Finishing disc device, chemical mechanical polishing equipment and cleaning method of finishing disc device

Abstract

The invention discloses a dressing disc device, chemical mechanical polishing equipment and a cleaning method of the dressing disc device, and the dressing disc device comprises a dressing disc which is arranged on a polishing pad and is used for dressing the polishing pad; the driving mechanism is arranged on the finishing disc, and the driving mechanism comprises a fixed disc used for being connected with the finishing disc; and the air guide unit is arranged on the fixed disc, and the air guide unit is used for cleaning residues in a gap between the finishing disc and the fixed disc. The air guide unit is designed on the fixed disc, residues in the gap between the finishing disc and the fixed disc are cleaned, the problem that the product quality and the production efficiency are affected by the residues is avoided, meanwhile, the finishing disc is easy to detach from the fixed disc, and the production efficiency is improved. The problem of inaccurate pressing or non-uniform pressing force caused by forcibly disassembling the finishing disc is avoided, and the production efficiency of a machine table is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and specifically to a dressing disc device, a chemical mechanical polishing (CMP) device, and a cleaning method for the dressing disc device. Background Technology

[0002] In semiconductor manufacturing processes, the dressing disk unit is an important component of the CMP (chemical mechanical polishing) department. The dressing disk, as an indispensable part of the dressing disk unit, plays an important role in dressing the polishing pad, removing residual slag on the leads of the wafer, and maintaining the stability of the RR (polishing rate).

[0003] In existing technologies, due to the specific nature of CMP (Chemical Mechanical Polishing) departments, disks need to be replaced after a period of use. Because there is a gap between the upper surface of the disk and the lower surface of the disk holder, and due to prolonged operation, pure water and slurry can seep in. Even when the dressing disk unit is stationary, a nozzle continuously sprays water to clean the residual slurry. However, this continuous spraying cannot completely remove all the residual slurry, and a small amount of slurry and pure water will enter the gaps within the dressing disk unit. Due to the unique nature of slurry, prolonged exposure to air can cause crystal formation. These crystals may detach and fall onto the lead surfaces of the wafer during disk operation, potentially scratching the wafer (the silicon wafer used to manufacture integrated circuits). This can range from affecting product quality to rendering the product unusable. During disk removal, the tension created by pure water between the upper surface of the disk and the lower surface of the disk holder makes removal difficult. Forcibly removing the disk holder may affect its pressure, causing inaccurate or uneven pressure. All of these issues can affect the grinding speed of the machine, ultimately impacting product quality, potentially leading to product scrap, reducing production efficiency, and increasing production costs. Summary of the Invention

[0004] The purpose of this invention is to provide a dressing disc device, a chemical mechanical polishing (CMP) machine, and a cleaning method for the dressing disc device. It aims to solve the problem in existing CMP processes where residues in the gap between the dressing disc and the stationary disc cannot be cleaned, thus affecting the polishing efficiency of the machine, the yield rate of wafer processing, and increasing production costs.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0006] On one hand, the present invention provides a dressing disc device for use in a chemical mechanical polishing (CMP) apparatus, the CMP apparatus comprising: a polishing table; and a polishing pad located on the polishing table, the polishing pad being used to polish a thin film layer on a wafer surface, comprising:

[0007] A dressing disc is disposed on the polishing pad, and the dressing disc is used to dress the polishing pad;

[0008] A drive mechanism, disposed on the dressing disc, for driving the dressing disc to move up and down and / or rotate, the drive mechanism comprising: a fixed disc located at the end of the drive mechanism, the fixed disc for connecting to the dressing disc, and a gap existing between the upper surface of the dressing disc and the lower surface of the fixed disc;

[0009] An air guiding unit is disposed on the fixed plate, and the air guiding unit is used to clean the residue in the gap between the trimming plate and the fixed plate.

[0010] Preferably, the driving mechanism further includes a cylinder assembly located above the fixed plate and connected to the fixed plate, for driving the trimming plate to move up and down;

[0011] A robotic arm assembly, located above and connected to the cylinder assembly, is used to drive the dressing disc to rotate and / or move on the surface of the grinding pad.

[0012] Preferably, the air guiding unit includes:

[0013] Vents are formed on the fixed plate;

[0014] The air tube has its first end located inside the air hole, and its second end connected to an external gas valve assembly. The air tube outputs gas through the air hole into the gap between the trimming plate and the fixing plate.

[0015] Preferably, the gas output from the trachea includes compressed dry air.

[0016] Preferably, the gas guiding unit further includes a gas guiding groove, which is formed on the lower surface of the fixed plate. The gas guiding groove is arranged around the air hole and is used to guide the gas output from the air hole along the gas guiding groove.

[0017] Preferably, the air guide groove includes at least one outlet end, which extends radially toward the edge of the fixed disk.

[0018] Preferably, the air guide groove includes:

[0019] The first groove portion includes: a plurality of closed-shaped grooves, the plurality of closed-shaped grooves being arranged at intervals around the air hole;

[0020] The second groove portion is connected to the first groove portion. The second groove portion includes a plurality of linear grooves, and at least one of the linear grooves includes the lead-out end.

[0021] Preferably, the plurality of said closed-shaped grooves include: a plurality of annular grooves and / or a plurality of polygonal grooves.

[0022] Preferably, the second groove includes two leads, the first ends of which are connected to the first groove, and the second ends of which extend toward the edge of the fixing plate.

[0023] On the other hand, the present invention also proposes a chemical mechanical grinding apparatus, comprising:

[0024] Grinding table;

[0025] A grinding pad, which is disposed on the grinding table;

[0026] A dressing disc device is disposed on the polishing pad for dressing the polishing pad, and the dressing disc device is the dressing disc device described above.

[0027] On the other hand, the present invention also proposes a cleaning method for a trimming disc device, comprising:

[0028] The above-described trimming disc device is used to clean the residue in the gap between the trimming disc and the fixing disc.

[0029] Preferably, the gas guiding unit includes an air hole formed on the fixed plate; an air pipe, the first end of which is disposed in the air hole, and the second end of which is connected to an external gas valve assembly. The air pipe outputs gas through the air hole into the gap between the trimming plate and the fixed plate.

[0030] Open the external gas valve assembly, and the gas pipe outputs gas through the gas hole to the gap between the upper surface of the dressing disc and the lower surface of the fixing disc, so as to clean the residue in the gap between the upper surface of the dressing disc and the lower surface of the fixing disc.

[0031] Preferably, the gas guiding unit further includes a gas guiding groove formed on the lower surface of the fixed plate, the gas guiding groove surrounding the air hole, and the gas guiding groove being used to guide the gas output from the air hole along the gas guiding groove.

[0032] When the external gas valve assembly is opened, the gas pipe outputs gas through the gas hole to the gap between the upper surface of the dressing disc and the lower surface of the fixed disc, so as to discharge the residue in the gap between the upper surface of the dressing disc and the lower surface of the fixed disc along the gas guide groove, thereby cleaning the dressing disc device.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] This invention provides a dressing disc device, a chemical mechanical grinding (CMP) equipment, and a cleaning method for the dressing disc device. By designing an air guiding unit on the fixed disc, it cleans the residue in the gap between the dressing disc and the fixed disc, avoiding the problem that the presence of residue affects product quality and production efficiency. At the same time, it makes the dressing disc easy to remove from the fixed disc, avoiding the problem of inaccurate or uneven pressure caused by forcibly removing the dressing disc, thus ensuring the production efficiency of the machine. Attached Figure Description

[0035] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the drawings described below are one embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0036] Figure 1 This is a schematic diagram of the lower surface structure of the fixed disk in the trimming disk device provided in Embodiment 1 of the present invention;

[0037] Figure 2 This is a schematic diagram of the trimming disc device provided in Embodiment 1 of the present invention.

[0038] Explanation of reference numerals in the attached drawings: 1-Air guide groove, 101-Annular groove, 102-Linear groove, 2-Air hole, 3-Threaded hole, 4-Grinding pad, 5-Clad disc, 6-Fixing disc, 7-Cylinder assembly, 8-Robotic arm assembly. Detailed Implementation

[0039] The following is in conjunction with the appendix Figure 1 and Figure 2The following detailed description of the dressing disc device, chemical mechanical polishing equipment, and cleaning method of the dressing disc device proposed in this invention will provide further explanation. The advantages and features of this invention will become clearer from the following description. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the accompanying drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0040] refer to Figure 1 As shown, in one aspect, this embodiment provides a dressing disc device for use in a chemical mechanical polishing (CMP) apparatus, the CMP apparatus including: a polishing table; a polishing pad 4 located on the polishing table, the polishing pad 4 being used to polish the thin film layer on the wafer surface, and the dressing disc device including: a dressing disc 5, a drive mechanism, and a gas guiding unit.

[0041] The trimming disc 5 is disposed on the polishing pad 4, and the trimming disc 5 is used to trim the polishing pad 4.

[0042] The driving mechanism is disposed on the dressing disc 5 to drive the dressing disc 5 to move up and down and / or rotate. The driving mechanism includes a fixed disc 6, which is located at the end of the driving mechanism and is used to connect to the dressing disc 5. In this embodiment, the fixed disc 6 and the dressing disc 5 are fixedly connected. Threaded holes 3 are correspondingly provided on the dressing disc 5 and the fixed disc 6 for fixing the dressing disc 5 and the fixed disc 6. There is a gap between the upper surface of the dressing disc 5 and the lower surface of the fixed disc 6. The driving mechanism also includes a cylinder assembly 7, which is located above the fixed disc 6 and connected to the fixed disc 6, for driving the dressing disc 5 to move up and down to adjust the distance between the dressing disc 5 and the grinding pad 4. The driving mechanism further includes a robotic arm assembly 8, which is located above the cylinder assembly 7 and connected to the cylinder assembly 7. The robotic arm assembly 8 drives the cylinder, fixed disk 6 and dressing disk 5 connected to it to move, and drives the dressing disk 5 to rotate and / or move on the surface of the grinding pad 4.

[0043] The air guiding unit is mounted on the fixed disk 6 and is used to clean residues in the gap between the dressing disk 5 and the fixed disk 6. In this embodiment, the residues include: polishing slurry, deionized water, and metal precipitates. The air guiding unit cleans these residues from the gap between the dressing disk 5 and the fixed disk 6, preventing the polishing slurry from crystallizing due to prolonged exposure to air, which could affect product quality and production efficiency. Simultaneously, it removes the deionized water between the dressing disk 5 and the fixed disk 6, making the dressing disk 5 easier to disassemble and avoiding problems such as inaccurate or uneven pressure caused by forcibly disassembling the dressing disk 5.

[0044] refer to Figure 1 and Figure 2 As shown, in this embodiment, the air guiding unit includes: an air hole 2, an air pipe, and an air guiding groove 1. The air hole 2 is formed on the fixed plate 6. The first end of the air pipe is disposed in the air hole 2, and the second end of the air pipe is connected to an external gas valve assembly. The air pipe outputs gas through the air hole 2 into the gap between the trimming plate 5 and the fixed plate 6. In some preferred embodiments, the gas output by the air pipe includes compressed dry air.

[0045] The gas guide groove 1 is formed on the lower surface of the fixed disk 6, and surrounds the air hole 2. The gas guide groove 1 is used to guide the gas output from the air hole 2 out along the gas guide groove 1. In some preferred embodiments, the gas guide groove 1 includes at least one outlet end, which extends radially towards the edge of the fixed disk 6. The outlet end is used to discharge the gas and the residue blown out by the gas.

[0046] The air guide groove 1 includes a first groove portion and a second groove portion. The first groove portion includes a plurality of closed-shaped grooves, which are spaced apart around the air hole 2. (Reference) Figure 1 The three annular grooves 101 surrounding the outer side of the vent 2 are shown. The plurality of said closed-shaped grooves include: a plurality of annular grooves 101 and / or a plurality of polygonal grooves. The closed-shaped grooves include: any one of annular grooves 101 and polygonal grooves. Figure 1 The three closed-shaped grooves shown are all annular grooves 101. The second groove portion is connected to the first groove portion, and the second groove portion includes: a plurality of linear grooves 102, at least one of the linear grooves 102 including the lead-out end. (Reference) Figure 1 The linear grooves 102 at both ends of the central air guide groove 1 are shown.

[0047] In this embodiment, the second groove includes two leads, the first ends of which are connected to the first groove, and the second ends of which extend toward the edge of the fixing disk 6.

[0048] On the other hand, this embodiment also proposes a chemical mechanical polishing apparatus, including: a polishing table; a polishing pad 4 disposed on the polishing table; and a dressing disc device disposed on the polishing pad 4 for dressing the polishing pad 4. Here, the dressing disc device is the dressing disc device in the above embodiment.

[0049] On the other hand, this embodiment also proposes a cleaning method for the trimming disc device, including: using the trimming disc device described above to clean the residue in the gap between the trimming disc 5 and the fixing disc 6.

[0050] In some embodiments, the air guiding unit includes an air hole 2, which is formed on the fixed plate 6; an air pipe, the first end of which is disposed in the air hole 2, and the second end of which is connected to an external gas valve group. The air pipe outputs gas through the air hole 2 into the gap between the trimming plate 5 and the fixed plate 6.

[0051] The specific cleaning method includes: after the trimming disc device works, the robotic arm assembly returns to its initial position. At this time, the external gas valve group is opened, and the air pipe outputs gas through the air hole 2 to the gap between the upper surface of the trimming disc 5 and the lower surface of the fixed disc 6, so as to clean the residue in the gap between the upper surface of the trimming disc 5 and the lower surface of the fixed disc 6.

[0052] In other embodiments, the gas guiding unit includes an air hole 2 formed on the fixed plate 6; an air pipe, the first end of which is disposed within the air hole 2, and the second end of which is connected to an external gas valve assembly. The air pipe outputs gas through the air hole 2 into the gap between the trimming plate 5 and the fixed plate 6. The gas guiding unit further includes a gas guiding groove 1 formed on the lower surface of the fixed plate 6. The gas guiding groove 1 surrounds the air hole 2 and is used to guide the gas output from the air hole 2 along the gas guiding groove 1.

[0053] The specific cleaning method includes: after the trimming disc device works, the robotic arm assembly returns to its initial position. At this time, the external gas valve group is opened, and the air pipe outputs gas through the air hole 2 to the gap between the upper surface of the trimming disc 5 and the lower surface of the fixed disc 6, so as to discharge the residue in the gap between the upper surface of the trimming disc 5 and the lower surface of the fixed disc 6 along the air guide groove 1, thereby cleaning the trimming disc device.

[0054] When it is necessary to replace the dressing disc 5, the external gas valve group is opened to blow out the deionized water remaining in the gap between the upper surface of the dressing disc 5 and the lower surface of the fixed disc 6. This reduces the tension between the upper surface of the dressing disc 5 and the lower surface of the fixed disc 6, making it easier to replace the dressing disc 5. It also avoids the problem of inaccurate or uneven pressure on the dressing disc 5 caused by forcibly disassembling the dressing disc 5 when the tension between the upper surface of the dressing disc 5 and the lower surface of the fixed disc 6 is too high, thus ensuring product quality and production efficiency.

[0055] In summary, the dressing disc device, chemical mechanical grinding equipment, and cleaning method of the dressing disc device provided in the above embodiments, by designing an air guiding unit on the fixed disc 6, cleans the residue in the gap between the dressing disc 5 and the fixed disc 6, avoiding the problem that the presence of residue affects product quality and production efficiency. At the same time, it makes the dressing disc 5 easy to remove from the fixed disc 6, avoiding the problem of inaccurate pressing or uneven pressing caused by forcibly removing the dressing disc 5, thus ensuring the production efficiency of the machine.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0057] It should be noted that the apparatus and methods disclosed in the embodiments herein can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments herein. In this regard, each block in a flowchart or block diagram may represent a module, program, or part of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system to perform the specified function or action, or can be implemented using a combination of dedicated hardware and computer instructions.

[0058] In addition, the functional modules in the various embodiments of this article can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0059] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A dressing disc device for use in a chemical mechanical polishing (CMP) apparatus, the CMP apparatus comprising: Grinding table; A polishing pad, located on the polishing table, for polishing a thin film layer on a wafer surface, characterized in that it comprises: A dressing disc is disposed on the polishing pad, and the dressing disc is used to dress the polishing pad; A drive mechanism, disposed on the dressing disc, for driving the dressing disc to move up and down and / or rotate, the drive mechanism comprising: a fixed disc located at the end of the drive mechanism, the fixed disc for connecting to the dressing disc, and a gap existing between the upper surface of the dressing disc and the lower surface of the fixed disc; An air guiding unit is disposed on the fixed plate, and the air guiding unit is used to clean the residue in the gap between the trimming plate and the fixed plate.

2. The trimming disc device as described in claim 1, characterized in that, The drive mechanism further includes a cylinder assembly located above the fixed plate and connected to the fixed plate, used to drive the trimming plate to move up and down; A robotic arm assembly, located above and connected to the cylinder assembly, is used to drive the dressing disc to rotate and / or move on the surface of the grinding pad.

3. The dressing disc device as described in claim 1, characterized in that, The air guiding unit includes: Vents are formed on the fixed plate; The air tube has its first end located inside the air hole, and its second end connected to an external gas valve assembly. The air tube outputs gas through the air hole into the gap between the trimming plate and the fixing plate.

4. The trimming disc device as described in claim 3, characterized in that, The gas output from the trachea includes compressed dry air.

5. The dressing disc device as described in claim 3, characterized in that, The gas guiding unit further includes a gas guiding groove, which is formed on the lower surface of the fixed plate. The gas guiding groove is arranged around the air hole and is used to guide the gas output from the air hole along the gas guiding groove.

6. The trimming disc device as described in claim 5, characterized in that, The air guide groove includes at least one outlet end, which extends radially toward the edge of the fixed disk.

7. The trimming disc device as described in claim 6, characterized in that, The air guide groove includes: The first groove portion includes: a plurality of closed-shaped grooves, the plurality of closed-shaped grooves being arranged at intervals around the air hole; The second groove portion is connected to the first groove portion. The second groove portion includes a plurality of linear grooves, and at least one of the linear grooves includes the lead-out end.

8. The trimming disc device as described in claim 7, characterized in that, The plurality of said closed-shaped grooves include: a plurality of annular grooves and / or a plurality of polygonal grooves.

9. The trimming disc device as described in claim 7, characterized in that, The second groove includes two leads, the first ends of which are connected to the first groove, and the second ends of which extend toward the edge of the fixed plate.

10. A chemical mechanical grinding apparatus, characterized in that, include: Grinding table; A grinding pad, which is disposed on the grinding table; A dressing disc device is disposed on the polishing pad for dressing the polishing pad, wherein the dressing disc device is the dressing disc device as described in any one of claims 1-9.

11. A cleaning method for a trimming disc device, characterized in that, include: A dressing disc device as described in any one of claims 1-9 is used to clean the residue in the gap between the dressing disc and the fixing disc.

12. The cleaning method of the dressing disc device as described in claim 11, characterized in that, The gas guiding unit includes an air hole formed on the fixed plate; an air pipe, the first end of which is disposed in the air hole, and the second end of which is connected to an external gas valve assembly. The air pipe outputs gas through the air hole into the gap between the trimming plate and the fixed plate. Open the external gas valve assembly, and the gas pipe outputs gas through the gas hole to the gap between the upper surface of the dressing disc and the lower surface of the fixing disc, so as to clean the residue in the gap between the upper surface of the dressing disc and the lower surface of the fixing disc.

13. The cleaning method of the trimming disc device as described in claim 12, characterized in that, The gas guiding unit further includes a gas guiding groove, which is formed on the lower surface of the fixed plate. The gas guiding groove surrounds the air hole and is used to guide the gas output from the air hole along the gas guiding groove. When the external gas valve assembly is opened, the gas pipe outputs gas through the gas hole to the gap between the upper surface of the dressing disc and the lower surface of the fixed disc, so as to discharge the residue in the gap between the upper surface of the dressing disc and the lower surface of the fixed disc along the gas guide groove, thereby cleaning the dressing disc device.

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