Electrophoresis plating solution for hub type wafer scribing knife

Abstract

The invention discloses an electrophoresis plating solution for a hub type wafer scribing knife, and relates to the technical field of cutting tool manufacturing, and the electrophoresis plating solution comprises the following steps: preparing a plating solution raw material; mixing plating solution components; adding diamond powder into the basic solution; adjusting the pH value of the plating solution; standing and stirring the prepared electrophoresis plating solution; the prepared electrophoresis plating solution is used in an electrophoresis device for electrophoresis; drying and curing; and performance testing. The diamond powder and the basic solution are mixed through ultrasonic treatment, it is ensured that the diamond powder is evenly dispersed in the plating solution, the particle aggregation phenomenon is avoided, and therefore the hardness and abrasion resistance of a plating layer are improved, the pH value of the plating solution is accurately controlled, the pH range is adjusted through ammonium sulfate and boric acid, excessive pH fluctuation is avoided, the plating layer stability is ensured, and the service life of the plating layer is prolonged. Defects are reduced, the concentration of the diamond can be controlled by adjusting the rotating speed of the conducting rod and the stability of the plating solution, additional supplement is not needed, cost is saved, and even distribution of plating layer diamond particles is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of cutting tool manufacturing technology, specifically to an electrophoretic plating solution for a hub-type wafer dicing blade. Background Technology

[0002] With the ever-increasing demands on the performance of cutting tools in modern manufacturing, especially in the semiconductor industry, the quality and performance of wafer dicing blades are of paramount importance. Traditional wafer dicing blades typically use metal substrates and are processed and finished using physical methods, but there is still room for improvement in their hardness, wear resistance, and cutting effect. To address this issue, electrophoretic plating technology has been widely used in the surface treatment of metal materials in recent years. Through an electrophoretic process, diamond particles are deposited onto the metal surface to form a composite coating with high hardness and excellent wear resistance.

[0003] However, traditional electrophoretic plating solutions suffer from problems such as uneven diamond particle distribution, inconsistent coating thickness, and unstable conductivity. These issues directly affect the coating quality and the cutting performance of the cutting tools. Therefore, improving the stability of the electrophoretic plating solution, the uniformity of diamond distribution, and the controllability of electrophoretic forming have become urgent technical challenges to be solved. Summary of the Invention

[0004] To solve the above-mentioned technical problems, an electrophoretic plating solution for a hub-type wafer dicing blade is provided. This technical solution solves the above problems.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: An electrophoretic plating solution for a hub-type wafer dicing blade includes: 100-150 parts nickel aminosulfonate, 25-30 parts nickel chloride, 20-40 parts ammonium sulfate, 60-100 parts sodium sulfate, 50-60 parts boric acid, and 30-60 parts diamond.

[0006] Preferably, the electrophoretic plating solution is composed of the following parts: nickel sulfamate 120 parts, nickel chloride 28 parts, ammonium sulfate 35 parts, sodium sulfate 80 parts, boric acid 55 parts, and diamond 50 parts.

[0007] Preferably, the nickel aminosulfonate provides the main salt required for the plating solution, the nickel chloride provides chloride ions to effectively ensure the dissolution of the nickel anode, the ammonium sulfate provides ammonium ions to stabilize the pH of the plating solution, the sodium sulfate provides conductive ions to ensure the electrical conductivity of the plating solution, and the boric acid is used to ensure the pH stability of the plating solution.

[0008] Preferably, the plating solution does not require additional diamond replenishment during electrophoresis. The concentration of diamond is maintained by controlling the rotation speed of the conductive rod and the stability of the plating solution. The pH value of the plating solution is adjusted by controlling the amount of ammonium sulfate and boric acid added and maintained within the optimal range required during electrophoresis. The electrophoresis process includes chemical degreasing, cleaning, acid pickling activation, chemical zinc deposition, and electrophoretic forming steps to ensure the consistency of coating thickness and hardness.

[0009] Preferably, the concentration of diamond during electrophoresis does not require the addition of additional diamond. By adjusting the rotation speed of the conductive rod, the required diamond content in the plating solution can be maintained. During the electrophoretic forming process, the coating thickness remains uniform, ensuring the stability of the blade cutting process. The plating solution has high conductivity and dispersion ability, effectively improving the overall performance of the hard blade, especially in terms of cutting quality and blade strength. The diamond content in the plating solution is determined according to the electrophoresis requirements to ensure the hardness and wear resistance of the blade coating without affecting the stability of the electrophoresis process.

[0010] Preferably, the preparation steps include: S1. Prepare the plating solution materials, including: 120 parts nickel aminosulfonate, 28 parts nickel chloride, 35 parts ammonium sulfate, 80 parts sodium sulfate, 55 parts boric acid, and 50 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid. S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating.

[0011] Preferably, S3 specifically includes: According to the formula requirements, prepare 50 portions of diamond powder and add the diamond powder to the prepared base solution; The diamond powder and base solution are mixed evenly using an ultrasonic cleaner, and the container is placed in the ultrasonic equipment. By setting the ultrasonic power and processing time, the agglomeration of diamond powder is broken up through vibration and bubble effect, so that it is evenly dispersed. After ultrasonic treatment, the distribution of diamond powder in the solution was paused and observed. Agglomeration was still observed, so the ultrasonic treatment time was extended. After ultrasonic treatment, stir the solution to ensure that all diamond powder is evenly distributed. Let the solution stand and observe whether the diamond is evenly distributed and without agglomeration. If agglomeration occurs, perform ultrasonic treatment again.

[0012] Preferably, S4 specifically includes: Prepare a pH meter to measure the initial pH value of the test plating solution. The pH value of the nickel aminosulfonate electrophoresis solution should be between 4 and 5. Add ammonium sulfate solution, stir well, and continuously measure the pH; Slowly add the boric acid solution and stir until homogeneous. After each addition of ammonium sulfate and boric acid, remeasure the pH value of the plating solution. If it deviates from the target range, continue adding ammonium sulfate and boric acid until the pH value stabilizes within the set range. Once the pH value is adjusted to the target range, continue stirring the plating solution for a period of time to ensure that the components in the solution are evenly mixed and the pH value remains stable. After adjustment, record the final pH value of the plating solution.

[0013] Preferably, S5 specifically includes: Pour the well-mixed electrophoretic plating solution into a container and let it stand for 10 to 30 minutes. The ultrasonic treatment method is used for oscillation, and the ultrasonic treatment time is 5 to 15 minutes. During the oscillation process, samples are taken periodically to check the distribution of diamonds in the plating solution. If the particles agglomerate, the ultrasonic treatment is continued.

[0014] Preferably, S6 specifically includes: Fix the wafer dicing blade to the hanger of the electrophoresis apparatus, adjust the current density, and set the electrophoresis time according to the required coating thickness; The prepared electrophoretic plating solution containing diamond powder is injected into the electrophoretic tank, ensuring that the liquid volume in the electrophoretic tank is sufficient to cover the workpiece. The fixed workpiece is then immersed in the electrophoretic solution, ensuring that the workpiece is completely submerged in the plating solution. Turn on the power, apply current, and start the electrophoresis process. The current will promote the uniform deposition of the coating, and the diamond particles will be evenly dispersed and embedded in the coating to form a composite metal diamond coating. When the electrophoresis time reaches the predetermined value, the current is turned off and electrophoresis is stopped. The workpiece is then removed from the electrophoresis solution, and the plating solution adhering to the surface is cleaned.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention proposes an electrophoretic plating solution that can not only improve the cutting performance and blade strength of wafer dicing blades, but also effectively reduce production costs and improve production efficiency, thus having broad application prospects. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating the steps of the present invention. Detailed Implementation

[0017] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0018] Reference Figure 1 As shown, an electrophoretic plating solution for a hub-type wafer dicing blade includes: 100-150 parts of nickel sulfamate, 25-30 parts of nickel chloride, 20-40 parts of ammonium sulfate, 60-100 parts of sodium sulfate, 50-60 parts of boric acid, and 30-60 parts of diamond.

[0019] The electrophoretic plating solution consists of the following components in the specified proportions: nickel sulfamate 120 parts, nickel chloride 28 parts, ammonium sulfate 35 parts, sodium sulfate 80 parts, boric acid 55 parts, and diamond 50 parts.

[0020] Nickel aminosulfonate provides the main salt required for the plating solution, nickel chloride provides chloride ions to effectively ensure the dissolution of the nickel anode, ammonium sulfate provides ammonium ions to stabilize the pH of the plating solution, sodium sulfate provides conductive ions to ensure the electrical conductivity of the plating solution, and boric acid is used to ensure the pH stability of the plating solution.

[0021] No additional diamond needs to be added to the plating solution during the electrophoresis process. The concentration of diamond is maintained by controlling the rotation speed of the conductive rod and the stability of the plating solution. The pH value of the plating solution is adjusted by controlling the amount of ammonium sulfate and boric acid added and maintained within the optimal range required during the electrophoresis process. The electrophoresis process includes chemical degreasing, cleaning, acid pickling activation, chemical zinc deposition, and electrophoretic forming steps to ensure the consistency of coating thickness and hardness.

[0022] During electrophoresis, the concentration of diamond does not require additional diamond addition. By adjusting the rotation speed of the conductive rod, the required diamond content in the plating solution can be maintained. During the electrophoretic forming process, the coating thickness remains uniform, ensuring stable blade cutting. The plating solution has high conductivity and dispersion ability, effectively improving the overall performance of the hard blade, especially in terms of cutting quality and blade strength. The diamond content in the plating solution is determined according to the electrophoresis requirements, ensuring the hardness and wear resistance of the blade coating without affecting the stability of the electrophoresis process.

[0023] The preparation steps include: S1. Prepare the plating solution materials, including: 120 parts nickel aminosulfonate, 28 parts nickel chloride, 35 parts ammonium sulfate, 80 parts sodium sulfate, 55 parts boric acid, and 50 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid; S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating.

[0024] S3 specifically includes: According to the formula requirements, prepare 50 portions of diamond powder and add the diamond powder to the prepared base solution; The diamond powder and base solution are mixed evenly using an ultrasonic cleaner, and the container is placed in the ultrasonic equipment. By setting the ultrasonic power and processing time, the agglomeration of diamond powder is broken up through vibration and bubble effect, so that it is evenly dispersed. After ultrasonic treatment, the distribution of diamond powder in the solution was paused and observed. Agglomeration was still observed, so the ultrasonic treatment time was extended. After ultrasonic treatment, stir the solution to ensure that all diamond powder is evenly distributed. Let the solution stand and observe whether the diamond is evenly distributed and without agglomeration. If agglomeration occurs, perform ultrasonic treatment again.

[0025] S4 specifically includes: Prepare a pH meter to measure the initial pH value of the test plating solution. The pH value of the nickel aminosulfonate electrophoresis solution should be between 4 and 5. Add ammonium sulfate solution, stir well, and continuously measure the pH; Slowly add the boric acid solution and stir until homogeneous. After each addition of ammonium sulfate and boric acid, remeasure the pH value of the plating solution. If it deviates from the target range, continue adding ammonium sulfate and boric acid until the pH value stabilizes within the set range. Once the pH value is adjusted to the target range, continue stirring the plating solution for a period of time to ensure that the components in the solution are evenly mixed and the pH value remains stable. After adjustment, record the final pH value of the plating solution.

[0026] S5 specifically includes: Pour the well-mixed electrophoretic plating solution into a container and let it stand for 10 to 30 minutes. The ultrasonic treatment method is used for oscillation, and the ultrasonic treatment time is 5 to 15 minutes. During the oscillation process, samples are taken periodically to check the distribution of diamonds in the plating solution. If the particles agglomerate, the ultrasonic treatment is continued.

[0027] S6 specifically includes: Fix the wafer dicing blade to the hanger of the electrophoresis apparatus, adjust the current density, and set the electrophoresis time according to the required coating thickness; The prepared electrophoretic plating solution containing diamond powder is injected into the electrophoretic tank, ensuring that the liquid volume in the electrophoretic tank is sufficient to cover the workpiece. The fixed workpiece is then immersed in the electrophoretic solution, ensuring that the workpiece is completely submerged in the plating solution. Turn on the power, apply current, and start the electrophoresis process. The current will promote the uniform deposition of the coating, and the diamond particles will be evenly dispersed and embedded in the coating to form a composite metal diamond coating. When the electrophoresis time reaches the predetermined value, the current is turned off and electrophoresis is stopped. The workpiece is then removed from the electrophoresis solution, and the plating solution adhering to the surface is cleaned. Example

[0028] S1. Prepare the plating solution materials, including: 120 parts nickel aminosulfonate, 28 parts nickel chloride, 35 parts ammonium sulfate, 80 parts sodium sulfate, 55 parts boric acid, and 50 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid. S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a uniform coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating. Example

[0029] S1. Prepare the plating solution materials, including: 110 parts nickel aminosulfonate, 30 parts nickel chloride, 40 parts ammonium sulfate, 85 parts sodium sulfate, 50 parts boric acid, and 60 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid. S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a uniform and harder coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating. Example

[0030] S1. Prepare the plating solution materials, including: 125 parts nickel aminosulfonate, 25 parts nickel chloride, 30 parts ammonium sulfate, 75 parts sodium sulfate, 60 parts boric acid, and 45 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid; S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a uniform and relatively hard coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating.

[0031] Comparative Example 1: S1. Prepare the plating solution materials, including: 130 parts nickel aminosulfonate, 25 parts nickel chloride, 30 parts ammonium sulfate, 70 parts sodium sulfate, 50 parts boric acid, and 40 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid; S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating.

[0032] The table below compares the coating performance of different embodiments:

[0033] By using ultrasonic treatment to mix diamond powder with the base solution, the diamond powder is evenly dispersed in the plating solution, avoiding the agglomeration of diamond particles. This ensures the uniform distribution of diamond in the coating and improves the hardness and wear resistance of the coating. By precisely controlling the pH value of the plating solution and using ammonium sulfate and boric acid to adjust the pH range, excessive pH fluctuations during electrophoresis are avoided, which can lead to unstable coatings or coating defects, thereby improving the stability of the electrophoresis process. No additional diamond is needed during the electrophoresis process. The diamond concentration is maintained by adjusting the rotation speed of the conductive rod and the stability of the plating solution. This not only saves material costs but also ensures that the diamond particles in the coating are evenly distributed, avoiding excessive diamond particles from affecting the electrophoresis effect. During the electrophoresis process, by precisely controlling the current density and electrophoresis time, the thickness of the coating is ensured to be uniform, avoiding uneven coating and improving the service life and cutting accuracy of the tool. The electrophoretic plating solution used effectively improves the hardness and wear resistance of the coating, ensuring that the cutting tool can maintain its sharpness for a long time during the cutting process. Especially when cutting wafers, it can maintain the strength of the blade and the stability of the groove shape, thereby improving the cutting quality.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. An electroplating solution for a wheel-type wafer dicing blade, characterized by comprising: a copper sulfate; a sulfuric acid; a brightener; and a surfactant. The electrophoretic plating solution comprises: 100-150 parts nickel aminosulfonate, 25-30 parts nickel chloride, 20-40 parts ammonium sulfate, 60-100 parts sodium sulfate, 50-60 parts boric acid, and 30-60 parts diamond.

2. The electroplating solution for a wheel-type wafer dicing blade according to claim 1, wherein The electrophoretic plating solution is specifically composed of the following parts: nickel sulfamate: 120 parts, nickel chloride: 28 parts, ammonium sulfate: 35 parts, sodium sulfate: 80 parts, boric acid: 55 parts, and diamond: 50 parts.

3. The electroplating solution for a wheel-type wafer dicing blade according to claim 2, wherein The nickel aminosulfonate provides the main salt required for the plating solution, the nickel chloride provides chloride ions to effectively ensure the dissolution of the nickel anode, the ammonium sulfate provides ammonium ions to stabilize the pH of the plating solution, the sodium sulfate provides conductive ions to ensure the electrical conductivity of the plating solution, and the boric acid is used to ensure the pH stability of the plating solution.

4. The electroplating solution for a wheel-type wafer dicing blade according to claim 3, wherein The plating solution does not require additional diamond replenishment during electrophoresis. The concentration of diamond is maintained by controlling the rotation speed of the conductive rod and the stability of the plating solution. The pH value of the plating solution is adjusted by controlling the amount of ammonium sulfate and boric acid added and maintained within the optimal range required during electrophoresis. The electrophoresis process includes chemical degreasing, cleaning, acid pickling activation, chemical zinc deposition, and electrophoretic forming steps to ensure the consistency of coating thickness and hardness.

5. The electroplating solution for a wheel-type wafer dicing blade according to claim 4, wherein During electrophoresis, the concentration of diamond does not require additional diamond addition. By adjusting the rotation speed of the conductive rod, the required diamond content in the plating solution can be maintained. During the electrophoretic forming process, the coating thickness remains uniform, ensuring stable blade cutting. The plating solution has high conductivity and dispersion ability, effectively improving the overall performance of the hard blade, especially in terms of cutting quality and blade strength. The diamond content in the plating solution is determined according to the electrophoresis requirements, ensuring the hardness and wear resistance of the blade coating without affecting the stability of the electrophoresis process.

6. The electroplating solution for a wheel-type wafer dicing blade according to claim 5, wherein The preparation steps include: S1. Prepare the plating solution materials, including: 120 parts nickel aminosulfonate, 28 parts nickel chloride, 35 parts ammonium sulfate, 80 parts sodium sulfate, 55 parts boric acid, and 50 parts diamond. S2. Mix the plating solution components: Mix nickel sulfamate, nickel chloride, ammonium sulfate, sodium sulfate and boric acid plating solution base components in proportion and stir until completely dissolved to form a uniform base solution. S3. Add diamond powder to the base solution and treat it with ultrasound to make the diamond powder evenly distributed in the solution, forming a composite solution with uniform diamond distribution. S4. Adjust the pH value of the plating solution using ammonium sulfate and boric acid; S5. Let the electrophoretic plating solution stand and stir. Let the prepared electrophoretic plating solution stand and stir to ensure that the diamond particles in the plating solution do not agglomerate and remain in suspension. S6. Electrophoresis: The prepared electrophoretic plating solution is used in the electrophoresis apparatus for electrophoresis. Under the action of current, diamond particles and nickel ions are deposited together on the aluminum substrate surface of the wafer dicing blade to form a coating. The current density and electrophoresis time are adjusted to ensure that the coating thickness is uniform. S7. Drying and curing: After electrophoresis, remove the tool, clean and dry it to remove excess plating solution and diamond particles, and ensure the stability and hardness of the coating through a curing process. S8. Performance testing: Perform a cutting performance test on the final prepared coating to check the uniformity, hardness, and diamond distribution of the coating.

7. The electroplating solution for a wheel-type wafer dicing blade according to claim 6, wherein S3 specifically includes: According to the formula requirements, prepare 50 portions of diamond powder and add the diamond powder to the prepared base solution; The diamond powder and base solution are mixed evenly using an ultrasonic cleaner, and the container is placed in the ultrasonic equipment. By setting the ultrasonic power and processing time, the agglomeration of diamond powder is broken up through vibration and bubble effect, so that it is evenly dispersed. After ultrasonic treatment, the distribution of diamond powder in the solution was paused and observed. Agglomeration was still observed, so the ultrasonic treatment time was extended. After ultrasonic treatment, stir the solution to ensure that all diamond powder is evenly distributed. Let the solution stand and observe whether the diamond is evenly distributed and without agglomeration. If agglomeration occurs, perform ultrasonic treatment again.

8. The electrophoretic plating solution for a hub-type wafer dicing blade according to claim 7, characterized in that, S4 specifically includes: Prepare a pH meter to measure the initial pH value of the test plating solution. The pH value of the nickel aminosulfonate electrophoresis solution should be between 4 and 5. Add ammonium sulfate solution, stir well, and continuously measure the pH; Slowly add the boric acid solution and stir until homogeneous. After each addition of ammonium sulfate and boric acid, remeasure the pH value of the plating solution. If it deviates from the target range, continue adding ammonium sulfate and boric acid until the pH value stabilizes within the set range. Once the pH value is adjusted to the target range, continue stirring the plating solution for a period of time to ensure that the components in the solution are evenly mixed and the pH value remains stable. After adjustment, record the final pH value of the plating solution.

9. The electrophoretic plating solution for a hub-type wafer dicing blade according to claim 8, characterized in that, S5 specifically includes: Pour the well-mixed electrophoretic plating solution into a container and let it stand for 10 to 30 minutes. The ultrasonic treatment method is used for oscillation, and the ultrasonic treatment time is 5 to 15 minutes. During the oscillation process, samples are taken periodically to check the distribution of diamonds in the plating solution. If the particles agglomerate, the ultrasonic treatment is continued.

10. The electrophoretic plating solution for a hub-type wafer dicing blade according to claim 9, characterized in that, S6 specifically includes: Fix the wafer dicing blade to the hanger of the electrophoresis apparatus, adjust the current density, and set the electrophoresis time according to the required coating thickness; The prepared electrophoretic plating solution containing diamond powder is injected into the electrophoretic tank, ensuring that the liquid volume in the electrophoretic tank is sufficient to cover the workpiece. The fixed workpiece is then immersed in the electrophoretic solution, ensuring that the workpiece is completely submerged in the plating solution. Turn on the power, apply current, and start the electrophoresis process. The current will promote the uniform deposition of the coating, and the diamond particles will be evenly dispersed and embedded in the coating to form a composite metal diamond coating. When the electrophoresis time reaches the predetermined value, the current is turned off and electrophoresis is stopped. The workpiece is then removed from the electrophoresis solution, and the plating solution adhering to the surface is cleaned.

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