Converted wave static correction method and device for seismic data

Abstract

The invention provides a converted wave static correction method and device for seismic data. The converted wave static correction method comprises the steps that a detection point file, a shot point file and a relation file of the seismic data in a target work area are acquired; obtaining longitudinal wave surface velocity and depth data and transverse wave surface velocity and depth data, and determining a reference surface elevation, a longitudinal wave filling velocity and a transverse wave filling velocity; performing vector rotation on the X and Y component seismic data of each shot to generate R and T component seismic data; picking up the longitudinal wave first arrival time of each shot of the Z component based on the offset range; setting parameters of a low-pass filter and performing low-pass filtering on the R-component seismic data; and calculating shot point longitudinal wave static correction and detection point longitudinal wave static correction according to the reference surface elevation, the longitudinal wave replacement speed and the transverse wave filling speed. In the scheme, the established transverse wave surface model is accurate, the transverse wave static correction precision of the detection point is high, the seismic imaging quality of the R component and the T component of the converted wave can be improved, and the method has wide applicability and universality in converted wave seismic exploration.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of geophysical exploration and seismic data processing, and particularly relates to a method and device for converting wave static correction of seismic data. BACKGROUND

[0002] In the process of land seismic data processing, seismic data is usually corrected to a unified reference plane, generally a horizontal plane. The theory of seismic exploration interpretation often assumes that the excitation point and the receiving point are on a horizontal plane, and the stratum velocity is uniform; but in fact, the ground is often uneven, and the depths of various excitation points can also be different, and the wave velocity in the low-velocity zone is also greatly different from the wave velocity in the stratum, so it will affect the shape of the measured time-distance curve. Therefore, in order to eliminate these influences, it is usually necessary to perform topographic correction, excitation depth correction, low-velocity zone correction, etc. on the original seismic data, and these corrections are constant for different seismic interfaces of the same observation point, and are therefore collectively referred to as static correction. Moreover, with the development of digital processing technology, there are various automatic static correction methods and programs.

[0003] A method for converting wave delay time static correction is provided in the prior art, according to the difference between the first arrival time of the horizontal component record and the first arrival time of the vertical component record of the converting wave exploration, the near-surface model of the longitudinal wave and the first arrival time of the longitudinal wave component are used to obtain the converting wave delay time, and the near-surface model of the transverse wave is established according to the converting wave delay time, so as to obtain the transverse wave static correction amount of the receiving point. The calculation formula of the converting wave delay time static correction amount is given in the prior art, and actual seismic data is used for verification.

[0004] A method for converting wave static correction in a thick weathering layer covered area is also provided in the prior art. PSV converting wave processing is very different from traditional PP wave processing, such as S wave static correction, CCP stacking, PSV velocity analysis, and migration, etc. The biggest problem is the S wave static correction problem. The S wave velocity is basically not affected by the water table, and has no direct correlation with the longitudinal wave static correction. Sometimes, the transverse wave static correction amount can reach ten times of the longitudinal wave static correction amount. Multiplying the longitudinal wave static correction amount by a proportionality coefficient to solve the transverse wave static correction problem will result in a large error. There is a certain first arrival time difference between the X and Z components of the same receiving point, which represents the travel time difference of P wave and S wave in the low-velocity zone. The first arrival time difference and the near-surface longitudinal and transverse wave velocity ratio information can be used to remove the influence of the low-velocity zone on the transverse wave, and to obtain an accurate static correction amount. The scheme uses the multi-component first arrival time difference to derive a relatively accurate transverse wave static correction formula, and combines the method of calculating the residual static correction amount by using the common receiver point stacking to form a complete converting wave static correction matching method.

[0005] The prior art also provides a converted wave static correction technology. Firstly, average velocity ratios of longitudinal and transverse waves of a low velocity layer are calculated according to three-component micro-logging data, and then the velocity ratios are multiplied by a receiver point static correction amount of a longitudinal wave to obtain a converted wave long wavelength static correction amount. Then, a converted wave short wavelength static correction amount is obtained by using an improved common receiver point stack cross-correlation method. Finally, a residual static correction amount is obtained by using a frequency division surface consistency residual static correction.

[0006] The prior art also provides a converted wave static correction method for complex structures. The specific steps are as follows: (1) the converted wave static correction structure term is eliminated by using a horizon flattening method to overcome the limitation of a substantially horizontal horizon. First, a structure horizon with a high P-P wave CMP stack signal-to-noise ratio is picked up, and a horizon flattening projection time difference is calculated to flatten the pre-stack data by using the projection time difference; (2) the horizon flattened data is converted to a common receiver point domain and common receiver point P-P wave velocity analysis is performed again to make the velocity of each trace of the common receiver point gather the same, eliminate the trace-to-trace moveout error caused by the severe lateral velocity variation of the complex structure and the low velocity analysis accuracy, improve the common receiver point in-phase stack and the signal-to-noise ratio, and reduce the influence of the low velocity accuracy on the residual static correction amount of the seismic trace; (3) the projection time difference of the P-P wave structure horizon flattening is converted to the P-SV domain to flatten the P-SV wave pre-stack data, and P-SV wave common receiver point velocity analysis is performed again in the common receiver point domain to improve the signal-to-noise ratio and resolution of the P-SV wave common receiver point gather stack profile, and finally improve the P-SV wave common receiver point gather stack horizon picking accuracy and efficiency. By using the structure horizon flattening and common receiver point domain velocity analysis, and then using the P-P wave structure constrained converted wave static correction method, the converted wave static correction calculation accuracy and efficiency for the complex structure can be improved.

[0007] In summary, although the prior art provides a large number of converted wave static correction schemes, for the specific application field of converted wave seismic data, the idea and method of directly picking up the transverse wave first arrival and then establishing a transverse wave surface model by using the transverse wave first arrival to solve the multi-wave static correction problem are not recorded in the prior art. Therefore, there is an urgent need to provide a converted wave static correction scheme applied to the field of geophysical exploration technology. SUMMARY

[0008] The present application shows a converted wave static correction method and device for seismic data.

[0009] In a first aspect, the present application shows a converted wave static correction method for seismic data, which comprises:

[0010] A three-dimensional SPS file of seismic data in a target work area is obtained, and the three-dimensional SPS file at least includes a receiver point file, a shot point file and a relationship file;

[0011] Collect and arrange the P-wave surface investigation data, S-wave surface investigation data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine the datum elevation, P-wave filling velocity and S-wave filling velocity in the target work area;

[0012] Perform vector rotation on the X-component and Y-component seismic data of each shot to generate R and T component seismic data;

[0013] Pick up the P-wave first arrival time of each shot of the Z component based on the determined offset range;

[0014] Set the parameters of the low-pass filter according to the P-wave main frequency and S-wave main frequency of the converted wave, and perform low-pass filtering on the R component seismic data;

[0015] Calculate the shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity.

[0016] Optionally, the step of obtaining the three-dimensional SPS file of the seismic data in the target work area, the three-dimensional SPS file at least including a receiver point file, a shot point file and a relationship file, comprises:

[0017] The receiver point file is sorted in ascending order of the receiver point stake number and indexed;

[0018] The shot point file is sorted in ascending order of the shot point stake number.

[0019] Optionally, the index of the first receiver point in the receiver point file is 1, and the index increment of the receiver point is 1; the index of the first shot point in the shot point file is 1, and the index increment of the shot point is 1.

[0020] Optionally, the step of setting the parameters of the low-pass filter according to the P-wave main frequency and S-wave main frequency of the converted wave and performing low-pass filtering on the R component seismic data comprises:

[0021] Generating a low-pass filter according to the preset P-wave spectrum and S-wave spectrum, and determining the cutoff frequency F of the low-pass filter according to the following expression c :

[0022] F c =f sv,c +k*(f p,c -f sv,c )

[0023] Wherein, F c is the cutoff frequency of the low-pass filter; f p,c is the P-wave main frequency; f sv,c is the S-wave main frequency; k is a coefficient, and the value range is (0.3-0.7).

[0024] Optionally, the step of generating a low-pass filter according to the preset longitudinal wave spectrum and transverse wave spectrum comprises:

[0025] For the converted wave Z-component seismic data in the seismic data, a spectrum analysis is performed on the longitudinal wave first arrival wave selected 1 to obtain a longitudinal wave main frequency f p,c ;

[0026] For the converted wave R-component seismic data in the seismic data, based on the characteristics of the wave, apparent velocity and comparison with the Z-component seismic data of the same shot point, the transverse wave first arrival wave on the R-component seismic data is determined; and one or more time windows are selected in the transverse wave first arrival wave area to perform a spectrum analysis to obtain a transverse wave main frequency f sv,c .

[0027] Optionally, the step of performing vector rotation on the X-component and Y-component seismic data of each shot to generate R and T-component seismic data comprises:

[0028] The trace head of the R-component seismic data and the T-component seismic data is consistent with the trace head of the Z-component seismic data of the corresponding shot point.

[0029] Optionally, before setting the parameters of the low-pass filter according to the longitudinal wave main frequency and the transverse wave main frequency of the converted wave and performing low-pass filtering processing on the R-component seismic data, the method further comprises:

[0030] A range of offset distances is determined, the first arrival time of each shot of the Z-component seismic data is picked up, and abnormal first arrivals are removed to generate a Z-component first arrival data file to obtain the longitudinal wave first arrival time.

[0031] Optionally, the step of calculating the shot point longitudinal wave static correction and the receiver point longitudinal wave static correction according to the datum surface elevation, the longitudinal wave replacement velocity and the transverse wave filling velocity comprises:

[0032] According to the picked-up longitudinal wave seismic first arrival, a tomographic inversion method is used to invert a longitudinal wave velocity model, and a high-speed top interface of a longitudinal wave surface model is determined according to the longitudinal wave surface velocity and depth data.

[0033] The shot point longitudinal wave static correction and the receiver point longitudinal wave static correction are calculated according to the datum surface elevation and the longitudinal wave replacement velocity.

[0034] Optionally, the step of calculating the shot point longitudinal wave static correction and the receiver point longitudinal wave static correction according to the datum surface elevation, the longitudinal wave replacement velocity and the transverse wave filling velocity comprises:

[0035] A refraction analysis method is used to analyze the longitudinal wave high-speed layer velocity and physical point delay time, and a longitudinal wave surface model is established according to the longitudinal wave surface data inversion;

[0036] The shot point longitudinal wave static correction and the receiver point longitudinal wave static correction are calculated according to the datum surface elevation and the longitudinal wave replacement velocity.

[0037] Optionally, after calculating the shot point P-wave static correction and the receiver point P-wave static correction according to the datum elevation, the P-wave replacement velocity and the P-wave filling velocity, the method further comprises:

[0038] According to the low-pass filter, the R-component seismic data is filtered to obtain filtered R-component seismic data;

[0039] According to the filtered R-component seismic data, a range of offset distances for picking up the first arrival is determined, and the first arrival of the P-wave is picked up on the filtered R-component seismic data to obtain P-wave first arrival data;

[0040] According to the P-wave first arrival, a tomographic inversion method is used to invert a P-wave velocity model, a high-velocity top interface of a P-wave surface model is determined according to the P-wave surface velocity and depth data or the tomographically inverted ray density data, and shot point P-wave static correction and receiver point P-wave static correction are calculated according to the datum elevation and the P-wave replacement velocity;

[0041] Based on the shot point P-wave static correction and the receiver point P-wave static correction, the R-component seismic data is processed to obtain R-component seismic imaging data, and based on the shot point P-wave static correction and the receiver point P-wave static correction, the T-component seismic data is processed to obtain T-component seismic imaging data.

[0042] In a second aspect, the application shows a converted wave static correction device for seismic data, characterized in that the device comprises:

[0043] A seismic data file acquisition module is configured to acquire a three-dimensional SPS file of seismic data in a target work area, wherein the three-dimensional SPS file at least includes a receiver point file, a shot point file and a relationship file;

[0044] A data collection and processing module is configured to collect and arrange P-wave surface survey data, S-wave surface survey data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data and S-wave surface velocity and depth data, and determine a datum elevation, a P-wave filling velocity and an S-wave filling velocity in the target work area;

[0045] A vector rotation module is configured to perform vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data;

[0046] A P-wave first arrival picking module is configured to pick up P-wave first arrival time of each shot of the Z-component based on the determined range of offset distances;

[0047] A low-pass filtering module is configured to set parameters of a low-pass filter according to a P-wave main frequency and an S-wave main frequency of converted waves, and perform low-pass filtering on the R-component seismic data;

[0048] a P-wave statics module configured to calculate a shot point P-wave statics and a receiver point P-wave statics according to the datum elevation, the P-wave replacement velocity and the S-wave fill velocity.

[0049] In a third aspect, the present application shows an electronic device, comprising: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute the method according to any one of the preceding aspects.

[0050] In a fourth aspect, the present application shows a non-transitory computer-readable storage medium, when the instructions in the storage medium are executed by a processor of an electronic device, the electronic device is enabled to execute the method according to any one of the preceding aspects.

[0051] In a fifth aspect, the present application shows a computer program product, when the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is enabled to execute the method according to any one of the preceding aspects.

[0052] The technical scheme provided by the present application can include the following beneficial effects:

[0053] The S-wave surface layer model established by the scheme provided by the present application is accurate, the receiver point S-wave statics precision is high, the converted wave R component and T component seismic imaging quality can be improved, and the scheme has wide applicability and universality in converted wave seismic exploration.

[0054] Figure 7 is the S-wave velocity model and the S-wave surface layer high-velocity top interface of the SLG area inversion, it can be seen that an accurate S-wave surface layer model can be established by the method; Figure 11 is the R component original single shot record of a certain line in the SLG area, Figure 12 is Figure 11 is the single shot record of the receiver point S-wave statics by applying the method of the present application, from the comparison of the two, it can be seen that the S-wave statics calculated by the method is accurate, the converted wave first arrival is smoother, and the S-wave reflection hyperbolic curve characteristics are better; Figure 13 is the stack profile of the SLG area applying elevation statics, Figure 14 is the stack profile of the SLG area applying the statics of the method of the present application, it can be seen that after applying the converted wave statics of the method, the influence of long wavelength is eliminated, the seismic stack profile imaging quality of the present application is good, the precision is high, the reflection continuity is enhanced, and the structural form is more accurate. BRIEF DESCRIPTION OF DRAWINGS

[0055] Figure 1 is a flow chart of the converted wave statics method for seismic data provided by the present application;

[0056] Figure 2is the Z-component seismic data and analysis time window of the SLG area;

[0057] Figure 3 is Figure 1 the frequency spectrum of the seismic data in the time window;

[0058] Figure 4 is the R-component seismic data and analysis time window of the SLG area;

[0059] Figure 5 is Figure 3 the frequency spectrum of the seismic data in the time window;

[0060] Figure 6 is the P-wave velocity model and P-wave surface high-velocity top interface of the SLG area inversion;

[0061] Figure 7 is the S-wave velocity model and S-wave surface high-velocity top interface of the SLG area inversion;

[0062] Figure 8 is the P-wave surface thickness and S-wave surface thickness comparison chart of a survey line in the SLG area;

[0063] Figure 9 is the P-wave static correction and S-wave static correction amount comparison curve of a geophone of a survey line in the SLG area;

[0064] Figure 10 is the S-wave static correction and P-wave static correction amount ratio curve of a geophone of a survey line in the SLG area;

[0065] Figure 11 is the R-component original single shot record of a survey line in the SLG area;

[0066] Figure 12 is Figure 10 the single shot record of the geophone S-wave static correction by applying the method of the present application;

[0067] Figure 13 is the stack profile of the SLG area applying the elevation static correction;

[0068] Figure 14 is the stack profile of the SLG area applying the static correction of the present application;

[0069] Figure 15 is a structural diagram of the converted wave static correction device for seismic data provided by the present application;

[0070] Figure 16 is a block diagram of an electronic device provided by the present application;

[0071] Figure 17 is a block diagram of another electronic device provided by the present application. DETAILED DESCRIPTION

[0072] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0073] In view of the problems in the prior art that the converted wave statics correction calculation is difficult, the precision is not high, and the imaging quality needs to be improved in converted wave seismic exploration, the present application aims to establish a relatively accurate S-wave surface model precision, improve the receiver S-wave statics correction precision, and thus ensure the imaging quality and imaging precision of converted wave seismic data.

[0074] The converted wave statics correction device and method of seismic data provided by the present application will be described below, please refer to Figures 1 to 14 .

[0075] Embodiment one

[0076] Referring to Figure 1 , a flow chart of the converted wave statics correction device and method of seismic data provided by the present application, the method can be applied to an electronic device, wherein the method can specifically include the following steps:

[0077] Step S101: obtaining a three-dimensional SPS file of seismic data in a target work area, wherein the three-dimensional SPS file at least includes a receiver point file, a shot point file and a relationship file.

[0078] Step S102: collecting and arranging P-wave surface survey data, S-wave surface survey data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine the datum surface elevation, P-wave filling velocity and S-wave filling velocity in the target work area.

[0079] Step S103: performing vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data. It should be noted that the trace head of the R-component and T-component seismic data is consistent with the trace head of the Z-component seismic data corresponding to the shot point.

[0080] Step S104: picking up the P-wave first arrival time of each shot of the Z-component based on the determined offset range.

[0081] Step S105: setting the parameters of a low-pass filter according to the P-wave main frequency and S-wave main frequency of the converted wave, and performing low-pass filter processing on the R-component seismic data.

[0082] Step S106: according to the datum plane elevation, the longitudinal wave replacement velocity and the transverse wave filling velocity, calculating the shot point longitudinal wave static correction and the receiver point longitudinal wave static correction.

[0083] In step S101, the receiver point file is sorted in ascending order of receiver point stake number and indexed; the shot point file is sorted in ascending order of shot point stake number. In a specific implementation, the first receiver point index of the receiver point file is 1, and the receiver point index increment is 1; the first shot point index of the shot point file is 1, and the shot point index increment is 1.

[0084] In step S105, a low-pass filter is generated according to the preset longitudinal wave spectrum and transverse wave spectrum, and the cutoff frequency F of the low-pass filter is determined according to the following expression c :

[0085] F c =f sv,c +k*(f p,c -f sv,c )

[0086] Wherein, F c is the cutoff frequency of the low-pass filter; f p,c is the main frequency of the longitudinal wave; f sv,c is the main frequency of the transverse wave; k is a coefficient, the value range is (0.3-0.7).

[0087] Further, for the converted wave Z component seismic data in the seismic data, the longitudinal wave main frequency f p,c is obtained by performing spectrum analysis on one selected in the longitudinal wave first arrival wave; for the converted wave R component seismic data in the seismic data, the transverse wave first arrival wave on the R component seismic data is determined based on the characteristics of the wave, apparent velocity and comparison with the Z component seismic data of the same shot point; and the transverse wave main frequency f sv,c is obtained by performing spectrum analysis on one or more time windows selected in the transverse wave first arrival wave region.

[0088] Further, before step S105, it further includes determining the offset distance range, picking up the first arrival time of each shot of the Z component seismic data, and eliminating abnormal first arrival to generate the Z component first arrival data file to obtain the longitudinal wave first arrival time.

[0089] In step S106, according to the picked-up longitudinal wave seismic first arrival, the longitudinal wave velocity model is inverted by using the tomographic inversion method, the high-speed top interface of the longitudinal wave surface model is determined according to the longitudinal wave surface velocity and depth data; and the shot point longitudinal wave static correction and the receiver point longitudinal wave static correction are calculated according to the datum plane elevation and the longitudinal wave replacement velocity.

[0090] In one embodiment of the present application, the P-wave static correction of the shot point and the P-wave static correction of the receiver point can be calculated in the following manner: the P-wave high-velocity layer velocity and the physical point delay time are analyzed by using the refraction analysis method, the P-wave surface layer model is established according to the P-wave surface data inversion, and the P-wave static correction of the shot point and the P-wave static correction of the receiver point are calculated according to the datum surface elevation and the P-wave replacement velocity.

[0091] Further, after step S106, the method can further include: filtering the R-component seismic data according to the low-pass filter to obtain filtered R-component seismic data; determining the offset range of the picked first arrival according to the filtered R-component seismic data; picking the S-wave first arrival on the filtered R-component seismic data to obtain S-wave first arrival data; inverting the S-wave velocity model by using the tomographic inversion method according to the S-wave first arrival, determining the high-velocity top interface of the S-wave surface layer model according to the S-wave surface velocity and depth data or the tomographically inverted ray density data, and calculating the S-wave static correction of the shot point and the S-wave static correction of the receiver point according to the datum surface elevation and the S-wave replacement velocity; processing the R-component seismic data based on the P-wave static correction of the shot point and the S-wave static correction of the receiver point to obtain R-component seismic imaging data; and processing the T-component seismic data based on the P-wave static correction of the shot point and the S-wave static correction of the receiver point to obtain T-component seismic imaging data.

[0092] In summary, the S-wave surface layer model established by the method provided in the present application is accurate, the S-wave static correction of the receiver point is high in precision, the seismic imaging quality of the converted wave R-component and T-component is improved, and the method has wide applicability and universality in converted wave seismic exploration.

[0093] In addition, Figure 7 is the S-wave velocity model and the S-wave surface high-velocity top interface inverted in the SLG region, and it can be seen that an accurate S-wave surface layer model can be established by the method; Figure 11 is the R-component original single-shot record of a survey line in the SLG region, Figure 12 is Figure 11 The single-shot record of the S-wave static correction of the receiver point by using the method of the present application, and it can be seen from the comparison between the two that the S-wave static correction calculated by the method is accurate, the converted wave first arrival is smoother, and the S-wave reflection hyperbolic curve characteristics are better; Figure 13 is the stack profile of the SLG region using the elevation static correction, Figure 14 is the stack profile of the SLG region using the static correction of the method of the present application, and it can be seen that the converted wave static correction by using the method eliminates the influence of long wavelengths, the seismic stack profile of the present application has good imaging quality, high precision, enhanced reflection continuity, and more accurate structural configuration.

[0094] It should be noted that for the method embodiments, the series of acts complement each other for the optimal understanding of the embodiments as a whole, but are not required. It should be noted that although the method embodiments are described as a series of acts, the acts are not required to be performed in the disclosed order, and that he acts can be modified in any order, including performed concurrently, that the disclosed order or modification of acts should not be inferred as having any dependency relating to the order or modification thereof.

[0095] The method for converting wave static correction of seismic data provided by the present application is described in detail below in combination with a specific example.

[0096] Step (1): According to the field production, the three-dimensional SPS file, i.e. the receiver point file, the shot point file and the relationship file, is arranged. The receiver point file is sorted in ascending order according to the receiver point stake number and indexed, the first receiver point index is 1, and the receiver point index increment is 1; the shot point file is sorted in ascending order according to the shot point stake number, the first shot point index is 1, and the shot point index increment is 1.

[0097] Step (2): Collect and arrange the P-wave surface survey data, S-wave surface survey data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data and S-wave surface velocity and depth data; specify the datum elevation of the area as 1350m, the P-wave filling velocity as 2500m / s and the S-wave filling velocity as 1350m / s.

[0098] Step (3): Perform vector rotation on the X component and Y component seismic data of each shot to generate R and T component seismic data. The trace head of the R and T component seismic data is consistent with the trace head of the Z component seismic data corresponding to the shot point.

[0099] Step (4): Specify the offset range as 0-6000m, pick up the first arrival time of each shot of the Z component, eliminate the obvious abnormal first arrival, and generate a Z component first arrival data file, i.e. obtain the P-wave first arrival time.

[0100] Step (5): According to the P-wave seismic first arrival picked up in step (4), the P-wave velocity model is inverted by using the tomographic inversion method, the high-speed top interface of the P-wave surface model is defined according to the P-wave surface velocity and depth data described in step (2) or the ray density data inverted by tomographic inversion, and then the shot point P-wave static correction and receiver point P-wave static correction are calculated according to the datum elevation and P-wave replacement velocity described in step (2).

[0101] Step (6): On the Z component seismic data, select 1 on the P-wave first arrival wave and perform spectral analysis to obtain the P-wave main frequency f p,c is 26Hz.

[0102] Step (7): On R-component seismic data, according to the characteristics of the wave, apparent velocity and comparison with Z-component seismic data of the same shot point, the S-wave first arrival wave on R-component seismic data is determined; and one or more time windows are selected in the S-wave first arrival wave area for frequency spectrum analysis to obtain the S-wave main frequency f sv,c is 10 Hz.

[0103] Step (8): According to the P-wave frequency spectrum and the S-wave frequency spectrum described in steps (6) and (7), a set of low-pass filters is designed, and the cut-off frequency F c of the low-pass filter is:

[0104] F c = f sv,c +k*(f p,c -f sv,c )

[0105] = 10+0.5*(26-10)

[0106] = 18 (Hz)

[0107] wherein F c is the cut-off frequency of the designed low-pass filter; f p,c is the P-wave main frequency described in step (6); f sv,c is the S-wave main frequency described in step (7); and k is a coefficient, which is between 0.3 and 0.7, and here is 0.5.

[0108] Step (9): According to the low-pass filter (0 Hz, 18 Hz) described in step (8), the R-component seismic data described in step (3) is filtered to obtain new R-component seismic data.

[0109] Step (10): According to the new R-component seismic data described in step (9), the offset range for picking up the first arrival is defined as 0-4000 m, and the S-wave first arrival is picked up on the new R-component seismic data to obtain S-wave first arrival data.

[0110] Step (11): According to the S-wave first arrival described in step (10), the S-wave velocity model is inverted by using the tomographic inversion method, the high-speed top interface of the S-wave surface model is defined according to the S-wave surface velocity and depth data described in step (2) or the tomographically inverted ray density data, and then the shot point S-wave static correction and the receiver point S-wave static correction are calculated according to the datum surface elevation and the S-wave replacement velocity described in step (2).

[0111] Step (12): according to the shot point P-wave static correction of step (5) and the receiver point S-wave static correction of step (11), the R-component seismic imaging data is obtained by processing the R-component seismic data of step (3); the shot point P-wave static correction and the receiver point S-wave static correction can also be used for processing the T-component seismic data of step (3), to obtain the T-component seismic imaging data.

[0112] Embodiment two

[0113] Reference Figure 15 A structural diagram of a device for converting wave static correction of seismic data is provided in the present application, and the device comprises:

[0114] A seismic data file acquisition module 210 is configured to acquire a three-dimensional SPS file of seismic data in a target work area, wherein the three-dimensional SPS file comprises at least a receiver point file, a shot point file and a relationship file;

[0115] A data collection and processing module 220 is configured to collect and arrange P-wave surface survey data, S-wave surface survey data and VSP P-wave and S-wave velocity data in the target work area, to obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and to determine a datum elevation, a P-wave filling velocity and an S-wave filling velocity in the target work area;

[0116] A vector rotation module 230 is configured to perform vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data;

[0117] A P-wave first arrival picking module 240 is configured to pick P-wave first arrival time of each shot of Z-component based on a determined offset range;

[0118] A low-pass filtering module 250 is configured to set parameters of a low-pass filter according to a P-wave main frequency and an S-wave main frequency of the converted wave, and to perform low-pass filtering processing on the R-component seismic data;

[0119] A P-wave static correction module 260 is configured to calculate shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation, the P-wave filling velocity and the S-wave filling velocity.

[0120] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the related parts can be referred to the part of the method embodiment.

[0121] Embodiment three

[0122] Optionally, the embodiment of the present application further provides an electronic device, comprising: a processor, a memory, a computer program stored in the memory and executable in the processor, when the computer program is executed by the processor, each process of the method embodiment is realized, and the same technical effects can be achieved, and here is not repeated.

[0123] The embodiment of the present application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program, when the computer program is executed by a processor, each process of the method embodiment is realized, and the same technical effects can be achieved, and here is not repeated. The computer readable storage medium is, for example, a read-only memory (Read-Only Memory, ROM for short), a random access memory (Random Access Memory, RAM for short), a magnetic disk or an optical disk.

[0124] Figure 16 A block diagram of an electronic device 800 is provided. For example, the electronic device 800 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

[0125] Reference Figure 16 The electronic device 800 can include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0126] The processing component 802 usually controls the overall operation of the electronic device 800, such as operations associated with displaying, making phone calls, data communications, camera operations and recording operations. The processing component 802 can include one or more processors 820 to execute instructions to complete all or part of the steps of the above method. In addition, the processing component 802 can include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0127] The memory 804 is configured to store various types of data to support the operation of the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phonebook data, messages, images, videos, etc. The memory 804 can be implemented by any type of volatile or nonvolatile memory, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disc, or optical disc.

[0128] The power supply component 806 supplies power for various components of the electronic device 800. The power supply component 806 can include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0129] The multimedia component 808 includes a screen providing an output interface between the electronic device 800 and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense a touch, a slide, and a gesture on the touch panel. The touch sensor can not only sense a boundary of a touching or a sliding action, but also detect duration and pressure related to the touching or sliding action. In some embodiments, the multimedia component 808 includes a front camera and / or a back camera. The front camera and / or the back camera can receive external multimedia data when the device 800 is in an operating mode, such as a shooting mode or a video mode. Each of the front camera and the back camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0130] The audio component 810 is configured to output and / or input an audio signal. For example, the audio component 810 includes a microphone (MIC) configured to receive an external audio signal when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting an audio signal.

[0131] The I / O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which can be a keypad, a click wheel, buttons, etc. The buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0132] The sensor component 814 includes one or more sensors for providing status assessments of various aspects of the electronic device 800. For example, the sensor component 814 can detect an open / closed position of the device 800, relative positioning of components, such as a display and a keypad of the electronic device 800, a change in position of the electronic device 800 or a component of the electronic device 800, presence or absence of user contact with the electronic device 800, orientation or acceleration / deceleration / g-force and temperature of the electronic device 800. The sensor component 814 can include an optical sensor for detecting ambient light, a proximity sensor for detecting nearby objects without any physical touch, a CMOS or CCD image sensor for use in imaging applications, or an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor in some embodiments.

[0133] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as WiFi, a cellular network (e.g., 2G, 3G, 4G, or 5G), or a combination thereof. In an example embodiment, the communication component 816 receives broadcast signals or broadcast operation information from an external broadcast management system via a broadcast channel. In an example embodiment, the communication component 816 can further include a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on Radio Frequency Identification (RFID) techniques, infrared data association (IrDA) techniques, ultra-wideband (UWB) techniques, Bluetooth (BT) techniques, and other techniques.

[0134] In an example embodiment, the electronic device 800 can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, micro-controllers, microprocessors, or other electronic elements for performing the above-described methods.

[0135] In an example embodiment, a non-transitory computer-readable storage medium including instructions, such as the memory 804 including instructions, is also provided, which can be executed by the processor 820 of the electronic device 800 to implement the above-described methods. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disc, and an optical data storage device, etc.

[0136] Embodiment Four

[0137] Figure 17Another block diagram of an electronic device 1900 is provided. For example, the electronic device 1900 can be provided as a server.

[0138] Referring to Figure 17 The electronic device 1900 includes a processing component 1922, which further includes one or more processors, and a memory resource represented by a memory 1932, for storing instructions, such as an application, executable by the processing component 1922. The application stored in the memory 1932 can include one or more than one module each corresponding to a set of instructions. In addition, the processing component 1922 is configured to execute the instructions to perform the above method.

[0139] The electronic device 1900 can further include a power component 1926 configured to perform power management of the electronic device 1900, a wired or wireless network interface 1950 configured to connect the electronic device 1900 to a network, and an input / output (I / O) interface 1958. The electronic device 1900 can operate based on an operating system stored in the memory 1932, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™ or the like.

[0140] Embodiment Five

[0141] In a fifth aspect, the present application shows a computer program product, when instructions in the computer program product are executed by a processor of an electronic device, the electronic device is enabled to perform the method as claimed in any one of the above aspects.

[0142] It should be noted that, in this document, the term "comprising" or "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or further include elements inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0143] Those skilled in the art can clearly understand that the above-mentioned embodiment method can be realized by means of software and necessary general hardware platform, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes a plurality of instructions for making a terminal (which can be a mobile phone, computer, server, air conditioner, or network device) execute the methods described in various embodiments of the present application.

[0144] The embodiments of the present application are described above in conjunction with the drawings, but the present application is not limited to the specific embodiments described above, which are only illustrative rather than limiting, and those of ordinary skill in the art can make many forms without departing from the purpose of the present application and the scope protected by the claims.

[0145] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed in the embodiments of the present application can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solutions. Those of ordinary skill in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0146] Those of ordinary skill in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be described here.

[0147] In the embodiments provided by the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed ones can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0148] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0149] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0150] The functions, if realized in the form of software functional units and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, the technical scheme of the present application or the part of the present application which essentially contributes to the prior art or the part of the technical scheme can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various storage media that can store program codes, such as a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk.

[0151] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for converting wave statics for seismic data, characterized in that, The method comprises: acquiring a three-dimensional SPS file of seismic data in a target work area, the three-dimensional SPS file comprising at least a receiver point file, a shot point file and a relationship file; collecting and arranging P-wave surface survey data, S-wave surface survey data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine a datum elevation, a P-wave filling velocity and an S-wave filling velocity in the target work area; performing vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data; picking P-wave first arrival time of each shot of Z-component based on the determined offset range; setting parameters of a low-pass filter according to P-wave and S-wave main frequencies of converted waves and performing low-pass filter processing on R-component seismic data; calculating shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity.

2. The method for converting wave static correction for seismic data according to claim 1, wherein, The step of acquiring a three-dimensional SPS file of seismic data in a target work area, the three-dimensional SPS file comprising at least a receiver point file, a shot point file and a relationship file, comprises: sorting and indexing the receiver point file in ascending order of receiver point stake number; sorting the shot point file in ascending order of shot point stake number.

3. The converted wave static correction method for seismic data according to claim 1, characterized in that: the first receiver point index of the receiver point file is 1, and the receiver point index increment is 1; the first shot point index of the shot point file is 1, and the shot point index increment is 1.

4. The method for converting wave static correction for seismic data according to claim 1, wherein, The step of setting parameters of a low-pass filter according to P-wave and S-wave main frequencies of converted waves and performing low-pass filter processing on R-component seismic data, comprises: The low-pass filter is generated according to the preset longitudinal wave spectrum and transverse wave spectrum, and a cut-off frequency F of the low-pass filter is determined according to the following expression c : F c = f sv,c +k*(f p,c -f sv,c ) Wherein, F c is the cut-off frequency of the low-pass filter; f p,c is the main frequency of the longitudinal wave; f sv,c is the main frequency of the transverse wave; k is a coefficient, and the value range is (0.3-0.7).

5. The method for converting wave static correction of seismic data according to claim 4, characterized in that, The step of generating a low-pass filter according to a preset P-wave spectrum and S-wave spectrum, comprises: For the converted wave Z component seismic data in seismic data, the first arrival of longitudinal wave is selected to carry out spectrum analysis, and the main frequency f p,c of longitudinal wave is obtained Aimed at converted wave R-component seismic data, based on the characteristics of the wave, apparent velocity and comparison with Z-component seismic data of the same shot point, the shear wave first arrival wave on the R-component seismic data is determined; and in the shear wave first arrival wave area, one or more time windows are selected to perform frequency spectrum analysis to obtain the main frequency f sv,c of the shear wave 6. The method for converting wave static correction for seismic data according to claim 4, wherein, The step of performing vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data, comprises: The trace head of R-component seismic data and T-component seismic data is consistent with the trace head of Z-component seismic data of the corresponding shot point.

7. The method for converting wave static correction for seismic data according to claim 4, wherein, Before setting parameters of a low-pass filter according to P-wave and S-wave main frequencies of converted waves and performing low-pass filter processing on R-component seismic data, it further comprises: determining an offset range, picking first arrival time of each shot of Z-component seismic data, and eliminating abnormal first arrival to generate a Z-component first arrival data file to obtain P-wave first arrival time.

8. The method for converting wave static correction for seismic data according to claim 1, wherein, The step of calculating shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity, comprises: inverting a P-wave velocity model by using a tomographic inversion method according to the picked P-wave seismic first arrival, and determining a high-velocity top interface of a P-wave surface model according to the P-wave surface velocity and depth data; calculating shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation and the P-wave replacement velocity.

9. The method for converting wave static correction for seismic data according to claim 1, wherein, The step of calculating shot point P-wave static correction and receiver point P-wave static correction according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity, comprises: analyzing P-wave high-velocity layer velocity and physical point delay time by using a refraction analysis method, and establishing a P-wave surface model by inversion according to P-wave surface data; According to the datum elevation and the P-wave replacement velocity, P-wave static corrections of the shot point and the receiver point are calculated.

10. The method for converting wave static correction for seismic data according to claim 7, wherein, After the P-wave static corrections of the shot point and the receiver point are calculated according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity, the method further comprises: According to the low-pass filter, the R-component seismic data are filtered to obtain filtered R-component seismic data. According to the filtered R-component seismic data, a range of offset distance for picking up the first arrival is determined, and the first arrival of the S-wave is picked up on the filtered R-component seismic data to obtain S-wave first arrival data. According to the S-wave first arrival, a tomographic inversion method is used to invert a S-wave velocity model, a high-velocity top interface of the S-wave surface model is determined according to the S-wave surface velocity and depth data or the tomographically inverted ray density data, and S-wave static corrections of the shot point and the receiver point are calculated according to the datum elevation and the S-wave replacement velocity. Based on the P-wave static corrections of the shot point and the S-wave static corrections of the receiver point, the R-component seismic data are processed to obtain R-component seismic imaging data, and the T-component seismic data are processed based on the P-wave static corrections of the shot point and the S-wave static corrections of the receiver point to obtain T-component seismic imaging data.

11. An apparatus for converting wave statics for seismic data, characterized by, The device comprises: a seismic data file acquisition module configured to acquire a three-dimensional SPS file of seismic data in a target work area, the three-dimensional SPS file comprising at least a receiver point file, a shot point file and a relationship file; a data collection and processing module configured to collect and arrange P-wave surface survey data, S-wave surface survey data and VSP P-S wave velocity data in the target work area to obtain P-wave surface velocity and depth data, S-wave surface velocity and depth data, and determine a datum elevation, a P-wave filling velocity and an S-wave filling velocity in the target work area; a vector rotation module configured to perform vector rotation on X-component and Y-component seismic data of each shot to generate R-component and T-component seismic data; a P-wave first arrival picking module configured to pick up P-wave first arrival time of each shot of the Z-component based on the determined range of offset distance; a low-pass filtering module configured to set parameters of a low-pass filter according to a P-wave main frequency and an S-wave main frequency of converted waves, and perform low-pass filtering on the R-component seismic data; a P-wave static correction module configured to calculate P-wave static corrections of the shot point and the receiver point according to the datum elevation, the P-wave replacement velocity and the S-wave filling velocity.

12. An electronic device, comprising: The device comprises: a processor, a memory and a computer program stored on the memory and executable on the processor, the computer program being executed by the processor to implement the method according to any one of claims 1 to 7.

13. A computer-readable storage medium, characterized in that, The computer program is stored on the computer readable storage medium and is executed by the processor to implement the method according to any one of claims 1 to 7.

14. A computer program product, characterised in that, When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device implements the method according to any one of claims 1 to 7.

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