Interface device for modularized semiconductor test equipment

Abstract

The invention relates to the technical field of semiconductor testing, and discloses an interface device for modularized semiconductor testing equipment, which comprises a macromolecular fixing frame fixed on a board card module and a probe contact layer sleeved in the macromolecular fixing frame. The macromolecular fixing frame is provided with an insulating cylinder and an L-shaped buckle at the top; the probe contact layer is made of a ductile copper material, the top is a cone, and the bottom is a cylindrical positioning section. When the board card module is in butt joint with the bottom plate, the probe contact layer is extruded to generate radial expansion deformation so as to realize tight electric connection, and meanwhile, the L-shaped buckle is elastically clamped with the lock hole of the bottom plate so as to complete mechanical locking. The device effectively solves the problems that an existing interface is low in contact reliability, poor in vibration resistance, inconvenient to maintain and the like, has the advantages of being stable in connection, convenient to plug and unplug, long in service life and convenient to replace and maintain at a single point, and remarkably improves the modularization level and the maintenance efficiency of semiconductor testing equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, in particular to an interface device for a modular semiconductor testing device. BACKGROUND

[0002] With the development of semiconductor testing demand towards multi-variety and small batch, modular testing equipment has become the mainstream due to its flexibility and high utilization rate. The core of such equipment is that the electrical connection interface between the board module and the test board needs to have high reliability and can be frequently plugged in and out. In the prior art, such interfaces are mostly designed in an integrated or welded manner, which has obvious drawbacks: the integrated probe structure is prone to plastic deformation or wear under the radial stress of frequent docking, resulting in increased contact resistance, decreased signal integrity, and the need to replace the entire interface module when local damage occurs, which is costly to maintain; and the welded connection is prone to cracking in a vibrating environment and is inconvenient to maintain. Especially in a large current testing scenario, the stability and maintainability of the connection point directly determine the testing efficiency and equipment life. SUMMARY

[0003] To solve or at least partially solve the above technical problems, the embodiments of the present application provide an interface device for a modular semiconductor testing device.

[0004] The present application provides an interface device for a modular semiconductor testing device, comprising:

[0005] A high-molecular fixed frame fixed to the board module, the high-molecular fixed frame comprising:

[0006] A ring-shaped pressing plate at the bottom;

[0007] An insulating cylindrical barrel extending upward from the outer circle of the ring-shaped pressing plate, the inner and outer surfaces of the insulating cylindrical barrel being covered with an insulating layer;

[0008] An L-shaped buckle provided on the side wall of the top of the insulating cylindrical barrel;

[0009] A probe contact layer sleeved in the high-molecular fixed frame, the probe contact layer being made of ductile copper material and having a hollow inside, the probe contact layer comprising:

[0010] A circular cone at the top;

[0011] A cylindrical positioning segment connected to the bottom of the circular cone;

[0012] The inner circle of the ring-shaped pressing plate is used to abut against the bottom of the probe contact layer, and the inner diameter of the insulating cylindrical barrel is greater than the diameter of the cylindrical positioning segment of the probe contact layer;

[0013] The probe contact layer is configured to be radially expanded when the board module is docked with the board.

[0014] The length of the L-shaped buckle is configured to be shorter than the total height of the probe contact layer, and is configured to be elastically buckled with the corresponding lock hole on the backplane when the board module is docked with the backplane.

[0015] Optionally, the hollow structure of the probe contact layer is a through hole extending from the center of the cone at the top to the cylindrical positioning segment.

[0016] Optionally, the bottom of the cylindrical positioning segment is provided with a guide inclined surface concave inward in the axial direction, for generating radial expansion deformation under extrusion when inserted.

[0017] Optionally, the bottom of the cylindrical positioning segment is provided with a plurality of openings extending in the axial direction and arranged in the circumferential direction, dividing the sidewall of the bottom of the cylindrical positioning segment into a plurality of expansion zones, so that the expansion zones generate radial expansion deformation under extrusion when inserted.

[0018] Optionally, the sidewall thickness of the cylindrical positioning segment is non-uniform in the axial direction and has a minimum value.

[0019] Optionally, the sidewall thickness of the cylindrical positioning segment is non-uniform in the axial direction and has a plurality of minimum values.

[0020] Optionally, the bottom of the annular pressing plate of the high polymer fixing frame is provided with a quick-release locking mechanism for detachably fixing the high polymer fixing frame in the mounting hole of the board module.

[0021] Optionally, the top sidewall of the insulating cylindrical barrel is provided with a limiting boss, and the L-shaped buckle is located outside the limiting boss; the limiting boss is configured to limit the maximum deformation stroke of the L-shaped buckle when it is extruded and deformed.

[0022] Optionally, the outer wall of the cylindrical positioning segment of the probe contact layer is provided with a plurality of annular protruding ribs; the protruding ribs are configured to form multi-point contact with the inner wall of the insulating cylindrical barrel after radial expansion deformation.

[0023] Optionally, the array of the board module has a plurality of the high polymer fixing frames and the probe contact layers.

[0024] The interface device for modular semiconductor test equipment provided by the present application has the following beneficial effects:

[0025] The interface device provided by the application sets the probe contact layer in the high polymer fixing frame, and supports and limits it by the annular pressing plate at the bottom of the high polymer fixing frame. This structure makes the whole interface become a pre-assembled whole in the non-working state, greatly facilitates the production assembly and subsequent overall taking and operation, and avoids the risk of scattering and loss of small parts. When the board module is connected with the test board, the top cone of the probe contact layer first contacts and leads in, and the cylindrical positioning section connected with it then enters the working area. Since the probe contact layer is made of copper material with excellent ductility and has a hollow structure inside, when it is subjected to axial extrusion, it can smoothly undergo controllable radial elastic expansion deformation, rather than irreversible plastic deformation or bending. This expansion enables the outer wall of the probe contact layer to tightly fit and extrude the target contact member with great positive pressure, thereby forming a current transmission path with large contact area, extremely low contact resistance and very stable current, effectively avoiding problems such as increased voltage drop, signal attenuation or increased heating caused by poor contact, and ensuring the reliability and consistency of test current, especially large current transmission.

[0026] At the same time, the L-shaped buckle provided on the top side wall of the insulating cylindrical barrel is designed to be slightly shorter than the total height of the probe contact layer, which ensures that the mechanical locking action lags slightly behind the establishment of electrical connection. Its structure avoids the ablation and damage of the L-shaped buckle by electric arc that may be generated during plugging and unplugging, thereby ensuring the long service life and reliability of the structure. After the electrical connection is established, the L-shaped buckle is elastically clamped with the corresponding lock hole on the bottom plate. This double connection mode, i.e. the main electrical connection formed by the elastic expansion deformation of the probe and the auxiliary mechanical locking formed by the L-shaped buckle, constitutes a stable connection state. It can effectively resist the vibration and impact that is difficult to avoid during equipment operation, prevent the interface from loosening due to long-term vibration, and ensure the durability and stability of the connection during the entire test period, avoiding test failure or equipment damage caused by connection interruption.

[0027] In addition, the inner and outer surfaces of the insulating cylindrical tube are covered with an insulating layer, which provides double insulation protection, prevents short circuit between the probe contact layer and external metal components, avoids the possibility of creep caused by dust, moisture and other factors between different interfaces, greatly improves the safety and reliability of the equipment in complex electrical environment. If the probe contact layer is worn out due to long-term use, or the L-shaped buckle is accidentally damaged, the entire interface device can be easily removed from the board module, and the failed parts can be replaced without discarding the entire connection unit or replacing the expensive board module, which greatly reduces the long-term maintenance cost and spare parts inventory pressure of the equipment, and reduces the downtime maintenance time. In summary, the interface device successfully realizes high reliability electrical connection, high efficiency mechanical locking, strong anti-vibration ability, good electrical safety and convenient maintenance through mechanical structure and material cooperation, and achieves various technical effects such as high reliability electrical connection, high efficiency mechanical locking, strong anti-vibration ability, good electrical safety and convenient maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A schematic diagram of a probe contact layer structure is provided for the embodiments of the present application.

[0029] Figure 2 A schematic diagram of a high polymer fixed frame structure is provided for the embodiments of the present application.

[0030] Figure 3 A schematic diagram of a probe contact layer and high polymer fixed frame combined structure is provided for the embodiments of the present application.

[0031] Figure 4 A schematic diagram of a board module and bottom plate combined structure is provided for the embodiments of the present application.

[0032] Figure 5 A schematic diagram of a guide inclined surface structure is provided for the embodiments of the present application.

[0033] Figure 6 A schematic diagram of an opening structure is provided for the embodiments of the present application.

[0034] Figure 7 A schematic diagram of a limiting boss structure is provided for the embodiments of the present application.

[0035] Figure 8 A schematic diagram of a raised rib structure is provided for the embodiments of the present application.

[0036] Figure 9 A schematic diagram of a board module structure is provided for the embodiments of the present application.

[0037] REFERENCE NUMERALS

[0038] A1, board module; 100, polymer fixed frame; 101, annular pressing plate; 102, insulating cylinder; 103, L-shaped buckle; 104, limiting boss; 200, probe contact layer; 201, cone; 202, cylindrical positioning section; A2, bottom plate; 203, guide slope; 204, opening; 205, raised rib; 301, lock hole. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will make further detailed description to the specific embodiments of the present application in combination with the drawings. It can be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, in order to facilitate the description, only the parts related to the present application are shown in the drawings, but not all the contents. Before discussing the example embodiments in more detail, it should be mentioned that some example embodiments are described as processes or methods depicted as flowcharts. Although the flowchart describes each operation (or step) as a sequential process, many of the operations can be implemented in parallel, concurrently or simultaneously. In addition, the order of the operations can be rearranged. The process can be terminated when its operations are completed, but can also have additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, etc.

[0040] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are usually a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the objects before and after are in a "or" relationship.

[0041] The technical solutions in the embodiments of the present application will be described clearly in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present application.

[0042] Reference Figures 1-8 The present application is a kind of interface device for modular semiconductor test equipment provided by strength, comprising:

[0043] The polymer fixed frame 100 fixed to the board module A1, the polymer fixed frame 100 comprises:

[0044] a ring-shaped pressing plate 101 at the bottom;

[0045] an insulating cylindrical tube 102 extending upward from the outer edge of the ring-shaped pressing plate 101, the inner and outer surfaces of the insulating cylindrical tube 102 being covered with an insulating layer;

[0046] an L-shaped buckle 103 provided at the top side wall of the insulating cylindrical tube 102;

[0047] a probe contact layer 200 sleeved in the polymer fixing frame 100, the probe contact layer 200 being made of ductile copper material and internally provided with a hollow, and the probe contact layer 200 comprising:

[0048] a conical body 201 at the top;

[0049] a cylindrical positioning section 202 connected to the bottom of the conical body 201;

[0050] the inner edge of the ring-shaped pressing plate 101 being used to abut against the bottom of the probe contact layer 200, and the inner diameter of the insulating cylindrical tube 102 being greater than the diameter of the cylindrical positioning section 202 of the probe contact layer 200;

[0051] the probe contact layer 200 being configured to be radially expanded when the board card module A1 is docked with the bottom plate A2;

[0052] the length of the L-shaped buckle 103 being configured to be shorter than the total height of the probe contact layer 200, and being configured to be elastically buckled with the corresponding lock hole on the bottom plate A2 when the board card module A1 is docked with the bottom plate A2.

[0053] Specifically, the device provided by the present application mainly comprises two core components: a polymer fixing frame 100 and a probe contact layer 200. The polymer fixing frame 100 is fixedly installed on the board card module A1 through the ring-shaped pressing plate 101 at the bottom. A cylindrical structure, i.e., an insulating cylindrical tube 102, extends upward from the outer edge of the ring-shaped pressing plate 101. The inner wall surface and the outer wall surface of the insulating cylindrical tube 102 are both completely covered with an insulating layer formed by an insulating material, which can effectively prevent accidental leakage of electric current or short circuit. An L-shaped buckle 103 is provided at the top side wall of the insulating cylindrical tube 102, and the buckle has a certain elastic deformation capacity.

[0054] The probe contact layer 200 is integrally fitted into the internal cavity of the polymer fixing frame 100. The probe contact layer 200 is made of copper, a material with good ductility, and features a through-hole structure in its central area, a design that reduces weight and increases flexibility. The top of the probe contact layer 200 is shaped like a cone 201; this conical structure facilitates initial guidance and positioning during docking. Connected to the bottom of the cone 201 is a cylindrical positioning section 202, which forms the main body of the probe contact layer 200. The inner edge of the annular pressure plate 101 protrudes upwards, forming a support ring that abuts against the bottom edge of the probe contact layer 200, providing stable support while limiting its downward movement. The inner diameter of the insulating cylindrical tube 102 is slightly larger than the outer diameter of the cylindrical positioning section 202 of the probe contact layer 200, with an appropriate gap between them, providing necessary space for radial deformation of the probe contact layer 200.

[0055] When the operator moves the board module A1 toward the test base plate A2 and mates it, the conical portion 201 of the probe contact layer 200 first contacts the corresponding receiving hole on the test base plate A2. As the mate continues, the probe contact layer 200 is subjected to axial compressive force from the test base plate A2. Because the probe contact layer 200 is made of highly ductile copper and has an internal hollow structure, the cylindrical positioning section 202 undergoes radial outward elastic deformation under axial pressure. This expansion allows the outer surface of the probe contact layer 200 to form a large-area, high-pressure, tight contact with the inner surface of the receiving hole on the test base plate A2, thereby establishing a stable and reliable electrical connection channel.

[0056] Because the length of the L-shaped latch 103 is designed to be slightly shorter than the total height of the probe contact layer 200, the L-shaped latch 103 does not immediately contact the test base plate A2 during the initial docking phase. After the probe contact layer 200 completes radial expansion and achieves good electrical contact, the continued docking action causes the L-shaped latch 103 to begin contacting the pre-set locking hole 301 on the test base plate A2. Figure 4 The interaction is illustrated in diagram 301. The L-shaped latch 103 undergoes elastic deformation when it contacts the edge of the lock hole. When the board module A2 is fully in place, the L-shaped latch 103 springs back and locks into the lock hole 301. This design ensures that the electrical connection is established before the mechanical lock, avoiding damage to the L-shaped latch 103 caused by electric arcs that may be generated during insertion and removal.

[0057] The interface device presents a stable state after completion of the docking. The radial expansion deformation of the probe contact layer 200 generates a continuous outward elastic pressure, ensuring that the electrical contact point remains tightly connected and does not loosen even under slight vibration or impact. The cooperation of the L-shaped buckle 103 with the lock hole provides mechanical protection against accidental disconnection of the interface due to external forces. The insulating layer on the insulating cylindrical barrel 102 completely wraps the entire interface area, effectively preventing current leakage to paths that should not be passed through, improving the electrical safety and reliability of the entire system.

[0058] This structural design also brings convenience in maintenance. Since the high polymer fixed frame 100 and the probe contact layer 200 adopt a split design and are fixed as a whole on the board card module A1, when replacement or maintenance is needed, the entire interface device can be directly operated. The elastic deformation characteristics of the probe contact layer 200 enable it to withstand multiple insertion and removal cycles while still maintaining performance, greatly extending the service life of the interface. At the same time, this design also reduces the manufacturing precision requirements, as appropriate gaps allow for some degree of centering error without affecting the final connection quality.

[0059] The working principle of the entire interface device is based on simple mechanical motion and material properties, without complex transmission mechanisms or electronic components, making it structurally robust and durable with low failure rate. The copper material of the probe contact layer 200 provides excellent electrical conductivity and elastic recovery characteristics, while the high polymer fixed frame 100 provides the necessary structural support and electrical insulation. The combination of the two forms a complete functional unit that meets the electrical transmission requirements and realizes the function of mechanical connection.

[0060] In actual application, the interface device shows good adaptability and reliability. The radial expansion deformation of the probe contact layer 200 can adapt to slightly different hole diameters, always maintaining sufficient contact pressure. The elastic clamping action of the L-shaped buckle 103 provides clear position feedback, allowing the operator to intuitively confirm the connection status. The presence of the insulating layer allows multiple interfaces to be closely arranged without interfering with each other, improving the space utilization of the equipment.

[0061] This interface device only needs simple insertion and removal actions to complete connection and disconnection, greatly simplifying the work process of the operator.

[0062] The structural design of this interface device also has good anti-aging performance. The selection of copper material for the probe contact layer 200 and the selection of high polymer fixed frame 100 material both consider the reliability of long-term use. The insulating layer material has good heat resistance and corrosion resistance, and can adapt to various conditions that may be encountered in the semiconductor test environment. All moving parts and contact points are designed with appropriate margins and protection, ensuring that they remain stable in performance after long-term use.

[0063] The interface device is also very easy to maintain and replace. Due to the modular design, the entire interface unit can be easily detached from the board module A1. The separable design of the probe contact layer 200 and the polymer fixing frame 100 allows for replacement of specific damaged components, greatly reducing maintenance costs and spare parts inventory requirements.

[0064] In some embodiments, the hollow structure of the probe contact layer 200 is a through-hole extending from the center of the conical top 201 to the cylindrical positioning section 202.

[0065] Specifically, the hollow structure inside the probe contact layer 200 is in the form of a through-hole, which starts from the center area of the top conical body 201 and extends along the central axis direction to the bottom, completely penetrating the entire cylindrical positioning section 202. When subjected to axial extrusion during the mating process, the through-hole provides sufficient space for the radial elastic deformation of the probe contact layer 200, allowing each part of the cylindrical positioning section 202 to expand uniformly and consistently outward. This uniform expansion behavior ensures that the outer surface of the probe contact layer 200 forms a complete and continuous contact ring with the inner surface of the mating component, significantly increasing the effective contact area. Greater contact area means lower contact resistance, improved current transmission capacity, and improved contact point stability. The through-hole structure also enhances the overall elasticity of the probe contact layer 200, allowing it to maintain good shape recovery ability after multiple plug-in and plug-out cycles, avoiding the problem of contact pressure drop due to plastic deformation. This design not only ensures sufficient contact reliability of the interface in the working state, but also prolongs the service life of the probe contact layer 200.

[0066] In some embodiments, the bottom of the cylindrical positioning section 202 is provided with a guide slope 203 recessed inward in the axial direction, used to generate radial expansion deformation when extruded during insertion.

[0067] As Figure 5As shown, the bottom edge of the cylindrical locating segment 202 is machined with a guiding slope 203 which is concave inwardly to the axis direction, the slope is smoothly transitioned from the outer surface to the inner surface of the cylindrical locating segment 202, forming a tapered trumpet structure. The slope angle of the guiding slope 203 enables it to form a progressive contact process with the mating component. When the board module A1 moves towards the test backplane A2, the guiding slope 203 first contacts the edge of the mating hole, and through the slope conversion principle, gradually converts the axial movement into radial expansion force. This conversion process makes the expansion of the probe contact layer 200 gentle and controllable, avoiding sudden stress impact. The smooth transition characteristics of the guiding slope 203 ensure the uniform distribution of the expansion force, preventing excessive local stress from causing material damage. As the mating process continues, the guiding slope 203 continuously guides the expansion deformation to extend to the upper part of the cylindrical locating segment 202, and finally forms a complete and uniform radial expansion form. This design significantly reduces the force required for initial insertion, making the mating operation more labor-saving and smooth, while ensuring the sufficiency and consistency of the expansion deformation, providing a good foundation for establishing stable and reliable electrical connection. The structure of the guiding slope 203 also improves the centering fault tolerance of the interface, even if there is a certain positional deviation, it can be automatically corrected through the guiding effect of the slope, ensuring the smooth completion of the mating process.

[0068] In some embodiments, the bottom of the cylindrical locating segment 202 is provided with a plurality of openings 204 extending in the axial direction and arranged in the circumferential direction, which divides the bottom side wall of the cylindrical locating segment 202 into a plurality of expansion zones, so that the expansion zones are extruded to produce radial expansion deformation when inserted.

[0069] As Figure 6As shown, the bottom region of the cylindrical positioning segment 202 is provided with a plurality of openings 204, which extend along the axial direction of the cylindrical positioning segment 202 while being evenly distributed in the circumferential direction. The openings 204 divide the originally continuous sidewall of the bottom of the cylindrical positioning segment 202 into a plurality of independent expansion zones, each of which becomes an elastic arm that can independently undergo elastic deformation. This design significantly changes the mechanical properties of the bottom structure, making the originally integral deformation of the cylindrical bottom now possible through the independent deformation of each elastic arm. When the docking process begins, each elastic arm can independently expand outward in the radial direction when subjected to extrusion without needing to overcome the rigid resistance of the entire circumference. The wall thickness between each opening 204 is specially designed to ensure that the elastic arm has sufficient strength and good flexibility. Due to the presence of the openings 204, the stress concentration phenomenon is effectively alleviated, and the deformation force is more evenly distributed. The outward expansion of each elastic arm is independent but coordinated, collectively forming a complete expansion movement. This multi-elastic arm structure also improves the controllability of deformation, and even if there is a slight positional deviation, each elastic arm can adaptively adjust its deformation amount to ensure uniform and reliable contact with the docking component. The size and shape of the openings 204 are optimized to provide sufficient deformation space while maintaining the structural integrity of the elastic arm. The design of multiple expansion zones enables the probe contact layer 200 to maintain good elastic recovery performance after multiple plug-in and plug-out cycles, and the independent movement of each elastic arm reduces the fatigue accumulation of the overall structure. This opening 204 layout ensures the sufficiency of expansion deformation while maintaining the stability and durability of the structure, providing the interface device with superior mechanical properties and a longer service life.

[0070] In some embodiments, the sidewall thickness of the cylindrical positioning segment 202 is non-uniform along the axial direction and has a minimum value.

[0071] Specifically, the sidewall thickness of the cylindrical locating segment 202 exhibits a non-uniform (mostly uniform, partially differential) distribution characteristic along the axial direction, with a distinct minimum wall thickness region at a specific axial location. This wall thickness variation is formed by precision machining, such that the minimum wall thickness region becomes the weakest point of the entire cylindrical locating segment 202. When subjected to axial pressure during docking, stress will naturally concentrate at this thinnest wall thickness region, prompting deformation to occur first at this location. This design effectively controls the specific location of the expansion deformation, concentrating it at the pre-set minimum wall thickness region instead of randomly distributing it anywhere on the cylindrical locating segment 202. The length and range of the minimum wall thickness region are carefully designed to ensure sufficient deformation while not compromising the overall structural strength integrity. The gradual transition design of the wall thickness from the minimum region to both sides ensures smooth transition of stress distribution, avoiding the stress concentration problem that sudden cross-section changes can cause. This controllable deformation characteristic enables the probe contact layer 200 to complete radial expansion in a more predictable manner, consistently forming a consistent contact morphology at the same location each time the probe is inserted and removed. The location selection of the minimum wall thickness region also takes into account the force situation during work, ensuring that sufficient expansion is achieved while not compromising the elastic recovery ability of the probe contact layer 200 due to excessive deformation. This wall thickness variation design guides the deformation behavior by controlling the distribution of materials, enabling the interface device to achieve more reliable performance while maintaining structural simplicity.

[0072] In some embodiments, the sidewall thickness of the cylindrical locating segment 202 is non-uniform along the axial direction and has multiple minima.

[0073] Specifically, the side wall thickness of the cylindrical positioning section 202 presents regular changes along the axial direction, and minimum wall thickness regions are respectively arranged at multiple different axial positions. These minimum wall thickness regions are distributed along the axial direction of the cylindrical positioning section 202, and each region constitutes a potential deformation occurrence point. When the docking process starts, each minimum wall thickness region will respond to the external pressure in turn and produce a corresponding radial expansion deformation. This multi-region deformation design enables the probe contact layer 200 to form contact areas at multiple different height positions when it contacts the inner wall of the insulating cylindrical barrel 102. The size and shape of each minimum wall thickness region are calculated to ensure that each contact area can produce appropriate and uniform contact pressure. The establishment of multiple contact areas significantly improves the stability of the connection, like multiple support points supporting a structure, which has better anti-vibration and anti-torsion ability than a single contact point. The spacing distance between each contact area is optimized to ensure sufficient support span and avoid interference between each other. This multi-level contact structure also improves the fault tolerance of the interface, so that even if one contact area is slightly insufficient due to manufacturing tolerance or wear, other contact areas can still maintain reliable connection. The wall thickness transition between each minimum wall thickness region adopts a smooth gradient manner to ensure uniform stress distribution and avoid local stress concentration.

[0074] In some embodiments, the bottom of the annular pressing plate 101 of the high polymer fixing frame 100 is provided with a quick-release locking mechanism for detachably fixing the high polymer fixing frame 100 in the mounting hole of the board module A1.

[0075] Specifically, the bottom of the annular pressing plate 101 of the high polymer fixing frame 100 is provided with a quick-release locking mechanism, which can include a rotatable locking ring and multiple circumferentially distributed elastic claws. The locking ring is connected to the bottom of the annular pressing plate 101 through threads, and the elastic claws are matched with the clamping grooves on the inner wall of the mounting hole of the board module A1. When installation is needed, the high polymer fixing frame 100 is simply placed in the mounting hole of the board module A1, and the locking ring is rotated clockwise to drive the elastic claws to expand outward and be clamped into the clamping grooves on the inner wall of the mounting hole to achieve fastening. When disassembling, the locking ring is counterclockwise rotated, and the elastic claws are immediately retracted and separated from the clamping grooves, and the entire interface device can be easily removed. This quick-release design does not require the use of any additional tools and can be operated by hand. This design makes the replacement of the interface device simple and fast, facilitating the replacement of the high polymer fixing frame 100 and the probe contact layer 200 when they are damaged, greatly shortening the maintenance time and improving the use efficiency of the equipment.

[0076] In some embodiments, the top side wall of the insulating cylindrical barrel 102 is provided with a limiting boss 104, and the L-shaped buckle 103 is located outside the limiting boss 104; the limiting boss 104 is configured to limit the maximum deformation stroke of the L-shaped buckle 103 when the L-shaped buckle 103 is deformed under pressure.

[0077] As shown in Figure 7 The top side wall of the insulating cylindrical barrel 102 is provided with a limiting boss 104, which is located at the inner circumferential side of the L-shaped buckle 103 and maintains a small gap with the L-shaped buckle 103. The limiting boss 104 is made in one piece with the insulating cylindrical barrel 102, with a height slightly lower than the free end height of the L-shaped buckle 103 and a width covering most of the inner side of the L-shaped buckle 103. When the L-shaped buckle 103 is elastically deformed by external extrusion, the limiting boss 104 is located on the deformation path of the L-shaped buckle 103 and can timely prevent the L-shaped buckle 103 from excessive inward inclination. This design takes into account the characteristics of the L-shaped buckle 103 as a precise and small structure, which is thin and needs to maintain good elasticity, but is prone to permanent deformation or fracture due to exceeding the elastic limit during frequent use. The presence of the limiting boss 104 ensures that the L-shaped buckle 103 does not exceed the maximum deformation range allowed by the material, thereby effectively avoiding plastic deformation. The inner side surface of the limiting boss 104 is designed as a smooth arc surface, which presents a gradual resistance during contact with the L-shaped buckle 103 and does not produce sudden mechanical impact. This limiting method does not affect the normal working stroke of the L-shaped buckle 103 and only plays a role when it exceeds the safe range. The limiting boss 104 is only provided at the inner circumferential side of the L-shaped buckle 103, and the outer circumferential side is kept open, which not only realizes effective overload protection, but also does not affect the elastic recovery of the L-shaped buckle 103 after the external force is removed. This design significantly improves the service life and reliability of the L-shaped buckle 103, especially in the working conditions of frequent plugging or existence of centering deviation, which can effectively prevent damage caused by accidental excessive extrusion.

[0078] In some embodiments, the outer wall of the cylindrical positioning section 202 of the probe contact layer 200 is provided with multiple annular protruding ribs 205; the protruding ribs 205 are configured to form multiple-point contact with the inner wall of the insulating cylindrical barrel 102 after radial expansion deformation.

[0079] As shown in Figure 8As shown, the outer wall of the cylindrical positioning section 202 of the probe contact layer 200 is machined with multiple annular raised ribs 205. These ribs are spaced apart along the axial direction, and each rib presents a complete annular structure. The cross-sectional shape of the raised ribs 205 is arc-shaped, and its height is slightly larger than the base outer diameter of the cylindrical positioning section 202, forming a series of protruding contact ridges. When the probe contact layer 200 undergoes radial expansion deformation, these raised ribs 205 will first contact the inner wall of the insulating cylindrical tube 102. Each raised rib 205 independently generates contact pressure, forming multiple discrete annular contact bands on the inner wall of the insulating cylindrical tube 102. This multi-rib design significantly increases the effective contact area, and because the contact pressure is concentrated at the raised parts, it can better penetrate the surface oxide layer, achieving a more reliable electrical connection. The spacing between the various raised ribs 205 also provides chip removal space, which can accommodate small debris or oxidation products that may be generated during use, preventing these impurities from affecting the connection quality of the main contact area. The rounded contour of the raised rib 205 ensures a smooth contact process, preventing jamming or wear on the insulation layer during insertion and removal. This design allows the interface device to maintain stable contact performance even after long-term use; even if one rib wears, the others can still maintain an effective connection, greatly extending the service life of the interface.

[0080] In some implementations, the board module A1 array has multiple polymer fixing frames 100 and probe contact layers 200.

[0081] like Figure 9 As shown, multiple polymer fixing frames 100 and probe contact layers 200 assemblies are densely arranged in a regular matrix on board module A1. These assemblies form a neat array layout on the surface of board module A1 according to testing requirements. The number of rows and columns of the array can be flexibly configured according to the actual number of test channels, usually presenting as a matrix of several rows multiplied by several columns. Each polymer fixing frame 100 and probe contact layer 200 assembly maintains a consistent orientation and spacing in the array, ensuring correspondence with the corresponding interface position on the test base plate A2. This array layout allows a single board module A1 to provide a large number of test contacts simultaneously, significantly improving testing efficiency and channel density. Each interface device in the array works independently without interference; even if a single interface fails, it will not affect the normal function of other interfaces. This modular array design also facilitates flexible adjustment of the configuration of board module A1 according to different testing requirements; simply changing the number of boards with different numbers of interfaces can adapt to various testing scenarios. The array arrangement matches the contact point distribution on the test base plate A2, ensuring that each probe contact layer 200 accurately corresponds to a test point. This high-density array layout greatly improves the integration and space utilization of the test equipment, providing comprehensive hardware support for the parallel testing of multi-pin semiconductor devices.

[0082] The above merely provides the preferred embodiment of the present application and the applied technical principles. The present application is not limited to the particular embodiments described herein, and various obvious changes, modifications and substitutions made by those skilled in the art without departing from the scope of the present application should be included. Therefore, although the present application is described in detail through the above embodiments, the present application is not limited to the above embodiments, and more other equivalent embodiments can be included without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. An interface device for modular semiconductor testing equipment, characterized in that, include: A polymer fixing frame (100) fixed to the board module (A1), the polymer fixing frame (100) comprising: The bottom annular pressure plate (101); An insulating cylindrical tube (102) extends upward from the outer ring of the annular pressure plate (101), and the inner and outer surfaces of the insulating cylindrical tube (102) are covered with an insulating layer; An L-shaped buckle (103) is provided on the top side wall of the insulating cylindrical tube (102); A probe contact layer (200) is fitted inside the polymer fixing frame (100). The probe contact layer (200) is made of ductile copper and has a hollow interior. The probe contact layer (200) includes: The cone at the top (201); A cylindrical positioning section (202) is connected to the bottom of the cone (201); The inner ring of the annular pressure plate (101) is used to abut against the bottom of the probe contact layer (200), and the inner diameter of the insulating cylindrical tube (102) is larger than the diameter of the cylindrical positioning section (202) of the probe contact layer (200). The probe contact layer (200) is configured to undergo radial expansion deformation when the board module (A1) docks with the base plate (A2); The length of the L-shaped buckle (103) is configured to be shorter than the total height of the probe contact layer (200), and is configured to elastically engage with the corresponding locking hole on the base plate (A2) when the board module (A1) docks with the base plate (A2).

2. The apparatus according to claim 1, characterized in that, The probe contact layer (200) has a perforated structure consisting of a through hole extending from the center of the cone (201) at its top to the cylindrical positioning section (202).

3. The apparatus according to claim 1, characterized in that, The bottom of the cylindrical positioning section (202) is provided with a guide slope (203) that is concave in the axial direction, which is used to generate radial expansion deformation when squeezed during insertion.

4. The apparatus according to claim 1, characterized in that, The bottom of the cylindrical positioning section (202) is provided with a plurality of openings (204) extending in the axial direction and arranged in the circumferential direction, which divide the bottom sidewall of the cylindrical positioning section (202) into a plurality of expansion areas, so that the expansion areas are squeezed and undergo radial expansion deformation when inserted.

5. The apparatus according to claim 1, characterized in that, The sidewall thickness of the cylindrical positioning section (202) is not uniform along the axial direction and has a minimum value.

6. The apparatus according to claim 5, characterized in that, The sidewall thickness of the cylindrical positioning section (202) is not uniform along the axial direction and has multiple minimum values.

7. The apparatus according to claim 1, characterized in that, The bottom of the annular pressure plate (101) of the polymer fixing frame (100) is provided with a quick-release locking mechanism for detachably fixing the polymer fixing frame (100) into the mounting hole of the board module (A1).

8. The apparatus according to claim 1, characterized in that, The top sidewall of the insulating cylindrical tube (102) is provided with a limiting boss (104), and the L-shaped buckle (103) is located on the outer periphery of the limiting boss (104); the limiting boss (104) is configured to limit the maximum deformation stroke of the L-shaped buckle (103) when it is squeezed and deformed.

9. The apparatus according to claim 1, characterized in that, The outer wall of the cylindrical positioning section (202) of the probe contact layer (200) is provided with multiple annular raised ribs (205); the raised ribs (205) are configured to form multiple points of contact with the inner wall of the insulating cylindrical tube (102) after radial expansion deformation.

10. The apparatus according to claim 1, characterized in that, The board module (A1) array has multiple polymer fixing frames (100) and probe contact layers (200).

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