Novel Micro LED product packaging and optical structure

Abstract

The invention discloses a novel Micro LED product packaging and optical structure. The novel Micro LED product packaging and optical structure comprises a packaging module and an optical lens which are matched with each other, the packaging module is composed of an FPCB substrate, a chip assembly and an MOC plastic packaging layer, and a bonding pad of the CMOS chip is conducted with a gold hand of the FPCB substrate through a wire to form an electric loop. The MOC plastic package layer or the packaging adhesive layer is provided with more than three positioning holes in a non-functional area around the LED light-emitting surface; positioning columns matched with the positioning holes are integrally formed at the bottom of the optical lens, accurate positioning is achieved through positioning hole-positioning column, and only gaps are filled with bonding glue. According to the invention, accurate and rapid positioning of the optical lens and the packaging module is realized; adhesive glue distribution is optimized, glue overflowing and insufficient adhesive force are avoided, and optical imaging uniformity is improved; two positioning hole preparation processes are provided, the requirements of batch production and small-batch trial production are met, and the cost is reduced; the overall thickness of packaging and lens assembly is reduced, and the product is light and thin.

Description

Technical Field

[0001] This invention relates to the field of Micro LED display technology, specifically to a novel Micro LED product packaging and optical structure, aiming to solve problems such as positioning difficulties, uncontrolled adhesive application, high costs, and low efficiency in the existing Micro LED product packaging and optical assembly processes, thereby improving product optical performance and production economy. Background Technology

[0002] Micro LED technology, with its advantages of high brightness, high contrast, fast response speed, and long lifespan, has become the core development direction of next-generation display technology. However, the packaging and optical assembly processes of existing Micro LED products still have key technical defects, which seriously restrict their mass production and performance improvement. The specific defects are as follows: 1. Low positioning efficiency: In existing Micro LED packaging structures, the MOC molding layer or encapsulating adhesive layer around the LED light-emitting surface does not have a dedicated positioning structure, which makes it easy for horizontal or vertical displacement to occur when the optical lens is closed. Each optical debugging and verification requires manual repeated movement of the lens to find the optimal imaging position (such as the display center, sharpness peak). The debugging and verification time for a single module usually exceeds 30 minutes, resulting in poor consistency during mass production.

[0003] 2. Adhesive Control Challenges: Optical lenses generally employ a planar bottom design, requiring "closed-loop dispensing" around the lens edge for fixation during assembly. Precise adhesive control is difficult: excessive adhesive overflows onto the LED light-emitting surface, obstructing light propagation and reducing light output efficiency by 10%-15%; insufficient adhesive results in weak adhesion, leading to a lens detachment failure rate exceeding 5% over long-term use; furthermore, uneven adhesive application can cause height differences of 20-30μm at the lens corners, directly compromising optical imaging uniformity.

[0004] 3. Cost and efficiency conflict: The "closed-loop dispensing" process for planar lenses is slow (dispensing time for a single module > 10 seconds), and additional manpower is required to clean the light-emitting surface after glue overflow, with rework costs accounting for 8%-12% of the total cost; at the same time, traditional packaging structures rely on high-precision SMT equipment to achieve lens bonding, and the equipment procurement cost is high during small-batch trial production, making it difficult to meet the rapid verification needs of the R&D stage.

[0005] 4. Redundancy in product thickness: Existing packaging and lens assembly rely on a relatively thick adhesive layer (usually 0.3-0.5mm) to ensure stability. Combined with the MOC molding layer thickness (0.8-1.0mm) and lens thickness (0.5-0.7mm), the overall product thickness exceeds 1.6mm, making it unsuitable for scenarios such as AR glasses and ultra-thin automotive screens that require a thickness of ≤1.2mm.

[0006] To address the aforementioned shortcomings, there is an urgent need for a Micro LED packaging and optical structure that can achieve rapid positioning, optimized adhesive dosage, reduced costs, and a thinner profile. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a novel Micro LED product packaging and optical structure, solving the following core problems: achieving precise and rapid positioning of optical lenses and packaging modules, shortening debugging and verification time; optimizing adhesive distribution, avoiding adhesive overflow and insufficient adhesion, and improving optical imaging uniformity; providing two positioning hole preparation processes to adapt to the needs of mass production and small-batch trial production, reducing costs; and reducing the overall thickness of packaging and lens assembly, achieving product thinning.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A novel Micro LED product packaging and optical structure, comprising a packaging module and an optical lens that cooperate with each other; The packaging module consists of an FPCB substrate, a chip assembly, and an MOC molding compound. The chip assembly includes a CMOS chip and an LED chip fixed to the surface of the FPCB substrate, and the pads of the CMOS chip are connected to the gold fingers of the FPCB substrate through wires to form an electrical circuit. The MOC molding compound covers the outside of the chip assembly, and at least three positioning holes are provided in a specific area around the light-emitting surface of the LED chip. The specific area is a non-functional area that avoids the light-emitting area and the bonding wire area. The bottom of the optical lens is integrally formed with positioning posts. The number and size of the positioning posts match the positioning holes one by one, and the positioning posts can be embedded in the positioning holes to achieve precise positioning and stable sealing of the optical lens and the packaging module. At the same time, the support of the positioning posts optimizes the adhesive distribution between the optical lens and the MOC molding layer.

[0009] In a preferred embodiment, the number of positioning holes is 3-10, and the number of positioning posts is 3-4, which are distributed in a triangular symmetrical manner; the diameter of the positioning holes is 0.6-0.8 mm and the depth is 0.4-0.5 mm, and the diameter of the positioning posts is 0.02-0.03 mm smaller than the corresponding positioning holes, forming a gap fit to allow for the filling of space with compatible adhesive.

[0010] In a preferred embodiment, the positioning hole is prepared using an MOC mold drilling process, specifically including the following steps: S1-1, Design an MOC molding die with a positioning hole molding structure, wherein the molding structure matches the position and size of the preset positioning hole; S1-2, the chip assembly is subjected to die bonding, curing and wire bonding processes to obtain a semi-finished product to be molded into an MOC; S1-3, the semi-finished product is placed into the MOC molding mold and integrally formed through the MOC molding process, so that the positioning hole is formed simultaneously in the MOC molding layer.

[0011] In a preferred embodiment, in steps S1-2, the die bonding material is any one of solder paste, silver paste, epoxy resin, silicone or UV adhesive, and the corresponding curing method is reflow soldering, oven heating and baking or UV curing; the conductor is gold wire, alloy wire or silver wire.

[0012] In a preferred embodiment, the positioning hole is prepared by a 3D printing drilling process on the surface of the encapsulating adhesive, specifically including the following steps: S2-1, After the chip assembly is die bonded and wire bonded, encapsulating adhesive is applied around the light-emitting surface of the LED chip using a dispensing device, and after curing, an encapsulating adhesive layer is formed. S2-2, Based on optical simulation parameters, the positioning hole is formed by printing in a specific area of ​​the encapsulating adhesive layer using a 3D printing device; the resolution of the 3D printing device is not less than 50μm to ensure the dimensional accuracy of the positioning hole.

[0013] In a preferred embodiment, in step S2-1, the encapsulating adhesive is any one of epoxy resin, silicone, or UV adhesive, and the dispensing thickness is 0.4-0.6 mm; the positioning hole formed by 3D printing has the same thickness as the encapsulating adhesive layer to avoid damaging the internal chip components by penetrating the encapsulating adhesive layer.

[0014] In a preferred embodiment, the optical lens is integrally formed by injection molding, and the injection molding material is polycarbonate or acrylic. During the injection molding process, the positioning post is formed synchronously with the optical lens, and the height of the positioning post is consistent with the depth of the positioning hole to ensure that the surface of the optical lens is flat after it is closed.

[0015] In a preferred embodiment, the positioning hole and the positioning post are fixed together by an adhesive, wherein the adhesive is a UV adhesive or a thermosetting adhesive; the adhesive only fills the gap between the positioning hole and the positioning post, and the filling amount is 0.01-0.03. This is to prevent adhesive from overflowing onto the light-emitting surface of the LED chip.

[0016] In a preferred embodiment, the thickness of the MOC molding layer is 0.5-0.8 mm, and the thickness of the optical lens is 0.3-0.5 mm.

[0017] In a preferred embodiment, the optical performance parameters of the product meet the following requirements: brightness uniformity ≥90%, bonding strength between lens and packaging module ≥3N, and viewing angle range ≥120°.

[0018] Due to the application of the above technical solution, the beneficial effects of this application compared with the prior art are as follows: 1. Significantly improved positioning efficiency: The mechanical cooperation of "positioning hole-positioning post" achieves ±10μm level precise positioning, eliminating the need for repeated manual adjustments. The debugging and verification time for a single module is shortened to less than 5 minutes (more than 80% shorter than the traditional structure), and the consistency error during mass production is ≤5μm.

[0019] 2. Significantly optimized optical performance: The positioning post support ensures the flatness of the lens, with a height difference of ≤5μm at the four corners and a brightness uniformity of ≥90%; the adhesive only fills the gaps in the positioning holes, eliminating the risk of adhesive overflow, improving light output efficiency by 10%-15%, and expanding the viewing angle range to ≥120°.

[0020] 3. Balance between cost and efficiency: Two positioning hole processes are adapted to different scenarios - the MOC mold hole-making process is adapted to mass production (reducing the processing cost of a single module by 20%), and the 3D printing hole-making process is adapted to small-batch trial production (no need for customized molds, shortening the R&D cycle by 50%). At the same time, the amount of glue used is reduced by 70%, and the rework rate is reduced to below 0.5%, significantly reducing consumable and labor costs.

[0021] 4. Achievement of product thinness: The thickness of the MOC molding layer is reduced to 0.5-0.8mm, the thickness of the optical lens is 0.3-0.5mm, and the overall thickness after assembly is ≤1.2mm (0.2-0.5mm less than the traditional structure), which can meet the stringent size requirements of AR / VR, ultra-thin automotive screens, etc.

[0022] 5. Improved reliability: The dual fixation of the positioning post and adhesive reduces the lens detachment failure rate to below 0.1%, and the MOC molding layer and encapsulation adhesive layer provide IP65 protection for the chip components, making them suitable for complex environments such as humidity and high temperature. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the novel Micro LED product packaging and optical structure of the present invention; Figure 2 This is another schematic diagram of the novel Micro LED product packaging and optical structure of the present invention; Figure 3 This is a top view of the packaging module of the present invention; Figure 4This is a top view of the optical lens of the present invention; The components include: 1. Packaging module; 2. Optical lens; 3. FPCB substrate; 4. Chip assembly; 5. MOC molding layer; 6. CMOS chip; 7. LED chip; 8. Positioning hole; 9. Positioning post. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0028] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0029] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] Example 1 Please see Figures 1-4 This invention provides a novel Micro LED product packaging and optical structure, employing a collaborative structural design of "packaging module positioning hole + optical lens positioning post," and offering two manufacturing processes for the positioning hole 8. The specific technical solutions are as follows: 1. Core structural design: The Micro LED product packaging and optical structure of this invention mainly consists of two parts: a packaging module 1 and an optical lens 2. The two parts are precisely positioned and stably connected through the cooperation of "positioning hole 8-positioning post 9". The specific structure is as follows: Packaging module 1 includes a flexible printed circuit board (FPCB substrate 3), a chip assembly 4, and an MOC molding layer 5; The FPCB substrate 3 is a flexible substrate with a thickness of 0.1-0.15mm, used to support the chip assembly 4 and realize electrical signal transmission; The chip assembly 4 is fixed on the surface of the FPCB substrate 3, including a CMOS chip 6 (for drive control) and an LED chip 7 (for light emission). The pads of the CMOS chip 6 are connected to the gold fingers of the FPCB substrate 3 through wires (gold wires, alloy wires or silver wires) to form a complete electrical circuit. The MOC molding layer 5 covers the outside of the chip assembly 4 with a thickness of 0.5-0.8mm, and is used to protect the chip assembly 4 from external moisture and dust corrosion. At least three positioning holes 8 are provided in the non-functional area around the light-emitting surface of the LED chip 7 (avoiding the light-emitting area and the bonding wire area). The positioning holes 8 have a diameter of 0.6-0.8mm and a depth of 0.4-0.5mm, and provide a positioning reference for the optical lens 2.

[0032] Optical lens 2: integrally formed by injection molding, the injection molding material is polycarbonate (PC) or acrylic (light transmittance ≥92%), and the lens thickness is 0.3-0.5mm; the bottom of the lens is integrally formed with positioning posts 9, the number and size of the positioning posts 9 are matched one by one with the positioning holes 8 of the packaging module 1, the number of positioning posts 9 is preferably 3-4 (3 are triangularly symmetrically distributed to ensure positioning stability, 4 are rectangularly symmetrically distributed to adapt to large-size lenses), the diameter is 0.02-0.03mm smaller than the corresponding positioning hole 8 (to form a gap fit and be compatible with adhesive filling), and the height is consistent with the depth of the positioning hole 8 (to ensure that the surface of the lens is flat after it is covered, without any height difference).

[0033] 2. Preparation process of positioning hole 8: This invention provides two manufacturing processes for the positioning hole 8, suitable for mass production and small-batch trial production scenarios respectively: Process 1: MOC mold hole-punching process (suitable for mass production); This process utilizes the structural design of the MOC (Metal Oxide Molding) mold to simultaneously form the positioning holes 8 during the molding process, eliminating the need for subsequent secondary processing. The specific steps are as follows: MOC mold design (S1-1): Based on the position of the positioning hole 8 determined by optical simulation (avoiding the light-emitting area and the bonding wire area), design an MOC molding mold with a forming protrusion for the positioning hole 8; the diameter and height of the forming protrusion are consistent with the diameter (0.6-0.8mm) and depth (0.4-0.5mm) of the preset positioning hole 8, respectively, to ensure the dimensional accuracy of the positioning hole 8 after molding.

[0034] Preparation of semi-finished product of packaging module 1 (S1-2): Die bonding: Using a bonding device, the CMOS chip 6 and the LED chip 7 are fixed to the designated positions on the FPCB substrate 3 using a bonding material (any one of solder paste, silver paste, epoxy resin, silicone or UV adhesive). Curing: Select the appropriate curing method according to the type of fixed material. Solder paste is cured by reflow soldering (temperature 240-260℃, time 3-5 minutes), silver paste / epoxy resin is cured by baking in an oven (temperature 120-150℃, time 30-60 minutes), and silicone / UV glue is cured by UV light (wavelength 365nm, time 60-90 seconds). Wire bonding: Using wire bonding equipment, the pads of the CMOS chip 6 are connected to the gold fingers of the FPCB substrate 3. Gold wires with a diameter of 20-25μm are preferred for the wires (for optimal conductivity and reliability), forming a semi-finished product to be molded into an MOC.

[0035] MOC molding (S1-3): The semi-finished product from step S1-2 is placed into the MOC molding mold designed in step S1-1. Epoxy resin molding material is used, and MOC molding is performed at a temperature of 150-160℃ and a pressure of 10-15MPa. After holding the temperature and pressure for 5-8 minutes, the mold is removed, so that the MOC molding layer 5 simultaneously forms the preset positioning holes 8, thus obtaining the encapsulation module 1 with positioning holes 8.

[0036] Process 2: 3D printing hole-punching process on the surface of the encapsulating adhesive (suitable for small-batch trial production). This process involves dispensing and curing an encapsulating adhesive layer, followed by precise 3D printing to create holes. No custom molds are required, making it suitable for rapid verification during the R&D phase. The specific steps are as follows: Preparation of encapsulating adhesive layer (S2-1): Die bonding and wire bonding: The steps are the same as S1-2 of process one, which completes the fixation of chip component 4 on FPCB substrate 3 and the conduction of electrical circuit. Dispensing and curing: Apply encapsulating adhesive (any one of epoxy resin, silicone or UV adhesive) around the light-emitting surface of LED chip 7 using dispensing equipment. The dispensing thickness should be controlled at 0.4-0.6mm (to ensure that the chip assembly 4 is covered without obstructing the light-emitting surface). Curing is performed using the corresponding method (UV adhesive is cured under 365nm ultraviolet light for 60-90 seconds, epoxy resin / silicone is baked at 120℃ for 30 minutes) to form an encapsulating adhesive layer that protects the chip assembly 4.

[0037] 3D printing hole drilling (S2-2): Based on the position, diameter (0.6-0.8mm), and depth (consistent with the thickness of the encapsulation adhesive layer to avoid penetrating and damaging the internal chip) of the positioning hole 8 determined by optical simulation, an SLA-type 3D printing device with a resolution of not less than 50μm is used to print the positioning hole 8 in the non-functional area of ​​the encapsulation adhesive layer; during the printing process, ultraviolet light curing resin is used to assist in the molding process to ensure that the inner wall of the positioning hole 8 is smooth and the dimensional accuracy error is ≤±5μm.

[0038] 3. Assembly and fixing of optical lens 2: Adhesive dotting: Apply adhesive (UV adhesive or thermosetting adhesive) to the positioning holes 8 of the encapsulation module 1, with the filling amount controlled between 0.01-0.03. Only fill the gap between the positioning hole 8 and the positioning post 9 to avoid excess glue overflowing.

[0039] Lens positioning and fitting: Align the positioning post 9 at the bottom of the optical lens 2 with the positioning hole 8 of the packaging module 1 and insert it vertically into the hole; due to the clearance fit between the positioning post 9 and the positioning hole 8 (gap 0.02-0.03mm), quick alignment can be achieved, and the assembly time of a single module is ≤30 seconds.

[0040] Curing and fixing: If UV adhesive is used, curing is completed by irradiation with 365nm ultraviolet light for 60-90 seconds; if thermosetting adhesive is used, curing is completed by baking in an oven at 80-100℃ for 15-20 minutes, ensuring that the adhesion between the lens and the encapsulation module 1 is ≥3N.

[0041] Example 2 This application provides an automotive Micro LED packaging and optical structure based on MOC mold drilling technology, the details of which are as follows: Mold design: Design an MOC molding mold with four rectangular symmetrical positioning holes 8 around the LED light-emitting surface (avoiding the light-emitting area and the bonding wire area). The positioning holes 8 have a diameter of 0.8mm and a depth of 0.5mm. Simultaneously design an injection mold for the optical lens 2. The bottom of the lens has four positioning posts 9 with a diameter of 0.78mm and a height of 0.5mm (with a gap of 0.02mm).

[0042] Packaging module 1 fabrication: Die bonding: The CMOS chip 6 (model XC7K325T) and LED chip 7 (model ES-M100) are fixed to the FPCB substrate 3 (thickness 0.1mm) using silver paste, and then baked in a 120℃ oven for 30 minutes to complete the curing. Wire bonding: Using gold wire bonding equipment, gold wire with a diameter of 25μm is used to connect the CMOS pads to the FPCB gold guide. MOC molding: The semi-finished product is placed into the above mold, and epoxy resin molding material (model EP-828) is used to mold for 6 minutes at 150℃ and 12MPa. After demolding, a packaging module 1 with 4 positioning holes 8 is obtained (MOC molding layer 5 thickness 0.6mm).

[0043] Optical lens 2 fabrication: The optical lens 2 (thickness 0.4mm) is made of polycarbonate (PC) material by injection molding process. The injection temperature is 280℃ and the mold temperature is 80℃. The positioning post 9 is integrally formed with the lens.

[0044] Assembly and Testing: Dispensing: Apply UV adhesive (model UV-301) to the positioning hole 8, with a filling amount of 0.02. ; Covering and curing: Insert the lens positioning post 9 into the positioning hole 8 and cure by irradiating with 365nm ultraviolet light for 80 seconds; Performance testing: brightness uniformity 95%, viewing angle 125°, adhesion force 5N, overall thickness 1.1mm, debugging and verification time 4 minutes, meeting the requirements of in-vehicle display.

[0045] Example 3 This application provides a Micro LED packaging and optical structure for AR glasses based on 3D printing perforation technology, the details of which are as follows: Preparation of encapsulating adhesive layer: Die bonding: The CMOS chip 6 (model XC7A35T) and the LED chip 7 (model ES-M080) are fixed to the FPCB substrate 3 (thickness 0.08mm) using UV adhesive (model UV-601) and cured by irradiation with 365nm ultraviolet light for 70 seconds; Wire bonding: Use 20μm diameter gold wire to connect the CMOS pads to the FPCB gold finger guide; Dispensing and curing: Dispense silicone (model SI-502) to form an encapsulating adhesive layer with a thickness of 0.5mm, and bake at 120℃ for 30 minutes to cure.

[0046] 3D printing hole drilling: Using an SLA 3D printing device with a resolution of 50μm, three positioning holes (0.6mm in diameter and 0.5mm in depth) were triangularly symmetrically printed on the encapsulating adhesive layer. The printing resin used was a UV-curable type (model RS-101).

[0047] Optical lens 2 assembly: Lens fabrication: The lens is injection molded from acrylic material (thickness 0.3mm), with three positioning posts 9 at the bottom, each with a diameter of 0.58mm and a height of 0.5mm. Assembly and curing: Apply thermosetting adhesive (model TS-201) to the positioning hole 8, with a filling amount of 0.01. After embedding the lens, bake at 80℃ for 20 minutes to cure.

[0048] Performance testing: brightness uniformity 92%, viewing angle 120°, adhesion force 3.5N, overall thickness 0.9mm, debugging and verification time 3 minutes, fully adapted to the thinness and optical requirements of AR glasses.

[0049] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A novel Micro LED product packaging and optical structure, characterized in that, This includes mutually compatible packaging modules and optical lenses; The packaging module consists of an FPCB substrate, a chip assembly, and an MOC molding compound. The chip assembly includes a CMOS chip and an LED chip fixed to the surface of the FPCB substrate, and the pads of the CMOS chip are connected to the gold fingers of the FPCB substrate through wires to form an electrical circuit. The MOC molding compound covers the outside of the chip assembly, and at least three positioning holes are provided in a specific area around the light-emitting surface of the LED chip. The specific area is a non-functional area that avoids the light-emitting area and the bonding wire area. The bottom of the optical lens is integrally formed with positioning posts. The number and size of the positioning posts match the positioning holes one by one, and the positioning posts can be embedded in the positioning holes to achieve precise positioning and stable sealing of the optical lens and the packaging module. At the same time, the support of the positioning posts optimizes the adhesive distribution between the optical lens and the MOC molding layer.

2. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The number of positioning holes is 3-10, and the number of positioning posts is 3-4, which are distributed in a triangular symmetrical pattern. The diameter of the positioning holes is 0.6-0.8 mm and the depth is 0.4-0.5 mm. The diameter of the positioning posts is 0.02-0.03 mm smaller than the corresponding positioning holes, forming a gap fit to fill the space with compatible adhesive.

3. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The positioning hole is prepared using an MOC mold drilling process, and the specific steps include: S1-1, Design an MOC molding die with a positioning hole molding structure, wherein the molding structure matches the position and size of the preset positioning hole; S1-2, the chip assembly is subjected to die bonding, curing and wire bonding processes to obtain a semi-finished product to be molded into an MOC; S1-3, the semi-finished product is placed into the MOC molding mold and integrally formed through the MOC molding process, so that the positioning hole is formed simultaneously in the MOC molding layer.

4. The novel Micro LED product packaging and optical structure according to claim 3, characterized in that, In steps S1-2, the die bonding material used is any one of solder paste, silver paste, epoxy resin, silicone or UV adhesive, and the corresponding curing method is reflow soldering, oven heating and baking or UV curing; the conductor is gold wire, alloy wire or silver wire.

5. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The positioning hole is prepared by a 3D printing drilling process on the surface of the encapsulating adhesive. The specific steps include: S2-1, After the chip assembly is die bonded and wire bonded, encapsulating adhesive is applied around the light-emitting surface of the LED chip using a dispensing device, and after curing, an encapsulating adhesive layer is formed. S2-2, Based on optical simulation parameters, the positioning hole is formed by printing in a specific area of ​​the encapsulating adhesive layer using a 3D printing device; the resolution of the 3D printing device is not less than 50μm to ensure the dimensional accuracy of the positioning hole.

6. The novel Micro LED product packaging and optical structure according to claim 5, characterized in that, In step S2-1, the encapsulating adhesive is any one of epoxy resin, silicone or UV adhesive, and the dispensing thickness is 0.4-0.6mm; the positioning hole formed by 3D printing has the same thickness as the encapsulating adhesive layer to avoid damaging the internal chip components by penetrating the encapsulating adhesive layer.

7. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The optical lens is integrally formed by injection molding, and the injection molding material is polycarbonate or acrylic. During the injection molding process, the positioning post is formed synchronously with the optical lens, and the height of the positioning post is consistent with the depth of the positioning hole to ensure that the surface of the optical lens is flat after it is covered.

8. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The positioning hole and the positioning post are fixed together by an adhesive, which is a UV adhesive or a thermosetting adhesive; the adhesive only fills the gap between the positioning hole and the positioning post, and the filling amount is 0.01-0.

03. This is to prevent adhesive from overflowing onto the light-emitting surface of the LED chip.

9. The novel Micro LED product packaging and optical structure according to claim 1, characterized in that, The thickness of the MOC molding layer is 0.5-0.8 mm, and the thickness of the optical lens is 0.3-0.5 mm.

10. The novel Micro LED product packaging and optical structure according to any one of claims 1-9, characterized in that, The optical performance parameters of the product meet the following requirements: brightness uniformity ≥90%, bonding strength between lens and packaging module ≥3N, and viewing angle range ≥120°.

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