Adsorption platform and gluing system

Abstract

The adsorption platform is applied to a gluing system and comprises an adsorption surface for carrying a semiconductor substrate, an adsorption area arranged on the adsorption surface and a vacuum communication area communicated with the adsorption area, the adsorption area comprises a plurality of rows of transverse grooves and a plurality of rows of longitudinal grooves which are communicated with one another, the adsorption area and the adsorption surface are communicated to form a plurality of lattice-shaped adsorption ports for uniformly adsorbing the semiconductor substrates, and the plurality of lattice-shaped adsorption ports can uniformly adsorb and fix the semiconductor substrates on the adsorption surface under the condition that the adsorption area has vacuum adsorption force; the problems that in the prior art, an ultra-thin semiconductor substrate is sunken and deformed under the action of vacuum adsorption force are solved, the parallelism of the semiconductor substrate is guaranteed, and a coating knife in a gluing system can evenly coat the semiconductor substrate with glue conveniently. The invention further provides a gluing system with the adsorption platform, and the gluing system is used for detecting the adsorption state between the semiconductor substrate and the adsorption platform.

Description

Technical Field

[0001] This invention relates to a coating system, and also to an adsorption platform used in a coating system. Background Technology

[0002] The adsorption platform in the coating system has an adsorption surface consisting of a vacuum adsorption area composed of vacuum adsorption tanks. Under the condition of vacuum adsorption force in the vacuum adsorption area, it is used to adsorb and fix the semiconductor substrate onto the adsorption platform.

[0003] However, when the aforementioned vacuum adsorption region adsorbs an ultra-thin semiconductor substrate (e.g., 10–30 μm), the semiconductor substrate in the vacuum adsorption region will be depressed and deformed under the adsorption force of the vacuum adsorption region, resulting in the thickness of the adhesive in the depressed region being greater than the thickness of the non-depressed region.

[0004] In addition, existing technologies cannot provide timely information on the adsorption state between the semiconductor substrate and the adsorption platform.

[0005] For the reasons mentioned above, there is an urgent need to design an adhesive application system that can solve these problems. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide an adsorption platform and a coating system with an adsorption platform, which avoids the phenomenon of semiconductor substrates sinking and deforming under the action of vacuum adsorption force, ensures the parallelism of semiconductor substrates, facilitates the uniform coating of adhesive on semiconductor substrates by the coating knife in the coating system, and can also detect the adsorption state between semiconductor substrates and adsorption platform.

[0007] This invention is implemented as follows: an adsorption platform comprising:

[0008] Adsorption surface, used to mount semiconductor substrates;

[0009] The adsorption area is disposed on the adsorption surface and includes multiple rows of transverse grooves arranged at intervals and multiple rows of longitudinal grooves arranged at intervals and connected to the transverse grooves. The multiple rows of transverse grooves and the multiple rows of longitudinal grooves are interconnected to form multiple grid-shaped adsorption ports for uniformly adsorbing semiconductor substrates.

[0010] The vacuum-connected region has one end connected to the adsorption region and the other end extending to the opposite side of the adsorption region.

[0011] Two longitudinal receiving grooves are provided at both ends along the X direction of the adsorption region for installing a first detection unit that detects the adsorption state between the adsorption surface and the semiconductor substrate in the X direction.

[0012] A transverse receiving groove is provided at both ends of the adsorption region along the Y direction for installing a second detection unit to detect the adsorption state between the adsorption surface in the Y direction and the semiconductor substrate.

[0013] Furthermore, the width of the transverse groove and the longitudinal groove is 0.5 to 1.5 mm.

[0014] Furthermore, the adsorption platform also includes:

[0015] Multiple first wiring grooves are provided at both ends along the X direction of the adsorption region. After the first wiring grooves are respectively connected to the adjacent longitudinal receiving grooves, they are used to accommodate the wires of the first detection unit.

[0016] Multiple second wiring grooves are provided at both ends along the Y direction of the adsorption region. After the second wiring grooves are connected to the transverse receiving groove, they are used to accommodate the wires of the second detection unit.

[0017] Preferably, the plurality of first wiring grooves located at both ends of the adsorption region in the X direction are symmetrically arranged in pairs, and the first wiring grooves located on the same side of the adsorption region are perpendicular to each other with the longitudinal receiving groove.

[0018] The second wiring grooves located at both ends of the adsorption region in the Y direction are symmetrically arranged in pairs, and the second wiring grooves located on the same side of the adsorption region are perpendicular to each other with the transverse receiving groove.

[0019] Furthermore, the vacuum communication area includes multiple rows of spaced-apart vacuum adsorption ports, and each row of vacuum adsorption ports includes multiple spaced-apart vacuum adsorption holes.

[0020] The present invention also provides a coating system, including the adsorption platform described above, and further comprising:

[0021] A coating blade is configured to translate along the X direction of the adsorption surface, and the coating blade has a slit-type adhesive outlet for applying adhesive to a semiconductor substrate;

[0022] The first detection module includes two first detection units respectively installed in the two longitudinal receiving slots, wherein the two first detection units are symmetrically arranged.

[0023] The second detection module includes two second detection units respectively installed in the two transverse receiving slots, wherein the two second detection units are symmetrically arranged.

[0024] The controller is used to receive control signals from the first detection unit and the second detection unit regarding whether there is a gap between the adsorption surface and the semiconductor substrate, and to output control signals and / or prompt signals to the outside.

[0025] Furthermore, the control signal includes at least an alarm control signal for output to the alarm and / or communication data for output to the display.

[0026] Furthermore, the adhesive application system also includes a vacuum negative pressure device, which includes a vacuum pump and a vacuum negative pressure pipeline. The vacuum pump is sealed and connected to the vacuum adsorption port through the vacuum negative pressure pipeline.

[0027] Furthermore, the vacuum negative pressure device includes:

[0028] The air intake regulating valve has its outlet connected to the vacuum negative pressure pipeline and its inlet connected to the outside atmosphere.

[0029] A lead screw motor is used to control the air intake volume of the air intake regulating valve;

[0030] A pressure sensor is used to detect the vacuum negative pressure value in the vacuum negative pressure pipeline and output a data signal containing the detected vacuum negative pressure value.

[0031] The controller stores a standard vacuum negative pressure value. Based on the difference between the vacuum negative pressure value fed by the pressure sensor and the standard vacuum negative pressure value, the controller controls the lead screw motor to rotate according to a set number of turns and direction. The lead screw motor, in conjunction with the air intake regulating valve, rotates according to a set number of turns and direction to adjust the air intake volume of the air intake regulating valve, thereby adjusting the vacuum negative pressure value at the outlet of the air intake fine-tuning valve to a preset vacuum negative pressure value.

[0032] Furthermore, the intake volume fine-tuning valve includes a valve core for adjusting the intake volume and a screw that drives the valve core to rotate by rotating axially via a thread to adjust the intake volume.

[0033] This invention provides an adsorption platform for use in a coating system. It includes an adsorption surface for mounting a semiconductor substrate, an adsorption region on the adsorption surface, and a vacuum communication region connected to the adsorption region. The adsorption region comprises multiple rows of transverse grooves and multiple rows of longitudinal grooves that are interconnected, forming multiple grid-like adsorption ports for uniformly adsorbing the semiconductor substrate. Under vacuum adsorption force in the adsorption region, these multiple grid-like adsorption ports can uniformly adsorb and fix the semiconductor substrate onto the adsorption surface. This solves the problem of indentation and deformation of ultra-thin semiconductor substrates under vacuum adsorption force in existing technologies, ensuring the parallelism of the semiconductor substrate and facilitating the uniform application of adhesive by the coating blade in the coating system. A coating system with an adsorption platform is also provided to detect the adsorption state between the semiconductor substrate and the adsorption platform. Attached Figure Description

[0034] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a structural diagram of the adhesive coating system provided in an embodiment of the present invention.

[0036] Figure 2 This is a structural diagram of the front of the adsorption platform in the adhesive coating system provided in this embodiment of the invention.

[0037] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0038] Figure 4 This is a structural diagram of the vacuum negative pressure device in the adhesive coating system provided in this embodiment of the invention.

[0039] Figure 5 This is a structural diagram of the back of the adsorption platform in the adhesive coating system provided in this embodiment of the invention, wherein the vacuum pipeline in the vacuum negative pressure device is disposed on the back of the adsorption platform.

[0040] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0041] The reference numerals in the attached figures are explained as follows:

[0042] Adsorption platform 100, adsorption surface 110, adsorption area 120, transverse groove 121, longitudinal groove 122, vacuum adsorption hole 130, longitudinal receiving groove 140, transverse receiving groove 150, first wiring groove 160, first wiring port 161, second wiring groove 170, second wiring port 171.

[0043] 200 scalpels;

[0044] Controller 300;

[0045] Vacuum negative pressure device 400, vacuum pump 401, vacuum negative pressure pipeline 410, air intake regulating valve 420, air outlet 421, air inlet 422, valve core 423, screw 424, lead screw motor 430, pressure sensor 440. Detailed Implementation

[0046] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0047] Furthermore, in addition to indicating location or state relationships, some of the aforementioned terms may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0048] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0049] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts, which may be the same or different in type and construction, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0050] To clarify the directional relationships in the diagram, a coordinate system with the vertical direction as the Z-direction and the horizontal plane as the XY-plane is appropriately labeled.

[0051] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0052] like Figures 1-4 As shown, an adsorption platform 100 provided in this embodiment of the invention is applied to a coating system. The adsorption platform 100 includes:

[0053] Adsorption surface 110 is used to mount semiconductor substrate 10;

[0054] The adsorption region 120, disposed on the adsorption surface 110, includes multiple rows of sequentially spaced transverse grooves 121 and multiple rows of sequentially spaced longitudinal grooves 122 communicating with the transverse grooves 121. The multiple rows of transverse grooves 121 and multiple rows of longitudinal grooves 122 are interconnected to form multiple grid-like adsorption ports for uniformly adsorbing the semiconductor substrate 10. When the adsorption region 120 has a vacuum adsorption force, the multiple grid-like adsorption ports can uniformly adsorb and fix the semiconductor substrate 10 onto the adsorption surface 110, ensuring the semiconductor substrate... The parallelism of 10 facilitates the uniform application of adhesive by the coating blade 200 in the coating system onto the semiconductor substrate 10; wherein, the width of the transverse groove 121 and the longitudinal groove 122 is 0.5 to 1.5 mm. In this embodiment, the width of the transverse groove 121 and the longitudinal groove 122 is preferably 1 mm, and the depth is 1 mm. This structure can avoid the phenomenon that the ultra-thin semiconductor substrate 10 will be concave and deformed under the action of vacuum adsorption force due to the large opening size of the transverse groove 121 and the longitudinal groove 122.

[0055] The vacuum communication area includes multiple rows of spaced vacuum adsorption ports. Each row of vacuum adsorption ports consists of multiple vacuum adsorption holes 130 arranged in sequence. One end of the vacuum adsorption hole 130 is directly opposite to and connected to the adsorption area 120, and the other end of the vacuum adsorption hole 130 extends to the opposite side of the adsorption area 120. In this embodiment, the vacuum adsorption hole 130 is disposed on the transverse groove 121 and has substantially the same size as the transverse groove 121 (e.g., the inner diameter of the vacuum adsorption hole 130 is substantially the same as the width of the transverse groove 121). In another embodiment, the vacuum adsorption hole 130 can also be disposed on the longitudinal groove 122; or, the vacuum adsorption hole 130 can also be disposed on both the transverse groove 121 and the longitudinal groove 122, all of which can achieve the function of adsorbing the semiconductor substrate on the adsorption surface 110.

[0056] Two longitudinal receiving grooves 140 are provided at both ends along the X direction of the adsorption region 120 for installing a first detection unit (not shown) for detecting the adsorption state between the adsorption surface 110 in the X direction and the semiconductor substrate 10. In this embodiment, the longitudinal receiving grooves 140 and the longitudinal grooves 122 are arranged in parallel.

[0057] Two transverse receiving grooves 150 are provided at both ends along the Y direction of the adsorption region 120 for installing a second detection unit (not shown) to detect the adsorption state between the adsorption surface 110 in the Y direction and the semiconductor substrate 10. In this embodiment, the transverse receiving grooves 150 and the transverse grooves 121 are arranged in parallel.

[0058] like Figure 2 As shown, the adsorption platform 100 further includes:

[0059] Multiple first wiring channels 160 are provided at both ends along the adsorption region 120X direction, and a first positioning frame (not shown) is provided to fix and limit the wires in the first wiring channels 160. The multiple first wiring channels 160 are respectively connected to the adjacent longitudinal receiving grooves 140. The first wiring channels 160 are used to receive the wires of the first detection unit. Each first wiring channel 160 has a first wiring port 161 that penetrates the adsorption platform 100. In this embodiment, the multiple first wiring channels 160 are preferably four, and are arranged symmetrically in pairs. The first wiring channels 160 located on the same side of the adsorption region 120 are arranged perpendicular to each other with the adjacent longitudinal receiving grooves 140.

[0060] Multiple second wiring channels 170 are provided at both ends along the Y direction of the adsorption region 120, and a second positioning frame (not shown) is provided to fix and limit the wires in the second wiring channels 170. The multiple second wiring channels 170 are respectively connected to the adjacent transverse receiving grooves 150. The second wiring channels 170 are used to accommodate the wires of the second detection unit. Each second wiring channel 170 has a second wiring port 171 that penetrates the adsorption platform 100. In this embodiment, the multiple second wiring channels 170 are preferably four, and are arranged symmetrically in pairs. The second wiring channels 170 located on the same side of the adsorption region 120 are arranged perpendicularly to each other with the adjacent transverse receiving grooves 150.

[0061] like Figure 1 and Figure 4 As shown, the present invention also provides a coating system, including the above-mentioned adsorption platform 100, and further comprising:

[0062] The coating blade 200 is configured to translate along the X direction of the adsorption surface 110, and the coating blade 200 has a slit-type adhesive outlet for applying adhesive to the semiconductor substrate 10.

[0063] The first detection module includes two first detection units respectively installed in two longitudinal receiving slots 140, wherein the two first detection units are symmetrically arranged;

[0064] The second detection module includes two second detection units respectively installed in two transverse receiving slots 150, wherein the two second detection units are symmetrically arranged.

[0065] The controller 300 is used to receive control signals from the first detection unit and the second detection unit regarding the adsorption state between the adsorption surface 110 and the semiconductor substrate 10, and to output control signals and / or prompt signals to the outside world.

[0066] Specifically, the controller 300 stores data on the thickness of the semiconductor substrate. The controller 300 detects the current thickness of the semiconductor substrate 10 through the first detection unit and the second detection unit. When the detected thickness of the semiconductor substrate deviates from the stored thickness of the semiconductor substrate, it is determined that the semiconductor substrate is not firmly adsorbed or there is a gap between it and the adsorption platform 100.

[0067] Preferably, the control signal includes at least an alarm control signal for output to the alarm and / or communication data for output to the display, so that the operator can handle it in a timely manner.

[0068] like Figure 4 and Figure 5 As shown, the adhesive coating system further includes a vacuum negative pressure device 400, which includes a vacuum pump 401 and a vacuum negative pressure pipeline 410. The vacuum pump 401 is sealed and connected to the vacuum adsorption port 130 through the vacuum negative pressure pipeline 410.

[0069] Furthermore, the vacuum negative pressure device 400 also includes:

[0070] The air intake regulating valve 420 has an outlet 421 connected to the vacuum negative pressure pipeline 410 and an inlet 422 connected to the outside atmosphere.

[0071] The intake volume fine-tuning valve 420 includes a valve core 423 for adjusting the intake volume and a screw 424 that drives the valve core 423 to rotate by rotating the screw axially to adjust the intake volume.

[0072] The lead screw motor 430 is used to control the air intake volume of the air intake regulating valve 420. The lead screw motor 430 drives the screw 424 to rotate, and the screw 424 is linked to the valve core 423 to rotate, so that the valve core 420 gradually opens or closes the air intake port 422.

[0073] Pressure sensor 440 is used to detect the vacuum negative pressure value in vacuum negative pressure pipeline 410 and output a data signal containing the detected vacuum negative pressure value.

[0074] The controller 300 also stores a standard vacuum negative pressure value. Based on the difference between the vacuum negative pressure value fed by the pressure sensor 440 and the standard vacuum negative pressure value, the controller 300 controls the lead screw motor 430 to rotate according to a set number of turns and direction. The lead screw motor 430, in conjunction with the air intake regulating valve 420, rotates according to a set number of turns and direction to adjust the air intake of the air intake regulating valve 420, thereby adjusting the vacuum negative pressure value of the air outlet 421 to the preset vacuum negative pressure value, so that the current vacuum pressure value in the adsorption platform 100 is suitable for adsorbing the ultrathin semiconductor substrate 10.

[0075] When adsorbing a semiconductor substrate 10 with a large thickness, the lead screw motor 430 drives the screw 424 to rotate according to the set number of turns and direction. The screw 424 is linked to the valve core 423 to rotate, so that the valve core 420 gradually reduces or closes the air intake of the air inlet 422, thereby increasing the vacuum pressure value in the vacuum pipeline 410.

[0076] Preferably, by setting the width dimensions of the transverse groove 121 and the longitudinal groove 122 and adjusting the current vacuum pressure value within the adsorption platform 100, the problem of the ultra-thin semiconductor substrate being concave and deformed under the action of vacuum adsorption force in the prior art can be solved, which is beneficial for the coating knife to uniformly coat the adhesive on the semiconductor substrate 10.

[0077] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. An adsorption platform, characterized in that, include: Adsorption surface, used to mount semiconductor substrates; The adsorption area, disposed on the adsorption surface, includes multiple rows of transverse grooves arranged at intervals and multiple rows of longitudinal grooves arranged at intervals and connected to the transverse grooves. The multiple rows of transverse grooves and the multiple rows of longitudinal grooves are interconnected to form multiple grid-shaped adsorption ports for uniformly adsorbing semiconductor substrates. The vacuum-connected region has one end connected to the adsorption region and the other end extending to the opposite side of the adsorption region. Two longitudinal receiving grooves are configured to be set at both ends along the X direction of the adsorption region, for installing a first detection unit that detects the adsorption state between the adsorption surface and the semiconductor substrate in the X direction. Two transverse receiving grooves are configured to be set at both ends along the Y direction of the adsorption region, for installing a second detection unit to detect the adsorption state between the adsorption surface and the semiconductor substrate in the Y direction.

2. The adsorption platform according to claim 1, characterized in that, The width of the transverse and longitudinal grooves is 0.5 to 1.5 mm.

3. The adsorption platform according to claim 1, characterized in that, include: Multiple first wiring grooves are configured to be arranged at both ends along the X direction of the adsorption area. After the first wiring grooves are respectively connected to the adjacent longitudinal receiving grooves, they are used to accommodate the wires of the first detection unit. Multiple second wiring channels are configured to be arranged at both ends along the Y direction of the adsorption region. After the second wiring channels are respectively connected to the adjacent transverse receiving channels, they are used to accommodate the wires of the second detection unit.

4. An adsorption platform according to claim 3, characterized in that, The number of first wiring channels is even and they are arranged symmetrically in pairs. The first wiring channels located on the same side of the adsorption area are arranged perpendicular to each other with the longitudinal receiving channel. The number of second wiring channels is even and they are arranged symmetrically in pairs. The second wiring channels located on the same side of the adsorption area are arranged perpendicular to each other with the transverse receiving channel.

5. The adhesive application system according to claim 1, characterized in that, The vacuum communication area includes multiple rows of spaced vacuum adsorption ports, and each row of vacuum adsorption ports includes multiple spaced vacuum adsorption holes.

6. An adhesive application system, characterized in that, The adsorption platform comprising any one of claims 1 to 5 further comprises: A coating blade is configured to translate along the Y direction of the adsorption surface, and the coating blade has a slit-type adhesive outlet for applying adhesive to a semiconductor substrate; The first detection module includes two first detection units respectively installed in the two longitudinal receiving slots, wherein the two first detection units are symmetrically arranged. The second detection module includes two second detection units respectively installed in the two transverse receiving slots, wherein the two second detection units are symmetrically arranged. The controller is used to receive control signals from the first detection unit and the second detection unit regarding whether there is a gap between the adsorption surface and the semiconductor substrate, and to output control signals and / or prompt signals to the outside.

7. The adhesive application system according to claim 6, characterized in that, The control signals include at least alarm control signals for output to the alarm and / or communication data for output to the display.

8. The adhesive application system according to claim 7, characterized in that, include: The vacuum negative pressure device includes a vacuum pump and a vacuum negative pressure pipeline, wherein the vacuum pump is sealed and connected to the vacuum adsorption port through the vacuum negative pressure pipeline.

9. The adhesive application system according to claim 8, characterized in that, The vacuum negative pressure device also includes: The air intake regulating valve has its outlet connected to the vacuum negative pressure pipeline and its inlet connected to the outside atmosphere. A lead screw motor is used to control the air intake volume of the air intake regulating valve; A pressure sensor is used to detect the vacuum negative pressure value in the vacuum negative pressure pipeline and output a data signal containing the detected vacuum negative pressure value. The controller stores a standard vacuum negative pressure value. Based on the difference between the vacuum negative pressure value fed by the pressure sensor and the standard vacuum negative pressure value, the controller controls the lead screw motor to rotate according to a set number of turns and direction. The lead screw motor, in conjunction with the air intake regulating valve, rotates according to a set number of turns and direction to adjust the air intake volume of the air intake regulating valve, thereby adjusting the vacuum negative pressure value at the outlet of the air intake fine-tuning valve to a preset vacuum negative pressure value.

10. The adhesive application system according to claim 9, characterized in that, The intake volume fine-tuning valve includes a valve core for adjusting the intake volume and a screw that drives the valve core to rotate by rotating the screw thread to adjust the intake volume.

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