Marking device and positioning device for failure analysis

Abstract

The invention relates to the technical field of semiconductors, in particular to a marking device and a positioning device for failure analysis, the marking device comprises a sleeve, a rotating assembly and a marking assembly, the rotating assembly and the marking assembly are arranged in the sleeve, and the marking assembly comprises a marking rod body and a marking tip. The marking tip extends out of the sleeve, one end of the marking rod body is connected with the marking tip, the other end of the marking rod body is connected with the rotating assembly, the rotating assembly is used for driving the marking assembly to rotate, the whole marking process is completed through an optical microscope, and the marking efficiency can be effectively improved; and the marking accuracy is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a marking device and a positioning device for failure analysis. Background Technology

[0002] An optical microscope is an optical instrument that uses optical principles to magnify and image tiny objects that are indistinguishable to the human eye, allowing people to extract information about their fine structures. It is widely used in semiconductors, life sciences, nanotechnology, and materials science. When optical microscopes are used in the semiconductor industry, they are mainly used to study wafer surface defects and accurately locate the target areas of the defects. However, because optical microscopes have a short working distance when observing samples, existing marking tools cannot be directly used for marking on the optical microscope, resulting in a cumbersome marking process, low accuracy of the target area, and easy marking errors that can contaminate the analytical structure. Summary of the Invention

[0003] This application discloses a marking device and a positioning device for failure analysis, which are used to improve the marking accuracy of optical microscopes when detecting defects on the surface of wafers.

[0004] This application provides the following technical solution:

[0005] In a first aspect, this application provides a marking device, which includes a sleeve, a rotating assembly, and a marking assembly. The rotating assembly and the marking assembly are disposed inside the sleeve. The marking assembly includes a marking rod body and a marking tip. The marking tip protrudes from the sleeve. One end of the marking rod body is connected to the marking tip, and the other end of the marking rod body is connected to the rotating assembly. The rotating assembly is used to drive the marking assembly to rotate.

[0006] This application adds a marking tip with a protruding sleeve, allowing the marking tip to better contact the surface of the object to be marked. Under the action of the rotating component, the marking tip can rotate along the axis of the sleeve, thus allowing the marking tip to rotate on the surface of the object to be marked and leave a marked area with a mark on the surface of the object. This area is the defect area on the surface of the object to be marked. In the above marking process, the marking tip can be used to mark different target positioning points, positioning lines, positioning rings and other sizes according to actual needs. The diversified marking methods can effectively improve the marking efficiency and improve the marking accuracy.

[0007] In some embodiments, the rotating assembly includes a central rotating shaft and a first rotating gear. One end of the central rotating shaft is rotatably connected to the marking rod body. The first rotating gear is sleeved on the central rotating shaft and fixedly connected to the central rotating shaft. The first rotating gear partially protrudes from the side wall of the sleeve.

[0008] In some embodiments, the marking device further includes an adjustment assembly comprising a second rotating gear and a helical rod. The helical rod is rotatably disposed inside the sleeve and is threadedly connected to the marking rod body. The second rotating gear partially protrudes from the side wall of the sleeve. The second rotating gear drives the marking rod body to move via the helical rod, thereby adjusting the size of the marking area at the marking tip.

[0009] In some embodiments, the marking assembly includes two marking rod bodies, each marking rod body having a corresponding marking tip, and the spiral rod having a first segment and a second segment connected together, the first segment and the second segment having opposite thread directions; the two marking rod bodies are respectively threadedly connected to the first segment and the second segment.

[0010] In some embodiments, the marking device further includes two micrometer scales, which are respectively disposed on the first segment and the second segment.

[0011] In some embodiments, an obtuse angle is formed between the mark tip and the mark rod body, with the opening facing the sleeve axis.

[0012] In some embodiments, the marker tip is detachable from the marker rod body.

[0013] In some embodiments, the sleeve includes an outer cylinder body and an inner cylinder body, the inner cylinder body is disposed inside the outer cylinder body and there is a gap between the inner cylinder body and the outer cylinder body, the marking device is disposed inside the inner cylinder body, and the outer cylinder body has a through first adjustment hole and a second adjustment hole, both of which are used to expose the inner cylinder body.

[0014] Secondly, this application also provides a positioning device for failure analysis, the positioning device comprising: a marking device as described in any of the preceding claims, a mirror frame, a turntable, and an eyepiece; the turntable is rotatably mounted on the mirror frame, and the marking device and the eyepiece are both mounted on the turntable.

[0015] In some embodiments, the positioning device further includes a conversion sleeve, the marking device is rotatably connected to the turntable through the conversion sleeve, a bearing is provided inside the conversion sleeve, and the central rotation axis of the rotating assembly is rotatably connected to the bearing. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal structure of the marking device in an embodiment of this application;

[0017] Figure 2 This is an exploded view of each component when the marking device is connected to the mirror frame in the embodiments of this application;

[0018] Figure 3 This is a schematic diagram of the rotating component structure in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the adjustment component structure without the marker rod body installed in the embodiment of this application;

[0020] Figure 5 This is a schematic diagram of the sleeve structure in an embodiment of this application;

[0021] Figure 6 This is a diagram of the positioning and calibration target paper in the embodiments of this application;

[0022] Figure 7 This is a diagram showing the effect of positioning calibration in an embodiment of this application.

[0023] The components are: 1-mirror frame, 2-turntable, 3-conversion sleeve, 4-sleeve, 5-eyepiece, 6-outer cylinder body, 7-inner cylinder body, 8-central rotating shaft, 9-first rotating gear, 10-marking rod body, 11-marking tip, 12-disassembly gear, 13-screw rod, 14-second rotating gear, 15-micrometer scale, 16-first adjustment hole, 17-second adjustment hole, 18-bearing. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] like Figures 1-2As shown, in a first aspect, this application provides a marking device, which includes a sleeve 4, a rotating assembly, and a marking assembly. The rotating assembly and the marking assembly are disposed inside the sleeve 4. The marking assembly includes a marking rod body 10 and a marking tip 11. The marking tip 11 protrudes from the sleeve 4. One end of the marking rod body 10 is connected to the marking tip 11, and the other end of the marking rod body 10 is connected to the rotating assembly. The rotating assembly is used to drive the marking assembly to rotate. By adding a marking tip 11 protruding from the sleeve 4, this application enables the marking tip 11 to better contact the surface of the object to be marked. Under the action of the rotating assembly, the marking tip 11 can rotate along the axis of the sleeve 4, thereby enabling the marking tip 11 to rotate on the surface of the object to be marked and leave a marked area with a mark on the surface of the object to be marked. This area is the defect area on the surface of the object to be marked. In the above marking process, the marking tip 11 can mark different marking positioning points, positioning lines, positioning rings, and other targets of various sizes according to actual needs. The diversified marking methods can effectively improve marking efficiency and improve marking accuracy.

[0026] One possible implementation method can be found in [reference]. Figure 3 The rotating assembly includes a central rotating shaft 8 and a first rotating gear 9. One end of the central rotating shaft 8 is rotatably connected to the marking rod body 10. The first rotating gear 9 is sleeved on the central rotating shaft 8 and fixedly connected to it. The first rotating gear 9 protrudes from the side wall of the sleeve. In the above structure, the first rotating gear 9 is used to rotate the central rotating shaft 8 in the transverse direction, i.e., the left and right direction in the figure, so that the central rotating shaft 8 can drive the marking rod body 10 to rotate around the sleeve 4, thereby causing the marking tip 11 to leave a marking area on the surface of the object to be marked. For the convenience of describing the specific embodiments in this application, the object to be marked is set as a wafer. The marking area left by the marking tip 11 on the wafer is the defect area. In addition, the first rotating gear 9 protrudes from the side wall of the sleeve 4 to facilitate rotation by the user.

[0027] One possible implementation method can be found in [reference]. Figure 1 , Figure 3 , Figure 4 The marking device also includes an adjustment assembly, which comprises a second rotating gear 14 and a helical rod 13. The helical rod 13 is rotatably disposed inside the sleeve 4 and is threadedly connected to the marking rod body 10. The second rotating gear 14 partially protrudes from the side wall of the sleeve 4. The second rotating gear 14 drives the marking rod body 10 to move via the helical rod 13, thereby adjusting the size of the marking area at the marking tip 11. In the above structure, specifically as follows... Figure 3The marker rod body 10 is rotatably mounted on the central rotating shaft 8 via a rotating shaft, and the axis of the rotating shaft is perpendicular to the axis of the central rotating shaft 8. When the central rotating shaft 8 rotates, the relative position of the marker rod body 10 and the central rotating shaft 8 remains unchanged along the circumferential direction of the central rotating shaft 8, thus facilitating the rotation of the marker rod body 10 by the central rotating shaft 8. In the first direction, the marker rod body 10 can also rotate relative to the central rotating shaft 8 via the rotating shaft, wherein the first direction is perpendicular to both the axis of the central rotating shaft 8 and the axis of the rotating shaft. Furthermore, the outer circumferential surface of the marker rod body 10 is provided with a threaded structure that is threadedly connected to the helical rod 13, such as... Figure 1 As shown, when the second rotating gear 14 rotates, it drives the screw rod 13 to rotate as well. At this time, the marking rod body 10 can reciprocate left and right relative to the screw rod 13 through the threaded structure. The left and right movement of the marking rod body 10 can change the size of the marking area formed by the rotation of the marking tip 11. Since the wafers themselves are of different sizes and the size of the defect area is also different, this application can continuously change the size of the marking area according to the size of the defect problem area, marking different sizes of markings for different sized targets, effectively improving the marking accuracy and facilitating subsequent analysis and testing.

[0028] In one possible implementation (not shown in the figure), the second rotating gear 14 and the screw rod 13 in this application are threadedly connected. Specifically, the screw rod 13 is provided with a threaded structure that meshes with the second rotating gear 14. The second rotating gear 14 drives the screw rod 13 to rotate through meshing, thereby causing the counting rod body 10 to reciprocate along the left and right direction of the screw rod 13.

[0029] One possible implementation method can be found in [reference]. Figure 1 The marking assembly includes two marking rod bodies 10, each marking rod body 10 having a corresponding marking tip 11. The spiral rod 13 has a first section and a second section connected together, with the threads of the first section and the second section having opposite directions. The two marking rod bodies 10 are respectively threaded to the first section and the second section. In this application, there can also be two marking rod bodies 10, both of which are threaded to the spiral rod 13. However, it is worth noting that the spiral rod 13 is also divided into two regions with opposite thread directions, so that the two marking rod bodies 10 can move in opposite directions, making it easier to adjust the size of the area formed by the two marking rod bodies 10, so that this application can better cope with marking areas of different sizes.

[0030] One possible implementation method can be found in [reference]. Figure 4The marking device also includes two micrometer scales, which are respectively set on the first segment and the second segment. This application sets two micrometer scales 15, so that they can better correspond to the two marking rod bodies 10. The precision on the micrometer scale 15 can enable the user to more accurately drive the marking tip 11 to move in the defect area, effectively improving the marking accuracy.

[0031] In one possible implementation (not shown in the figure), there is one marking rod body 10. One end of the marking rod body 10 is rotatably connected to the central rotating shaft 8, and the marking rod body 10 is also threadedly connected to the spiral rod 13. In this application, there can be one marking rod body 10. When there is one marking rod body 10, the operator only needs to rotate the second rotating gear 14 to move the marking tip 11 connected to one marking rod body 10 to the edge of the defect area. The operator can then rotate the first rotating gear 9 to drive the marking tip 11 to mark the defect area.

[0032] In one possible implementation, the marking device also includes a micrometer scale 15, which is disposed on the screw rod 13. The precision of the micrometer scale 15 enables the user to more accurately drive the marking tip 11 to move in the defect area, effectively improving the marking accuracy.

[0033] One possible implementation method can be found in [reference]. Figure 1 The marking tip 11 and the marking rod body 10 form an obtuse angle with the opening facing the axis of the sleeve 4. The marking tip 11 with a certain angle can better contact the wafer surface. Moreover, the marking tip 11 in this application has nanometer-level precision, which can more accurately mark the defect area.

[0034] One possible implementation method can be found in [reference]. Figure 1 The marker tip 11 and the marker rod body 10 are detachable. This application also provides a disassembly gear 12, which is used to thread the marker tip 11 and the marker rod body 10, so as to facilitate the manual replacement of the marker tip 11 in the future.

[0035] It is worth noting that the connection method of disassembling gear 12 is only one method in this application. Other pairwise matching methods, such as plugging, pinning, and snapping, are also connection methods in this application. This application does not make specific limitations on these methods and intends to include these modifications and variations.

[0036] One possible implementation method can be found in [reference]. Figures 5-7The sleeve 4 includes an outer cylinder body 6 and an inner cylinder body 7. The inner cylinder body 7 is disposed inside the outer cylinder body 6, and there is a gap between the inner cylinder body 7 and the outer cylinder body 6. The marking device is disposed inside the inner cylinder body 7. The outer cylinder body 6 has a through first adjustment hole 16 and a second adjustment hole 17, both of which are used to expose the inner cylinder body 7. After the lens body in this application has been used and operated multiple times, due to mechanical wear or frequent handling, there is a probability that the inner cylinder body 7 will shift, that is, the center points of the two marking tips 11 will no longer be aligned with the center point of the stage. At this time, the user can make a fine adjustment to the inner cylinder body 7 through the first adjustment hole 16 and the second adjustment hole 17 opened on the outer cylinder body 6. Specifically, manual adjustment can be achieved with the help of external tools, such as screwdrivers, levers, etc. Here, this application uses a screwdriver as an example. When the user observes through a microscope that the center points of the two marking tips 11 are no longer aligned with the center point of the stage, please refer to the following for details. Figure 6 , Figure 7 Users can use the crosshair positioning calibration target paper as a reference; for details, please refer to... Figure 6 , Figure 7 , Figure 6 This serves as the standard positioning and calibration target paper diagram. Figure 7 This is a diagram showing the effect during positioning and calibration. Figure 7 The arrow in the image represents the center point of the two marker tips 11. Figure 7 The diagram illustrates the process of continuously adjusting the center points of the two marking tips 11 to align with the center point of the positioning calibration target paper. Specifically, when a deviation occurs in the center points of the two marking tips 11, the user aligns the center points of the two marking tips 11 with the center point of the crosshair target. Then, a screwdriver is inserted into the first adjustment hole 16 or the second adjustment hole 17, bringing the screwdriver into contact with the inner cylinder body 7. The inner cylinder body 7 is then rotated in one direction. In this embodiment, the first rotating gear 9 sequentially penetrates the inner cylinder body 7 and the outer cylinder body 6, and the second rotating gear 14 sequentially penetrates the inner cylinder body 7 and the outer cylinder body 6. This application can be configured such that when the rotation adjustment direction is clockwise, the two marking tips 11... When the center point is located in the positive direction of the coordinate system, and the rotation adjustment direction is counterclockwise, the center points of the two mark tips 11 are located in the negative direction of the coordinate system. If the center points of the two mark tips 11 in this application are biased to the right side of the cross target, the inner cylinder body 7 is moved counterclockwise to the left to align the midpoint of the marking device with the midpoint of the cross target, and vice versa. In summary, the marking device adjusted by the first adjustment hole 16 and the second adjustment hole 17 can improve the hit rate and achieve accurate positioning. However, it is worth noting that the displacement caused by the adjustment direction described above is only an example. Other directions are also within the scope of the claims of this application and their equivalents. This application does not make specific limitations on this.

[0037] Secondly, for details please refer to Figure 2 This application also provides a positioning device for failure analysis, which includes: a marking device as described above, a microscope frame 1, a turntable 2, and an eyepiece 5; the turntable 2 is rotatably mounted on the microscope frame 1, and the marking device and the eyepiece 2 are both mounted on the turntable 1. The positioning device for failure analysis in this application can be a defect analysis device such as an optical microscope. For ease of description, this application takes an optical microscope as an example. When the optical microscope in this application is used, the user can prepare to identify the defect location on the wafer through the eyepiece 5. At this time, the user can rotate the marking device directly above the defect location through the turntable 2, and then use the lifting function of the optical microscope to make the marking tip 11 contact the surface at the defect location of the wafer. At this time, the rotating component is used to drive the marking tip 11 to rotate on the surface at the defect location of the wafer, thus completing the marking of the surface at the defect location of the wafer. The entire marking process is completed by the optical microscope without the need for other analysis tools, effectively improving the marking efficiency.

[0038] One possible implementation method can be found in [reference]. Figure 2 The positioning device also includes a conversion sleeve. The marking device is rotatably connected to the turntable through the conversion sleeve. A bearing is provided inside the conversion sleeve. The central rotating shaft of the rotating component is rotatably connected to the bearing so that the central rotating shaft 8 can rotate relative to the conversion sleeve 3 through the bearing 18, so as to efficiently complete the marking process at the defect location of the defective wafer.

[0039] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A marking device, characterized in that The marking device comprises a sleeve, a rotating assembly and a marking assembly, the rotating assembly and the marking assembly are arranged inside the sleeve, the marking assembly comprises a marking rod body and a marking tip, the marking tip protrudes out of the sleeve, one end of the marking rod body is connected with the marking tip, the other end of the marking rod body is connected with the rotating assembly, and the rotating assembly is used for driving the marking assembly to rotate.

2. The marking device of claim 1, wherein, The rotating assembly comprises a central rotating shaft and a first rotating gear, one end of the central rotating shaft is rotationally connected with the marking rod body, the first rotating gear is sleeved on the central rotating shaft and is fixedly connected with the central rotating shaft, and the first rotating gear partially protrudes out of the side wall of the sleeve.

3. The marking device of claim 2, wherein, The marking device further comprises an adjusting assembly, the adjusting assembly comprises a second rotating gear and a screw rod, the screw rod is rotationally arranged inside the sleeve, the screw rod is threadedly connected with the marking rod body, and the second rotating gear partially protrudes out of the side wall of the sleeve; the second rotating gear drives the marking rod body to move through the screw rod, and is used for adjusting the size of the marking area of the marking tip.

4. The marking device of claim 3, wherein The marking assembly comprises two marking rod bodies, each of the marking rod bodies is provided with the marking tip in one-to-one correspondence, the screw rod has a first segment and a second segment connected in series, and the screw threads of the first segment and the second segment are opposite in direction; the two marking rod bodies are threadedly connected with the first segment and the second segment respectively.

5. The marking device of claim 4, wherein, The marking device further comprises two micrometer scales, and the two micrometer scales are arranged on the first segment and the second segment respectively.

6. The marking device of claim 1, wherein, An obtuse angle is formed between the marking tip and the marking rod body, and the opening of the obtuse angle is directed to the axis of the sleeve.

7. The marking device of claim 1, wherein The marking tip and the marking rod body are detachable.

8. Marking device according to any of claims 1-7, characterized in that The sleeve comprises an outer cylinder body and an inner cylinder body, the inner cylinder body is arranged inside the outer cylinder body, and a gap is formed between the inner cylinder body and the outer cylinder body, the marking device is arranged inside the inner cylinder body, and the outer cylinder body is provided with a first adjusting hole and a second adjusting hole penetrating through, and the first adjusting hole and the second adjusting hole are used for exposing the inner cylinder body.

9. A positioning device for failure analysis, characterized in that The positioning device comprises the marking device, a mirror body frame, a rotating disc and an ocular lens, the rotating disc is rotationally mounted on the mirror body frame, and the marking device and the ocular lens are mounted on the rotating disc.

10. The positioning device of claim 9, wherein, The positioning device further comprises a conversion sleeve, the marking device is rotationally connected with the rotating disc through the conversion sleeve, a bearing is arranged inside the conversion sleeve, and the central rotating shaft of the rotating assembly is rotationally connected with the bearing.

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