Printed circuit board configuration for negative pressure wound therapy device

Abstract

A negative pressure wound therapy system may include a negative pressure source configured to provide negative pressure to a wound covered by a wound dressing via a fluid flow path and to aspirate fluid from the wound. A wound therapy system may include a multi-layer printed circuit board (PCB) supporting a plurality of electronic components including a negative pressure source, the plurality of electronic components including control circuitry configured to control operation of the negative pressure source, and the multi-layer PCB supporting a plurality of traces electrically connecting at least some of the plurality of electronic components. The multi-layer PCB may include a first layer joined with a second layer to reduce gas leakage in a fluid flow path.

Description

Technical Field

[0001] The embodiments described herein relate to devices, systems, and methods for treating wounds (e.g., treating wounds using a combination of dressings and negative pressure wound therapy). Background Technology

[0002] The use of negative pressure to treat open or chronic wounds that are too large to close spontaneously or otherwise fail to heal is well known in the art. Currently known negative pressure wound therapy (“NPWT”) systems typically involve placing a fluid-impermeable or semi-permeable covering over the wound, sealing the covering to the patient’s tissue surrounding the wound using various means, and connecting a negative pressure source (such as a vacuum pump) to the covering in a manner that generates and maintains negative pressure beneath it. Such negative pressure is believed to promote wound healing by facilitating granulation tissue formation at the wound site and aiding the body’s normal inflammatory processes while removing excess fluid that may contain harmful cytokines and / or bacteria. However, further improvements to NPWT are needed to fully realize the therapeutic benefits. Summary of the Invention

[0003] A negative pressure wound therapy system may include a negative pressure source configured to provide negative pressure to a wound via a fluid flow path and to aspirate fluid from the wound. The system may include an electronic control circuitry configured to control the operation of the negative pressure source. The system may include a multilayer printed circuit board (PCB) having at least a first layer connected to a second layer to reduce gas leakage in the fluid flow path. At least one of the first or second layer may support a plurality of electronic components including the negative pressure source and the electronic control circuitry, and a plurality of traces electrically connecting at least some of the plurality of electronic components. The multilayer PCB may include at least one electrical connection between the first and second layers.

[0004] The negative pressure wound therapy system described in any of the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features: The system may include a gasket positioned between the negative pressure source and the multilayer PCB and configured to provide a seal to prevent or reduce leakage in one or more of the fluid flow paths. The portion of the multilayer PCB facing the gasket may not include any traces. The portion of the multilayer PCB facing the gasket may not include any holes other than one or more orifices configured to discharge gas drawn from the negative pressure source.

[0005] The negative pressure wound therapy system described in any of the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features: The multilayer PCB may be a flexible printed circuit board. The first and second layers may be at least partially adhered to each other using an adhesive. At least some areas of the first and second layers may be adhered without the adhesive.

[0006] Any of the negative pressure wound therapy systems described in the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features: At least one of the first or second layers may include a transparent portion. The multilayer PCB may support a light source positioned adjacent to the portion. The portion may be adhesive-free to allow light emitted by the light source to transmit through the multilayer PCB. The portion may be configured as an optical filter for the light emitted by the light source. The portion may include a mask configured to filter the light emitted by the light source. The light source may include a light-emitting diode mounted to the first layer of the multilayer PCB.

[0007] Any of the negative pressure wound therapy systems described in the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features: The first layer may include one or more discontinuities. Conductive material of at least one of the first or second layers may be removed from one or more discontinuities. The second layer may be adhered to the first layer complementary to one or more discontinuities of the first layer. The one or more discontinuities of the first layer may include discontinuities that physically and electrically isolate an insulating portion of the first layer from adjacent portions of the first layer. The insulating portion of the first layer may support one or more of the plurality of traces. The insulating portion of the first layer may be configured to fold away from the second layer to connect the one or more traces to one or more of the plurality of electronic components. The insulating portion of the first layer may be configured to connect the one or more traces to the negative pressure source. The insulating portion may include a flexible connector. One or more of the plurality of traces may be physically isolated from discontinuities in the multilayer PCB to prevent fluid ingress between the first and second layers.

[0008] The negative pressure wound therapy system described in any of the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features. The system may include a wound dressing configured to be positioned above the wound. The wound dressing may support the negative pressure source and the multilayer PCB.

[0009] This document discloses methods for operating negative pressure wound therapy systems described in any of the preceding paragraphs and / or methods for any of the systems, devices, or equipment disclosed herein.

[0010] Medical treatment or monitoring systems may include treatment or monitoring devices. The system may include an electronic control circuitry configured to control the operation of the treatment or monitoring device. The system may include a multilayer printed circuit board (PCB) having at least a first layer connected to a second layer. At least one of the first or second layer may support a plurality of electronic components including the treatment or monitoring device, and a plurality of traces electrically connecting at least some of the electronic components. The multilayer PCB may include at least one electrical connection between the first and second layers.

[0011] Any medical treatment or monitoring system described in any of the preceding paragraphs and / or any of the systems, devices, or apparatuses disclosed herein may include one or more of the following features: The multilayer PCB may include one or more discontinuities in which conductive material of at least one of the first or second layers has been removed. The one or more discontinuities may facilitate the flexibility of the multilayer PCB. The region of the multilayer PCB supporting the treatment or monitoring device may not include any traces. The multilayer PCB may support a light source positioned adjacent to a transparent portion of the multilayer PCB. The transparent portion may not include adhesive to allow light emitted by the light source to transmit through the multilayer PCB. The transparent portion may include a mask configured to filter the light emitted by the light source.

[0012] This document discloses methods for operating medical treatment or monitoring systems of any of the preceding paragraphs and / or methods for any of the systems, devices or equipment disclosed herein.

[0013] Any feature, component, or detail of any arrangement or embodiment disclosed in this application, including but not limited to any device embodiment and any negative pressure wound therapy embodiment disclosed herein, may be interchangeably combined with any other feature, component, or detail of any arrangement or embodiment disclosed herein to form new arrangements and embodiments. Attached Figure Description

[0014] Figure 1A-1C A wound dressing is shown, which incorporates a negative pressure source and / or other electronic components within the wound dressing;

[0015] Figure 2A-2B An electronic device unit that may be incorporated into a wound dressing is shown;

[0016] Figure 3It is an exploded perspective view of an electronic device assembly in which electronic device units are encapsulated within a housing;

[0017] Figure 4A It shows Figure 3 Bottom perspective view of the electronic component assembly;

[0018] Figure 4B It shows Figure 3 Top perspective view of the electronic component assembly;

[0019] Figure 5A This is an exploded view of a wound dressing that includes electronic components within the wound dressing layer;

[0020] Figure 5B A cross-sectional layout of the material layers of a wound dressing that includes electronic components within the dressing is shown.

[0021] Figure 6 A multilayer printed circuit board for an electronic device unit is shown;

[0022] Figure 7 It shows a device filled with electronic components. Figure 6 Multilayer printed circuit boards;

[0023] Figures 8A-8D The assembly of the electronic device unit is shown;

[0024] Figure 9 The assembled electronic device unit is shown; and

[0025] Figure 10 A folded printed circuit board is shown. Detailed Implementation

[0026] Overview

[0027] The embodiments disclosed herein relate to devices and methods for treating wounds under decompression, including negative pressure sources and wound dressing components and devices. These devices and components (including, but not limited to, wound coverings, backing layers, overlays, drapes, sealing layers, spacers, absorbent layers, delivery layers, wound contact layers, filler materials, fillers, and / or fluid connectors) are sometimes collectively referred to herein as dressings.

[0028] It should be understood that the term "wound" is used throughout this instruction manual. It should be understood that the term "wound" should be interpreted broadly to include and encompass both open and closed wounds where the skin is torn, cut, or punctured, or where trauma has caused contusion, or any other surface or other condition or defect on the patient's skin, or those wounds that have benefited from decompression therapy. Therefore, a wound is broadly defined as any area of ​​damaged tissue where fluid may or may not be produced. Examples of such wounds include, but are not limited to, abdominal wounds or other large or open wounds that result from surgery, trauma, sternotomy, fasciotomy, or other conditions, lacerations, acute wounds, chronic wounds, subacute and lacerated wounds, traumatic wounds, flaps and skin grafts, lacerations, abrasions, contusions, burns, diabetic ulcers, pressure ulcers, stomas, surgical wounds, traumatic ulcers, and venous ulcers.

[0029] It should be understood that the embodiments of this disclosure are generally applicable to use in NPWT or local negative pressure (“TNP”) therapy systems. In simple terms, negative pressure wound therapy helps close and heal various forms of “refractory” wounds by: reducing tissue edema; promoting blood flow and granulation tissue formation; removing excess exudate and reducing bacterial load (and thus reducing the risk of infection). Additionally, this therapy allows for less disturbance to the wound, resulting in faster healing. TNP therapy systems can also aid in the healing of surgically closed wounds by removing fluid and by helping to stabilize tissue immediately adjacent to the closure site. Another beneficial use of TNP therapy can be found in grafts and flaps, where removing excess fluid is important and the graft needs to be close to the tissue to ensure tissue viability.

[0030] As used herein, a decompression level or negative pressure level (such as -X mmHg) represents a pressure level relative to normal ambient atmospheric pressure, which may correspond to 760 mmHg (or 1 atm, 29.93 inHg, 101.325 kPa, 14.696 psi, 1013.25 mbar, etc.). Therefore, a negative pressure value of -X mmHg reflects an absolute pressure X mmHg lower than 760 mmHg, or in other words, an absolute pressure of (760-X) mmHg. Furthermore, a negative pressure "lower" or "smaller" than X mmHg corresponds to a pressure closer to atmospheric pressure (e.g., -40 mmHg is lower than -60 mmHg). A negative pressure "higher" or "larger" than -X mmHg corresponds to a pressure further away from atmospheric pressure (e.g., -80 mmHg is higher than -60 mmHg). In some cases, a local ambient atmospheric pressure is used as a reference point, which does not necessarily have to be, for example, 760 mmHg.

[0031] The negative pressure range can be approximately -80 mmHg, or between approximately -20 mmHg and -200 mmHg. Note that these pressures are relative to normal ambient atmospheric pressure, which can be 760 mmHg. Therefore, -200 mmHg would practically be approximately 560 mmHg. In some cases, the pressure range can be between approximately -40 mmHg and -150 mmHg. Alternatively, pressure ranges up to -75 mmHg, up to -80 mmHg, or above -80 mmHg can be used. Additionally, in some cases, pressure ranges below -75 mmHg can be used. Alternatively, the negative pressure equipment can supply pressure ranges above approximately -100 mmHg or even -150 mmHg.

[0032] The systems and methods disclosed herein relate to the use of wound dressings. Wound dressings may include one or more electrical components to provide therapeutic functions to a wound. To provide therapeutic functions, the wound dressing may be connected to a control circuitry system that causes the wound dressing to perform wound therapy (e.g., TNP therapy, ultrasound therapy, compression therapy, phototherapy, etc.). The control circuitry system can drive the wound dressing by providing drive signals to the wound dressing to cause it to perform wound therapy.

[0033] wound dressing

[0034] The negative pressure source (such as a pump) and some or all other components of the TNP system can be integrated with the wound dressing. These other components include, for example, multiple power supplies, multiple sensors, multiple connectors, multiple user interface components (such as multiple buttons, multiple switches, multiple speakers, multiple screens, etc.). Material layers may include a wound contact layer, one or more absorbent layers, one or more transport or spacer layers, and a backing or covering layer that covers one or more absorbent layers and transport or spacer layers. The wound dressing can be placed over and sealed to the wound, with the pump and / or other electronic components housed beneath the covering layer within the wound dressing. The dressing may be supplied as a single article, wherein all wound dressing elements (including the pump) are pre-attached and integrated into a single unit. Figure 1A-1C As shown, the periphery of the wound contact layer can be attached to the periphery of the covering layer that encapsulates all wound dressing elements.

[0035] The pump and / or other electronic components may be configured to be positioned adjacent to or immediately adjacent to the absorbent and / or transport layers, such that the pump and / or other electronic components remain part of a single article to be applied to the patient. The pump and / or other electronic components may be positioned remotely from the wound site. Although certain features disclosed herein can be described as relating to systems and methods for controlling the operation of a negative pressure wound therapy system in which the pump and / or other electronic components are positioned in or on a wound dressing, the systems and methods disclosed herein are applicable to any negative pressure wound therapy system or any medical device. Figure 1A-1C A wound dressing is shown, which incorporates a negative pressure source and / or other electronic components within the wound dressing. Figure 1A-1C A wound dressing 100 is shown in which the pump and / or other electronic components are positioned away from the wound site. The wound dressing may include an electronics region 161 and an absorbent region 160. The dressing may include a wound contact layer 110. Figure 1A-1B (not shown in the image), and water vapor permeable to the membrane, overlay, or backing layer 113 positioned above the contact layer and other layers of the dressing. (e.g.) Figure 1A-1C As shown, the wound dressing layer, as well as the components of the electronic device area and the absorption area, can be covered by a continuous covering layer 113.

[0036] A porous material layer 111 may be located above the wound contact layer 110. As used herein, the terms porous material, spacer, and / or transport layer may be used interchangeably to refer to a material layer in a dressing configured to distribute negative pressure throughout the wound area. This porous layer or transport layer 111 allows fluids, including liquids and gases, to be transported away from the wound site to the upper layer of the wound dressing. Specifically, the transport layer 111 preferably ensures that open air channels are maintained to deliver negative pressure over the wound area even when the absorbent layer has absorbed a considerable amount of exudate. Layer 111 should preferably remain open under the typical pressure that will be applied during negative pressure wound therapy as described above, so that the entire wound site is subjected to uniform negative pressure. Layer 111 may be formed of a material having a three-dimensional structure. For example, knitted or woven spacer fabrics (e.g., Baltex 7970 weft-knitted polyester) or nonwoven fabrics may be used.

[0037] In addition, one or more absorbent layers (such as layers 122, 151) can be used to absorb and retain exudate aspirated from the wound. Superabsorbent material can be used in absorbent layers 122, 151. One or more absorbent material layers 122, 151 can be disposed above transport layer 111. Since each of the absorbent layers experiences negative pressure during use, the material of the absorbent layer can be selected to absorb liquid under these conditions. Absorbent layers 122, 151 may include composites comprising superabsorbent powder, fibrous materials such as cellulose, and bound fibers. The composite may be an air-laid thermally bonded composite.

[0038] Electronics area 161 may include a negative pressure source (such as a pump) and some or all other components of a TNP system that can be integrated with the wound dressing, such as power supplies, sensors, connectors, user interface components (such as buttons, switches, speakers, screens, etc.), etc. For example, electronics area 161 may include buttons or switches. Figure 1A-1B (The image shown is covered by a pull tab). A button or switch can be used to operate the pump (such as turning the pump on / off).

[0039] The electronic component region 161 of the dressing may include one or more transport or spacer material layers and / or absorbent material layers, and electronic components may be embedded within one or more transport or spacer material layers and / or absorbent material layers. The transport or absorbent material layers may have recesses or cutouts to embed the electronic components internally while providing a structure to prevent collapse. Figure 1C As shown, recesses 128 and 129 can be disposed in absorption layers 151 and 122, respectively.

[0040] As used herein, the upper layer, top layer, or overlying layer refers to the layer furthest from the surface of the skin or wound when the dressing is in use and positioned above the wound. Therefore, the lower surface, lower layer, bottom layer, or underlying layer refers to the layer closest to the surface of the skin or wound when the dressing is in use and positioned above the wound. Additionally, these layers may have a proximal side facing the wound, referring to the side or face of the layer closest to the skin or wound, and a distal side, referring to the side or face of the layer furthest from the skin or wound.

[0041] The capping layer may include a cut 172 positioned above at least a portion of an opening 128 in the absorbent layer 122 to allow access to and fluid communication with at least a portion of the absorbent layers 122 and 151, the transport layer 111, and the underlying wound contact layer 110. Electronic device assemblies, such as those described below, may be positioned in the openings 128, 129, and 172 of the first absorbent material 151, the second absorbent material 122, and the capping layer 113. (See reference...) Figure 3 and 6 As described in -7, electronic device components may include pumps, power supplies, and printed circuit boards.

[0042] Prior to use, the dressing may include one or more delivery layers 146 adhered to the bottom surface of the wound contact layer 110. Delivery layers 146 may cover adhesive or openings on the bottom surface of the wound contact layer 110. Delivery layers 146 may provide support for the dressing and may facilitate sterile and proper placement of the dressing over the patient's wound and skin. Delivery layers 146 may include a handle that can be used by the user to detach the delivery layer 146 from the wound contact layer 110 before applying the dressing to the patient's wound and skin.

[0043] Electronic components included in wound dressings

[0044] Figure 2A-2B An electronic device unit 267 that may be incorporated into a wound dressing is shown. Figure 2A A top view of the electronic device unit is shown. Figure 2B The bottom or wound-facing surface of the electronic device unit is shown. The electronic device unit 267 may include a pump 272 and one or more power sources 268, such as a battery. The electronic device unit 267 may include a circuit board 276 configured to be electrically connected to the pump 272 and / or the power source 268. The circuit board 276 may be flexible or substantially flexible.

[0045] like Figure 2A As shown, the electronic device unit 267 may include a single button or switch 265 on the upper surface of the unit. The single button or switch 265 can be used as an on / off button or switch to stop and start the operation of the pump and / or electronic components. The electronic device unit 267 may also include one or more vents or exhaust ports 264 on the circuit board 276 for discharging air discharged from the pump. Figure 2B As shown, pump outlet discharge mechanism 274 (sometimes referred to as pump discharge mechanism or pump outlet mechanism) can be attached to the outlet of pump 272.

[0046] like Figure 2B As shown, the electronic device unit 267 may include a pump inlet protection mechanism 280 positioned on the portion of the electronic device unit closest to the absorbent area and aligned with the inlet of the pump 272. The pump inlet protection mechanism 280 is positioned between the pump inlet and the absorbent area or absorbent layer of the dressing. The pump inlet protection mechanism 280 may include a hydrophobic material to prevent fluid from entering the pump 272. The pump inlet protection mechanism 280 (or any inlet protection mechanism disclosed herein) may include a filter.

[0047] The upper surface of the electronic device unit 267 may include one or more indicators 266 for indicating the condition of the pump and / or the pressure level within the dressing. The indicators may be small LED lights or other light sources visible through the dressing component. As will be discussed herein, the dressing component may be at least partially transparent or translucent, such that the indicators(s) are visible without any openings in the dressing component. The indicators may be green, yellow, red, orange, or any other color. For example, two lights may be present, one green and one orange. The green light indicates that the device is functioning normally, and the orange light indicates that there is a problem with the pump (such as leakage, dressing saturation level, blockage downstream of the pump, vent blockage, low battery, etc.). In some embodiments, the indicators may have a monochromatic color (such as a white LED), wherein each indicator is visible through a colored mask used as an optical filter to produce light emission of various colors.

[0048] Power supply 268 may be electrically connected to circuit board 276. One or more power connectors are connected to the surface of circuit board 276. Circuit board 276 may have other electronic devices included therein. For example, circuit board 276 may support various sensors, including but not limited to one or more pressure sensors, temperature sensors, optical sensors and / or cameras, and / or saturation indicators.

[0049] Figure 3 An electronic device assembly 300 is shown, in which electronic device units are encapsulated within a housing. For example... Figure 3 As shown, the housing of the electronic device assembly 300 may include a plate 301 and a flexible membrane 302 encapsulating the electronic device unit 303 therein. The electronic device unit 303 may include a pump 305, an inlet protection mechanism 310, a pump discharge mechanism 306, a power supply 307, and a circuit board 309. The circuit board 309 may be flexible or substantially flexible.

[0050] As shown, the pump discharge mechanism 306 can be a housing such as a chamber. The electronic unit 303 and the pump 305 can be used without the inlet protection mechanism 310. However, the pump discharge mechanism 306 and the pump 305 can be located within an extended housing 316.

[0051] The flexible membrane 302 can be attached to the plate 301 to form a fluid-impermeable seal and enclosure around the electronic components. The flexible membrane 302 can be attached to the periphery of the plate by thermal welding, adhesive bonding, ultrasonic welding, RF welding, or any other attachment or bonding technology.

[0052] The flexible membrane 302 may include an aperture 311. The aperture 311 allows the inlet protection mechanism 310 to be in fluid communication with the absorbent layer and / or transport layer of the wound dressing. The periphery of the aperture 311 of the flexible membrane 302 may be sealed or attached to the inlet protection mechanism 310 to form a fluid-impermeable seal and closure around the inlet protection mechanism 310, allowing the electronic component 303 to remain protected from fluids within the dressing. The flexible membrane 302 may be attached to the periphery of the inlet protection mechanism 310 by thermal welding, adhesive bonding, ultrasonic welding, RF welding, or any other attachment or bonding technique. The inlet protection mechanism 310 prevents wound exudate or fluid from the wound and collected in the absorbent area 160 of the wound dressing from entering the pump and / or electronic component of the electronic device assembly 300.

[0053] As described in this article, Figure 3 The electronic component 300 shown may be included within the wound dressing such that once the dressing is applied to the patient's body, air from within the dressing can be pumped out through the inlet protection mechanism 310 toward the pump discharge mechanism 306, which communicates with the orifices in the housing 316 and the circuit board 309.

[0054] Figure 4A -B shows the reference Figure 3 The description similarly includes an electronic component assembly 400 of a pump inlet protection mechanism 410 sealed to the outside of a flexible membrane 402. An emission mechanism 406, which may be similar to an emission mechanism 306, is also shown.

[0055] Figure 4A The lower surface of the electronic device assembly 400 facing the wound is shown. Figure 4B The upper surface of a plate 401 of an electronic device assembly 400 (which may face the patient or user) is shown. The upper surface of plate 401 may include an on / off switch or button cover 443 (shown as a pull tab), an indicator 444, and / or one or more ventilation holes 442. Removal of the pull tab 443 may activate the electronic device assembly 400, such as by supplying power from a power source to the electronic device assembly. Further details of the operation of the pull tab 443 are described in PCT International Application No. PCT / EP2018 / 079745, filed October 30, 2018, entitled “Safety Operation of Integrated Negative Pressure Wound Treatment Apparatus,” which is incorporated herein by reference in its entirety.

[0056] like Figure 1C As shown, an electronic component assembly 400 having a pump inlet protection mechanism 410 extending from and sealing the membrane 402 can be positioned within an orifice 172 in the cover layer 113 and the absorber layers (122, 151). Figure 1C As shown and referred to in this document Figures 5A-5B In more detail, the periphery of the electronic component assembly 400 can be sealed to the top surface of the outer periphery of the orifice 172 in the cover layer 113. The electronic component assembly 400 can be sealed to the cover layer 113 using gaskets, adhesives, thermal welding, adhesive bonding, ultrasonic welding, RF welding, or any other attachment or bonding technique. The electronic component assembly 400 can be permanently sealed to the cover layer 113 and cannot be removed from the cover layer without damaging the dressing.

[0057] The electronic component assembly 400 can be used in a single dressing and disposed of with the dressing. In other cases, the electronic component assembly 400 can be used in a series of dressings.

[0058] Figure 5A This illustrates a wound dressing that includes an electronic component 500 within a wound dressing layer 590, such as... Figure 1C Wound dressings. Figure 5B It shows including Figure 5AA cross-sectional view of a wound dressing with an electronic component assembly. The electronic component assembly 500 may be disposed within orifices 172 in a cover layer and within orifices 129 and 128 in a first absorbent layer 122 and a second absorbent layer 151. The electronic component assembly 500 may be sealed to the outer periphery of the orifices 172 in the cover layer. The dressing may include a wound contact layer 110, and a water vapor permeable membrane, cover layer, or backing layer 113 positioned above the contact layer 110 and other layers of the dressing. A porous material layer 111 may be located above the wound contact layer 110. As used herein, the terms porous material, spacer, and / or transport layer may be used interchangeably to refer to a material layer in a dressing configured to distribute negative pressure throughout the wound area. This porous layer or transport layer 111 allows fluids, including liquids and gases, to be transported away from the wound site to the upper layers of the wound dressing. Additionally, one or more absorbent layers (such as layers 122, 151) may be utilized for absorbing and retaining exudate aspirated from the wound. One or more absorbent material layers 122, 151 may be disposed above the delivery layer 111. A small-aperture absorbent layer 151 and a large-aperture absorbent layer 122 may be present. The small-aperture absorbent layer 151 may be positioned above the large-aperture absorbent layer 122. In some cases, the small-aperture absorbent layer 151 may be positioned below the large-aperture absorbent layer 122. Before use, the dressing may include one or more delivery layers 146 adhered to the bottom surface of the wound contact layer. The delivery layers 146 may cover the adhesive or openings on the bottom surface of the wound contact layer 110.

[0059] Multilayer printed circuit boards

[0060] Positioning any of the electronic components or units disclosed herein on a wound dressing can be challenging, at least because one or more electronic components are potentially exposed to fluids (such as wound exudate) aspirated from and absorbed by the wound dressing. Consequently, protecting the electronic components from liquid intrusion is important. Another challenge is eliminating or reducing any leakage in the fluid flow path used to aspirate fluid from the wound, where the fluid flow path includes the electronic components. Potential leakage paths may be introduced via holes, programming pins, or PCB features such as folded lines or cutouts. Leakage formation can adversely affect power capacity and the continuous delivery of negative pressure wound therapy. Yet another challenge is reducing the size of the electronic components to fit within the wound dressing. These and other challenges can be addressed through one or more designs disclosed herein.

[0061] In some embodiments, any of the electronic device components or units disclosed herein may include one or more multilayer printed circuit boards (PCBs) supporting one or more electronic components. Figure 6A multilayer PCB 600 is shown that can be utilized by any of the devices or systems described herein. For example, the multilayer PCB 600 may be part of an electronic device unit 267. The multilayer PCB 600 may be a double-layer PCB having an upper (or top) layer 605a and a lower (or bottom) layer. Figures 8A-8B (As shown in the diagram). The designation of the layers as upper and lower layers is relative, and in some cases, layer 605a may be referred to as the lower layer and layer 605b as the upper layer. The upper and lower layers of the multilayer PCB 600 may be bonded together by an adhesive (such as glue). In some cases, one or more intermediate PCB layers may be provided between the upper layer 605a and the lower layer 605b to increase the density of one or more electronic components.

[0062] The lower layer 605a and the upper layer 605b may include a conductive material such as copper. As described herein, the upper layer 605a of the PCB 600 may include one or more discontinuities 608 at which at least one of the upper layer 605a or the lower layer 605b is removed. For example, conductive material of at least one of the upper layer 605a or the lower layer 605b may be removed to form one or more discontinuities 608. This one or more discontinuities 608 may provide flexibility and may protect electronic components positioned on the PCB 600 from displacement, bending, or breakage due to patient movement. For example, as Figure 7 As shown, one or more discontinuities 608 may be formed around the pump 272 or the power supply 268. This facilitates the maintenance of negative pressure wound therapy and prevents short circuits. One or more discontinuities 608 may be covered with a tape (such as a Kapton tape).

[0063] As described herein, an additional adhesive may be disposed near one or more discontinuities 608 between the upper layer 605a and the lower layer 605b to maintain an airtight seal. In some embodiments, the adhesive is not disposed in the areas of one or more discontinuities because at least one of the upper layer 605a or the lower layer 605b has been removed in these areas.

[0064] The multilayer PCB 600 can be flexible to improve patient comfort when a wound dressing supporting the multilayer PCB 600 is applied to the wound site. Each of layers 605a and 605b can be made of a flexible material. The layers in the multilayer PCB can be made of a dielectric polymer such as polyimide. The multilayer PCB 600 and the individual layers 605a, 605b can be thin to provide a high degree of flexibility for the multilayer PCB.

[0065] The multilayer PCB 600 can support multiple electronic components 610, including those described herein (such as references to...). Figure 2A-2BThis refers to any electronic component discussed. Electronic components may include one or more of capacitors, resistors, transistors, pressure sensors, temperature sensors, etc. At least some of the electronic components may be thin components and can be mounted to a PCB 600 using surface mount technology (SMT). See reference... Figure 7 The additional hardware device can be installed on the multilayer PCB 600 (e.g., on the upper PCB layer 605a) to complete the electronic device unit 267.

[0066] Continue to refer to Figure 6 The multilayer PCB 600 may include an integrated electrical connector 620 (sometimes referred to as connector 620). The integrated electrical connector 620 may be configured to connect the pump 272 to the multilayer PCB 600. The integrated electrical connector may include a PCB having one or more electronic components configured to provide an interface between the pump 272 and one or more electronic components of the multilayer PCB 600. For example, the flap 625 may be a flexible PCB.

[0067] Instead of using one or more holes to connect pump 272 to other components mounted on multilayer PCB 600 (e.g., one or more traces connected to opposite sides of multilayer PCB 600) (which could disadvantageously introduce leakage in the fluid flow path including pump 272), an integrated electrical connector 620 can be used. The integrated electrical connector 620 may include a flap 625, which may be flexible. As shown, flap 625 may be substantially rectangular. Flap 625 may be defined by one or more discontinuities of at least one of upper layer 605a or lower layer 605b to provide physical and electrical isolation of at least one portion of upper layer 605a or lower layer 605b. The integrated electrical connector 620 may be electrically connected to a first trace 630a and a second trace 630b configured to provide an electrical connection between pump 272 and one or more components of multilayer PCB 600. (See reference...) Figures 8A-8B The integrated electrical connector 620 can utilize the flexibility of the upper PCB layer 605a to form a robust and durable connection with the pump 272. This can be achieved without creating additional discontinuities in the multilayer PCB 600. In some embodiments, additional electrical connectors can be similarly provided to connect other hardware devices.

[0068] A pair of openings 640a and 640b may be provided in the multilayer PCB 600, allowing fluids (such as gas) to leak out of the wound dressing during negative pressure wound therapy. Openings 640a and 640b may be circular. Openings 640a and 640b may resemble vent 442. In some cases, one or more filters may be provided to cover openings 640a and 640b to reduce odor, prevent bacterial contamination, or protect pump 272. Figure 7 As shown, the pump exhaust port 274 of the pump 272 can be positioned above the openings 640a and 640b.

[0069] In some cases, openings 640a and 640b may be the only holes in region 645 where the pump vent 274 (or pump 272) is mounted on the multilayer PCB 600. This design can reduce or eliminate unwanted leakage in the fluid flow path. In some embodiments, a single opening 640a or 640b may be provided.

[0070] Similar to one or more discontinuities 608, openings 640a, 640b allow conductive material to be removed from at least one of the upper layer 605a or the lower layer 605b. This provides flexibility for venting gas through openings 640a, 640b and reduces the risk of forming a seal with the rigid surface of the PCB 600 (which would prevent gas venting through openings 640a, 640b).

[0071] Conductive material can be removed from at least one of the upper layer 605a or the lower layer 605b along the edge of the PCB 600. This improves flexibility and provides protection against electrostatic discharge (ESD).

[0072] Multiple traces 650 on the upper layer 605a can provide multiple electrical connections. To avoid introducing leakage into the fluid flow path, traces 650 may not be present in region 645. Tracees 650 may have a raised profile relative to the surface of the multilayer PCB 600, and positioning any trace of trace 650 in region 645 may undesirably introduce leakage into the fluid flow path (e.g., by providing a raised path for gas to travel along). Gaskets (in Figures 8A-8B The gasket (shown as 825) can be positioned below the pump exhaust port 274 to improve sealing and reduce or eliminate leakage. An adhesive can be applied in region 645 between the upper layer 605a and the lower layer 605b to prevent or reduce leakage due to gas passing through the multilayer PCB 600. Region 645 may have a smooth surface to prevent or reduce leakage. In some cases, the gasket may be omitted.

[0073] Figure 7A printed circuit board 600 is shown, filled with electronic components 700. Electronic component 700 may be the same as or substantially similar to electronic component 267. Electronic component 700 may include a pump 272, which is connected to the multilayer PCB via an integrated electrical connector 620. Operation of pump 272 may be achieved as described herein (e.g., references). Figure 3 The electronic device unit 700 described herein controls the pump exhaust port 274, pump inlet protection mechanism 280, and power supply(s) 268, which can be mounted to the multilayer PCB 600 as shown. As described herein, the pump exhaust port 274 can be centrally located above openings 640a and 640b and connected to the pump 272. One or more power supplies 268 (such as lithium-ion batteries or other battery technologies) can be disposed adjacent to the pump 272 at the periphery of the PCB 600.

[0074] Electronic device unit 700 may include one or more indicators for visually providing the status of negative pressure wound therapy. Similar to indicator 266, one or more indicators may include a first indicator 760a and a second indicator 760b. The first indicator 760a and the second indicator 760b may be light-emitting diodes (LEDs) or another type of light source. Indicators 760a and 760b may be mounted on the upper layer 605a, and the multilayer PCB 600 may be mounted in reverse such that the upper layer 605a faces the wound. To provide visibility, light from indicators 760a and 760b may illuminate through the multilayer PCB 600. For example, the multilayer PCB 600 (or one or more areas) may be made of a transparent or translucent material to allow indicators 760a and 760b to be observed when looking at the lower layer 605b. Indicators 760a and 760b may be mounted on areas 660a and 660b ( Figure 6 (As shown in the diagram). Adhesive may not be provided in areas 660a and 660b so as not to adversely affect the color of the light generated by indicators 760a and 760b. A PCB masking layer (or mask) may not be provided in areas 660a and 660b so as not to adversely affect the color of the light generated by indicators 760a and 760b. Advantageously, this design avoids the use of holes for providing visual indication, as such holes could introduce one or more leaks into the fluid flow path.

[0075] Indicators 760a and 760b can be green, yellow, red, orange, or any other color. For example, the first indicator 760a can emit green light to indicate normal operation, and the second indicator 760b can emit orange or yellow light to indicate one or more problems. In some embodiments, either indicator 760a or 760b can have a monochromatic color (such as a white LED). A mask can be provided in one or more areas 660a or 660b on the multilayer PCB 600 to act as an optical filter for the light generated by either indicator 760a or 760b. The mask can act as a filter to change the color of the emitted light to a desired color, such as green, yellow, or orange. For example, a green mask can be provided to change the white emitted by a white LED to green.

[0076] Figures 8A-8B It shows Figure 7 Assembly of electronic device unit 700. Figure 8A yes Figure 6-7 An exploded view of the multilayer PCB 600 shows the upper PCB layer 605a separated from the lower PCB layer 605b. In assembly step 810, the upper PCB layer 605a and the lower PCB layer 605b can be bonded together, for example, by an adhesive. Adhesive can also be applied near any discontinuities to reduce or eliminate any potential leakage. As described herein, adhesive may not be applied to any of the one or more discontinuities, particularly when conductive material has been removed from both the upper PCB layer 605a and the lower PCB layer 605b at the discontinuity. Adhesive can be applied throughout the PCB 600, such as by applying an adhesive layer to a first side of the upper layer 605a before bonding the upper layer 605a to the lower layer 605b. Step 810 may include separating the flap 625 of the integrated electrical connector 620 from the multilayer PCB 600. The flap 625 of the integrated electrical connector 620 may not be separated from the multilayer PCB 600. Figure 6 Adhesive is applied to the upper layer 605a (as shown in the diagram). Depending on the method of applying adhesive to form the multilayer PCB 600, the tabs 625 may be separated before the upper layer 605a is attached to the lower layer 605b to prevent the integrated electrical connector 620 from becoming adhered to the lower layer 605b.

[0077] In step 820, the flaps 625 of the integrated electrical connector 620 can be attached to the pump 272. The electrical terminals of the pump 272 can be soldered to the integrated electrical connector 620 (e.g., via through-hole soldering or surface mount soldering) or otherwise connected to the integrated electrical connector 620. In some embodiments, the pump 272 and the integrated electrical connector 620 may each include corresponding halves of a receptacle interface to allow the pump 272 to be connected to the multilayer PCB 600 without soldering or using holes.

[0078] Step 820 may also include placing a gasket 825 (such as a rubber gasket or a PTFE gasket) on the multilayer PCB 600 in preparation for mounting the pump 272. The gasket 825 is configured to form a fluid-impermeable seal between the multilayer PCB 600 and the pump 272. The gasket 825 may have a similar footprint to the pump 272, or the gasket may be elongated to provide mounting surfaces for one or more additional hardware devices (such as a power supply 268, a pump vent 274, etc.). In some cases, the gasket 825 may be first adhered to the underside of the pump.

[0079] In step 830, pump 272 is attached to upper PCB layer 605a. As described herein, the region 645 below pump 272 may be devoid of electronic components, traces, and / or pathways to reduce or eliminate leakage. Pump 272 may be attached to multilayer PCB 600 using an adhesive, which may be the same adhesive used to bond layers 605a and 605b of multilayer PCB 600. The adhesive may be selected to prevent or reduce the formation of fluid leaks, and the adhesive may be hydrophobic. Electronic component 610 may include a moisture sensor configured to facilitate shutting off pump 272 in response to a moisture content meeting a moisture threshold.

[0080] In some cases, the adhesive may be applied to the underside of the pump 272 in step 820 and adhered to the gasket, which is then bonded to the remainder of the electronics unit 700 in step 830. In some embodiments, the pump 272 may be attached to the multilayer PCB 600 before the flaps 625 of the integrated electrical connector 620 are attached to the pump 272. In some embodiments, steps 810, 820, and 830 may be performed in a different order.

[0081] Figure 8B An assembled electronic device unit 700 is shown, which includes multiple power supplies 268. Layers 605a and 605b can be flexible, allowing the electronic device unit 700 to be worn more comfortably by the patient. Because the pump 272 and the multiple power supplies 268 can be rigid, the central region 840 of the electronic device unit 700 housing the pump 272 can have very little flexibility or no flexibility compared to the peripheral region 850 of the multilayer PCB 600. To mitigate this reduction in flexibility, one or more elongated flexible regions 860 can be provided in the multilayer PCB 600, in which few or no additional components are mounted. For example, the multiple elongated flexible regions 860 can be formed by one or more discontinuities 608 (such as...). Figure 6 and Figure 7(As shown in the diagram) defines a flexible space between the pump 272 and the power supply 268. The flexible space provided by the elongated flexible region 860 allows the electronic device unit 700 to have a greater degree of flexibility by dividing the multilayer PCB 600 into two or more segments.

[0082] As described in this article, the layers of a multilayer PCB 600 can be stacked on top of each other. Connections between components or traces on different layers can be achieved using one or more conductive paths or by forming pad-to-pad connections. Figure 8C The diagram illustrates the connection between an electronic component 870 positioned on an upper PCB layer 605a and an electronic component 880 positioned on a lower PCB layer 605b. Electronic component 870 may have contact pads 872, and electronic component 880 may have contact pads 882. In some cases, one or more of pads 872 or 882 may be pins, boards, etc. The connection between pads 872 and 882 of electronic components 870 and 880 can be formed using conductive paths 886 in each of the upper PCB layer 605a and the lower PCB layer 605b. Figure 8D The diagram illustrates the connection between electronic components 870 and 880 when electronic component 880 is positioned on the top side of the lower PCB layer 605b. A connection can be formed between pads 872 and 882 using conductive paths 886 in the upper PCB layer 605a. When electronic component 870 is positioned on the bottom side of the upper PCB layer 605a and electronic component 880 is positioned on the top side of the lower PCB layer 605b, a direct connection between pads 872 and 882 can be formed without using any conductive paths.

[0083] Figure 9 The assembled electronic device unit 700 is shown. The connection between the pump 272 and the integrated electrical connector 620 is shown. For ease of illustration, Figure 9 Multiple power supplies 268 are not shown. The flap 625 of the integrated electrical connector 620 can be configured to bend up to 180 degrees to fold backward against the upper PCB layer 605a when connected to the pump 272. The folded flap 625 of the electrical connector 620 does not necessarily abut flat against the upper PCB layer 605a.

[0084] In some cases, the integrated electrical connector 620 may be elongated to allow multiple folds to be created in the flap 625. For example, the flap 625 may be folded to create a twist that exposes opposite sides of the connector 620 to the hardware device(s), or to expose the connector 620 at an angle from the multilayer PCB 600.

[0085] In some cases, a multilayer PCB 600 can be assembled by adhering, fixing, soldering, or bonding one or more layers together. For example, thermoforming, hand soldering, SMT soldering, or reflow soldering can be used to assemble a multilayer PCB 600. As described herein, one or more layers can be flexible. A multilayer PCB 600 may include more than two layers.

[0086] In some implementations, a folded single-layer PCB can be used instead of a multi-layer PCB. This single-layer PCB can be flexible. Figure 10 A folded single-layer PCB 1000 supporting electronic components and connections (or tracks) 1010 is shown. When folded, PCB 1000 can effectively form a double-layer PCB. However, connections between components can span the folds (or multiple folds) in PCB 1000, and it may not be necessary to route connections from one PCB layer to another.

[0087] in conclusion

[0088] The disclosed approach may be advantageous when compared to mitigation techniques used to reduce leakage, such as using secondary adhesive films, tapes, or coatings to “block” potential leakage paths in multilayer PCBs. As described herein, multilayer PCBs can be designed to eliminate vias that run through the entire PCB while maintaining the functionality of electronic components such as LEDs or pumps. Furthermore, using the approach described herein, multilayer PCBs can retain their flexibility after electronic components have been mounted on the PCB. This can facilitate the continued delivery of negative pressure wound therapy, improve patient safety, and enhance patient comfort.

[0089] Other variations

[0090] While some embodiments described herein relate to integrated negative pressure wound therapy systems in which the negative pressure source is supported by a dressing, the systems and methods described herein are applicable to any negative pressure wound therapy system or medical system, particularly systems positioned on (or worn by) a patient. For example, the systems and methods described herein for controlling operation can be used in fluid-resistant (e.g., waterproof) negative pressure wound therapy systems or medical systems. Such systems may be configured with a negative pressure source and / or electronics located outside the wound dressing, such as a negative pressure source and / or electronics configured within a fluid-resistant housing. Additionally, such systems are generally configured for use within ultrasonic delivery devices, negative pressure devices powered by an external power supply, negative pressure devices with a separate pump, and medical devices.

[0091] Any embodiment disclosed herein may be used in conjunction with one or more features disclosed in the following documents: U.S. Patent No. 7,779,625, entitled "DEVICE AND METHODFOR WOUND THERAPY," issued August 24, 2010; U.S. Patent No. 7,964,766, entitled "WOUND CLEANSING APPARATUS IN SITU," issued June 21, 2011; U.S. Patent No. 8,235,955, entitled "WOUND TREATMENT APPARATUS AND METHOD," issued August 7, 2012; U.S. Patent No. 7,753,894, entitled "WOUND CLEANSING APPARATUS WITH STRESS," issued July 13, 2010; and U.S. Patent No. 7,753,894, entitled "WOUND CLEANSING APPARATUS WITH STRESS," issued July 1, 2014; and U.S. Patent No. 7,753,894, entitled "WOUND Dressings." U.S. Patent No. 8,764,732 entitled "Wound Dressing"; U.S. Patent No. 8,808,274 entitled "Wound Dressing" issued August 19, 2014; U.S. Patent No. 9,061,095 entitled "Wound Dressing and Method of Use" issued June 23, 2015; U.S. Patent No. 10,076,449 entitled "Wound Dressing and Method of Treatment" issued September 18, 2018; and U.S. Patent Publication No. 2015 / 0190286 entitled "Wound Dressing and Method of Treatment" filed January 30, 2015, and published July 9, 2015. U.S. Patent Application No. 14 / 418908 entitled “OFREATMENT”; U.S. Patent No. 10,231,878 entitled “TISSUE HEALING”, granted on March 19, 2019; and PCT International Application PCT / GB2012 / 000587 entitled “WOUND DRESSING AND METHOD OF TREATMENT”, filed on July 12, 2012.International patent applications filed on May 22, 2013, entitled "Apparatuses and Methods for Negative Pressure Wound Therapy" (PCT / IB2013 / 001469); July 31, 2013, entitled "Wound Dressing and Method of Treatment" (PCT / IB2013 / 002102); July 31, 2013, entitled "Wound Dressing and Method of Treatment" (PCT / IB2013 / 002060); and March 12, 2013, entitled "Reduced Pressure Apparatus and Method" (PCT / IB2013 / 002060). PCT international application number PCT / IB2013 / 00084 entitled "Reduced Pressure Apparatuses" filed on April 26, 2016; PCT / EP2016 / 059329 entitled "Wound Dressings and Methods of Use with Integrated Negative Pressure Source Having a Fluid Ingress Inhibition Component" filed on April 26, 2017; PCT / EP2017 / 059883 entitled "Wound Treatment Apparatuses and Methods with Integrated Negative Pressure Source" filed on March 6, 2017; The PCT international application number for “INTO WOUND DRESSING” is PCT / EP2017 / 055225; the PCT international application number for “NEGATIVE PRESSURE WOUND TREATMENT APPARATUSES AND METHODS WITH INTEGRATED ELECTRONICS”, filed on September 13, 2018, is PCT / EP2018 / 074694.The following PCT international applications were filed on September 13, 2018, entitled "Negative Pressure Wound Treatment Apparatuses and Methods with Integrated Electronics" (PCT / EP2018 / 074701); on October 25, 2018, entitled "Negative Pressure Wound Treatment Apparatuses and Methods with Integrated Electronics" (PCT / EP2018 / 079345); and on October 30, 2018, entitled "Safety Operation of Integrated Negative Pressure Wound Treatment". The PCT international application number for "APPARATUSES" is PCT / EP2018 / 079745; each of the aforementioned documents is incorporated herein by reference in its entirety.

[0092] While some embodiments described herein relate to wound dressings, the systems and methods disclosed herein are not limited to wound dressings or medical applications. The systems and methods disclosed herein are generally applicable to electronic devices, such as those that can be worn by a user or applied to a user's electronic device.

[0093] Any values ​​of thresholds, limits, durations, etc., provided herein are not intended to be absolute and are therefore approximate. Furthermore, any thresholds, limits, durations, etc., provided herein may be fixed or automatically or by the user. Additionally, terms relating to reference values, such as exceeding, greater than, less than, etc., as used herein, are intended to also cover being equal to the reference value. For example, exceeding a positive reference value may cover being equal to or greater than the reference value. Furthermore, terms relating to reference values, such as exceeding, greater than, less than, etc., as used herein, are intended to also cover the opposite relationships disclosed, such as being below, less than, greater than, etc., relative to the reference value. Moreover, although various processes may be described in boxes regarding determining whether a value meets or does not meet a particular threshold, these boxes can be understood similarly, for example, regarding values ​​(i) below or above a threshold or (ii) meeting or not meeting a threshold.

[0094] Features, materials, characteristics, or groups described in connection with a particular aspect, embodiment, or example shall be construed as applicable to any other aspect, embodiment, or example described herein, unless incompatible therewith. All features disclosed in this specification (including any appended claims, abstract, and drawings), or all steps of any method or process so disclosed, may be combined in any combination, except for at least some mutually exclusive combinations of such features or steps. Protection is not limited to the details of any of the foregoing embodiments. Protection extends to any novel feature or any novel combination of features disclosed in this specification (including any appended claims, abstract, and drawings), or any novel feature or any novel combination of steps of any method or process so disclosed.

[0095] While certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of protection. In fact, the novel methods and systems described herein can be embodied in various other forms. Furthermore, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein. Those skilled in the art will understand that in some embodiments, the actual steps taken in the illustrated or disclosed process may differ from those shown in the figures. According to embodiments, some of the steps described above may be removed, and other steps may be added. For example, the actual steps or the order of steps taken in the disclosed process may differ from those shown in the figures.

[0096] The various components shown in the figures or described herein may be implemented as software or firmware on a processor, controller, ASIC, FPGA, or dedicated hardware. The software or firmware may include instructions stored in a non-transitory computer-readable storage medium. These instructions may be executed by a processor, controller, ASIC, FPGA, or dedicated hardware. Hardware components such as controllers, processors, ASICs, FPGAs, etc., may include logic circuit systems. Furthermore, the features and attributes of the specific embodiments disclosed above may be combined in different ways to form other embodiments, all of which fall within the scope of this disclosure.

[0097] While this disclosure includes certain embodiments, examples, and applications, those skilled in the art will understand that this disclosure extends beyond the specific embodiments disclosed herein to other alternative embodiments or uses, as well as obvious modifications and equivalents thereof, including embodiments that do not provide all the features and advantages described herein. Therefore, the scope of this disclosure is not intended to be limited by the specific disclosure of the preferred embodiments herein, but may be defined by the claims set forth herein or proposed herein.

[0098] Conditional language, such as “can,” “may,” “may,” or “may,” unless explicitly stated otherwise or otherwise understood in the context in which they are used, is generally intended to express that certain embodiments include certain features, elements, or steps that are not included in other embodiments. Therefore, such conditional language is not generally intended to imply that one or more embodiments require features, elements, or steps in any way, or that one or more embodiments must include logic for determining whether such features, elements, or steps are included in or performed in any particular embodiment, with or without user input or prompting. The terms “comprising,” “including,” “having,” etc., are synonymous and used in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc. Additionally, the term “or” is used in its inclusive sense (but not in its proprietary sense) such that, when used, for example, to connect lists of elements, the term “or” means one, some, or all of the elements in the list. Furthermore, in addition to having its ordinary meaning, the term “each,” as used herein, can mean any subset of the set of elements to which the term “each” is applied.

[0099] Unless otherwise explicitly stated, union language such as the phrase “at least one of X, Y, and Z” is understood in context as generally used to express that an item, term, etc., may be X, Y, or Z. Therefore, such union language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z.

[0100] The degree language used herein, such as the terms “approximately,” “about,” “substantially,” and “basically” as used herein, refers to a value, quantity, or characteristic that is close to still performing the desired function or achieving the desired result. For example, the terms “approximately,” “about,” “substantially,” and “basically” can refer to a quantity that is less than 10%, less than 5%, less than 1%, less than 0.1%, and less than 0.01% of the specified quantity.

[0101] The scope of this disclosure is not intended to be limited by the specific disclosure of preferred embodiments in this section or elsewhere in this specification, but may be defined by the claims in this section or elsewhere in this specification or future. The language of the claims will be interpreted broadly based on the language used in the claims and is not limited to the examples described in this specification or during the examination of the application, which should be interpreted as non-exclusive.

Claims

1. A negative pressure wound therapy system, comprising: A negative pressure source configured to provide negative pressure to a wound via a fluid flow path and to draw fluid from the wound; An electronic control circuit system configured to control the operation of the negative pressure source; A multilayer printed circuit board (PCB) comprising at least a first layer, the first layer being connected to a second layer to reduce gas leakage in the fluid flow path, at least one of the first layer or the second layer supporting a plurality of electronic components including the negative pressure source and the electronic control circuit system, and a plurality of conductive traces electrically connecting at least some of the plurality of electronic components, and the multilayer PCB comprising at least one electrical connection between the first layer and the second layer. as well as A gasket, positioned on the multilayer PCB below the negative pressure source and configured to provide a seal to prevent or reduce one or more leaks in the fluid flow path, wherein the area of ​​the multilayer PCB supporting the gasket does not include any conductive traces.

2. The system of claim 1, wherein the area of ​​the multilayer PCB supporting the pad does not include any holes other than one or more orifices configured to discharge gas drawn out by the negative pressure source.

3. The system according to any one of the preceding claims, wherein the multilayer PCB includes one or more discontinuities in which conductive material of at least one of the first layer or the second layer has been removed.

4. The system of claim 3, wherein the one or more discontinuities include discontinuities that physically and electrically isolate the isolation portion of the first layer from the adjacent portion of the first layer.

5. The system of claim 4, wherein the isolation portion of the first layer supports one or more of the plurality of conductive traces.

6. The system of claim 5, wherein the isolation portion of the first layer is configured to fold away from the second layer to connect the one or more conductive traces to one or more of the plurality of electronic components.

7. The system of claim 6, wherein the isolation portion of the first layer is configured to connect the one or more conductive traces to the negative pressure source.

8. The system according to any one of claims 4 to 7, wherein the isolation portion comprises a flexible connector.

9. The system according to any one of the preceding claims further includes a wound dressing configured to be positioned above the wound, the wound dressing supporting the negative pressure source and the multilayer PCB.

10. The system according to any one of the preceding claims, wherein the multilayer PCB comprises a flexible printed circuit board.

11. The system according to any one of the preceding claims, wherein the first layer and the second layer are at least partially adhered to each other with an adhesive.

12. The system of claim 11, wherein at least some regions of the first layer and the second layer are not adhered to by the adhesive.

13. The system according to any one of the preceding claims, wherein at least one of the first layer or the second layer includes a transparent portion.

14. The system of claim 13, wherein the multilayer PCB supports a light source positioned adjacent to the transparent portion, and wherein the transparent portion does not include adhesive so that light emitted by the light source can be transmitted through the multilayer PCB.

15. The system of claim 14, wherein the transparent portion is configured as an optical filter for the light emitted by the light source.

16. The system of claim 15, wherein the transparent portion comprises a mask configured to filter the light emitted by the light source.

17. The system according to any one of claims 14 to 16, wherein the light source comprises a light-emitting diode mounted to a first layer of the multilayer PCB.

18. A medical treatment or monitoring system, comprising: Treatment or monitoring devices; An electronic control circuit system configured to control the operation of the treatment or monitoring device; as well as A multilayer printed circuit board (PCB) comprising at least a first layer connected to a second layer, wherein at least one of the first or second layer supports a plurality of electronic components including the therapeutic or monitoring device, and a plurality of conductive traces electrically connecting at least some of the plurality of electronic components, and the multilayer PCB comprising at least one electrical connection between the first layer and the second layer. The multilayer PCB includes one or more discontinuities in which conductive material of at least one of the first layer or the second layer has been removed.

19. The system of claim 18, wherein the one or more discontinuities promote the flexibility of the multilayer PCB.

20. The system according to any one of claims 18 to 19, wherein the area of ​​the multilayer PCB supporting the treatment or monitoring device does not include any conductive traces.

21. The system according to any one of claims 18 to 20, wherein the multilayer PCB supports a light source positioned adjacent to a transparent portion of the multilayer PCB, and wherein the transparent portion does not contain adhesive so that light emitted by the light source can be transmitted through the multilayer PCB.

22. The system of claim 21, wherein the transparent portion comprises a mask configured to filter the light emitted by the light source.

23. A method of operating the system according to any one of the preceding claims.

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