Co-processing device for waste printed circuit board product and copper-containing sludge and method thereof
By designing a synergistic thermal treatment device and method, the problem of synergistic treatment of waste circuit board sorting products and high-moisture copper-containing sludge was solved, achieving efficient copper recovery and environmentally friendly treatment, and improving resource utilization efficiency.
Patent Information
- Application Number
- CN202511493447.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2045-10-20
AI Technical Summary
Existing technologies lack effective methods for the co-processing of waste circuit board sorting products and high-moisture copper-containing sludge, resulting in low copper recovery rates and severe environmental pollution. Furthermore, there is a lack of automated screening and transport efficiency for the processed fragments.
A co-processing device for waste circuit board products and copper-containing sludge was designed, including a conveying component, a pushing component, and an adjusting component. The device achieves automatic screening and conveying of fragments through a motor-driven rotating rod and connecting rod structure, and controls the discharge speed through the adjusting component, and performs co-processing in conjunction with a pyrolysis reactor.
This technology enables the co-processing of waste circuit board sorting products and copper-containing sludge, improving copper recovery rates, reducing environmental burden, and enhancing the utilization value of solid waste.
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Figure CN120961556B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of solid waste treatment, and particularly relates to a device and method for synergistically thermal treatment of waste printed circuit board products and copper-containing sludge. BACKGROUND
[0002] Currently, the recycling and treatment of electronic waste and sludge faces many challenges. The waste printed circuit board light board sorting product is a typical difficult-to-treat part of electronic waste, which is mainly composed of glass fiber and epoxy resin, and also contains high-value metals such as gold, silver, palladium and copper, with a content of about 10%. Traditional recycling methods such as incineration and chemical treatment can extract part of the metal, but due to incomplete combustion and waste gas pollution, they often cause environmental burden, and the copper recovery rate is low. The heavy metal copper in high-moisture copper-containing sludge has high recycling value. Due to the huge output of sludge, pyroprocessing is the most effective way to achieve harmlessness, reduction and resource utilization of this type of sludge. However, at present, when copper-containing sludge is treated by pyroprocessing, only reduction or harmlessness treatment can be carried out, and high-value metals such as copper cannot be recovered, or the copper content in the slag is too high, resulting in a low copper recovery rate, making it difficult to achieve efficient recovery and utilization of copper, and also causing environmental pollution and resource waste.
[0003] In the prior art, there is a lack of a technical method for synergistically treating waste printed circuit board sorting products and high-moisture copper-containing sludge to improve resource recovery efficiency and reduce environmental pollution. For automated production, the prior art can easily complete the conveying of dried sludge, but the waste printed circuit board broken product lacks an effective processing means for screening and processing the fragments, while controlling the transmission efficiency of the fragments. SUMMARY
[0004] In view of the above problems of the prior art waste printed circuit board product and copper-containing sludge synergistically thermal treatment device and method, the present application is proposed.
[0005] Therefore, the present application aims to provide a waste printed circuit board product and copper-containing sludge synergistically thermal treatment device and method, which realizes the synergistic treatment of waste printed circuit board sorting products and copper-containing sludge and the efficient recovery of copper.
[0006] To solve the above technical problems, the application provides the following technical scheme: a waste circuit board product and copper-containing sludge collaborative thermal disposal device, comprising: a conveying assembly, comprising a mounting frame, a first motor arranged on the mounting frame, a rotating rod connected with the first motor, a first connecting rod and a second connecting rod arranged on the rotating rod, a lower conveying frame connected with the first connecting rod, an upper conveying frame connected with the second connecting rod, an inlet arranged on the mounting frame, and a discharge platform; a pushing assembly arranged on the mounting frame, comprising a fixed frame, a second motor arranged on the fixed frame, a driving rod connected with the second motor, a transmission rod connected with the driving rod, a push rod connected with the transmission rod, and a push block connected with the push rod; and an adjusting assembly arranged on the fixed frame, comprising a handle, a first bevel gear arranged on the handle, a second bevel gear meshing with the first bevel gear, a threaded rod fixed with the second bevel gear, a support rod arranged on the threaded rod, an arc-shaped groove arranged on the fixed frame, a sliding block arranged in the arc-shaped groove, a positioning rod rotatably arranged on the sliding block, and an adjusting rod rotatably connected with the positioning rod.
[0007] As a preferred scheme of the waste circuit board product and copper-containing sludge collaborative thermal disposal device, the mounting frame is fixedly provided with the first motor at the bottom, the output shaft of the first motor is fixedly connected with the rotating rod, two center-symmetrical connecting rods are arranged on the rotating rod, one end of the first connecting rod is rotatably connected with one connecting rod, and the other end is rotatably connected with the lower conveying frame.
[0008] As a preferred scheme of the waste circuit board product and copper-containing sludge collaborative thermal disposal device, the inner wall of the mounting frame is also symmetrically provided with a slide, the upper conveying frame is slidably arranged in the slide, the upper conveying frame comprises two upper side plates and an upper partition plate arranged between the upper side plates, the upper side plates are slidably arranged in the slide, the upper partition plate is fixedly arranged on the upper side plates, the upper partition plate is provided with three upper partition plates, the upper partition plates are spaced apart by a fixed distance, and the height of the upper partition plates gradually decreases layer by layer.
[0009] As a preferred scheme of the waste circuit board product and copper-containing sludge collaborative thermal disposal device, the lower conveying frame comprises a lower bottom plate and a lower partition plate fixedly arranged on the lower bottom plate, the lower partition plate is provided with three lower partition plates, the lower partition plates are spaced apart by a fixed distance, the distance between the upper partition plates is equal to the thickness of the lower partition plate, and the distance between the lower partition plates is equal to the thickness of the upper partition plate; the length of the lower partition plate gradually decreases layer by layer, and the lower partition plate is embedded between the upper partition plates.
[0010] As a preferred scheme of the waste circuit board product and copper-containing sludge synergistic thermal disposal device, the feeding port is fixedly arranged beside the lower partition plate, the discharging platform is arranged on the top of the inner wall of the mounting frame, and the discharging platform, the upper conveying frame, the lower conveying frame and the slide are arranged in an inclined manner.
[0011] As a preferred scheme of the waste circuit board product and copper-containing sludge synergistic thermal disposal device, the fixed frame is fixed to one side of the top of the mounting frame, the second motor output shaft is fixedly connected with the drive rod, the drive rod is a crankshaft, one end of the transmission rod is rotatably connected with the drive rod, and the other end is rotatably connected with the end of the push rod.
[0012] As a preferred scheme of the waste circuit board product and copper-containing sludge synergistic thermal disposal device, the handle is rotatably arranged on the fixed frame, the first bevel gear is fixedly arranged on the handle rod, the supporting rod is in a right angle shape, one end is rotatably connected with the handle, and the other end is rotatably connected with the threaded rod, and the handle and the threaded rod are both provided with a limiting ring to prevent the supporting rod from sliding along the rod.
[0013] As a preferred scheme of the waste circuit board product and copper-containing sludge synergistic thermal disposal device, the threaded rod penetrates through the positioning rod and is connected with the positioning rod through threads, the sliding block can slide along the arc-shaped groove, one side of the positioning rod is inserted into the sliding block and is rotatably connected with the sliding block, and the other side is rotatably connected with the end of the adjusting rod.
[0014] As a preferred scheme of the waste circuit board product and copper-containing sludge synergistic thermal disposal device, the end of the adjusting rod away from the positioning rod is rotatably connected with the transmission rod, and the adjusting rod, the transmission rod and the push rod are the same rotating shaft.
[0015] The application discloses a waste circuit board product and copper-containing sludge synergistic thermal disposal method, mainly including the following steps:
[0016] S1: the waste circuit board is coarsely crushed to obtain a processing product;
[0017] S2: the high-wet copper-containing sludge is dried;
[0018] S3: the waste circuit board product is added into a reactor through a waste circuit board product and copper-containing sludge synergistic thermal disposal device, and the sludge is directly poured into the reactor;
[0019] S4: the pyrolysis temperature and the reaction time of the reactor are set, the oxygen is continuously and stably introduced into the reactor until the reaction stops;
[0020] S5: Collect the metal particles generated after the reaction and measure the weight loss rate of the reaction material, and the residual glass fiber continues to participate in the pyrolysis reaction as an inert porous medium.
[0021] Advantages of the present application:
[0022] The waste circuit board product in the present application and the copper-containing sludge cooperative thermal disposal device can independently screen smaller waste circuit board fragments, which are sent to the reactor, and at the same time, the discharge rate of the waste circuit board fragments can be adjusted in cooperation with the conveying efficiency of the sludge; the cooperative disposal thermal method in the present application realizes the cooperative treatment of the waste circuit board sorting product and the copper-containing sludge and the efficient recovery of copper by combining the two wastes, which reduces the environmental burden and realizes the high-value utilization of solid waste. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:
[0024] Figure 1 It is the overall structure schematic diagram of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0025] Figure 2 It is the rear view of the overall structure of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0026] Figure 3 It is the mounting rack structure schematic diagram of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0027] Figure 4 It is the rear view of the mounting rack structure of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0028] Figure 5 It is the upper conveying rack structure schematic diagram of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0029] Figure 6 It is the rear view of the upper conveying rack structure of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0030] Figure 7 It is the lower conveying rack structure schematic diagram of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0031] Figure 8 It is the rotating rod structure schematic diagram of the waste circuit board product and copper-containing sludge cooperative thermal disposal device of the present application.
[0032] Figure 9 Structure diagram of conveying assembly of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0033] Figure 10 Structure sectional view of conveying assembly of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0034] Figure 11 Structure diagram of pushing assembly and adjusting assembly of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0035] Figure 12 Overall structure diagram of pushing block of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0036] Figure 13 Structure diagram of adjusting assembly of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0037] Figure 14 Structure diagram of driving rod of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0038] Figure 15 Structure diagram of adjusting rod of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0039] Figure 16 Structure diagram of sliding block of the waste circuit board product and copper-containing sludge collaborative thermal disposal device.
[0040] Figure 17 Flowchart of the waste circuit board product and copper-containing sludge collaborative thermal disposal method.
[0041] The drawing number: 100, conveying assembly; 101, mounting frame; 101a, slide; 102, first motor; 103, rotating rod; 103a, connecting rod; 104, first connecting rod; 105, second connecting rod; 106, lower conveying frame; 106a, lower bottom plate; 106b, lower partition plate; 107, upper conveying frame; 107a, upper side plate; 107b, upper partition plate; 108, feeding port; 109, discharging platform; 109a, baffle; 200, pushing assembly; 201, fixed frame; 201a, sliding cavity; 202, second motor; 203, driving rod; 204, transmission rod; 205, pushing rod; 206, pushing block; 300, adjusting assembly; 301, handle; 302, first bevel gear; 303, second bevel gear; 304, threaded rod; 305, support rod; 306, arc-shaped groove; 307, sliding block; 308, positioning rod; 309, adjusting rod. DETAILED DESCRIPTION
[0042] In order to make the above objectives, features and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0043] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced without the specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure aspects of the present application. Accordingly, it will be appreciated that the present application can be practiced with modification and alteration, and that the present application be limited by the
[0044] Second, the "one embodiment" or "an embodiment" as used in this specification means that a particular implementation can contain one or more features, structures, or characteristics, but each of the features, structures, or characteristics can not be required in all implementations of the application. Thus, each of the appearances of "in one embodiment" or "in an embodiment" in various places in the specification are not necessarily referring to the same embodiment nor are they necessarily all directed to the same embodiment.
[0045] Third, the present application is described in connection with exemplary embodiments. With specific reference to the figures in place of an overall description, the cross-sectional views of the device structure are partially enlarged without the general proportion for the convenience of explanation, and the schematic diagrams are only examples which should not limit the scope of the present application. In addition, the three-dimensional spatial dimensions including length, width and depth should be included in the actual manufacture.
[0046] Example 1
[0047] Reference Figures 1-16For the first embodiment of the present application, a device for synergistically disposing waste circuit board product and copper-containing sludge is provided, which comprises a conveying assembly 100, a pushing assembly 200 and an adjusting assembly 300. The conveying assembly 100 comprises a mounting frame 101, a first motor 102 arranged on the mounting frame 101, a rotating rod 103 connected with the first motor 102, a first connecting rod 104 and a second connecting rod 105 arranged on the rotating rod 103, a lower conveying frame 106 connected with the first connecting rod 104, an upper conveying frame 107 connected with the second connecting rod 105, an inlet 108 and an outlet platform 109 arranged on the mounting frame 101. The pushing assembly 200 is arranged on the mounting frame 101 and comprises a fixing frame 201, a second motor 202 arranged on the fixing frame 201, a driving rod 203 connected with the second motor 202, a transmission rod 204 connected with the driving rod 203, a pushing rod 205 connected with the transmission rod 204, and a pushing block 206 connected with the pushing rod 205. The adjusting assembly 300 is arranged on the fixing frame 201 and comprises a handle 301, a first bevel gear 302 arranged on the handle 301, a second bevel gear 303 engaged with the first bevel gear 302, a threaded rod 304 fixed with the second bevel gear 303, a supporting rod 305 arranged on the threaded rod 304, an arc-shaped groove 306 arranged on the fixing frame 201, a sliding block 307 arranged in the arc-shaped groove 306, a positioning rod 308 rotatably arranged on the sliding block 307, and an adjusting rod 309 rotatably connected with the positioning rod 308.
[0048] The first motor 102 is fixedly arranged at the bottom of the mounting frame 101, and the output shaft of the first motor 102 is fixedly connected with the rotating rod 103. The rotating rod 103 is provided with two center-symmetrical connecting rods 103a along the central axis of the rotating rod 103. One end of the first connecting rod 104 is rotatably connected with one of the connecting rods 103a, and the other end is rotatably connected with the lower conveying frame 106. One end of the second connecting rod 105 is rotatably connected with the other connecting rod 103a, and the other end is rotatably connected with the upper conveying frame 107. The inner wall of the mounting frame 101 is also provided with two symmetrical slideways 101a. The upper conveying frame 107 is slidably arranged in the slideway 101a. The upper conveying frame 107 comprises two upper side plates 107a and an upper partition plate 107b arranged between the upper side plates 107a. The upper side plates 107a are slidably arranged in the slideway 101a. The upper partition plate 107b is provided with three upper partition plates 107b fixedly arranged on the upper side plates 107a. The upper partition plates 107b are spaced apart by a fixed distance. The height of the upper partition plates 107b gradually decreases layer by layer. The lower conveying frame 106 comprises a lower bottom plate 106a and a lower partition plate 106b fixedly arranged on the lower bottom plate 106a. The lower partition plate 106b is provided with three lower partition plates 106b. The lower partition plates 106b are spaced apart by a fixed distance. The distance between the upper partition plates 107b is equal to the thickness of the lower partition plate 106b. The distance between the lower partition plates 106b is equal to the thickness of the upper partition plate 107b. The length of the lower partition plate 106b gradually decreases layer by layer. The feeding port 108 is fixedly arranged beside the lower partition plate 106b. The discharging platform 109 is arranged at the top of the inner wall of the mounting frame 101. The discharging platform 109, the upper conveying frame 107, the lower conveying frame 106 and the slideway 101a are inclinedly arranged. The discharging platform 109 is further provided with a baffle 109a.
[0049] In use, referring to Figures 1-10The waste circuit board fragments are poured into the feeding port 108, the first motor 102 is started, and the first motor 102 can drive the rotating rod 103 to rotate. At this time, since the rotating rod 103 is provided with two center-symmetrical connecting rods 103a, the connecting rods 103a can drive the first connecting rod 104 and the second connecting rod 105 to move when the connecting rods 103a rotate. The slide 101a is arranged on the inner wall of the mounting frame 101, the upper conveying frame 107 is arranged in the slide 101a, so that the upper conveying frame 107 can only move along the direction of the slide 101a, and each lower partition plate 106b in the lower conveying frame 106 is inserted between the upper partition plates 107b in the upper conveying frame 107, so that the lower conveying frame 106 can only move along the direction of the upper conveying frame 107. The first connecting rod 104 and the second connecting rod 105 can drive the upper conveying frame 107 and the lower conveying frame 106 to move alternately. The movement process is as follows: when the first connecting rod 104 rotates from the bottom end of the rotating rod 103 to the top end, the second connecting rod 105 rotates from the top end of the rotating rod 103 to the bottom end at this time, the first connecting rod 104 lifts the lower conveying frame 106, and the second connecting rod 105 lowers the upper conveying frame 107. At this time, the upper conveying frame 107 and the lower conveying frame 106 are embedded to the deepest degree, each lower partition plate 106b has the same height as each corresponding upper partition plate 107b. At this time, since the upper conveying frame 107 and the lower conveying frame 106 are arranged obliquely, the fragments on the lower partition plate 106b can roll onto the upper partition plate 107b with the same height. Each partition plate performs the above movement; when the first connecting rod 104 rotates from the top end of the rotating rod 103 to the bottom end, the second connecting rod 105 rotates from the bottom end of the rotating rod 103 to the top end at this time, the upper conveying frame 107 and the lower conveying frame 106 are staggered, the upper conveying frame 107 is lifted, and the lower conveying frame 106 is lowered. At this time, the lowest layer of the upper partition plate 107b is flush with the second layer of the lower partition plate 106b, the second layer of the upper partition plate 107b is flush with the highest layer of the lower partition plate 106b, and the highest layer of the upper partition plate 107b is flush with the discharge platform 109, that is, the fragments on the upper partition plate 107b have climbed one layer compared with before. Through the oblique arrangement, the fragments slide onto each partition plate. At the same time, oversized fragments cannot climb through the narrow partition plates, automatic screening is realized, and the transportation efficiency of the fragments can be controlled by the rotating speed of the first motor 102.
[0050] In order to adjust the discharge speed of the fragments, the fixed frame 201 is fixed on one side of the top of the mounting frame 101, the output shaft of the second motor 202 is fixedly connected with the driving rod 203, the driving rod 203 is a crankshaft, one end of the transmission rod 204 is rotatably connected with the driving rod 203, and the other end is rotatably connected with the end of the push rod 205; the fixed frame 201 is also provided with a sliding cavity 201a, the push block 206 is slidably arranged in the sliding cavity 201a, and the end of the push rod 205 away from the transmission rod 204 is rotatably connected with the push block 206. The handle 301 is rotatably arranged on the fixed frame 201, the first bevel gear 302 is fixedly arranged on the rod part of the handle 301, the supporting rod 305 is in a right angle shape, one end is rotatably connected with the handle 301, and the other end is rotatably connected with the threaded rod 304, the handle 301 and the threaded rod 304 are both provided with a limiting ring to prevent the supporting rod 305 from sliding along the rod part. The threaded rod 304 penetrates through the positioning rod 308 and is connected with the positioning rod 308 through threads, the sliding block 307 can slide along the arc-shaped groove 306, one side of the positioning rod 308 is inserted into the sliding block 307 and is rotatably connected with the sliding block 307, and the other side is rotatably connected with the end of the adjusting rod 309. The end of the adjusting rod 309 away from the positioning rod 308 is rotatably connected with the transmission rod 204, and the adjusting rod 309, the transmission rod 204 and the push rod 205 are the same rotating shaft.
[0051] Reference Figures 11-16The baffle 109a is arranged on the discharging platform 109 to prevent the fragments from affecting the operation of the push rod 205, and the whole discharging platform 109 can be inclined to the discharging port, so that the fragments slide to the discharging port, and the second motor 202 can be started to control the discharging speed of the fragments, the second motor 202 drives the driving rod 203 to rotate, and since the driving rod 203 is a crankshaft, the rotation of the driving rod 203 can make the transmission rod 204 control the push rod 205 to move back and forth in the sliding cavity 201a, and it should be noted that, due to the self-locking effect of the first bevel gear 302 and the second bevel gear 303, the threaded rod 304 remains unchanged, and since the positioning rod 308 is connected with the threaded rod 304 through threads, the adjusting rod 309 remains unchanged and has no effect on the cyclic movement of the push rod 205, the push rod 205 drives the push block 206 to cyclically reciprocate in the extension direction of the sliding cavity 201a, when the push rod 205 is retracted, the fragments can slide down the inclined slope of the discharging platform 109, and when the push rod 205 is pushed out, the fragments can be pushed out to the discharging port, thereby completing the discharging, and the handle 301 can be rotated to drive the first bevel gear 302 to rotate, and the second bevel gear 303 is engaged with the first bevel gear 302, so that the second bevel gear 303 can drive the threaded rod 304 to rotate, the threaded rod 304 adjusts the position of the positioning rod 308 through threads, so that the positioning rod 308 moves on the threaded rod 304 and drives the sliding block 307 to slide on the arc-shaped groove 306, and it should be noted that, when the positioning rod 308 moves, the threaded rod 304 gradually inclines, and the supporting rod 305 can ensure that the second bevel gear 303 is engaged with the first bevel gear 302, and after the positioning rod 308 moves to the end of the threaded rod 304, the inclination angle of the adjusting rod 309 is changed, and at this time, the compression ratio of the push rod 205 in the sliding cavity 201a is changed, so that the stroke of the push rod 205 in each cycle is changed, and specifically, the distance of the push rod 205 between retraction and extension is lengthened, and the pushed-out fragments are more, thereby adjusting the discharging speed, and in actual operation, the discharging speed can be matched with the transportation speed of the partition plate.
[0052] Example 2
[0053] Reference Figure 17 For the second embodiment of the application, which is different from the first embodiment, a method for cooperatively and thermally disposing waste circuit board products and copper-containing sludge is provided.
[0054] S1: Pretreatment of waste circuit board light board sorting products. The collected waste circuit board light board sorting products are coarsely broken by a large shearing equipment, then broken by a hammer crusher, and then screened to obtain pretreated waste circuit board light board sorting products.
[0055] S2: Pretreatment of high-moisture copper-containing sludge. The collected high-moisture copper-containing sludge is dried by a drum dryer, then broken and ground to obtain pretreated copper-containing sludge.
[0056] S3: The waste PCB light board sorting product is mixed with copper-containing sludge for treatment. A spiral mixer is used to mix the pretreated waste PCB light board sorting product and high-moisture copper-containing sludge uniformly according to a certain proportion.
[0057] S4: The mixed waste PCB light board sorting product and copper-containing sludge are co-treated by heat. Before starting the experiment, the air tightness of the entire reaction device is checked. After the materials are uniformly mixed, they are placed in the reactor, the pyrolysis temperature and reaction time are set, and the reaction stage continues to introduce a stable flow of oxygen until the reaction stops.
[0058] S5: The metal particles generated after the reaction are collected and the weight loss rate of the reaction material is measured, and the residual glass fiber is used as an inert porous medium to continue to participate in the pyrolysis reaction or used for building structures and decorative materials.
[0059] Compared with Example 1, further, in S1, the waste PCB light board sorting product is the part remaining after the waste PCB light board is preliminarily removed of heavy metals such as copper, with a copper content of 5%-10% and a resin and glass fiber content of 70%-80%.
[0060] In S1, a hammer crusher is used to crush the waste PCB light board sorting product to a particle size of 0.8-1.2 mm, and then a 20-mesh screen is used to screen the crushed waste PCB light board sorting product.
[0061] In S2, the drying process temperature is 160°C and the time is 12h, and after drying, the sludge has a moisture content of 30%-35% and a copper content of 45%-60%.
[0062] In S2, a 60-mesh screen is used to screen the crushed sludge.
[0063] In S3, the ratio of the waste PCB light board sorting product to the sludge can be 1:3, 1:4, or 1:5.
[0064] In S3, the speed of the spiral mixer is 100-200 rpm and the time is 2h.
[0065] In S4, the reactor is wrapped with a 40mm thick asbestos insulation layer.
[0066] In S4, the reactor is a concave device and heating coils are evenly distributed on the two sides of the reactor.
[0067] In S4, an air distributor is present at the bottom of the reactor to make the incoming air more uniform and stable.
[0068] In S4, the pyrolysis reaction temperature is 500-900°C, the reactor heating rate is 10°C / min, and the constant temperature reaction time is 60-180min.
[0069] In S4, the oxygen concentration in the reactor is 5-30%, the carrier gas flow rate is 0.5-1 Nm3 / h·m2, and the gas flow rate is 0.5-0.8 m / s.
[0070] In S5, the metal particles generated after the reaction are collected, and the weight loss rate of the reaction material and the total recovery rate of high-value metals are measured.
[0071] In S5, the residual glass fibers are used as inert porous media to continue participating in the pyrolysis reaction in S3, and are reused or used for building structures and decorative materials.
[0072] Compared with the prior art, the method has the following advantages:
[0073] 1. The treatment technology is a synergistic pyrolysis disposal technology. The pollutants are treated by pyrolysis under a low-oxygen atmosphere. The required temperature for pyrolysis is much lower than that for flaming combustion, and the reaction is relatively mild. The reaction process is safe and easy to control. The whole process does not require the addition of fuel, and the disposal cost and carbon emissions of pyrolysis treatment are much lower than those of traditional garbage incineration and other soil remediation technologies. It is a clean, environmentally friendly, and sustainable treatment technology.
[0074] 2. The waste circuit board light board sorting product contains a large amount of resin matrix, which has a certain flammability and a high calorific value, and can be used as fuel in the pyrolysis process. The heat provided by the fuel can completely support the pyrolysis reaction, and the heat generated by the partial combustion of the resin matrix in the waste circuit board light board sorting product can be fully utilized, and the sludge reaction is complete. After the treatment is completed, the glass fibers in the waste circuit board light board sorting product will remain, which can be directly used as inert porous media to continue participating in the pyrolysis reaction for reuse, which can enhance the air permeability of the reaction material, make the pyrolysis of the reaction material more complete, and speed up the pyrolysis efficiency. The recovered glass fibers have complete shape and good performance, and their physical and chemical properties are basically equivalent to those of newly produced glass fibers, with the characteristics of high strength, corrosion resistance, and high temperature resistance.
[0075] The specific experimental steps are as follows: (1) The waste circuit board light board sorting product collected has a copper content of 8.46% and a resin matrix content of 47.86%. After coarse crushing by a large-scale shearing device, the product is crushed to a particle size of 0.8-1.2 mm by a hammer crusher, and then sieved by a 20-mesh screen.
[0076] (2) The high-moisture copper-containing sludge collected has a water content of 70.66%. It is dried in a drum dryer with a temperature of 160°C for 12 hours. After drying, the sludge has a copper content of 50.25%. Then, the sludge is crushed by a crusher and sieved by a 60-mesh screen to obtain the pretreated sludge.
[0077] (3) The pretreated waste PCB light board sorting product and the pretreated high-humidity copper-containing sludge were mixed uniformly at a ratio of 1:3 using a spiral mixer, the rotation speed of the spiral mixer was 200 rpm, and the time length was 2 h.
[0078] (4) Before starting the experiment, the air tightness of the entire reaction device was checked, and the materials were uniformly mixed and filled into the reactor. The pyrolysis reaction temperature was set to 800°C, the reactor heating rate was 10°C / min, the constant temperature reaction time was 180 min. The oxygen concentration in the reactor was 10%, the carrier gas flow rate was 1 Nm³ / h·m2, and the gas flow rate was 0.7 m / s.
[0079] (5) After the reaction was completed, the weight loss rate of the reaction material was 76.68%, the copper oxide content in the pyrolysis solid product was 87.53%, the total recovery rate of high-value metals such as gold, silver, palladium, and copper was >98%, and the obtained glass fiber was in a complete form and had good performance, and the physicochemical properties were basically equivalent to those of newly produced glass fiber, and could be used for building structures and decorative materials.
[0080] Importantly, it should be noted that the constructions and arrangements of the present application shown in the various different example embodiments are merely illustrative. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) using the principles and concepts taught herein, without materially departing from the novel teachings and advantages of the subject matter described in this application. For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be reversed or otherwise varied, and the nature or number of discrete elements or positions can be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the present application. The order or sequence of any process or method steps can be changed, or reordered, according to alternative embodiments. Any "means plus function" clauses are intended to cover the structures described herein as performing the recited functions and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the example embodiments without departing from the scope of the present application. Accordingly, the present application is not limited to particular embodiments described, but extends to various modifications, combinations, sub-combinations, and equivalents instructed by the scope of the following claims.
[0081] Furthermore, in an effort to provide a concise description of exemplary embodiments, all features of an actual implementation can not be described (i.e., those unrelated to the best mode of practicing the present application currently contemplated).
[0082] It is to be understood that the development of the particular implementations described herein was motivated by the desire to solve real-world problems, and as such the claimed implementations can be susceptible to numerous modifications, changes and adaptations. Numerous specific implementation details are set forth herein to provide a thorough understanding of the claimed implementations. However, it will be understood by those skilled in the art that the claimed implementations are not limited to the particular implementations described herein. Rather, the claimed implementations are susceptible to numerous modifications, changes and adaptations.
[0083] It should be noted that the above examples are only used to illustrate the technical solutions of the present application but not limit the present application. Although the present application is described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the present application, and all should be covered in the scope of the claims of the present application.
Claims
1. A device for the synergic thermal treatment of waste printed circuit board products and sludges containing copper, characterized by the fact that it comprises: include: The conveying assembly (100) includes a mounting frame (101), a first motor (102) mounted on the mounting frame (101), a rotating rod (103) connected to the first motor (102), a first connecting rod (104) and a second connecting rod (105) mounted on the rotating rod (103), a lower conveying frame (106) connected to the first connecting rod (104), an upper conveying frame (107) connected to the second connecting rod (105), a feed inlet (108) and a discharge platform (109) mounted on the mounting frame (101). The feeding assembly (200) is mounted on the mounting frame (101) and includes a fixed frame (201), a second motor (202) mounted on the fixed frame (201), a drive rod (203) connected to the second motor (202), a transmission rod (204) connected to the drive rod (203), a push rod (205) connected to the transmission rod (204), and a push block (206) connected to the push rod (205). An adjustment assembly (300) is mounted on a fixed frame (201) and includes a handle (301), a first bevel gear (302) mounted on the handle (301), a second bevel gear (303) meshing with the first bevel gear (302), a threaded rod (304) fixed to the second bevel gear (303), a support rod (305) mounted on the threaded rod (304), an arc groove (306) mounted on the fixed frame (201), a slider (307) mounted in the arc groove (306), a positioning rod (308) rotatably mounted on the slider (307), and an adjustment rod (309) rotatably connected to the positioning rod (308). The mounting frame (101) is also symmetrically provided with slide rails (101a) on its inner wall. The upper conveyor frame (107) is slidably disposed in the slide rails (101a). The upper conveyor frame (107) includes two upper side plates (107a) and an upper partition plate (107b) disposed between the upper side plates (107a). The upper side plates (107a) are slidably disposed in the slide rails (101a). There are three upper partition plates (107b) and they are fixedly disposed on the upper side plates (107a). The upper partition plates (107b) are spaced at a fixed distance from each other, and the height of the upper partition plates (107b) decreases layer by layer. The lower conveyor frame (106) includes a lower base plate (106a) and lower partitions (106b) fixedly mounted on the lower base plate (106a). There are three lower partitions (106b), which are spaced at a fixed distance from each other. The distance between the upper partitions (107b) is equal to the thickness of the lower partitions (106b), and the distance between the lower partitions (106b) is the same as the thickness of the upper partitions (107b). The length of the lower partitions (106b) decreases layer by layer. The lower partitions (106b) are embedded between the upper partitions (107b).
2. The apparatus for co-treatment of waste PCBs and copper-containing sludge according to claim 1, wherein: The first motor (102) is fixedly arranged at the bottom of the mounting frame (101), the output shaft of the first motor (102) is fixedly connected with a rotating rod (103), two connecting rods (103a) are arranged on the rotating rod (103) and are symmetrically arranged along the central axis of the rotating rod (103), one end of the first connecting rod (104) is rotatably connected with one connecting rod (103a), and the other end is rotatably connected with the lower conveying frame (106); one end of the second connecting rod (105) is rotatably connected with the other connecting rod (103a), and the other end is rotatably connected with the upper conveying frame (107).
3. The apparatus for co-treatment of waste PCBs and copper-containing sludge according to claim 2, wherein: The feeding port (108) is fixedly arranged beside the lower partition plate (106b), the discharging platform (109) is arranged at the top of the inner wall of the mounting frame (101), and the discharging platform (109), the upper conveying frame (107), the lower conveying frame (106) and the slide (101a) are arranged in an inclined manner; the discharging platform (109) is further provided with a baffle (109a).
4. The apparatus for co-treatment of waste PCBs and copper-containing sludge according to claim 3, wherein: The fixed frame (201) is fixed to one side of the top of the mounting frame (101), the output shaft of the second motor (202) is fixedly connected with a driving rod (203), the driving rod (203) is a crankshaft, one end of the transmission rod (204) is rotatably connected with the driving rod (203), and the other end is rotatably connected with the end of the push rod (205); the fixed frame (201) is further provided with a sliding cavity (201a), the push block (206) is slidably arranged in the sliding cavity (201a), and the end of the push rod (205) away from the transmission rod (204) is rotatably connected with the push block (206).
5. The apparatus for co-treatment of waste PCBs and copper-containing sludge by heat according to claim 4, characterized in that: The handle (301) is rotatably arranged on the fixed frame (201), the first bevel gear (302) is fixedly arranged on the rod portion of the handle (301), the supporting rod (305) is in a right angle shape, one end of the supporting rod (305) is rotatably connected with the handle (301), and the other end is rotatably connected with the threaded rod (304), and the handle (301) and the threaded rod (304) are both provided with a limiting ring to prevent the supporting rod (305) from sliding along the rod portion.
6. The apparatus for co-treatment of waste PCBs and copper-containing sludge by heat according to claim 5, wherein: The threaded rod (304) penetrates through the positioning rod (308) and is connected with the positioning rod (308) through threads, the sliding block (307) can slide along the arc-shaped groove (306), one side of the positioning rod (308) is inserted into the sliding block (307) and is rotatably connected with the sliding block (307), and the other side is rotatably connected with the end of the adjusting rod (309).
7. The apparatus for co-treatment of waste PCBs and copper-containing sludge according to claim 6, wherein: The end of the adjusting rod (309) away from the positioning rod (308) is rotatably connected with the transmission rod (204), and the adjusting rod (309), the transmission rod (204) and the push rod (205) are the same rotating shaft.
8. A method for co-thermal treatment of waste printed circuit board product and copper-containing sludge, applied to the co-thermal treatment device of waste printed circuit board product and copper-containing sludge according to any one of claims 1-7, characterized in that, Mainly include the following steps: S1: the waste circuit board is roughly broken, and a processing product is obtained; S2: the high-humidity copper-containing sludge is dried; S3: the waste circuit board product passes through a waste circuit board product and copper-containing sludge cooperative thermal treatment device, is added into a reactor, and the sludge is directly poured into the reactor; S4: the reactor is provided with a pyrolysis temperature and a reaction time, a stable oxygen flow is continuously introduced during the reaction stage until the reaction stops. S5: Collect the metal particles generated after the reaction and measure the weight loss rate of the reaction material, and the residual glass fibers continue to participate in the pyrolysis reaction as inert porous media.
Citation Information
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