Gas pressure laminating device for semiconductor ceramics

Abstract

The invention discloses a gas pressure laminating device for semiconductor ceramics, which comprises a substrate, a sealing cover and a pressurizing assembly, and is characterized in that the substrate is provided with an upper surface for bearing a to-be-laminated piece, and the to-be-laminated piece comprises a plurality of green ceramic chips which are sequentially stacked from bottom to top; the sealing cover has a first state of covering the substrate and defining a closed cavity and a second state of being separated from the substrate, and a pressurizing air inlet is formed in the top end of the sealing cover; the pressurizing assembly is communicated with the pressurizing air inlet and used for conveying pressurizing air into the closed cavity and providing uniform downward pressure for the end face, away from the upper surface, of the to-be-laminated piece. According to the invention, the mode of applying the downward pressure through gas is used for replacing the traditional mode of applying the downward pressure through mechanical and physical contact, so that the dimensional deformation of the prepared laminated part is less than 20 microns.

Description

Technical Field

[0001] This invention relates to the field of electrostatic chuck manufacturing technology, and more specifically to a gas pressure lamination device for semiconductor ceramics. Background Technology

[0002] Electrostatic chucks are platforms used in precision wafer processing equipment, such as PVD coating equipment, etching equipment, ion implantation equipment, and EUV lithography machines. As one of the core components of these machines, the manufacturing quality of electrostatic chucks plays a crucial role.

[0003] The fabrication of electrostatic chucks involves a tape casting process. In this process, multiple green ceramic sheets, each containing a printed electrode, are stacked from bottom to top to form a laminate. These laminates are then pressed together to form a high-density preform, which is subsequently sintered to create a high-density preform. Currently, the commonly used methods include... Figure 1 The hydraulic press shown performs mechanical lamination. During lamination, the workpiece to be laminated is placed on a metal pallet 210. Then, the hydraulic rod 220 is activated to lower the metal pressure head 230 to meet the workpiece and laminate it to form a laminate. However, the flatness of the bottom surface of the metal pressure head 230 and the flatness of the top surface of the metal pallet 210 usually exceed 10 μm, making the laminate obtained by mechanical lamination using the above-mentioned hydraulic press prone to defects such as… Figure 2 The problem of dimensional deformation exceeding 20μm (i.e., the flatness of the laminate exceeds 20μm) leads to unsatisfactory quality of the electrostatic chuck. Therefore, there is an urgent need for a lamination device that can ensure the flatness of the laminate. Summary of the Invention

[0004] Therefore, the present invention provides a gas pressure lamination apparatus for semiconductor ceramics to solve the problem of the lack of a lamination apparatus in the prior art that can ensure the flatness of the laminate.

[0005] This invention provides a gas pressure lamination apparatus for semiconductor ceramics, comprising:

[0006] The substrate has an upper surface for supporting the laminate, which includes a plurality of green ceramic sheets stacked sequentially from bottom to top.

[0007] The sealing cover has a first state in which it covers the substrate and forms a sealed cavity, and a second state in which it is separated from the substrate. The top of the sealing cover is provided with a pressurized air inlet.

[0008] A pressurizing assembly, connected to the pressurizing inlet, is used to deliver pressurized gas into the sealed cavity and to provide uniform downward pressure to the end face of the part to be laminated that is away from the upper surface.

[0009] The gas pressure laminating device for the semiconductor ceramic according to the present application has at least the following technical effects:

[0010] By arranging the pressurized air inlet on the top end of the sealing cover, arranging the pressurized air inlet in the vertical direction, and connecting the pressurized air inlet with the pressurizing assembly, in the process of laminating to prepare the laminated part, the sealing cover is first switched to the second state, and after the plurality of green ceramic sheets are sequentially stacked on the upper surface to form the laminated part, the sealing cover is switched to the first state, at this time, the sealing cover and the substrate form a closed and sealed cavity, and then the pressurizing assembly is started to continuously fill the pressurized gas into the sealed cavity through the pressurized air inlet, so that the pressure of the sealed cavity is increased, and a uniform downward pressure is provided for the top end surface of the laminated part, so that the downward pressure is applied by replacing the traditional mechanical physical contact downward pressure, so that the size deformation of the prepared laminated part is less than 20μm.

[0011] In an optional embodiment, the pressurizing assembly comprises:

[0012] The gas source tank is used to store the pressurized gas.

[0013] The air pump is connected with the gas source tank through the first air pipe at the air inlet end, and connected with the pressurized air inlet through the second air pipe at the air outlet end.

[0014] In an optional embodiment, the limiting assembly is arranged on the substrate, and is used to limit the laminated part.

[0015] In an optional embodiment, the limiting assembly comprises:

[0016] The at least two limiting columns are used to be inserted into the electrode holes of the green ceramic sheet.

[0017] In an optional embodiment, the limiting column is detachably connected with the substrate through the first connecting assembly.

[0018] In an optional embodiment, the first connecting assembly comprises:

[0019] The outer threaded part is arranged on the outer wall of one end of the limiting column towards the substrate.

[0020] The first threaded hole is arranged on the upper surface, and the first threaded hole is matched with the outer threaded part.

[0021] The part of the limiting column extending out of the first threaded hole is arranged as an insertion section, and the insertion section is used to be inserted into the electrode hole of the green ceramic sheet.

[0022] In an alternative embodiment, the substrate comprises a bottom and a bearing part, the cross-sectional area of the bottom perpendicular to the vertical direction is greater than the cross-sectional area of the bearing part perpendicular to the vertical direction, the bearing part is detachably connected to the upper end of the bottom through a second connecting assembly, the upper surface is arranged on the bearing part, and when the sealing cover is in the first state, the sealing cover abuts against the upper end of the bottom.

[0023] And / or, the flatness of the upper surface is less than or equal to 10 μm.

[0024] In an alternative embodiment, the bottom end of the sealing cover is outwardly convex to form an abutting part for abutting against the upper end of the bottom; the bottom end face of the abutting part is arranged as a first tooth seal surface, and the upper end of the bottom is provided with a second tooth seal surface corresponding to the position of the first tooth seal surface, and the second tooth seal surface and the first tooth seal surface are matched.

[0025] And / or, further comprising a breathable film arranged on the end face of the to-be-laminated part facing the upper surface; the bearing part is provided with a heating assembly.

[0026] In an alternative embodiment, the bearing part comprises a heating plate, the heating assembly comprises a heating rod arranged in the heating plate and a temperature sensor, the temperature sensor is arranged at one end of the heating rod facing the upper surface; the temperature sensor and the heating rod are electrically connected with a controller.

[0027] In an alternative embodiment, further comprising a driving assembly for driving the sealing cover to move along the vertical direction and to rotate around the vertical direction. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0029] Figure 1 The structure schematic diagram of the existing mold hydraulic press for laminating the to-be-laminated part;

[0030] Figure 2 The microstructure schematic diagram of the laminated part laminated by the mold hydraulic press adopting Figure 1 ;

[0031] Figure 3 The structure schematic diagram of the partial cross-section of the present embodiment;

[0032] Figure 4 Fig. 1 is a schematic view of an electrostatic chuck according to an embodiment of the present application; Figure 3 Fig. 2 is an enlarged schematic view of A in Fig. 1;

[0033] Figure 5 Fig. 3 is a schematic view of a sealing cover and a driving assembly in the electrostatic chuck according to an embodiment of the present application; Figure 3 Fig. 4 is an enlarged schematic view of B in Fig. 3;

[0034] Figure 6 Fig. 5 is a schematic view of an assembly structure of the sealing cover and the driving assembly in the electrostatic chuck according to an embodiment of the present application;

[0035] Figure 7 Fig. 6 is a schematic view of an assembly structure of a heating assembly and a bearing plate in the electrostatic chuck according to an embodiment of the present application;

[0036] Figure 8 Fig. 7 is a schematic view of a thickness size deviation of an electrode in a laminate prepared by using a conventional mold hydraulic press; Figure 1 Fig. 8 is a schematic view of a thickness size deviation of an electrode in a laminate prepared by using the electrostatic chuck according to an embodiment of the present application;

[0037] Figure 9 Fig. 9 is a schematic view of a thickness size deviation of an electrode in a laminate prepared by using the electrostatic chuck according to an embodiment of the present application;

[0038] Figure 10 Fig. 10 is a schematic view of a microstructure of an electrostatic chuck prepared by sintering the laminate prepared by using the electrostatic chuck according to an embodiment of the present application.

[0039] Explanation of reference numerals:

[0040] 110-electrode, 120-green sheet, 121-electrode hole, 130-air permeable film;

[0041] 210-metal support plate, 220-hydraulic rod, 230-metal pressure head;

[0042] 300-substrate, 310-bottom, 320-bearing part, 321-upper surface, 330-sealing gasket, 341-second threaded hole, 342-second bolt, 343-second through hole;

[0043] 400-sealing cover, 410-hermetic cavity, 420-pressurized air inlet, 430-abutment part, 440-pressure detector;

[0044] 510-air source tank, 520-air pump, 530-first air pipe, 540-second air pipe;

[0045] 610-limiting column, 620-first insertion part, 630-first insertion hole;

[0046] 710-heating rod, 720-temperature sensor;

[0047] 810-elastic locking plug, 820-locking slot;

[0048] 910 - mounting seat, 920 - motor, 930 - connecting plate, 940 - telescopic element. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0050] In the description of the present embodiments, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present embodiments and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present embodiments. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0051] In the description of the present embodiments, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present embodiments can be understood according to the specific circumstances.

[0052] The embodiments of the present application will be described below with reference to Figures 3 to 10 .

[0053] The gas pressure laminating device for semiconductor ceramics provided by the embodiments of the present application comprises a substrate 300, a sealing cover 400 and a pressurizing assembly. The substrate 300 has an upper surface 321 for carrying a to-be-laminated piece, and the to-be-laminated piece comprises a plurality of green ceramic sheets 120 stacked one by one from bottom to top. The sealing cover 400 has a first state of covering the substrate 300 and enclosing a sealed cavity 410, and a second state of being separated from the substrate 300. A pressurized gas inlet 420 is arranged at the top end of the sealing cover 400. The pressurizing assembly is in communication with the pressurized gas inlet 420, and is used for delivering pressurized gas into the sealed cavity 410 and providing uniform downward pressure on the end surface of the to-be-laminated piece away from the upper surface 321.

[0054] The gas pressure laminating device of the embodiment is provided with the pressurized air inlet 420 at the top end of the sealing cover 400, the pressurized air inlet 420 is arranged in the vertical direction, and the pressurized air inlet 420 is communicated with the pressurizing assembly. During the process of laminating to prepare the laminated piece, first, the sealing cover 400 is switched to the second state, and after the plurality of green ceramic sheets 120 are sequentially stacked on the upper surface 321 to form the laminated piece to be laminated, the sealing cover 400 is switched to the first state, at this time, the sealing cover 400 and the base plate 300 form a closed sealed cavity 410, and then the pressurizing assembly is started to continuously fill the pressurized gas into the sealed cavity 410 through the pressurized air inlet 420, so that the pressure of the sealed cavity 410 increases, and the downward flowing pressurized gas provides uniform downward pressure to the top end surface of the laminated piece to be laminated, so as to realize the replacement of the traditional mechanical physical contact downward pressure application mode by the gas downward pressure application mode, thereby ensuring that the size deformation of the prepared laminated piece is less than 20 μm.

[0055] It should be noted that the electrostatic chuck works by the coulomb force mechanism, the thickness of the electrode 110 of the electrostatic chuck (i.e. the thickness of the electrode 110 of the laminated piece) is usually not more than 10 μm, and the surface roughness and thickness deviation of the electrostatic chuck are required to be extremely high, therefore, the thickness deviation of the electrode 110 and the thickness deviation of the green ceramic sheet 120 will have an important influence on the quality of the electrostatic chuck; the gas downward pressure application mode is adopted in the embodiment to provide uniform downward pressure to the top end surface of the laminated piece to be laminated for laminating, which can ensure that the thickness deviation of the prepared laminated piece is less than 20 μm, thereby ensuring the quality of the electrostatic chuck. Because the thickness of the electrode 110 of the laminated piece is usually not more than 20 μm, if the thickness deviation of the electrode 110 is greater than 10 μm, the electrode 110 is easily broken.

[0056] It can be understood that the embodiment is applied to the preparation of the electrostatic chuck.

[0057] Figure 8 The figure is a schematic diagram of the thickness size deviation change of the electrode 110 in the laminated piece prepared by the traditional mold hydraulic press laminating, the abscissa represents the thickness size of the laminated piece, and the ordinate represents the thickness size of the electrode 110, Figure 9 The figure is a schematic diagram of the thickness size deviation change of the electrode 110 in the laminated piece prepared by the laminating of the embodiment, the abscissa represents the thickness size of the laminated piece, and the ordinate represents the thickness size of the electrode 110, combined with Figure 8 and Figure 9It can be seen that, compared with the traditional mechanical physical contact pressure application mode, the gas pressure application mode of the embodiment is advantageous in reducing the thickness size deviation range of the electrode 110 in the prepared laminated piece, and the thickness size deviation of the electrode 110 is less than 20 μm, effectively avoiding the fracture of the electrode 110 with a thickness of 10 μm, and ensuring the quality of the finally prepared electrostatic chuck.

[0058] It should be noted that the pressurized gas mentioned herein refers to an inert or safe gas used to transfer the isostatic pressure, such as nitrogen.

[0059] It can be understood that, for the convenience of description, the vertical direction in Figure 6 is taken as the vertical direction herein for description.

[0060] It can be understood that, even if the flatness of the bottom end surface of the metal pressure head 230 of the mold hydraulic press shown in Figure 1 is processed to 10 μm by using a special grinding process, the flatness of the bottom end surface of the metal pressure head 230 will gradually increase after a period of use, which will also cause the flatness of the prepared laminated piece to exceed 20 μm, and the metal pressure head 230 needs to be frequently replaced to ensure the preparation quality, which is high in preparation cost.

[0061] As shown in Figure 1 , in some embodiments, the pressurizing assembly includes a gas source tank 510 for storing pressurized gas and an air pump 520, the air inlet end of the air pump 520 is connected to the gas source tank 510 through a first air pipe 530, and the air outlet end is connected to the pressurized air inlet 420 through a second air pipe 540. During the process of laminating the laminated piece, after the sealing cover 400 is switched to the first state, the air pump 520 is started to continuously fill the pressurized gas in the gas source tank 510 into the closed cavity 410, so that the downward flowing pressurized gas transmits the isostatic pressure to the top end surface of the laminated piece to be laminated, thereby providing uniform downward pressure to the top end surface of the laminated piece to be laminated, and ensuring that the size deformation of the prepared laminated piece is less than 10 μm.

[0062] In specific applications, the second air pipe 540 and the pressurized air inlet 420 can be detachably connected.

[0063] As shown in Figure 3 , specifically, the top end of the sealing cover 400 is provided with a pressure detector 440, the pressure detector 440 is electrically connected to the controller, the detection end of the pressure detector 440 extends to the inside of the sealing cover 400, and is used to detect the internal pressure of the closed cavity 410 and transmit it to the controller in real time, when the controller judges that the pressure in the closed cavity 410 reaches the set range, the power of the air pump 520 is controlled by transmitting a signal, and the laminating quality is ensured.

[0064] In some embodiments, the gas pressure laminating device further comprises a driving assembly for moving the sealing cover 400 in the vertical direction and rotating the sealing cover 400 around the vertical direction. By such arrangement, when it is required to stack the plurality of green ceramic sheets 120 one by one from bottom to top on the upper surface 321 to form a laminating piece or to take out the laminated piece from the upper surface 321, the sealing cover 400 can be lifted and then rotated around the vertical direction by a set angle to release the space above the substrate 300 so as to perform the stacking or taking out operation.

[0065] As shown in Figure 6 , in particular, the driving assembly comprises a mounting seat 910, the top end of the mounting seat 910 is provided with a connecting plate 930 driven to rotate by a motor 920, one end of the connecting plate 930 extends to the upper side of the substrate 300 and is provided with a telescopic piece 940, the telescopic end of the telescopic piece 940 is connected to the sealing cover 400, and the telescopic piece 940 drives the sealing cover 400 to move in the vertical direction.

[0066] In specific applications, the driving assembly can also be provided as a laminating robot, and the sealing cover 400 is arranged at the execution end of the laminating robot.

[0067] In some embodiments, the substrate 300 is provided with a limiting assembly for limiting the laminating piece. By fixing the relative position between the laminating piece and the upper surface 321 through the limiting assembly, the offset of each green ceramic sheet 120 relative to the upper surface 321 during the laminating process is effectively avoided, and the preparation quality of the laminated piece is ensured.

[0068] As shown in Figure 1 , Figure 3 , and Figure 4 , in particular, the limiting assembly comprises at least two limiting columns 610, preferably three limiting columns 610, and the three limiting columns 610 are respectively inserted into the corresponding electrode holes 121 of the green ceramic sheets 120. During the stacking of the plurality of green ceramic sheets 120 to form the laminating piece, the limiting columns 610 provide positioning so as to accurately and quickly stack the plurality of green ceramic sheets 120; meanwhile, during the laminating process, the three limiting columns 610 are respectively inserted into the electrode holes 121 located at three different circumferential positions, thus effectively avoiding the offset or rotation of each green ceramic sheet 120 relative to the upper surface 321 during the laminating process, and ensuring the preparation quality of the laminated piece.

[0069] In specific applications, the number of limiting columns 610 is reasonably increased or decreased according to the number of electrode holes 121 of the green ceramic sheet 120, for example, in other embodiments, the limiting assembly comprises two, four or five limiting columns 610, etc.

[0070] Specifically, the limiting column 610 is detachably connected to the base plate 300 through a first connecting assembly. By doing so, the limiting column 610 can be replaced to adapt to different electrode holes 121 of green ceramic sheets 120, and the application range is wide.

[0071] Specifically, the first connecting assembly includes an external thread part and a first threaded hole. The external thread part is arranged on the outer side wall of one end of the limiting column 610 towards the base plate 300. The first threaded hole is arranged on the upper surface 321 and matches the external thread part. The part of the limiting column 610 extending out of the first threaded hole is arranged as a plug-in section, which is used to plug into the electrode hole 121 of the green ceramic sheet 120. When the electrode hole 121 of the green ceramic sheet 120 of the actual lamination piece to be laminated changes, the original limiting column 610 can be removed and replaced with a limiting column 610 with a plug-in section of a corresponding size, and the application range is wider.

[0072] The specific structure of the first connecting assembly is not limited to the above structure. For example, Figure 4 In other embodiments, the first connecting assembly includes a first plug-in part 620 and a first plug-in hole 630. The first plug-in part 620 is arranged on one end of the limiting column 610 towards the base plate 300. The first plug-in hole 630 is arranged on the upper surface 321. The first plug-in part 620 is plug-in detachable in a transition fit or interference fit manner in the first plug-in hole 630. The diameter of the first plug-in part 620 is smaller than the hole diameter of the electrode hole 121. The detachable connection of the limiting column 610 and the base plate 300 can be realized, and after the lamination piece is prepared by lamination, the limiting column 610 can be pulled out, and then the lamination piece can be taken off from the upper surface 321.

[0073] As shown in Figure 3 In some embodiments, the base plate 300 includes a bottom part 310 and a bearing part 320. The cross-sectional area of the bottom part 310 perpendicular to the vertical direction is greater than the cross-sectional area of the bearing part 320 perpendicular to the vertical direction. The bearing part 320 is detachably connected to the upper end of the bottom part 310 through a second connecting assembly. The upper surface 321 is arranged on the bearing part 320. When the sealing cover 400 is in the first state, the sealing cover 400 abuts against the upper end of the bottom part 310. By detachably connecting the bearing part 320 to the bottom part 310, when the upper surface 321 is damaged and cannot meet the use requirements, the bearing part 320 can be removed for grinding and processing to improve the flatness quality of the upper surface 321, and then reinstalled for repeated use, thereby reducing the use cost.

[0074] Specifically, the planeness of the upper surface 321 is less than or equal to 10 μm, which is conducive to ensuring that the dimensional deformation of the prepared laminated piece is less than or equal to 20 μm, and is particularly suitable for preparing a laminated piece with a thickness deviation of 10 μm or less, thereby being suitable for high-quality preparation of an electrostatic chuck product containing an electrode 110 with a thickness of 5 μm.

[0075] As shown in Figure 3 and Figure 4 Specifically, the second connecting assembly includes second threaded holes 341 and second bolts 342 corresponding in number to the second threaded holes 341. Here, preferably, there are four second threaded holes 341, which are arranged at one end of the bottom portion 310 facing the bearing portion 320 and are arranged at intervals along the cross-sectional profile of the bottom portion 310 perpendicular to the vertical direction. The bearing portion 320 is provided with second through holes 343 corresponding to the positions of the second threaded holes 341, and the second bolts 342 are used to pass through the second through holes 343 and be threadedly connected to the corresponding second threaded holes 341. By such an arrangement, when the bottom portion 310 and the bearing portion 320 need to be assembled, only the second through holes 343 and the corresponding second threaded holes 341 need to be aligned in the vertical direction, and then a corresponding number of second bolts 342 are selected to pass through the second through holes 343 and be screwed into the corresponding second threaded holes 341. When the bearing portion 320 needs to be detached from the bottom portion 310, only the second bolts 342 need to be unscrewed from the corresponding second threaded holes 341, and the entire disassembly process is convenient to operate.

[0076] In specific applications, the number of second threaded holes 341 is reasonably increased or decreased according to the cross-sectional area of the bottom portion 310 perpendicular to the vertical direction and the connection and fitting strength. For example, in other embodiments, the end of the bottom portion 310 facing the bearing portion 320 is provided with two, three, or five or the like number of second threaded holes 341.

[0077] The above embodiments are only illustrative of the structure of the second connecting assembly, but do not limit the specific structure of the second connecting assembly. In other embodiments, the second connecting assembly can include a plurality of second buckles and a plurality of second clamping grooves. The second buckles are arranged on one of the bearing portion 320 and the bottom portion 310, and the second clamping grooves are arranged on the other of the bearing portion 320 and the bottom portion 310. The second buckles are connected to the corresponding second clamping grooves in a clamping manner to achieve detachable connection and assembly of the bearing portion 320 and the bottom portion 310 into one.

[0078] As shown in Figure 3As shown in Figure 6, in some embodiments, the bottom end of the sealing cap 400 protrudes radially outward to form an abutment portion 430, which abuts against the upper end of the bottom 310. The bottom end face of the abutment portion 430 is configured as a first toothed cover, and the upper end of the bottom 310 is provided with a second toothed cover corresponding to the position of the first toothed cover. The second toothed cover matches the first toothed cover. When the sealing cap 400 is switched to the first state, the first toothed cover and the second toothed cover interlock to form a tight sealing line, ensuring the sealing performance of the sealed cavity 410. This ensures that during the process of starting the pressurizing assembly to fill the sealed cavity 410 with pressurized gas, the pressurized gas provides a uniform downward pressure to the top surface of the component to be laminated.

[0079] like Figure 3 and Figure 5 As shown, specifically, a locking assembly is provided between the sealing cover 400 and the bottom 310 in the first state. The locking assembly includes a matching elastic locking plug 810 and a locking slot 820. The elastic locking plug 810 is disposed on one of the sealing cover 400 and the bottom 310, and the locking slot 820 is disposed on the other of the sealing cover 400 and the bottom 310. Preferably, the elastic locking plug 810 is disposed on the sealing cover 400, and the locking slot 820 is disposed on the bottom 310. When the sealing cover 400 is switched from the second state to the third state... In the first state, the elastic locking plug 810 is inserted into the locking slot 820 with an interference fit. At this time, the locking force between the elastic locking plug 810 and the locking slot 820 can ensure that the sealing cover 400 will not move relative to the base plate 300 during the process of filling the sealed cavity 410 with pressurized gas, thus ensuring the tightness between the sealing cover 400 and the bottom 310 in the first state. Furthermore, the locking force between the elastic locking plug 810 and the locking slot 820 is much smaller than the lifting force applied to the sealing cover 400 by the drive component.

[0080] like Figure 3 and Figure 5 As shown, specifically, a sealing gasket 330 is provided at the connection between the abutment portion 430 and the bottom 310, which further improves the sealing performance between the sealing cover 400 and the bottom 310 in the first state; more specifically, the upper end of the bottom 310 is surrounded by an installation groove, and the sealing gasket 330 is partially embedded in the installation groove, so as to prevent the sealing gasket 330 from shifting during the process of switching the sealing cover 400 between the first state and the second state, thus affecting the sealing effect.

[0081] like Figure 4As shown, in some embodiments, the gas pressure lamination apparatus further includes a breathable membrane 130, which is disposed on the end face of the part to be laminated facing the upper surface 321; a heating component is disposed within the support portion 320. The part to be laminated is heated by the heating component, so that the binder / plasticizer between two adjacent green ceramic sheets 120 is subjected to a certain pressure within the glass transition temperature (Tg) range (specifically, 55°C to 75°C) to laminate and form a high-density laminate; at the same time, by pre-disposing the breathable membrane 130 on the end face of the part to be laminated facing the upper surface 321, the breathable membrane 130 prevents the bottom green ceramic sheet 120 from adhering to the upper surface 321 during the heating process, so that the laminate can be separated from the upper surface 321 after the lamination preparation is completed.

[0082] In specific applications, the breathable membrane 130 is set as a PET breathable membrane.

[0083] like Figure 7 As shown, specifically, the support portion 320 includes a heating plate, and the heating assembly includes a heating rod 710 and a temperature sensor 720 disposed within the heating plate. The temperature sensor 720 is disposed at the end of the heating rod 710 facing the upper surface 321. Both the temperature sensor 720 and the heating rod 710 are electrically connected to the controller. When the sealing cover 400 is switched to the first state and the pressurization assembly is activated, the heating rod 710 is activated to heat the heating plate, causing the temperature of the heating plate to gradually increase. Simultaneously, the temperature sensor 720 detects the temperature of the end of the heating plate relatively close to the upper surface 321 in real time and feeds it back to the controller. When the temperature of the end of the heating plate relatively close to the upper surface 321 reaches the set glass transition temperature range, the heating power of the heating rod 710 is controlled to precisely maintain the temperature of the end of the heating plate relatively close to the upper surface 321 within the set glass transition temperature range, thereby achieving precise control of the set glass transition temperature and ensuring the lamination quality of the laminate.

[0084] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A gas pressure lamination device for semiconductor ceramics, characterized in that, include: The substrate (300) has an upper surface (321) for supporting the laminate, which includes a plurality of green ceramic sheets (120) stacked from bottom to top. The sealing cover (400) has a first state in which it covers the substrate (300) and forms a sealed cavity (410), and a second state in which it is separated from the substrate (300). The top of the sealing cover (400) is provided with a pressurized air inlet (420). A pressurizing assembly is connected to the pressurizing inlet (420). The pressurizing assembly is used to deliver pressurized gas into the sealed cavity (410) and to provide uniform downward pressure to the end face of the part to be laminated that is away from the upper surface (321).

2. The gas pressure lamination device for semiconductor ceramics according to claim 1, characterized in that, The pressurization component includes: Gas source tank (510), used to store pressurized gas; An air pump (520) has its air inlet end connected to the air source tank (510) via a first air pipe (530) and its air outlet end connected to the pressurized air inlet (420) via a second air pipe (540).

3. The gas pressure lamination device for semiconductor ceramics according to claim 1, characterized in that, A limiting component is provided on the substrate (300), which is used to limit the lamination to be laminated.

4. A gas pressure lamination device for semiconductor ceramics according to claim 3, characterized in that, The limiting component includes: At least two limiting posts (610) are used for insertion into the electrode holes (121) of the green ceramic plate (120).

5. A gas pressure lamination device for semiconductor ceramics according to claim 4, characterized in that, The limiting post (610) is detachably connected to the substrate (300) via the first connecting component.

6. A gas pressure lamination device for semiconductor ceramics according to claim 5, characterized in that, The first connection component includes: An external thread portion is provided on the outer side wall of one end of the limiting post (610) facing the substrate (300); A first threaded hole is provided on the upper surface (321), and the first threaded hole matches the external thread portion; The portion of the limiting post (610) extending outside the first threaded hole is configured as a plug-in section, which is used to plug into the electrode hole (121) of the green ceramic plate (120).

7. A gas pressure lamination device for semiconductor ceramics according to claim 1, characterized in that, The substrate (300) includes a bottom (310) and a support portion (320). The cross-sectional area of ​​the bottom (310) perpendicular to the vertical direction is larger than the cross-sectional area of ​​the support portion (320) perpendicular to the vertical direction. The support portion (320) is detachably connected to the upper end of the bottom (310) through a second connecting component. The upper surface (321) is disposed on the support portion (320). When the sealing cover (400) is in the first state, the sealing cover (400) abuts against the upper end of the bottom (310). And / or, the flatness of the upper surface (321) is less than or equal to 10 μm.

8. A gas pressure lamination device for semiconductor ceramics according to claim 7, characterized in that, The bottom end of the sealing cap (400) is radially protruding outward to form an abutment portion (430), which is used to abut the upper end of the bottom (310); the bottom end face of the abutment portion (430) is configured as a first toothed cover, and the upper end of the bottom (310) is provided with a second toothed cover corresponding to the position of the first toothed cover, and the second toothed cover matches the first toothed cover; And / or, it also includes a breathable membrane (130) disposed on the end face of the part to be laminated facing the upper surface (321); a heating component is disposed within the support portion (320).

9. A gas pressure lamination device for semiconductor ceramics according to claim 8, characterized in that, The support part (320) includes a heating plate, and the heating assembly includes a heating rod (710) and a temperature sensor (720) disposed in the heating plate. The temperature sensor (720) is disposed at one end of the heating rod (710) facing the upper surface (321). Both the temperature sensor (720) and the heating rod (710) are electrically connected to the controller.

10. A gas pressure lamination device for semiconductor ceramics according to claim 1, characterized in that, It also includes a drive assembly for moving the sealing cap (400) in a vertical direction and for rotating the sealing cap (400) about a vertical direction.

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