Lamp bead package and packaging method thereof

Abstract

The invention relates to the technical field of LED packaging, and discloses a lamp bead package and a packaging method thereof, the lamp bead package comprises a support and an LED arranged in the support; the first fluorescent glue layer is covered on the LED; the first diaphragm covers the first fluorescent glue layer; the second fluorescent glue layer covers the first diaphragm; and the second diaphragm covers the second fluorescent glue layer and is flush with the edge of the bracket. The double fluorescent glue layers are adopted, and the diaphragms are arranged between the two fluorescent glue layers and on the top fluorescent glue layer, so that the phenomenon that the fluorescent powder is hydrolyzed and blackened due to water vapor invasion can be effectively reduced, and the reliability of the lamp bead can be improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more particularly to an LED chip package and its packaging method. Background Technology

[0002] LED chips typically require encapsulation with fluorescent adhesive. This fluorescent adhesive is prepared by dispensing and leveling a mixture of phosphor and glue, followed by centrifugal precipitation of the phosphor into the LED chip.

[0003] However, because the fluorescent adhesive (silicone) is not very effective at blocking moisture, it cannot effectively prevent moisture from penetrating into the LED chip, causing the phosphor to hydrolyze. This results in the phosphor reacting with moisture to produce black substances, which in turn reduces the reliability of the LED chip.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a lamp bead packaging and packaging method to solve the problem that the phosphor inside the lamp bead will hydrolyze due to moisture intrusion, resulting in the formation of black substances.

[0006] The technical solution of the present invention is as follows:

[0007] In a first aspect, the present invention provides a lamp bead package comprising:

[0008] The bracket and the LEDs disposed within the bracket;

[0009] A first fluorescent adhesive layer covers the LED;

[0010] The first diaphragm covers the first fluorescent adhesive layer;

[0011] A second fluorescent adhesive layer covers the first diaphragm;

[0012] The second diaphragm covers the second fluorescent adhesive layer and is flush with the edge of the support.

[0013] In a further embodiment of the present invention, both the first diaphragm and the second diaphragm are silicon dioxide layers.

[0014] In a further embodiment of the present invention, the first fluorescent adhesive layer is a non-moisture-resistant fluorescent adhesive layer; and the second fluorescent adhesive layer is a moisture-resistant fluorescent adhesive layer.

[0015] In a further embodiment of the present invention, the thickness of the first fluorescent adhesive layer is equal to the thickness of the second fluorescent adhesive layer.

[0016] In a further embodiment of the present invention, the thickness of the first diaphragm and the second diaphragm is 20-50 nm.

[0017] In a further embodiment of the present invention, the support includes a support frame and a cup / bowl structure; the cup / bowl structure is disposed on the support frame; the LED, the first fluorescent adhesive layer and the first diaphragm, and the second fluorescent adhesive layer and the second diaphragm are disposed within the cup / bowl structure.

[0018] Secondly, the present invention also provides a packaging method for LED chip packaging as described above, comprising the steps of:

[0019] The support frame is dehumidified and cleaned with plasma.

[0020] Prepare fluorescent adhesive and perform powder application;

[0021] A first phosphor layer was prepared on the LED and then subjected to centrifugation and baking.

[0022] A first diaphragm is prepared on the first fluorescent adhesive layer;

[0023] A second fluorescent adhesive layer is prepared on the first diaphragm and then subjected to centrifugation and baking.

[0024] A second diaphragm is prepared on the second fluorescent adhesive layer.

[0025] In a further embodiment of the present invention, the first diaphragm and the second diaphragm are prepared by a vapor deposition process.

[0026] In a further embodiment of the present invention, when baking the first fluorescent adhesive layer and the second fluorescent adhesive layer, the first layer is baked at 100 degrees Celsius for 1 hour, and then baked at 150 degrees Celsius for 3 hours.

[0027] This invention provides a lamp bead encapsulation and encapsulation method. The lamp bead encapsulation includes: a bracket and an LED disposed within the bracket; a first phosphor layer covering the LED; a first separator covering the first phosphor layer; a second phosphor layer covering the first separator; and a second separator covering the second phosphor layer and flush with the edge of the bracket. This invention employs a double-layer phosphor layer and provides separators between the two phosphor layers and on the top phosphor layer, which effectively reduces the phenomenon of phosphor hydrolysis and blackening caused by moisture intrusion, thereby improving the reliability of the lamp bead. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the LED chip packaging structure in this invention.

[0030] Figure 2 This is a schematic diagram of the packaging method for LED chip packaging in this invention.

[0031] Figure 3 This is a flowchart of the LED chip packaging process in one embodiment of the present invention.

[0032] Figure 4 This is a schematic diagram of the structure of the LED chip after die bonding and wire bonding in one embodiment of the present invention.

[0033] Figure 5 This is a schematic diagram of the structure of the first fluorescent adhesive layer at the LED bead encapsulation point in one embodiment of the present invention.

[0034] Figure 6 This is a schematic diagram of the structure of the first diaphragm in one embodiment of the present invention.

[0035] Figure 7 This is a schematic diagram of the structure of the second fluorescent adhesive layer in one embodiment of the present invention.

[0036] The following are the labels in the attached diagram: 1. Support; 11. Support frame; 12. Cup / bowl structure; 2. LED; 3. First fluorescent adhesive layer; 4. First diaphragm; 5. Second fluorescent adhesive layer; 6. Second diaphragm. Detailed Implementation

[0037] This invention provides a lamp bead encapsulation and encapsulation method thereof. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of the present invention involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0039] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when an element is referred to as "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements present. Furthermore, "connected" or "coupled" as used herein can include wireless connections or wireless coupling. The term "and / or" as used herein includes all or any of the units and all combinations thereof of one or more associatedly listed items.

[0040] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0041] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0042] Please also refer to Figure 1 The present invention provides a preferred embodiment of LED chip packaging.

[0043] In some embodiments, such as Figure 1 As shown, the present invention provides a lamp bead package, comprising: a bracket 1, an LED 2 disposed within the bracket 1, a first phosphor layer 3, a first separator 4, a second phosphor layer 5, and a second separator 6. The first phosphor layer 3 covers the LED 2; the first separator 4 covers the first phosphor layer 3; the second phosphor layer 5 covers the first separator 4; and the second separator 6 covers the second phosphor layer 5 and is flush with the edge of the bracket 1.

[0044] In this embodiment, the LED2 is located within the bracket 1. After die bonding and wire bonding of the LED2 are completed, the first phosphor layer 3 is first applied to the LED2, covering it. The second phosphor layer 5 covers the first phosphor layer 3, and the first diaphragm 4 is located between the first phosphor layer 3 and the second phosphor layer 5. After applying the first phosphor layer 3 and the second phosphor layer 5, the phosphor is centrifuged and settled to the bottom. The second diaphragm 6 and the second phosphor layer 5 can effectively isolate foreign substances. The first diaphragm 4 is located between the first phosphor layer 3 and the second phosphor layer 5, and is therefore not easily damaged by external forces. Even if the second diaphragm 6 is damaged, it can still prevent harmful substances from penetrating the first phosphor layer 3. Combined with the waterproof function of the first phosphor layer 3, it can prevent the phosphor in the first phosphor layer 3 from being hydrolyzed and turning black due to moisture intrusion, thereby improving the reliability of the LED.

[0045] In some embodiments, the first fluorescent adhesive layer 3 is a non-moisture-resistant fluorescent adhesive layer; the second fluorescent adhesive layer 5 is a moisture-resistant fluorescent adhesive layer.

[0046] In this embodiment, the phosphor in the second fluorescent adhesive layer 5 is a phosphor with strong moisture resistance, so that even if the second diaphragm 6 is damaged, the second fluorescent adhesive layer 5 will not undergo hydrolysis. The first fluorescent adhesive layer 3 uses a phosphor with poor moisture resistance, which can improve the brightness and color rendering index of the LED, and by centrifuging and settling to the bottom, the path of moisture intrusion is increased, thereby further preventing external moisture from penetrating the phosphor in the first fluorescent adhesive layer 3.

[0047] In some embodiments, both the first membrane 4 and the second membrane 6 are silicon dioxide layers.

[0048] In some embodiments, the first diaphragm 4 and the second diaphragm 6 are obtained by vapor deposition of silicon dioxide material on the surfaces of the first fluorescent adhesive layer 3 and the second fluorescent adhesive layer 5, respectively, so that the first diaphragm 4 and the second diaphragm 6 have a water-blocking effect.

[0049] In some embodiments, the thickness of the first diaphragm 4 and the second diaphragm 6 is 20-50 nm, for example, it can be 20 nm, 35 nm, 50 nm, etc.

[0050] In some embodiments, the thickness of the first fluorescent adhesive layer 3 is equal to the thickness of the second fluorescent adhesive layer 5.

[0051] In this embodiment, the height of the first fluorescent adhesive layer 3 and the second fluorescent adhesive layer 5 is determined according to the depth of the support 1. Generally, the first fluorescent adhesive layer 3 and the second fluorescent adhesive layer 5 are in equal proportion, that is, the thickness of the first fluorescent adhesive layer 3 is equivalent to the thickness of the second fluorescent adhesive layer 5. Since the thickness of the first diaphragm 4 and the second diaphragm 6 is at the nanometer level, the thickness of the first fluorescent adhesive layer 3 and the second fluorescent adhesive layer 5 is approximately equal to half the depth of the support 1.

[0052] In some embodiments, the support 1 includes a support frame 11 and a cup and bowl structure 12; the cup and bowl structure 12 is disposed on the support frame 11; the LED 2, the first fluorescent adhesive layer 3 and the first diaphragm 4, the second fluorescent adhesive layer 5 and the second diaphragm 6 are disposed within the cup and bowl structure 12.

[0053] In this embodiment, as Figure 1 As shown, the support 1 consists of a support frame 11 and a cup-and-bowl structure 12. The cup-and-bowl structure 12 is located on the support frame 11 and is bowl-shaped with a certain depth. The LED 2, the first fluorescent adhesive layer 3 and the first diaphragm 4, and the second fluorescent adhesive layer 5 and the second diaphragm 6 are disposed within the cup-and-bowl structure 12. The depth of the cup-and-bowl structure 12 is equal to the thickness of the first fluorescent adhesive layer 3, the second fluorescent adhesive layer 5, the first diaphragm 4, and the second diaphragm 6.

[0054] In some embodiments, such as Figures 1 to 7 As shown, the present invention also provides a packaging method for LED chip packaging as described above, which includes the following steps:

[0055] S1. Dehumidify and clean the bracket 1 with plasma;

[0056] Specifically, please refer to Figure 2 , Figure 3 and Figure 4 First, the support 1 is dehumidified, and then the surface of the support 1 is ion cleaned by mixing argon and nitrogen and using a plasma machine.

[0057] S2. Prepare fluorescent adhesive and perform powder application;

[0058] Specifically, please refer to Figure 2 and Figure 3 The preparation of fluorescent adhesive first requires powder preparation, followed by formulation. Powder preparation involves selecting appropriate fluorescent powders and mixing them according to the user's requirements for XY center points, Ra, etc. (the mixing ratio is generally not specified and is determined based on customer needs). Formulation involves mixing the prepared powder with silica gel to form the fluorescent adhesive. After the fluorescent adhesive preparation is completed, the first sample is applied.

[0059] S3. Prepare the first fluorescent adhesive layer 3 on LED2, and perform centrifugation and baking treatment;

[0060] Specifically, please refer to Figure 2 , Figure 3 and Figure 5 After applying the first fluorescent adhesive layer 3 to LED2, the phosphor is centrifuged and precipitated using a centrifuge. Then, it is baked at 100 degrees Celsius for 1 hour, and then baked at 150 degrees Celsius for 3 hours. The baking process is completed at two different temperatures of 100 degrees Celsius and 150 degrees Celsius.

[0061] S4. Prepare a first diaphragm 4 on the first fluorescent adhesive layer 3;

[0062] Specifically, please refer to Figure 2 , Figure 3 and Figure 6 After the preparation of the first fluorescent adhesive layer 3 is completed, a 20-50 nm silicon dioxide layer is deposited on the surface of the first fluorescent adhesive layer 3 by vapor deposition to block water vapor from penetrating the first fluorescent adhesive layer 3.

[0063] S5. Prepare a second fluorescent adhesive layer 5 on the first diaphragm 4, and perform centrifugation and baking treatment;

[0064] Specifically, please refer to Figure 2 , Figure 3 and Figure 7 After completing the first diaphragm 4, a second fluorescent adhesive layer 5 is applied to the first diaphragm 4. After the preparation of the second fluorescent adhesive layer 5 is completed, the fluorescent powder is centrifuged and precipitated using a centrifuge. Then, it is baked at 100 degrees Celsius for 1 hour, and then baked at 150 degrees Celsius for 3 hours. The baking time is completed at two temperatures of 100 degrees Celsius and 150 degrees Celsius.

[0065] S6. Prepare a second diaphragm 6 on the second fluorescent adhesive layer 5.

[0066] Specifically, please refer to Figure 1 , Figure 2 and Figure 3 After the preparation of the second fluorescent adhesive layer 5 is completed, a 20-50 nm silicon dioxide layer is deposited on the surface of the first fluorescent adhesive layer 3 by vapor deposition to block water vapor from penetrating the first fluorescent adhesive layer 3.

[0067] In the above technical solution, by using two phosphor dispensing methods and two coating methods, the inside of the LED bead is made into several layers of barriers. The bottom layer is a phosphor adhesive layer that is not moisture-resistant, while the second layer is a moisture-resistant phosphor adhesive layer. A coating (silica inorganic layer) is applied to the edges of the two layers, which can effectively prevent harmful substances such as moisture and sulfur from penetrating into the LED bead and damaging the phosphor inside the bead or the silver layer on the surface of the bracket. The coating process between the two phosphor adhesive layers can effectively prevent the second coating layer from being easily damaged by external forces due to exposure, thus preventing coating failure. The first separator between the two silicone layers can prevent damage caused by external forces and effectively prevent the intrusion of harmful substances.

[0068] In summary, the LED chip packaging and packaging method provided by this invention have the following beneficial effects:

[0069] By using a double-layer fluorescent adhesive and a double-layer coating, the hydrolysis and blackening of the bottom phosphor caused by moisture intrusion can be effectively reduced, thereby improving the reliability of the LED beads.

[0070] Using phosphors with poor moisture resistance to dot the first fluorescent adhesive layer and centrifuging to settle it to the bottom can increase the path for moisture intrusion.

[0071] The first diaphragm between the two fluorescent adhesive layers is located between the two silicone layers, making it less susceptible to damage from external forces and thus providing a more reliable barrier against the intrusion of harmful substances.

[0072] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A type of LED chip package, characterized in that, include: The bracket and the LEDs disposed within the bracket; A first fluorescent adhesive layer covers the LED; The first diaphragm covers the first fluorescent adhesive layer; A second fluorescent adhesive layer covers the first diaphragm; The second diaphragm covers the second fluorescent adhesive layer and is flush with the edge of the support.

2. The LED chip packaging according to claim 1, characterized in that, Both the first membrane and the second membrane are silicon dioxide layers.

3. The LED chip packaging according to claim 1, characterized in that, The first fluorescent adhesive layer is a non-moisture-resistant fluorescent adhesive layer.

4. The LED chip packaging according to claim 1, characterized in that, The second fluorescent adhesive layer is a moisture-resistant fluorescent adhesive layer.

5. The LED chip packaging according to claim 1, characterized in that, The thickness of the first fluorescent adhesive layer is equal to the thickness of the second fluorescent adhesive layer.

6. The LED chip packaging according to claim 1, characterized in that, The thickness of the first diaphragm and the second diaphragm is 20-50 nm.

7. The LED chip packaging according to claim 1, characterized in that, The support includes a support frame and a cup / bowl structure; the cup / bowl structure is disposed on the support frame; the LED, the first fluorescent adhesive layer and the first diaphragm, and the second fluorescent adhesive layer and the second diaphragm are disposed within the cup / bowl structure.

8. A packaging method for LED chips according to any one of claims 1-7, characterized in that, Including the following steps: The support frame is dehumidified and cleaned with plasma. Prepare fluorescent adhesive and perform powder application; A first phosphor layer was prepared on the LED and then subjected to centrifugation and baking. A first diaphragm is prepared on the first fluorescent adhesive layer; A second fluorescent adhesive layer is prepared on the first diaphragm and then subjected to centrifugation and baking. A second diaphragm is prepared on the second fluorescent adhesive layer.

9. The packaging method according to claim 8, characterized in that, The first diaphragm and the second diaphragm are prepared by vapor deposition.

10. The packaging method according to claim 8, characterized in that, When baking the first fluorescent adhesive layer and the second fluorescent adhesive layer, they are first baked at 100 degrees Celsius for 1 hour, and then baked at 150 degrees Celsius for 3 hours.

Images