Shaping machine for diode processing

Abstract

The invention relates to the technical field of electronic component manufacturing, in particular to a shaping machine for diode machining, which comprises a movable base, a fixed base and a mold, an air cylinder is fixedly connected to the bottom surface of the fixed base, the output end of the air cylinder is vertically connected to the movable base, and a workbench for placing a diode is fixedly connected to the middle of the upper surface of the movable base; when the pins of the diode are bent, the diode directly penetrates through the interior of the die and is discharged directly after being discharged from the top of the die, and damage to the inner wall of the die caused by the pins of the diode in the reset process is prevented; besides, after one-time bending work is completed, the die is driven by the sliding plate to perform small-amplitude horizontal displacement, and contact positions of pins on two sides of the diode and the die are not overlapped when the diode passes through the die during next-time bending work, so that the inner wall of the die is prevented from being locally and repeatedly damaged by the pins, the service life of the die is prolonged, and the production efficiency is improved. The production cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of electronic component manufacturing technology, and in particular to a shaping machine for diode processing. Background Technology

[0002] A shaping machine is a device that bends the metal leads of a diode into a specific shape required for the final product, ensuring that the diode can be smoothly and accurately inserted into holes in a circuit board (PCB) or surface-mounted.

[0003] Figure 1 This is a schematic diagram of a common through-hole AI pin diode. When the forming machine bends the diode pins into through-hole AI pins, in order to ensure production efficiency and quality, it usually uses a rectangular thin-walled mold to completely bend the diode pins.

[0004] Figure 2 This is a schematic diagram of the operation of a shaping machine in the prior art, in which the diode is located below the mold and is in a fixed state. The shaping machine drives the mold to move down to bend the pin. After the pin is bent, the shaping machine drives the mold to move up to discharge the material.

[0005] Based on the above description, our factory has encountered the following problems during actual production: Figure 3 As shown, during one diode processing cycle, the tip of the lead will scratch the inner wall of the mold once when the mold moves down for bending, and the tip of the lead will also scratch the inner wall of the mold once when the mold moves up for material removal. Although each time only a slight scratch is caused, the scratches caused by each bending operation overlap. Especially during continuous processing, the lead of the diode will repeatedly scratch the local mirror surface inside the mold, which will increase the wear rate of the mold and affect the service life of the mold. Summary of the Invention

[0006] The purpose of this invention is to solve the problem that bending diode leads can cause repeated scratches on the inner wall of the mold in the prior art, and to propose a diode forming machine.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] Design a diode forming machine, including a movable base, a fixed base, and a mold. A cylinder is fixedly connected to the bottom surface of the fixed base, and the output end of the cylinder is vertically connected to the movable base. A worktable for placing diodes is fixedly connected to the middle of the upper surface of the movable base. Two connecting plates are vertically fixedly connected to the bottom surface of the fixed base, and a slotted plate is fixedly connected to the bottom of the connecting plates. Slide plates are fixedly connected to both sides of the mold. The slide plates slide within the slotted plates. A driving structure is provided on the slotted plates to drive the slide plates to slide within the slotted plates.

[0009] Preferably, the drive structure includes a rotating block, which is rotatably mounted on the slot plate. A rotating shaft is fixedly connected through the rotating block, and an incomplete gear is fixedly connected to the end of the rotating shaft. A first transmission rack is fixedly connected to the top of the slide plate, and a second transmission rack is fixedly connected to the bottom of the slide plate. The first and second transmission racks are symmetrically arranged, and both the first and second transmission racks are engaged with the incomplete gear.

[0010] Preferably, an arc-shaped hoop is fixed to the groove plate, the hoop has a sliding hole, a ball is slidably fitted in the sliding hole, and multiple limiting grooves are formed on the outer wall of the rotating block, the ball is fitted with the limiting grooves.

[0011] Preferably, a first spring is provided in the sliding hole to apply a downward elastic force to the ball.

[0012] Preferably, a driven gear is mounted on the end of the rotating shaft via a one-way bearing, and a driving rack is slidably fitted on the outer wall of the slot plate. The driving rack is vertically arranged to drive the driven gear to rotate.

[0013] Preferably, a counterweight is fixedly connected to the bottom end of the active rack, and top blocks are fixedly connected to both sides of the upper surface of the movable base, with the top blocks located directly below the counterweight.

[0014] Preferably, a guide post is slidably fitted inside the connecting plate, the guide post is vertically arranged, and the bottom end of the guide post is fixed to the counterweight block.

[0015] Preferably, a second spring is sleeved on the guide post, and the second spring is always in a compressed state to apply a downward elastic force to the counterweight.

[0016] The present invention discloses a diode forming machine, which has the following advantages: When bending the diode leads, the diode passes directly through the mold and exits from the top of the mold for unloading, preventing damage to the inner wall of the mold caused by the diode leads during the resetting process; in addition, after one bending operation, the mold makes a small horizontal displacement under the action of the slide plate, so that the contacts of the diode leads on both sides with the mold will not overlap during the next bending operation, thereby preventing repeated damage to the inner wall of the mold by the leads, extending the service life of the mold and reducing production costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a common through-hole type AI diode.

[0018] Figure 2 This is a schematic diagram of a forming machine using a mold to bend the diode leads.

[0019] Figure 3This is a schematic diagram of the diode processing using a mold.

[0020] Figure 4 This is a schematic diagram of the structure of a diode forming machine proposed in this invention.

[0021] Figure 5 This is a front view of a diode forming machine proposed in this invention.

[0022] Figure 6 This invention proposes a shaping machine for diode processing. Figure 5 Sectional view along the AA direction.

[0023] Figure 7 This invention proposes a shaping machine for diode processing. Figure 5 The right view in the image.

[0024] Figure 8 This is a schematic diagram of the mold structure of a diode forming machine proposed in this invention.

[0025] Figure 9 This is a schematic diagram of the structure of the slot plate and slide plate of a diode processing shaping machine proposed in this invention.

[0026] Figure 10 This is a schematic diagram of the structure of an incomplete gear and two transmission racks in a diode processing shaping machine proposed in this invention.

[0027] Figure 11 This is an exploded view of the slot plate of a diode forming machine proposed in this invention.

[0028] Figure 12 This is a schematic diagram of the structure of the hoop of a diode processing shaping machine proposed in this invention.

[0029] In the diagram: 1. Movable base; 2. Top block; 3. Fixed base; 4. Cylinder; 5. Worktable; 6. Connecting plate; 7. Mold; 701. Slide plate; 8. Slot plate; 9. Counterweight; 10. Driving rack; 11. Second spring; 12. First transmission rack; 13. Second transmission rack; 14. Incomplete gear; 15. Rotating shaft; 16. Driven gear; 17. One-way bearing; 18. Rotating block; 19. Limiting groove; 20. First spring; 21. Ball; 22. Hoop; 23. Sliding hole; 24. Guide post. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] Reference Figures 4-7 A diode forming machine includes a movable base 1, a fixed base 3, and a mold 7. The fixed base 3 is in a fixed state. A cylinder 4 is fixedly connected to the bottom surface of the fixed base 3. The output end of the cylinder 4 is vertically connected to the movable base 1. A worktable 5 for placing diodes is fixedly connected to the middle of the upper surface of the movable base 1. Two connecting plates 6 are vertically fixedly connected to the bottom surface of the fixed base 3. A slotted plate 8 is fixedly connected to the bottom of the connecting plates 6. Slide plates 701 are fixedly connected to both sides of the mold 7. The slide plates 701 are slidably fitted in the slotted plate 8. A driving structure is provided on the slotted plate 8 to drive the slide plates 701 to slide in the slotted plate 8.

[0032] When bending the diode's leads, the diode is placed on the worktable 5 with its leads on both sides suspended in the air. The cylinder 4 drives the movable base 1 to move upwards. During this upward movement, the diode on top of the worktable 5 moves towards the mold 7, entering the mold from bottom to top. The leads on both sides of the diode are bent downwards under the action of the mold 7. After the diode emerges from the top of the mold 7, it is unloaded. After unloading, the cylinder 4 drives the movable base 1 to move downwards for reset. During the reset process of the movable base 1 after unloading, the drive structure drives the sliding plate 701 to move a small distance within the slot plate 8. The movement of the sliding plate 701 causes the mold 7 to shift horizontally, resulting in a slight horizontal misalignment of the mold 7 relative to the worktable 5.

[0033] Compared to existing technologies, this invention provides a forming machine for diode processing. When bending the diode leads, the diode passes directly through the mold 7 and exits directly from the top of the mold 7 for unloading, preventing damage to the inner wall of the mold 7 caused by the diode leads during the resetting process. In addition, after one bending operation is completed, the mold 7 undergoes a small horizontal displacement driven by the slide plate 701. During the next bending operation, the contacts of the diode leads on both sides with the mold 7 will not overlap during the process of the diode passing through the mold 7, thereby preventing repeated damage to the inner wall of the mold 7 by the leads, extending the service life of the mold 7 and reducing production costs.

[0034] like Figures 8-11 As shown, the drive structure includes a rotating block 18, which is rotatably mounted on the slot plate 8. A rotating shaft 15 is fixedly connected through the rotating block 18. An incomplete gear 14 is fixedly connected to the end of the rotating shaft 15. A first transmission rack 12 is fixedly connected to the top of the slide plate 701, and a second transmission rack 13 is fixedly connected to the bottom of the slide plate 701. The first transmission rack 12 and the second transmission rack 13 are symmetrically arranged, and both the first transmission rack 12 and the second transmission rack 13 are engaged with the incomplete gear 14.

[0035] The rotating shaft 15 transmits power to rotate the incomplete gear 14. The incomplete gear 14 is always in contact with one of the two transmission racks. During the rotation of the incomplete gear 14, it will drive the mold 7 to move horizontally through one of the transmission racks. When the stroke of the transmission rack ends, the incomplete gear 14 will drive the mold 7 to move in the opposite direction through the other transmission rack. Therefore, through the cooperation of the incomplete gear 14 and the two transmission racks, the mold 7 is always horizontally linearly displaced to ensure that the contact position between the pin and the inner wall of the mold 7 is different during two adjacent bending operations.

[0036] like Figure 11 and Figure 12 As shown, an arc-shaped hoop 22 is fixed to the groove plate 8. A sliding hole 23 is provided on the hoop 22. A ball 21 is slidably fitted in the sliding hole 23. Multiple limiting grooves 19 are provided on the outer wall of the rotating block 18. The ball 21 is fitted with the limiting groove 19. A first spring 20 is provided in the sliding hole 23 to apply a downward elastic force to the ball 21.

[0037] The first spring 20 always maintains a downward elastic force on the ball 21. Under the action of the elastic force, the ball 21 is located in the limiting groove 19 on the surface of the rotating block 18, so that the ball 21 plays a certain limiting role on the rotating block 18, thereby preventing the incomplete gear 14 from rotating unexpectedly.

[0038] like Figures 5-11 As shown, a driven gear 16 is mounted on the end of the rotating shaft 15 via a one-way bearing 17. A driving rack 10 is slidably fitted on the outer wall of the slot plate 8. The driving rack 10 is vertically arranged to drive the driven gear 16 to rotate. A counterweight 9 is fixedly connected to the bottom end of the driving rack 10. Top blocks 2 are fixedly connected to both sides of the upper surface of the movable base 1. The top blocks 2 are located directly below the counterweight 9. A guide post 24 is slidably fitted inside the connecting plate 6. The guide post 24 is vertically arranged. The bottom end of the guide post 24 is fixedly connected to the counterweight 9. A second spring 11 is sleeved on the guide post 24. The second spring 11 is always in a compressed state to apply a downward elastic force to the counterweight 9.

[0039] When the cylinder 4 drives the movable base 1 to move upward, the top block 2 will apply an upward force to the counterweight 9, thereby causing the active rack 10 to move upward. The upward movement of the active rack 10 will drive the driven gear 16 to rotate. Due to the presence of the one-way bearing 17, the driven gear 16 will not drive the rotating shaft 15 to rotate when it idles.

[0040] When the cylinder 4 drives the movable base 1 to move down for reset, the active rack 10 moves downward under the action of the weight of the counterweight 9 and the elastic force of the second spring 11. The downward movement of the active rack 10 will drive the driven gear 16 to reverse. Due to the presence of the one-way bearing 17, when the driven gear 16 reverses, the shaft 15 and the driven gear 16 are essentially fixedly connected. The reverse rotation of the driven gear 16 will drive the shaft 15 to rotate, so that the shaft 15 can act as a transmission shaft to drive the incomplete gear 14 to rotate.

[0041] Working principle:

[0042] During the continuous diode lead bending process, the diode is placed on the worktable 5 with the leads on both sides of the diode suspended in the air. The movable base 1 is driven by the cylinder 4 to move upward. During the upward movement of the movable base 1, the top block 2 and the worktable 5 will move upward. The upward movement of the top block 2 will apply an upward force to the counterweight 9, so that the active rack 10 moves upward. The upward movement of the worktable 5 will cause the diode to move towards the mold 7. The diode enters the mold from bottom to top. The leads on both sides of the diode are bent downward under the action of the mold 7. After the diode comes out from the top of the mold 7, it is unloaded.

[0043] After the diode is unloaded, the cylinder 4 drives the movable base 1 to move down for reset. During the reset process, the active rack 10 moves downward under the action of the weight of the counterweight 9 and the elastic force of the second spring 11. During the downward movement of the active rack 10, the driven gear 16 drives the rotating shaft 15 to rotate. The rotation of the rotating shaft 15 drives the incomplete gear 14 to rotate.

[0044] The incomplete gear 14 is always in contact with one of the two transmission racks. During the rotation of the incomplete gear 14, it will drive the mold 7 to move horizontally through one of the transmission racks. When the stroke of the transmission rack ends, the incomplete gear 14 will drive the mold 7 to move in the opposite direction through the other transmission rack. Therefore, through the cooperation of the incomplete gear 14 and the two transmission racks, the mold 7 is always moved horizontally in a straight line to ensure that the contact position between the pin and the inner wall of the mold 7 is different during two adjacent bending operations.

[0045] Compared to existing technologies, this invention provides a forming machine for diode processing. When bending the diode leads, the diode passes directly through the mold 7 and exits directly from the top of the mold 7 for unloading, preventing damage to the inner wall of the mold 7 caused by the diode leads during the resetting process. In addition, after one bending operation is completed, the mold 7 undergoes a small horizontal displacement driven by the slide plate 701. During the next bending operation, the contacts of the diode leads on both sides with the mold 7 will not overlap during the process of the diode passing through the mold 7, thereby preventing repeated damage to the inner wall of the mold 7 by the leads, extending the service life of the mold 7 and reducing production costs.

[0046] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A shaping machine for diode processing, comprising a movable base (1), a fixed base (3), and a mold (7), characterized in that, A cylinder (4) is fixedly connected to the bottom surface of the fixed base (3). The output end of the cylinder (4) is vertically connected to the movable base (1). A workbench (5) for placing diodes is fixedly connected to the middle of the upper surface of the movable base (1). Two connecting plates (6) are vertically fixedly connected to the bottom surface of the fixed base (3). A slot plate (8) is fixedly connected to the bottom of the connecting plate (6). Slide plates (701) are fixedly connected to both sides of the mold (7). The slide plates (701) slide in the slot plate (8). A driving structure is provided on the slot plate (8) to drive the slide plates (701) to slide in the slot plate (8).

2. The diode forming machine according to claim 1, characterized in that, The drive structure includes a rotating block (18), which is rotatably mounted on the slot plate (8). A rotating shaft (15) is fixedly connected through the rotating block (18). An incomplete gear (14) is fixedly connected to the end of the rotating shaft (15). A first transmission rack (12) is fixedly connected to the top of the slide plate (701), and a second transmission rack (13) is fixedly connected to the bottom of the slide plate (701). The first transmission rack (12) and the second transmission rack (13) are symmetrically arranged, and both the first transmission rack (12) and the second transmission rack (13) are engaged with the incomplete gear (14).

3. The diode forming machine according to claim 2, characterized in that, A circular arc-shaped hoop (22) is fixedly connected to the groove plate (8). A sliding hole (23) is provided on the hoop (22). A ball (21) is slidably fitted in the sliding hole (23). Multiple limiting grooves (19) are provided on the outer wall of the rotating block (18). The ball (21) is fitted with the limiting groove (19).

4. The diode forming machine according to claim 3, characterized in that, The sliding hole (23) is provided with a first spring (20) to apply a downward elastic force to the ball (21).

5. The diode forming machine according to claim 4, characterized in that, A driven gear (16) is mounted on the end of the rotating shaft (15) via a one-way bearing (17), and a drive rack (10) is slidably fitted on the outer wall of the slot plate (8). The drive rack (10) is vertically arranged to drive the driven gear (16) to rotate.

6. The diode forming machine according to claim 5, characterized in that, The bottom end of the active rack (10) is fixed with a counterweight (9), and the upper surfaces of the movable base (1) are fixed with top blocks (2), which are located directly below the counterweight (9).

7. The diode forming machine according to claim 6, characterized in that, The connecting plate (6) is slidably fitted with a guide post (24), which is vertically set and its bottom end is fixed to the counterweight (9).

8. The diode forming machine according to claim 7, characterized in that, A second spring (11) is fitted on the guide post (24). The second spring (11) is always in a compressed state to apply a downward elastic force to the counterweight (9).

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