Wafer cleaning equipment with defect and quantity detection function

Abstract

The invention discloses wafer cleaning equipment with a defect and quantity detection function, and relates to the technical field of wafer cleaning, the wafer cleaning equipment comprises a mounting rack, a back-splashing prevention unit, a feeding unit, a water pressure adjusting unit, a supporting unit and a detection unit, the mounting rack is used for mounting and fixing the back-splashing prevention unit, the feeding unit, the water pressure adjusting unit and the supporting unit, the anti-splashing unit is used for preventing cleaning liquid from flowing back to the surface of a wafer, the feeding unit is used for automatic compensation feeding of abrasion of bristles, the water pressure adjusting unit is used for adjusting fluctuating water pressure to guarantee constant cleaning pressure, the supporting unit is used for supporting rotation of the wafer, and the detecting unit is used for detecting surface defects and the number of the cleaned wafer. After the wafer is placed on the supporting unit, the water pressure adjusting unit ensures that the cleaning pressure is constant, the feeding unit ensures that the abrasion of a cleaning brush is automatically compensated, liquid drops generated after cleaning are prevented from rebounding to the surface of the wafer to cause secondary pollution through the anti-splash unit, and the detection unit detects the defects of the cleaned wafer and detects the number of the cleaned wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning, and particularly relates to a wafer cleaning device with defect and quantity detection functions. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers are the basic materials for chip manufacturing, and their quality directly determines the performance and reliability of the final chips. Wafers will inevitably be contaminated with various pollutants such as particles, organic matter, and metal impurities during the production process, so wafer cleaning is a crucial process in semiconductor manufacturing. With the continuous development of semiconductor technology, wafer size is increasing and integration is becoming higher and higher, which puts forward more stringent requirements on the quality and efficiency of wafer cleaning. Traditional wafer cleaning equipment has many shortcomings in defect detection, cleaning water pressure control, brush wear compensation, and anti-back splash, and cannot meet the needs of modern semiconductor manufacturing.

[0003] In the wafer cleaning process, cleaning water pressure is one of the key factors affecting the cleaning effect. Traditional wafer cleaning equipment usually uses fixed water pressure for cleaning, and fluctuations in cleaning water pressure can result in poor cleaning effect or damage to the wafer. Meanwhile, in wafer cleaning, brush cleaning is a common cleaning method that removes contaminants through the friction between the brush and the wafer surface. However, as the use time increases, the brush will gradually wear out, resulting in a decrease in the contact pressure between the brush and the wafer surface and a decrease in the friction force, thereby affecting the cleaning effect.

[0004] In the wafer cleaning process, the high-speed injection of cleaning liquid and the rotational motion of the brush will cause the cleaning liquid to splash back. The splashed cleaning liquid not only pollutes the environment around the cleaning equipment, but also may fall on the cleaned wafer surface, causing secondary pollution and affecting the cleaning quality. In addition, the splashed cleaning liquid may also cause corrosion to the mechanical parts of the cleaning equipment, shortening the service life of the equipment.

[0005] In the wafer cleaning process, timely and accurate detection of defects and their quantity on the wafer surface is crucial for evaluating the cleaning effect, adjusting the cleaning process parameters, and ensuring product quality. Traditional wafer defect detection methods mainly rely on manual visual inspection or simple optical microscope observation. Manual visual inspection is not only inefficient, but also easily affected by the subjective factors of the detector, resulting in high rates of missed detection and false detection. SUMMARY

[0006] The present application aims to provide a wafer cleaning device with defect and quantity detection functions to solve the problems in the prior art.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions: The wafer cleaning equipment with the accompanying defect and quantity detection function includes a mounting frame, an anti-splashing unit, a feeding unit, a water pressure adjusting unit, a supporting unit and a detection unit, the mounting frame is placed on the horizontal ground, the anti-splashing unit is fixedly connected with the mounting frame, the anti-splashing unit has the function of avoiding secondary pollution of the wafer, the feeding unit is fixedly connected with the mounting frame, the water pressure adjusting unit is fixedly connected with the mounting frame, the supporting unit is fixedly connected with the mounting frame, and the detection unit is fixedly connected with the mounting frame.

[0008] The mounting frame is used for mounting and fixing the anti-splashing unit, the feeding unit, the water pressure adjusting unit and the supporting unit, the anti-splashing unit is used for avoiding backflow of the cleaning liquid to the wafer surface, the feeding unit is used for automatic compensation feeding of the brush wear, the water pressure adjusting unit is used for adjusting fluctuating water pressure to ensure constant cleaning pressure, the supporting unit is used for supporting and rotating the wafer, and the detection unit is used for detecting the defects and quantity of the wafer surface after cleaning.

[0009] Further, the anti-splashing unit has two groups, the two groups of anti-splashing units are symmetrically arranged on both sides of the wafer, the anti-splashing unit includes a motor, a positive plate, a support, a negative plate, a bracket, a moving frame and a brush, the motor is fixedly installed on the mounting frame, the positive plate is fixedly connected with the mounting frame through the support, the negative plate is fixedly connected with the mounting frame through the bracket, the moving frame has two, the two moving frames are fixedly installed at the telescopic ends of the double-head telescopic motor, the fixed end of the double-head telescopic motor is fixedly installed on the mounting frame, the brush is uniformly arranged on the moving frame, the positive plate is a closed disc, the negative plate is an arc-shaped disc, the mounting frame is provided with a drainage groove below the negative plate, the brush is made of Teflon, the motor is connected with the positive plate through a wire, and the motor is connected with the negative plate through a wire.

[0010] In the wafer cleaning process, a thin liquid film is left on the surface of the wafer, the double extension motor retracts to drive the moving frame to move closer to each other, and the brush slightly rubs with the liquid film. Since Teflon can easily obtain negative charge in the frictional electric series, and water solution usually tends to be positively charged, this process will enhance the overall positive charge characteristics of the liquid film. Those liquid droplets that are about to splash out of the liquid film therefore carry a net positive charge. At this time, the controller controls the motor to start, and delivers positive charge to the positive plate and negative charge to the negative plate. An electrostatic field is formed between the positive plate and the negative plate. When a positively charged liquid droplet splashes from the wafer surface and tries to fall back to the wafer, it will immediately enter the electrostatic field. According to Coulomb's law, the positively charged liquid droplet will be repelled by the positive plate and attracted by the negative plate. Under the action of the resultant force of the two forces, the trajectory of the liquid droplet will be severely deflected, and the flight path will be forced to change. Finally, the liquid droplet flows out of the drain groove of the mounting frame, thereby avoiding the contamination of the wafer surface caused by the splashing of the liquid droplets after cleaning.

[0011] Further, the feeding unit comprises a rotary motor, a rotating rod, a roller, an electromagnet, a magnetic block and a straight cylinder. The fixed end of the rotary motor is fixedly installed on the mounting frame. The output end of the rotary motor is fixedly connected with one end of the rotating rod. The other end of the rotating rod is rotatably connected with the mounting frame. The roller is fixedly installed on the rotating rod. The electromagnet is fixedly installed on the rotating rod. The magnetic block is fixedly installed on the outer surface of one end of the straight cylinder close to the electromagnet. The straight cylinder is arranged in the roller.

[0012] Further, the feeding unit further comprises a support plate, an induction coil, a bar magnet, a buffer spring and a bristle assembly. The support plate is fixedly installed in the straight cylinder. The induction coil is arranged in the straight cylinder. One end of the bar magnet is fixedly connected with the bristle assembly. One end of the buffer spring is fixedly connected with the bristle assembly. The other end of the buffer spring is fixedly connected with the support plate. The bar magnet is slidably connected with the support plate. The bristle assembly is slidably connected with the roller.

[0013] The controller controls the starting of the rotating motor to drive the rotating rod to rotate, so that the drum rotates, and the brush assembly cleans the surface of the wafer. During the long cleaning process, when the brush assembly is worn due to contact with the surface of the wafer, the pressure of the brush assembly on the surface of the wafer decreases. At this time, under the action of the wafer thrust, the brush assembly extrudes the buffer spring and drives the strip-shaped magnet to move a small distance in the straight cylinder. Since the strip-shaped magnet moves in the induction coil, the magnetic flux changes. At this time, the instantaneous current generated by the induction coil decreases. When the controller detects that the instantaneous current decreases, the input current to the electromagnet increases, the polarity of the electromagnet generated increases, thereby driving the magnetic block to drive the straight cylinder to move outward, and under the action of the support plate and the buffer spring, the brush assembly moves outward, thereby compensating for the decrease in the contact force of the brush assembly on the wafer caused by wear of the brush assembly, and avoiding the problem of poor cleaning effect of the wafer surface.

[0014] Further, the water pressure adjusting unit includes a water pipe, a nozzle, a valve and a return spring. The water pipe is fixedly installed on the mounting frame. One end of the water pipe inlet is connected with an external water pump. The nozzles are uniformly arranged on the water pipe. One end of the valve is rotatably connected with the water pipe. The other end of the valve is fixedly connected with one end of the return spring. The other end of the return spring is fixedly connected with the inner wall of the water pipe.

[0015] During the process in which the controller controls the water pump to deliver water flow into the water pipe, due to the fluctuation of flow rate and water pressure of the water flow, when the water pressure increases, the water flow drives the valve to stretch the return spring while moving closer to each other, reducing the water pressure of the water flow, and the water is sprayed from the nozzle to the surface of the wafer. When the water pressure decreases, the valve is pulled away from each other under the action of the restoring force of the return spring, increasing the water flow, so that the water pressure sprayed from the nozzle to the surface of the wafer is always kept constant, avoiding the situation that the wafer surface is damaged or the cleaning effect is poor due to excessive or insufficient water pressure.

[0016] Further, the support unit includes an electric push rod, a connecting frame, a drive motor and a baffle disc. The fixed end of the electric push rod is fixedly installed on the mounting frame. The output end of the electric push rod is fixedly connected with the connecting frame through a bent rod. The fixed end of the drive motor is fixedly connected with the connecting frame. The output end of the drive motor is fixedly connected with the rotating roller. The baffle disc is fixedly installed on the rotating roller.

[0017] When the wafer is placed on the rotating roller, the controller controls the drive motor to start, driving the baffle disc and the rotating roller to rotate, so that the wafer rotates, cooperating with the cleaning work. After the wafer is cleaned, the controller controls the electric push rod to start while controlling the drive motor to stop rotating, so that the electric push rod drives the drive motor and the baffle disc to move upward through the connecting frame, making the cleaned wafer move upward to separate from the cleaning area and return to the wafer grid.

[0018] Further, the detection unit comprises a workbench, a telescopic motor, a moving plate, a guide rail, a mapping sensor and a dust cover, the workbench is fixedly connected with the mounting frame, the fixed end of the telescopic motor is fixedly installed on the workbench, the telescopic motor is fixedly connected with the moving plate, the moving plate is slidably installed on the guide rail through a sliding rod, the guide rail is fixedly installed on the workbench, the mapping sensor is fixedly installed on the moving plate close to one end of the mounting frame, and the dust cover is fixedly installed on the workbench.

[0019] After the wafer cleaning is completed, the controller controls the telescopic motor to start, so as to drive the moving plate to move on the guide rail, and the mapping sensor on the moving plate detects the cleaned wafer, detects whether the wafer in each cell of the wafer box is odd, whether the thickness is uniform, and whether the wafer surface has defects, so as to feed back the information of the detected wafer to the computer record, and after the detection is completed, the controller controls the telescopic motor to retract, and drives the mapping sensor to retreat to the initial position.

[0020] Further, the bar magnet is N-pole close to one end of the rotating rod.

[0021] In order to control the controller to detect the distance of the bar magnet moving downward in the induction coil, the size value of the fixed direction current generated, so as to facilitate the electromagnetic iron to deliver different size current, avoid the situation that the brush assembly is worn and the wafer cleaning effect is poor.

[0022] Further, the sliding friction between the brush assembly and the roller is greater than the centrifugal force of the roller.

[0023] In order to avoid the situation that the brush assembly is separated from the roller when the rotating motor drives the rotating rod and the roller to rotate, so as to cause the wafer surface to be effectively cleaned.

[0024] Further, the mounting frame is provided with a controller.

[0025] In order to realize automatic control of the device and facilitate the staff to intervene, so as to avoid the emergence of unexpected situations.

[0026] Compared with the prior art, the beneficial effects of the present application are: 1、The present application through in the wafer cleaning process its surface will leave a thin layer of liquid film, double head telescopic motor contraction drive moving frame close to each other, brush and the layer of liquid film slight friction, due to the friction of Teflon in the electric sequence is easy to obtain negative charge, and water solution usually tend to positive, so this process will strengthen the overall positive liquid film characteristics, those will soon from the liquid film splashing out of the droplets, thus carrying the net positive charge, at this time the controller control motor start, for the positive plate transport positive charge, for the negative plate transport negative charge, the positive plate and negative plate between the formation of an electrostatic field, when a positive droplet from the wafer surface splashing, try to fall back to the wafer, it will immediately enter the electrostatic field, according to coulomb's law, positive droplet will be repelled by the positive plate and the negative plate attraction, under the action of the two forces, the droplet trajectory will occur sharply deflection, forced to change flight path, eventually from the installation frame of the outflow, thus avoiding the liquid droplet after cleaning again to the wafer surface, pollution to the wafer cleaning process.

[0027] 2、The present application through the controller control the motor start, drive the rotating rod rotation, so that the drum rotation, brush assembly for wafer surface cleaning, in the long cleaning process, due to the brush assembly and wafer surface contact caused by abrasion, when the brush assembly and wafer surface contact process, the brush assembly received wafer surface pressure becomes smaller, at this time under the action of wafer thrust, the brush assembly extrusion buffer spring at the same time drive the strip magnet in the straight cylinder moving distance becomes smaller, because the strip magnet in the inductor moving, magnetic flux changes, at this time the inductor produces instantaneous current becomes smaller, the controller detects instantaneous current becomes smaller, increase the input current to the electromagnet, electromagnet generated polarity becomes larger, thus push the magnetic block drive straight cylinder outward movement, under the action of support plate and buffer spring drive brush assembly to the outside, thus compensate the brush assembly abrasion caused by the brush assembly and wafer contact force becomes smaller, avoid the wafer surface cleaning effect becomes poor problem, the controller control water pump to the water pipe in the process of water flow, because the water flow exists flow velocity water pressure fluctuation, when the water pressure appears larger, water flow push valve flap stretch reset spring at the same time close to each other, reduce the water flow pressure, from the nozzle to the wafer surface, when the water pressure appears smaller, under the action of reset spring itself recovery force pull valve flap away from each other, increase the water flow, make the nozzle to the wafer surface water pressure always keep constant, avoid because the water pressure is too large or too small, resulting in wafer surface damage or cleaning effect becomes poor situation appears.

[0028] 3、The present application, after the wafer cleaning is completed, the controller controls the telescopic motor to start, thereby driving the moving plate to move on the guide rail, while the mapping sensor on the moving plate detects the cleaned wafer, detects whether the wafer in each cell of the wafer box is odd, whether the thickness is uniform, and whether the wafer surface has defects, thereby feeding back the information recorded by the computer after detection, and after detection is completed, the controller controls the telescopic motor to retract, driving the mapping sensor to retreat back to the initial position. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is an overall appearance structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 2 It is a partial appearance structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 1 Another view structure schematic view; Figure 3 It is a structure schematic view of the detection unit of the wafer cleaning equipment with defect and quantity detection function of the present application after removing the dust cover. Figure 4 It is a partial anti-splashing unit appearance structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 5 It is a partial feeding unit appearance structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 6 It is a moving frame and brush installation position structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 7 It is a roller internal structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 8 It is a straight cylinder internal structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application. Figure 9 It is a water pipe internal structure schematic view of the wafer cleaning equipment with defect and quantity detection function of the present application.

[0030] In the diagram: 1. Mounting bracket; 2. Anti-splash unit; 21. Starter motor; 22. Positive electrode plate; 23. Bracket; 24. Negative electrode plate; 25. Bracket; 26. Moving frame; 27. Starter brush; 3. Feeding unit; 31. Rotary motor; 32. Rotating rod; 33. Roller; 34. Electromagnet; 35. Magnetic block; 36. Straight cylinder; 37. Support plate; 38. Induction coil; 39. Bar magnet; 310. Buffer spring; 311. Brush assembly; 4. Water pressure regulating unit; 41. Water pipe; 42. Nozzle; 43. Valve disc; 44. Return spring; 5. Support unit; 51. Electric push rod; 52. Connecting frame; 53. Drive motor; 54. Baffle plate; 6. Detection unit; 61. Workbench; 62. Telescopic motor; 63. Moving plate; 64. Guide rail; 65. Mapping sensor; 66. Dust cover. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example: Figures 1-9 As shown, the present invention provides a technical solution: like Figure 1 , Figure 2 , Figure 4 As shown, a wafer cleaning device with defect and quantity detection functions includes a mounting frame 1, an anti-splash unit 2, a feeding unit 3, a water pressure regulating unit 4, a support unit 5, and a detection unit 6. The mounting frame 1 is placed on a horizontal ground. The anti-splash unit 2 is fixedly connected to the mounting frame 1 and has the function of preventing secondary contamination of the wafer. The feeding unit 3 is fixedly connected to the mounting frame 1, the water pressure regulating unit 4 is fixedly connected to the mounting frame 1, the support unit 5 is fixedly connected to the mounting frame 1, and the detection unit 6 is fixedly connected to the mounting frame 1.

[0033] Mounting bracket 1 is used to mount and fix anti-splash unit 2, feeding unit 3, water pressure regulating unit 4, and support unit 5. Anti-splash unit 2 is used to prevent cleaning fluid from flowing back to the wafer surface. Feeding unit 3 is used to automatically compensate for brush bristle wear during feeding. Water pressure regulating unit 4 is used to regulate fluctuating water pressure to ensure constant cleaning pressure. Support unit 5 supports the rotation of the wafer. Detection unit 6 is used to detect the defects and quantity on the wafer surface after cleaning. After the wafer is placed in support unit 5, water pressure regulating unit 4 ensures constant cleaning pressure, feeding unit 3 ensures automatic compensation for cleaning brush wear, anti-splash unit 2 prevents cleaning droplets from bouncing back to the wafer surface and causing secondary contamination, and detection unit 6 detects the defects and quantity on the wafer after cleaning.

[0034] As Figure 4 , Figure 6 shown, the anti-back splash unit 2 has two groups, two groups of anti-back splash unit 2 symmetrically arranged on both sides of the wafer, anti-back splash unit 2 includes the motor 21, the positive plate 22, the support 23, the negative plate 24, the bracket 25, the moving frame 26 and the brush 27, the motor 21 is fixedly installed on the mounting bracket 1, the positive plate 22 is fixedly connected with the mounting bracket 1 through the support 23, the negative plate 24 is fixedly connected with the mounting bracket 1 through the bracket 25, the moving frame 26 has two, two moving frames 26 are fixedly installed on the double-head telescopic motor telescopic end, the double-head telescopic motor fixed end is fixedly installed on the mounting bracket 1, the brush 27 is uniformly arranged on the moving frame 26, the positive plate 22 is a closed disc, the negative plate 24 is an arc plate, the mounting bracket 1 is arranged with a drainage groove below the negative plate 24, the brush 27 is made of Teflon, the motor 21 is connected with the positive plate 22 through a wire, and the motor 21 is connected with the negative plate 24 through a wire.

[0035] In the wafer cleaning process, a thin liquid film is left on the surface, the double-head telescopic motor is retracted to drive the moving frame 26 to approach each other, the brush 27 slightly rubs with the liquid film, since Teflon is easy to obtain negative charge in the friction electric series, and the aqueous solution usually tends to be positively charged, therefore, this process will strengthen the overall positive charge characteristics of the liquid film, those liquid droplets about to splash out of the liquid film therefore carry net positive charge, at this time, the controller controls the motor 21 to start, and the positive plate 22 is supplied with positive charge and the negative plate 24 is supplied with negative charge, an electrostatic field is formed between the positive plate 22 and the negative plate 24, when a positively charged liquid droplet splashes from the wafer surface and tries to fall back to the wafer, it will immediately enter the electrostatic field, according to Coulomb's law, the positively charged liquid droplet will be repelled by the positive plate 22 and attracted by the negative plate 24, under the action of the resultant force of the two forces, the motion trajectory of the liquid droplet will be sharply deflected, the flight path is forced to change, and finally flows out of the drainage groove of the mounting bracket 1, thereby avoiding the liquid droplets after cleaning from splashing back to the wafer surface, causing pollution to the wafer cleaning process.

[0036] As Figure 5 , Figure 7 , Figure 8 shown, the feeding unit 3 includes a rotating motor 31, a rotating rod 32, a roller 33, an electromagnet 34, a magnetic block 35 and a straight cylinder 36, the fixed end of the rotating motor 31 is fixedly installed on the mounting bracket 1, the output end of the rotating motor 31 is fixedly connected with one end of the rotating rod 32, the other end of the rotating rod 32 is rotatably connected with the mounting bracket 1, the roller 33 is fixedly installed on the rotating rod 32, the electromagnet 34 is fixedly installed on the rotating rod 32, the magnetic block 35 is fixedly installed on the outer surface of one end of the straight cylinder 36 close to the electromagnet 34, and the straight cylinder 36 is arranged in the roller 33.

[0037] AsFigure 7 , Figure 8 As shown, the feeding unit 3 also includes a support plate 37, an induction coil 38, a bar magnet 39, a buffer spring 310, and a bristle assembly 311. The support plate 37 is fixedly installed inside the straight cylinder 36, the induction coil 38 is disposed inside the straight cylinder 36, one end of the bar magnet 39 is fixedly connected to the bristle assembly 311, one end of the buffer spring 310 is fixedly connected to the bristle assembly 311, the other end of the buffer spring 310 is fixedly connected to the support plate 37, the bar magnet 39 is slidably connected to the support plate 37, and the bristle assembly 311 is slidably connected to the roller 33.

[0038] The controller starts the rotary motor 31, which drives the rotating rod 32 to rotate, thereby rotating the roller 33. The bristle assembly 311 cleans the wafer surface. During the long cleaning process, as the bristle assembly 311 wears down due to contact with the wafer surface, the pressure on the bristle assembly 311 from the wafer surface decreases. At this time, under the action of the wafer's thrust, the bristle assembly 311 compresses the buffer spring 310, while simultaneously causing the bar magnet 39 to move a shorter distance within the straight cylinder 36. As the 9 moves within the induction coil 38, the magnetic flux changes. At this time, the instantaneous current generated by the induction coil 38 decreases. When the controller detects that the instantaneous current has decreased, it increases the input current to the electromagnet 34. The polarity generated by the electromagnet 34 increases, thereby pushing the magnetic block 35 to move the straight cylinder 36 outward. Under the action of the support plate 37 and the buffer spring 310, the brush assembly 311 moves outward, thereby compensating for the reduced contact force between the brush assembly 311 and the wafer caused by wear of the brush assembly 311, and avoiding the problem of poor cleaning effect on the wafer surface.

[0039] like Figure 9 As shown, the water pressure regulating unit 4 includes a water pipe 41, a nozzle 42, a valve disc 43, and a return spring 44. The water pipe 41 is fixedly installed on the mounting bracket 1. One end of the water pipe 41 is connected to an external water pump. The nozzles 42 are evenly arranged on the water pipe 41. One end of the valve disc 43 is rotatably connected to the inside of the water pipe 41. The other end of the valve disc 43 is fixedly connected to one end of the return spring 44. The other end of the return spring 44 is fixedly connected to the inner wall of the water pipe 41.

[0040] During the process of the controller controlling the water pump to deliver water into the water pipe 41, due to fluctuations in water flow velocity and pressure, when the water pressure increases, the water flow pushes the valve discs 43 to stretch the return spring 44 and move them closer together, reducing the water flow and pressure, and spraying it from the nozzle 42 onto the wafer surface. When the water pressure decreases, the return spring 44 pulls the valve discs 43 away from each other under its own restoring force, increasing the water flow rate, so that the water pressure sprayed from the nozzle 42 onto the wafer surface remains constant, avoiding damage to the wafer surface or a decrease in cleaning effect due to excessive or insufficient water pressure.

[0041] As Figure 5 shown, the support unit 5 includes an electric push rod 51, a connecting frame 52, a drive motor 53 and a stop disc 54, the fixed end of the electric push rod 51 is fixedly installed on the mounting frame 1, the output end of the electric push rod 51 is fixedly connected with the connecting frame 52 through a bent rod, the fixed end of the drive motor 53 is fixedly connected with the connecting frame 52, the output end of the drive motor 53 is fixedly connected with a rotating roller, and the stop disc 54 is fixedly installed on the rotating roller.

[0042] When the wafer is placed on the rotating roller, the controller controls the drive motor 53 to start, drives the stop disc 54 and the rotating roller to rotate, so that the wafer rotates, and cooperates with the cleaning work. After the wafer cleaning is completed, the controller controls the electric push rod 51 to start while controlling the drive motor 53 to stop rotating, and the electric push rod 51 drives the drive motor 53 and the stop disc 54 to move upward through the connecting frame 52, so that the cleaned wafer moves upward to separate from the cleaning area and returns to the wafer grid.

[0043] As Figure 1 , Figure 3 shown, the detection unit 6 includes a workbench 61, a telescopic motor 62, a moving plate 63, a guide rail 64, a mapping sensor 65 and a dust cover 66, the workbench 61 is fixedly connected with the mounting frame 1, the fixed end of the telescopic motor 62 is fixedly installed on the workbench 61, the telescopic end of the telescopic motor 62 is fixedly connected with the moving plate 63, the moving plate 63 is slidably installed on the guide rail 64 through a sliding rod, the guide rail 64 is fixedly installed on the workbench 61, the mapping sensor 65 is fixedly installed on the moving plate 63 close to one end of the mounting frame 1, and the dust cover 66 is fixedly installed on the workbench 61.

[0044] After the wafer cleaning is completed, the controller controls the telescopic motor 62 to start, so as to drive the moving plate 63 to move on the guide rail 64, and at the same time, the mapping sensor 65 on the moving plate 63 detects the cleaned wafer, detects whether the wafer in each grid of the wafer box is odd, whether the thickness is uniform, and whether the wafer surface has defects, so as to feed back the detected information to the computer record. After the detection is completed, the controller controls the telescopic motor 62 to retract, drives the mapping sensor 65 to retreat to the initial position.

[0045] As Figure 7 , Figure 8 shown, the bar magnet 39 is N-pole close to one end of the rotating rod 32.

[0046] In order for the controller to detect the size of the current generated in the fixed direction of the bar magnet 39 moving downward in the induction coil 38, so as to facilitate the electromagnetic iron 34 to deliver different size currents, and avoid the situation that the bristle assembly 311 is worn out to cause poor cleaning effect of the wafer.

[0047] As Figure 8As shown, the sliding friction between the bristle assembly 311 and the roller 33 is greater than the centrifugal force of the roller 33.

[0048] To prevent the brush assembly 311 from detaching from the roller 33 when the rotary motor 31 drives the rotating rod 32 and the roller 33 to rotate, thus preventing the wafer surface from being effectively cleaned.

[0049] like Figure 1 As shown, a controller is installed on the mounting bracket 1.

[0050] To enable automated control of the device while facilitating staff intervention and thus preventing unexpected situations.

[0051] Working principle of the invention: When the wafer is placed on the rotating roller, the controller starts the drive motor 53, which drives the baffle 54 and the rotating roller to rotate, thereby causing the wafer to rotate. In conjunction with the cleaning process, the controller controls the water pump to deliver water into the water pipe 41. During this process, due to fluctuations in water flow rate and water pressure, when the water pressure increases, the water flow pushes the valve discs 43 to stretch the return spring 44 and move them closer together, reducing the water flow and water pressure. The water is then sprayed from the nozzle 42 onto the wafer surface. When the water pressure decreases, the return spring 44 pulls the valve discs 43 away from each other under its own restoring force, increasing the water flow rate. This ensures that the water pressure sprayed from the nozzle 42 onto the wafer surface remains constant, preventing damage to the wafer surface or a decrease in cleaning effect due to excessive or insufficient water pressure.

[0052] The controller starts the rotary motor 31, which drives the rotating rod 32 to rotate, thereby rotating the roller 33. The bristle assembly 311 cleans the wafer surface. During the long cleaning process, as the bristle assembly 311 wears down due to contact with the wafer surface, the pressure on the bristle assembly 311 from the wafer surface decreases. At this time, under the action of the wafer's thrust, the bristle assembly 311 compresses the buffer spring 310, while simultaneously causing the bar magnet 39 to move a shorter distance within the straight cylinder 36. As the 9 moves within the induction coil 38, the magnetic flux changes. At this time, the instantaneous current generated by the induction coil 38 decreases. When the controller detects that the instantaneous current has decreased, it increases the input current to the electromagnet 34. The polarity generated by the electromagnet 34 increases, thereby pushing the magnetic block 35 to move the straight cylinder 36 outward. Under the action of the support plate 37 and the buffer spring 310, the brush assembly 311 moves outward, thereby compensating for the reduced contact force between the brush assembly 311 and the wafer caused by wear of the brush assembly 311, and avoiding the problem of poor cleaning effect on the wafer surface.

[0053] In the wafer cleaning process, a thin liquid film is left on the surface of the wafer. The double-rod telescopic motor retracts to drive the moving frame 26 to move closer to each other. The brush 27 slightly rubs against the liquid film. Since Teflon easily acquires negative charge in the rubbing electricity sequence, and the water solution usually tends to carry positive charge, this process enhances the overall positive charge characteristics of the liquid film. Those liquid droplets that are about to splash out of the liquid film thus carry net positive charge. At this time, the controller controls the motor 21 to start, and supplies positive charge to the positive plate 22 and negative charge to the negative plate 24. An electrostatic field is formed between the positive plate 22 and the negative plate 24. When a positively charged liquid droplet splashes from the wafer surface and attempts to fall back onto the wafer, it immediately enters the electrostatic field. According to Coulomb's law, the positively charged liquid droplet is repelled by the positive plate 22 and attracted by the negative plate 24. Under the action of the resultant force of the two forces, the trajectory of the liquid droplet is sharply deflected, and is forced to change the flight path. Finally, the liquid droplet flows out of the drainage groove of the mounting frame 1, thereby avoiding the contamination of the wafer surface caused by the splashing of the liquid droplets after cleaning.

[0054] After the wafer cleaning is completed, the controller controls the electric push rod 51 to start while controlling the driving motor 53 to stop rotating. The electric push rod 51 drives the driving motor 53 and the baffle plate 54 to move upward through the connecting frame 52, so that the cleaned wafer moves upward to separate from the cleaning area and return to the wafer grid. After the wafer cleaning is completed, the controller controls the telescopic motor 62 to start, thereby driving the moving plate 63 to move on the guide rail 64. At the same time, the mapping sensor 65 on the moving plate 63 detects the cleaned wafer to detect whether the wafer in each cell of the wafer box is odd, whether the thickness is uniform, and whether the wafer surface has defects, thereby feeding back the detected information to the computer record. After the detection is completed, the controller controls the telescopic motor 62 to retract, thereby driving the mapping sensor 65 to retreat to the initial position.

[0055] It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims.

Claims

1. A wafer cleaning device with defect and quantity detection functions, characterized in that: The wafer cleaning equipment with the accompanying defect and quantity detection function, including mounting frame (1), anti-splashing unit (2), feeding unit (3), water pressure adjusting unit (4), support unit (5) and detection unit (6), the mounting frame (1) is placed on the horizontal ground, the anti-splashing unit (2) is fixedly connected with the mounting frame (1), the anti-splashing unit (2) has the function of avoiding secondary pollution of the wafer, the feeding unit (3) is fixedly connected with the mounting frame (1), the water pressure adjusting unit (4) is fixedly connected with the mounting frame (1), the support unit (5) is fixedly connected with the mounting frame (1), and the detection unit (6) is fixedly connected with the mounting frame (1).

2. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The anti-splashing unit (2) has two groups, and the two groups of anti-splashing units (2) are symmetrically arranged on both sides of the wafer, the anti-splashing unit (2) includes a motor (21), a positive plate (22), a support (23), a negative plate (24), a bracket (25), a moving frame (26) and a starting brush (27), the motor (21) is fixedly installed on the mounting frame (1), the positive plate (22) is fixedly connected with the mounting frame (1) through the support (23), the negative plate (24) is fixedly connected with the mounting frame (1) through the bracket (25), the moving frame (26) has two, the two moving frames (26) are fixedly installed on the telescopic end of the double-head telescopic motor, the fixed end of the double-head telescopic motor is fixedly installed on the mounting frame (1), the starting brush (27) is uniformly arranged on the moving frame (26), the positive plate (22) is a closed disc, the negative plate (24) is an arc-shaped disc, the mounting frame (1) is located below the negative plate (24) and is provided with a drainage groove, the starting brush (27) is made of Teflon, the motor (21) is connected with the positive plate (22) through wires, and the motor (21) is connected with the negative plate (24) through wires.

3. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The feeding unit (3) includes a rotating motor (31), a rotating shaft (32), a roller (33), an electromagnet (34), a magnetic block (35) and a straight cylinder (36), the fixed end of the rotating motor (31) is fixedly installed on the mounting frame (1), one end of the rotating motor (31) is fixedly connected with the rotating shaft (32), the other end of the rotating shaft (32) is rotatably connected with the mounting frame (1), the roller (33) is fixedly installed on the rotating shaft (32), the electromagnet (34) is fixedly installed on the rotating shaft (32), the magnetic block (35) is fixedly installed on the outer surface of one end of the straight cylinder (36) close to the electromagnet (34), and the straight cylinder (36) is arranged in the roller (33).

4. The wafer cleaning apparatus with a defect and quantity detection function according to claim 3, wherein: The feeding unit (3) further comprises a support plate (37), an induction coil (38), a bar magnet (39), a buffer spring (310) and a bristle assembly (311), the support plate (37) is fixedly installed in the straight cylinder (36), the induction coil (38) is arranged in the straight cylinder (36), one end of the bar magnet (39) is fixedly connected with the bristle assembly (311), one end of the buffer spring (310) is fixedly connected with the bristle assembly (311), the other end of the buffer spring (310) is fixedly connected with the support plate (37), the bar magnet (39) is slidably connected with the support plate (37), and the bristle assembly (311) is slidably connected with the roller (33).

5. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The water pressure adjusting unit (4) comprises a water pipe (41), a nozzle (42), a valve clack (43) and a return spring (44), the water pipe (41) is fixedly installed on the mounting rack (1), one end of the water pipe (41) is connected with an external water pump, the nozzles (42) are uniformly arranged on the water pipe (41), one end of the valve clack (43) is rotatably connected with the water pipe (41), the other end of the valve clack (43) is fixedly connected with one end of the return spring (44), and the other end of the return spring (44) is fixedly connected with the inner wall of the water pipe (41).

6. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The supporting unit (5) comprises an electric push rod (51), a connecting frame (52), a driving motor (53) and a baffle disc (54), the fixed end of the electric push rod (51) is fixedly installed on the mounting rack (1), the output end of the electric push rod (51) is fixedly connected with the connecting frame (52) through a bent rod, the fixed end of the driving motor (53) is fixedly connected with the connecting frame (52), the output end of the driving motor (53) is fixedly connected with the rotating roller, and the baffle disc (54) is fixedly installed on the rotating roller.

7. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The detection unit (6) comprises a workbench (61), a telescopic motor (62), a moving plate (63), a guide rail (64), a mapping sensor (65) and a dustproof cover (66), the workbench (61) is fixedly connected with the mounting rack (1), the fixed end of the telescopic motor (62) is fixedly installed on the workbench (61), the telescopic end of the telescopic motor (62) is fixedly connected with the moving plate (63), the moving plate (63) is slidably installed on the guide rail (64) through a sliding rod, the guide rail (64) is fixedly installed on the workbench (61), the mapping sensor (65) is fixedly installed on one end of the moving plate (63) close to the mounting rack (1), and the dustproof cover (66) is fixedly installed on the workbench (61).

8. The wafer cleaning apparatus with a defect and quantity detection function according to claim 4, wherein: The bar magnet (39) is an N-pole close to one end of the rotating rod (32).

9. The wafer cleaning apparatus with a defect and quantity detection function according to claim 4, wherein: The sliding friction force between the bristle assembly (311) and the roller (33) is greater than the centrifugal force of the roller (33).

10. The wafer cleaning apparatus with a defect and quantity detection function according to claim 1, wherein: The mounting rack (1) is provided with a controller.

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