipation efficiency and effect of the upper and lower circuit boards.

[0026] 2. In this invention, the expansion of the airbag is controlled by absorbing heat through the heat-conducting seat. This allows the speed of the exhaust fan at the corresponding position to be adjusted according to the temperature of different components, thereby achieving precise heat dissipation and effectively avoiding local overheating that could damage the circuit board. When the temperature drops, the airbag slowly contracts, and with the rebound capability of the elastic element, the movable plate slowly returns to its original position, thereby causing the drive wheel to slowly return to its original position, which in turn reduces the speed of the exhaust fan.

[0027] 3. In this invention, when the temperature rises, the movable plate drives the drive wheel to move and adjust the speed of the exhaust fan. The movement of the movable plate also drives the second toothed plate to move. Through the cooperation of the gear and the first toothed plate, the sleeve plate drives the ring plate and several pull rods to move away from the exhaust fan. This causes the pull rods to pull the fan blades on the exhaust fan, causing the fan blades to rotate. As a result, the tilt angle of the fan blades becomes larger and larger, which can increase the suction force of the exhaust fan, thereby further accelerating the airflow speed and further improving the heat dissipation efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the cross-sectional structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the cross-sectional structure of the water-cooled plate;

[0030] Figure 3 This is a schematic diagram of a partial water-cooled plate structure;

[0031] Figure 4 This is a schematic diagram of the internal structure of the heat sink;

[0032] Figure 5 This is a schematic diagram of the adjustment group component structure;

[0033] Figure 6 for Figure 4 Enlarged structural diagram at point A in the middle;

[0034] Figure 7 for Figure 4 Enlarged structural diagram at point B;

[0035] Figure 8 A simplified diagram of the board connection relationship;

[0036] Figure 9 A simplified diagram of the water-cooled plate installation method;

[0037] Figure 10 A simplified diagram of the board's functional modules;

[0038] Figure 11 This is a simplified diagram of the output voltage.

[0039] In the picture:

[0040] 1. Upper plate; 2. Lower plate; 3. Outer shell; 4. Water-cooled plate; 41. Flow channel; 411. Heat dissipation slot; 412. Vent; 413. Conical plate; 42. Turbine; 421. Shaft; 4211. Drive wheel; 4212. Guide plate; 43. Heat dissipation fins; 431. Through hole; 44. Circulating water tank; 5. Exhaust fan; 6. Connecting column; 7. Heat conduction seat; 8. Speed ​​control assembly; 81. Airbag; 82. Push plate; 83. Connecting rod; 84. Movable plate; 841. U-shaped plate; 85. Elastic component one; 86. Universal joint; 87. Conical column; 9. Angle adjustment assembly; 91. Sleeve; 92. Sleeve plate; 93. Circular ring plate; 94. Pull rod; 95. Gear plate one; 96. Gear plate two; 97. Gear; 10. Telescopic cylinder; 101. Elastic component two. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] like Figures 1-7 As shown, a heat dissipation structure for a high-power power supply board for memory testing includes a water-cooled plate 4, which is installed between a lower board 2 and an upper board 1. A housing 3 is installed outside the lower board 2 and the upper board 1, and a circulating water tank 44 is installed outside the housing 3. The circulating water tank 44 is connected to the water-cooled plate 4. Two sets of flow channels 41 are opened inside the water-cooled plate 4, which correspond to the lower board 2 and the upper board 1 respectively. Several heat dissipation slots 411 are opened at the top and bottom of the water-cooled plate 4. An exhaust fan 5 is rotatably installed in the heat dissipation slots 411. Heat dissipation fins 43 are provided in the heat dissipation slots 411 and are close to the flow channels 41. Several air vents 412 are opened on the water-cooled plate 4, and the air vents 412 are connected to the heat dissipation slots 411.

[0043] A connecting post 6 is installed at the open end of the heat dissipation slot 411, and a heat conduction seat 7 is provided at the other end of the connecting post 6. Several sets of turbines 42 are installed in the flow channel 41. A speed regulating component 8 is installed between the heat conduction seat 7, the turbines 42 and the exhaust fan 5. The speed regulating component 8 is used to adjust the speed of the exhaust fan 5.

[0044] In one embodiment, the circulating water tank 44 stores cooling water and is equipped with a circulating pump that drives the cooling water flow.

[0045] In practical application, when it is necessary to dissipate heat from the upper board 1 and the lower board 2, the circulating pump in the circulating water tank 44 drives the cooling water to flow along the upper and lower flow channels 41 of the water-cooled plate 4, thereby absorbing the heat generated on the upper board 1 and the lower board 2 and achieving the purpose of heat dissipation.

[0046] Specifically, during heat dissipation, the flow of cooling water drives several sets of turbines 42 to rotate. To ensure uniform heat dissipation, these turbines 42 can be connected together so that their initial rotational speeds are the same. The rotating turbines 42 drive the exhaust fan 5 to rotate. The exhaust fan 5 draws the heat generated on the upper board 1 and lower board 2 into the heat sink 411 through airflow. The high-temperature airflow comes into contact with the heat dissipation fins 43, which absorb the heat from the airflow and then transfer it to the cooling water flowing in the channel 41, thus achieving heat dissipation. The airflow, after contacting and cooling the heat dissipation fins 43, is then discharged back into the upper board 1 through several vents 412. The space between the lower board 2 and the water-cooled plate 4 allows for airflow, enabling the airflow to carry heat and contact the heat dissipation fins 43 for heat dissipation. Simultaneously, the heat of the airflow is absorbed after contacting the heat dissipation fins 43, and due to the cold radiation penetration of the cooling water, some of the heat dissipation fins 43 are kept at a low temperature. The airflow temperature decreases after contacting the low-temperature heat dissipation fins 43. When the airflow exits through the vent 412, it contacts the components on the upper board 1 or the lower board 2, thereby achieving the purpose of cooling the components. This further improves the overall heat dissipation efficiency and effect of the upper board 1 and the lower board 2.

[0047] Furthermore, the speed regulating component 8 includes:

[0048] Airbag 81 is installed inside the heat-conducting base 7;

[0049] Push plate 82 is movably installed inside heat-conducting seat 7, and push plate 82 abuts against airbag 81;

[0050] Movable plate 84 extends through and slides within connecting column 6. A connecting rod 83 connects push plate 82 and movable plate 84. An elastic element 85 connects movable plate 84 and connecting column 6. Movable plate 84 is U-shaped.

[0051] Universal shaft 86, the exhaust fan 5 is equipped with universal shaft 86, and a conical column 87 is provided on universal shaft 86;

[0052] The rotating shaft 421 on the turbine 42 extends through into the heat dissipation slot 411. The rotating shaft 421 is equipped with a drive wheel 4211, which abuts against the conical column 87. The rotating shaft 421 is equipped with several guide plates 4212, and the drive wheel 4211 moves along the guide plates 4212. The other end of the movable plate 84 is equipped with a U-shaped plate 841, and the drive wheel 4211 is fitted inside the U-shaped plate 841.

[0053] The arc surface on the conical cylinder 87 remains vertical.

[0054] In practical application, the rotation of turbine 42 causes shaft 421 to drive drive wheel 4211 to rotate, which in turn drives conical column 87 to rotate, thereby causing universal joint 86 to drive exhaust fan 5 to rotate. When the components on upper board 1 or lower board 2 generate a large amount of heat, the heat from the components is transferred to heat conduction seat 7, and the air bladder 81 inside heat conduction seat 7 will slowly expand. The expanded air bladder 81 will push push plate 82, causing push plate 82 and connecting rod 83 to push movable plate 84 into heat dissipation groove 411. The moving movable plate 84 will drive U-shaped plate 841 to move, thereby causing U-shaped plate 841 to drive drive wheel 4211 to move. In this way, drive wheel 4211 will move towards the area with smaller diameter of conical column 87. When drive wheel 4211 moves to the conical column 87, the diameter of the conical column 87 will be reduced. When the diameter of column 87 is small, since the size of drive wheel 4211 remains unchanged, the transmission ratio between drive wheel 4211 and conical column 87 changes, causing the rotation speed of conical column 87 to increase, thereby increasing the rotation speed of exhaust fan 5. This accelerates airflow and improves heat dissipation efficiency. The expansion of airbag 81 is controlled by heat absorption by heat-conducting seat 7, allowing the rotation speed of exhaust fan 5 at corresponding positions to be adjusted according to the temperature of different components, achieving precise heat dissipation and effectively preventing local overheating that could damage the circuit board. As the temperature drops, airbag 81 slowly contracts, and with the rebound capability of elastic element 85, movable plate 84 slowly returns to its original position, causing drive wheel 4211 to slowly return to its original position, thus reducing the rotation speed of exhaust fan 5.

[0055] Furthermore, the opening end of the heat dissipation groove 411 is provided with an inwardly concave conical plate 413, and a hole is opened at the center of the conical plate 413, and the connecting post 6 is installed at the center of the hole.

[0056] In practical applications, when the high-temperature airflow comes into contact with the cold heat dissipation fins 43, water droplets easily condense on the heat dissipation fins 43. The water droplets in the heat dissipation groove 411 below the water-cooled plate 4 can easily fall onto the lower board 2, causing the components on the lower board 2 to be damaged by water. The conical plate 413 can effectively block the water droplets, thereby effectively preventing the water droplets from falling directly onto the components and causing damage.

[0057] Furthermore, an angle adjustment assembly 9 is installed between the movable plate 84 and the exhaust fan 5. The angle adjustment assembly 9 includes:

[0058] Sleeve 91 is mounted on conical plate 413;

[0059] Sleeve 92 is movably fitted inside sleeve 91;

[0060] An annular plate 93 is provided on the sleeve plate 92;

[0061] Pull rod 94, several pull rods 94 are provided on the annular plate 93, the fan blades on the exhaust fan 5 are all in a rotating installation state, the other end of the pull rod 94 is connected to the fan blade, the pull rod 94 is used to pull the fan blade to rotate the fan blade, thereby adjusting the tilt angle of the fan blade;

[0062] Gear plate 1 95, gear plate 2 96 and gear 97 are provided. Gear plate 1 95 is provided on sleeve plate 92, gear plate 2 96 is provided on movable plate 84, and gear 97 is installed on conical plate 413. Gear plate 1 95 and gear plate 2 96 mesh with gear 97.

[0063] In practical application, when the temperature rises, the movable plate 84 drives the drive wheel 4211 to move and adjust the speed of the exhaust fan 5. The movement of the movable plate 84 also drives the toothed plate 96 to move. Through the cooperation of the gear 97 and the toothed plate 95, the sleeve plate 92 drives the annular plate 93 and several pull rods 94 to move away from the exhaust fan 5. This causes the pull rods 94 to pull the fan blades on the exhaust fan 5, causing the fan blades to rotate. As a result, the tilt angle of the fan blades becomes larger and larger, which can increase the suction force of the exhaust fan 5, thereby further accelerating the airflow speed and further improving the heat dissipation efficiency.

[0064] It should be noted that the rotation range of the fan blades is less than 90°. This is to prevent the fan blades from being in a vertical position, which would prevent the airflow from passing through smoothly and thus prevent the high-temperature airflow from being drawn into the heat dissipation slot 411 for heat dissipation.

[0065] Furthermore, a telescopic cylinder 10 is movably sleeved on the heat-conducting base 7, and several elastic elements 101 are connected between the telescopic cylinder 10 and the heat-conducting base 7.

[0066] In practical application, when installing the upper board 1, lower board 2, and water-cooled plate 4, some components on the upper board 1 and lower board 2 will contact and compress the telescopic cylinder 10. During high-temperature heat dissipation, the expansion of the airbag 81 will generate a reaction force on the heat-conducting seat 7, which then contacts the components through the telescopic cylinder 10. This effectively prevents the heat-conducting seat 7 from compressing the components and causing damage. At the same time, since the upper board 1 and lower board 2 are mostly PCB boards, which may bend and deform under high temperatures, the elasticity of the telescopic cylinder 10 against the components on the upper board 1 and lower board 2 can effectively buffer the force caused by the bending deformation of the upper board 1 and lower board 2 due to heat, thereby further preventing damage to the components under high temperatures.

[0067] Furthermore, space is provided at the heat dissipation fin 43 for installing the speed control component 8, and several through holes 431 are provided on the heat dissipation fin 43.

[0068] In practical applications, the through holes 431 can increase the contact area between the heat dissipation fins 43 and the high-temperature airflow. This can improve the heat absorption effect of the heat dissipation fins 43 and thus improve the heat dissipation efficiency. On the other hand, the through holes 431 can intercept the condensed water droplets and prevent them from coming into contact with the device again with the airflow, thereby further preventing the device from being damaged by water.

[0069] In this application, the reusable and quickly replaceable parts of the power supply board are separated. The reusable part is named the user power supply and control universal board, and the quickly replaceable part is named the power supply unit upper / lower board, namely upper board 1 and lower board 2. Figure 8 The diagram shown is a simplified representation of the connections between the aforementioned boards. The user power supply and control general-purpose board connects to the upper power supply unit board via the upper connector. The two connectors of the upper connector used here are connected using a foldable flexible cable harness. It connects to the lower power supply unit board via the lower connector. The two connectors of the lower connector used here are directly plugged into each other, without the need for a cable harness connection. Figure 8 The outer side shown is the surface where all circuit boards and mechanical components are installed, i.e., the outer shell 3. Only some relatively short capacitors, resistors, etc. are installed on this side of the circuit boards, which is called the mechanical component side. The inner side is the surface where the main components are installed. The water-cooled plate 4 for cold water intake is also placed on this side, which is called the component side.

[0070] like Figure 9 The diagram shows a simplified installation method for the heat sink (water-cooled plate 4). The upper part shows the existing single-board heat sink installation method. The small heat sink on the left is installed above the DC-DC, CPU, and FPGA modules, providing them with separate air cooling. The large heat sink on the right is installed over the DPS chip for heat dissipation. In this application, the single board is divided into three independent boards, with a single large water-cooled plate 4 placed inside. The small heat sinks are removed, resulting in a larger heat dissipation range and higher heat dissipation efficiency. During installation, the two lower boards are first connected via connectors, the bottom mechanical fasteners are installed, and then the water-cooled plate 4 is placed on top. Then, the upper power supply unit board is connected to the lower power supply unit board via a flexible cable harness, covering the water-cooled plate 4. Finally, the upper mechanical fasteners are placed over the entire board structure for secure installation. Compared with the prior art, the design of this application has no changes in the external frame dimensions, and the overall thickness is slightly increased, but it is fully compatible with the slot positions of the boards in the testing equipment.

[0071] like Figure 10 The diagram shown is a simplified representation of the board's functional modules. Below is an introduction to the entire board's functional modules.

[0072] 1. User power control general board:

[0073] This board is a reusable, general-purpose board, mainly used to build a power supply module, a central processing unit module, a control module, and a configuration module. The user power supply and network cable are used to input the internal 48V power and network signal from the test machine into the board. The upper and lower connectors are used to connect the lower and upper power supply unit boards; the upper connector uses a flexible cable harness, while the lower connector is a direct connection.

[0074] 1) Power module

[0075] The 48V power supplied by the external test equipment through the cable interface is converted into various different voltage power supplies to the various modules in the current board and the various modules in the upper / lower boards of the power supply unit.

[0076] 2) Central Processing Unit Module

[0077] It is the CPU module of the entire high-power power supply board. After power-on, it configures the programs of each FPGA, receives instructions from the workstation through the LAN interface and forwards them to each FPGA, and reads back the summary status and test results to the workstation.

[0078] 3) Control Module

[0079] The main control FPGA is the controller of the entire high-power power supply board. After the configuration file is burned, the CPU can send various commands to control the operation of each module.

[0080] 4) Configuration Module

[0081] Configure the FPGA, load the program upon power-up, send the ID to the CPU according to the hardware settings, configure the IP according to the ID, and upgrade the main control FPGA program by configuring the FPGA.

[0082] 2. Power supply unit upper / lower board

[0083] It consists of two identical circuit boards, one above the other. Figure 8 As shown, the components are placed face-to-face to ensure that the connector interfaces on both sides do not interfere with each other. Each board contains an ADC & MUX module, a calibration module, a DPS module, and an output connector.

[0084] 1) Analog-to-digital conversion module

[0085] The analog-to-digital converter module is used to acquire analog signals from the DPS module and perform analog-to-digital conversion.

[0086] 2) Calibration module

[0087] The calibration module calibrates the voltage and current of the output resources on the board to ensure the accuracy and reliability of the output and measurement. The theoretical description of this calibration module is consistent with the content in the previous patent and remains unchanged.

[0088] 3) Power chip module

[0089] It consists of a signal output and measurement module, and an output control module. The signal output and measurement module is a signal output and measurement circuit composed of a DPS chip as the core. It can output signals and also acquire and measure signals. The output control module is used to control the output and measurement of the DPS.

[0090] Unlike previous designs, this time each PSU board can have up to 72 DPS chips when fully configured. The chips are grouped into sets of 36, and the two boards together can have 4 sets of 144 chips. Channels in different sets can be connected in parallel (up to 32 sets of continuous channels can be connected in parallel), enabling output and measurement of current exceeding 2A x 32CH.

[0091] 4) OUT-CON

[0092] The channel output connectors are also divided into upper and lower sections because the PSU board is divided into upper and lower parts. The voltage and current signals from the two PSU boards are output to the subsequent circuits and boards for chip testing through four connectors.

[0093] The following is a description of the main functions of this high-power power supply board.

[0094] 1. High-power power supply board workflow:

[0095] 1) Power-on code loading

[0096] After power-on, the configuration module loads code from the storage unit. Once loading is complete, the CPU loads the program to the main control module through the configuration module.

[0097] 2) Signal output

[0098] The main control module processes the pre-output signal commands, and the FPGA sends the commands to the DPS chip through the upper / lower connector. The DPS chip outputs the corresponding voltage and current signals according to the commands, and then the output control module closes the output relay of the corresponding channel to supply the DPS output signal to the chip under test.

[0099] 3) Signal Measurement

[0100] The DPS chip's output transmits the sampled signal to the analog-to-digital converter module, which performs analog-to-digital conversion on the sampled signal. The converted signal is then transmitted to the main control module. The measurement results are processed and sent to the CPU via the PCIe protocol between the FPGA and the CPU. Finally, the results are output to the workstation for display via the LAN port.

[0101] 2. PSU board output channel switching

[0102] In high-speed chip testing, high power consumption is more frequent and often necessitates the use of fully-equipped PSU boards. However, for testing standard-type chips, using fully-equipped PSU boards is wasteful of resources and increases costs. In this case, we can reduce the number of power supply unit boards by removing one board above or below the power supply unit. This allows for greater flexibility in board usage, enabling switching between different output channels for different chip tests.

[0103] In the full configuration, 144 high-power output channels are used, while in the half configuration, 72 high-power output channels are used. Alternatively, depending on the situation, a board with 136 or 128 channels in the full configuration and 68 or 64 channels in the half configuration can be used. This way, in subsequent board design and iteration processes, we don't need to consider... Figure 10 The left side shows the various modules in the user power control general board. Only the design and channel allocation of the upper or lower power supply unit board on the right side need to be redesigned, which greatly reduces the design and manufacturing costs. Except for the right side board, the rest do not need to be redesigned.

[0104] 3. Switching between DC-DC output voltage and current

[0105] 1) Introduction to Trim Resistors

[0106] During the use of a DC-DC module, the output voltage and current can be adjusted using the Trim resistor, such as... Figure 11 This illustrates the up-adjustment function of the Trim resistor. ±Vout and ±sense are Kelvin four-wire connections. C0 is the decoupling capacitor in the output section, and Rload is the load resistor. Rtrim_up, connected to the positive terminal, is used to pull up the output voltage across the load resistor. However, since the overall power of the DC-DC module remains constant, the current through the load resistor decreases. During up-adjustment, the output power must not exceed the rated output power of the DC-DC module.

[0107] Similarly, if the Trim resistor is connected to the negative terminal, it is used to reduce the voltage across the load resistor and increase the current through the load resistor.

[0108] 2) Use of Trim resistors

[0109] In this entire board, the DC-DC module whose Trim resistor needs adjustment is connected to the PSU output module, which supplies current to the Device. In high-power power supply boards, the PSU module needs to operate at full capacity. However, under full capacity and power, the heat generated at the DC-DC module and PSU chip output terminals increases dramatically, leading to increased cooling requirements. By using Trim down resistors to reduce the output power, and in non-full-channel operation, some DC-DC modules are reduced to below their maximum rated power, ensuring that the overall output power of the board is not excessive and thus prevents overheating.

[0110] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A heat dissipation structure of a high-power power panel for memory test, characterized by, The utility model provides a water cooling board (4) is installed between lower plate card (2) and upper plate card (1), and the shell (3) is installed outside lower plate card (2) and upper plate card (1), and the circulating water tank (44) is installed outside shell (3), the circulating water tank (44) is connected with water cooling board (4), two groups of flow channel (41) are set up in water cooling board (4), and two groups of flow channel (41) correspond lower plate card (2) and upper plate card (1) respectively, and the top and bottom of water cooling board (4) are provided with a plurality of heat dissipation grooves (411), and the heat dissipation grooves (411) are rotatably installed with exhaust fan (5), and the heat dissipation grooves (411) are equipped with heat dissipation fin (43), and the heat dissipation fin (43) is close to flow channel (41), and a plurality of air outlet holes (412) are set up on water cooling board (4), and the air outlet hole (412) is communicated with heat dissipation groove (411), The opening end of heat dissipation groove (411) is installed with connecting column (6), and the other end of connecting column (6) is equipped with heat conduction seat (7), and a plurality of groups of turbine (42) are installed in flow channel (41), and heat conduction seat (7), turbine (42) and exhaust fan (5) are installed with speed regulation assembly (8), and speed regulation assembly (8) is used for adjusting the rotating speed of exhaust fan (5), The speed regulation assembly (8) comprises: Air bag (81), the air bag (81) is installed in heat conduction seat (7), Push plate (82), the push plate (82) is movably installed in heat conduction seat (7), and the push plate (82) is abutted with air bag (81), Movable plate (84), the movable plate (84) is penetrated into connecting column (6) and slides in connecting column (6), and the connecting rod (83) is connected between push plate (82) and movable plate (84), and the elastic member one (85) is connected between movable plate (84) and connecting column (6), and the movable plate (84) is the N type, Universal shaft (86), the universal shaft (86) is installed on exhaust fan (5), and the conical column (87) is arranged on universal shaft (86), The rotating shaft (421) on turbine (42) is penetrated into heat dissipation groove (411), and the driving wheel (4211) is arranged on rotating shaft (421), and the driving wheel (4211) is abutted with conical column (87), and a plurality of guide plates (4212) are arranged on rotating shaft (421), and the driving wheel (4211) moves along guide plate (4212), and the other end of movable plate (84) is provided with N type plate (841), and the driving wheel (4211) is sleeved in N type plate (841).

2. The heat dissipation structure of a high-power power panel for memory test according to claim 1, wherein, The circular arc surface on conical column (87) keeps vertical state.

3. The heat dissipation structure of a high-power power panel for memory test according to claim 1, wherein, The opening end of heat dissipation groove (411) is provided with the conical plate (413) that recesses inward, the hole is set up in the center position of conical plate (413), and connecting column (6) is installed in the center position of hole.

4. The heat dissipation structure of a high-power power panel for memory testing according to claim 3, wherein, The angle adjusting assembly (9) is installed between movable plate (84) and exhaust fan (5), and the angle adjusting assembly (9) comprises: Sleeve (91), the sleeve (91) is installed on conical plate (413), A sleeve plate (92) movably sleeves the sleeve (91); A circular ring plate (93) is arranged on the sleeve plate (92); A plurality of pull rods (94) are arranged on the circular ring plate (93), the fan blades on the exhaust fan (5) are in a rotating installation state, the other end of the pull rod (94) is connected with the fan blade, and the pull rod (94) is used for pulling the fan blade to rotate the fan blade to adjust the inclination angle of the fan blade; A tooth plate one (95), a tooth plate two (96) and a gear (97) are arranged on the sleeve plate (92), the tooth plate two (96) is arranged on the movable plate (84), and the gear (97) is installed on the conical plate (413); the tooth plate one (95) and the tooth plate two (96) are meshed with the gear (97).

5. The heat dissipation structure of a high-power power panel for memory test according to claim 1, wherein, A plurality of elastic members two (101) are connected between the telescopic cylinder (10) and the heat conduction seat (7).

6. The heat dissipation structure of a high-power power panel for memory test according to claim 1, wherein, A space for installing the speed regulating assembly (8) is reserved at the heat dissipation fin (43), and a plurality of through holes (431) are formed in the heat dissipation fin (43).

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