Rotary turntable for silicon wafer grinding

Abstract

The invention discloses a rotating turntable for silicon wafer grinding. The rotating turntable comprises a turntable body, an adjusting module, a locking module, a chassis and a wafer carrier. A clamping groove in which a wafer can be embedded is formed in the top of the wafer carrier; the rotating disc is a circular rotating disc, a mounting opening is formed in the circle center of the rotating disc, a plurality of concentric circular rings and concentric circular grooves are uniformly distributed in the rotating disc in a staggered manner, and four adjusting grooves are uniformly distributed in the rotating disc in a cross manner; the peripheries of the adjusting grooves are consistent with the circular rings in height, each circular ring is equally divided into four circular arcs by the four adjusting grooves, and sliding grooves are formed between the circular arcs and the adjusting grooves at equal intervals. The periphery of the adjusting groove is consistent with the height of the circular ring, it is guaranteed that grinding fluid can flow to the sliding groove from the groove and then flow into the overflow groove, and due to blocking of the overflow groove, the grinding fluid is prevented from being directly thrown to the inner wall of equipment at a high speed and also prevented from directly flowing into the adjusting module.

Description

Technical Field

[0001] This invention belongs to the field of wafer polishing technology, specifically a rotating disk for polishing silicon wafers. Background Technology

[0002] When grinding a wafer, the turntable drives the wafer to rotate evenly, and the grinding end reciprocates from the outer side of the wafer to the center, thereby achieving high-precision grinding. During the grinding process, the wafer needs to fall on the center of the turntable; otherwise, uneven grinding may occur. Especially when grinding curved wafers, the height of the center and the outer side of the wafer is different, so it is even more necessary to ensure that the center of the wafer coincides with the center of the turntable. Conventional grinding mechanisms are only designed for grinding silicon wafers of a single size. Designing a wafer grinding fixture suitable for multiple sizes can significantly reduce costs, especially when prototyping wafers. Summary of the Invention

[0003] To address the problems mentioned in the background art, the present invention provides a rotary table for grinding silicon wafers.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a rotary table for silicon wafer grinding, comprising a rotary table, an adjustment module, a locking module, a base, and a wafer carrier; the wafer carrier has a slot at its top for fitting wafers; the rotary table is circular, with an installation opening at its center, and multiple concentric circular rings and concentric circular grooves evenly and alternately distributed on the table; four adjustment grooves are evenly distributed in a cross shape on the rotary table; the adjustment grooves are at the same height as the rings around their perimeter, and the four adjustment grooves divide each ring into four equal arcs; equidistant sliding grooves are provided between the arcs and the adjustment grooves, and the sliding grooves extend continuously. At the end of the adjustment groove, near the outer side of the turntable, there is a blocking block perpendicular to the adjustment groove. Between the blocking block and the slide groove, there is an overflow groove perpendicular to the slide groove. The middle of the adjustment groove has a long, narrow cavity. The adjustment module is a movable slider located at the bottom of the circular turntable. The adjustment module has a locking screw hole. The locking module is a latch that matches the adjustment groove. The locking module can be locked with the locking screw hole on the adjustment module. The chassis has a main shaft at its center and support shafts around its perimeter. The main shaft is fixedly connected to the mounting port of the turntable, and the support shafts are fixedly connected to the bottom of the turntable.

[0005] Preferably, the adjustment module includes an adjustment end, a transmission rod, a follower rod, and a fixed base. The fixed base has a mounting groove in the middle that fits into the main shaft, and a movable groove around its periphery. The movable groove is movably connected to the follower rod via a rotating shaft. The follower rod is movably connected to the transmission rod via a rotating shaft. The transmission rod is movably connected to the adjustment end via a rotating shaft. The adjustment end includes a second blocking block, a slide rail, a base plate, and a first slider. The slide rail consists of two symmetrically installed tracks at the bottom of the adjustment groove. The first slider and the second blocking block are fixedly connected to the base plate. The second blocking block is higher than the adjustment groove. The first slider and the slide rail fit into each other. The bottom of the base plate is movably connected to the transmission rod via a rotating shaft. The base plate has a locking screw hole in the middle near the outer side of the turntable. There are four adjustment modules, each corresponding to one adjustment groove.

[0006] Preferably, the locking module includes an adjusting bolt and a second slider; the second slider is a U-shaped groove that is inverted and fastened to the upper part of the adjusting groove, and the middle part of the second slider is provided with a second locking screw hole corresponding to the first locking screw hole. The adjusting bolt is threadedly connected to the first locking screw hole and the second locking screw hole respectively, and the adjusting module is locked by rotating the adjusting bolt.

[0007] Preferably, the bottom of the chassis is also provided with a drive shaft and a motor.

[0008] Preferably, a differential is also provided between the drive shaft and the motor.

[0009] Preferably, the slide rail is further provided with limiting blocks at both ends.

[0010] Preferably, the slot of the wafer carrier is further provided with a notch.

[0011] Preferably, the adjusting bolt is also provided with a handle at the top.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Multiple concentric rings and grooves are evenly and alternately distributed on the turntable. The rings can be evenly arranged according to the size of the wafer and can be used as a reference for centering the wafer, helping to accurately align the center of the wafer with the center of the turntable.

[0013] 2. The four adjustment slots evenly distributed in a cross shape on the turntable, together with the adjustment module and the locking module, ensure that force can be applied in all directions, thereby locking the wafer carrier and preventing the wafer carrier from falling off during rotation.

[0014] 3. The grooves, slides, and vertical overflow channels of the turntable work together, and the height of the adjustment channel is consistent with that of the ring. This ensures that the grinding fluid can flow from the groove to the slide and then into the overflow channel. Furthermore, the overflow channel prevents the grinding fluid from being directly and rapidly thrown onto the inner wall of the equipment, and also prevents the grinding fluid from flowing directly into the adjustment module.

[0015] 4. The adjustment end of the adjustment module can lock the wafer carrier in conjunction with the locking module according to the size of the wafer, and the follower rod and transmission rod can also provide some support for the adjustment end; in addition, the adjustment module has a simple structure and low repair cost after damage. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the turntable structure of the present invention; Figure 3 This is a top view of the adjustment module of the present invention; Figure 4 This is a three-dimensional schematic diagram of the adjustment module of the present invention; Figure 5 This is a schematic diagram of the chassis structure of the present invention; Figure 6 This is a schematic diagram of the locking module structure of the present invention; In the diagram: 1. Turntable, 2. Adjustment module, 3. Locking module, 4. Chassis, 5. Wafer carrier, 6. Drive shaft, 7. Motor, 8. Differential; 11. Ring, 12. Groove, 13. Adjustment groove, 14. Arc, 15. Slide groove, 16. Block 1, 17. Overflow groove; 18. Cavity, 21. Fixed seat, 22. Follower rod, 23. Drive rod, 24. Adjustment end, 31. Adjustment bolt, 32. Slider 2, 41. Main shaft, 42. Support shaft, 211. Movable groove, 212. Mounting groove, 241. Block 2, 242. Slide rail, 243. Base plate, 244. Slider 1, 245. Locking screw hole 1, 321. Locking screw hole 2, 2421. Limit block. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] like Figures 1 to 6As shown, the present invention provides a rotary table for silicon wafer grinding, characterized in that it includes a rotary table 1, an adjustment module 2, a locking module 3, a base 4, and a wafer carrier 5; the wafer carrier 5 has a slot on its top for fitting wafers; the rotary table 1 is a circular rotary table with an installation opening at its center, and multiple concentric circular rings 11 and concentric circular grooves 12 are evenly and alternately distributed on the rotary table 1; four adjustment grooves 13 are evenly distributed in a cross shape on the rotary table 1; the four adjustment grooves 13 are at the same height as the rings 11 around their perimeter, and the four adjustment grooves 13 divide each ring 11 into four arcs 14; there are sliding grooves 15 equidistant from each arc 14 and adjustment groove 13, and the sliding grooves 15 extend to the end of the adjustment grooves 13. Near the outer side of the turntable 1, there is a blocking block 16 perpendicular to the adjustment groove 13. Between the blocking block 16 and the slide groove 15, there is an overflow groove 17 perpendicular to the slide groove 15. The middle of the adjustment groove 13 has a long strip-shaped cavity 18. The adjustment module 2 is a movable slider set at the bottom of the circular turntable 1. The adjustment module 2 has a locking screw hole 245. The locking module 3 is a latch that matches the adjustment groove 13. The locking module 3 can be locked with the locking screw hole 245 on the adjustment module 2. The chassis 4 has a main shaft 41 at its center. The chassis 4 has support shafts 42 around its perimeter. The main shaft 41 is fixedly connected to the mounting port of the turntable 1. The support shafts 42 are fixedly connected to the bottom of the turntable 1.

[0019] The above solution employs a method where multiple concentric rings 11 and concentric grooves 12 are evenly and alternately distributed on the turntable 1. The rings 11 can be evenly arranged according to the size of the wafer, serving as a reference for centering and aligning the wafer, and assisting in accurately aligning the center of the wafer with the center of the turntable. Four evenly distributed adjustment slots on the turntable, along with the adjustment module and locking module, ensure that force can be applied in all directions, thereby locking the wafer carrier and preventing it from falling off during rotation. This technical solution not only enables precise alignment of wafers of various sizes, but also the grooves 12, sliding grooves 15, and vertical overflow grooves 17 of the turntable 1 work together. The adjustment grooves 17 are at the same height as the rings, ensuring that the polishing slurry can flow from the grooves 12 to the sliding grooves 15 and then into the overflow grooves 17. Furthermore, the overflow grooves 17 prevent the polishing slurry from being directly and rapidly thrown onto the inner wall of the equipment, and prevent the polishing slurry from directly flowing into the adjustment module. This structure is simple to operate, applicable to wafers of different sizes, and has a low cost.

[0020] like Figure 3-6As shown, the adjustment module 2 includes an adjustment end 24, a transmission rod 23, a follower rod 22, and a fixed base 21. The fixed base 21 has a mounting groove 212 in the middle that fits into the main shaft 41, and a movable groove 211 around the middle of the fixed base 21. The movable groove 211 is movably connected to the follower rod 22 via a rotating shaft. The follower rod 22 is movably connected to the transmission rod 23 via a rotating shaft. The transmission rod 23 is movably connected to the adjustment end 24 via a rotating shaft. The adjustment end 24 includes a second blocking block 241, a slide rail 242, and a base plate 243. The slide block 244 is a slider 1. The slide rail 242 consists of two symmetrical tracks installed at the bottom of the adjustment groove 13. The slider 244 and the blocking block 241 are fixedly connected on the base plate 243. The blocking block 241 is higher than the adjustment groove 13. The slider 244 and the slide rail 242 are interlocked. The bottom of the base plate 243 is movably connected to the transmission rod 23 through a rotating shaft. The base plate 243 is provided with a locking screw hole 245 in the middle near the outer side of the turntable 1. There are four adjustment modules 2, each corresponding to one adjustment groove 13.

[0021] The chassis 4 is also provided with a drive shaft 6 and a motor 7 at the bottom. A differential 8 is also provided between the drive shaft 6 and the motor 7. Limiting blocks 2421 are also provided at both ends of the slide rail 242. A notch is also provided on the slot of the wafer carrier 5. A handle is also provided on the top of the adjusting bolt 31.

[0022] The above solution is adopted: the adjustment module 2 and the locking module can lock the wafer carrier according to the size of the wafer. The structure is stable and the adjustment module has a simple structure, which can reduce the later maintenance cost. In addition, the drive shaft 6, motor 7 and differential 8 can realize the adjustment of the turntable speed. The slot is also provided with a notch to help the polishing slurry flow out.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0024] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rotary table for grinding silicon wafers, characterized in that, It includes a turntable (1), an adjustment module (2), a locking module (3), a chassis (4), and a wafer carrier (5); the wafer carrier (5) has a slot on its top for fitting wafers; The turntable (1) is a circular turntable (1). The turntable (1) has an installation port at its center. The turntable (1) has a plurality of concentric circular rings (11) and concentric circular grooves (12) evenly and alternately distributed. The turntable (1) has four adjustment grooves (13) evenly distributed in a cross shape. The adjustment grooves (13) are at the same height as the rings (11) around their perimeter. The four adjustment grooves (13) divide each ring (11) into four arcs (14). The arcs (14) and the adjustment grooves (13) are provided with sliding grooves (15) at equal intervals. The sliding grooves (15) extend all the way to the end of the adjustment grooves (13). A blocking block (16) perpendicular to the adjustment grooves (13) is provided near the outer side of the turntable (1). An overflow groove (17) perpendicular to the sliding grooves (15) is provided between the blocking block (16) and the sliding grooves (15). The adjustment grooves (13) have a long, narrow cavity (18) in the middle. The adjustment module (2) is a movable slider located at the bottom of the circular turntable (1), and the adjustment module (2) is provided with a locking screw hole (245). The locking module (3) is a latch that matches the adjustment groove (13), and the locking module (3) can be locked with the locking screw hole (245) on the adjustment module (2); The chassis (4) has a main shaft (41) at its center and a support shaft (42) around its perimeter. The main shaft (41) is fixedly connected to the mounting port of the turntable (1), and the support shaft (42) is fixedly connected to the bottom of the turntable (1).

2. The rotary table for grinding silicon wafers according to claim 1, characterized in that: The adjustment module (2) includes an adjustment end (24), a transmission rod (23), a follower rod (22), and a fixed seat (21). The fixed seat (21) has a mounting groove (212) in the middle that fits into the main shaft (41). The fixed seat (21) has a movable groove (211) around its periphery. The movable groove (211) is movably connected to the follower rod (22) via a rotating shaft. The follower rod (22) is movably connected to the transmission rod (23) via a rotating shaft. The transmission rod (23) is movably connected to the adjustment end (24) via a rotating shaft. The adjustment end (24) includes a second blocking block (241), a slide rail (242), and a base plate (243). The slider is 1 (244), the slide rail (242) consists of two symmetrical tracks installed at the bottom of the adjustment groove (13), the slider is 1 (244) and the blocking block is 2 (241) fixedly connected on the base plate (243), the blocking block is 2 (241) higher than the adjustment groove (13), the slider is 1 (244) and the slide rail (242) are fitted together, the bottom of the base plate (243) is movably connected to the transmission rod (23) through a rotating shaft, and the base plate (243) is provided with a locking screw hole 1 (245) in the middle near the outer side of the turntable (1); there are four adjustment modules (2), each adjustment module (2) corresponds to one adjustment groove (13).

3. The rotary table for grinding silicon wafers according to claim 2, characterized in that: The locking module (3) includes an adjusting bolt (31) and a second slider (32); the second slider (32) is a U-shaped groove that is upside down on the upper part of the adjusting groove (13). The second slider (32) has a second locking screw hole (321) in the middle that corresponds to the first locking screw hole (245). The adjusting bolt (31) is threadedly connected to the first locking screw hole (245) and the second locking screw hole (321) respectively. The adjusting module (2) is locked by rotating the adjusting bolt (31).

4. The rotary table for grinding silicon wafers according to claim 1, characterized in that: The chassis (4) is also equipped with a drive shaft (6) and a motor (7) at the bottom.

5. A rotating disk for grinding silicon wafers according to claim 4, characterized in that: A differential (8) is also provided between the drive shaft (6) and the motor (7).

6. The rotary table for grinding silicon wafers according to claim 1, characterized in that: The slide rail (242) is also provided with limit blocks (2421) at both ends.

7. The rotary table for grinding silicon wafers according to claim 1, characterized in that: The wafer carrier (5) also has a notch on its slot.

8. A rotating disk for grinding silicon wafers according to claim 3, characterized in that: The adjusting bolt (31) is also provided with a handle at the top.

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