Dynamic presintering test system and dynamic presintering test method
By using a dynamic burn-in test system and method, temperature and power parameters are dynamically adjusted based on simulation test results, solving the problem that existing burn-in test architectures cannot perform personalized testing, improving the testing efficiency and accuracy of semiconductor products, and reducing the risk of failure.
Patent Information
- Application Number
- CN202410622498.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-11-21
AI Technical Summary
Existing burn-in testing architectures cannot perform the most appropriate burn-in tests based on the specifications or state of the device under test, resulting in the inability to effectively screen out semiconductor products with potential failures or malfunctions.
A dynamic pre-burn-in test system is adopted, including a pre-burn-in board, a signal generation module, and a dynamic adjustment module. The signal generation module generates dynamic test parameters based on the simulation test results, and the dynamic adjustment module, in conjunction with the signal generation module, modulates the pre-burn-in board to perform dynamic pre-burn-in tests. The dynamic adjustment module includes a power supply module, a pre-burn-in temperature distribution module, and a pre-burn-in power distribution module, which adjust the temperature and power parameters respectively to accommodate unqualified test objects.
It enables personalized pre-burn-in testing based on the specific state and specifications of the device under test, improving testing efficiency and accuracy, screening out semiconductor products with potential failures or malfunctions, and reducing the failure risk for end customers.
Smart Images
Figure CN120993150A_ABST
Abstract
Description
Technical Field
[0001] This application relates to semiconductor testing systems and methods, and in particular to a pre-burn-in testing system and method. Background Technology
[0002] Burn-in testing is primarily used to screen semiconductor products for potential failures or malfunctions caused by process defects or design flaws. By subjecting the chip to harsh environmental conditions (high temperature or temperature difference, high current, high voltage, etc.), burn-in testing detects whether the chip exhibits defects or failures due to external environmental changes, preventing malfunctions during product use by end customers. However, in typical burn-in testing architectures, to improve testing efficiency, at least two devices under test (DUTs) are usually tested simultaneously on a single burn-in board. However, the burn-in parameters for different DUTs on the same board are identical. This means that current burn-in testing architectures cannot provide the most appropriate burn-in test for a specific DUT based on its specifications or condition, and therefore require improvement. Summary of the Invention
[0003] This application provides a dynamic burn-in test system, including at least one burn-in board, at least one signal generation module, and a dynamic adjustment module. The burn-in board is electrically connected to at least two devices under test (DUTs). The signal generation module is electrically connected to the burn-in board and is used to control the DUTs to undergo testing, and in response to the test results of the DUTs, to determine that at least one DUT is unqualified; it is also adapted to transmit simulated test data to the unqualified DUTs, and control the unqualified DUTs to execute the simulated test data to generate simulated test results; and in response to the simulated test results, to generate dynamic test parameters. The dynamic adjustment module is electrically connected to the signal generation module and the burn-in board, and is adapted to receive dynamic test parameters from the signal generation module and, in coordination with the signal generation module, modulate the burn-in board to perform dynamic burn-in testing on the unqualified DUTs using the dynamic test parameters.
[0004] In some embodiments, the aforementioned pre-burning board includes a substrate, test sockets, a temperature control module, and a power control module. The test sockets are electrically connected to the substrate. The temperature control module is electrically connected to the substrate and is controlled by the dynamic adjustment module to adjust the temperature of each test socket. The power control module is electrically connected to the substrate and is controlled by the dynamic adjustment module to adjust the voltage value output to each test socket.
[0005] In some embodiments, the aforementioned power control module provides power with a reduced voltage value and an increased current value to each test socket.
[0006] In some embodiments, the aforementioned dynamic adjustment module includes a power supply module, a pre-burning temperature distribution module, and a pre-burning power distribution module that are electrically connected to each other. The power supply module is used to supply power to the pre-burning board, the pre-burning temperature distribution module is used to transmit a test temperature control signal to the temperature control module according to the dynamic test parameters to adjust the temperature of each test socket, and the pre-burning power distribution module is used to transmit a test power control signal to the power control module according to the dynamic test parameters to adjust the voltage value output to each test socket.
[0007] In some embodiments, the aforementioned signal generation module includes a storage module and a processor electrically connected to each other. The storage module stores a lookup table, which includes at least two test results and at least two grouped test parameters. The signal generation module is adapted to find one of the corresponding at least two test results from the lookup table based on the simulated test results, and output one of the corresponding at least two grouped test parameters as a dynamic test parameter.
[0008] In some embodiments, the aforementioned processor is a monolithic system, a field-programmable gate array (FPGA) chip, or a high-performance computing chip.
[0009] In some embodiments, the aforementioned test object includes at least two processing cores, each processing core including at least one temperature sensing circuit; when the aforementioned unqualified test object performs simulated test data, the signal generation module reads the sensing value of the temperature sensing circuit as the simulated test result.
[0010] In some embodiments, the number of the aforementioned temperature control modules corresponds to the number of test sockets, and the number of power control modules corresponds to the number of test sockets. Each test socket is electrically connected to a temperature control module and a power control module.
[0011] In some embodiments, the dynamic burn-in test system further includes a hub and a computing host; the number of burn-in boards is at least two, and the number of signal generation modules is at least two; each burn-in board is electrically connected to each signal generation module, and each signal generation module is electrically connected to the computing host through the hub.
[0012] A dynamic pre-burn-in test method, suitable for testing at least two devices under test (DUTs) on a pre-burn-in board, includes the following steps: A signal generation module controls each DUT to be tested; and in response to the test results of each DUT, at least one DUT is determined to be non-compliant. The signal generation module transmits simulated test data to the non-compliant DUT and controls the non-compliant DUT to execute the simulated test data to generate simulated test results. The signal generation module generates dynamic test parameters in response to the simulated test results and transmits them to a dynamic adjustment module. The dynamic adjustment module, in conjunction with the signal generation module, modulates the pre-burn-in board to perform dynamic pre-burn-in testing on the non-compliant DUT using the dynamic test parameters.
[0013] In some embodiments, the aforementioned signal generation module controls each device under test to perform functional tests.
[0014] In some embodiments, the aforementioned simulation test results include at least one of voltage change values, current change values, and temperature change values.
[0015] In some embodiments, the aforementioned dynamic test parameters include at least one of a specific voltage value and a specific current value of the unqualified test object, and controlling the temperature of the unqualified test object to reach a specific temperature value.
[0016] In some embodiments, the aforementioned signal generation module generates dynamic test parameters from a lookup table based on the simulation test results.
[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0019] Figure 1 This is a system block diagram of an embodiment of the dynamic pre-burn-in test system of this application.
[0020] Figure 2 This is a flowchart illustrating the steps of an embodiment of the dynamic pre-burn-in test method of this application.
[0021] Figure 3 This is a system block diagram of another embodiment of the dynamic pre-burn-in test system of this application.
[0022] Figure 4 This is a schematic diagram of the architecture of the signal generation module of the dynamic pre-burn-in test system of this application.
[0023] Figure 5 This is a schematic diagram of the architecture of another embodiment of the signal generation module of the dynamic pre-burn-in test system of this application.
[0024] Figure 6 This is a schematic diagram illustrating the execution logic of the pre-burn-in test method in the dynamic pre-burn-in test system of this application.
[0025] Figure 7 This is a flowchart illustrating the process of switching the pre-burn-in test model in the dynamic pre-burn-in test method of this application.
[0026] Figure 8 This is a schematic diagram of the architecture of a pre-burning board in the dynamic pre-burning system of this application.
[0027] Figure 9 This is a flowchart illustrating the process of adjusting the power parameters in the dynamic pre-burning test method of this application.
[0028] Figure 10 This is a flowchart illustrating the process of adjusting the test temperature parameters in the dynamic pre-burning test method of this application.
[0029] Figure 11 This is a schematic diagram of another embodiment of the burn-in board in the dynamic burn-in test system of this application.
[0030] Figure 12 This is a schematic diagram of the architecture of an embodiment of the test object in the dynamic pre-burn-in test system of this application.
[0031] Figure 13 This is a schematic diagram of the architecture of another embodiment of the dynamic pre-burn-in test system of this application.
[0032] Explanation of reference numerals in the attached figures:
[0033] 10: Pre-fired plate;
[0034] 11: Substrate;
[0035] 12: Test socket;
[0036] 13: Power control module;
[0037] 14: Temperature control module;
[0038] 20: Signal generation module;
[0039] 21: Processor;
[0040] 22: Storage module;
[0041] 30: Dynamic adjustment module;
[0042] 31: Power supply module;
[0043] 32: Pre-burned power distribution module;
[0044] 33: Pre-burning temperature distribution module;
[0045] 40: Hub;
[0046] 50: Computing host;
[0047] 60: Pre-burn-in main unit;
[0048] C: Processing core;
[0049] C1: Temperature sensing circuit;
[0050] D: The test sample;
[0051] M1: First unit;
[0052] M2: Second unit;
[0053] S01~S04: Steps. Detailed Implementation
[0054] See Figure 1 This application provides a dynamic burn-in test system, including a burn-in board 10, a signal generation module 20, and a dynamic adjustment module 30. The signal generation module 20 and the dynamic adjustment module 30 work together based on the simulated test results of the device under test (DUT) D to dynamically burn-in at least one non-conforming DUT D on the burn-in board 10.
[0055] See Figure 1 and cooperate Figure 2 The pre-burn-in board 10 is adapted to be electrically connected to at least two test objects D. The signal generation module 20 is electrically connected to the pre-burn-in board 10 to control the test objects D to perform tests, and in response to the test results of the test objects D, to determine that at least one of the test objects D is unqualified; it is also adapted to transmit simulated test data to the unqualified test objects D, and control the unqualified test objects D to execute the simulated test data to generate simulated test results; and in response to the simulated test results, to generate dynamic test parameters. The dynamic adjustment module 30 is electrically connected to the signal generation module 20 and the pre-burn-in board 10, and is adapted to receive dynamic test parameters from the signal generation module 20, and, in coordination with the signal generation module, modulate the pre-burn-in board 10 to perform dynamic pre-burn-in tests on the unqualified test objects D using the dynamic test parameters.
[0056] See Figure 1 and Figure 2 Based on the aforementioned dynamic pre-burn-in test system, this application further provides a dynamic pre-burn-in test method, comprising:
[0057] Step S01: The signal generation module 20 controls the test object D to perform a test; and in response to the test result of the test object D, at least one of the test objects D is determined to be unqualified; in some embodiments, the signal generation module 20 controls the test object D to perform a functional test in order to classify the test object D according to the functional test result.
[0058] Step S02: The signal generation module 20 transmits the simulated test data to the unqualified test object D, and controls the unqualified test object D to execute the simulated test data to generate simulated test results;
[0059] Step S03: The signal generation module 20 generates dynamic test parameters in response to the simulation test results and transmits them to the dynamic adjustment module 30; and
[0060] Step S04: The dynamic adjustment module 30, in coordination with the signal generation module 20, modulates the unqualified test object D to meet the dynamic test parameters for dynamic pre-burning test.
[0061] The device under test (DUT) D is a semiconductor device. In some embodiments, the DUT in the dynamic burn-in test system and dynamic burn-in test method of this application is a high-performance computing (HPC) chip. In some embodiments where the DUT is an HPC chip, the DUT may be, but is not limited to, a CPU (Central Processing Unit) chip, a power accelerator chip (e.g., a GPU (Graphics Processing Unit) chip, a GPGPU (General-Purpose Computing on Graphics Processing Units) chip, an FPGA (Field Programmable Gate Array) chip, a DSP (Digital Signal Processing) chip, a TPU (Tensor Processing Unit) chip, an AI (Artificial Intelligence) chip, other suitable power accelerator chips or combinations thereof), a memory chip (e.g., a high-bandwidth memory (HBM) chip, a graphics double-data-rate (GDDR) memory chip, other suitable memory chips or combinations thereof), an I / O chip, a communication chip, and a power management chip.
[0062] See Figure 1 and cooperate Figure 3 In some embodiments, the pre-burning plate 10 includes a substrate 11 and at least two test sockets 12, which are electrically connected to the substrate 11 and used to electrically connect the test object D for dynamic pre-burning testing.
[0063] See Figure 3In some embodiments, the signal generation module 20 includes a processor 21 and a storage module 22 electrically connected to each other. The processor 21 performs various processes required by the signal generation module 20. In some embodiments, the processor 21 may be, but is not limited to, a system-on-a-chip (SoC), a field-programmable gate array (FPGA) chip, or a high-performance computing (HPC) chip.
[0064] In some embodiments where the processor 21 of the signal generation module 20 is a single-chip system (SOC), see [reference]. Figure 4 The single-chip system acts as the processor 21 and is integrated with the storage module 22 into a single-chip signal generation module 20. In some embodiments where the processor 21 of the signal generation module 20 is a field-programmable gate array (FPGA), see [reference needed]. Figure 5 The field-editable gate array chip includes a first field-editable gate array chip (FPGA1) and a second field-editable gate array chip (FPGA2). The first field-editable gate array chip (FPGA1) serves as a processor 21, and the second field-editable gate array chip (FPGA2) and the storage module 22 constitute a test data processing module. The test data processing module is electrically connected to the processor 21 to form a signal generation module 20.
[0065] Storage module 22 stores test data, which is the data that the device under test (D) can execute. That is, the test data will be different when the data that the D can process is different. In some embodiments, the test data may be, but is not limited to, image files, text files, audio and video files, applications, or various files or data that the D can execute.
[0066] In some embodiments, the test data includes simulated test data and a pre-burn-in test model. The simulated test data is the data executed when the test object D performs a simulated test, while the pre-burn-in test model is the test data executed during a dynamic pre-burn-in test. That is, the simulated test data is determined based on the results of the test object D after step S01, while the pre-burn-in test model is determined based on the dynamic test parameters.
[0067] In these embodiments, the storage module 22 can pre-store various simulation test data and pre-burn-in test models to be suitable for simulation testing and dynamic pre-burn-in testing of various different test objects D. Specifically, the simulation test data may be, but is not limited to, image files, text files, audio and video files, application programs, and other files or data that the test object D can execute.
[0068] In some embodiments, the storage module 22 may be any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory, hard disk drive (HDD), solid state drive (SSD), or similar components or combinations thereof.
[0069] See Figures 1 to 3 and Figure 6 The execution logic of the dynamic pre-burn-in test method of this application is to perform a simulated test when the test subject D is determined to be unqualified in step S01. In some embodiments, in step S01, the signal generation module 20 determines that the test subject D is unqualified based on the results of the functional test, and the basis for the determination is determined by the signal generation module 20. In some embodiments, the determination method for determining that the test subject D is unqualified may be a condition such as the functional test result being greater than, less than, or not equal to a specific parameter. Since the specific parameter value can be adjusted according to the severity of the test, the functional test result being greater than, less than, or equal to a specific parameter can all be set as the basis for determining unqualification, such as the data processing time exceeding a predetermined specific time. In some embodiments, the functional test result may be, but is not limited to, the number of functions that the test subject D passes / fails in multiple functional tests.
[0070] See Figures 1 to 3 and Figure 6 In step S02, the processor 21 of the signal generation module 20 accesses the simulated test data in the storage module 22 based on the test result of the test object D in step S01, and then transmits the simulated test data corresponding to the test object D to the test object D for simulated testing. In some embodiments, steps S01 and S02 can be performed directly in the pre-burn-in equipment, and the test environment when performing step S02 (simulated test) can be the same as when performing step S01. In other embodiments, the environmental parameters when performing step S01 can be canceled, for example, high temperature can be canceled, and step S02 can be performed at room temperature.
[0071] Furthermore, after the device under test (DUT) D generates simulated test results, the processor 21 of the signal generation module 20 receives the simulated test results and generates dynamic test parameters based on the simulated test results. In some embodiments, the simulated test results include at least one of voltage change values, current change values, and temperature change values. In other embodiments, the simulated test results may also be the time consumed by the DUT D to process test data, thermal design power, clock rate, or other parameters sufficient to identify the function or performance of the DUT D.
[0072] The dynamic adjustment module 30 adjusts the dynamic pre-burning test parameters for each unqualified test object D on the pre-burning plate 10 according to the dynamic test parameters. (See reference...) Figure 6 In some embodiments, the dynamic pre-burn-in test parameters include a pre-burn-in test pattern, test power parameters, and test temperature parameters. In these embodiments, the pre-burn-in test pattern refers to the test content of the dynamic pre-burn-in test, such as test items, test methods, and judgment criteria. In some embodiments, the pre-burn-in test patterns in steps S01 and S04 may be the same; in other embodiments, the pre-burn-in test patterns in steps S01 and S04 may be different, for example, omitting certain specific test items or adjusting the judgment benchmark values of certain test items. The test power parameters are specific voltage and current values input to the unqualified test object D for dynamic pre-burn-in; the test temperature parameters are specific test temperatures for the unqualified test object D during dynamic pre-burn-in. That is, in these embodiments, in step S04, the dynamic adjustment module 30, in coordination with the signal generation module 20, modulates the pre-burn-in board 10 by modifying the pre-burn-in test pattern, test power parameters, and test temperature parameters input to the unqualified test object D to perform the dynamic pre-burn-in test.
[0073] In some embodiments, the specific method for pre-burning test model of analyte D with unqualified modulation input is as follows: Figure 7 As shown, after the signal generation module 20 generates dynamic pre-burning test parameters in response to the simulation test results of the test object D, the signal generation module 20 transmits the pre-burning test model in the generated dynamic pre-burning test parameters to the test seat 12 of the unqualified test object D on the pre-burning plate 10.
[0074] See Figure 2 and Figure 3In some embodiments, the dynamic adjustment module 30 includes a power supply module 31, a pre-burning power distribution module 32, and a pre-burning temperature distribution module 33, which are electrically connected to each other. In some embodiments, the power supply module 31 includes an AC-to-DC converter for receiving AC power and converting it into DC power for output. In these embodiments, in step S04, the dynamic adjustment module 30 sends a test power control signal to the pre-burning board 10 according to the dynamic pre-burning test parameters through the pre-burning power distribution module 32, and sends a test temperature control signal to the pre-burning board 10 according to the dynamic pre-burning test parameters through the pre-burning temperature distribution module 33.
[0075] See Figure 8 In some embodiments, the pre-burning board 10 further includes a power control module 13. The power control module 13 is electrically connected to the substrate 11, and adjusts the voltage value output to each test socket 12 according to the control of the pre-burning power distribution module 32 from the dynamic adjustment module 30. In some embodiments, the power control module 13 is a DC-to-DC converter, and the power supply module 31 of the dynamic adjustment module 30 provides power to the power control module 13. In these embodiments, in step S04, the dynamic adjustment module 30 modulates the test power parameters of the pre-burning board 10 in the following specific manner: Figure 9 As shown, after the signal generation module 20 generates dynamic pre-burning test parameters including test power parameters in response to the simulation test results of the test object D, the signal generation module 20 sends the test power parameters to the power control module 13 of the pre-burning board 10 via the pre-burning power distribution module 32. The power control module 13 of the pre-burning board 10 can then provide corresponding power to the test socket 12 according to the test power control signal from the pre-burning power distribution module 32.
[0076] In some embodiments where the power supply module 31 includes an AC-to-DC converter and the power control module 13 is a DC-to-DC converter, the power supplied by the power supply module 31 has a first voltage value and a first current value. After receiving the power supplied by the power supply module 31, the power control module 13 reduces the first voltage value and simultaneously increases the first current value. In this way, the defective test object D in the test socket 12 can undergo dynamic pre-burn-in testing with the reduced voltage value and the increased current value.
[0077] Therefore, the power supply module 31 only needs to provide normal voltage and normal current values to the pre-burning board 10. The power control module 13 on the pre-burning board 10 can provide power with reduced voltage and increased current values to the test socket 12. The power supply module 31 does not need to use high current specifications as the number of test objects D increases.
[0078] See Figure 8In some embodiments, the pre-burning plate 10 further includes a temperature control module 14, which is electrically connected to the substrate 11. In these embodiments, during step S04, the temperature control module 14 of the pre-burning plate 10 can control and adjust the temperature of each test socket 12, i.e., the pre-burning test temperature, according to the temperature control signal from the pre-burning temperature distribution module 33 of the dynamic adjustment module 30.
[0079] In some embodiments, during step S04, the specific method by which the dynamic adjustment module 30 modulates the test temperature parameter of the preheating plate 10 is as follows: Figure 10 As shown, after the signal generation module 20 generates dynamic pre-burning test parameters including test temperature parameters in response to the simulated test results of the test object D, the signal generation module 20 sends the test temperature parameters to the temperature control module 14 of the pre-burning plate 10 via the pre-burning temperature distribution module 33. The temperature control module 14 of the pre-burning plate 10 can then change the test temperature of the test holder 12 according to the test temperature control signal from the pre-burning temperature distribution module 33.
[0080] In some embodiments, the temperature control module 14 may be a heater or a cooler. In these embodiments, the temperature control module 14 is located at the position corresponding to each test socket 12, but this application is not limited thereto.
[0081] See Figure 8 and Figure 11 In some embodiments where the pre-burning plate 10 includes a power control module 13, the number of power control modules 13 may be, but is not limited to, one or at least two. When the number of power control modules 13 is one (e.g....), Figure 8 The power control module 13 is electrically connected to each test socket 12 on the pre-burning board 10, and controls the power parameters of each test socket 12 through one power control module 13. When the number of power control modules 13 is at least two (e.g., Figure 11 The number of power control modules 13 is the same as the number of test sockets 12. Each power control module 13 is electrically connected to one test socket 12, and the power parameters of each test socket 12 are controlled by a separate power control module 13.
[0082] See Figure 8 and Figure 11 In some embodiments where the preheating plate 10 includes a temperature control module 14, the number of temperature control modules 14 may be, but is not limited to, one or at least two. When the number of temperature control modules 14 is one (e.g....), Figure 8 The temperature control module 14 is electrically connected to each test socket 12 on the pre-burning plate 10, and controls the temperature parameters of each test socket 12 through one temperature control module 14. When the number of temperature control modules 14 is at least two (e.g., Figure 11The number of temperature control modules 14 is the same as the number of test sockets 12. Each temperature control module 14 is electrically connected to one test socket 12, and the temperature parameters of each test socket 12 are controlled by a separate temperature control module 14.
[0083] In some embodiments, the signal generation module 20 generates dynamic test parameters based on the simulation test results by generating dynamic test parameters from a lookup table. In these embodiments, the storage module 22 stores a lookup table, which includes at least two test results and at least two grouped test parameters corresponding to each test result.
[0084] In these embodiments, the processor 21 of the signal generation module 20 compares the simulated test results with a lookup table to obtain the corresponding test results, then compares the test results to obtain the corresponding grouped test parameters, and finally outputs the obtained grouped test parameters to the dynamic adjustment module 30 as dynamic test parameters.
[0085] In some embodiments, the relationship between test results and grouped test parameters in the lookup table may include, but is not limited to, one simulated test result corresponding to one grouped test parameter, one simulated test result corresponding to at least two grouped test parameters, at least two simulated test results corresponding to one grouped test parameter, or at least two simulated test results corresponding to at least two grouped test parameters.
[0086] Specifically, an example where one simulated test result corresponds to one grouped test parameter can be: when the voltage change value (simulated test result) meets a predetermined value (test result), the grouped test parameter is the test voltage parameter modulated and input to test socket 12; an example where one simulated test result corresponds to at least two grouped test parameters can be: when the voltage change value (simulated test result) meets a predetermined value (test result), the grouped test parameter is the pre-burn-in test model input to test socket 12 and the test voltage parameter modulated and input to test socket 12 simultaneously; at least two simulated test results correspond to one group. Examples of grouped test parameters could be: when both the voltage change value (simulated test result) and the temperature change value (simulated test result) meet predetermined values (test results), the grouped test parameters are the pre-burn-in test model whose input is switched to test socket 12; examples of at least two simulated test results corresponding to at least two grouped test parameters could be: when both the voltage change value (simulated test result) and the current change value (simulated test result) meet predetermined values (test results), the grouped test parameters are the pre-burn-in test model whose input is switched to test socket 12 and the test temperature parameter whose input is switched to test socket 12. However, the above test results and grouped test parameter settings are merely illustrative examples, and this application is not limited thereto.
[0087] In some embodiments, the storage module 22 stores at least two lookup tables, and each lookup table may, but is not limited to, correspond to different test objects D, different simulated test data, or different groups of simulated test data.
[0088] In some embodiments where each lookup table corresponds to a different test object D, the lookup table will be different when the type or specification of the test object D is different. As a result, when the test object D changes, the test results in the lookup table and the corresponding grouped test parameters will also change accordingly.
[0089] In some embodiments where the lookup table corresponds to different simulated test data, the lookup table will be different when the simulated test data performed on the test object D is different; thus, when the simulated test data performed on the test object D changes, the test results in the lookup table and the corresponding grouped test parameters will also change accordingly.
[0090] In some embodiments where the lookup table corresponds to different simulated test data groups, the lookup table will differ when the simulated test data performed by the test object D belongs to different simulated test data groups that include at least two simulated test data groups. Thus, when the simulated test data performed by the test object D belongs to different simulated test data groups, the test results in the lookup table and the corresponding grouped test parameters will also change accordingly. However, the above lookup table settings are merely illustrative and are not intended to limit the scope of this application.
[0091] It is worth noting that the means by which the signal generation module 20 generates dynamic test parameters based on the simulation test results are not limited to generating them through a lookup table as exemplified in the above embodiments. In some other embodiments, the signal generation module 20 can also calculate the dynamic test parameters according to a specific formula.
[0092] In some embodiments, the temperature change value of the simulated test result may be, but is not limited to, the surface temperature (Tc: Case Temperature), junction temperature (Tj: Junction Temperature) or working core temperature of the test object D, depending on the test object D.
[0093] The surface temperature of the object D is the temperature of the outer shell surface of the object D, which can be sensed by setting a surface temperature sensor on the surface of the object D.
[0094] The junction temperature of the test object D is the actual operating temperature of the test object D. It can be calculated based on the sensed ambient temperature (Ta) and the known thermal resistance (θj-a) and power consumption (P[W]) of the test object according to the formula for calculating the junction temperature (Tj=Ta+θj-a×P[W]).
[0095] Overall, unlike related technologies that directly discard unqualified test objects D after step S01, in some embodiments, unqualified test objects D can be subjected to a simulation test as in step S02 again. Based on the simulation test results of each unqualified test object D, the dynamic test parameters for re-firing are adjusted, and re-firing is performed. The scope of the dynamic test parameters includes, but is not limited to, dynamically calculating the upper limit of the test power supply, dynamically adjusting the power supply and protection range, providing test programs, output status, temperature and voltage, automatically switching the hottest zone, and automatic temperature control of the surface temperature, interface temperature, or core temperature of the test object D.
[0096] The operating core temperature of the analyte D is the actual operating temperature of each processing core C of the analyte D, which includes at least two processing cores C. (See also...) Figure 3 and Figure 12 In these embodiments, the device under test (DUT) D includes at least two processing cores C, and each processing core C includes at least one temperature sensing circuit C1. When the DUT executes simulated test data, the signal generation module 20 reads the temperature sensing values of the temperature sensing circuits C1 of each processing core C of the DUT as the simulated test result. Therefore, when the DUT includes at least two processing cores C and executes highly complex simulated test data, the signal generation module 20 can directly read the operating core temperature of each processing core C, improving the accuracy of temperature judgment and the accuracy of subsequent dynamic modulation.
[0097] Next, the processor 21 of the signal generation module 20 generates dynamic test parameters for each processing core C of the test object D based on the simulation test results. The dynamic adjustment module 30 then modulates the dynamic pre-burn-in test parameters for each processing core C of each unqualified test object D on the pre-burn-in board 10 based on the dynamic test parameters. These parameters include, but are not limited to, appropriate test voltage and temperature for each processing core C to prevent overheating during pre-burn-in. In other words, in these embodiments, the respective test parameters (e.g., voltage and temperature) can also be dynamically adjusted based on the simulation test results of each processing core C on each test object D.
[0098] See Figure 13In some embodiments, the dynamic pre-burn-in test system further includes a hub 40, a computing host 50, and a pre-burn-in host 60. In these embodiments, the number of signal generation modules 20 is at least two, and each signal generation module 20 is electrically connected to the computing host 50 via the hub 40 to form a computing system. The dynamic adjustment module 30 is electrically connected to the pre-burn-in host 60 to form the pre-burn-in test system. The computing system and the pre-burn-in test system are electrically connected and are adapted to pre-burn-in at least two pre-burn-in boards 10. Here, the number of pre-burn-in boards 10 is at least two, and each pre-burn-in board 10 is electrically connected to a signal generation module 20, thereby enabling the computing system and the pre-burn-in test system to perform dynamic pre-burn-in on at least two pre-burn-in boards 10 through collaborative computation.
[0099] See Figure 13 In some embodiments, the dynamic pre-burn-in test system can be integrated into a single hardware architecture. For example, the computing system is integrated into the first body M1, while the pre-burn-in test system is integrated into the second body M2 and set on the first body M1 of the computing system. In this way, the connection line between the computing system and the pre-burn-in test system is shortened as much as possible to better meet the operating environment of high-speed transmission and high-speed computing.
Claims
1. A dynamic pre-burn-in test system, characterized in that, include: At least one pre-burnt plate, suitable for electrically connecting at least two test objects; At least one signal generation module is electrically connected to the at least one burn-in board for controlling the at least two test objects to perform tests, and determining at least one of the at least two test objects to be unqualified in response to the test results of the at least two test objects; and is adapted to transmit simulated test data to the at least one unqualified test object, and control the at least one unqualified test object to execute the simulated test data to generate simulated test results; And in response to the results of the simulation test, dynamic test parameters are generated; as well as A dynamic adjustment module is electrically connected to the at least one signal generation module and the at least one pre-burning board. It is adapted to receive the dynamic test parameters from the at least one signal generation module and coordinate with the signal generation module to modulate the at least one pre-burning board to perform dynamic pre-burning test on the at least one unqualified test object with the dynamic test parameters.
2. The dynamic pre-burn-in test system according to claim 1, characterized in that, The at least one pre-fired plate includes: substrate; At least two test sockets are electrically connected to the substrate; A temperature control module is electrically connected to the substrate; the temperature control module is controlled by the dynamic adjustment module to adjust the temperature of each test socket; and A power control module is electrically connected to the base plate; the power control module is controlled by the dynamic adjustment module to adjust the voltage value output to each of the test sockets.
3. The dynamic pre-burn-in test system according to claim 2, characterized in that, The power control module supplies power with reduced voltage and increased current to each of the test sockets.
4. The dynamic pre-burn-in test system according to claim 2, characterized in that, The dynamic adjustment module includes a power supply module, a pre-burning temperature distribution module, and a pre-burning power distribution module that are electrically connected to each other. The power supply module is used to supply power to the at least one pre-burning board. The pre-burning temperature distribution module is used to transmit a test temperature control signal to the temperature control module according to the dynamic test parameters to adjust the temperature of each test socket. The pre-burning power distribution module is used to transmit a test power control signal to the power control module according to the dynamic test parameters to adjust the voltage value output to each test socket.
5. The dynamic pre-burn-in test system according to claim 1, characterized in that, The at least one signal generation module includes a storage module and a processor electrically connected to each other. The storage module stores a lookup table, which includes at least two test results and at least two grouped test parameters. The at least one signal generation module is adapted to find one of the corresponding at least two test results from the lookup table based on the simulated test results, and output one of the corresponding at least two grouped test parameters as the dynamic test parameter.
6. The dynamic pre-burn-in test system according to claim 5, characterized in that, The processor can be a monolithic system, a field-programmable gate array (FPGA) chip, or a high-performance computing chip.
7. The dynamic pre-burn-in test system according to claim 1, characterized in that, The test object includes at least two processing cores, each of which includes at least one temperature sensing circuit; when the at least one defective test object executes the simulated test data, the at least one signal generation module reads the sensing value of the at least one temperature sensing circuit as the simulated test result.
8. The dynamic pre-burn-in test system according to claim 2, characterized in that, The number of temperature control modules corresponds to the number of at least two test sockets, and the number of power control modules corresponds to the number of at least two test sockets. Each test socket is electrically connected to one temperature control module and one power control module.
9. The dynamic pre-burn-in test system according to claim 1, characterized in that, It also includes a hub and a computing host; the at least one pre-burning board is at least two pre-burning boards, and the at least one signal generation module is at least two signal generation modules; the at least two pre-burning boards are electrically connected to the at least two signal generation modules respectively, and the at least two signal generation modules are electrically connected to the computing host through the hub.
10. A dynamic pre-burn-in test method, characterized in that, The dynamic pre-burn-in test method is suitable for testing at least two test objects on a pre-burn-in plate, and includes: The signal generation module controls the testing of at least two test objects; and in response to the test results of the at least two test objects, at least one of the at least two test objects is determined to be a non-conforming test object; The signal generation module transmits simulated test data to the at least one non-conforming test object and controls the at least one non-conforming test object to execute the simulated test data to generate simulated test results; The signal generation module generates dynamic test parameters in response to the simulation test results and transmits them to the dynamic adjustment module; and The dynamic adjustment module, in conjunction with the signal generation module, modulates the pre-burning plate to perform a pre-burning test on at least one non-conforming test object using the dynamic test parameters.
11. The dynamic pre-burn-in test method according to claim 10, characterized in that, The signal generation module controls the functional testing of at least two devices under test.
12. The dynamic pre-burn-in test method according to claim 10, characterized in that, The simulation test results include at least one of the voltage change, current change, and temperature change values.
13. The dynamic pre-burn-in test method according to claim 10, characterized in that, The dynamic test parameters include inputting at least one of a specific voltage value and a specific current value of the at least one non-conforming test object, and controlling the temperature of the at least one non-conforming test object to reach a specific temperature value.
14. The dynamic pre-burning test method according to claim 10, characterized in that, The signal generation module generates the dynamic test parameters from a lookup table based on the simulation test results.