Ball valve ball coating surface detection system

Abstract

The invention discloses a ball valve ball coating surface detection system, belongs to the technical field of ball coating detection, and solves the problem that conventional static detection during delivery can only capture the initial performance of a coating in a frozen state; the problems that continuous thickening and coarsening of a brittle intermetallic compound phase layer formed by mutual diffusion of interface elements at a high temperature in thousands of thermal cycles cannot be evaluated in a lossless mode, and the cumulative effect of alternating thermal stress generated by mismatch of thermal expansion coefficients on the brittle layer cannot be predicted are solved. Comprising a master control and digital signal processing module, a multi-band electric excitation and nonlinear measurement module and a multifunctional contact sensor array module. Multi-band electric signals and femtosecond laser ultrasonic pulses are injected into a coating interface of a ball body of the ball valve, electrical nonlinear response and optical ultrasonic signals are synchronously collected, and after signal processing and deep learning fusion analysis, visual detection results of the thickness, the stress and the damage state of an interface intermetallic compound layer are output.

Description

Technical Field

[0001] This invention relates to the field of ball coating inspection technology, and more particularly to a ball valve ball coating surface inspection system. Background Technology

[0002] The ball of a ball valve is the core opening and closing component, responsible for controlling the flow of fluid. It is typically made of high-strength, corrosion-resistant materials such as stainless steel or alloys to ensure structural stability and basic sealing. To further enhance performance, its surface is often coated with tungsten carbide, ceramic, or diamond-like carbon coatings, which improve wear resistance and corrosion resistance, reduce the coefficient of friction, decrease opening and closing wear, and extend the ball's lifespan. This is especially important in harsh operating conditions containing particles or corrosive media, ensuring long-term reliable sealing and operation of the valve.

[0003] In the operation of the catalyst circulation pipeline in the catalytic cracking unit, the ball valve needs to frequently switch between oxygen-containing flue gas with a temperature of over 700°C and carbonaceous hydrocarbon oil gas with a temperature of about 550°C, with a cycle of several minutes. It has to withstand the dual effects of severe temperature shock of over 150°C and abrasive catalyst powder.

[0004] To ensure that the ball valve ball can be used under such conditions, the surface coating of the ball valve ball needs to be tested in advance during production. Conventional static tests at the factory, including metallographic, hardness and adhesion tests, can only capture the initial performance of the coating in the "frozen" state. They cannot non-destructively evaluate the continuous thickening and coarsening of the brittle intermetallic compound phase layer formed by the interdiffusion of interfacial elements at high temperatures during thousands of thermal cycles, and cannot predict the cumulative effect of alternating thermal stress caused by the mismatch of thermal expansion coefficients on this brittle layer.

[0005] Therefore, when the ball valve is put into use in the catalytic device, each temperature cycle acts as a driving force to intensify element interdiffusion and brittle phase growth, and also acts as a stress source to repeatedly affect this "mechanical short board" whose performance is continuously deteriorating. The two form a vicious cycle of self-catalysis, which ultimately leads to the coating not wearing uniformly, but rather to a catastrophic "shell-breaking" large-area peeling due to the expansion of fatigue cracks in the IMC layer.

[0006] The consequence was that the geometry of the ball sealing surface was completely destroyed, the ball valve experienced catastrophic internal leakage, the high-temperature process medium was reversed, and the entire unit was forced to shut down unexpectedly.

[0007] Therefore, a ball valve ball coating surface inspection system is proposed to solve or alleviate the above problems. Summary of the Invention

[0008] The purpose of this invention is to address the shortcomings of existing technologies by proposing a ball valve ball coating surface inspection system.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: A ball valve ball coating surface inspection system includes a main control and digital signal processing module, a multi-band electrical excitation and nonlinear measurement module, a multifunctional contact sensor array module, a femtosecond laser ultrasonic excitation module, a non-contact optical detection module, and an ultra-high-speed data acquisition and synchronization module. The output terminal of the main control and digital signal processing module is connected to the input terminal of the multi-band electrical excitation and nonlinear measurement module. The excitation output terminal of the multi-band electrical excitation and nonlinear measurement module is connected to the electrical input terminal of the multifunctional contact sensor array module. The signal measurement terminal of the multi-band electrical excitation and nonlinear measurement module is connected to the analog input terminal of the ultra-high-speed data acquisition and synchronization module. The system is connected as follows: the trigger input terminal of the femtosecond laser ultrasonic excitation module is connected to the synchronous trigger output terminal of the main control and digital signal processing module; the optical pulse output terminal of the femtosecond laser ultrasonic excitation module is connected to the optical input terminal of the multifunctional contact sensor array module; the electrical signal output terminal of the non-contact optical detection module is connected to the analog input channel of the ultra-high-speed data acquisition and synchronization module; the digital data output terminal of the ultra-high-speed data acquisition and synchronization module is connected to the high-speed data input terminal of the main control and digital signal processing module; and the sampling clock input terminal of the ultra-high-speed data acquisition and synchronization module is connected to the synchronous clock output terminal of the main control and digital signal processing module.

[0010] Preferably, the main control and digital signal processing module includes an RFSoC chip XCZU28DR and a clock distributor LMK04828. The general-purpose input / output pin group of the RFSoC chip XCZU28DR is connected to the serial data input / output pins, serial clock pins, and input / output update pins of the direct digital frequency synthesizer AD9959 in the multi-band electrical excitation and nonlinear measurement module. The gigabit transceiver pins of the RFSoC chip XCZU28DR are connected to the high-speed analog-to-digital converter ADS54J6 in the ultra-high-speed data acquisition and synchronization module. The JESD204B interface pin is connected to 0. Any general-purpose input / output pin of the RFSoC chip XCZU28DR is connected to the external trigger input pin of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module. The reference clock output by the RFSoC chip XCZU28DR is connected to the reference input pin of the clock distributor LMK04828. The output of the clock distributor LMK04828 is connected to the positive clock input pin and the negative clock input pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module.

[0011] Preferably, the multi-band electrical excitation and nonlinear measurement module includes a direct digital frequency synthesizer AD9959, an RF power amplifier, a directional coupler, a double-balanced mixer, and a logarithmic detector ADL6012. One output channel pin of the direct digital frequency synthesizer AD9959 is connected to the input pin of the RF power amplifier. The output pin of the RF power amplifier is connected to the input port of the directional coupler. The output port of the directional coupler is connected to the microwave electrode pair of the multi-functional contact sensor array module. One coupling port of the directional coupler is connected to the RF input pin of the double-balanced mixer, and the other coupling port is connected to the input pin of the logarithmic detector ADL6012. The reference clock output pin of the direct digital frequency synthesizer AD9959 is connected to the local oscillator input pin of the double-balanced mixer. The intermediate frequency output pin of the double-balanced mixer is connected to the analog input channel pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module. The output pin of the logarithmic detector ADL6012 is connected to the analog input channel pin two of the high-speed analog-to-digital converter ADS54J60.

[0012] Preferably, the multifunctional contact sensor array module includes a microwave electrode pair, a low-frequency four-wire electrode, and a photoconductive antenna. The microwave electrode pair adopts a coplanar waveguide structure and is connected to the output port of the directional coupler in the multi-band electrical excitation and nonlinear measurement module via a coaxial cable. The low-frequency four-wire electrode is connected to the external precision source measurement unit IT2800 via four independent shielded wires. The photoconductive antenna is made of low-temperature grown gallium arsenide material and is connected to the optical output port of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module via an optical fiber.

[0013] Preferably, the femtosecond laser ultrasonic excitation module includes a femtosecond fiber laser and an optical delay line. The optical output port of the femtosecond fiber laser is connected to the input end of the optical delay line via an optical fiber, and the output end of the optical delay line is connected to the photoconductive antenna in the multifunctional contact sensor array module via an optical fiber.

[0014] Preferably, the non-contact optical detection module includes a continuous wave laser, an ultrafast photoelectric balanced detector, and a lock-in amplifier. The modulation input terminal of the continuous wave laser is connected to any general-purpose input / output pin of the RFSoC chip XCZU28DR in the main control and digital signal processing module. The positive and negative output pins of the ultrafast photoelectric balanced detector are connected to the signal input port of the lock-in amplifier. The reference clock input port of the lock-in amplifier is connected to the synchronization clock output pin of the femtosecond fiber laser. The auxiliary output pin of the lock-in amplifier is connected to the analog input channel three pins of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module.

[0015] Preferably, the ultra-high-speed data acquisition and synchronization module includes a high-speed analog-to-digital converter (ADS54J60). One analog input channel pin of the ADS54J60 is connected to the intermediate frequency output pin of the double-balanced mixer in the multi-band electrically excited and nonlinear measurement module. Another analog input channel pin of the ADS54J60 is connected to the output pin of the logarithmic detector ADL6012 in the multi-band electrically excited and nonlinear measurement module. A third analog input channel pin of the ADS54J60 is connected to the auxiliary output pin of the lock-in amplifier in the non-contact optical detection module. The zero and three positive / negative pins of the data channel of the JESD204B interface of the ADS54J60 are connected to the gigabit transceiver pins of the RFSoC chip XCZU28DR in the digital signal processing module. The positive and negative clock input pins of the ADS54J60 are connected to the output of the clock distributor LMK04828 in the main control and digital signal processing module.

[0016] The present invention has the following beneficial effects: This invention injects multi-band electrical signals and femtosecond laser ultrasonic pulses into the coating interface of a ball valve body and simultaneously acquires electrical nonlinear response and optical ultrasonic signals. After signal processing and deep learning fusion analysis, it outputs visualized detection results of the thickness, stress and damage state of the intermetallic compound layer at the interface. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a structural block diagram of the present invention.

[0019] The diagram shows: 1. Main control and digital signal processing module; 2. Multi-band electrical excitation and nonlinear measurement module; 3. Multifunctional contact sensor array module; 4. Femtosecond laser ultrasonic excitation module; 5. Non-contact optical detection module; 6. Ultra-high-speed data acquisition and synchronization module. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this invention, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] A ball valve ball coating surface inspection system, such as Figure 1As shown, the system includes a main control and digital signal processing module 1, a multi-band electrical excitation and nonlinear measurement module 2, a multi-functional contact sensor array module 3, a femtosecond laser ultrasonic excitation module 4, a non-contact optical detection module 5, and an ultra-high-speed data acquisition and synchronization module 6. The output terminal of the main control and digital signal processing module 1 is connected to the input terminal of the multi-band electrical excitation and nonlinear measurement module 2. The excitation output terminal of the multi-band electrical excitation and nonlinear measurement module 2 is connected to the electrical input terminal of the multi-functional contact sensor array module 3. The signal measurement terminal of the multi-band electrical excitation and nonlinear measurement module 2 is connected to the analog input channel of the ultra-high-speed data acquisition and synchronization module 6. The trigger input terminal of the femtosecond laser ultrasonic excitation module 4 is connected to the synchronous trigger output terminal of the main control and digital signal processing module 1. The optical pulse output terminal of the femtosecond laser ultrasonic excitation module 4 is connected to the optical input terminal of the multifunctional contact sensor array module 3. The electrical signal output terminal of the non-contact optical detection module 5 is connected to the analog input channel of the ultra-high-speed data acquisition and synchronization module 6. The digital data output terminal of the ultra-high-speed data acquisition and synchronization module 6 is connected to the high-speed data input terminal of the main control and digital signal processing module 1. The sampling clock input terminal of the ultra-high-speed data acquisition and synchronization module 6 is connected to the synchronous clock output terminal of the main control and digital signal processing module 1.

[0027] The main control and digital signal processing module 1 includes the RFSoC chip XCZU28DR and the clock distributor LMK04828. The general-purpose input / output pin group of the RFSoC chip XCZU28DR is connected to the serial data input / output pins, serial clock pins, and input / output update pins of the direct digital frequency synthesizer AD9959 in the multi-band electrical excitation and nonlinear measurement module 2. The gigabit transceiver pins of the RFSoC chip XCZU28DR are connected to the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module 6. The JESD204B interface pins are connected, and any general-purpose input / output pin of the RFSoC chip XCZU28DR is connected to the external trigger input pin of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module 4. The reference clock output by the RFSoC chip XCZU28DR is connected to the reference input pin of the clock distributor LMK04828. The output of the clock distributor LMK04828 is connected to the positive clock input pin and the negative clock input pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module 6.

[0028] The multi-band electrical excitation and nonlinear measurement module 2 includes a direct digital frequency synthesizer AD9959, an RF power amplifier, a directional coupler, a double-balanced mixer, and a logarithmic detector ADL6012. The output channel pin of the direct digital frequency synthesizer AD9959 is connected to the input pin of the RF power amplifier. The output pin of the RF power amplifier is connected to the input port of the directional coupler. The output port of the directional coupler is connected to the microwave electrode pair of the multi-functional contact sensor array module 3. One coupling port of the directional coupler is connected to the RF input pin of the double-balanced mixer, and the other coupling port of the directional coupler is connected to the input pin of the logarithmic detector ADL6012. The reference clock output pin of the direct digital frequency synthesizer AD9959 is connected to the local oscillator input pin of the double-balanced mixer. The intermediate frequency output pin of the double-balanced mixer is connected to the analog input channel pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module 6. The output pin of the logarithmic detector ADL6012 is connected to the analog input channel pin of the high-speed analog-to-digital converter ADS54J60.

[0029] The multifunctional contact sensor array module 3 includes a microwave electrode pair, a low-frequency four-wire electrode, and a photoconductive antenna. The microwave electrode pair adopts a coplanar waveguide structure and is connected to the output port of the directional coupler in the multi-band electrical excitation and nonlinear measurement module 2 via a coaxial cable. The low-frequency four-wire electrode is used to connect to the external precision source measurement unit IT2800 via four independent shielded wires. The photoconductive antenna is made of low-temperature grown gallium arsenide material and is connected to the optical output port of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module 4 via an optical fiber.

[0030] The femtosecond laser ultrasonic excitation module 4 includes a femtosecond fiber laser and an optical delay line. The optical output port of the femtosecond fiber laser is connected to the input end of the optical delay line through an optical fiber, and the output end of the optical delay line is connected to the photoconductive antenna in the multifunctional contact sensor array module 3 through an optical fiber.

[0031] The non-contact optical detection module 5 includes a continuous wave laser, an ultrafast photoelectric balanced detector, and a lock-in amplifier. The modulation input of the continuous wave laser is connected to any general-purpose input / output pin of the RFSoC chip XCZU28DR in the main control and digital signal processing module 1. The positive and negative output pins of the ultrafast photoelectric balanced detector are connected to the signal input port of the lock-in amplifier. The reference clock input port of the lock-in amplifier is connected to the synchronization clock output pin of the femtosecond fiber laser. The auxiliary output pin of the lock-in amplifier is connected to the analog input channel three pins of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module 6.

[0032] The ultra-high-speed data acquisition and synchronization module 6 includes a high-speed analog-to-digital converter (ADS54J60). One pin of the ADS54J60's analog input channel is connected to the intermediate frequency output pin of the double-balanced mixer in the multi-band electrically excited and nonlinear measurement module 2. The second pin of the ADS54J60's analog input channel is connected to the output pin of the logarithmic detector ADL6012 in the same module. The third pin of the ADS54J60's analog input channel is connected to the auxiliary output pin of the lock-in amplifier in the non-contact optical detection module 5. The positive and negative pins of the data channel zero to the positive and negative pins of the JESD204B interface of the ADS54J60 are connected to the gigabit transceiver pins of the RFSoC chip XCZU28DR in the digital signal processing module. The positive and negative clock input pins of the ADS54J60 are connected to the output of the clock distributor LMK04828 in the main control and digital signal processing module 1.

[0033] The ball valve ball coating surface inspection system operates by including the following steps: Step S100: The main control and digital signal processing module 1 controls the multi-band electrical excitation and nonlinear measurement module 2 to generate multi-band electrical signals, which are then injected into the object under test via the multi-functional contact sensor array module 3. Simultaneously, the main control and digital signal processing module 1 controls the femtosecond laser ultrasonic excitation module 4 to generate femtosecond laser pulses, which are then excited by the multifunctional contact sensor array module 3 to generate ultrasonic waves. More specifically, Digital control signals and waveform data are generated by the RFSoC chip XCZU28DR in the main control and digital signal processing module 1. The digital signal is converted into an analog sine wave signal by the direct digital frequency synthesizer AD9959 in the multi-band electrical excitation and nonlinear measurement module 2. The analog sine wave signal is amplified using an RF power amplifier; The amplified signal is coupled to the microwave electrode pair in the multifunctional contact sensor array module 3 via a directional coupler. Simultaneously, a synchronous trigger signal is generated by the main control and digital signal processing module 1 and sent to the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module 4. Femtosecond laser pulses are generated using a femtosecond fiber laser. The delay of the femtosecond laser pulse is adjusted by using an optical delay line; The adjusted femtosecond laser pulse is transmitted to the photoconductive antenna in the multifunctional contact sensor array module 3; Step S200: The electrical response signal of the object under test is acquired through the multi-functional contact sensor array module 3 and transmitted to the ultra-high-speed data acquisition and synchronization module 6 through the multi-band electrical excitation and nonlinear measurement module 2; Simultaneously, the ultrasonic optical response signal of the object under test is acquired through the non-contact optical detection module 5 and transmitted to the ultra-high-speed data acquisition and synchronization module 6; More specifically, The electrical reflection signal of the object under test is acquired by the microwave electrode pair in the multifunctional contact sensor array module 3. The electrical reflection signal is extracted through the coupling port of the directional coupler; The extracted signals are transmitted to the RF input of the double-balanced mixer and the input of the logarithmic detector, respectively. The signal is mixed by a double-balanced mixer to obtain an intermediate frequency signal containing nonlinear information. The signal amplitude information is obtained by envelope detection using a logarithmic detector ADL6012. Simultaneously, a detection laser is emitted towards the object under test through the continuous wave detection laser in the non-contact optical detection module 5; The detector light signal reflected by the object under test is received by an ultrafast photoelectric balanced detector; The reflected light signal is demodulated by a lock-in amplifier to obtain the ultrasonic response signal; Step S300: The electrical response signal and the ultrasonic optical response signal are synchronously acquired and digitally processed by the ultra-high speed data acquisition and synchronization module 6, and the processed data is transmitted to the main control and digital signal processing module 1; More specifically, The high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module 6 synchronously acquires nonlinear electrical signals from a double-balanced mixer, signal envelope information from a logarithmic detector ADL6012, and ultrasonic response signals from a lock-in amplifier. The digitized data is transmitted to the RFSoC chip XCZU28DR in the main control and digital signal processing module 1 via the JESD204B interface of the high-speed analog-to-digital converter ADS54J60. Step S400: The nonlinear feature extraction of the digitized electrical response signal is performed by the main control and digital signal processing module 1 to obtain the electrical nonlinear feature parameters; More specifically, The electrical response signal is subjected to a fast Fourier transform to obtain the signal spectrum; Extract the amplitude of the fundamental frequency, the amplitude of the second harmonic frequency, and the amplitude of the third harmonic frequency from the signal spectrum; The total harmonic distortion is calculated as the ratio of the square root of the sum of the squares of the amplitudes of each harmonic to the amplitude of the fundamental wave. When dual-frequency excitation is used, the third-order intermodulation distortion is calculated as the ratio of the average amplitude of the two third-order intermodulation products to the fundamental amplitude, multiplied by a percentage conversion factor. Step S500: The acoustic features of the digitized ultrasonic optical response signal are extracted by the main control and digital signal processing module 1 to obtain acoustic propagation characteristic parameters; More specifically, Measuring the time of flight of an ultrasonic wave over a known distance; Calculate the speed of sound, which is the ratio of the propagation distance to the flight time; The attenuation coefficient of an ultrasonic wave is measured; its value is the ratio of the attenuation of the ultrasonic wave amplitude in decibels to the propagation distance. The acoustic nonlinear parameter is extracted and its value is the ratio of the second harmonic amplitude to the product of the square of the fundamental amplitude, the square of the wave number, and the propagation distance, multiplied by a constant coefficient. Step S600: By fusing electrical nonlinear characteristic parameters and acoustic propagation characteristic parameters through the main control and digital signal processing module 1, the thickness distribution, stress distribution and damage distribution of the intermetallic compound layer at the interface are retrieved through a deep learning algorithm; More specifically, Construct a multimodal eigenvector that includes total harmonic distortion, third-order intermodulation distortion, sound velocity, attenuation coefficient, and acoustic nonlinear parameters; Input the feature vectors into the trained deep neural network model; The thickness distribution, stress distribution, and damage probability distribution of the intermetallic compound layer at the interface were retrieved using deep learning algorithms. Step S700: The inversion results are visualized and output through the main control and digital signal processing module 1; More specifically, The physical parameters obtained from the inversion are interpolated in a gridded manner in two-dimensional space; Generate a pseudo-color image of the thickness distribution of the intermetallic compound layer at the interface; Generate a pseudo-color image of residual stress distribution; Generate a pseudo-color image of the probability distribution of microcrack density; The results are visualized and output through a display device.

[0034] In summary, this ball valve ball coating surface inspection system works to inspect the ball valve ball coating surface. First, the RFSoC chip XCZU28DR in the main control and digital signal processing module 1 acts as the brain of the entire system. It simultaneously sends precisely synchronized digital control signals and waveform data to the multi-band electrical excitation and nonlinear measurement module 2 and the femtosecond laser ultrasonic excitation module 4 through its gigabit transceiver pins and general-purpose input / output pin groups. This ensures that all excitation sources are perfectly aligned in time, thereby simulating the thermal cycling process in actual working conditions.

[0035] Next, the AD9959 direct digital frequency synthesizer in the multi-band electrical excitation and nonlinear measurement module 2 generates multi-band analog sine wave signals from kilohertz to gigahertz based on the received digital signals. After being amplified by the RF power amplifier QPA1013, the signals are transmitted to the microwave electrode pairs of the multi-functional contact sensor array module 3 through the main output port of the directional coupler ZFDC-10-1G. These electrodes form ohmic contact with the surface of the ball valve coating under test, injecting multi-band electrical signals into the coating interface system. At this time, the intermetallic compound layer at the interface will produce different impedance responses to different frequency signals due to its semiconductor properties. In particular, the microcracks formed under alternating thermal stress will lead to obvious nonlinear effects.

[0036] Simultaneously, the coupling port of the directional coupler extracts the reflected electrical signal and transmits it to the RF input of the dual-balanced mixer ADE-R1 and the input of the logarithmic detector ADL6012, respectively. The dual-balanced mixer uses the reference clock output of the direct digital frequency synthesizer chip as the local oscillator reference to perform mixing processing on the reflected signal, generating an intermediate frequency signal containing second harmonics, third harmonics, and intermodulation distortion products. These nonlinear components are extremely sensitive to the thickness variation and micro-defects of the brittle interfacial layer and can effectively characterize the degree of interdiffusion of elements. The logarithmic detector simultaneously extracts the envelope information of the signal, reflecting the overall conductivity variation of the interfacial layer.

[0037] In parallel, the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module 4 generates ultrashort laser pulses with a pulse width of less than 100 femtoseconds after receiving the synchronous trigger signal from the main control module. These pulses are then precisely delayed by an optical delay line and transmitted through an optical fiber to the photoconductive antenna of the multifunctional contact sensor array module 3. The photoconductive antenna generates terahertz ultrasonic pulses with an extremely wide bandwidth under the excitation of the femtosecond laser. When the acoustic wave propagates in the coating, it interacts with the interface IMC layer. When the acoustic wave encounters a stress concentration area or microcrack caused by the mismatch of thermal expansion coefficients, scattering, mode conversion, and nonlinear distortion will occur. These changes in acoustic characteristics directly reflect the cumulative effect of alternating thermal stress.

[0038] Subsequently, the continuous wave detection laser in the non-contact optical detection module 5 emits a stable detection laser towards the same detection point. The ultrafast photoelectric balanced detector Newport 1807-FS detects the reflected light signal modulated by ultrasound with nanometer-level precision. By measuring its Doppler frequency shift and wavefront distortion, it accurately reconstructs the changes in sound velocity, attenuation characteristics, and nonlinear parameters of ultrasound during propagation. The lock-in amplifier uses the synchronous clock output of the femtosecond laser as a reference to coherently demodulate the output signal of the balanced detector, extracting the precise phase and amplitude information of the modulated light signal. The change in sound velocity is directly related to the elastic modulus of the interface layer. The thickening and coarsening of the IMC layer will significantly change the sound velocity. The attenuation coefficient is highly sensitive to microcracks and porosity, while the acoustic nonlinear parameters can effectively capture the microscopic plastic deformation and fatigue damage caused by alternating thermal stress.

[0039] All these analog signals, including the intermediate frequency nonlinear electrical signal from the double-balanced mixer, the envelope signal from the logarithmic detector, and the demodulated ultrasonic signal from the lock-in amplifier, are synchronously transmitted to the ultra-high-speed data acquisition and synchronization module 6. The high-speed analog-to-digital converter ADS54J60 in this module, driven by the ultra-low jitter sampling clock provided by the clock distributor LMK04828, synchronously converts multiple analog signals into digital signals at a rate of gigabits per second, and transmits the high-speed data stream back to the main control and digital signal processing module 1 in real time through the JESD204B interface.

[0040] Ultimately, the FPGA and ARM core integrated within the RFSoC chip XCZU28DR process massive amounts of data in real time. First, it performs a fast Fourier transform on the electrical signals to calculate nonlinear indicators such as total harmonic distortion and third-order intermodulation distortion. These indicators directly reflect the electrical nonlinearity of the interface IMC layer. As the IMC layer thickens and coarsens, the nonlinear distortion will significantly increase.

[0041] For acoustic signals, sound velocity, attenuation coefficient and acoustic nonlinear parameters are extracted through time-frequency analysis. These parameters accurately characterize the degree of mechanical property degradation of the interface layer. The decrease in sound velocity and the increase in attenuation indicate the increase in brittleness of the IMC layer and the propagation of microcracks.

[0042] Finally, a deep learning algorithm is used to fuse electrical nonlinear characteristics and acoustic propagation characteristics into multimodal data, establishing a quantitative mapping relationship between these dynamic responses and the thickness of the interface IMC layer, residual stress distribution, and microcrack density. This generates a high-resolution tomographic image of the interface health status, enabling accurate assessment and prediction of interface failure dynamics throughout the entire thermal cycle.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A ball valve ball coating surface inspection system, characterized in that, The system includes a main control and digital signal processing module (1), a multi-band electrical excitation and nonlinear measurement module (2), a multi-functional contact sensor array module (3), a femtosecond laser ultrasonic excitation module (4), a non-contact optical detection module (5), and an ultra-high-speed data acquisition and synchronization module (6). The output of the main control and digital signal processing module (1) is connected to the input of the multi-band electrical excitation and nonlinear measurement module (2). The excitation output of the multi-band electrical excitation and nonlinear measurement module (2) is connected to the electrical input of the multi-functional contact sensor array module (3). The signal measurement terminal of the multi-band electrical excitation and nonlinear measurement module (2) is connected to the analog input channel of the ultra-high-speed data acquisition and synchronization module (6). The trigger input terminal of the femtosecond laser ultrasonic excitation module (4) is connected to the synchronous trigger output terminal of the main control and digital signal processing module (1). The optical pulse output terminal of the femtosecond laser ultrasonic excitation module (4) is connected to the optical input terminal of the multifunctional contact sensor array module (3). The electrical signal output terminal of the non-contact optical detection module (5) is connected to the analog input channel of the ultra-high speed data acquisition and synchronization module (6). The digital data output terminal of the ultra-high speed data acquisition and synchronization module (6) is connected to the high speed data input terminal of the main control and digital signal processing module (1). The sampling clock input terminal of the ultra-high speed data acquisition and synchronization module (6) is connected to the synchronous clock output terminal of the main control and digital signal processing module (1).

2. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The main control and digital signal processing module (1) includes an RFSoC chip XCZU28DR and a clock distributor LMK04828. The general-purpose input / output pin group of the RFSoC chip XCZU28DR is connected to the serial data input / output pin, serial clock pin, and input / output update pin of the direct digital frequency synthesizer AD9959 in the multi-band electrical excitation and nonlinear measurement module (2). The gigabit transceiver pin of the RFSoC chip XCZU28DR is connected to the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module (6). The JESD204B interface pins are connected, and any general-purpose input / output pin of the RFSoC chip XCZU28DR is connected to the external trigger input pin of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module (4). The reference clock output by the RFSoC chip XCZU28DR is connected to the reference input pin of the clock distributor LMK04828. The output of the clock distributor LMK04828 is connected to the positive clock input pin and the negative clock input pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module (6).

3. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The multi-band electrical excitation and nonlinear measurement module (2) includes a direct digital frequency synthesizer AD9959, an RF power amplifier, a directional coupler, a double-balanced mixer, and a logarithmic detector ADL6012. The output channel pin of the direct digital frequency synthesizer AD9959 is connected to the input pin of the RF power amplifier. The output pin of the RF power amplifier is connected to the input port of the directional coupler. The output port of the directional coupler is connected to the microwave electrode pair of the multifunctional contact sensor array module (3). The coupling port of the directional coupler is connected to the double-balanced mixer. The RF input pin of the mixer, the coupling port of the directional coupler is connected to the input pin of the logarithmic detector ADL6012, the reference clock output pin of the direct digital frequency synthesizer AD9959 is connected to the local oscillator input pin of the dual-balanced mixer, the intermediate frequency output pin of the dual-balanced mixer is connected to the analog input channel pin of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module (6), and the output pin of the logarithmic detector ADL6012 is connected to the analog input channel pin of the high-speed analog-to-digital converter ADS54J60.

4. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The multifunctional contact sensor array module (3) includes a microwave electrode pair, a low-frequency four-wire electrode and a photoconductive antenna. The microwave electrode pair adopts a coplanar waveguide structure. The microwave electrode pair is connected to the output port of the directional coupler in the multi-band electrical excitation and nonlinear measurement module (2) through a coaxial cable. The low-frequency four-wire electrode is used to connect to the external precision source measurement unit IT2800 through four independent shielded wires. The photoconductive antenna adopts low-temperature grown gallium arsenide material. The photoconductive antenna is connected to the optical output port of the femtosecond fiber laser in the femtosecond laser ultrasonic excitation module (4) through an optical fiber.

5. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The femtosecond laser ultrasonic excitation module (4) includes a femtosecond fiber laser and an optical delay line. The optical output port of the femtosecond fiber laser is connected to the input end of the optical delay line through an optical fiber. The output end of the optical delay line is connected to the photoconductive antenna in the multifunctional contact sensor array module (3) through an optical fiber.

6. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The non-contact optical detection module (5) includes a continuous wave detection laser, an ultrafast photoelectric balanced detector, and a lock-in amplifier. The modulation input terminal of the continuous wave detection laser is connected to any general-purpose input / output pin of the RFSoC chip XCZU28DR in the main control and digital signal processing module (1). The positive and negative output pins of the ultrafast photoelectric balanced detector are connected to the signal input port of the lock-in amplifier. The reference clock input port of the lock-in amplifier is connected to the synchronization clock output pin of the femtosecond fiber laser. The auxiliary output pin of the lock-in amplifier is connected to the analog input channel three pins of the high-speed analog-to-digital converter ADS54J60 in the ultra-high-speed data acquisition and synchronization module (6).

7. The ball valve ball coating surface inspection system according to claim 1, characterized in that, The ultra-high-speed data acquisition and synchronization module (6) includes a high-speed analog-to-digital converter (ADS54J60). One pin of the analog input channel of the ADS54J60 is connected to the intermediate frequency output pin of the double-balanced mixer in the multi-band electrically excited and nonlinear measurement module (2). The other pin of the analog input channel of the ADS54J60 is connected to the output pin of the logarithmic detector ADL6012 in the multi-band electrically excited and nonlinear measurement module (2). The analog input channel of the ADS54J60... The three pins are connected to the auxiliary output pins of the lock-in amplifier in the non-contact optical detection module (5). The positive and negative pins of the data channel zero to the positive and negative pins of the JESD204B interface of the high-speed analog-to-digital converter ADS54J60 are connected to the gigabit transceiver pins of the RFSoC chip XCZU28DR in the digital signal processing module. The positive clock input pin and the negative clock input pin of the high-speed analog-to-digital converter ADS54J60 are connected to the output of the clock distributor LMK04828 in the main control and digital signal processing module (1).

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