Pipeline fixing part veneer

Abstract

The present application relates to a pipe fixture finish and, more particularly, to a method for applying a finish to a hardware set, comprising heating a chamber, pressurizing the chamber comprising the hardware set to create a vacuum in the chamber, applying at least one gas to an ionized target material in the chamber to form a non-reactive coating, and providing at least one gas to the chamber at a dynamically increasing pressure over a predetermined time range to form a coating having a predetermined color. In one embodiment, an apparatus includes a bracket configured to hold a set of hardware in a chamber and to distribute a finish over the set of hardware; a vacuum pump for forming a vacuum; an electrical input for increasing the voltage of the target material; a heating element for increasing the temperature in the device; and a gas inlet tube configured to provide a gas for the non-reactive coating and a gas for the reactive coating to the hardware set.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 761,086 (file number: 010222-24007B), filed February 20, 2025, and U.S. Provisional Patent Application No. 63 / 650,211 (file number: 010222-24007A), filed May 21, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to one or more finishes or coatings applied to pipe fasteners. Background Technology

[0004] Pipe fasteners are typically available with coatings in various colors and styles. Applying dark coatings to pipe fasteners presents several challenges. Summary of the Invention

[0005] This application provides a method for applying a finish to a hardware assembly, the method comprising:

[0006] Heating the chamber;

[0007] The chamber comprising the hardware assembly is pressurized to create a vacuum within the chamber;

[0008] At least one gas is applied to the ionized target material in the chamber to form a non-reactive coating; and

[0009] At least one gas is supplied to the chamber at dynamically increasing pressure within a predetermined time range to form a coating with a predetermined color.

[0010] This application also provides an apparatus for applying a finish to a hardware assembly, the apparatus comprising:

[0011] A support, configured to hold the hardware assembly in a chamber and distribute the finish on the hardware assembly;

[0012] A vacuum pump, used to create a vacuum in the device;

[0013] An electrical input, used to increase the voltage of the target material;

[0014] Heating element, the heating element being used to increase the temperature in the device; and

[0015] At least one gas inlet pipe is configured to supply the hardware assembly with gas for non-reactive coating and gas for reactive coating.

[0016] This application also provides a finish, including:

[0017] Base;

[0018] A chromium layer, said chromium layer being formed by reacting a first gas with an ionized target material; and

[0019] A chromium nitrate layer, which is formed by reacting a second gas with the ionized target material. Attached Figure Description

[0020] Exemplary embodiments are described herein with reference to the following accompanying drawings.

[0021] Figure 1 This is an exemplary device for forming a coating on pipe fasteners.

[0022] Figure 2 It is used for Figure 1 A block diagram of the device.

[0023] Figure 3 This is a flowchart for forming a coating on pipe fasteners.

[0024] Figure 4 This is a flowchart for forming a coating on pipe fasteners.

[0025] Figure 5 An exemplary control system is illustrated.

[0026] Figure 6 The diagram illustrates the use of Figure 5 The flowchart of the controller.

[0027] Figure 7 The diagram illustrates the method for passing through Figures 1 to 4 The flowchart describes the modification of the coating to create a cleanable surface on the pipe fixture. Detailed Implementation

[0028] In the following detailed description, reference is made to the accompanying drawings, which form an integral part of this document. In the drawings, like symbols generally denote like parts unless the context otherwise requires. The illustrative embodiments described in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments and modifications may be made without departing from the spirit or scope of the subject matter herein. It will be readily understood that various aspects of this disclosure, as generally described and illustrated herein, can be arranged, substituted, combined, and designed in a variety of different configurations, all of which are explicit considerations and components of this disclosure.

[0029] This disclosure provides a method and apparatus for forming a finish on a fastener, and a fastener having such a finish. The fastener may be associated with a pipe (i.e., a pipe fastener) and includes one or more channels, valves, or chambers for the passage and / or diversion of water or other liquids. The pipe fastener is not intended to be limited and can be any household pipe fastener associated with delivery and drainage. The pipe fastener can be at least one of the following: a faucet, faucet handle, faucet accessory such as a fluid conduit (e.g., a water pipe, hose, etc.), or a water container or vessel (e.g., a sink, bathtub, whirlpool, spa pool), etc., for sinks, bathtubs, whirlpools, spa pools, soap dispensers, etc. In another embodiment, the finish may also be applied to other fasteners, such as bathroom or kitchen fasteners, such as towel racks, lighting fasteners, or ventilation fasteners. In addition, surface finishes can be applied to the surface of fasteners made of at least one of low-corrosion metals or metal alloys (e.g., tungsten, titanium, chromium, pewter, copper, bronze, brass, stainless steel, zinc alloys), ceramics (e.g., porcelain), glass, plastics, or combinations thereof.

[0030] The following processes may include depositing a coating on a pipe fastener to obtain a finish with a desired appearance. The step of depositing the first coating may be performed using at least one of vacuum deposition (physical vapor deposition, PVD; chemical vapor deposition, CVD; atomic layer deposition, ALD). In one embodiment, PVD is used as the deposition technique for forming the first coating on the pipe fastener.

[0031] PVD vacuum deposition is advantageous because it does not involve aqueous components and is more environmentally friendly and economical than wet chemical processes. PVD coatings are generally harder and more corrosion-resistant than coatings applied by electroplating. Most PVD coatings exhibit high temperature and good impact strength, excellent abrasion resistance, and durability, making protective topcoats an option. PVD deposition processes include at least one of cathodic arc evaporation, electron beam (e-beam) PVD, evaporation deposition, pulsed laser deposition, sputtering deposition, ion plating, or pulsed electron deposition. In a typical PVD process, material is evaporated from a solid source and transported as vapor to a substrate in a vacuum environment, where it condenses to form a coating. The vacuum environment is configured such that the mean free path for particle collisions is on the order of the size of the processing chamber or through a low-pressure environment of gas or plasma (ionized gas).

[0032] The process for depositing dark (e.g., black or graphite) finishes differs from that for other colors. For example, dark finishes can utilize different non-reactive coatings compared to other finishes. PVD finishes themselves consist of chromium metal and various gases to form layers of chromium nitride and carbonitride. This technique increases the coating strength.

[0033] Dark colors (such as graphite or black) can include non-reactive coatings consisting of many layers of metallic chromium (Cr) and chromium nitride (CrN) stacked on top of each other. Chromium is a very hard metal, exhibiting scratch and corrosion resistance. CrN is an interstitial compound comprising a compact lattice structure in which nitrogen atoms fill the gaps in the Cr lattice. This is another very hard and extremely corrosion-resistant coating. Overall, this non-reactive coating approach provides both corrosion resistance and strength.

[0034] In primary reactive coatings, the standard procedure in PVD processes uses all gas from the start of coating, but in graphite finishes, the gas is gradually increased until the end of the coating time. The advantage of this process is improved coating durability and corrosion resistance. It also results in a cleaner chamber. Because the coating is black, it generates a significant amount of dust that is detrimental to the chamber and may require frequent cleaning. The cleaning requirement decreases as the gas concentration increases.

[0035] The following processes may also include forming a cleanable surface using a PVD coating. The cleanable surface may have properties such as repellency to water, oil, and / or other liquids. Exemplary cleanable surfaces include fluoropolymers. One example is a fluoropolymer of tetrafluoroethylene (PTFE), which may be referred to as Teflon in certain formulations from certain sources.

[0036] In some cases, this cleanable surface can be deposited onto the material by adding silicon oxide (SiO2) to the substrate. Silicon oxide can be deposited via a sputtering PVD process. The silicon oxide acts as an adhesive layer. On top of the adhesive layer, a coating is deposited (e.g., using a thermal evaporation PVD process). This process is complex. Due to its complexity and cost, a chamber capable of accommodating three different PVD processes is impractical for production. Furthermore, depositing a silicon oxide layer can cause color shifts on the target (pipe fixture). These color shifts can be more pronounced when the pipe fixture has a zirconium coating.

[0037] Applying this cleanable surface via oxidation of the PVD coloring layer, as described in one or more of the following embodiments, overcomes these drawbacks. An ion source for oxygen (O2) can be applied to the target (pipe fixture). An organic coating is deposited using a thermal evaporation process. This process eliminates the need for a silicon oxide layer. Furthermore, it avoids color shifts caused by the silicon oxide layer.

[0038] Figure 1 This is an exemplary device for forming a coating on pipe fittings or other hardware. An exemplary hardware assembly 80 as a faucet is illustrated. The hardware assembly 80 may be supported by a bracket 20. The hardware assembly 80 may include a target material (e.g., the outer layer of the hardware assembly 80 or other material) subjected to processes. While other examples are possible, the target material 30 may include chromium, zirconium, or titanium.

[0039] The device may include a turntable 90 for rotating hardware assembly 80. The turntable 90 may include or be otherwise coupled to a motor that rotates the turntable 90. The motor may rotate the turntable in response to user input at the device (e.g., a button or lever) or wireless communication (e.g., from a mobile device or remote control). The device may include a housing for hermetically sealing the chamber. Additional, different, or fewer components may be included.

[0040] Figure 2 It is used for Figure 1 A block diagram of the apparatus. Chamber 10 includes at least a support 20 configured to support target material 30. The chamber is connected to multiple inputs, including a gas input (e.g., gas inlet 70), an electrical input (e.g., power supply 50), a thermal input (e.g., heating element 60), and a vacuum input (e.g., vacuum pump 40). As described in more detail below, manual or automatic controllers or feedback systems activate or enable the various inputs at different times depending on the PVD process.

[0041] Figure 3 This is a flowchart for forming a coating or finish on pipe fasteners. It may include additional, different, or fewer actions.

[0042] At action S101, chamber 10 is depressurized. For example, vacuum pump 40 can pump air out of chamber 10 to create a vacuum (e.g., a pressure level below the vacuum threshold).

[0043] At action S103, chamber 10 is heated. Chamber 10 may include heating element 60, to which electricity is applied and converted into heat. Actions S101 and S103 may be performed simultaneously or at overlapping time intervals.

[0044] At action S105, a first layer (e.g., a non-reactive layer) is applied to the conduit fixture (e.g., target material 30). For example, at least one gas is supplied to the ionized target material in chamber 10 through gas inlet 70.

[0045] At action S107, a second layer (e.g., a reactive layer) is applied to the pipe fixture (e.g., target material 30). For example, at least one gas is delivered into the chamber at dynamically increasing pressure over a predetermined time range, thereby achieving a coating with a predetermined color.

[0046] Following this process, the pipe fixture or hardware assembly includes a base substrate, a chromium layer formed by reacting a first gas with an ionized target material, and a chromium nitrate layer formed by reacting a second gas with an ionized target material.

[0047] Figure 4 This is a more detailed exemplary flowchart for forming a coating on pipe fasteners. Additional, different, or fewer actions may be included.

[0048] At action S201, the pump and heat are applied to chamber 10.

[0049] As shown in action S203, the pressure in chamber 10 is monitored (e.g., using a pressure sensor). When the vacuum pressure drops below a predetermined level of 0.005 mbar, the heating element 60 is deactivated.

[0050] As shown in action S205, the pump continues to reduce the pressure in chamber 10. Once the pressure drops below a second predetermined level of 0.003 mbar, the process then moves to action S209, in which the target is cleaned. Contaminants or oxidation can be removed by applying voltage.

[0051] At action S211, ion etching is applied at a first voltage level. An exemplary first voltage level is 500V. Ion etching may include plasma or an ion beam applied to the target material. The first voltage is a low voltage applied to the substrate for cleaning.

[0052] At action S213, ion etching is applied at a second voltage level. An exemplary second voltage level is 900V. The second voltage is a high voltage applied to the substrate for cleaning. The high voltage is greater than the low voltage.

[0053] At action S215, a sublayer is applied. The sublayer may be an applied zirconium (Zr) layer. A first gas reacts with the ionized target material to form a non-reactive coating. The first gas may be argon, nitrogen, oxygen, or acetylene.

[0054] The control system sets a counter for the Cr layer. At S217, the counter n is set to an initial value (e.g., n = 0). At S219, the Cr layer is applied. At S221, the CrN layer is applied. Through this sequence, the non-reactive coating is formed by a first layer made of chromium and a second layer made of chromium nitride.

[0055] At S223, the counter n is compared with a threshold. Exemplary threshold values ​​for n include 10 to 50. Other values ​​are possible. If the counter has not yet reached the threshold, the counter is incremented at S225, and actions S219 and S221 are repeated. The threshold is one less than the number of times the gas is applied to the ionized target material. Therefore, when the threshold is n, n+1 layers are applied.

[0056] When counter n reaches the threshold, the reactive coating S227 is applied. During application, gas is supplied at an increased pressure level over a predetermined time period. The predetermined time range can be any value from 10 minutes to 60 minutes.

[0057] In one embodiment, the coating deposition step includes depositing the coating over the entire surface area of ​​the pipe fastener. In another embodiment, only a portion of the surface area of ​​the fastener is coated. Other portions of the pipe fastener may be at least one of polished metal, brushed metal, gold-plated metal, oiled metal, satin metal, or a combination thereof. Non-limiting examples of the first finish include polished chrome, brushed chrome, polished French gold, polished titanium, brushed titanium, polished rose gold, polished modern gold, polished tungsten, polished modern brass, satin titanium, polished satin chrome, satin bronze, polished brass, satin brass, oil-brushed bronze, polished nickel, brushed nickel, matte black, and the like.

[0058] In some embodiments, the PVD process for the coating is a reactive deposition process in which the deposited material reacts with gaseous substances in the process environment to form compounds prior to deposition (e.g., nitrogen reacts with deposited titanium to form a TiN coating (with a gold appearance)). Decorative / wear-resistant PVD coatings for pipe fittings include TiN (with a gold appearance), ZrN (with a brass-like appearance), TiC (with a black appearance), TICN (with an anthracite gray appearance), ZrCN (with a nickel-like appearance), ZrCrCN (with a brass-like appearance), and ZrCrN (with a gold or rose gold appearance). In one embodiment, the thickness of the first coating can vary from about 100 nm to about 2000 nm. In some embodiments, at least one thin seed layer or primer layer can be deposited on the pipe fitting prior to PVD deposition to achieve enhanced bonding properties with the subsequent PVD coating. For non-planar surfaces, the pipe fitting can be mounted on a turntable that is rotated manually or automatically when the first coating is applied. The second gas may include oxygen and acetylene.

[0059] Figure 5An exemplary controller 501 for the operation of chamber 10 and the process described herein is illustrated. Controller 501 may include processor 300, memory 352, and communication interface 353 for interacting with devices or the Internet and / or other networks 346.

[0060] Optionally, the control system may include an input device 355 and / or sensing circuitry 356 that communicates with any sensor (e.g., a probe in chamber 10). The sensing circuitry receives sensor measurements from one or more sensors. The input device may include any user input, such as a button, touchscreen, keyboard, microphone for voice input, camera for gesture input, and / or other mechanisms.

[0061] Processor 300 is configured to execute instructions 342 stored in memory 352 for executing the algorithms described herein. Display 350 may be an indicator or other screen output device. Display 350 may be combined with user input device 355.

[0062] Figure 6 It shows the use of Figure 5 The flowchart shows the actions in the device. The actions in the flowchart can be performed by the controller 301. Additional, different, or fewer actions may be included.

[0063] At action S301, controller 301 (e.g., processor 300) receives an indication that hardware has been loaded into chamber 10. This indication may be sensor data detecting the hardware. This indication may be input from the user (e.g., open or pressed ready).

[0064] At action S303, controller 301 (e.g., processor 300) provides an instruction to close chamber 10. Closing the chamber may include lowering or otherwise moving the housing to close chamber 10. Closing the chamber may include closing a window in the housing.

[0065] At action S305, controller 301 (e.g., processor 300) provides a command to turn on vacuum pump 40 to pressurize chamber 10. This command can either power vacuum pump 40 or open a valve connected between vacuum pump 40 and chamber 10.

[0066] At action S307, controller 301 (e.g., processor 300) provides an instruction to turn on heating element 60 to heat chamber 10. This instruction may provide power to heating element 60 and / or provide a target temperature to heating element 60.

[0067] At action S309, controller 301 (e.g., processor 300) provides instructions for ionizing target material 30.

[0068] At action S311, controller 301 (e.g., processor 300) provides instructions to rotate bracket 20 within chamber 10. These instructions can activate a motor connected to bracket 20. The instructions can provide rotation time, speed, or number of rotations.

[0069] At action S313, controller 301 (e.g., processor 300) provides instructions to input a first gas into chamber 10 to react with target material 30 to form a chromium layer.

[0070] At action S315, controller 301 (e.g., processor 300) provides instructions to form a second gas that reacts with target material 30 to produce a chromium nitrate layer.

[0071] At action S317, controller 301 (e.g., processor 300) provides an instruction to start a timer. The timer can be set to a predetermined timer period. At action S317, controller 301 (e.g., processor 300) provides an instruction to increase the pressure in chamber 10 during the formation of the reactive coating during a predetermined time period of the timer.

[0072] At action S321, controller 301 (e.g., processor 300) provides an instruction to deactivate chamber 10. Deactivation may include any combination of turning off vacuum pump 40, turning off power supply 50, turning off heating element 60, closing valve in gas inlet 70, stopping rotation of support 20, and / or opening chamber 10.

[0073] Figure 7 The diagram illustrates the method for passing through Figures 1 to 4 The flowchart describes the modification of the coating to create a cleanable surface on the pipe fastener. The pipe fastener may include metal (e.g., stainless steel). The pipe fastener may be a faucet or other metal part of a water-related appliance. Additional, different, or fewer actions may be included.

[0074] At action S401, a PVD coloring layer is applied according to any embodiment described herein. The PVD coloring layer can be formed using heat and pressure within a chamber. In one example, at least one gas is supplied to the chamber using multiple pressure levels over a period of time. The pressure levels and / or time periods can be selected as needed.

[0075] At action S403, an ion source is applied to expose the PVD coloring layer. The ion source may be located within the chamber or otherwise connected to the chamber. The ion source may supply plasma to the chamber. The ion source may be configured to oxidize one or more materials in the coating of the pipe fastener. The ion source may oxidize zirconium carbonate in the pipe fastener.

[0076] In one example, a gas (e.g., oxygen) can be supplied to the chamber. An ion source can supply oxygen to the chamber. The ion source can cause at least a portion of the oxygen molecules in the oxygen to split into oxygen atoms. The oxygen becomes reactive and causes the zirconium carbonate in the pipe fixture to be oxidized. The oxide layer can be used as an adhesion layer to facilitate the coating of the hydrophobic layer. The oxide layer can have a thickness in the range of 1-50 nanometers. An example may include a thickness in the range of 2-5 nanometers.

[0077] At action S405, a hydrophobic layer is formed from the oxidation of the PVD coloring layer. For example, organic materials can be deposited on the adhesion layer by thermal evaporation PVD.

[0078] Processor 300 may be a general-purpose processor or a special-purpose processor, an application-specific integrated circuit (ASIC), one or more programmable logic controllers (PLCs), one or more field-programmable gate arrays (FPGAs), a set of processing units, or other suitable processing units. Processor 300 is configured to execute computer code or instructions stored in memory 352 or received from other computer-readable media (e.g., embedded flash memory, local hard disk storage, local ROM, network storage, remote server, etc.). Processor 300 may be a single device or a combination of devices, such as those associated with a network, distributed processing, or cloud computing.

[0079] Memory 352 may include one or more devices (e.g., memory cells, memory devices, storage devices, etc.) for storing data and / or computer code for performing and / or facilitating the various methods described herein. Memory 352 may include random access memory (RAM), read-only memory (ROM), hard disk storage, temporary storage, non-volatile memory, flash memory, optical storage, or any other suitable memory for storing software objects and / or computer instructions. Memory 352 may include database components, object code components, scripting components, or any other type of information structure for supporting the various activities and information structures described herein. Memory 352 may be communicatively connected to processor 300 via processing circuitry and may include computer code for performing (e.g., by processor 300) one or more methods described herein. For example, memory 298 may include graphics, web pages, HTML files, XML files, script code, spray configuration files, or other resources for generating graphical user interfaces for display and / or for interpreting user interface input to generate command, control, or communication decisions.

[0080] In addition to including ingress and egress ports, communication interface 353 may also include any operable connections. Operable connections may be connections in which signals can be sent and / or received, physical communications and / or logical communications can be performed. Operable connections may include physical interfaces, electrical interfaces and / or data interfaces. Communication interface 353 may be connected to a network. This network may include a wired network (e.g., Ethernet), a wireless network, or a combination thereof. A wireless network may be a cellular telephone network, an 802.11, 802.16, 802.20, or WiMax network, Bluetooth pairing of devices, or a Bluetooth mesh network. Furthermore, the network may be a public network (such as the Internet), a private network (such as an intranet), or a combination thereof, and may utilize various network protocols currently available or developed in the future, including but not limited to TCP / IP-based network protocols.

[0081] Although a computer-readable medium (e.g., memory 352) is shown as a single medium, the term "computer-readable medium" includes single or multiple media, such as a centralized or distributed database, and / or associated caches and servers that store one or more sets of instructions. The term "computer-readable medium" should also include any medium capable of storing, encoding, or carrying a set of instructions that can be executed by a processor, or a medium that enables a computer system to perform any one or more methods or operations disclosed herein.

[0082] In certain non-limiting, exemplary embodiments, a computer-readable medium may include solid-state memory, such as a memory card, or other package housing one or more non-volatile read-only memories. Additionally, a computer-readable medium may be random access memory or other volatile rewritable memory. Furthermore, a computer-readable medium may include magneto-optical or optical media, such as magnetic disks or magnetic tapes, or other storage devices used to capture carrier signals (such as signals communicated via a transmission medium). Emails or other self-contained information archives or sets of digital files can be considered distribution media of tangible storage media. Therefore, this disclosure is considered to include any one or more computer-readable media or distribution media and other equivalents and subsequent media in which data or instructions may be stored. A computer-readable medium may be non-transitory, which includes all tangible computer-readable media.

[0083] In alternative embodiments, dedicated hardware implementations, such as application-specific integrated circuits (ASICs), programmable logic arrays (PLA), and other hardware devices, can be constructed to implement one or more methods described herein. Applications of the apparatuses and systems that may include the various embodiments are broadly applicable to a wide range of electronic and computer systems. One or more embodiments described herein may use two or more specific, interconnected hardware modules or devices to implement functionality, these modules or devices having associated control and data signals that can communicate between and through modules, or as part of an ASIC. Therefore, this system encompasses software, firmware, and hardware implementations.

[0084] This application also provides a method for applying a hydrophobic coating to a pipe fastener, the method comprising:

[0085] Apply physical vapor deposition layer;

[0086] Provide an ion source to the physical vapor deposition layer;

[0087] Oxidize the physical vapor deposition layer; and

[0088] The hydrophobic layer is adhered to the pipe fastener assembly via an oxidized physical vapor deposition layer.

[0089] In one exemplary method, the hydrophobic layer comprises a synthetic fluoropolymer.

[0090] In one exemplary method, the oxidized physical vapor deposition layer has a thickness of 2 to 5 nanometers.

[0091] In one of the exemplary methods, the oxidized physical vapor deposition layer is an adhesion layer.

[0092] In one exemplary method, the method further includes:

[0093] The hydrophobic layer is generated by thermal evaporation from physical vapor deposition.

[0094] In one exemplary method, applying the physical vapor deposition layer includes:

[0095] Applying at least one gas to an ionized target material to form a non-reactive coating; and

[0096] At least one gas is supplied to the chamber at dynamically increasing pressure within a predetermined time range to form a coating with a predetermined color.

[0097] The accompanying drawings of the embodiments described herein are intended to provide a general understanding of the structure of various embodiments. These drawings are not intended as a complete description of all elements and features of devices and systems utilizing the structures or methods described herein. Many other embodiments will be apparent to those skilled in the art upon review of this disclosure. Other embodiments can be utilized and derived from this disclosure, allowing for structural and logical substitutions and changes without departing from the scope of this disclosure. Furthermore, the drawings are merely representative and may not be drawn to scale. Some scales in the drawings may be exaggerated, while others may be minimized. Therefore, this disclosure and the drawings should be considered illustrative rather than restrictive.

[0098] While this specification contains numerous specific details, these details should not be construed as limiting the scope of the invention or the scope of the claims, but rather as descriptions of specific features of particular embodiments of the invention. Certain features described in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although the foregoing features may be described as functioning in certain combinations, or even initially claimed in this way, in some cases one or more features may be removed from the claimed combination, and the claimed combination may be for sub-combinations or variations thereof.

[0099] One or more embodiments of this disclosure may be referred to herein, individually and / or collectively, with the term "invention" for convenience only and not intended to voluntarily limit the scope of this application to any particular invention or inventive concept. Furthermore, although specific embodiments have been illustrated and described herein, it should be understood that any subsequent arrangements intended to achieve the same or similar purpose may supersede the specific embodiments shown. This disclosure is intended to cover any and all subsequent adjustments or variations of the various embodiments. Combinations of the foregoing embodiments, as well as other embodiments not specifically described herein, will be apparent to those skilled in the art upon reading the specification.

[0100] The above detailed description is intended to be illustrative rather than restrictive, and the following claims are understood to include all equivalents in order to define the scope of the invention. Unless so stated, the claims should not be construed as limiting to the order or elements described. Therefore, all embodiments within the scope and spirit of the following claims and their equivalents are claimed as part of the invention.

Claims

1. A method for applying a finish to a hardware assembly, the method comprising: Heating the chamber; The chamber comprising the hardware assembly is pressurized to create a vacuum within the chamber; At least one gas is applied to the ionized target material in the chamber to form a non-reactive coating; as well as At least one gas is supplied to the chamber at dynamically increasing pressure within a predetermined time range to form a coating with a predetermined color.

2. The method according to claim 1, further comprising: The ion source is applied to a coating having the predetermined color; as well as A hydrophobic layer is formed on the hardware assembly by oxidation.

3. The method of claim 1, wherein the at least one gas reacts with the ionized target material to form the non-reactive coating.

4. The method of claim 1, wherein the at least one gas is applied to the ionized target material a predetermined number of times.

5. The method according to claim 1, wherein the predetermined color is black or graphite.

6. The method according to claim 1, wherein the predetermined time range is greater than 10 minutes.

7. The method of claim 1, wherein the non-reactive coating comprises a first layer made of chromium and a second layer made of chromium nitride.

8. The method of claim 7, wherein the first layer is applied during a first time period, and the second layer is applied during a second time period.

9. The method of claim 1, wherein the ionized target material is titanium, chromium, or zirconium.

10. The method according to claim 1, wherein the at least one gas is nitrogen, oxygen or acetylene.

11. The method of claim 1, wherein the pressure and heat in the chamber are reduced to a first level.

12. The method of claim 11, wherein the pressure is further reduced to a second level.

13. An apparatus for applying a finish to a hardware assembly, the apparatus comprising: A support, configured to hold the hardware assembly in a chamber and distribute the finish on the hardware assembly; A vacuum pump, used to create a vacuum in the device; An electrical input, used to increase the voltage of the target material; A heating element, used to increase the temperature in the device; as well as At least one gas inlet pipe is configured to supply the hardware assembly with gas for non-reactive coating and gas for reactive coating.

14. The apparatus of claim 13, wherein the at least one gas inlet pipe comprises a plurality of pipes.

15. The apparatus of claim 13, wherein the support rotates about the target material.

16. The apparatus of claim 13, wherein the electrical input increases the voltage of the target material to ionize the target material.

17. The apparatus of claim 16, wherein the gas reacts with the ionized target material to form the non-reactive coating.

18. The apparatus of claim 13, wherein the vacuum pump reduces the pressure in the chamber to a first level.

19. The apparatus of claim 18, wherein the vacuum pump further reduces the pressure in the chamber to a second level.

20. A finish comprising: Base; A chromium layer, which is formed by reacting a first gas with an ionized target material; as well as A chromium nitrate layer, which is formed by reacting a second gas with the ionized target material.

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