Continuous hot dipping die for contact pin conductor

Abstract

The invention relates to the technical field of pin conductor material processing, in particular to a pin conductor continuous hot dipping die which comprises a hot dipping die and a tin removing die, and the hot dipping die comprises a drawing die used for controlling the thickness of a plating layer; the tin removing mold comprises an air blowing mold, a tin removing mold and a tin removing mold. The air blowing mold is provided with air inlets and air outlets. The air outlet direction of the air outlet is perpendicular to the strip conveying direction. The receiving mold is arranged below the strip and is provided with a material receiving opening and an air suction opening; after the thickness of a coating on the surface of a strip is controlled through a drawing die, tin liquid on the side face of the contact pin is blown off and the thickness of the coating on the side face of the contact pin is controlled through an air knife in cooperation with an up-blowing and down-sucking mode of a tin removing die, continuous hot dipping of the high-quality contact pin with the complex section is achieved, and it is guaranteed that the thickness of the coating on the surface and the thickness of the coating on the side face of a contact pin conductor are kept consistent; the problem that in the prior art, the thickness consistency of a plating layer on the surface of a contact pin conductor in a complex shape is poor is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pin conductor material processing, in particular to a pin conductor continuous hot-dip plating die. BACKGROUND

[0002] Pin products are widely used in the field of electronic devices, and have various shapes. The use of tin, nickel, gold and other coatings for electroplating can prevent corrosion and increase conductivity. For complex-shaped pin conductors, electroplating can be used, but tin whiskers may occur during electroplating tin, and the cost of electroplating nickel and gold is high, and the solderability is low.

[0003] In addition, more and more electronic device solder joints and device surfaces require tin and other materials, and tin whiskers need to be prevented. Hot-dip tin alloy can reduce the occurrence of tin whiskers. If hot-dip plating is used, for complex-shaped pin structures, such as Figure 1 As shown in the figure, tin will hang at the gap of the complex cross section, and the coating will be uneven. In addition, single pins cannot be continuously produced, and the hot-dip plating process is difficult.

[0004] Chinese patent CN201720487237.6 discloses a metal wire tin plating equipment, which comprises a pay-off device, an annealing device, a flux coating device, a hot-dip plating device and a winding device. The metal wire is softened after heat treatment in the annealing device, and the softened metal wire is coated with a layer of flux in the flux coating device. The metal wire coated with the flux layer is plated with a layer of tin in the hot-dip plating device, and the metal wire coated with the tin layer is finally wound up by the winding device. The metal wire tin plating equipment of the utility model mainly controls the thickness of the coating on the surface of the metal wire immersed in the tin water through the sizing die, and makes the coating surface smooth and uniform in thickness, which can improve the welding performance of the metal wire.

[0005] Although the technical scheme discloses the use of a sizing die to control the thickness of the coating on the surface of the metal wire immersed in the tin water, the thickness of the coating on the side of the pin conductor cannot be consistent with the thickness of the coating on the surface of the pin conductor after the pin conductor with complex shape passes through the sizing die. SUMMARY

[0006] The plug pin conductor continuous hot-dip plating mold aims at the deficiencies of the prior art, and utilizes the draw die to control the plating layer thickness of the strip surface, sets a tin removal die at the outlet of the draw die, sets the air outlet direction of the air outlet perpendicular to the strip transmission direction, cooperates with the blowing and sucking mode of the tin removal die, blows off the tin liquid on the side of the plug pin, controls the plating layer thickness of the side of the plug pin by means of the air knife, realizes the continuous hot-dip plating of the plug pin with a complex section and high quality, ensures that the plating layer thickness of the surface and the side of the plug pin conductor is consistent, realizes the hot-dip alloying of the surface of the plug pin conductor with high quality, and solves the problem that the plating layer thickness consistency of the plug pin conductor with a complex shape cannot be ensured in the prior art.

[0007] To achieve the above object, the present application provides the following technical scheme. A plug pin conductor continuous hot-dip plating mold, comprising a hot-dip plating mold, the hot-dip plating mold for controlling the plating layer thickness is arranged at the discharge end of a tin melting pool, and a tin removal die, the tin removal die is adjustably arranged on one side of the hot-dip plating mold. The hot-dip plating mold comprises a draw die for controlling the plating layer thickness. The tin removal die comprises: A blowing die, the blowing die is arranged above the strip, and is provided with an air inlet and an air outlet; the air outlet direction of the air outlet is perpendicular to the strip transmission direction. A receiving die, the receiving die is arranged below the strip, and is provided with a material receiving port and an air suction port. The plug pin conductor strip passes through the draw die to control the plating layer thickness, the blowing die blows off the tin liquid hanging on the side of the plug pin, and the small tin particles or small tin liquid drops blown off by the blowing die are collected by the negative pressure die cavity of the receiving die.

[0008] As an improvement, the hot-dip plating mold further comprises an angle-adjustable mounting plate, and the draw die is mounted on the mounting plate.

[0009] As an improvement, the tin removal die further comprises: A moving seat, two groups of positioning grooves are formed in the side surface of the moving seat. And an adjusting plate, the adjusting plate is mounted on the moving seat through the two groups of positioning grooves.

[0010] As an improvement, the air outlet direction of the air outlet is perpendicular to the strip transmission direction, and the profile of the air outlet is a character structure or a profile structure surrounded by the sides of adjacent plug pins.

[0011] As an improvement, the material receiving port is arranged in a horn port structure, the bottom of the material receiving port is provided with an air suction channel and a storage bin, and the air suction channel is arranged at the top of the storage bin and connected with the material receiving port.

[0012] As an improvement, the tin-removing die further comprises a discharging assembly for discharging the tin particles or tin droplets collected by the receiving die.

[0013] As an improvement, the storage bin is arranged through the receiving die, and one end is rotatably provided with a bin door for closing the storage bin.

[0014] As an improvement, the discharging assembly comprises a push plate slidingly arranged in the storage bin, the push plate pushes the particles in the storage bin out through the bin door, and a driving assembly drives the push plate to reciprocate.

[0015] As an improvement, the top surface of the push plate is arranged in alignment with the bottom surface of the air suction channel.

[0016] As an improvement, the air blowing die is further provided with a sensor for detecting the position of the pin.

[0017] The present application has the following advantages: (1) The present application controls the thickness of the plated layer on the surface of the strip by using the drawing die, sets a tin-removing die at the outlet of the drawing die, sets the air outlet direction of the air outlet of the tin-removing die perpendicular to the transmission direction of the strip, and cooperates with the blowing and sucking mode of the tin-removing die to blow off the tin liquid on the side of the pin and control the thickness of the plated layer on the side of the pin by the air knife, thereby realizing continuous hot dipping plating of the high-quality complex-section pin, ensuring that the thickness of the plated layer on the surface and side of the pin conductor is consistent, and realizing high-quality surface hot alloy plating of the pin conductor.

[0018] (2) The present application forms an air knife by the air outlet of the air blowing die, and the shape of the air knife matches the profile between the adjacent two pins, cooperates with the sensor to detect the position of the pin, realizes blowing off the tin liquid on the side of the pin at a fixed point, and thereby realizes high-quality plated layer control on the surface of the pin.

[0019] (3) The present application immerses one end of the drawing die into the molten liquid, thereby avoiding that the impurities on the surface of the molten liquid adhere to the surface of the strip during the hot dipping plating process of the strip, and affecting the surface quality of the plated layer.

[0020] (4) The present application realizes adjustment of different thickness, position and angle of the strip by the moving seat cooperating with the adjusting plate, and improves the adaptability of the equipment.

[0021] (5) The present application periodically discharges the tin particles in the storage bin by the discharging assembly to realize reuse of the raw material, and in the process of cleaning the tin particles by the push plate, does not affect the normal continuous production of the hot dipping plating.

[0022] In summary, the present application has the advantages of uniform tin plating thickness, impurity-free plated layer surface, wide application range, etc. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1The pin of the complex structure is plated by the common hot-dip plating, and the surface quality of the plated layer is good; Figure 2 An embodiment one process flow diagram of the present application is shown in the figure; Figure 3 A strip structure diagram of the pin conductor semi-finished product of the present application is shown in the figure; Figure 4 An embodiment two overall structure diagram of the present application is shown in the figure; Figure 5 A hot-dip plating device diagram of the present application is shown in the figure; Figure 6 An embodiment one process flow diagram of the present application is shown in the figure; Figure 5 A local enlarged diagram of I in the embodiment one of the present application is shown in the figure; Figure 7 A tin-removing mold diagram of the present application is shown in the figure; Figure 1 ; Figure 8 A tin-removing mold diagram of the present application is shown in the figure; Figure 2 ; Figure 9 A blow mold bottom gas outlet structure diagram of the present application is shown in the figure; Figure 10 A receiving mold structure diagram of the present application is shown in the figure; Figure 11 A receiving mold internal structure diagram of the present application is shown in the figure; Figure 12 A tin-removing pool molten liquid surface and drawing die position diagram of the present application is shown in the figure; Figure 13 A flux coating device diagram of the present application is shown in the figure; Figure 14 A cooling device diagram of the present application is shown in the figure; Figure 15 A local enlarged diagram of II in the embodiment one of the present application is shown in the figure. Figure 14 A local enlarged diagram of II in the embodiment one of the present application is shown in the figure. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] Example 1 like Figures 6-11 As shown, this embodiment provides a continuous hot-dip plating mold for pin conductors, including a hot-dip plating mold 33 for controlling the plating thickness, the hot-dip plating mold 33 being disposed at the discharge end of a tin bath 31, and a desoldering mold 34, the desoldering mold 34 being adjustable to one side of the hot-dip plating mold 33; one end of the hot-dip plating mold 33 extends below the surface of the molten liquid in the tin bath 31 to prevent oxides on the surface of the molten liquid from adhering to the plating surface, thereby improving the surface quality of the plating layer; The hot-dip galvanizing mold 33 includes a drawing die 332 for controlling the coating thickness; different drawing dies 332 are adapted according to different shapes of the strip 100, for example, the strip 100 is selected with a rectangular cross section, the round wire is selected with a round cross section, and the rectangular wire is selected with a rectangular cross section, thereby improving the versatility of the equipment. The feeding end of the drawing die 332 has a flared structure, which facilitates the feeding of the strip 100. The desolder 34 includes: An air blowing mold 343 is disposed above the strip 100 and connected to one end of the adjusting plate 342. It is provided with an air inlet 3431 and an air outlet 3432. The air outlet 3432 is arranged perpendicular to the conveying direction of the strip 100. A receiving mold 344 is located below the strip 100 and connected to one end of an adjusting plate 342. It has a receiving port 3441 and an air intake port 3442. Specifically, the air intake port 3442 is connected to a negative pressure device to create a negative pressure state in the cavity of the receiving mold 344, so as to collect small tin particles or small tin droplets blown off by the blowing mold 343 and prevent the blown-off small particles or droplets from flying around and affecting the surface quality of the pin.

[0027] The pin conductor strip 100 passes through the draw die 332 to control the plating thickness, the blowing die 343 blows off the tin liquid hanging on the side of the pin, and the small tin particles or small tin droplets blown off by the blowing die 343 are collected by the negative pressure cavity of the receiving die 344.

[0028] Preferably, the air outlet 3432 is arranged in a straight line structure or a structure surrounded by adjacent pin side surfaces, and the air outlet 3432 is a small gap structure. When high-pressure gas passes through the air outlet 3432, a wind knife is formed to blow off the tin liquid hanging on the side of the pin. It should be noted that the straight line structure can realize continuous and uninterrupted production, and is more suitable for pin profiles with less complex shapes.

[0029] When the pin shape is complex, the air outlet structure surrounded by the profiles formed between the two groups of pins is used in combination with the setting of the sensor to realize point blowing. The two groups of pins are stopped below the air outlet, so that the junction of the two groups of pins is just below the air outlet. The high-pressure gas blown out by the air outlet blows away the tin liquid between the two groups of pins, while the thickness of the tin liquid on the side of the pin can be ensured.

[0030] As an improvement, the hot plating die 33 further comprises an angle-adjustable mounting plate 331, and the draw die 332 is mounted on the mounting plate 331.

[0031] Preferably, the tin removal die 34 further comprises: A moving seat 341, two groups of positioning grooves 3411 are formed on the side surface of the moving seat 341, and the moving seat 341 is slidably arranged on the tin pool 31. Specifically, a guide groove is formed on the moving seat 341, one end of the tin pool 31 is provided with a sliding channel matched with the moving seat 341, and guide rails matched with the guide groove are arranged on both sides of the sliding channel. An adjusting plate 342 is mounted on the moving seat 341 by the two groups of positioning grooves 3411, and the installation angle of the adjusting plate 342 is changed by the two groups of positioning grooves 3411.

[0032] Preferably, the receiving port 3441 is arranged in a horn structure, the bottom of the receiving port 3441 is provided with an air suction channel 3443 and a storage bin 3444, the air suction channel 3443 is arranged at the top of the storage bin 3444 and connected with the receiving port 3441, so that the solidified small tin particles fall into the storage bin 3444, preventing the small tin particles from being sucked into the air suction channel 3443.

[0033] The blowing mold 343 is also provided with a sensor 346 for detecting the position of the pin, and the sensor 346 is signal connected with a controller for controlling the whole line operation. When the sensor 346 detects that one side of the pin is aligned with one side of the air outlet 3432, a signal is sent out, the strip 100 stops transmission, the gap between the two groups of pins is located directly below the air outlet, the blowing mold 343 blows high-pressure gas along the air outlet 3432 to blow off the tin liquid on the side of the pin, and the strip 100 continues to move until the sensor 346 detects the position of the pin again, and the above process is repeated to realize intermittent blowing of tin liquid, thereby realizing the side thickness control of the pin, ensuring that there is no tin hanging phenomenon at the complex cross section, and ensuring that the plating thickness at the corresponding position meets the process requirements.

[0034] Embodiment two As Figures 6-11 shown, wherein the same or corresponding parts as in embodiment one adopt corresponding reference numerals in embodiment one, for the sake of simplicity, only the difference points with embodiment one are described below. The difference between this embodiment two and embodiment one is that: In this embodiment, the tin removal mold 34 further comprises a discharging assembly 345 for discharging the small tin particles or small tin liquid drops collected by the receiving mold 344 to a storage bin 3444.

[0035] Preferably, the storage bin 3444 is provided through the receiving mold 344, one end of which is rotatably provided with a bin door 3445 for closing the storage bin 3444; the bin door 3445 is an automatic closing bin door 3445, a reset spring is installed at the rotating shaft of the bin door 3445 to ensure that the bin door 3445 always abuts against the side wall of the storage bin 3444, and the air suction channel 3443 is always in a sealed state.

[0036] As an improvement, the discharging assembly 345 comprises a push plate 3451 slidingly arranged in the storage bin 3444, the push plate 3451 pushes the particles in the storage bin 3444 out through the bin door 3445; and a driving assembly 3452 driving the push plate 3451 to reciprocate; the driving assembly 3452 preferably adopts a pneumatic cylinder drive, the pneumatic cylinder is arranged on one side of the tin removal mold, the extension end of the pneumatic cylinder is connected with the push plate 3451 to drive the push plate 3451 to reciprocate.

[0037] Preferably, the top surface of the pusher plate 3451 is aligned with the bottom surface of the suction channel 3443. During the forward pushing process, the pusher plate 3451 does not affect the normal operation of the suction channel 3443, that is, it does not affect the continuous production of the strip 100. When the pusher plate 3451 is pushed to the front of the hopper door 3445, the pusher plate 3451 just blocks the side wall of the storage hopper 3444 and the suction channel 3443. At the same time, a certain storage space is left between the front end of the pusher plate 3451 and the hopper door 3445. When it continues to push forward, the pusher plate 3451 pushes open the hopper door 3445. At the same time, the granular material located in the storage space is pushed onto the baffle 35 and rolls down along the baffle 35 into the tin melting pool 31 for reuse.

[0038] As the pusher plate 3451 moves backward, during continuous production, the particles that fall on top of the pusher plate 3451 are scraped again into the storage bin 3444 through the inner wall of the receiving mold 344.

[0039] Example 3 like Figures 3-15 As shown, this embodiment provides an apparatus for continuous hot-dip tin-plating of irregular pin material to prevent solder whiskers. The apparatus includes, in sequence, an unwinding device 1, a flux coating device 2, a hot-dip plating device 3, a cooling device 4, and a winding device 5. The hot-dip plating device 3 includes: Tin melting pool 31, wherein the tin melting pool 31 is used to melt the raw material to be hot-dip plated; An adjusting device 32 is used to change the depth of the strip 100 immersed in the tin melting pool 31. The adjusting device 32 is adjustable on the tin melting pool 31. The adjusting device 32 is adjustable in the left and right positions of the tin melting pool 31. It also includes a continuous hot-dip galvanizing mold for insert conductors as described in Embodiment 1 or Embodiment 2; And a baffle 35, which is inclinedly disposed on one side of the desoldering mold 34, with its lower end located below the desoldering mold 34; a liquid return channel is formed between the baffle 35 and the hot-dip galvanizing mold 33.

[0040] As an improvement, the adjustment device 32 includes: a support plate 321 that is movable along the material flow direction and a pressure roller 322 that is adjustable up and down on the support plate 321.

[0041] Specifically, the support plate 321 is movable along the flow direction of the strip 100 via a sliding rod 323 and a sliding groove. At the same time, the sliding rod 323 changes the height position of the support plate 321 via upper and lower fasteners. The pressure roller 322 is connected via an adjusting rod 324, which is slidably mounted on the support plate 321. One side of the support plate 321 is provided with fasteners for securing the adjusting rod 324.

[0042] Specifically, the mounting plate 331 is rotatably mounted on the tin plating bath, and a positioning hole is provided above it for controlling the angle of the mounting plate 331. By changing the position of the positioning hole, the angle of the mounting plate 331 relative to the tin plating bath 31 is changed. One end of the mounting plate 331 is immersed in the molten alloy liquid in the tin plating bath 31, so that the mounting plate 331 has a certain temperature. At the same time, the drawing die 332 mounted on the mounting plate 331 is kept at a certain temperature, which improves the control accuracy of the plating thickness. In addition, it can also ensure that the lower end of the drawing die 332 is immersed in the alloy liquid, preventing impurities on the surface of the liquid from affecting the surface quality of the strip 100 after hot-dip plating.

[0043] Example 4 like Figure 13 As shown, components that are the same as or corresponding to those in Embodiment 3 are referred to using the same reference numerals as those in Embodiment 3. For simplicity, only the differences from Embodiment 3 will be described below. The difference between Embodiment 4 and Embodiment 3 is as follows: In this embodiment, the flux coating device 2 includes: a flux storage tank 21 and return tanks 22 disposed on both sides of the flux storage tank 21; the flux storage tank 21 stores flux, and the strip 100 passes through the flux storage tank 21 to complete the flux coating. Specifically, the flux storage tank 21 and the return tank 22 are provided with channels for the strip 100 to pass through; the bottom of the return tank 22 is provided with a first return hole 221, and the bottom of the flux storage tank 21 is provided with a flux return tank 22; the flux in the flux storage tank 21 enters the return tank 22 through the strip 100 channels on both sides, and flows back into the flux return tank 22 through the first return hole 221; the flux in the flux return tank 22 is pumped into the flux storage tank 21, realizing the recycling of flux and ensuring that the transmission path of the strip 100 is not changed, thus completing the flux coating. During the production process, by controlling the flow rate, the liquid level in the flux storage tank is kept higher than that of the strip 100 to ensure the coating effect of the strip 100.

[0044] Furthermore, a scraper 23 for evenly applying flux is provided on the discharge side of the strip 100. The scraper 23 is located on the upper and lower sides of the strip 100 to remove excess flux from the surface of the strip 100 after flux application, ensuring that the flux is evenly applied. The scraper 23 is preferably made of a flexible material, such as felt or sponge.

[0045] Example 5 like Figures 14-15 As shown, components that are the same as or corresponding to those in Embodiment 3 are referred to using the same reference numerals as those in Embodiment 3. For simplicity, only the differences from Embodiment 3 will be described below. The difference between Embodiment 5 and Embodiment 3 is as follows: In this embodiment, the cooling device 4 includes a cooling tank 41. Several sets of cooling tanks 41 are arranged inclined upward along the conveying direction of the strip 100. The side wall of the cooling tank 41 is provided with a through cooling channel for the strip 100 to pass through. The cooling tank 41 is provided with multiple cooling zones. The bottom of the cooling zone at the bottom is provided with a second return hole 42. The bottom of the cooling tank 41 is provided with a water storage tank. The cooling water returning from the second return hole 42 enters the water storage tank. The circulating water in the water storage tank is pumped into the top of the cooling tank 41. The cooling water at the top flows downward through the cooling channel step by step to cool the strip 100 passing through the cooling channel, and then flows back to the water storage tank through the second return hole 42.

[0046] Furthermore, the end of the cooling tank 41 is also provided with a drying assembly 43 for air drying the strip 100.

[0047] The drying component 43 is slidably disposed on the cooling tank 41. The drying component 43 includes an air blowing head 431, which is disposed on both sides of the strip 100 to simultaneously blow air and dry both sides of the strip 100.

[0048] Furthermore, the outer side of the cooling tank 41 is also provided with a guide wheel 44 to guide the cooled strip 100 to the winding assembly; in addition, the guide wheel 44 and the pressure roller 322 position the strip 100 at the center of the drawing die 332 to ensure the uniformity of the coating on the strip 100.

[0049] Work steps: like Figure 2 As shown, the working steps for continuous hot-dip tin-plating of irregular pin materials include the following: Step 1, Flux Application: The continuously formed pin conductor strip 100 is coated with flux by a flux application device; Step 2, hot-dip plating: The strip 100 coated with flux in Step 1 enters the molten tin alloy bath 31 through the guiding device. The strip 100 pressure roller 322 presses the strip 100 into the molten tin alloy bath 31 for hot-dip tin plating. Step 3, Coating control: The hot-dip coated strip 100 passes through the hot-dip galvanizing mold 33 used to control the coating thickness. Step 4: Removal of solder from the side of the pin: A desoldering mold 34 is provided on the outlet side of the hot-dip galvanizing mold 33 to blow the solder from the side of the pin away from the pin body. The desoldering mold 34 is provided on both sides of the strip 100. The desoldering mold 34 has an air outlet 3432 forming an air knife. Hot air blows away the solder that is still condensed on the side of the pin through the air outlet 3432. Step 5, Cooling and Rewinding: After Step 4 is completed, the strip 100 is cooled by the cooling device 4 and then rewound by the rewinding device 5; Step six, pin separation: the rolled strip 100 is separated one by one by punch forming.

[0050] It should be noted that before the flux application step, a degreasing treatment step of cleaning the strip 100 is also included to ensure the surface quality of the strip 100 and improve the hot-dip plating effect. This step is a conventional means and will not be described herein.

[0051] As an improvement, the tin alloy is any one of a tin-silver-copper alloy, a tin-silver alloy, a tin-copper alloy, and a tin-bismuth alloy capable of preventing tin whisker growth.

[0052] As an improvement, the tin removal die 34 includes a blowing die 343 arranged above the strip 100 and a receiving die 344 arranged below the strip 100. The blowing die 343 is arranged with the air outlet direction perpendicular to the transmission direction of the strip 100. The receiving die 344 is provided with a material receiving channel, and the material receiving channel is in a negative pressure state.

[0053] As an improvement, the profile of the air outlet 3432 is a straight structure or a profile structure surrounded by adjacent pin side surfaces.

[0054] As an improvement, the air outlet pressure of the blowing die 343 can blow off the uncondensed alloy liquid on the pin side surface. According to different widths of the strip 100, a suitable air pressure is selected.

[0055] As an improvement, the blowing die 343 is provided below with a baffle 35 for guiding the blown-off alloy liquid to the inside of the tin melting tank 31. The baffle 35 prevents high-pressure gas from blowing the tin alloy liquid inside the tin melting tank 31.

[0056] It should be noted that the baffle 35 is arranged obliquely, and the lower end is located below the hot-dip die 33, so that the blown-off tin alloy liquid / particles flow back into the tin melting tank 31 for repeated use.

[0057] As an improvement, the pin conductor strip 100 is punched and formed into a pin conductor semi-finished product shape by a die. At the same time, a plurality of semi-finished pin conductors are connected to form a pin conductor strip 100 with a larger length, which can be uniformly pulled out by the tinning die.

[0058] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A continuous hot-dip galvanizing mold for pin conductors, characterized in that, It includes a hot-dip galvanizing mold (33) for controlling the coating thickness and a detinning mold (34), wherein the detinning mold (34) is adjustable to one side of the hot-dip galvanizing mold (33); The hot-dip galvanizing mold (33) includes a drawing die (332) for controlling the coating thickness; The desoldering mold (34) includes: An air blowing mold (343) is provided above the strip (100), and it is provided with an air inlet (3431) and an air outlet (3432); the air outlet (3432) is arranged perpendicular to the conveying direction of the strip (100); A receiving mold (344) is located below the strip (100) and has a receiving port (3441) and an air intake port (3442). The conductor strip (100) of the pin passes through the drawing die (332) to control the plating thickness. The blowing die (343) blows off the molten tin hanging on the side of the pin. A negative pressure state is formed in the cavity of the receiving die (344) to collect the small tin particles or small molten tin droplets blown off by the blowing die (343).

2. The continuous hot-dip galvanizing mold for a pin conductor according to claim 1, characterized in that, The hot-dip galvanizing mold (33) also includes an angle-adjustable mounting plate (331), on which the pull mold (332) is mounted.

3. The continuous hot-dip galvanizing mold for a pin conductor according to claim 1, characterized in that, The desoldering mold (34) also includes: The movable seat (341) has two sets of positioning grooves (3411) on its side. And an adjustment plate (342), which is mounted on the movable seat (341) via two sets of positioning slots (3411).

4. A continuous hot-dip galvanizing mold for insert conductors according to any one of claims 1-3, characterized in that, The air outlet (3432) is perpendicular to the conveying direction of the strip (100), and the outline of the air outlet (3432) is a straight structure or an outline structure formed between the sides of adjacent pins.

5. A continuous hot-dip galvanizing mold for pin conductors according to any one of claims 1-3, characterized in that, The receiving port (3441) is designed with a funnel-shaped structure. The bottom of the receiving port (3441) is provided with an air intake channel (3443) and a storage bin (3444). The air intake channel (3443) is located at the top of the storage bin (3444) where it connects with the receiving port (3441).

6. The continuous hot-dip galvanizing mold for a pin conductor according to claim 5, characterized in that, The desoldering mold (34) also includes a discharge assembly (345) for discharging small tin particles or small tin droplets collected by the receiving mold (344) from the storage bin (3444).

7. A continuous hot-dip galvanizing mold for a pin conductor according to claim 5, characterized in that, The storage bin (3444) is configured to pass through the receiving mold (344), and one end is provided with a door (3445) for closing the storage bin (3444).

8. A continuous hot-dip galvanizing mold for a pin conductor according to claim 6, characterized in that, The discharge assembly (345) includes a pusher plate (3451) slidably disposed in the storage bin (3444), the pusher plate (3451) pushes the particles in the storage bin (3444) out through the bin door (3445); and a drive assembly (3452), the drive assembly (3452) driving the pusher plate (3451) to reciprocate.

9. A continuous hot-dip galvanizing mold for a pin conductor according to claim 8, characterized in that, The top surface of the push plate (3451) is aligned with the bottom surface of the air intake channel (3443).

10. A continuous hot-dip galvanizing mold for a pin conductor according to any one of claims 1-3, characterized in that, The blowing mold (343) is also equipped with a sensor (346) for detecting the position of the insert pin.

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