High-power SSPC printed circuit board

Abstract

The invention provides a high-power SSPC printed circuit board. The high-power SSPC printed circuit board comprises a substrate and a plurality of channels arranged on the end face of the substrate. A metal via hole and a bonding pad are arranged in each channel; a bus bar is installed in the channel and comprises a main body, a plurality of supporting bosses are arranged on the lower surface of the main body, and electrical connecting ends are arranged at the two ends of the lower surface of the main body respectively. The electrical connection end can be independently connected with the main body or connected with the lower surface through supporting bosses at the two ends of the lower surface; the electrical connection end is connected with the substrate through a metal via hole, and the supporting boss is connected with the substrate through a bonding pad. According to the invention, the bus bar is used as a power conduction path, so that the problem of high-power distribution output can be effectively solved under the condition of limited space; reliable connection between the bus bar and the substrate is realized through welding and dispensing, fasteners required by mechanical fixation are reduced, and the assembly difficulty is reduced; and the bus bars are uniformly mounted on the substrate and have the function of reinforcing ribs, so that the reliability is improved structurally.

Description

Technical Field

[0001] This invention relates to a high-power SSPC printed circuit board, belonging to the field of power distribution control technology for application equipment. Background Technology

[0002] Solid-state power controllers (SSPCs) are relatively intelligent switching devices. With the increasing automation and intelligence of power distribution equipment, and the rising voltage and current levels of electronic power systems, the number of electrical devices is increasing, and their power demands are becoming more complex. Therefore, SSPC power distribution methods are widely used due to their advantages such as high integration, light weight, small size, and high degree of automation.

[0003] However, on commonly used SSPC printed circuit boards, power supply is completed through printed circuit board traces. With limited space, the power distribution output capability is relatively small. Therefore, improving the load capacity of SSPC is of great significance for the power distribution application of solid-state power controllers (SSPC). Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a high-power SSPC printed circuit board. This high-power SSPC printed circuit board addresses the issue of relatively low power output of commonly used SSPC printed circuit boards by using busbars as power transmission paths. In situations with limited space, this increases the current-carrying capacity of the power distribution channel, thereby achieving high-power power output.

[0005] The present invention is achieved through the following technical solutions.

[0006] This invention provides a high-power SSPC printed circuit board, comprising a substrate and multiple channels disposed on the end face of the substrate; each channel is provided with metal vias and pads; a busbar is installed in each channel, the busbar comprising a main body, multiple support bosses provided on the lower surface of the main body, and electrical connection terminals provided at both ends of the lower surface; the electrical connection terminals can be individually connected to the main body, or connected to the lower surface through the support bosses at both ends of the lower surface; the electrical connection terminals are connected to the substrate through metal vias, and the support bosses are connected to the substrate through pads.

[0007] The metal via is a straight slot.

[0008] The pad is a rectangular pad.

[0009] The main body is elongated.

[0010] The busbars include short busbars and long busbars, with either a short busbar or a long busbar installed within the channel.

[0011] The electrical connection end is rectangular and can extend directly downward from the lower surface or be integrated with the support boss to form a T-shaped structure.

[0012] The supporting boss is rectangular.

[0013] The electrical connection terminals are fixed to the metal vias, and the support bosses are fixed to the pads by welding and adhesive application.

[0014] The beneficial effects of this invention are as follows: using busbars as the power transmission path can effectively solve the problem of high-power power distribution output in situations where space is limited; reliable connection between the busbars and the substrate is achieved through welding and adhesive application, reducing the fasteners required for mechanical fixation and lowering the assembly difficulty; the busbars are evenly installed on the substrate, which has the function of reinforcing ribs and increases reliability from a structural perspective. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a top view of the connection method between the busbar and the substrate of the present invention; Figure 3 This is a front view of the connection method between the busbar and the substrate of the present invention; Figure 4 This is a schematic diagram of the structure of the short busbar of the present invention; Figure 5 This is a schematic diagram of the structure of the long busbar of the present invention; Figure 6 This is a schematic diagram of the structure of the metal via of the present invention; In the figure: 1-substrate, 2-body, 21-upper surface, 22-lower surface, 23-side, 3-electrical connection terminal, 4-support boss, 5-metal via, 6-pad. Detailed Implementation

[0016] The technical solution of the present invention is further described below, but the scope of protection is not limited to what is described.

[0017] like Figure 1 As shown, multiple channels are provided on the substrate 1, and a busbar is installed in each channel.

[0018] Preferably, the substrate 1 is designed with symmetry in mind, and the busbars are evenly distributed on the substrate 1, so that the whole invention is heated evenly; structurally, the busbars have the function of reinforcing ribs, which increases the reliability of the structure.

[0019] Specifically, the substrate 1 also includes metal vias 5 and pads 6, wherein the metal vias 5 are straight slot holes (e.g., Figure 6 As shown), it is used to plug in electrical connection terminal 3, and the pad 6 is a rectangular pad used to weld the support boss 4.

[0020] Furthermore, such as Figure 4 and 5 As shown, the busbar includes: a main body 2, an electrical connection end 3, and a support boss 4, mainly used for power signal transmission. The main body 2 is elongated and divided into an upper surface 21, a lower surface 222, and a side surface 23, used for power conduction. Compared with copper foil traces, copper foil traces can currently only be designed to be 2 oz with the same trace width. However, when the busbar is used as a power conduction path, the output load capacity of the channel can be increased by increasing the thickness of the busbar. The electrical connection end 3 extends downward from the lower surface 22, away from the main body 2. The electrical connection end 3 is rectangular and extends downward from the lower surface 22. Generally, the electrical connection end 3 is set at the beginning and end of the busbar for electrical connection, and can also be reasonably set according to specific needs. The support boss 4 is rectangular and extends downward from the lower surface 22, playing a supporting role in the connection between the busbar and the substrate 1. The number of support bosses 4 is not specified and can be reasonably set according to the length of the busbar. The support boss 4 can also be integrated with the electrical connection end 3 in a T-shape.

[0021] Preferably, the material, length, and thickness of the busbar can be designed according to specific needs, and no specific requirements are imposed on them. In this invention, the busbar is made of copper, and most of its cross-section is rectangular, which not only facilitates heat dissipation but also provides higher temperature adaptability. The current guiding trajectory of the busbar is similar to the copper foil trace, and all corners are obtuse angles to ensure signal integrity and reduce signal reflection.

[0022] like Figure 2 and 3 As shown, the electrical connection end 3 and the support boss 4 correspond to the metal via 5 and the pad 6. The reliable connection between the busbar and the substrate 1 is achieved by welding and adhesive fixing, which reduces the fasteners required for mechanical fixing and reduces the difficulty of assembly and maintenance.

[0023] Furthermore, the support boss 4 can also ensure that there is a certain distance between the busbar and the substrate 1, preventing the busbar from wearing through the copper foil of the substrate 1 during vibration.

[0024] In summary, the beneficial effects of the present invention are as follows: 1. Using busbars as the power transmission path can effectively solve the problem of high-power power distribution output in situations with limited space; 2. Reliable connection between the busbar and the substrate is achieved through welding and adhesive application, reducing the fasteners required for mechanical fixation and simplifying assembly.

[0025] 3. Symmetry is considered during substrate design to ensure uniform heating of the entire invention; 4. The busbars are evenly installed on the base plate, which acts as a reinforcing rib and increases the reliability of the structure.

[0026] 5. It features high power output, easy assembly, and uniform heating.

Claims

1. A high-power SSPC printed circuit board, comprising a substrate (1) and a plurality of channels disposed on the end face of the substrate (1), characterized in that: Each channel is provided with a metal via (5) and a pad (6); a busbar is installed in the channel, the busbar includes a main body (2), and multiple support bosses (4) are provided on the lower surface (22) of the main body (2), and electrical connection terminals (3) are provided at both ends of the lower surface (22); the electrical connection terminals (3) can be connected to the main body (2) individually, or connected to the lower surface (22) through the support bosses (4) at both ends of the lower surface (22); the electrical connection terminals (3) are connected to the substrate (1) through the metal via (5), and the support bosses (4) are connected to the substrate (1) through the pads (6).

2. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The metal via (5) is a straight slot hole.

3. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The pad (6) is a rectangular pad.

4. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The main body (2) is long and narrow.

5. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The busbars include short busbars and long busbars, with either a short busbar or a long busbar installed within the channel.

6. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The electrical connection end (3) is rectangular and can extend directly downward from the lower surface (22) or be connected to the support boss (4) to form a T-shaped structure.

7. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The supporting boss (4) is rectangular.

8. The high-power SSPC printed circuit board as described in claim 1, characterized in that: The electrical connection end (3) is fixed to the metal via (5), and the support boss (4) is fixed to the pad (6) by welding and adhesive.

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