Electronic component heat dissipation system based on gallium-based liquid metal

Abstract

The invention discloses an electronic component cooling system based on gallium-based liquid metal. The electronic component cooling system comprises cooling fins, a liquid storage device, a cooling loop and an external cooling loop. The radiating fin is arranged at the hot end of the electronic element and is internally provided with a fluid channel; gallium-based liquid metal and first liquid are stored in the liquid storage device; the first liquid is water or an organic solvent; the fluid channel is communicated with the liquid storage device through a cooling loop; the external heat dissipation loop is communicated with the liquid storage device; the first liquid transfers heat to the outside through the external heat dissipation loop. According to the electronic component heat dissipation system provided by the invention, the gallium-based liquid metal with a high heat conductivity coefficient is used as a refrigerant, so that the rapid heat dissipation requirement of a high-power-density component is met, and the operation stability of the heat dissipation system is guaranteed. According to the invention, the first liquid can isolate the gallium-based liquid metal from being in contact with air, so that the gallium-based liquid metal is prevented from being oxidized; and a thin liquid film can be formed, so that the gallium-based liquid metal is prevented from adhering to the wall.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat dissipation, and particularly relates to an electronic component heat dissipation system based on gallium-based liquid metal. BACKGROUND

[0002] With the continuous development of electronic equipment, the integration of high-performance equipment has become a development trend. Under the impetus of the artificial intelligence wave, the power consumption of the next-generation AI chip even exceeds 1 kilowatt. Excessive temperature can cause the performance of the chip to decrease, the reliability to decrease, the aging of the electronic component to accelerate, and even safety accidents such as fire to occur; meanwhile, excessive power consumption increases the operating cost. The heat flux density in the limited space inside the equipment increases substantially, and the commonly used air cooling, water cooling and heat pipe heat dissipation technologies are difficult to meet the heat dissipation needs of the continuous high-power operation of the equipment, and the heat dissipation problem has increasingly become a great challenge to the performance and stability of the equipment.

[0003] Immersion cooling is a new high-efficiency heat dissipation technology, which puts the whole server into a non-conductive liquid (dielectric liquid) to dissipate heat from the CPU, memory and other electronic equipment in the server. However, the high cost and environmental protection problems of the dielectric liquid, the reliability of the electronic equipment soaked for a long time and the subsequent maintenance and other problems still need to be solved. Another high-efficiency cooling technology is to replace water with gallium-based liquid metal as the heat dissipation medium to realize high-efficiency heat dissipation of the liquid cooling system to high-power components. The gallium-based liquid metal is a eutectic alloy formed by taking gallium as the main body and adding indium, tin and other metals. The gallium-based liquid metal remains liquid in the range of normal temperature to 2000 DEG C, has high flowability and safety, and its thermal conductivity (25.24 Wm -1 K -1 ) is more than 40 times that of water (0.62 W m -1 K -1 ), so it has the advantage of rapid heat dissipation for high-power density equipment.

[0004] However, the gallium-based liquid metal heat dissipation technology still faces some challenges. First, the metal gallium is easy to corrode when it comes into contact with most metals (including copper, aluminum and other commonly used heat-conducting materials), which causes the corrosion of the cold plate and the pipeline system, the increase of the viscosity of the gallium-based liquid metal and the decrease of the flow performance. Second, the metal gallium is easy to react with oxygen to form a gallium oxide film, which covers the gallium-based liquid metal, affects the flowability of the liquid and is easy to cause the sticking wall phenomenon in the pipeline, so as to narrow the pipeline and reduce the heat dissipation efficiency. Due to the failure to recognize the above problems, people have tried to make electronic component rapid cooling systems by mechanically packaging gallium-based liquid metal, but all of them are difficult to work stably for a long time. Therefore, how to avoid the corrosion of the gallium-based liquid metal to the heat-conducting shell made of copper, aluminum and other materials, prevent the sticking wall and oxidation phenomena and improve the flow heat transfer efficiency is a key problem to be solved for the liquid metal heat dissipation system. SUMMARY

[0005] In order to solve the problems of easy oxidation and wall sticking of gallium-based liquid metal as heat dissipation medium, the application provides an electronic component heat dissipation system based on gallium-based liquid metal. The gallium-based liquid metal is used as heat transfer medium (or refrigerant), and a ceramic coating can be arranged on the inner wall of the heat dissipation fin to prevent reaction with the gallium-based liquid metal; the first solvent separates the gallium-based liquid metal from the air, preventing the reaction of oxygen and the gallium-based liquid metal to form an oxide; before starting and shutting down, the first solvent forms a thin liquid film in the heat dissipation fin and the cooling circuit, effectively reducing the wall sticking phenomenon of the gallium-based liquid metal, and effectively recycling the residual gallium-based liquid metal to the liquid storage device, thereby improving the operation stability of the heat dissipation system. During the heat dissipation process, the first liquid circulates between the external heat dissipation circuit and the liquid storage device, and the heat carried out by the gallium-based liquid metal is dissipated to the environment.

[0006] To achieve the above object, the technical scheme adopted by the application is:

[0007] The application provides an electronic component heat dissipation system based on gallium-based liquid metal, which comprises a heat dissipation fin, a liquid storage device, a cooling circuit and an external heat dissipation circuit; the heat dissipation fin is arranged at the hot end of the electronic component, and a fluid passage is arranged in the heat dissipation fin; the liquid storage device stores gallium-based liquid metal and a first liquid; the first liquid is water or an organic solvent; the fluid passage is communicated with the liquid storage device through the cooling circuit; the external heat dissipation circuit is communicated with the liquid storage device; and the first liquid transfers heat to the outside through the external heat dissipation circuit.

[0008] In the technical scheme of the present application, the water or organic solvent has a lower density than the gallium-based liquid metal, and thus floats above the liquid surface of the gallium-based liquid metal, effectively isolating the gallium-based liquid metal from the air and avoiding oxidation reaction. In the electronic component heat dissipation system provided by the present application, the cooling loop can realize circulation of the gallium-based liquid metal and the first liquid between the liquid storage device and the fluid passage. The specific operation process is as follows: first, the first liquid in the liquid storage device is transported to the heat dissipation fins through the cooling loop and then returned to the liquid storage device, at this time, a thin liquid film formed by the first liquid is attached to the inner wall of the cooling loop and the fluid passage; then, the gallium-based liquid metal in the liquid storage device is transported to the heat dissipation fins, absorbs the heat energy of the electronic component, and then is returned to the liquid storage device; the gallium-based liquid metal that has absorbed the heat energy exchanges heat with the first liquid in the liquid storage device, and the first liquid in the liquid storage device is transported to the external environment through the external heat dissipation loop, completing the whole process of heat dissipation of the electronic component from the gallium-based liquid metal, the first liquid, and the external environment. After the electronic component stops working, the heat dissipation system transports the first liquid to the heat dissipation fins again, returns the residual gallium-based liquid metal in the heat dissipation fins and the cooling loop to the liquid storage device, and recovers the gallium-based liquid metal that has sunk below the liquid surface of the first liquid, completing the recovery of the gallium-based liquid metal. In some specific embodiments, the organic solvent can be any one of ethanol, methanol, ethylene glycol, and propylene glycol or a mixture of several thereof.

[0009] The electronic component in the present application can be a chip, a high-power LED, an IGBT power supply, etc.

[0010] As a preferred embodiment, the heat dissipation fins include an upper cover plate, a lower cover plate, and a fluid passage layer arranged between the upper cover plate and the lower cover plate; the lower cover plate is attached to the hot end of the electronic component; the upper cover plate is provided with a liquid outlet hole and a liquid inlet hole, which respectively communicate with the openings at both ends of the fluid passage. In the technical scheme of the present application, the gallium-based liquid metal and the first liquid are transported through the fluid passage layer, and the fluid passage layer effectively contacts the upper cover plate and the lower cover plate, and can efficiently transfer the heat of the electronic component introduced by the lower cover plate.

[0011] Preferably, the fluid passage layer is made of an elastomer, and the fluid passage is S-shaped. In the technical scheme of the present application, the liquid passage formed by the fluid passage layer made of an elastomer has designability and does not react with the gallium-based liquid metal; the S-shaped fluid passage can increase the contact time of the gallium-based liquid metal with the electronic component and improve the heat dissipation efficiency; in some specific embodiments, the elastomer can be silicone.

[0012] Preferably, the upper cover plate and the lower cover plate are fastened by a countersunk screw. In the technical solution of the present application, the countersunk screw can further improve the sealing of the fluid channel layer. In some specific embodiments, four countersunk holes are formed on the upper cover plate and the lower cover plate; the upper cover plate and the lower cover plate are fastened by the countersunk screw in the countersunk holes.

[0013] Preferably, the upper cover plate and the lower cover plate are made of copper or copper alloy. In the technical solution of the present application, copper or copper alloy has high thermal conductivity, which can quickly transfer the heat of the electronic components to the gallium-based liquid metal in the fluid channel.

[0014] Preferably, a ceramic coating is deposited on the surface of the upper cover plate and the lower cover plate facing the fluid channel layer; the ceramic coating is selected from at least one of titanium nitride (TiN), titanium diboride (TiB2), chromium dioxide (CrO2) and molybdenum disilicide (MoSi2).

[0015] In the technical solution of the present application, depositing the ceramic coating can not only avoid the corrosion of the gallium-based liquid metal to the upper cover plate and the lower cover plate, but also improve the surface hardness and wear resistance of the upper cover plate and the lower cover plate; in addition, the ceramic coating also has high thermal conductivity, which improves the heat dissipation efficiency. In some specific embodiments, the upper cover plate and the lower cover plate are polished and cleaned with organic solvents (such as ethanol and acetone) before depositing the ceramic coating, so as to improve the surface smoothness and remove impurities, grease and other dirt; the deposition uses high vacuum vapor deposition method.

[0016] As a preferred embodiment, the liquid storage device is provided with a first liquid inlet for the gallium-based liquid metal and / or the first liquid to flow in, a first liquid outlet for the gallium-based liquid metal to flow out, and a second liquid outlet for the first liquid to flow out; the first liquid inlet and the first liquid outlet are communicated through a cooling circuit; a three-way valve is arranged on the cooling circuit, and three interfaces of the three-way valve are respectively communicated with the cooling circuit, the first liquid outlet and the second liquid outlet. In the technical solution of the present application, switching the three-way valve can change the liquid (i.e. the gallium-based liquid metal or the first liquid) in the fluid channel and the cooling circuit, which is returned to the liquid storage device from the first liquid inlet through the cooling circuit and the cooling fin, so as to realize the circulation of the gallium-based liquid metal and the first liquid between the liquid storage device and the fluid channel.

[0017] As a preferred embodiment, a first fluid pump is arranged on the cooling circuit to transport the liquid from the first liquid outlet to the first liquid inlet.

[0018] As a preferred implementation, the liquid storage device is provided with a second liquid inlet and a third liquid outlet for the first liquid to flow in and out; the second liquid inlet and the third liquid outlet are communicated through an external heat dissipation circuit; and a second fluid pump is arranged on the external heat dissipation circuit to transport the first liquid from the third liquid outlet to the second liquid inlet. In the technical solution of the present application, after the first liquid absorbs the heat energy brought back by the gallium-based liquid metal in the liquid storage device, the first liquid exchanges the heat energy it absorbs with an external heat dissipation device through the external heat dissipation circuit, so as to complete the whole heat dissipation process from the gallium-based liquid metal, the first liquid and the external environment; and the external heat dissipation device can be a dry cooler, a closed cooling tower or a water chiller.

[0019] As a preferred implementation, the electronic component heat dissipation system further comprises a temperature measuring unit and a control unit for adjusting the flow rates of the first fluid pump and the second fluid pump; the temperature measuring unit comprises temperature measuring devices arranged on the first liquid outlet, the second liquid outlet and the heat dissipation fins; and the control unit is connected with the temperature measuring unit and adjusts the flow rates of the first fluid pump and the second fluid pump according to the temperature measured by the temperature measuring unit.

[0020] The above technical solution has the following advantages or beneficial effects:

[0021] The electronic component heat dissipation system provided by the present application uses the gallium-based liquid metal with high thermal conductivity as the refrigerant, meets the rapid heat dissipation requirement of high-power-density components, and guarantees the stability of the heat dissipation system.

[0022] The present application has the following advantages:

[0023] 1. The present application uses the first liquid with a lower specific gravity than the gallium-based liquid metal to isolate the gallium-based liquid metal from the air, avoids the oxidation of the gallium-based liquid metal, reduces the sealing requirement, and reduces the manufacturing difficulty and cost of the heat dissipation system.

[0024] 2. The circulation of the first liquid between the heat dissipation fins and the liquid storage device can form a thin liquid film on the inner wall of the fluid channel and the cooling circuit, avoid the adhesion of the gallium-based liquid metal to the wall, improve the flowability of the gallium-based liquid metal, and complete cleaning and recycling of the residual gallium-based liquid metal to the liquid storage device during the circulation process.

[0025] 3. The first liquid in the present application can exchange heat with the gallium-based liquid metal and dissipate the heat to the external environment through the external heat dissipation circuit, further improving the heat dissipation efficiency.

[0026] 4. The electronic component heat dissipation system provided by the present application can also process the surfaces of the upper and lower cover plates through a ceramic coating with good corrosion resistance and thermal conductivity, avoid the direct contact of the gallium-based liquid metal with the copper-based material, prevent corrosion, avoid the deterioration of the gallium-based liquid metal, and further improve the durability and long-term stability of the heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0027] The present application and its features, objects and advantages will become clearer in light of the following detailed description of non-limiting embodiments thereof, read in conjunction with the accompanying drawings. The same reference numbers in different drawings identify the same components in the embodiments. The drawings are not to scale and emphasis is instead placed on the principles of the application.

[0028] Figure 1 is a structural schematic diagram of a gallium-based liquid metal heat dissipation system in an embodiment of the present application.

[0029] Figure 2 is a structural schematic diagram of a heat dissipation fin in an embodiment of the present application.

[0030] Figure 3 is a physical diagram of a cooling loop conveying a first liquid and a gallium-based liquid metal in an embodiment of the present application.

[0031] Figure 4 is a physical diagram of a liquid storage device with / without a first liquid after being stored for a certain period of time in an embodiment of the present application.

[0032] Figure 5 is a surface physical diagram of a lower cover plate of a heat dissipation system after long-term circulation in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Therefore, the detailed description of the embodiments of the present application provided in the following drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0034] It should be understood that when the terms "comprise" and / or "include" are used in the specification, it indicates the presence of a feature, step, operation, device, component and / or combinations thereof.

[0035] In the description of the present application, it should be noted that when the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like appear, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] In this invention, unless otherwise specified, all equipment and raw materials are commercially available or commonly used in the industry. The methods described in the following embodiments are conventional methods in the art, unless otherwise specified.

[0038] Example

[0039] like Figures 1-2 As shown, this embodiment provides a heat dissipation system for electronic components based on gallium-based liquid metal. Figures 1-2 In the middle section, 1-upper cover plate; 2-fluid channel layer; 3-lower cover plate; 4-fluid channel; 5-heat sink; 6-liquid storage device; 7-cooling circuit; 8-electronic component; 9-gallium-based liquid metal; 10-first liquid; 11-outlet hole; 12-inlet hole; 13-counterhead hole; 14-first inlet; 15-first outlet; 16-second outlet; 17-second inlet; 18-third outlet; 19-three-way valve; 20-first fluid pump; 21-external heat dissipation circuit; 22-second fluid pump; 23-external heat dissipation device.

[0040] The electronic component heat dissipation system includes a heat sink 5, a liquid storage device 6, a cooling circuit 7, and an external heat dissipation circuit 21. The heat sink 5 is located at the hot end of the electronic component 8 and has a fluid channel 4 inside. The liquid storage device 6 stores gallium-based liquid metal 9 and a first liquid 10. The first liquid 10 is water or an organic solvent. The fluid channel 4 is connected to the liquid storage device 6 through the cooling circuit 7. The external heat dissipation circuit 21 is connected to the liquid storage device 6. The first liquid 10 transfers heat to the outside through the external heat dissipation circuit 21.

[0041] In the electronic component heat dissipation system provided in this embodiment, the density of water or organic solvent is lower than that of gallium-based liquid metal 9, so it floats above the surface of gallium-based liquid metal 9, effectively isolating gallium-based liquid metal 9 from air and preventing oxidation reaction; the cooling circuit 7 enables the circulation of gallium-based liquid metal 9 and the first liquid 10 between the storage device 6 and the fluid channel 4. The specific operation process of this electronic component heat dissipation system is as follows: First, the first liquid 10 in the storage device 6 is transported to the heat sink 5 through the cooling circuit 7 and then returned to the storage device 6. Figure 2In the left figure, the cooling circuit 7 formed by the plastic tube is transparent. At this time, a thin liquid film formed by the first liquid 10 adheres to the inner wall of the cooling circuit 7 and the fluid channel 4. Then, the gallium-based liquid metal 9 in the liquid storage device 6 is transported to the heat sink 5, which absorbs the heat energy of the electronic components 8 and then returns to the liquid storage device 6. Figure 2 In the right figure, the cooling circuit 7 formed by the plastic tube shows the color of the gallium-based liquid metal (reflected in the figure). The gallium-based liquid metal 9, which absorbs heat energy, exchanges heat with the first liquid 10 in the liquid storage device 6. The first liquid 10 in the liquid storage device 6 then transfers the heat to the external environment through the external heat dissipation circuit 21, completing the heat dissipation process of the electronic component 8 from the gallium-based liquid metal 9 to the first liquid 10 to the external environment. After the electronic component 8 stops working, the heat dissipation system delivers the first liquid 10 back to the heat sink 5, and returns the gallium-based liquid metal 9 remaining in the heat sink 5 and the cooling circuit 7 to the liquid storage device 6. The gallium-based liquid metal 9 sinks back below the surface of the first liquid 10, completing the recovery of the gallium-based liquid metal 9. In some specific embodiments, the organic solvent can be any one or a mixture of ethanol, methanol, ethylene glycol, and propylene glycol.

[0042] The electronic components in this embodiment can be chips, high-power LEDs, IGBT power supplies, etc.

[0043] Furthermore, the heat sink 5 includes an upper cover plate 1, a lower cover plate 3, and a fluid channel layer 2 disposed between the upper cover plate 1 and the lower cover plate 3; the lower cover plate 3 is attached to the hot end of the electronic component 8; the upper cover plate 1 has a liquid outlet hole 11 and a liquid inlet hole 12, which are respectively connected to the openings at both ends of the fluid channel 4. In the electronic component heat dissipation system provided in this embodiment, the gallium-based liquid metal 9 and the first liquid 10 are transported through the fluid channel layer 2, and the fluid channel layer 2 is in effective contact with the upper cover plate 1 and the lower cover plate 3, which can efficiently transfer the heat of the electronic component 8 introduced by the lower cover plate 3.

[0044] Furthermore, the fluid channel layer 2 is made of an elastomer, and the fluid channel 4 is S-shaped. In the electronic component heat dissipation system provided in this embodiment, the liquid passage formed by the fluid channel layer 2 made of the elastomer is designable and does not react with the gallium-based liquid metal 9; the S-shaped fluid channel 4 can increase the contact time between the gallium-based liquid metal 9 and the electronic component 8, thereby improving heat dissipation efficiency; in some specific embodiments, the elastomer can be silicone.

[0045] Further, the upper cover plate 1 and the lower cover plate 3 are fastened by a countersunk screw. In the electronic component heat dissipation system provided by the embodiment, the countersunk screw can further improve the sealing of the fluid channel layer 2. In some specific embodiments, four countersunk holes 13 are formed on the upper cover plate 1 and the lower cover plate 3; the upper cover plate 1 and the lower cover plate 3 are fastened by the countersunk screw in the countersunk holes 13.

[0046] Further, the upper cover plate 1 and the lower cover plate 3 are made of copper or copper alloy. In the electronic component heat dissipation system provided by the embodiment, copper or copper alloy has high thermal conductivity, which can quickly transfer the heat of the electronic component 8 to the gallium-based liquid metal 9 in the fluid channel 4.

[0047] Further, a ceramic coating is deposited on the surface of the upper cover plate 1 and the lower cover plate 3 facing the fluid channel layer 2; the ceramic coating is selected from at least one of titanium nitride (TiN), titanium diboride (TiB2), chromium dioxide (CrO2) and molybdenum disilicide (MoSi2). In the electronic component heat dissipation system provided by the embodiment, the deposition of the ceramic coating can not only avoid the corrosion of the gallium-based liquid metal 9 to the upper cover plate 1 and the lower cover plate 3, but also improve the surface hardness and wear resistance of the upper cover plate 1 and the lower cover plate 3; in addition, the ceramic coating also has high thermal conductivity, which improves the heat dissipation efficiency. In some specific embodiments, before the deposition of the ceramic coating, the upper cover plate 1 and the lower cover plate 3 are polished and cleaned with organic solvents (such as ethanol and acetone), so as to improve the surface smoothness and remove impurities, grease and other dirt; the deposition is performed by high vacuum vapor deposition.

[0048] Further, the liquid storage device 6 is provided with a first liquid inlet 14 for the gallium-based liquid metal 9 and / or the first liquid 10 to flow in, a first liquid outlet 15 for the gallium-based liquid metal 9 to flow out, and a second liquid outlet 16 for the first liquid 10 to flow out; the first liquid inlet 14 and the first liquid outlet 15 are communicated through the cooling circuit 7; the cooling circuit 7 is provided with a three-way valve 19, and the three interfaces of the three-way valve 19 are respectively communicated with the cooling circuit 7, the first liquid outlet 15 and the second liquid outlet 16. In the electronic component heat dissipation system provided by the embodiment, switching the three-way valve 19 can change the liquid (i.e. the gallium-based liquid metal 9 and the first liquid 10) in the fluid channel 4 and the cooling circuit 7, which is returned to the liquid storage device 6 from the first liquid inlet 14 through the cooling fin 5 and the cooling circuit 7, so as to realize the circulation of the gallium-based liquid metal 9 and the first liquid 10 between the liquid storage device 6 and the fluid channel 4.

[0049] Further, the cooling circuit 7 is provided with a first fluid pump 20 for delivering the liquid from the first liquid outlet 15 to the first liquid inlet 14.

[0050] Further, the liquid storage device 6 is provided with a second liquid inlet 17 and a third liquid outlet 18 for the first liquid 10 to flow in and out; the second liquid inlet 17 and the third liquid outlet 18 are communicated through an external heat dissipation circuit 21; the external heat dissipation circuit 21 is provided with a second fluid pump 22 for conveying the first liquid 10 from the third liquid outlet 18 to the second liquid inlet 17. In the electronic component heat dissipation system provided by the embodiment, after the first liquid 10 absorbs the heat energy brought back by the gallium-based liquid metal 9 in the liquid storage device 6, the first liquid 10 exchanges the absorbed heat energy with an external heat dissipation device 23 through the external heat dissipation circuit 21, so as to complete the whole heat dissipation process from the gallium-based liquid metal 9 to the first liquid 10 to the external environment; the external heat dissipation device 23 can be a dry cooler, a closed cooling tower, a water chiller, etc.

[0051] Further, the electronic component heat dissipation system further comprises a temperature measuring unit and a control unit for adjusting the flow of the first fluid pump 20 and the second fluid pump 22; the temperature measuring unit comprises temperature measuring devices arranged on the first liquid outlet 15, the second liquid outlet 16 and the heat dissipation fin 5; the control unit is connected with the temperature measuring unit, and the flow of the first fluid pump 20 and the second fluid pump 22 is adjusted according to the temperature measured by the temperature measuring unit.

[0052] After the electronic component heat dissipation system with ethanol as the first liquid runs for a period of time, and after the electronic component heat dissipation system without the first liquid runs for a period of time, the physical diagram of the liquid storage device 6 (glass material) is shown in Figure 4 the left figure; the physical diagram of the liquid storage device 6 is shown in Figure 4 the right figure; it can be seen from the figures that, without the protection of the first liquid, the gallium-based liquid metal will stick to the wall and oxidize after running for a period of time; the gallium-based liquid metal protected by ethanol is still smooth and round, and has good fluidity, without the phenomenon of sticking to the wall, which indicates that there is no oxidation, and the thin liquid film of ethanol on the inner wall of the glass material effectively prevents the phenomenon of sticking to the wall.

[0053] Figure 5 The physical diagram of the lower cover plate with a titanium nitride coating deposited on the surface after a long period of circulation is shown; it can be seen that the surface has no any corrosion trace, which indicates that the gallium-based liquid metal cannot corrode the lower cover plate with a ceramic coating deposited on the surface in the running process of the electronic component heat dissipation system provided by the embodiment.

[0054] The above only describes the preferred embodiments of the present application, and it should be noted that those skilled in the art can make some improvements and refinements without departing from the principles of the present application, and these improvements and refinements should also be regarded as the protection scope of the present application.

Claims

1. A heat dissipation system for electronic components based on gallium-based liquid metal, characterized in that, It includes a heat sink, a liquid storage device, a cooling circuit, and an external heat dissipation circuit; the heat sink is disposed at the hot end of the electronic component and has a fluid channel inside; the liquid storage device stores gallium-based liquid metal and a first liquid; the first liquid is water or an organic solvent; the fluid channel is connected to the liquid storage device through the cooling circuit; the external heat dissipation circuit is connected to the liquid storage device; the first liquid transfers heat to the outside through the external heat dissipation circuit.

2. The electronic component heat dissipation system according to claim 1, characterized in that, The heat sink includes an upper cover plate, a lower cover plate, and a fluid channel layer disposed between the upper cover plate and the lower cover plate; the lower cover plate is attached to the hot end of the electronic component; the upper cover plate has a liquid outlet hole and a liquid inlet hole, which are respectively connected to the openings at both ends of the fluid channel.

3. The electronic component heat dissipation system according to claim 2, characterized in that, The fluid channel layer is made of an elastomer, and the fluid channel is S-shaped.

4. The electronic component heat dissipation system according to claim 2, characterized in that, The upper cover plate and the lower cover plate are fastened together by countersunk screws.

5. The electronic component heat dissipation system according to claim 2, characterized in that, The upper and lower cover plates are made of copper or copper alloy.

6. The electronic component heat dissipation system according to claim 2, characterized in that, The upper and lower cover plates are coated with ceramic coatings on their surfaces facing the fluid channel layer; the ceramic coatings are selected from at least one of titanium nitride, titanium diboride, chromium dioxide, and molybdenum disilicide.

7. The electronic component heat dissipation system according to claim 1, characterized in that, The liquid storage device has a first inlet for gallium-based liquid metal and / or a first liquid to flow in, a first outlet for gallium-based liquid metal to flow out, and a second outlet for the first liquid to flow out; the first inlet and the first outlet are connected through a cooling circuit; a three-way valve is provided on the cooling circuit, and the three ports of the three-way valve are respectively connected to the cooling circuit, the first outlet and the second outlet.

8. The electronic component heat dissipation system according to claim 7, characterized in that, The cooling circuit is equipped with a first fluid pump that transports liquid from the first outlet to the first inlet.

9. The electronic component heat dissipation system according to claim 8, characterized in that, The liquid storage device is provided with a second inlet and a third outlet for the first liquid to flow in and out; the second inlet and the third outlet are connected by an external heat dissipation circuit; the external heat dissipation circuit is provided with a second fluid pump to transport the first liquid from the third outlet to the second inlet.

10. The electronic component heat dissipation system according to claim 9, characterized in that, It also includes a temperature measuring unit and a control unit for adjusting the flow rates of the first fluid pump and the second fluid pump; the temperature measuring unit includes a temperature measuring device disposed on the first liquid outlet, the second liquid outlet and the heat sink; the control unit is connected to the temperature measuring unit and adjusts the flow rates of the first fluid pump and the second fluid pump by means of the temperature measured by the temperature measuring unit.

Images