Glass chip bonding equipment

Abstract

The invention provides glass chip bonding equipment, and relates to the field of glass chip bonding, the glass chip bonding equipment comprises a base, the top of the base is fixedly provided with a machine head, the front surface of the machine head is vertically and slidably provided with a bonding mechanism, and the top of the bonding mechanism is fixedly provided with a lifting motor on the front surface of the machine head. When the lifting motor controls the hot pressing head to descend and presses the hot pressing wheel on a chip, the hot pressing wheel can movably move towards the outer side under the action of the guide rail and pressure, and at the moment, heat on the hot pressing wheel presses the chip on a glass screen through heat conduction; the time of direct contact between the hot-pressing head and the chip is shortened in a rolling mode of the hot-pressing wheel, and the chip is adhered to the glass screen, so that chip warping caused by long-time overheating and overlarge temperature difference is prevented, dynamic heating of the hot-pressing wheel through rolling contact is realized, the contact time is shorter and uniform, the local temperature difference between the chip and the substrate is reduced, and the production efficiency is improved. And chip warping caused by thermal stress is effectively relieved.

Description

Technical Field

[0001] This invention relates to the field of glass chip bonding, and more specifically, to a glass chip bonding apparatus. Background Technology

[0002] In the field of semiconductor packaging and micro-assembly, high-precision thermosetting bonding of chips to substrates is a critical step in ensuring device reliability. Existing automated bonding equipment typically uses planar thermosetting heads to bond chips to substrates (such as glass substrates) through static heating. However, with the shrinking of chip sizes, the diversification of substrate materials, and the increasing demands for process efficiency, the planar thermosetting head heats the chip through a large area of ​​static contact during the thermosetting process, leading to a significant temperature gradient at the chip-substrate interface. At high temperatures, the thermal expansion mismatch of the materials intensifies, causing warping deformation at the chip edges due to localized stress concentration.

[0003] For example, the Chinese utility model patent (application number: CN201821889365.4) discloses an "automatic bonding device for a chip and a glass substrate." Its specification states that the bonding machine is a device that precisely positions and bonds an IC chip onto a glass substrate. The entire machine is controlled by a PLC and HMI, and an automatic image alignment system calculates the alignment data of the target object. After alignment and pre-pressing, the product is transferred from the platform to the bonding press for bonding. However, existing automatic bonding devices still have some shortcomings: Existing automatic bonding devices suffer from excessive chip warping due to large temperature differences between the chip and the glass substrate, and the hot press head cannot be cleaned properly, making bonding difficult. The aforementioned patent can corroborate the defects of the existing technology.

[0004] Therefore, we have made improvements to this and proposed a glass chip bonding device. Summary of the Invention

[0005] The purpose of this invention is to address the problem of excessive chip warping caused by excessive temperature differences between the chip and the glass substrate.

[0006] To achieve the above-mentioned objectives, the present invention provides a glass chip bonding device to improve the aforementioned problems.

[0007] The application is as follows: A glass chip bonding device includes a base, a head fixedly mounted on the top of the base, a bonding mechanism vertically slidably mounted on the front of the head, a lifting motor fixedly mounted on the top of the bonding mechanism on the front of the head, the bonding mechanism including a hot pressing head, an electric cylinder fixedly mounted on the top of the hot pressing head, a traction block vertically slidably mounted in the middle of the inner cavity of the hot pressing head, a connector snapped into the middle of the top of the traction block, a guide rod fixedly mounted on the top of the connector, the top of the guide rod fixedly connected to the output end of the electric cylinder, and a spring fixedly connected between the top of the inner cavity of the hot pressing head and the traction block. A grinding head is fixedly connected to the bottom of the traction block. Hot pressure rollers are provided on both sides of the grinding head. Two pairs of sliding guide grooves that slope outward and upward are symmetrically opened on the inner wall of the hot pressure roller. A rotating shaft is fixedly installed in the middle of the hot pressure roller. Gears are fixedly installed on both sides of the hot pressure roller. A rack is provided at the bottom of the sliding guide groove. The gear meshes with the rack. The end of the rotating shaft is rotatably sleeved inside the sliding guide groove.

[0008] As a preferred technical solution of this application, a guide groove is provided in the middle of the rack, and a limiting shaft is sleeved inside the guide groove. The limiting shaft is fixedly installed on the inner wall of the hot press head, and the limiting shaft is located below the outer side of the gear.

[0009] As a preferred technical solution of this application, a connecting magnetic rod is fixedly connected between the tops of two adjacent racks, and a support plate is fixedly installed on both sides of the inner wall of the hot press head, with the top of the connecting magnetic rod pressing against the top of the support plate.

[0010] As a preferred technical solution of this application, a vertical sliding groove is provided in the middle of the traction block, and the connector is vertically slidably engaged in the interior of the vertical sliding groove. Installation grooves are symmetrically provided on both sides of the inner cavity of the vertical sliding groove. A positioning rod is slidably engaged in the inner side of the installation groove. A limit spring is fixedly connected to the outer side of the positioning rod, and the outer side of the limit spring is fixedly connected to the inner wall of the outer side of the installation groove.

[0011] As a preferred technical solution of this application, a pair of extrusion blocks are symmetrically slidably installed in the middle of the connector, a top rod is fixedly connected to the outer side of the extrusion block, a support spring is fixedly connected between the outer side of the top rod and the inner cavity wall of the connector, and a pair of push blocks are symmetrically arranged between the two extrusion blocks.

[0012] As a preferred technical solution of this application, positioning holes are provided on both sides of the connector, and slots are provided on both the front and back of the connector. The outer ends of the push block are located inside the slots, and the outer ends of the push rod are slidably engaged inside the positioning holes.

[0013] As a preferred technical solution of this application, traction rods are fixedly installed on both sides of the top of the traction block, and uprights are provided on the top of the support plate. The outer end of the traction rod is vertically slidably engaged with the bottom of the top of the upright, and the upright is vertically slidably engaged with the top of the support plate.

[0014] As a preferred technical solution of this application, the support plate has an inwardly oriented rotating groove in the middle, and the bottom of the upright is rotatably mounted with a sleeve by a torsion spring. A telescopic spring is slidably fitted inside the sleeve, and the bottom end of the telescopic spring is attached to the lower side of the hot press roller.

[0015] As a preferred technical solution of this application, the top outer side of the grinding head is provided with a chamfer, the hot pressure roller is attached to the side of the grinding head, and when the hot pressure roller rotates on the side of the grinding head, the grinding head scrapes and cleans the surface of the hot pressure roller.

[0016] As a preferred technical solution of this application, a cross-shaped transport shaft is fixedly installed on the top of the base, and a tray is fixedly installed on the top of the cross-shaped transport shaft. The cross-shaped transport shaft controls the tray to move laterally and longitudinally.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: In the scheme of this application: 1. To address the problem of excessive chip warpage caused by large temperature differences between the chip and the glass substrate in existing technologies, this application utilizes a lifting motor to control the descent of the hot pressing head and the pressing roller to press onto the chip. Under the action of the guide rail and pressure, the hot pressing roller moves outward, and the heat on the hot pressing roller presses the chip onto the glass screen through heat conduction. The rolling of the hot pressing roller reduces the direct contact time between the hot pressing head and the chip, thus adhering the chip to the glass screen. This prevents chip warpage caused by prolonged overheating and excessive temperature differences. The hot pressing roller achieves dynamic heating through rolling contact, resulting in shorter and more uniform contact time, reducing local temperature differences between the chip and the substrate, and effectively alleviating chip warpage caused by thermal stress. 2. To address the problem in existing technologies where the hot press head cannot be thoroughly cleaned during operation, causing difficulties in bonding, this application utilizes a rotatable hot press wheel. After each bonding operation, the traction block is energized and magnetically guided, attracting the connecting magnetic rod and engaging it against the side of the connector. At this point, an electric cylinder controls the movement of the connector, causing the rack and gear to mesh and rotate, resulting in friction between the hot press wheel and the grinding head, thus cleaning the surface of the hot press wheel. This achieves automatic and timely cleaning of the hot press wheel after each bonding operation, allowing for quick cleaning and preventing prolonged adhesion that would hinder later cleaning. 3. The sleeve and telescopic spring, under the action of the torsion spring, are always in contact with the outside of the hot pressure roller. When the hot pressure roller moves to the outermost position, the sleeve and telescopic spring move outward synchronously, and the bottom end of the telescopic spring contacts the two sides of the glass chip, thereby clamping the two sides of the glass chip. When the guide rod moves upward, the traction rod moves upward, causing the glass chip at the bottom of the telescopic spring to interact with the hot pressure roller, thereby achieving separation. This not only enables the handling of glass chips but also enables automatic loading and unloading, solving the problem of needing to add mechanical claws to handle glass chips in the existing technology. Attached Figure Description

[0018] Figure 1 A schematic diagram of the glass chip bonding device provided in this application; Figure 2 A schematic diagram of the internal structure of the glass chip bonding device provided in this application; Figure 3 A schematic diagram of the hot press head structure of the glass chip bonding device provided in this application; Figure 4 A side cross-sectional view of the hot press head of the glass chip bonding device provided in this application; Figure 5 The glass chip bonding device provided in this application Figure 4 A magnified structural diagram at point A; Figure 6 A schematic diagram of the internal structure of the hot press head of the glass chip bonding device provided in this application; Figure 7 A schematic diagram of the structure of the first embodiment of the glass chip bonding device provided in this application; Figure 8 A disassembled structural diagram of the internal structure of the hot press head of the glass chip bonding device provided in this application; Figure 9 An exploded view of the internal structure of the connector of the glass chip bonding device provided in this application. Figure 10 This is a schematic diagram of the second embodiment of the glass chip bonding device provided in this application; Figure 11 This is a schematic diagram of the third embodiment of the glass chip bonding device provided in this application.

[0019] The image shows: 1. Base; 101. Machine head; 102. Cross transport shaft; 103. Pallet; 2. Bonding mechanism; 201. Lifting motor; 202. Hot press head; 203. Electric cylinder; 204. Hot press wheel; 205. Guide rod; 206. Spring; 207. Connecting joint; 208. Traction block; 209. Grinding head; 210. Gear; 211. Support plate; 212. Sleeve; 213. Telescopic spring; 214. Rack; 215. Guide groove; 216. Connecting magnetic rod; 217. Rotating shaft; 218. Traction rod; 219. Upright pole; 220. Limiting shaft; 221. Positioning hole; 222. Slot; 223. Pressing block; 224. Top rod; 225. Support spring; 226. Positioning rod; 227. Limiting spring; 228. Push block; 229. Vertical groove; 230. Mounting slot. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0021] As described in the background art, excessive temperature difference between the chip and the glass substrate causes excessive chip warping.

[0022] To address this technical problem, the present invention provides a glass chip bonding device for bonding glass chips.

[0023] For details, please refer to Figures 1-11 The glass chip bonding device specifically includes a base 1, a machine head 101 fixedly installed on the top of the base 1, a bonding mechanism 2 vertically slidably installed on the front of the machine head 101, a lifting motor 201 fixedly installed on the top of the bonding mechanism 2 on the front of the machine head 101, the bonding mechanism 2 includes a hot pressing head 202, an electric cylinder 203 fixedly installed on the top of the hot pressing head 202, a traction block 208 vertically slidably installed in the middle of the inner cavity of the hot pressing head 202, a connector 207 snapped into the middle of the top of the traction block 208, a guide rod 205 fixedly installed on the top of the connector 207, the top of the guide rod 205 fixedly connected to the output end of the electric cylinder 203, and a spring 206 fixedly connected between the top of the inner cavity of the hot pressing head 202 and the traction block 208. A grinding head 209 is fixedly connected to the bottom of the traction block 208. A hot pressure roller 204 is provided on both sides of the grinding head 209. Two pairs of sliding guide grooves that are inclined outward and upward are symmetrically opened on the inner wall of the hot pressure roller 202. A rotating shaft 217 is fixedly installed in the middle of the hot pressure roller 204. Gears 210 are fixedly installed on both sides of the hot pressure roller 204. A rack 214 is provided at the bottom of the sliding guide groove. The gear 210 meshes with the rack 214. The end of the rotating shaft 217 is rotatably sleeved inside the sliding guide groove.

[0024] The glass chip bonding device provided by this invention addresses the problem of excessive chip warpage caused by large temperature differences between the chip and the glass substrate in existing technologies. This application utilizes a lifting motor to control the descent of the hot pressing head and the pressing rollers to press onto the chip. Under the influence of the guide rail and pressure, the hot pressing rollers move outwards, allowing heat from the rollers to conduct heat and press the chip onto the glass screen. The rolling motion of the hot pressing rollers reduces the direct contact time between the hot pressing head and the chip, thus bonding the chip to the glass screen. This prevents chip warpage caused by prolonged overheating and excessive temperature differences. The device achieves dynamic heating through rolling contact, resulting in shorter and more uniform contact time, reducing localized temperature differences between the chip and the substrate, and effectively alleviating chip warpage caused by thermal stress.

[0025] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0026] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0028] Example 1, please refer to Figures 1-7 A glass chip bonding device includes a base 1, a head 101 fixedly mounted on the top of the base 1, a bonding mechanism 2 vertically slidably mounted on the front of the head 101, a lifting motor 201 fixedly mounted on the top of the bonding mechanism 2 on the front of the head 101, the bonding mechanism 2 including a hot pressing head 202, an electric cylinder 203 fixedly mounted on the top of the hot pressing head 202, a traction block 208 vertically slidably mounted in the middle of the inner cavity of the hot pressing head 202, a connector 207 snapped into the middle of the top of the traction block 208, a guide rod 205 fixedly mounted on the top of the connector 207, the top of the guide rod 205 fixedly connected to the output end of the electric cylinder 203, and a spring 206 fixedly connected between the top of the inner cavity of the hot pressing head 202 and the traction block 208. A grinding head 209 is fixedly connected to the bottom of the traction block 208. A hot pressure roller 204 is provided on both sides of the grinding head 209. Two pairs of sliding guide grooves that are inclined outward and upward are symmetrically opened on the inner wall of the hot pressure roller 202. A rotating shaft 217 is fixedly installed in the middle of the hot pressure roller 204. Gears 210 are fixedly installed on both sides of the hot pressure roller 204. A rack 214 is provided at the bottom of the sliding guide groove. The gears 210 mesh with the rack 214. The end of the rotating shaft 217 is rotatably sleeved inside the sliding guide groove. A cross transport shaft 102 is fixedly installed on the top of the base 1. A tray 103 is fixedly installed on the top of the cross transport shaft 102. The cross transport shaft 102 controls the tray 103 to move laterally and longitudinally. The glass chip is placed on top of the tray 103 and transported to the underside of the hot press head 202 via the cross transport shaft 102. Then, the hot press head 202 is moved up and down by the lifting motor 201, so that the hot press roller 204 at the bottom of the hot press head 202 presses against the top of the glass chip. At this time, the hot press roller 204 is subjected to the pressure from the bottom and, in conjunction with the guide groove opened on the inner wall of the hot press head 202, moves the hot press roller 204 and meshes with the gear 210, so that the hot press roller 204 rotates. At this time, through the action of uniform rotation, the surface of the glass chip is not overheated locally, thereby preventing the chip from warping.

[0029] When the lifting motor controls the descent of the hot pressing head and presses the hot pressing roller onto the chip, the hot pressing roller moves outward under the action of the guide rail and pressure. At this time, the heat on the hot pressing roller presses the chip onto the glass screen through heat conduction. The rolling of the hot pressing roller reduces the direct contact time between the hot pressing head and the chip, and adheres the chip to the glass screen. This prevents chip warping caused by prolonged overheating and excessive temperature difference. The hot pressing roller achieves dynamic heating through rolling contact, with shorter and more uniform contact time, reducing local temperature differences between the chip and the substrate, and effectively alleviating chip warping caused by thermal stress.

[0030] Example 2 further optimizes the glass chip bonding device provided in Example 1, specifically, as follows: Figures 3-10As shown, a guide groove 215 is provided in the middle of the rack 214, and a limiting shaft 220 is sleeved inside the guide groove 215. The limiting shaft 220 is fixedly installed on the inner wall of the hot press head 202. The limiting shaft 220 is located below the outer side of the gear 210. A connecting magnetic rod 216 is fixedly connected between the tops of two adjacent racks 214. Support plates 211 are fixedly installed on both sides of the inner wall of the hot press head 202. The top of the connecting magnetic rod 216 presses against the top of the support plate 211. A vertical groove 229 is provided in the middle of the traction block 208. The connector 207 is vertically slidably engaged inside the vertical groove 229. Installation grooves 230 are symmetrically provided on both sides of the inner cavity of the vertical groove 229. A positioning rod 226 is slidably engaged inside the installation groove 230. A limiting spring 227 is fixedly connected to the outer side of the positioning rod 226. A limiting spring 227 is fixedly connected to the outer side of the limiting spring 227. A pair of extrusion blocks 223 are symmetrically slidably installed in the middle of the connector 207 on the inner wall of the outer side of the mounting slot 230. A push rod 224 is fixedly connected to the outer side of the extrusion block 223. A support spring 225 is fixedly connected between the outer side of the push rod 224 and the inner wall of the connector 207. A pair of push blocks 228 are symmetrically arranged between the two extrusion blocks 223. Positioning holes 221 are opened on both sides of the connector 207. Slots 222 are opened on the front and back of the connector 207. The outer ends of the push blocks 228 are located inside the slots 222. The outer ends of the push rods 224 are slidably engaged inside the positioning holes 221. The top outer side of the grinding head 209 is chamfered. The hot pressure roller 204 is attached to the side of the grinding head 209. When the hot pressure roller 204 rotates on the side of the grinding head 209, the grinding head 209 scrapes and cleans the surface of the hot pressure roller 204. After bonding the glass chip, the traction block 208 is energized and magnetized, causing it to attract the connecting magnetic rod 216. This causes the connecting magnetic rod 216 to rotate along with the rack 214, bringing it into contact with both sides of the traction block 208. The connecting magnetic rod 216 then presses the pushing blocks 228 on both sides of the connector 207 towards the center of the slot 222. This, in turn, causes the pushing blocks 228 to support the pressing block 223 outwards, thereby causing the push rod 224 to press the positioning rod 226 inside the positioning hole 221. When the pressure is applied outwards, the electric cylinder 203 controls the guide rod 205 to pull the connector 207 to slide vertically relative to the traction block 208 inside the grinding head 209, thereby controlling the meshing between the rack 214 and the gear 210, thus causing the hot pressure wheel 204 to rotate. At this time, the gear 210 on the outside of the hot pressure wheel 204 is limited by the rack 214. When the rack 214 slides vertically up and down, the hot pressure wheel 204 is pressed against the side of the grinding head 209 and rotates continuously, thereby cleaning the surface of the hot pressure wheel 204.

[0031] To address the problem in existing technologies where the hot press head cannot be thoroughly cleaned during operation, causing difficulties in bonding, this application utilizes a rotatable hot press wheel. After each bonding operation, the traction block 208 is energized and magnetically guided, attracting the connecting magnetic rod 216 and engaging it against the side of the connector 207. At this point, an electric cylinder controls the movement of the connector 207, causing the rack 214 and gear 210 to mesh and rotate, resulting in friction between the hot press wheel 204 and the grinding head 209, thus cleaning the surface of the hot press wheel 204. This achieves automatic and timely cleaning of the hot press wheel after each bonding operation, ensuring quick cleaning and preventing prolonged adhesion that would hinder later cleaning.

[0032] Example 3 further optimizes the glass chip bonding device provided in Example 2, specifically, as follows: Figures 6-8 and Figure 11 As shown, traction rods 218 are fixedly installed on both sides of the top of the traction block 208, and uprights 219 are provided on the top of the support plate 211. The outer end of the traction rod 218 is vertically slidably engaged with the bottom of the top of the upright 219, and the upright 219 is vertically slidably engaged with the top of the support plate 211. A rotating groove facing inward is opened in the middle of the support plate 211. A sleeve 212 is rotatably installed at the bottom of the upright 219 through a torsion spring. A telescopic spring 213 is slidably fitted inside the sleeve 212. The bottom end of the telescopic spring 213 is attached to the lower side of the hot pressure wheel 204. When the hot press roller 204 is moved to both sides, the hot press roller 204 will push the sleeve 212 and the telescopic spring 213 to both sides. When the telescopic spring 213 moves to the outermost side, it can clamp the two sides of the glass chip. Then, the glass chip can be transported by the bonding mechanism 2. Then, the electric cylinder 203 controls the traction rod 218 to pull the upright rod 219 to move vertically upward, so that the glass chip and the hot press roller 204 squeeze each other, thereby realizing the separation of the glass chip after transport, thus realizing the transport and loading / unloading of the glass chip.

[0033] The sleeve 212 and telescopic spring 213, under the action of the torsion spring, are always in contact with the outside of the hot pressure roller 204. When the hot pressure roller 204 moves to the outermost position, the sleeve 212 and telescopic spring 213 move outward synchronously, and the bottom end of the telescopic spring 213 is in contact with both sides of the glass chip, thereby clamping both sides of the glass chip. When the guide rod 205 moves upward, the traction rod 219 moves upward, so that the glass chip at the bottom of the telescopic spring 213 interacts with the hot pressure roller 204, thereby achieving separation. This not only enables the handling of glass chips but also enables automatic loading and unloading, solving the problem of needing to add mechanical claws to handle glass chips in the prior art.

[0034] The glass chip bonding device provided by this invention is used as follows: The glass chip is placed on top of the tray 103 and transported to the underside of the hot press head 202 via the cross transport shaft 102. Then, the hot press head 202 is moved up and down by the lifting motor 201, so that the hot press roller 204 at the bottom of the hot press head 202 presses against the top of the glass chip. At this time, the hot press roller 204 is subjected to the pressure from the bottom and, in conjunction with the guide groove opened on the inner wall of the hot press head 202, moves the hot press roller 204 and meshes with the gear 210, so that the hot press roller 204 rotates. At this time, through the action of uniform rotation, the surface of the glass chip is not locally overheated, thereby preventing the chip from warping. After bonding the glass chip, the traction block 208 is energized and magnetized, causing it to attract the connecting magnetic rod 216. This causes the connecting magnetic rod 216 to rotate along with the rack 214, bringing it into contact with both sides of the traction block 208. The connecting magnetic rod 216 then presses the pushing blocks 228 on both sides of the connector 207 towards the center of the slot 222. This, in turn, causes the pushing blocks 228 to support the pressing block 223 outwards, thereby causing the push rod 224 to press the positioning rod 226 inside the positioning hole 221. When the pressure is applied outwards, the electric cylinder 203 can control the guide rod 205 to pull the connector 207 to slide vertically relative to the traction block 208 inside the grinding head 209, thereby controlling the meshing between the rack 214 and the gear 210, thus causing the hot pressure wheel 204 to rotate. At this time, the gear 210 on the outside of the hot pressure wheel 204 is limited by the rack 214. When the rack 214 slides vertically up and down, the hot pressure wheel 204 is pressed against the side of the grinding head 209 and rotates continuously, thereby cleaning the surface of the hot pressure wheel 204. When the hot press roller 204 is moved to both sides, the hot press roller 204 will push the sleeve 212 and the telescopic spring 213 to both sides. When the telescopic spring 213 moves to the outermost side, it can clamp the two sides of the glass chip. Then, the glass chip can be transported by the bonding mechanism 2. Then, the electric cylinder 203 controls the traction rod 218 to pull the upright rod 219 to move vertically upward, so that the glass chip and the hot press roller 204 squeeze each other, thereby realizing the separation of the glass chip after transport, thus realizing the transport and loading / unloading of the glass chip.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A glass chip bonding device, characterized in that, The device includes a base (1), on the top of which a machine head (101) is fixedly mounted. A bonding mechanism (2) is vertically slidably mounted on the front of the machine head (101). A lifting motor (201) is fixedly mounted on the top of the bonding mechanism (2) on the front of the machine head (101). The bonding mechanism (2) includes a hot press head (202). An electric cylinder (203) is fixedly mounted on the top of the hot press head (202). A traction block (208) is vertically slidably mounted in the middle of the inner cavity of the hot press head (202). A connector (207) is snapped into the middle of the top of the traction block (208). A guide rod (205) is fixedly mounted on the top of the connector (207). The top of the guide rod (205) is fixedly connected to the output end of the electric cylinder (203). A spring (206) is fixedly connected between the top of the inner cavity of the hot press head (202) and the traction block (208). A grinding head (209) is fixedly connected to the bottom of the traction block (208). A hot pressure roller (204) is provided on both sides of the grinding head (209). Two pairs of sliding guide grooves that are inclined outward and upward are symmetrically opened on the inner wall of the hot pressure roller (202). A rotating shaft (217) is fixedly installed in the middle of the hot pressure roller (204). Gears (210) are fixedly installed on both sides of the hot pressure roller (204). A rack (214) is provided at the bottom of the sliding guide groove. The gear (210) meshes with the rack (214). The end of the rotating shaft (217) is rotatably sleeved inside the sliding guide groove.

2. The glass chip bonding device according to claim 1, characterized in that, The rack (214) has a guide groove (215) in the middle, and a limiting shaft (220) is sleeved inside the guide groove (215). The limiting shaft (220) is fixedly installed on the inner wall of the hot press head (202), and the limiting shaft (220) is located below the outer side of the gear (210).

3. The glass chip bonding device according to claim 2, characterized in that, A connecting magnetic rod (216) is fixedly connected between the tops of two adjacent racks (214), and a support plate (211) is fixedly installed on both sides of the inner wall of the hot press head (202), with the top of the connecting magnetic rod (216) pressing on the top of the support plate (211).

4. A glass chip bonding device according to claim 3, characterized in that, The traction block (208) has a vertical groove (229) in the middle. The connector (207) is vertically slidably engaged inside the vertical groove (229). The inner cavity of the vertical groove (229) has symmetrically arranged mounting grooves (230). The inner side of the mounting groove (230) is slidably engaged with a positioning rod (226). The outer side of the positioning rod (226) is fixedly connected with a limit spring (227). The outer side of the limit spring (227) is fixedly connected to the inner wall of the outer side of the mounting groove (230).

5. A glass chip bonding device according to claim 4, characterized in that, A pair of extrusion blocks (223) are symmetrically slidably installed in the middle of the connector (207). A push rod (224) is fixedly connected to the outer side of the extrusion block (223). A support spring (225) is fixedly connected between the outer side of the push rod (224) and the inner wall of the connector (207). A pair of push blocks (228) are symmetrically arranged between the two extrusion blocks (223).

6. A glass chip bonding device according to claim 5, characterized in that, The connector (207) has positioning holes (221) on both sides, and slots (222) are provided on the front and back sides of the connector (207). The outer ends of the push block (228) are located inside the slots (222), and the outer ends of the push rod (224) are slidably engaged inside the positioning holes (221).

7. A glass chip bonding device according to claim 4, characterized in that, Both sides of the top of the traction block (208) are fixedly installed with traction rods (218), and the top of the support plate (211) is provided with uprights (219). The outer end of the traction rod (218) is vertically slidably engaged with the bottom of the top of the upright (219), and the upright (219) is vertically slidably engaged with the top of the support plate (211).

8. A glass chip bonding device according to claim 7, characterized in that, The support plate (211) has a rotating groove facing inward in the middle. The bottom of the upright (219) is fitted with a sleeve (212) by a torsion spring. The sleeve (212) is fitted with a telescopic spring (213) inside. The bottom end of the telescopic spring (213) is attached to the side of the hot press wheel (204).

9. A glass chip bonding device according to claim 1, characterized in that, The grinding head (209) has a chamfer on its top outer side. The hot pressure roller (204) is attached to the side of the grinding head (209). When the hot pressure roller (204) rotates on the side of the grinding head (209), the grinding head (209) scrapes and cleans the surface of the hot pressure roller (204).

10. A glass chip bonding device according to claim 1, characterized in that, A cross transport shaft (102) is fixedly installed on the top of the base (1), and a tray (103) is fixedly installed on the top of the cross transport shaft (102). The cross transport shaft (102) controls the tray (103) to move laterally and longitudinally.

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