Nickel plating solution and preparation method and application thereof

Abstract

The invention discloses a nickel plating solution as well as a preparation method and application thereof. The nickel plating solution is prepared from the following raw materials: nickel aminosulfonate, nickel chloride, boric acid and an additive UPC Ni MP601, the additive UPC Ni MP601 is prepared from the following raw materials: a grain refiner, a complexing agent, a stress regulator and an antioxidant, the nickel plating solution disclosed by the invention can be used for preparing a plating layer which is high in binding force with a matrix, high in microhardness and outstanding in corrosion resistance, the plating layer is bright, flat and fine in appearance, and the surface of the plating layer is free of defects such as pinholes, hard spots, bubbles and mist.

Description

Technical Field

[0001] This invention relates to the field of electrochemical nickel plating technology, and in particular to a nickel plating solution, its preparation method, and its application. Background Technology

[0002] Electrochemical nickel plating, a commonly used surface treatment technology, is widely applied in mechanical parts, electronic components, tools, and decorative coatings. The electrochemical nickel plating process reduces nickel ions through electrolysis and deposits them on the substrate surface to form a nickel layer, thereby improving the workpiece's corrosion resistance, wear resistance, and decorative properties. However, existing electrochemical nickel plating technologies still have some shortcomings, particularly regarding the corrosion resistance and service life of the plating layer. While most electrochemical nickel plating processes produce coatings with certain corrosion resistance initially, these coatings are prone to oxidation, corrosion, or peeling over time. This is mainly due to insufficient density of the coating, which easily forms micro-cracks or pores on the surface, allowing corrosive media to penetrate the substrate and exacerbate corrosion. Furthermore, the adhesion and uniformity of the coating are often affected by factors such as electrolyte composition and current density, leading to poor corrosion resistance in certain extreme environments and impacting the workpiece's service life.

[0003] Therefore, there is an urgent need for a new electrochemical nickel plating process that can effectively improve the corrosion resistance of the coating, extend its service life, and meet increasingly stringent application requirements. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a nickel plating solution, its preparation method, and its application, solving the problem of insufficient corrosion resistance in electronic products.

[0005] The present invention also provides a method for preparing nickel plating solution.

[0006] This invention also provides applications of nickel plating solutions.

[0007] According to a first aspect of the present invention, a nickel plating solution is provided, the raw materials for which include: nickel aminosulfonate, nickel chloride, boric acid and additive UPC Ni MP601;

[0008] The raw materials for preparing the additive UPC Ni MP601 include: grain refiner, complexing agent, stress modifier and antioxidant;

[0009] The raw materials for preparing the grain refiner include: ammonium tungstate, sodium molybdate, and phosphoramide;

[0010] The raw materials for preparing the complexing agent include ethylenediaminetetraacetic acid and nickel hexafluorophosphate;

[0011] The raw materials for preparing the stress modifier include: 1-ethyl-3-methylimidazolium tetrafluoroborate;

[0012] The antioxidant includes cerium oxide.

[0013] According to a first aspect of the present invention, at least the following beneficial effects are achieved:

[0014] Nickel sulfamate is the primary source of nickel metal ions in the electroplating process. Nickel ions in the nickel sulfamate solution are deposited on the workpiece surface through an electrochemical reaction, forming a nickel layer. It features high current efficiency and low internal stress during electroplating, contributing to the formation of a uniform and smooth coating. Nickel ions in nickel sulfamate undergo a reduction reaction under electrochemical action and are deposited on the cathode surface. Due to the high current efficiency of nickel sulfamate, the coating can be uniform and fine, avoiding scorching caused by excessive current.

[0015] Nickel chloride enhances the conductivity of the plating solution, reduces the resistance of the solution during electrolysis, improves current efficiency, increases the conductivity of the plating solution, promotes the dissolution of the anode, and enables the coating to be deposited uniformly.

[0016] Boric acid, as a buffer in electroplating solutions, plays a role in adjusting the pH value and mitigating pH fluctuations during electroplating, reducing problems caused by excessive acid-base changes during electroplating, and reducing scorching in high-current areas.

[0017] UPC Ni MP601 is used to reduce the internal stress of electrochemical plating, providing a soft and uniform coating, improving the coating's high-temperature resistance, and is particularly suitable for electronic components in high-temperature environments. It also effectively enhances the coating's resistance to discoloration. Specifically: 1. Ammonium tungstate and sodium molybdate form a temporary adsorption layer with phosphoramide on the cathode surface, inhibiting nickel grain growth and making the coating denser and more uniform. Simultaneously, W and Mo are co-deposited on the cathode, forming a Ni-W-Mo nanoalloy, improving the coating's hardness and high-temperature stability. Furthermore, the P=O structure of phosphoramide further stabilizes the Ni deposition process, optimizes the grain structure, and reduces internal stress; 2. The complexing agent complexes Ni... 2+ Precisely control the nickel ion release rate to reduce local oversaturation and prevent rough and uneven coating thickness. Simultaneously, the complexing agent and grain refiner work synergistically to optimize the Ni-W-Mo structure, resulting in a more uniform and denser coating. 3. 1-Ethyl-3-methylimidazolium tetrafluoroborate (EMIM-BF4), as an ionic liquid, reduces cathodic polarization, adjusts the nickel deposition method, and creates a low-stress state during deposition, improving flexibility. 4. Antioxidants form a nano-protective film on the coating surface, reducing oxygen and sulfide corrosion and preventing discoloration. Therefore, UPC NiMP601 simultaneously increases solderability, resists high temperatures, and reduces stress in the electrochemically deposited layer. It enhances the oxidation and discoloration resistance of subsequent tin plating during heat treatment or reflow soldering, and can also be used to plate silver on thin nickel layers, resisting baking and whitening.

[0018] According to some embodiments of the present invention, the preparation raw materials include the following concentrations:

[0019] Nickel sulfamate 300-600 ml / L, nickel chloride 0-40 g / L, boric acid 20-50 g / L, UPC Ni MP601 5-50 ml / L.

[0020] According to some embodiments of the present invention, the raw materials for preparing the nickel plating solution also include UPC Ni MP6O2;

[0021] The raw materials for preparing the UPC Ni MP6O2 include:

[0022] Benzotriazole, sodium silicate, and graphitic carbon nitride.

[0023] UPC Ni MP6O2, acting as a fine-structure agent for nickel plating, further improves plating quality, enhances its anti-discoloration ability, and strengthens its oxidation and anti-discoloration resistance under reflow soldering or high-temperature environments. Specifically, graphitic carbon nitride exhibits high chemical stability and oxidation resistance. Under high-temperature conditions, g-C3N4 forms a stable nano-protective film on the plating surface, isolating oxygen, moisture, and other corrosive gases, effectively preventing direct contact between the nickel plating and oxygen, thus reducing the risk of plating oxidation. Benzotriazole (BTA) undergoes a coordination reaction with the nickel surface, forming a stable protective film on the nickel layer surface, preventing direct contact between oxygen and sulfides and the plating. This protective film effectively reduces the reaction between nickel and oxygen or sulfides, preventing discoloration. Silicates, through co-deposition with nickel and its alloys, improve the hardness and density of the plating. The density and hardness of the plating are crucial to its stability under high-temperature conditions; the addition of silicates effectively reduces thermal expansion mismatch in the plating, thereby reducing the risk of plating cracking during reflow soldering. In addition, silicates enhance the thermal shock resistance of the coating, making it more stable under high-temperature conditions.

[0024] According to some embodiments of the present invention, the nickel plating solution comprises the following preparation raw materials at the following concentrations:

[0025] 300~600ml / L, nickel chloride 0~40g / L, boric acid 20~50g / L, UPC Ni MP601 5~50ml / L and UPC Ni MP6020~20ml / L.

[0026] With the above composition, the low current area will be dark and there will be plating defects, which is caused by excessive UPC NiMP602 content.

[0027] According to some embodiments of the present invention, the raw materials for preparing the nickel plating solution further include: malic acid, citric acid, antimony salt, and iodate.

[0028] Citric acid and malic acid are used as complexing agents, whose functional groups can form stable complexes with nickel ions, thereby regulating the nickel ion concentration. At the same time, boric acid is used as a buffer to maintain the stability of the pH value in the plating solution, improve the uniformity and adhesion of nickel deposition, inhibit impurity deposition and bubble formation, and improve the coating quality.

[0029] Antimony salts can inhibit excessive crystal growth of nickel. Antimony ions in the coating can affect the crystal growth process, reduce the roughness of the coating, and enhance the hardness and wear resistance of the coating.

[0030] Iodates can form stable complexes with nickel ions, preventing nickel ion precipitation. In addition, the precipitates formed by iodates and impurity ions are usually insoluble, thereby reducing the influence of impurities and improving the purity and smoothness of the coating.

[0031] According to a second aspect of the present invention, a method for preparing a nickel plating solution is provided, comprising the following steps:

[0032] After mixing and dispersing the nickel aminosulfonate, nickel chloride, boric acid, UPC Ni MP601, and UPC NiMP601, the pH of the plating solution is adjusted to 3.0-4.5.

[0033] According to some embodiments of the present invention, the step of adjusting the pH of the plating solution to 3.0-4.5 includes: adding nickel carbonate to adjust the pH of the plating solution to rise when the pH of the plating solution is lower than 3; and adding aminosulfonic acid to adjust the pH of the plating solution to fall when the pH of the plating solution is higher than 4.5.

[0034] Nickel carbonate and sulfamic acid are used as pH adjusters: when the pH is below 3.0, it needs to be adjusted to around 3.75 with a 10% nickel carbonate solution; when the pH is above 4.5, it needs to be adjusted to 3.75 with a 10% sulfamic acid solution.

[0035] According to a third aspect of the present invention, a method for electrochemical nickel plating is provided, comprising electrochemical nickel plating with the nickel plating solution.

[0036] According to some embodiments of the present invention, the current density of the electrochemical nickel plating is 5-15 ASD.

[0037] According to some embodiments of the present invention, the electrochemical nickel plating temperature is 50-55°C.

[0038] According to a fourth aspect of the present invention, a nickel-plated part with a corrosion-resistant microcrystalline structure is provided, the nickel-plated part comprising a substrate and a nickel plating layer located on the surface of the substrate, the nickel plating layer being formed by the nickel plating solution.

[0039] According to a fifth aspect of the present invention, an application of a corrosion-resistant microcrystalline structure for nickel-plated parts in the electronics industry is proposed.

[0040] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. Detailed Implementation

[0041] The following will describe the concept and technical effects of the present invention clearly and completely with reference to embodiments, so as to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention.

[0042] Unless otherwise specified in the examples, the procedures should be performed under standard conditions or conditions recommended by the manufacturer. Reagents or instruments whose manufacturers are not specified are all commercially available products.

[0043] In the description of this invention, the use of terms such as first, second, third, etc., is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0044] In the description of this invention, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0045] Unless otherwise specified, "room temperature" in this invention means within (25±5)℃.

[0046] Example 1

[0047] This embodiment is a nickel plating solution. The components of the nickel plating solution are: nickel chloride 10g / L, boric acid 35g / L, nickel aminosulfonate 500ml / L, UPC Ni MP601 5ml / L, malic acid 5g / L, citric acid 5g / L, antimony chloride 0.5g / L and potassium iodate 2g / L, with the balance being water accounting for 40% of the total solution volume.

[0048] The composition of UPC Ni MP601 is as follows: ammonium tungstate 8 g / L, sodium molybdate 6 g / L, phosphoramide 3 g / L, nickel hexafluorophosphate 2 g / L, ethylenediaminetetraacetic acid 1 g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 3 g / L and cerium oxide 1.5 g / L.

[0049] Example 2

[0050] This embodiment describes a nickel plating solution. The components of the nickel plating solution are: nickel chloride 10g / L, boric acid 35g / L, nickel aminosulfonate 500ml / L, UPC Ni MP601 5ml / L, UPC Ni MP602 5ml / L, malic acid 5g / L, citric acid 5g / L, antimony chloride 0.5g / L, and potassium iodate 2g / L, with the balance being water, accounting for 40% of the total solution volume.

[0051] The composition of UPC Ni MP601 is as follows: ammonium tungstate 6 g / L, sodium molybdate 6 g / L, phosphoramide 3 g / L, nickel hexafluorophosphate 4 g / L, ethylenediaminetetraacetic acid 2 g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 5 g / L and cerium oxide 1.5 g / L.

[0052] Example 3

[0053] This embodiment describes a nickel plating solution. The components of the nickel plating solution are: nickel chloride 10 g / L, boric acid 45 g / L, nickel aminosulfonate 600 ml / L, UPC Ni MP601 5 ml / L, UPC Ni MP602 5 ml / L, malic acid 5 g / L, citric acid 5 g / L, antimony chloride 0.5 g / L, and potassium iodate 2 g / L, with the balance being water, accounting for 40% of the total solution volume.

[0054] The composition of UPC Ni MP601 is as follows: ammonium tungstate 5g / L, sodium molybdate 5g / L, phosphoramide 3g / L, nickel hexafluorophosphate 4g / L, ethylenediaminetetraacetic acid 2g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 5g / L and cerium oxide 1.5g / L.

[0055] Example 4

[0056] This embodiment is a nickel plating solution. The difference between this embodiment and Embodiment 1 is that it does not include citric acid and malic acid. The components of the nickel plating solution are: nickel chloride 10g / L, boric acid 35g / L, nickel aminosulfonate 500ml / L, UPC Ni MP601 5ml / L, antimony chloride 0.5g / L and potassium iodate 2g / L, with the balance being water accounting for 40% of the total solution volume.

[0057] The composition of UPC Ni MP601 is as follows: ammonium tungstate 6 g / L, sodium molybdate 4 g / L, phosphoramide 3 g / L, nickel hexafluorophosphate 4 g / L, ethylenediaminetetraacetic acid 2 g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 5 g / L and cerium oxide 1.5 g / L.

[0058] Example 5

[0059] This embodiment is a nickel plating solution. The difference between this embodiment and Embodiment 1 is that it does not include antimony salt. The components of the nickel plating solution are: nickel chloride 10g / L, boric acid 35g / L, nickel aminosulfonate 500ml / L, UPC Ni MP601 5ml / L, malic acid 5g / L, citric acid 5g / L and potassium iodate 2g / L, with the balance being water accounting for 40% of the total solution volume.

[0060] The composition of UPC Ni MP601 is as follows: ammonium tungstate 6 g / L, sodium molybdate 6 g / L, phosphoramide 3 g / L, nickel hexafluorophosphate 1 g / L, ethylenediaminetetraacetic acid 2 g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 5 g / L and cerium oxide 1.5 g / L.

[0061] Example 6

[0062] This embodiment is a nickel plating solution. The difference between this embodiment and Embodiment 1 is that potassium iodate is not included. The components of the nickel solution are: nickel chloride 10g / L, boric acid 35g / L, nickel aminosulfonate 500ml / L, UPC Ni MP601 5ml / L, malic acid 5g / L, citric acid 5g / L, and antimony chloride 0.5g / L, with the remainder being water, accounting for 40% of the total solution volume.

[0063] The composition of UPC Ni MP601 is as follows: ammonium tungstate 6 g / L, sodium molybdate 6 g / L, phosphoramide 3 g / L, nickel hexafluorophosphate 4 g / L, ethylenediaminetetraacetic acid 2 g / L, 1-ethyl-3-methylimidazolium tetrafluoroborate 3 g / L and cerium oxide 0.5 g / L.

[0064] Comparative Example 1

[0065] This comparative example is a nickel plating solution. The difference between this comparative example 1 and Example 1 is that sodium benzenesulfonate is used instead of ammonium tungstate, sodium molybdate and phosphoramide in UPC NiMP601, while the other conditions are the same.

[0066] Comparative Example 2

[0067] This comparative example is a nickel plating solution. The difference between this comparative example and Example 1 is that sodium sulfate is used instead of 1-ethyl-3-methylimidazolium tetrafluoroborate in UPC NiMP601, while the other conditions are the same.

[0068] Test Example 1

[0069] Electrochemical nickel plating was performed on the high-brightness nickel plating solutions provided in the above examples and comparative examples, and the performance parameters of the plating layer were then tested. The specific steps are as follows: According to the ratio, nickel chloride was slowly added to 50°C hot pure water and stirred until completely dissolved. Then, boric acid was slowly added while stirring and stirred until completely dissolved. Nickel sulfamate was added and stirred until completely dissolved. Then, nickel sulfamate, UPC Ni MP601, malic acid 5g / L, citric acid 5g / L, antimony salt 0.5g / L, and iodate were added in sequence to adjust the pH of the mixture to 3.5. Note: When the pH value is too low, it can be increased by nickel carbonate, and when the pH value is too high, it can be decreased by aminosulfamate.

[0070] The specific nickel plating process is as follows:

[0071] S1. Place the workpiece to be plated into a solution containing a degreasing agent, and use ultrasonic vibration to remove oil stains from the surface of the workpiece. The degreasing agent used is alkaline degreasing agent H-111, with a concentration of 100g / L (solvent is water). Electrolytic degreasing is performed at a temperature of 60℃ for 2-10 minutes.

[0072] S2. The degreased parts to be plated are then pickled and activated. The pickling agents include hydrochloric acid and nitric acid. The concentration of hydrochloric acid is 100 ml / L and the concentration of nitric acid is 10 ml / L. The pickling and activation temperature is 25℃ and the time is 3-5 min.

[0073] S3. After the pickled and activated parts are rinsed with pure water twice, the acid solution is prevented from being carried into the nickel plating solution.

[0074] S4. The part to be plated is suspended in an electroplating tank containing nickel plating solution (the nickel plating solution prepared in the examples and comparative examples). The temperature of the nickel plating solution in the plating tank is 55°C and the current density is 5-10 ASD. Nickel plating is carried out to deposit nickel ions onto the surface of the part to be plated to form a uniform coating.

[0075] S4. After the coating deposition is complete, remove the plated parts from the plating tank and clean them.

[0076] S5. After cleaning, place the plated parts in an oven to dry and remove surface moisture;

[0077] This test example performs relevant performance tests on the plated part obtained in step S6. The test method is as follows:

[0078] (1) Coating appearance inspection: If the coating is bright, flat and fine, and there are no defects such as pinholes, pits, bubbles, or fog on the surface, it is considered qualified; otherwise, it is considered unqualified.

[0079] (2) Salt spray test: The test is conducted in a salt spray test chamber. The salt solution is a 50g / L NaCl aqueous solution, the temperature is (35±2)℃, the pH is 6.5~7.2, and the test time is 48h. After the test, each high phosphorus nickel-plated part is taken out and placed at room temperature for 2h. The appearance of each high phosphorus nickel-plated part is inspected. If no rust, discoloration or plating peeling occurs, it is recorded as qualified; otherwise, it is recorded as unqualified.

[0080] (3) Coating adhesion test: According to the national standard GB / T 5270-2005 "Review of Test Methods for Adhesion Strength of Electrodeposited and Chemically Deposited Metallic Coatings on Metallic Substrates", a thermal shock test was conducted. The test temperature was 250℃, and the test time was 2 hours. After the test, each nickel-plated part was immediately transferred to room temperature water for rapid cooling. If the coating did not blister, peel off in flakes, or delaminate, it was considered qualified; otherwise, it was considered unqualified.

[0081] (4) Microhardness test: The coating was tested using an HVS-1000A digital display microhardness tester with a load of 100g and an application time of 20s.

[0082] The test results are shown in Table 1.

[0083] Table 1. Performance Testing

[0084]

[0085] As shown in Table 1, the electrochemical nickel plating solution of the embodiment exhibits good stability and can produce nickel-plated parts with high microhardness, good coating adhesion, and good corrosion resistance. Furthermore, the high-phosphorus nickel-plated parts produced have a bright, smooth, and fine coating appearance, free from defects such as pinholes, pitting, blistering, and haze. The grain refiner inhibits excessive nickel grain growth, resulting in a finer and denser coating, while the complexing agent precisely controls the release rate of nickel ions, preventing excessively high nickel ion concentration in the plating solution and avoiding localized oversaturation. The combined effect of both makes the coating more uniform and reduces uneven local deposition. Therefore, the synergistic effect of the grain refiner and complexing agent significantly improves the microhardness and adhesion of the coating, thereby extending its service life.

[0086] Test Example 2

[0087] The nickel-plated workpieces of the examples and comparative examples were baked at 260°C for 3 minutes to observe whether color change, discoloration or oxidation occurred.

[0088] The specific steps are as follows:

[0089] Select workpieces that have been plated with high-temperature nickel to ensure that the workpiece surface is smooth and free of obvious defects.

[0090] 1. Mark the starting position: Use a fine ink pen to mark an observation point on each workpiece and record the appearance data of the workpiece such as color and gloss before the test;

[0091] 2. High-temperature treatment: Preheat the standard heat treatment furnace to 260℃ and keep it stable. Place the workpiece in the furnace and bake it at 260℃ for 3 minutes.

[0092] 3. Remove the workpiece from the furnace and allow it to cool to room temperature.

[0093] Using a colorimeter: Select several points on the workpiece surface to measure the color difference, and record the color difference values ​​before and after the test. A common color difference standard is the CIE LAB color space.

[0094] • L* value (brightness): Indicates the lightness or darkness of a color.

[0095] • a* value (red-green axis): Represents the change in color from red to green.

[0096] • b* value (yellow-blue axis): Represents the color change from yellow to blue.

[0097] 2. Color difference calculation: Calculate ΔE (color difference value) using the following formula:

[0098]

[0099] • If ΔE < 1, it means there is no obvious color change.

[0100] • If ΔE>1, it indicates a significant color change, especially when ΔE>3, indicating a large color difference.

[0101] The workpieces with high-temperature nickel plating in the examples did not show obvious discoloration, while the workpieces in Comparative Example 1 showed obvious discoloration.

[0102] The embodiments of the present invention have been described in detail above with reference to the examples. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A nickel plating solution, characterized in that, The raw materials for preparation include: nickel aminosulfonate, nickel chloride, boric acid, and additive UPC NiMP601; The raw materials for preparing the additive UPC Ni MP601 include: grain refiner, complexing agent, stress modifier and antioxidant; The raw materials for preparing the grain refiner include: ammonium tungstate, sodium molybdate, and phosphoramide; The raw materials for preparing the complexing agent include ethylenediaminetetraacetic acid and nickel hexafluorophosphate; The raw materials for preparing the stress modifier include: 1-ethyl-3-methylimidazolium tetrafluoroborate; The antioxidant includes cerium oxide.

2. The nickel plating solution according to claim 1, characterized in that, The nickel plating solution comprises the following raw materials at the following concentrations: nickel aminosulfonate 300-600 ml / L, nickel chloride 0-40 g / L, boric acid 20-50 g / L, and UPC Ni MP601 5-50 ml / L.

3. The nickel plating solution according to claim 2, characterized in that, The UPC Ni MP601 comprises the following raw materials at the following concentrations: grain refiner 8-25 g / L, complexing agent 1.5-7 g / L, stress modifier 2-8 g / L, and antioxidant 0.2-2 g / L.

4. A method for preparing a nickel plating solution as described in any one of claims 1 to 3, characterized in that, Includes the following steps: After mixing and dispersing the nickel aminosulfonate, nickel chloride, boric acid and UPC Ni MP601, the pH of the plating solution is adjusted to 3.0-4.

5.

5. The preparation method according to claim 4, characterized in that, The step of adjusting the pH of the plating solution to 3.0-4.5 includes: adding nickel carbonate to adjust the pH of the plating solution to rise when the pH of the plating solution is lower than 3; and adding aminosulfonic acid to adjust the pH of the plating solution to fall when the pH of the plating solution is higher than 4.

5.

6. A method for electrochemical nickel plating, characterized in that, This includes electrochemical nickel plating using the nickel plating solution described in any one of claims 1 to 3.

7. The electrochemical nickel plating method according to claim 6, characterized in that, The current density for electrochemical nickel plating is 5–15 ASD.

8. The method for electrochemical nickel plating according to claim 6, characterized in that, The electrochemical nickel plating temperature is 50–55°C.

9. A nickel-plated part with a corrosion-resistant microcrystalline structure, characterized in that, The anti-corrosion microcrystalline structure of the nickel-plated part includes a substrate and a nickel plating layer located on the surface of the substrate, wherein the nickel plating layer is formed by the nickel plating solution according to any one of claims 1 to 3.

10. The application of a nickel-plated part with a corrosion-resistant microcrystalline structure as described in claim 9 in the electronics industry.

Images