Battery pack

By using polymer materials to cover some electrical components of the circuit board in the battery pack and combining them with a heat sink, the problem of battery packs being susceptible to moisture, dust and debris was solved, thereby improving the stability and reliability of battery performance.

CN120958644APending Publication Date: 2025-11-14TECHTRONIC CORDLESS GP
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Patent Information

Application Number
CN202380097056.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-04-13
Publication Date
2025-11-14

AI Technical Summary

Technical Problem

Existing battery packs are susceptible to moisture, dust, and debris during use, which can lead to a decline in battery performance.

Method used

A cover made of polymer material covers part of the electrical components of the circuit board and is combined with a heat sink that is in direct contact with the uncovered electrical components. The cover is formed using a low-pressure molding process to protect the circuit board, and the heat sink dissipates heat.

Benefits of technology

It effectively protects the circuit board from environmental influences, maintains battery performance, and improves the reliability and lifespan of the battery pack.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a battery pack for an electrical device. A battery pack includes a housing having at least one terminal configured to electrically connect the battery pack to an electrical device, a plurality of battery cells disposed within the housing and configured to supply power to the electrical device, a support structure configured to receive and support the plurality of battery cells within the housing, and a circuit board disposed within the housing on top of the support structure and including a plurality of electrical components. The circuit board is configured to selectively supply power to the plurality of battery units. The circuit board also includes a cover covering at least some of the plurality of electrical components to protect the circuit board from dust, debris, and water. Thus, in some embodiments, the cover is configured to render the circuit board waterproof.
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Description

Technical Field

[0001] This invention relates to battery packs, and more specifically, to circuit boards used in battery packs. Summary of the Invention

[0002] Power tools can be powered by portable battery packs. These battery packs vary in battery chemistry and nominal voltage and can be used to power a wide range of tools and electrical devices. Due to the electrical characteristics of the sub-components within the battery pack, it is advantageous to protect these sub-components from moisture, dust, and / or debris to maintain optimal battery performance.

[0003] Therefore, in one aspect, the present invention provides a battery pack for an electrical device, comprising a housing having a housing configured to electrically connect the battery pack to at least one terminal of the electrical device; a plurality of battery cells disposed within the housing and configured to supply power to the electrical device; a support structure configured to receive and support the plurality of battery cells within the housing; and a circuit board disposed within the housing on top of the support structure and including a plurality of electrical components. The circuit board is configured to selectively supply power to the plurality of battery cells. The circuit board also includes a cover that shields at least some of the plurality of electrical components.

[0004] The present invention includes a cover made of polymer material.

[0005] The present invention includes polymer materials that are polyamides and polyolefins.

[0006] The present invention includes forming a cover by low-pressure molding.

[0007] The present invention includes a plurality of electrical components disposed in a first region of a circuit board, wherein the circuit board further includes a second plurality of electrical components disposed in a second region of the circuit board, the second region being different from the first region.

[0008] The invention also includes a heat sink that is in direct contact with a second plurality of electrical components in a second region without a cover, wherein a cover is disposed on a first region of a circuit board to cover a first plurality of electrical components.

[0009] The present invention includes a heat sink that captures and dissipates heat from a second plurality of electrical components.

[0010] The present invention includes a cover disposed on a first region of a circuit board and a heat sink disposed on a second region of the circuit board.

[0011] The invention includes a cover disposed on a first region and a second region, and further includes a heat sink extending through the cover to contact a second plurality of electrical components.

[0012] The present invention includes a cover that covers a plurality of electrical components.

[0013] The present invention includes attaching a cover to a second region after attaching the heat sink to a second plurality of electrical components, such that the lower portion of the heat sink is surrounded by the cover and the upper portion of the heat sink is not covered by the cover.

[0014] In another aspect, the present invention provides a battery pack for an electrical device, comprising a housing having at least one terminal configured to electrically connect the battery pack to the electrical device; a plurality of battery cells disposed within the housing and configured to supply power to the electrical device; a support structure configured to receive and support the plurality of battery cells within the housing; a circuit board disposed within the housing on top of the support structure and including a plurality of electrical components; and a variable-thickness cover made of a polymer material covering at least some of the electrical components, the circuit board being configured to selectively supply power to the plurality of battery cells. The present invention includes polymer materials that are polyamides and polyolefins.

[0015] The present invention includes multiple battery cells comprising lithium-based chemical substances.

[0016] The present invention includes a cover comprising a first thickness portion and a second thickness portion, wherein the second thickness portion is greater than the first thickness portion.

[0017] The present invention includes a plurality of electrical components disposed in a first region of a circuit board, wherein the circuit board further includes a second plurality of electrical components disposed in a second region of the circuit board, the second region being different from the first region.

[0018] The invention also includes a heat sink that is in direct contact with a second plurality of electrical components in a second region without a cover, wherein a cover is disposed on a first region of a circuit board to cover a first plurality of electrical components.

[0019] The present invention includes a heat sink that captures and dissipates heat from a second plurality of electrical components.

[0020] Other aspects of the invention will become apparent from consideration of the detailed description and accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a perspective view of a battery pack according to an embodiment of the present invention.

[0022] Figure 2 According to some embodiments Figure 1 A three-dimensional view of the rear of the battery pack.

[0023] Figure 3 According to some embodiments Figure 1 An exploded view of the battery pack.

[0024] Figure 4 According to some embodiments Figure 1 A perspective view of the battery pack, in which the first housing portion of the casing has been removed.

[0025] Figure 5 According to some embodiments, it is used for Figure 1 A perspective view of the circuit board of the battery pack, including the cover and heat sink.

[0026] Figure 6 According to some embodiments Figure 5 A perspective view of the circuit board with the heatsink removed.

[0027] Figure 7 According to some embodiments Figure 5 Top view of the circuit board, with the heatsink removed.

[0028] Figure 8 According to some embodiments Figure 5 A side view of the circuit board, with the heatsink removed.

[0029] Before explaining any embodiments of the invention in detail, it should be understood that the application of the invention is not limited to the details of the construction and arrangement of the components set forth in the following description or shown in the following drawings. The invention can have other embodiments and can be practiced or performed in various ways. Moreover, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting.

[0030] Features shown or described as part of one embodiment may be used in conjunction with another embodiment to produce yet another embodiment. Therefore, the invention is intended to cover these modifications and variations that fall within the scope of the appended claims and their equivalents. Detailed descriptions use numerals and letter designations to refer to features in the drawings. Identical or similar designations in the drawings and specification are used to denote identical or similar portions of the invention.

[0031] As used herein, the terms “first,” “second,” and “third” are used interchangeably to distinguish one component from another and are not intended to indicate the location or importance of a single component. The singular forms “a,” “an,” and “the” include plural references unless the context clearly indicates otherwise. The terms “connected,” “fixed,” “attached,” etc., refer to direct connection, fixation, or attachment, as well as indirect connection, fixation, or attachment via one or more intermediate components or features, unless otherwise specified herein. As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “having,” or any other variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, article of manufacture, or apparatus that includes a list of features is not necessarily limited to those features but may include other features not expressly listed or inherent to such process, method, article of manufacture, or apparatus. Furthermore, unless expressly stated to the contrary, “or” is inclusive rather than exclusive. For example, any of the following conditions A or B are satisfied: A is true (or exists) and B is false (or does not exist), A is false (or does not exist) and B is true (or exists), and both A and B are true (or exist).

[0032] Approximate terms, such as “generally,” “approximately,” or “substantially,” include values ​​up to 10% larger or smaller than the stated value. When used in the context of angles or directions, such terms include those within ten degrees greater or less than the stated angle or direction. For example, “generally perpendicular” includes directions within ten degrees perpendicular in any direction (e.g., clockwise or counterclockwise).

[0033] The following description of specific embodiments illustrates the benefits, other advantages, and solutions to problems. However, the benefits, advantages, solutions to problems, and any features that may cause any benefit, advantage, or solution to appear or become more significant should not be construed as key, essential, or fundamental features of any or all claims. Detailed Implementation

[0034] Figure 1 and Figure 2A battery pack 10 according to some embodiments is shown. The battery pack 10 can be connected to and operated to power electrical devices, such as, but not limited to, handheld power tools (e.g., drills, fasteners, saws, pipe cutters, grinders, nailers, staplers, vacuum cleaners, etc.); motor-driven power tools (e.g., cutting saws, miter saws, table saws, core drills, augers, crushers, hydraulic breakers, compactors, vibrators, compressors, drain cleaners, welding machines, cable pullers, pumps, etc.); outdoor tools (e.g., chainsaws, rope trimmers, hedge trimmers, blowers, lawnmowers, ride-on lawnmowers, etc.); other motor-driven devices (e.g., vehicles, multi-purpose carts, material handling trolleys, etc.); and non-motor-driven electrical devices (e.g., power supplies, lights, AC / DC adapters, generators, personal electronic devices, etc.), any of which may now be referred to herein as "electrical devices". Furthermore, in other embodiments, the battery pack 10 can be connected to and operated to power other electrical devices. The battery pack 10 can be removed from the electrical device and can be recharged by a battery charger (not shown).

[0035] Battery pack 10 contains battery chemicals such as lead-acid, nickel-cadmium (“NiCd”), nickel metal hydride (“NiMH”), lithium (“Li”), lithium-ion (“Li-ion”), other lithium-based chemicals, or other rechargeable or non-rechargeable battery chemicals. In some embodiments, battery pack 10 may contain Li, Li-ion battery chemicals, or another lithium-based chemical and may provide an average discharge current equal to or greater than about 20 A. In one example, battery pack 10 may contain lithium cobalt (“Li-Co”), lithium manganese (“Li-Mn”) spinel, Li-Mn nickel, or other lithium metal chemicals. Furthermore, battery pack 10 may include one or more cylindrical battery cells, one or more pouch battery cells, or one or more prismatic battery cells.

[0036] Battery pack 10 has a nominal voltage. In some embodiments, battery pack 10 may have a nominal voltage of approximately 9.6V. In other embodiments, battery pack 10 may have a nominal voltage of up to approximately 50V. In some embodiments, battery pack 10 may have a nominal voltage of approximately 21V. In other embodiments, battery pack 10 may have a nominal voltage of approximately 28V. Furthermore, in other embodiments, battery pack 10 may have a nominal voltage, such as 12V, 14.4V, 18V, 24V, 40V, or 80V, to power an electrical device and be charged by a battery charger (not shown).

[0037] Continue to refer to Figure 1 and Figure 2The battery pack 10 includes a housing 14 having a first housing portion 18 and a second housing portion 22. The battery pack 10 also includes an electrical interface 24 having one or more terminals 26 configured to connect to and be electrically connected to an electrical device. The first housing portion 18 and the second housing portion 22 are joined together via a plurality of fasteners 28. However, in other embodiments, the first housing portion 18 may be coupled to the second housing portion 22 via a coupling and / or compression coupling. An O-ring (not shown) may be provided at the interface between the first housing portion 18 and the second housing portion 22 to prevent dust and other debris from entering the housing 14. Specifically, when the first and second housing portions 18, 22 are joined together, the O-ring is partially received in a groove 29 extending around the periphery of the second housing portion 22. Figure 3 The first and second housing portions 18 and 22 are further received within corresponding recesses (not shown) extending around the periphery of the first housing portion 18. Although fasteners 28 are used to join the first and second housing portions 18 and 22 together in the illustrated embodiment, in other embodiments, the first housing portion 18 and the second housing portion 22 may be joined together via adhesives, tapes, fasteners, tabs, or any combination thereof. The battery pack 10 also includes a locking mechanism 20 configured to selectively connect the battery pack 10 to an electrical device.

[0038] refer to Figure 3 The housing 14 defines an inner cavity 30. The housing 14 (more specifically, the inner cavity 30) receives and supports a battery cell assembly 34. The battery cell assembly 34 includes a plurality of battery cells 38 and a support structure 42 (e.g., a battery cell holder) that receives and supports the plurality of battery cells 38. The plurality of battery cells 38 have the chemical composition and nominal voltage as described above. In the illustrated embodiment, the housing 14 is shaped and sized to receive twenty battery cells 38, while in other embodiments, the housing 14 may receive different predetermined numbers of battery cells 38 (e.g., ten, thirty, forty, one hundred, etc.). In some embodiments, the battery cell assembly 34 may include two or more battery cells 38. The battery cells 38 may be connected in series, in parallel, or in a series-parallel combination to provide the desired electrical characteristics of the battery pack 10 (e.g., nominal voltage, current output, current capacity, power capacity, etc.).

[0039] refer to Figure 3 and Figure 4The housing 14 substantially surrounds a support circuit or circuit board 46 electrically connected to one or more terminals 26. The circuit board 46 is positioned above and supported by the battery cell assembly 34, such that it is located within a first housing portion 18 of the housing 14. Specifically, the circuit board 46 is supported on top of a support structure 42 of the battery cell assembly 34 and adjacent to the first housing portion 18. The circuit board 46 includes a microcontroller or microprocessor and is configured to provide operational control of the battery pack 10 and monitor various characteristics (e.g., voltage, temperature, etc.) of each individual battery cell 38. For example, the circuit board 46 controls electrical components within the battery pack 10 to control the charging and discharging of the battery cells 38. Simply put, the circuit board 46 can supply power to electrical devices via the battery cells 38. That is, the circuit board 46 can communicate with electrical devices, a battery charger (not shown), and can provide these devices with information about one or more battery characteristics or conditions of the battery pack 10, such as nominal voltage, temperature, chemical properties, and / or other similar characteristics.

[0040] refer to Figure 4 and Figure 5 The battery pack 10 may include a heat sink 50 and a terminal contact plate 54 adjacent to the heat sink 50. The heat sink 50 is disposed on and extends above a circuit board 46. The heat sink 50 is located directly above some electrical components of the circuit board 46, allowing the heat sink 50 to capture and dissipate heat from the circuit board 46 to prevent accidental damage due to overheating. The terminal contact plate 54 is also disposed on the circuit board 46 adjacent to the heat sink 50. Although the first housing portion 18 extends around the electrical interface 24, the terminals 26 and the terminal contact plate 54 can be accessed from the outside of the housing 14 to allow electrical devices to directly engage with the electrical interface 24.

[0041] Figure 5 and Figure 6A circuit board 46 is shown including a cover 58 (i.e., a molded part, housing, enclosure, etc.) configured to protect the circuit board 46 from environmental elements such as dust, debris, and / or water. Thus, in some embodiments, the cover 58 is configured to make the circuit board 46 waterproof. The cover 58 is disposed on the circuit board 46, and in some embodiments, only covers or obscures a portion of the circuit board 46. That is, the cover 58 does not cover the entire circuit board 46, thereby allowing some components to have direct contact with the circuit board 46 without the cover 58 positioned between these components and the circuit board 46. Specifically, the cover 58 is disposed on a first region 62 of the circuit board 46, which includes a first plurality of electrical components 70, such as capacitors, resistors, inductors, sensors, and / or processors, which do not need to contact the heat sink 50 and are susceptible to damage from contact with water or debris. Thus, the cover 58 is configured to protect the first plurality of electrical components 70 from environmental elements.

[0042] Furthermore, the cover 58 may not be provided on the second region 66 of the circuit board 46, which differs from the first region 62. The heat sink 50 and the terminal contact plate 54 are connected to the circuit board 46 in the second region 66. In other words, the second region 66 of the circuit board 46 may be without the cover 58, allowing the heat sink 50 to capture and dissipate heat from a second plurality of electrical components 74 disposed on the second region 66. The second plurality of electrical components 74 include, for example, capacitors, resistors, inductors, sensors, and / or processors. Simply put, the heat sink 50 is in thermal contact with the second plurality of electrical components 74 to capture and dissipate heat from the second plurality of electrical components 74, without the cover 58 thermally insulating the electrical components 74 from the heat sink 50.

[0043] In other embodiments, a cover 58 is disposed on the first region 62 and the second region 66. In such an embodiment, the heat sink 50 contacts the second plurality of electrical components 74, and then the cover 58 is disposed on the second region 66. In other words, the cover 58 is disposed on the second region 66 after the heat sink 50 is connected to the second plurality of electrical components 74.

[0044] Cover 58 may be made of a polymer material. Cover 58 may be formed of a material different from that of the circuit board 46, the heat sink 50, and / or the terminal contact plate 54. In some embodiments, cover 58 may be formed of polyamide and polyolefin materials. In some embodiments, cover 58 may be formed of thermoplastic or hot-melt materials. Furthermore, in some embodiments, cover 58 may be formed of a thermally conductive adhesive or binder. However, in other embodiments, cover 58 may contain a water-resistant or waterproof material. For example, cover 58 may be formed of a hydrophobic material comprising acrylic resin, epoxy resin, polyethylene, polystyrene, polyvinyl chloride, polytetrafluoroethylene, polydimethylsiloxane, polyester, or polyurethane.

[0045] refer to Figure 6 and Figure 8 Cover 58 defines a thickness measured in a direction perpendicular to the length axis L of circuit board 46. In some embodiments, the thickness of cover 58 varies such that cover 58 defines a first thickness portion 78 and a second thickness portion 82 greater than the first thickness portion 78. The first thickness portion 78 defines a first thickness T1, and the second thickness portion 82 defines a second thickness T2 greater than the first thickness T1. The first thickness portion 78 allows coverage of a plurality of electrical components 70 having a first smaller height, while the second thickness portion 82 allows coverage of a plurality of electrical components 70 having a second larger height.

[0046] The method of manufacturing a circuit board 46 including a cover 58 is described in more detail below. The method includes providing a cover 58 to the circuit board 46, the cover 58 being formed by a low-pressure molding process. The low-pressure molding process may include the steps of: melting a molding material into a liquid state; placing the circuit board 46 or a portion thereof into a mold cavity; injecting molding material into the mold cavity, wherein the molding material is injected onto a first region 62 of the circuit board 46, allowing the molding material to cool to room temperature; and removing the circuit board 46 from the mold cavity.

[0047] The advantages of low-pressure molding include material type, low viscosity, and adhesive properties. Low-pressure molding can utilize thermoplastics (i.e., materials that can be reformed due to their low viscosity when heated and then hardened upon cooling to maintain the desired shape). Low-pressure molding utilizes low viscosity (e.g., 3000 centipoise), requiring only lower injection pressure to inject into the mold cavity. Low-pressure molding is advantageous for overmolding fragile electronic components. The low-pressure molding process utilizes materials with beneficial adhesive properties (i.e., purely mechanical adhesion) (i.e., thermoplastics or polyamides), which properly encapsulate and environmentally protect the desired electrical components on circuit board 46.

[0048] The various features of the invention are set forth in the appended claims.

Claims

1. A battery pack for an electrical device, the battery pack comprising: A housing, the housing including at least one terminal configured to electrically connect the battery pack to the electrical device; Multiple battery cells are disposed within the housing and configured to supply power to the electrical device; A support structure configured to receive and support the plurality of battery cells within the housing; A circuit board, disposed within the housing on top of the support structure, and comprising a plurality of electrical components, the circuit board being configured to selectively supply power to the plurality of battery cells; as well as A cover that covers at least some of the plurality of electrical components.

2. The battery pack according to claim 1, wherein, The cover is made of polymer material.

3. The battery pack according to claim 2, wherein, The polymer material is a polyamide and a polyolefin material.

4. The battery pack according to claim 1, wherein, The cover is formed by low-pressure molding.

5. The battery pack according to claim 1, wherein, The plurality of electrical components are a first plurality of electrical components disposed in a first region of the circuit board, and the circuit board further includes a second plurality of electrical components disposed in a second region of the circuit board, the second region being different from the first region.

6. The battery pack according to claim 5, wherein, The battery pack also includes a heat sink that is in direct contact with the second plurality of electrical components in the second region, the second region having no cover, and wherein the cover is disposed on the first region of the circuit board to cover the first plurality of electrical components.

7. The battery pack according to claim 6, wherein, The radiator captures and dissipates heat from the second plurality of electrical components.

8. The battery pack according to claim 5, wherein, The cover is disposed on the first region of the circuit board, and the heat sink is disposed on the second region of the circuit board.

9. The battery pack according to claim 8, wherein, The cover is made of polymer material.

10. The battery pack according to claim 9, wherein, The polymer material is a polyamide and a polyolefin material.

11. The battery pack according to claim 5, wherein, The cover is disposed on the first region and the second region, and also includes a heat sink extending through the cover to contact the second plurality of electrical components.

12. The battery pack according to claim 11, wherein, The cover shields the first plurality of electrical components.

13. The battery pack according to claim 12, wherein, After the radiator is connected to the second plurality of electrical components, the cover is connected to the second region such that the lower part of the radiator is surrounded by the cover, while the upper part of the radiator is not covered by the cover.

14. A battery pack for an electrical device, the battery pack comprising: A housing, the housing including at least one terminal configured to electrically connect the battery pack to the electrical device; Multiple battery cells are disposed within the housing and configured to supply power to the electrical device; A support structure configured to receive and support the plurality of battery cells within the housing; A circuit board, disposed within the housing on top of the support structure, and comprising a plurality of electrical components, the circuit board being configured to selectively supply power to the plurality of battery cells; as well as A cover having a variable thickness and covering at least some of the plurality of electrical components, the cover being made of a polymer material.

15. The battery pack according to claim 14, wherein, The polymer material is a polyamide and a polyolefin material.

16. The battery pack according to claim 14, wherein, The multiple battery cells include lithium-based chemicals.

17. The battery pack according to claim 14, wherein, The cover includes a first thickness portion and a second thickness portion, wherein the second thickness portion is greater than the first thickness portion.

18. The battery pack according to claim 14, wherein, The plurality of electrical components are a first plurality of electrical components disposed in a first region of the circuit board, and the circuit board further includes a second plurality of electrical components disposed in a second region of the circuit board, the second region being different from the first region.

19. The battery pack according to claim 18, wherein, The battery pack also includes a heat sink that is in direct contact with the second plurality of electrical components in the second region, the second region having no cover, and wherein the cover is disposed on the first region of the circuit board to cover the first plurality of electrical components.

20. The battery pack according to claim 19, wherein, The radiator captures and dissipates heat from the second plurality of electrical components.