Apparatus and method for ultrasonic field assisted lapping and polishing of microspheres

Abstract

The application discloses a device and method for ultrasonic energy field assisted grinding and polishing of microspheres, which comprises an upper grinding disc assembly and a lower grinding disc assembly, and a ball to be processed is arranged between an upper grinding disc of the upper grinding disc assembly and a lower grinding disc of the lower grinding disc assembly; the upper grinding disc assembly comprises a transmission assembly, a bearing assembly, a connecting assembly two, a spring assembly and an upper grinding disc which are sequentially connected, and the connecting assembly two can generate axial ultrasonic vibration. The connecting assembly two capable of generating ultrasonic vibration is adopted to replace a rigid connecting piece in an existing device, so that axial ultrasonic vibration is introduced, and further, a radial ultrasonic assembly is adopted to introduce radial ultrasonic vibration, through ultrasonic energy field assisted processing, the surface of a small microsphere is rapidly removed in a small amount, the self-rotation angle of the microsphere is increased, the grinding track envelope degree is higher, and higher roundness and surface quality are obtained.

Description

Technical Field

[0001] This invention relates to the field of ultra-precision machining technology for spheres, and particularly to an apparatus and method for ultrasonic energy field-assisted grinding and polishing of microspheres. Background Technology

[0002] Microspheres play a crucial role in fields such as national defense, aerospace, and precision transmission, and their quality directly affects the performance of mechanical parts. The machining of microspheres requires the differential rotation of upper and lower grinding discs in opposite directions, and relies on the slow, minute removal of microspheres by tiny abrasive particles in the polishing paste.

[0003] Current mainstream machining methods include four-head ultra-precision machining, variable curvature groove grinding, dual-rotation grinding, and magnetic levitation grinding, among others. Their core differences lie in the contact method and energy transfer mechanism. Traditional machining methods rely on mechanical contact, achieving material removal through direct contact between the grinding head and the workpiece. However, this approach has significant limitations: contact easily leads to stress concentration and surface damage, and the processing cycle is long, with low precision and efficiency. For microsphere machining, these methods suffer even more from these drawbacks: low processing efficiency, and the small rotational inertia of the microspheres affects their motion stability, resulting in poor sphericity and uneven rolling. Summary of the Invention

[0004] To address the above problems, the present invention aims to provide an apparatus and method for ultrasonic energy field-assisted grinding and polishing of microspheres.

[0005] The technical solution of the present invention is as follows:

[0006] On the one hand, an apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres is provided, including an upper grinding disc assembly and a lower grinding disc assembly, wherein the sphere to be processed is disposed between the upper grinding disc of the upper grinding disc assembly and the lower grinding disc of the lower grinding disc assembly;

[0007] The upper grinding disc assembly includes a transmission assembly, a bearing assembly, a second connecting assembly, a spring assembly, and an upper grinding disc connected in sequence. The second connecting assembly is capable of generating axial ultrasonic vibration.

[0008] Preferably, the second connection component includes a power supply, a key-type ultrasonic tool holder, and a disc-shaped grinding vibrator assembly;

[0009] The outer surface of the keyed ultrasonic scalpel handle is sequentially fitted with a bearing guard plate, a bearing sleeve, a negative electrode protective plate, and a positive electrode protective sleeve from top to bottom. A bearing is provided between the bearing sleeve and the keyed ultrasonic scalpel handle. The bearing guard plate is located on the top of the bearing. A flange nut is provided between the bottom of the positive electrode protective sleeve and the keyed ultrasonic scalpel handle. A sealed conductive cavity is formed between the bearing sleeve and the keyed ultrasonic scalpel handle. An outer carbon brush and an inner carbon brush are provided in the sealed conductive cavity. The outer carbon brush is connected to the bearing sleeve, and the inner carbon brush is connected to the keyed ultrasonic scalpel handle. When the keyed ultrasonic scalpel handle rotates, the outer carbon brush remains stationary, while the inner carbon brush rotates with the keyed ultrasonic scalpel handle.

[0010] The disc-shaped grinding vibrator assembly includes a ceramic crystal stack, a disc grinding steel valve body, and a grinding disc arranged coaxially from top to bottom. The ceramic crystal stack is fixed to the top of the disc grinding steel valve body by a valve cover and bolts. The ceramic crystal stack is disposed inside the key-pin ultrasonic shovel. The disc grinding steel valve body is fixedly connected to the bottom of the key-pin ultrasonic shovel.

[0011] Both the bearing sleeve and the keyed ultrasonic scalpel handle have openings. The power supply is electrically connected to the outer carbon brush through the opening on the bearing sleeve, and the inner carbon brush is connected to the ceramic crystal stack through the opening on the keyed ultrasonic scalpel handle.

[0012] Preferably, the device also includes a radial ultrasonic component capable of generating ultrasonic vibrations, the radial ultrasonic component abutting against the outer surface of the upper grinding disc to provide radial ultrasonic vibrations to the upper grinding disc.

[0013] Preferably, the radial ultrasonic component includes a support component, a connecting component, and an ultrasonic vibration component, wherein the ultrasonic vibration component is capable of generating ultrasonic vibration.

[0014] The support assembly is mounted on the workbench, the connecting assembly three is detachably connected to the support assembly, and the ultrasonic vibration assembly is slidably connected to the connecting assembly three.

[0015] Preferably, the support assembly includes a base, a right-angle mounting block one, and a right-angle mounting block two. The base is disposed on the workbench. The right-angle mounting block one and the right-angle mounting block two have similar structures, each including three square faces connected end to end and two right-angled triangular faces enclosed by the square faces. The right-angle mounting block one is vertically disposed on the base, and the right-angle mounting block two is vertically and detachably disposed on the right-angle mounting block one.

[0016] Preferably, a shock-absorbing adapter block is provided between the connecting component three and the ultrasonic vibration component.

[0017] On the other hand, a method for ultrasonic energy field assisted grinding and polishing of microspheres is also provided, wherein the microspheres are processed using the ultrasonic energy field assisted grinding and polishing apparatus described in any one of the above-mentioned methods.

[0018] The beneficial effects of this invention are:

[0019] This invention utilizes ultrasonic vibration to introduce an ultrasonic energy field to assist in processing, thereby achieving rapid micro-removal of the surface of microspheres, increasing the rotation angle of the microspheres, and achieving a higher degree of envelopment of the grinding trajectory, resulting in higher roundness and surface quality. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a three-dimensional structural schematic diagram of the device for ultrasonic energy field-assisted grinding and polishing of microspheres according to the present invention;

[0022] Figure 2 This is a cross-sectional structural diagram of the connecting component 2 and the upper grinding disc;

[0023] Figure 3 This is a cross-sectional structural diagram of connecting component two;

[0024] Figure 4 This is a three-dimensional structural diagram of a disc-shaped grinding vibrator assembly;

[0025] Figure 5 This is a three-dimensional structural diagram of the radial ultrasound component;

[0026] Figure 6 A three-dimensional structural diagram of the radial ultrasonic component from another angle;

[0027] Figure 7 This is a schematic diagram of the three-dimensional structure of the ultrasonic vibration component;

[0028] Figure 8 This is a schematic diagram of the surface of microspheres obtained by different processing methods in a specific embodiment, magnified 500 times under an optical microscope; wherein, AF is a schematic diagram of the surface result of microspheres obtained by conventional processing methods (conventional processes), and GL is a schematic diagram of the surface result of microspheres obtained by the ultrasonic energy field assisted processing method of the present invention;

[0029] Figure 9This is a schematic diagram of the roughness results of microspheres obtained by white light interferometer scanning of the spherical surface using different processing methods in a specific embodiment; where ad represents the result of conventional process and eh represents the result of ultrasonic energy field assisted processing of the present invention;

[0030] Figure 10 This is a schematic diagram showing the microsphere roundness results obtained by the ultrasonic energy field assisted processing method of the present invention at different processing times in a specific embodiment;

[0031] Figure 11 The image shows the envelope diagram of the spherical point motion trajectory with and without an ultrasonic energy field in a specific embodiment; where (a) represents the area without an ultrasonic energy field and (b) represents the area with an ultrasonic energy field.

[0032] Numbering on the map:

[0033] 1-Worktable, 2-Column assembly, 3-Connecting assembly one, 4-Upper grinding disc assembly, 401-Upper grinding disc, 402-Transmission assembly, 403-Bearing assembly, 404-Connecting assembly two, 405-Spring assembly, 5-Lower grinding disc assembly, 501-Lower grinding disc, 6-Key-pin ultrasonic tool holder, 7-Disc grinding vibrator assembly, 701-Ceramic crystal stack, 702-Disc grinding steel valve body, 703-Grinding disc, 704-Valve cover, 705-Bolt, 8-Bearing guard plate, 9-Bearing sleeve, 10-Negative electrode protection plate, 11-Positive electrode 12-Bearing, 13-Flange nut, 14-Outer carbon brush, 15-Inner carbon brush, 16-Radial ultrasonic assembly, 17-Support assembly, 1701-Base, 1702-Right angle mounting block one, 1703-Right angle mounting block two, 18-Connecting assembly three, 19-Ultrasonic vibration assembly, 1901-Ultrasonic transducer, 1902-Ultrasonic amplitude transformer, 1903-Ultrasonic vibrator, 20-Shock damping adapter block, 21-Slide table base, 22-Linear guide rail, 23-Horizontal slide table, 24-Vertical support base. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and technical features described in this application can be combined with each other. It should also be pointed out that, unless otherwise indicated, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terms "comprising" or "including" and similar words used in this invention refer to elements or objects preceding the word that encompass the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0035] On the one hand, such as Figure 1-7As shown, the present invention provides an apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres, including a worktable 1, a column assembly 2, a connecting assembly 3, an upper grinding disc assembly 4, and a lower grinding disc assembly 5, wherein the microsphere to be processed is disposed between the upper grinding disc 401 of the upper grinding disc assembly 4 and the lower grinding disc 501 of the lower grinding disc assembly 5.

[0036] The column assembly 2 and the lower grinding disc assembly 5 are disposed on the worktable 1, and the upper grinding disc assembly 4 is slidably connected to the column assembly 2 through the connecting component 3.

[0037] The upper grinding disc assembly 4 includes a transmission assembly 402, a bearing assembly 403, a second connecting assembly 404, a spring assembly 405, and an upper grinding disc 401 connected in sequence. The transmission assembly 402 is disposed on the first connecting assembly 3, and the output end of the transmission assembly 402 passes through the first connecting assembly 3 and is connected to the bearing assembly 403. The second connecting assembly 404 is capable of generating axial ultrasonic vibration.

[0038] In the above embodiments, the present invention replaces the existing rigid connector by introducing a second ultrasonically vibrating connecting component 404. This allows for high-frequency, extremely small-amplitude vibrations generated by ultrasonic vibration, enabling the microspheres immersed in the polishing paste to vibrate up and down at high frequency. This increases the rotation angle of the microspheres, improving the polishing effect. In a specific embodiment, the present invention directly introduces an ultrasonic energy field into the polishing head (upper plate). After introduction, the processing efficiency is rapidly improved, and the rolling uniformity is also enhanced. The original method (rigid connector) requires 4 hours to complete the processing of a batch of microspheres, while the present invention (second ultrasonically vibrating connecting component 404) only requires 2 hours.

[0039] In one specific embodiment, the connection component 404 includes a power supply (not shown in the figure), a key-type ultrasonic tool holder 6, and a disc-shaped grinding vibrator assembly 7.

[0040] The outer surface of the keyed ultrasonic scalpel handle 6 is sequentially fitted with a bearing guard plate 8, a bearing sleeve 9, a negative electrode protective plate 10, and a positive electrode protective sleeve 11 from top to bottom. A bearing 12 is provided between the bearing sleeve 9 and the keyed ultrasonic scalpel handle 6. The bearing guard plate 8 is located on the top of the bearing 12. A flange nut 13 is provided between the bottom of the positive electrode protective sleeve 11 and the keyed ultrasonic scalpel handle 6. A sealed conductive cavity is formed between the bearing sleeve 9 and the keyed ultrasonic scalpel handle 6. An outer carbon brush 14 and an inner carbon brush 15 are provided in the sealed conductive cavity. The outer carbon brush 14 is connected to the bearing sleeve 9, and the inner carbon brush 15 is connected to the keyed ultrasonic scalpel handle 6. When the keyed ultrasonic scalpel handle 6 rotates, the outer carbon brush 14 remains stationary, while the inner carbon brush 15 rotates with the keyed ultrasonic scalpel handle 6.

[0041] The disc-shaped grinding vibrator assembly 7 includes a ceramic crystal stack 701, a disc grinding steel valve body 702, and a grinding disc 703 arranged coaxially from top to bottom. The ceramic crystal stack 701 is fixed to the top of the disc grinding steel valve body 702 by a valve cover 704 and bolts 705. The ceramic crystal stack 701 is disposed inside the key-pin type ultrasonic scalpel handle 6. The disc grinding steel valve body 702 is fixedly connected to the bottom of the key-pin type ultrasonic scalpel handle 6.

[0042] Both the bearing sleeve 9 and the keyed ultrasonic scalpel handle 6 have openings. The power supply is electrically connected to the outer carbon brush 14 through the opening on the bearing sleeve 9, and the inner carbon brush 15 is connected to the ceramic crystal stack 701 through the opening on the keyed ultrasonic scalpel handle 6.

[0043] In the above embodiment, ultrasonic vibration is generated by the ceramic crystal stack 701 receiving current and vibrating. Specifically: the power supply provides current to the outer carbon brush 14, and the key-pin ultrasonic scalpel handle 6 rotates, causing the inner carbon brush 15 to rotate as well. This causes the outer carbon brush 14 and the inner carbon brush 15 to rotate in opposite directions, thereby transmitting current to the inner carbon brush 15 and then to the ceramic crystal stack 701. The ceramic crystal stack 701, receiving current, generates axial vibration as a whole, forming ultrasonic waves, which are then transmitted downwards sequentially to the grinding steel valve body 702 and the grinding disc 703. The spring assembly evenly distributes the vibration force, finally enabling the upper grinding disc 401 to achieve stable and uniform ultrasonic vibration.

[0044] In one specific embodiment, the keyed ultrasonic scalpel handle 6 has an opening at the top center, which is keyed to the drive shaft. A fastening ring is nested on the outside. A fixed force is applied by a given bolt to ensure stable installation directly below the drive shaft. To ensure that the same fastening force is used for each installation, a torque wrench is used to tighten the bolt each time.

[0045] In one specific embodiment, the bearing 12 includes an upper deep groove ball bearing and a lower deep groove ball bearing, and the negative electrode protection plate 10 and the positive electrode protection sleeve 11 are both made of epoxy resin.

[0046] In the above embodiments, the use of two deep groove ball bearings can better ensure stable operation of axial ultrasonic rotation and reduce the transmission of upward vibration, ensuring smooth rotation of axial ultrasonic and upper grinding disc, and preventing wire entanglement during processing.

[0047] In one specific embodiment, the processing apparatus further includes a radial ultrasonic component 16 capable of generating ultrasonic vibrations, the radial ultrasonic component 16 abutting against the outer surface of the upper grinding disc 401 to provide radial ultrasonic vibrations to the upper grinding disc 401.

[0048] In the above embodiments, radial ultrasound is further provided on the basis of axial ultrasound, which can provide radial ultrasonic vibration from the diameter direction of the upper grinding disc, thereby achieving a richer variety of micro-sphere rotational motions.

[0049] In one specific embodiment, the radial ultrasonic component 16 includes a support component 17, a connecting component 18, and an ultrasonic vibration component 19, the ultrasonic vibration component 19 being capable of generating ultrasonic vibration.

[0050] The support component 17 is disposed on the workbench 1, the connecting component 3 18 is detachably connected to the support component 17, and the ultrasonic vibration component 19 is slidably connected to the connecting component 3 18.

[0051] In one specific embodiment, the ultrasonic vibration assembly 19 includes an ultrasonic transducer 1901, an ultrasonic amplitude transformer 1902, and an ultrasonic vibrator 1903 connected in sequence, and the ultrasonic vibrator 1903 is rotatably connected to the ultrasonic amplitude transformer 1902.

[0052] In the above embodiment, the ultrasonic transducer 1901 generates vibration by transmitting signals from an external ultrasonic generator, and changes the vibration amplitude and energy distribution along the ultrasonic amplitude transformer 1902 to the required conditions, and then the ultrasonic vibrator 1903 transmits the vibration to the upper grinding disc radially to realize the radial ultrasonic vibration loading of the upper grinding disc.

[0053] In one specific embodiment, the ultrasonic vibrator 1903 is cylindrical, the bottom of the ultrasonic amplitude transformer 1902 is provided with a U-shaped groove, the two bottom surfaces of the ultrasonic vibrator 1903 are arranged opposite to the U-shaped groove, and the curved surface of the ultrasonic vibrator 1903 at least partially protrudes from the U-shaped groove and can rotate within the U-shaped groove.

[0054] In the above embodiment, ultrasonic vibration is transmitted to the upper grinding disc through local contact. The radial force is transmitted through extremely small, high-frequency collisions, which can more easily drive the tiny spheres in the V-groove to roll more evenly along the raceway. Combined with the increased rotation angle achieved by axial ultrasound, the spherical contact area and grinding uniformity in the small ball grinding and polishing are improved more significantly.

[0055] In one specific embodiment, the support component 17 includes a base 1701, a right-angle mounting block one 1702, and a right-angle mounting block two 1703. The base 1701 is disposed on the workbench 1. The right-angle mounting block one 1702 and the right-angle mounting block two 1703 have similar structures, each including three square faces connected end to end and two right-angled triangular faces enclosed by the square faces. The right-angle mounting block one 1702 is vertically disposed on the base 1701, and the right-angle mounting block two 1703 is vertically and detachably disposed on the right-angle mounting block one 1702.

[0056] It should be noted that the support component in the above embodiment is only a preferred embodiment of the present invention. The L-shaped assembly of the right-angle mounting block 1702 and the right-angle mounting block 2703 facilitates the height adjustment and fixation of the connection component 318.

[0057] In one specific embodiment, a shock-absorbing adapter block 20 is provided between the connecting component 3 18 and the ultrasonic vibration component 19. In this embodiment, the shock-absorbing adapter block 20 can isolate the upward transmission of ultrasonic vibration and ensure the connection stability between the connecting component 3 18 and the ultrasonic vibration component 19.

[0058] In one specific embodiment, the connecting component 3 18 includes a slide base 21, a linear guide rail 22, a horizontal slide 23, and a vertical support 24 connected in sequence. The slide base 21 is detachably connected to the support component 17, and the vertical support 24 is connected to the ultrasonic vibration component.

[0059] It should be noted that the sub-component structures used in this invention, such as the column assembly, lower grinding disc assembly, key-pin ultrasonic scalpel holder, outer carbon brush, inner carbon brush, connecting assembly, etc., are all existing technologies, and their specific structures will not be described in detail here.

[0060] On the other hand, the present invention also provides a method for ultrasonic energy field-assisted grinding and polishing of microspheres, wherein the microspheres are processed using the ultrasonic energy field-assisted grinding and polishing apparatus described in any one of the above-mentioned methods.

[0061] In one specific embodiment, multiple microspheres were processed using both a conventional processing method (i.e., the connecting component between the bearing assembly and the spring assembly of the device used is not the ultrasonic vibration-generating connecting component two of the present invention, but a rigid connector) and the ultrasonic energy field-assisted processing method of the present invention (i.e., the connecting component between the bearing assembly and the spring assembly of the device used is the ultrasonic vibration-generating connecting component two of the present invention). The quality of the microspheres was evaluated by comparing the roundness and surface roughness of the microspheres obtained by the two methods.

[0062] In this embodiment, the obtained microspheres were photographed three times at 100X magnification using an optical microscope to obtain the original images. The central light spot was then removed using Photoshop software. Finally, MATLAB was used to calculate and process the images to obtain the roundness value of each microsphere photograph. Within a predetermined range, a smaller roundness value indicates better / rounder roundness; a value below 0.5 indicates good roundness, and a value above 0.5 indicates poor roundness. The test results are shown in Table 1.

[0063] Table 1. Microsphere sphericity results obtained by the two processing methods

[0064]

[0065] As shown in Table 1, the roundness data of microspheres processed using traditional methods is not as good as that of microspheres processed with ultrasonic energy field assistance introduced in this invention. Therefore, it is evident that using the ultrasonic energy field assisted processing method of this invention can effectively help produce microspheres with better batch consistency and that better meet requirements.

[0066] In this embodiment, the surface roughness of the microspheres is analyzed using data obtained from optical microscopy and white light interferometry. Optical microscopy at 500X magnification allows direct observation of the surface for obvious defects such as pits, scratches, and flaking. White light interferometry, by scanning the microsphere surface through fringe interference, provides precise spherical data and roughness values, enabling more intuitive comparison and analysis. The results are as follows: Figure 8 and Figure 9 As shown. Figure 9 In this context, Sa refers to surface roughness; the smaller the value, the smoother the surface of the microspheres and the better their quality.

[0067] from Figure 8 It can be seen that the surface of microspheres processed using traditional methods is prone to defects such as chipping and pitting. When the number of these defects exceeds a certain level, the surface quality is considered too poor, which will be reflected in the white light interferometer scanning data as significant differences in data across multiple surfaces. In contrast, the microspheres processed using the ultrasonic energy field-assisted processing method of this invention only have small, patchy scratches, which are minor defects and within an acceptable range. Visual observation under a 500X microscope clearly confirms that the surface of the microspheres processed using the ultrasonic energy field-assisted processing method of this invention is superior.

[0068] from Figure 9 It can be seen that the surface roughness of microspheres processed using traditional methods is slightly better than that of microspheres processed using the ultrasonic energy field-assisted processing method of this invention, but the difference in surface roughness is not significant. The introduction of ultrasonic energy field assistance in this invention does not cause additional damage to the surface of the microspheres.

[0069] Processing time is one of the key influencing factors in the microsphere processing. If the processing time is too short, the surface material of the microspheres cannot be fully removed, resulting in unsatisfactory processing results. Repeated rework will reduce experimental efficiency. If the processing time is too long, the surface material of the microspheres will be excessively removed, which will damage the roundness and surface.

[0070] In this embodiment, the present invention conducted experiments on different processing times, and the results are as follows: Figure 10 As shown. From Figure 10 As can be seen, this invention only requires one hour of ultrasonic energy field-assisted processing to obtain microspheres with optimal sphericity. In contrast, traditional processing methods require two hours to achieve the best sphericity, thus this invention significantly saves processing time.

[0071] In addition, simulations were performed on the processing procedures of this invention with the addition of an ultrasonic energy field and the existing processing procedures without the addition of an ultrasonic energy field, and the results are as follows. Figure 11 As shown. From Figure 11 It can be seen that the envelope diagram of the spherical point motion trajectory after introducing ultrasound is more uniform and comprehensive than the envelope diagram of the spherical point motion trajectory without ultrasound energy field simulation.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A device for ultrasonic energy field-assisted grinding and polishing of microspheres, characterized in that, It includes an upper grinding disc assembly and a lower grinding disc assembly, with the ball to be processed positioned between the upper grinding disc of the upper grinding disc assembly and the lower grinding disc of the lower grinding disc assembly; The upper grinding disc assembly includes a transmission assembly, a bearing assembly, a second connecting assembly, a spring assembly, and an upper grinding disc connected in sequence. The second connecting assembly is capable of generating axial ultrasonic vibration. The second connection component includes a power supply, a keyed ultrasonic tool holder, and a disc-shaped grinding vibrator assembly. The outer surface of the keyed ultrasonic scalpel handle is sequentially fitted with a bearing guard plate, a bearing sleeve, a negative electrode protective plate, and a positive electrode protective sleeve from top to bottom. A bearing is provided between the bearing sleeve and the keyed ultrasonic scalpel handle. The bearing guard plate is located on the top of the bearing. A flange nut is provided between the bottom of the positive electrode protective sleeve and the keyed ultrasonic scalpel handle. A sealed conductive cavity is formed between the bearing sleeve and the keyed ultrasonic scalpel handle. An outer carbon brush and an inner carbon brush are provided in the sealed conductive cavity. The outer carbon brush is connected to the bearing sleeve, and the inner carbon brush is connected to the keyed ultrasonic scalpel handle. When the keyed ultrasonic scalpel handle rotates, the outer carbon brush remains stationary, while the inner carbon brush rotates with the keyed ultrasonic scalpel handle. The disc-shaped grinding vibrator assembly includes a ceramic crystal stack, a disc grinding steel valve body, and a grinding disc arranged coaxially from top to bottom. The ceramic crystal stack is fixed to the top of the disc grinding steel valve body by a valve cover and bolts. The ceramic crystal stack is disposed inside the key-pin ultrasonic shovel. The disc grinding steel valve body is fixedly connected to the bottom of the key-pin ultrasonic shovel. Both the bearing sleeve and the keyed ultrasonic scalpel handle have openings. The power supply is electrically connected to the outer carbon brush through the opening on the bearing sleeve, and the inner carbon brush is connected to the ceramic crystal stack through the opening on the keyed ultrasonic scalpel handle.

2. The apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres according to claim 1, characterized in that, It also includes a radial ultrasonic component capable of generating ultrasonic vibrations, the radial ultrasonic component abutting against the outer surface of the upper grinding disc to provide radial ultrasonic vibrations to the upper grinding disc.

3. The apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres according to claim 2, characterized in that, The radial ultrasonic component includes a support component, a connecting component, and an ultrasonic vibration component, which is capable of generating ultrasonic vibration. The support assembly is mounted on the workbench, the connecting assembly three is detachably connected to the support assembly, and the ultrasonic vibration assembly is slidably connected to the connecting assembly three.

4. The apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres according to claim 3, characterized in that, The support assembly includes a base, a right-angle mounting block one, and a right-angle mounting block two. The base is set on the workbench. The right-angle mounting block one and the right-angle mounting block two have similar structures, each including three square faces connected end to end and two right-angled triangular faces enclosed by the square faces. The right-angle mounting block one is vertically set on the base, and the right-angle mounting block two is vertically and detachably set on the right-angle mounting block one.

5. The apparatus for ultrasonic energy field-assisted grinding and polishing of microspheres according to claim 3, characterized in that, A shock-absorbing adapter block is provided between the connecting component three and the ultrasonic vibration component.

6. A method for ultrasonic energy field-assisted grinding and polishing of microspheres, characterized in that, The microspheres are processed using the ultrasonic energy field-assisted grinding and polishing apparatus described in any one of claims 1-5.

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