Electronic expansion valve coil structure, electronic expansion valve and electronic expansion valve coil structure manufacturing method
By encapsulating the electronic expansion valve coil with a thermosetting composite material through one-piece injection molding, the problems of complex assembly and unstable materials in traditional electronic expansion valves are solved, achieving a highly efficient and reliable coil structure and improving waterproof and insulation performance.
Patent Information
- Application Number
- CN202511035819.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-25
- Publication Date
- 2025-11-21
AI Technical Summary
The existing electronic expansion valve has a cumbersome and complex coil assembly structure, high material costs, poor electrical insulation due to differences in material shrinkage under high temperature environments, long production cycle, insufficient waterproofing, and the epoxy resin potting is prone to porosity defects.
It adopts a combination structure of coil body, wire harness assembly, wire buckle structure and plastic encapsulation outer layer. The coil and electrical wiring parts are covered by thermosetting composite material by one-piece injection molding, eliminating the cover body and epoxy resin potting. The thermosetting material is used uniformly to ensure material consistency and stability.
The assembly process has been simplified, material costs have been reduced by 30%, product structural strength and electrical insulation performance have been improved by 150%, and the waterproof rating has reached IP68, ensuring structural stability and safety over a wide temperature range.
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Figure CN120998622A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of flow regulating valve, in particular to an electronic expansion valve coil structure, an electronic expansion valve and a manufacturing method of the electronic expansion valve coil structure. BACKGROUND
[0002] The electronic expansion valve is a throttling control element for accurately regulating the flow of refrigerant based on electrical signals. Its core principle is that the electronic controller receives sensor signals and adjusts the valve opening in real time to optimize system performance. It can be widely used in modern refrigeration, air conditioning and heat pump systems.
[0003] In the prior art, the electronic expansion valve is generally composed of a valve body and a coil structure. The coil structure, as the driving part, directly drives the needle valve inside the valve body using a pulse stepping method. When the pulse voltage of the control circuit acts on the coils of the stator of the coil structure according to a certain logical relationship, the rotor inside the valve body rotates under the action of the magnetic torque of the winding coil, and through force transmission, the needle valve rises or falls, thereby controlling the flow of fluid through the valve port inside the valve body, and thus achieving precise control of the flow of refrigerant.
[0004] For example, a Chinese invention patent application with the publication number CN114078622A and the patent name "A coil device and an electronic expansion valve with the coil device" includes a valve body and a coil device. The coil device is sleeved outside the valve body, and the coil device and the rotor inside the valve body form a stepping motor. The coil device includes a coil body, an encapsulation layer and a shell. The coil body includes two stator winding units that are mirror images along the axial direction of the coil device. The stator winding units are used to generate a magnetic field after being energized and drive the valve body to act. The shell is arranged outside the encapsulation layer. The encapsulation layer and the shell are used to achieve insulation protection of the stator winding units. The encapsulation layer is formed by injection molding after the assembled coil body is placed in an injection mold. The encapsulation layer is arranged around the outer circumferential surface of the stator housing and the electromagnetic pole plate, and substantially covers the first end portion and the peripheral portion. The encapsulation layer can be formed by directly injection molding the thermoplastic resin on the coil body. The shell covers the coil body and the encapsulation layer. A filling cavity for filling the insertion pin is formed between the shell body and the encapsulation layer, which can avoid the problems of increased connection process and complex process caused by the structure of the filling insertion pin.
[0005] In addition, another embodiment is to independently arrange a shell outside the insertion pin and the circuit board. The shell is welded and fixed with the encapsulation layer for electrical protection. For example, a Chinese invention patent application with the publication number CN102054553A and the patent name "Electromagnetic coil and manufacturing method thereof" discloses the content.
[0006] However, the prior art still has the following defects:
[0007] 1. The coil device of the traditional electronic expansion valve relates to the independent coating structure of the encapsulation layer and the shell body, the encapsulation layer can only encapsulate the positioning shell and the electromagnetic pole plate, and the shell body is further welded on the basis of the encapsulation layer, the coil body and the electrical circuit part can be completely coated through the shell body, and the epoxy resin in the sealing cavity between the shell body and the encapsulation layer is further sealed to fix the structure, the whole assembly structure and process are relatively complicated, the product structure stability and performance reliability cannot be guaranteed, the product production cycle is affected, and the material cost is also relatively high.
[0008] 2. The shell body and the encapsulation layer adopt thermoplastic materials, and the epoxy resin belongs to thermosetting materials, the shrinkage difference of the two materials is large in a high-temperature environment, and a separation layer is easily generated between the two materials, causing poor electrical insulation and other problems.
[0009] 3. The coil device of the traditional electronic expansion valve is firstly encapsulated to form an encapsulation layer on the stator shell and the electromagnetic pole plate, then an independent shell body is arranged to coat the electrical circuit part, and finally the encapsulation layer and the shell body are welded, and epoxy resin glue filling is needed, the whole production and processing process and assembly structure are relatively complex, the production cost is high, and the production cycle is long.
[0010] Moreover, the epoxy resin in the sealing cavity between the shell body and the encapsulation layer is used for fixing the electrical circuit and preventing water, internal residual pores are easily caused due to insufficient defoaming of the epoxy resin, and the epoxy resin is not pressure-formed, so that the adhesion between the wires and the circuit board is low and the adhesion is small, resulting in insufficient waterproofness; since the epoxy resin belongs to thermosetting materials, oxidation and decomposition occur in a high-temperature environment, the epoxy resin cannot be fused again, and the plastic sealing effect between the wires and the circuit board is affected. SUMMARY
[0011] In order to overcome the defects of the prior art, one of the purposes of the present application is to provide an electronic expansion valve coil structure.
[0012] One of the purposes of the present application is achieved by adopting the following technical scheme: an electronic expansion valve coil structure, comprising a coil body, a wire harness assembly, a wire buckle structure and a plastic sealing outer layer, the coil body has a winding coil, the wire harness assembly has a plurality of wires, and the wires are electrically connected with the winding coil.
[0013] The wire buckle structure has a plurality of wire pressing grooves, and the wire buckle structure seals and presses the wires one by one through the wire pressing grooves.
[0014] The plastic sealing outer layer is integrally injection molded on the outside of the coil body in correspondence, and is injection molded with the wire buckle structure.
[0015] Further, the plastic sealing outer layer has a first plastic sealing part and a second plastic sealing part, and the first plastic sealing part is integrally injection molded on the outside of the coil body, and the second plastic sealing part is integrally injection molded on the outside of the wire harness assembly and the wire buckle structure.
[0016] Further, the wire buckle structure has a wire buckle base and a wire buckle cover oppositely pressed with the wire buckle base, and the wire buckle base and the side of the wire buckle cover oppositely pressed with the wire buckle base are respectively provided with a first wire pressing groove and a second wire pressing groove, for sealing and pressing the conductive wire through the first wire pressing groove and the second wire pressing groove.
[0017] Further, the first wire pressing groove, or the first wire pressing groove and the second wire pressing groove have a plurality of waterproof ribs adapted to press the outer peripheral wall of the conductive wire.
[0018] Further, the first wire pressing groove is integrally recessed from the assembly surface of the wire buckle base, and the first wire pressing groove is arranged along the wire arrangement direction of the assembly surface of the wire buckle base, and the limiting groove is arranged between two adjacent first wire pressing grooves.
[0019] The assembly surface of the wire buckle cover has a limiting boss, and the second wire pressing groove is integrally recessed on the limiting boss and arranged along the wire arrangement direction, and the interval distance of the second wire pressing groove and the first wire pressing groove corresponds, so that when the wire buckle cover is pressed with the wire buckle base, the first wire pressing groove and the second wire pressing groove are oppositely pressed to the conductive wire, and the limiting boss is embedded in the limiting groove.
[0020] Further, the coil body further has a coil skeleton, a stator and a stator shell, the stator and the winding coil are mounted on the coil skeleton, the stator shell covers the outside of the coil skeleton and the stator, and the coil skeleton, the wire buckle structure and the plastic sealing outer layer are made of thermosetting composite material.
[0021] Further, the wire connection end of the coil skeleton extends out of the outside of the stator shell, the wire connection end of the coil skeleton is provided with an angle pin and a circuit board, the angle pin is electrically connected with the winding coil and the circuit board, and the conductive wire of the wire harness assembly is electrically connected with the circuit board.
[0022] Compared with the prior art, the beneficial effects of the present application are:
[0023] (1) The application embodiment sets a wire buckle structure and an integrally injection molded plastic sealing outer layer, the wire buckle structure is used for sealing and compressing a plurality of wires of a wire harness assembly through a wire pressing groove, during injection molding, the plastic sealing outer layer is correspondingly injection molded and coated on the coil body, and the wires of the wire harness assembly and the wire connection part of the winding coil, the traditional shell body and the like components and the epoxy resin pouring process are cancelled, the assembly structure is simplified, the product structural strength and performance reliability are improved, the production efficiency is greatly improved, and the material cost is reduced by more than 30%; the integrally injection molded plastic sealing outer layer avoids the pouring sealing air hole defect, improves the density of wire adhesion, and reaches the waterproof level of IP68; the thermosetting plastic sealing layer does not melt at high temperature, and the structural stability under the condition of minus 40 DEG C to 150 DEG C is ensured; and the injection molding connection of the plastic sealing outer layer and the wire buckle structure avoids the problem of wire damage caused by high temperature, and higher-grade heat-resistant wires do not need to be purchased, further saving cost and ensuring production safety.
[0024] (2) The coil framework, wire buckle structure and plastic sealing outer layer provided by the application embodiment replace the existing thermoplastic sealing layer by uniformly adopting the same material of thermosetting composite material, ensure that the material linear expansion coefficients are consistent during injection molding, and keep the shape stable; each part expands synchronously after preheating and thermal cycling, and no separation layer phenomenon occurs, the material stability and electrical insulation performance are more stable, and the insulation performance is improved by 150%.
[0025] In order to overcome the defects of the prior art, the second object of the present application is to provide an electronic expansion valve.
[0026] The second object of the present application is achieved by the following technical scheme: an electronic expansion valve has a valve body and the electronic expansion valve coil structure, and the valve body is inserted with the coil body of the electronic expansion valve coil structure.
[0027] In order to overcome the defects of the prior art, the third object of the present application is to provide a manufacturing method of an electronic expansion valve coil structure.
[0028] The third object of the present application is achieved by the following technical scheme: a manufacturing method of an electronic expansion valve coil structure comprises the following manufacturing steps:
[0029] S1, pre-assembly of the coil body, winding of the winding coil of the coil body;
[0030] S2, arrangement and fixation of the electrical circuit wire, a plurality of wires of the wire harness assembly are separated and sealed and compressed through the wire pressing groove of the wire buckle structure;
[0031] S3, wire connection of the electrical circuit, the wire harness assembly and the winding coil are electrically connected after being sealed and compressed;
[0032] S4, integrally injection molding, an integrally injection molded plastic sealing outer layer is formed outside the coil body, the wire harness assembly and the wire buckle structure.
[0033] Further, the wire clasp structure in the step S2 has a wire clasp base and a wire clasp cover, and the wire clasp base and the wire clasp cover are respectively provided with a first wire pressing groove and a second wire pressing groove corresponding to the opposite pressing sides, for sealing and pressing the wire through the first wire pressing groove and the second wire pressing groove.
[0034] The plastic outer layer in the step S4 has a first plastic part and a second plastic part integrally injection molded, and the first plastic part and the second plastic part are respectively integrally injection molded on the outside of the coil body and the outer peripheral wall of the wire clasp structure.
[0035] Compared with the prior art, the application has the following beneficial effects:
[0036] (1) The electronic expansion valve coil structure manufacturing method provided by the application has the following advantages: after the coil body, the electrical wiring and the wire sealing and pressing through the wire clasp structure are preassembled, the electronic expansion valve coil is directly placed into an injection mold for integrally injection molding of the plastic outer layer, so that the injection outer layer injection coats the coil body and the electrical wiring part, and is injection welded with the outer peripheral wall of the wire clasp structure, thereby avoiding high-temperature damage to the wire and achieving better plastic sealing effect; compared with the traditional plastic sealing process, the process is simplified, the assembly structure is simplified, the production cycle is shortened by 40%, integrally injection molding avoids air hole defects caused by pouring sealing, the adhesion density of the wire is improved, and the waterproof level reaches IP68; compared with the traditional sealing layer and the shell of different materials, the application uses a unified thermosetting composite material, the thermosetting plastic sealing layer does not melt at high temperature, and the interface bonding strength is better than that of the pouring sealing process, and the structure is stable. BRIEF DESCRIPTION OF DRAWINGS
[0037] Figure 1 FIG. 1 is a three-dimensional schematic view of an electronic expansion valve coil structure in a preferred embodiment of the application;
[0038] Figure 2 FIG. 1 is a three-dimensional schematic view of an electronic expansion valve coil structure in a preferred embodiment of the application;
[0039] Figure 3 FIG. 1 is a three-dimensional schematic view of an electronic expansion valve coil structure in a preferred embodiment of the application;
[0040] Figure 4 FIG. 1 is a three-dimensional schematic view of an electronic expansion valve coil structure in a preferred embodiment of the application;
[0041] Figure 5 FIG. 1 is a three-dimensional schematic view of an electronic expansion valve coil structure in a preferred embodiment of the application;
[0042] Figure 6 This is a schematic diagram of the component manufacturing process of the electronic expansion valve coil structure in a preferred embodiment of the present invention;
[0043] Figure 7 This is a flowchart illustrating the manufacturing process of the electronic expansion valve coil structure in a preferred embodiment of the present invention.
[0044] In the picture:
[0045] 10. Coil body; 101. Winding coil; 102. Coil frame; 103. Stator; 104. Stator housing; 105. Angle pin; 106. Coil support;
[0046] 20. Wire harness assembly; 201. Wire; 202. Circuit board;
[0047] 30. Outer plastic seal layer; 301. First plastic seal portion; 302. Second plastic seal portion;
[0048] 40. Wire buckle structure; 401. Wire buckle seat; 4011. First wire pressing groove; 4012. Limiting groove; 402. Wire buckle cover; 4021. Limiting boss; 4022. Second wire pressing groove; 4023. Waterproof rib;
[0049] 50. Valve body. Detailed Implementation
[0050] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0051] like Figures 1-7 As shown, an electronic expansion valve coil structure can be widely used in modern refrigeration, air conditioning, and heat pump systems. This electronic expansion valve coil structure includes a coil body 10, a wire harness assembly 20, a wire clip structure 40, and a plastic-encapsulated outer layer 30. The coil body 10 has a coil frame 102, a winding coil 101, a stator 103, and a stator housing 104. The winding coil 101 is wound on the coil frame 102, and the stator is inserted into one end of the coil frame 102. The stator housing 104 covers the outside of the coil frame 102 and the stator 103, and has an opening to facilitate the extension of the terminals of the coil frame 102 to the outside of the stator housing 104.
[0052] In practical applications, the length of the wire end of the coil framework 102 extending outward can be set according to actual use requirements, for example, the wire end of the coil framework 102 extends 2-3 cm outside the stator shell 104. The wire end of the coil framework 102 is provided with an angle pin 105 and a circuit board 202, the angle pin 105 is electrically connected with the winding coil 101, and the angle pin 105 is punched into an L-shaped and inserted into a through hole of the circuit board 202, and the circuit board 202 is double-sided copper-clad and welded with the angle pin 105.
[0053] The coil body 10 also has a coil support 106, which is generally annular and has a connecting piece extending downward. After being integrally injection molded, the coil support 106 is fixed at the lower end of the plastic encapsulation shell 30, and the coil support 106 is connected with the parts such as the plastic-encapsulated stator 103 and the stator shell 104, and is used for positioning and installing, heat protection, and anti-vibration buffering of the electronic expansion valve coil structure.
[0054] The wire harness assembly 20 has a plurality of parallelly arranged wires 201, which are electrically connected with the circuit board 202 by welding or plugging, and then electrically connected with the winding coil 101.
[0055] The wire buckle structure 40 has a plurality of parallelly arranged wire pressing grooves, the groove width of the wire pressing grooves is matched with the diameter of the wires 201, and when the wires 201 are arranged and installed, the plurality of parallelly arranged wires 201 are sealed and pressed at one time according to the interval of each wire pressing groove, and if necessary, a sealing rubber strip can be embedded in the wire pressing groove, so as to realize the arrangement and fixation and radial sealing of the wires 201 by mechanical pressure.
[0056] The plastic encapsulation shell 30 is integrally injection molded on the outside of the coil body 10, the wire harness assembly 20, and the wire buckle structure 40. Specifically, the plastic encapsulation shell 30 adopts a thermosetting composite material, the assembled coil body 10, the wire harness assembly 20, and the wire buckle structure 40 are placed on an injection mold, and the thermosetting composite material is used to integrally injection coat the wire connection part of the coil body 10, the wire harness assembly 20, and the outer peripheral wall of the wire buckle structure 40 in a high-temperature injection mold, so as to form a seamless and waterproof plastic encapsulation shell 30 after molding.
[0057] Preferably, the coil framework 102, the wire buckle structure 40, and the plastic encapsulation shell 30 all adopt the same thermosetting composite material, and the thermosetting composite material is a BMC material. Therefore, the coil framework 102, the wire buckle structure 40, and the plastic encapsulation shell 30 are replaced by the existing thermoplastic encapsulation layer by uniformly adopting the same thermosetting composite material, so that the material linear expansion coefficients are consistent and the shapes are stable during injection molding, for example, the expansion coefficients are uniform ; each part expands synchronously after preheating and thermal cycling, no separation layer is generated, material stability and electrical insulation performance are more stable, for example, the arc resistance of BMC material is >180s, and the insulation performance is improved by 150%.
[0058] Therefore, by setting the wire buckle structure 40 and the integrally injection-molded plastic sealing outer layer 30, the wire buckle structure 40 is used to seal and compress the wire harness assembly 20 by opening the wire pressing groove for the plurality of wires 201, and during injection molding, the plastic sealing outer layer 30 is injection-molded on the coil body 10 and the wire 201 of the wire harness assembly 20 and the wire connection part of the winding coil 101, thereby canceling the traditional shell body and epoxy resin pouring process, simplifying the assembly structure, improving the product structural strength and performance reliability, greatly improving the production efficiency, and reducing the material cost by more than 30%; the integrally injection-molded plastic sealing outer layer 30 avoids the air hole defect of pouring and sealing, improves the adhesion density of the wire 201, and reaches the waterproof level of IP68; the thermosetting plastic sealing layer does not melt at high temperature, thereby guaranteeing the structural stability under the condition of minus 40℃ to 200℃; and the plastic sealing outer layer 30 and the wire buckle structure 40 are injection-molded to avoid the problem of high-temperature damage to the wire 201, thereby guaranteeing the production safety.
[0059] The plastic sealing outer layer 30 provided by the embodiment of the present application has a first plastic sealing part 301 and a second plastic sealing part 302, the first plastic sealing part 301 and the second plastic sealing part 302 are integrally injection-molded, and the second plastic sealing part is injection-molded on one side of the first plastic sealing part. The first plastic sealing part 301 covers the stator shell 104 of the coil body 10 and most of the coil framework 102, only the wire connection end part of the coil framework 102 protrudes out of the first plastic sealing part 301, and the actual injection thickness of the first plastic sealing part 301 can be set as needed, for example, the injection thickness is 3-5mm.
[0060] The second plastic sealing part 302 covers the wire connection end part of the coil framework 102, including the angle needle 105 on the wire connection end of the coil framework 102, the circuit board 202 and the wire 201 electrically connected with the angle needle 105, and the outer peripheral wall of the wire buckle structure 40, that is, the second plastic sealing part 302 is integrally injection-molded and fused along the four walls of the wire buckle structure 40, thereby achieving the sealing and connecting effect. During injection molding, a multi-gate mold can be selected to ensure that the material molecular chains at the interface between the first plastic sealing part 301 and the second plastic sealing part 302 are mutually fused.
[0061] Therefore, by dividing the plastic sealing outer layer 30 into two parts of the first plastic sealing part 301 and the second plastic sealing part 302, the design of the electronic expansion valve coil structure is adapted, the overall structure is more compact and stable, and the partial shrinkage stress concentration is avoided by the partition plastic sealing. The fusion area of the first plastic sealing part 301 and the second plastic sealing part 302 realizes the physical sealing continuity, solves the cumbersome production process problem of the traditional separate use of the encapsulation layer and the shell to coat and weld the coil body 10, the lead wire 201 and the circuit board 202, avoids the delamination risk between different materials of the encapsulation layer and the shell, and further ensures the overall plastic sealing effect of the entire electronic expansion valve coil structure, and the waterproof performance is greatly improved.
[0062] The wire clamping structure 40 provided by the embodiment of the application has a wire clamping seat 401 and a wire clamping cover 402. The wire clamping cover 402 is relatively tightly covered with the wire clamping seat 401. For example, connecting columns are arranged at four corner positions of an assembly surface of the wire clamping seat 401, and connecting holes corresponding to the connecting columns are arranged at four corner positions of an assembly surface of the wire clamping cover 402. When the wire clamping structure 40 is installed, the connecting holes of the wire clamping cover 402 are aligned with the connecting columns for insertion and installation, so that the wire clamping cover 402 and the wire clamping seat 401 are quickly positioned and tightly covered and assembled. In addition, the wire clamping seat 401 and the wire clamping cover 402 can also be tightly covered through buckling or bolts.
[0063] The side surfaces of the wire clamping seat 401 and the wire clamping cover 402 that are relatively tightly covered are respectively provided with a first wire pressing groove 4011 and a second wire pressing groove 4022. The first wire pressing groove 4011 and the second wire pressing groove 4022 are both designed as U-shaped strip grooves. When the lead wire 201 is installed, the lead wire 201 is first embedded on the first wire pressing groove 4011 of the wire clamping seat 401, and then the wire clamping cover 402 is covered on the wire clamping seat 401. When the wire clamping cover 402 is pressed downward, the second wire pressing groove 4022 of the wire clamping cover 402 forms an arc surface contact with the lead wire 201, so that the lead wire 201 is sealed and tightly pressed through the opposite pressing assembly of the first wire pressing groove 4011 and the second wire pressing groove 4022. If necessary, a micro gap is filled with pre-coated silica gel in the pressed groove after pressing, and the silica gel assists in sealing to improve the sealing reliability under high-frequency vibration, and further improve the sealing and pressing effect of the lead wire 201 in the groove.
[0064] Preferably, when the plastic sealing outer layer 30 is integrally injection molded, the plastic sealing outer layer 30 is injection molded along the outer peripheral walls of the wire clamping seat 401 and the wire clamping cover 402 through injection and fusion between the plastic sealing outer layer 30 and the wire clamping structure 40, so as to further strengthen the matching compactness between the wire clamping seat 401 and the wire clamping cover 402, and further improve the sealing and pressing effect of the wire clamping structure 40 on the lead wire 201 to prevent high-pressure injection glue leakage.
[0065] Therefore, the wire buckle structure 40 adopts a split design. The wire buckle seat 401 and the wire buckle cover 402 are pressed together to seal and tighten the wire 201. The double-sided pressure of the wire buckle seat 401 and the wire buckle cover 402 makes the wire 201 evenly stressed, improves the tensile strength, and has a better sealing and tightening effect. The detachable assembly of the wire buckle seat 401 and the wire buckle cover 402 makes the operation more convenient and the maintenance and replacement costs lower.
[0066] Preferably, the first wire pressing groove 4011 of the wire fastener 401 is provided with one or two waterproof ribs 4023. The waterproof ribs 4023 are generally designed in a ring shape on the first wire pressing groove 4011, or the waterproof protrusions are designed as semi-circles. In addition, the second wire pressing groove 4022 may be provided with one or more waterproof ribs 4023, or may not be provided with waterproof ribs 4023.
[0067] like Figure 3 As shown, when the first pressure groove 4011 is provided with a waterproof rib 4023 and the second pressure groove 4022 is also provided with a corresponding waterproof rib 4023, the waterproof ribs 4023 of the first pressure groove 4011 and the second pressure groove 4022 are aligned with each other.
[0068] like Figure 4 As shown, when the first pressure groove 4011 is provided with two waterproof ribs 4023 and the second pressure groove 4022 is provided with one waterproof rib 4023, the two waterproof ribs 4023 of the first pressure groove 4011 are located on both sides of the one waterproof rib 4023 of the second pressure groove 4022, and are arranged in a staggered manner.
[0069] During the installation of conductor 201, the relative pressing of the wire clamp seat 401 and the wire clamp cover 402, along with the continuous compression of the outer sheath of conductor 201 by the waterproof protrusions 4023 of the first wire clamping groove 4011 and the second wire clamping groove 4022, compensates for the deformation of conductor 201 material caused by temperature changes, forming a multi-level sealing barrier to prevent water from seeping in along the groove openings or conductor 201. Furthermore, by designing the waterproof protrusions 4023, the local pressure of the wire clamping groove on conductor 201 is increased, cutting off the water vapor penetration path and significantly improving the insulation and electrical performance.
[0070] More specifically, the first wire pressing groove 4011 is recessed into the mounting surface of the wire fastener 401, and several first wire pressing grooves 4011 are provided. These grooves are spaced apart along the wiring direction of the mounting surface of the wire fastener 401 to accommodate the spaced arrangement of several wires 201, avoiding problems such as overheating caused by the wires 201 being laid too close together. In addition, a limiting groove 4012 is provided between two adjacent first wire pressing grooves 4011 on the wire fastener 401, and the bottom of the limiting groove 4012 is slightly higher than the bottom of the first wire pressing groove 4011.
[0071] In addition, the assembly surface of the wire clamping cover 402 has a protruding limiting boss 4021, and a second wire pressing groove 4022 is integrally recessed from the limiting boss 4021, and a plurality of second wire pressing grooves 4022 are arranged on the limiting boss 4021 along the wire arrangement direction, and the interval distance of the second wire pressing grooves 4022 corresponds to the interval distance of the first wire pressing grooves 4011.
[0072] When the wire clamping cover 402 is pressed and combined with the wire clamping seat 401, the first wire pressing groove 4011 and the second wire pressing groove 4022 can be pressed towards the wire 201, and the limiting boss 4021 of the wire clamping cover 402 is correspondingly embedded in the limiting groove 4012 of the wire clamping seat 401, so as to reduce the axial deviation of the first wire pressing groove 4011 and the second wire pressing groove 4022, eliminate the bending damage of the wire 201 caused by the assembly misalignment between the wire clamping cover 402 and the wire clamping seat 401, and ensure the accurate butt joint of the first wire pressing groove 4011 and the second wire pressing groove 4022, thereby further improving the sealing consistency.
[0073] As shown in Figure 5 , the embodiment of the present application also provides an electronic expansion valve, which comprises a valve body 50, and when assembled, the upper end shell of the valve body 50 is inserted into the center hole of the coil framework 102 and the coil body 10 is inserted and assembled, so that the installation is convenient and the waterproof effect is better.
[0074] As shown in Figures 6-7 , the embodiment of the present application also provides a manufacturing method of an electronic expansion valve coil structure, which comprises the following manufacturing steps:
[0075] S1, pre-assembly of the coil body 10, winding of the winding coil 101 of the coil body 10; specifically, the winding coil 101 is wound on the coil framework 102, the stator 103 is installed at one end of the coil framework 102, the stator shell 104 is covered outside the coil framework 102, and the wiring end of the coil framework 102 protrudes out of the stator shell 104;
[0076] S2, arrangement and fixation of the electrical circuit line, a plurality of wires 201 of the wire harness assembly 20 are sealed and pressed by the wire pressing grooves of the wire clamping structure 40; specifically, the wires 201 are pre-welded with the circuit board 202, the wire clamping structure 40 has a wire clamping seat 401 and a wire clamping cover 402 which is pressed and combined with the wire clamping seat 401, and the side surfaces of the wire clamping seat 401 and the wire clamping cover 402 which are pressed and combined correspondingly are respectively provided with first wire pressing grooves 4011 and second wire pressing grooves 4022 for sealing and pressing the wires 201 towards each other through the first wire pressing grooves 4011 and the second wire pressing grooves 4022;
[0077] S3, wiring of the electrical circuit, electrically connecting the sealed and compressed wire harness assembly 20 and the winding coil 101; specifically, welding the circuit board 202 and the angle pin 105 on the wiring end of the coil skeleton 102, thereby realizing the electrical connection between the wire 201 and the winding coil 101;
[0078] S4, integrally injection-molding packaging, integrally injection-molding the plastic outer layer 30 outside the coil body 10 and the wire clamping structure 40; specifically, the plastic outer layer 30 has a first plastic packaging part 301 and a second plastic packaging part 302 integrally injection-molded, and the first plastic packaging part 301 and the second plastic packaging part 302 are integrally injection-molded outside the coil body 10, the wiring part of the wire harness assembly 20 and the outer peripheral wall of the wire clamping structure 40, respectively.
[0079] Therefore, the electronic expansion valve coil structure manufacturing method provided by the embodiment of the present application is used to directly put the electronic expansion valve coil into an injection mold for integrally injection-molding the plastic outer layer 30 after preassembling the coil body 10, laying the electrical circuit and sealing and compressing the wire 201 through the wire clamping structure 40, so that the injection outer layer injection-molds and covers the coil body 10 and the electrical wiring part, and is injection-molded and welded with the outer peripheral wall of the wire clamping structure 40, thereby avoiding the high-temperature damage of the wire 201 and achieving better plastic packaging effect; compared with the traditional plastic packaging process, the process is simplified, the assembly structure is simplified, the production cycle is shortened by 40%, the integrally injection-molding avoids the air hole defect of the pouring packaging, the adhesion density of the wire 201 is improved, and the waterproof level reaches IP68; compared with the traditional packaging layer and the shell of different materials, the embodiment of the present application uses a unified thermosetting composite material, the thermosetting plastic packaging layer does not melt at high temperature, and the interface bonding strength is better than that of the pouring packaging process, and the structure stability is high.
[0080] The above-mentioned embodiments are only preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-essential changes and replacements made by those skilled in the art on the basis of the present application are within the scope of protection of the present application.
Claims
1. An electronic expansion valve coil structure, characterized in that, It includes a coil body, a wire harness assembly, a wire clip structure, and a plastic encapsulation layer. The coil body has a winding coil, and the wire harness assembly has a plurality of wires, which are electrically connected to the winding coil. The wire buckle structure has several wire pressing grooves, and the wire buckle structure seals and presses the wire tightly through the wire pressing grooves one by one; The outer plastic encapsulation layer is integrally injection molded onto the outside of the coil body and is injection molded to connect with the wire buckle structure.
2. The electronic expansion valve coil structure as described in claim 1, characterized in that, The outer plastic-encapsulated layer has an integrally formed first plastic-encapsulated portion and a second plastic-encapsulated portion, and the first plastic-encapsulated portion is integrally injection molded on the outside of the coil body, and the second plastic-encapsulated portion is integrally injection molded on the outer peripheral wall of the wiring harness assembly's connection portion and the wire buckle structure.
3. The electronic expansion valve coil structure as described in claim 1, characterized in that, The wire buckle structure has a wire buckle seat and a wire buckle cover that is pressed against the wire buckle seat. The wire buckle seat and the wire buckle cover are respectively provided with a first wire pressing groove and a second wire pressing groove on their respective pressed sides, which are used to seal and press the wire tightly through the first wire pressing groove and the second wire pressing groove facing each other.
4. The electronic expansion valve coil structure as described in claim 3, characterized in that, The first wire pressing groove, or the first wire pressing groove and the second wire pressing groove, have a number of waterproof ribs that are adapted to press the outer peripheral wall of the wire.
5. The electronic expansion valve coil structure as described in claim 3, characterized in that, The first wire pressing groove is formed by a recess in the assembly surface of the wire buckle seat. The first wire pressing groove is spaced apart along the wiring direction of the assembly surface of the wire buckle seat, and there is a limiting groove between two adjacent first wire pressing grooves. The mounting surface of the wire buckle cover has a limiting boss. The second wire pressing groove is recessed in one part of the limiting boss and is spaced apart along the wiring direction. The spacing between the second wire pressing groove and the first wire pressing groove corresponds to each other. When the wire buckle cover and the wire buckle seat are pressed together, the first wire pressing groove and the second wire pressing groove face each other to press the wire and the limiting boss is embedded in the limiting groove.
6. The electronic expansion valve coil structure as described in claim 1, characterized in that, The coil body also has a coil frame, a stator and a stator housing. The stator and the winding coil are mounted on the coil frame. The stator housing covers the outside of the coil frame and the stator. The coil frame, the wire clip structure and the plastic encapsulation layer are all made of thermosetting composite materials.
7. The electronic expansion valve coil structure as described in claim 6, characterized in that, The wiring terminals of the coil frame extend outside the stator housing. The wiring terminals of the coil frame are provided with angle pins. The wire harness assembly also has a circuit board. The circuit board is electrically connected to the wires. The angle pins are electrically connected to the winding coils and the circuit board.
8. An electronic expansion valve, characterized in that, It has a valve body and an electronic expansion valve coil structure as described in any one of claims 1-7, wherein the valve body is inserted into the coil body of the electronic expansion valve coil structure.
9. A method for manufacturing an electronic expansion valve coil structure, characterized in that, The manufacturing process includes the following steps: S1. Pre-assembly of the coil body, and winding of the coil body; S2. The electrical wiring is fixed by sealing and pressing several wires of the wire harness assembly in sections through the wire clamping groove of the wire clamp structure. S3. Electrical wiring layout, connecting the sealed and compressed wire harness assembly to the winding coil; S4, Integrated injection molding encapsulation, with an outer layer integrally injection molded around the coil body, wire harness assembly, and wire clip structure.
10. The method for manufacturing the electronic expansion valve coil structure as described in claim 9, characterized in that, The wire buckle structure in step S2 has a wire buckle seat and a wire buckle cover. The wire buckle seat and the wire buckle cover are respectively provided with a first wire pressing groove and a second wire pressing groove on their opposite sides, which are used to seal and press the wire tightly through the first wire pressing groove and the second wire pressing groove facing each other. The outer plastic encapsulation layer in step S4 has an integrally injection-molded first plastic encapsulation part and a second plastic encapsulation part, which are respectively integrally injection-molded on the outside of the coil body and the outer peripheral wall of the wire buckle structure.
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