Laser module of laser debonding and film tearing all-in-one machine

Abstract

The invention provides a laser module of a laser debonding and film tearing all-in-one machine, which belongs to the technical field of wafer processing equipment and comprises a laser emitting device for emitting laser beams and a control unit for controlling the laser module. The power adjusting device is mounted on a propagation path of the laser beam and is used for adjusting the power of the laser beam according to a process requirement; the beam expander is used for adjusting the spot size; the positioning assembly comprises two groups of positioning mirrors used for correcting the position and angle of a laser beam, the beam expander and the two groups of positioning mirrors are located on a laser beam propagation path through two groups of first refractors and second refractors respectively, and the laser power monitoring device is used for monitoring the laser power of the laser beam in real time and dynamically adjusting the laser power of the laser beam; the galvanometer is used for changing the reflection angle of the laser beam to scan a machining area; therefore, dislocation of a de-bonding area caused by optical path offset is avoided, and material breakdown caused by too high power and insufficient de-bonding caused by insufficient power or improper light spot adaptation are prevented.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing equipment technology, and more specifically, relates to the laser module of a laser debonding and film peeling integrated machine. Background Technology

[0002] In the field of semiconductor wafer manufacturing, bonding and debonding are processes that ensure the structural integrity and processing precision of devices. As devices become smaller and thinner, the requirements for the separation precision of bonding materials are becoming increasingly stringent. Traditional mechanical peeling can easily cause scratches on the device surface, while chemical dissolution methods pose a risk of contamination and are difficult to control the reaction boundary. Laser debonding, with its advantages of being non-contact, having concentrated energy, and being able to target a precise area, has become the mainstream technology.

[0003] However, in complex processing scenarios, the laser modules of existing laser debonding equipment rely on manual preset and static adjustment for optical path calibration. The relative positional deviation between the laser beam and the processing platform is prone to accumulate, which can easily lead to debonding area shift and the spot size cannot be flexibly adapted to the type and thickness of the adhesive material. This often results in situations where the material is broken down due to excessive power or the debonding is insufficient due to insufficient power. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a laser module for a laser debonding and film-peeling integrated machine. This addresses the issues in the prior art where the optical path calibration of existing laser modules relies on manual presets and static adjustments, which can easily lead to debonding area shifts and the inability to flexibly adapt the spot size to the type and thickness of the adhesive material. This often results in material breakdown due to excessive power or insufficient debonding due to insufficient power.

[0005] The purpose and effectiveness of the laser module in the laser debonding and film peeling integrated machine of the present invention are achieved by the following specific technical means: The laser module of the laser debonding and film peeling integrated machine includes: The equipment box contains a laser emitting device for emitting laser beams and a control unit for controlling the laser module. A power adjustment device is installed at the orientation of the laser emitting device and on the propagation path of the laser beam. The power adjustment device is used to adjust the power of the laser beam according to process requirements. A beam expander is located in the propagation path of a laser beam through two sets of first refracting mirrors. The beam expander is used to adjust the spot size, reduce energy density, and improve beam collimation. The positioning component is installed on one side of the beam expander. The positioning component includes two sets of positioning mirrors for correcting the position and angle of the laser beam. The two sets of positioning mirrors are located on the propagation path of the laser beam through two sets of second refraction mirrors. A laser power monitoring device is installed on one side of the positioning component. The laser power monitoring device is used to monitor the laser power of the laser beam in real time and make dynamic adjustments. A galvanometer is installed on one side of the laser power monitoring device. The galvanometer is used to change the reflection angle of the laser beam to scan the processing area.

[0006] According to a preferred embodiment, the control method of the control unit for controlling the laser module includes the following steps: S1: Based on the device initialization data and real-time image data, perform laser optical path calibration and power preset operations to obtain laser output data and alignment coordinate data; S2: Based on laser output data and process requirement data, perform dynamic adjustment of laser power and control of spot size to obtain power output data and calibrated spot size data; S3: Based on the calibrated spot size data and beam uniformity requirement data, perform beam shaping and collimation correction operations to obtain beam quality data; S4: Debonding scan is performed based on alignment coordinate data, beam quality data, and path planning data.

[0007] According to a preferred embodiment, the step of performing laser optical path calibration and power presetting operations based on device initialization data and real-time image data to obtain laser output data and alignment coordinate data includes: Obtain the laser data and optical component calibration data preset by the equipment at the factory, perform system preheating and component initialization operations based on the laser data and optical component calibration data, and obtain laser output data; The CCD positioning system acquires real-time image data of the workbench, performs coordinate system transformation and feature point matching based on the real-time image data, and obtains the relative positional deviation data between the laser optical path and the processing platform. The optical lens pose adjustment operation is performed based on the relative position deviation data. The position deviation is compensated by controlling the angular offset of the positioning component to obtain the alignment coordinate data.

[0008] According to a preferred embodiment, the step of acquiring factory-preset laser data and optical component calibration data, performing system preheating and component initialization operations based on the laser data and optical component calibration data, and acquiring laser output data includes: Read the laser wavelength configuration data, perform laser operating mode setting operation based on the wavelength configuration data, and obtain the mode confirmation signal; Read the thermal expansion coefficient data of the optical components, calculate the preheating temperature curve based on the thermal expansion coefficient data, preheat the components according to the temperature curve through the temperature control system, and obtain the component stable state data; The laser emitting device is started based on the mode confirmation signal and component steady state data. The initial output power is collected through the power monitoring device, and the laser output data is obtained when the power fluctuation is less than the threshold.

[0009] According to a preferred embodiment, the step of acquiring real-time image data of the workbench based on the CCD positioning system, performing coordinate system transformation and feature point matching operations based on the real-time image data, and obtaining relative positional deviation data between the laser optical path and the processing platform includes: The workpiece stage image containing positioning markers is acquired by a CCD camera, the pixel coordinate data of the markers is extracted, and the pixel coordinates are converted to mechanical coordinates based on the CCD camera calibration data to obtain the mechanical coordinate data of the markers. Read the preset standard positioning coordinate data, calculate the difference between the marker point mechanical coordinate data and the standard positioning coordinate data, obtain the position deviation vector and angle offset, and obtain the relative position deviation data based on the position deviation vector and angle offset.

[0010] According to a preferred embodiment, the step of dynamically adjusting the laser power and controlling the spot size based on laser output data and process requirement data, and obtaining power output data and calibrated spot size data, includes: Receive user-input data on adhesive type and thickness, query the corresponding reference power range and reference spot size range from the material data database, and obtain the initial process dataset; Based on the laser output data and the initial process dataset, a reference power value is set through a power adjustment device, and the beam divergence angle is adjusted by controlling the lens spacing of the beam expander to obtain the initial spot size data. Based on the laser power monitoring device, real-time laser power data is collected. When the real-time laser power data is not within the reference power range, the power of the laser beam is adjusted by the power adjustment device to obtain stable power output data. The focal length of the beam expander is recalibrated based on stable power output data. The actual spot size data is collected by a spot analyzer. When the actual spot size data is within the range of the reference spot size, the actual spot size data is the calibrated spot size data.

[0011] According to a preferred embodiment, the step of performing beam shaping and collimation correction operations based on calibrated spot size data and beam uniformity requirement data to obtain beam quality data includes: Retrieve the beam uniformity index required by the process, calculate the target energy distribution curve based on the beam uniformity index, and obtain the theoretical energy distribution data; Based on the calibrated spot size data and theoretical energy distribution data, actual spot energy distribution data are collected by a beam analyzer. The actual data is compared and analyzed with the theoretical data to obtain the energy distribution deviation matrix. By adjusting the spatial configuration of the positioning component based on the energy distribution deviation matrix, energy redistribution is achieved by changing the beam phase distribution and adjusting the beam incident angle, thereby obtaining beam quality data.

[0012] According to a preferred embodiment, the debonding scan based on alignment coordinate data, beam quality data, and path planning data includes: Based on the alignment coordinate data, the machining path data is generated by importing CAD drawings. The scanning trajectory planning operation is performed according to the machining path data, and the galvanometer control instruction set is obtained and executed. Among them, the galvanometer scanning speed is dynamically adjusted based on beam quality data and real-time power monitoring data; Real-time images of the processing area are acquired using a CCD positioning system. Based on these images, the boundary features between the processed and unprocessed areas are extracted to obtain real-time processing progress data. The completion rate is compared with the real-time processing progress data and processing path data. When the deviation exceeds the threshold, the supplementary processing process is triggered.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. By combining equipment initialization data with real-time image data acquired by the CCD positioning system, a full-process optical path calibration mechanism was constructed. During system startup, based on laser wavelength configuration and the thermal expansion coefficient data of optical components, the components are preheated according to a preset temperature curve by the temperature control system, reducing the impact of thermal deformation on the optical path. Simultaneously, images of positioning markers on the worktable are acquired using a CCD camera. After coordinate system transformation and feature point matching, the positional deviation is obtained, and then the two sets of positioning mirrors on the positioning components are used to adjust the angle to compensate for the deviation. This eliminates the need for manual static presets, effectively avoiding misalignment of the debonding area caused by optical path offset, ensuring that the laser beam always acts on the target area, and improving the positional accuracy of the processing.

[0014] 2. By setting up the power adjustment device and beam expander, after receiving the user-input data on the type and thickness of the adhesive material, the system can retrieve the corresponding reference power and spot range from the material database. The initial power is set via the power adjustment device, and the spot size is changed by adjusting the lens spacing of the beam expander. The laser power monitoring device collects power data in real time and dynamically corrects for fluctuations. Based on stable power output, the beam expander focal length is recalibrated to ensure the spot size meets process requirements. This linkage control mechanism between power and spot size allows for flexible parameter adjustment according to the characteristics of different adhesive materials. It avoids material breakdown caused by excessive power and prevents insufficient debonding caused by insufficient power or improper spot size adaptation, ensuring consistent processing quality.

[0015] 3. Based on the beam uniformity index required by the process, the system collects actual beam energy distribution data and compares it with the theoretical distribution. Energy redistribution is achieved by adjusting the configuration of the positioning components, improving beam uniformity. During the scanning phase, processing path data is imported based on alignment coordinates to generate galvanometer control commands. Simultaneously, the scanning speed is dynamically adjusted based on beam quality and real-time power data to ensure uniform energy application. Furthermore, real-time image acquisition of the processing area via CCD extracts boundary features to obtain processing progress. If deviations occur, a reprocessing step is triggered. This not only improves the consistency of beam energy distribution but also promptly corrects deviations during processing, ensuring the integrity of the debonding process and reducing the probability of defective products. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention.

[0017] Figure 2 This is a flowchart of the control method for the laser module in this invention.

[0018] In the diagram, the correspondence between component names and drawing numbers is as follows: 1. Laser emitting device; 2. Power adjustment device; 3. First refracting mirror; 4. Beam expander; 5. Positioning mirror; 6. Second refracting mirror; 7. Laser power monitoring device; 8. Galvanometer. Detailed Implementation

[0019] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0020] Example:

[0021] As attached Figure 1 As shown: This invention provides a laser module for a laser debonding and film-peeling integrated machine, comprising: The equipment box contains a laser emitting device 1 for emitting a laser beam and a control unit for controlling the laser module. The power adjustment device 2 is installed at the orientation position of the laser emitting device 1 and is located on the propagation path of the laser beam. When in use, the power of the laser beam is adjusted by inputting parameters through the control unit or by manually adjusting the power adjustment device 2 according to the thickness of the adhesive material and the bonding strength. The beam expander 4 is located on the propagation path of the laser beam through two sets of first refraction mirrors 3. The two sets of first refraction mirrors 3 are used to change the propagation direction of the laser beam and guide the laser beam emitted by the laser emitting device 1 to the beam expander 4. The beam expander 4 adjusts the spot size by adjusting the spacing between the internal mirrors. When it is necessary to process a large bonding area, the mirror spacing is increased to expand the spot. When it is necessary to process a local fine area, the mirror spacing is reduced to reduce the spot. At the same time, this operation can reduce the energy density of the laser beam, avoid direct action that could damage the material, and also improve the collimation of the beam, making the laser propagation path more stable. The positioning component is installed on one side of the beam expander 4. The positioning component includes two sets of positioning mirrors 5 for correcting the position and angle of the laser beam. Two sets of second refraction mirrors 6 guide the laser beam output from the beam expander 4 to the two sets of positioning mirrors 5. In use, the control unit finely adjusts the tilt angle of the positioning mirrors 5 according to the image data fed back by the CCD positioning system. Laser power monitoring device 7 is installed on one side of the positioning component. After the laser beam passes through the positioning component, it enters the laser power monitoring device 7. The laser power monitoring device 7 continuously collects laser power data and transmits it to the control unit. When the power is detected to be lower than the process requirements, the control unit drives the power adjustment device 2 to increase the output. When the power is higher than the process requirements, the control unit controls the power adjustment device 2 to reduce the output, thereby achieving dynamic power stabilization. The galvanometer 8 is installed on one side of the laser power monitoring device 7. It receives the laser beam after power monitoring. When in use, the control unit sends a control signal to the galvanometer 8 according to the preset processing path data, changes the reflection angle of the galvanometer 8, and makes the laser beam move in the processing area according to the set trajectory.

[0022] Please see as follows Figure 2 As shown, the control method of the control unit for the laser module includes the following steps: S1: Based on the device initialization data and real-time image data, perform laser optical path calibration and power preset operations to obtain laser output data and alignment coordinate data.

[0023] Specifically, the system first retrieves the factory-preset laser data and optical component calibration data from the equipment storage unit. The laser data includes the wavelength configuration and power output range of the laser emitting device 1; the optical component calibration data includes the initial installation angle of the positioning mirror 5, the position reference of the first refractor 3 and the second refractor 6, and the initial lens spacing of the beam expander 4. Based on this data, the system preheats and components are initialized to obtain laser output data. Specifically, the laser wavelength configuration data is read first, and the corresponding wavelength is selected according to the type of adhesive being processed. Then, the thermal expansion coefficient data of the optical components is read. Different components, such as the positioning mirror 5 and the beam expander 4, have different thermal expansion coefficients. Based on this data, the preheating temperature curve is calculated, and the heating elements in the equipment box are controlled by the temperature control system to heat up according to this curve. When the temperature of each component stabilizes and no longer exhibits thermal deformation, the component stable state data is obtained. Based on the mode confirmation signal and the component stable state data, the laser emitting device 1 is started, and the laser power monitoring device 7 is simultaneously activated to continuously collect the initial output power. Then, real-time image data of the workbench is acquired based on the CCD positioning system. The camera of the CCD positioning system captures images of the workbench surface, which contain preset positioning markers on the workbench. Based on these real-time image data, coordinate system transformation and feature point matching operations are performed to obtain the relative positional deviation data between the laser path and the processing platform.

[0024] The process involves continuously capturing several images of the workpiece stage containing positioning markers using a CCD camera. Image processing software is used to extract the pixel coordinates of the markers in each image, and then converting these pixel coordinates to mechanical coordinates based on the CCD camera's calibration data. The converted mechanical coordinates are then averaged to obtain the marker's mechanical coordinate data. The standard positioning coordinates corresponding to the marker are read from the control unit's preset parameters. The difference between the marker's mechanical coordinates and the standard positioning coordinates is calculated to obtain the position deviation vector and angular offset. These values ​​are used to obtain the relative position deviation data. Finally, based on the relative position deviation data, the optical lens pose is adjusted. The control unit sends an adjustment command to the positioning component, which uses two sets of positioning mirrors 5 to perform angular offsets to compensate for the positional deviation between the laser path and the processing platform. After adjustment, the CCD camera is used to capture another image to confirm that the deviation has been eliminated, thus obtaining the alignment coordinate data.

[0025] Furthermore, by combining equipment initialization data with real-time image data acquired by the CCD positioning system, a full-process optical path calibration mechanism was constructed. During system startup, based on laser wavelength configuration and the thermal expansion coefficient data of optical components, the temperature control system preheats the components according to a preset temperature curve, reducing the impact of thermal deformation of components such as the beam expander 4 and positioning mirror 5 caused by temperature changes on the optical path propagation direction. Simultaneously, the CCD camera acquires images of the positioning markers on the worktable, and the positional deviation is obtained through coordinate system transformation and feature point matching. The two sets of positioning mirrors 5 on the positioning components then adjust their angles to compensate for the deviation. The entire process is automatically completed by the control unit, eliminating the need for manual static parameter presets. This allows for timely correction of optical path offsets caused by component installation errors, temperature changes, and other factors, preventing the laser beam from deviating from the debonding area and ensuring that the laser beam always acts on the target area, thus improving the positional stability of the processing. S2: Based on laser output data and process requirement data, perform dynamic adjustment of laser power and control of spot size to obtain power output data and calibrated spot size data.

[0026] Specifically, the control unit receives user-inputted adhesive type and thickness data through the user interface. Based on this data, it accesses a pre-stored material data database containing processing parameters for different adhesives at various thicknesses. After querying, it obtains an initial process dataset including a reference power range and a reference spot size range. The control unit then retrieves the reference power range and the reference spot size range. Based on the laser output data and initial process dataset obtained in step S1, the control unit sends a command to the power adjustment device 2. By adjusting the position of the attenuator inside the power adjustment device 2 or the driving current of the laser emitting device 1, the power is set to the middle value within the reference power range. Simultaneously, a control signal is sent to the beam expander 4. The motor inside the beam expander 4 drives the movable lens to change the spacing. Increasing the spacing increases the beam divergence angle, while decreasing it decreases it, thus adjusting the spot size. At this point, a spot analyzer initially collects the spot size data. Then, the laser power monitoring device 7 is activated, continuously collecting real-time laser power data several times per second. When the collected data is lower or higher than the reference power range, the control unit immediately sends an adjustment command to the power adjustment device 2. If the power is too low, the attenuation is reduced or the drive current is increased; if the power is too high, the attenuation is increased or the drive current is decreased, until the real-time power stabilizes within the reference power range. At this point, stable power output data is obtained. Based on the stable power output data, the control unit again controls the beam expander 4 to fine-tune the internal lens spacing to recalibrate the focal length, preventing spot size shifts caused by power changes. After calibration, the spot analyzer collects the actual spot size data again. When the real-time laser power data is within the reference power range, this actual spot size data is the calibrated spot size data.

[0027] Furthermore, after receiving the user's input of the adhesive material type and thickness data, the system does not require repeated manual trial and error. It directly retrieves the matching reference power and spot range from the material database, quickly sets the initial power through the power adjustment device 2, and simultaneously adjusts the spot size by changing the lens spacing of the beam expander 4 to adapt to the energy requirements of different adhesive materials. The laser power monitoring device 7 continuously collects data and feeds it back to the control unit. If power fluctuations are caused by grid voltage fluctuations, slight component heating, etc., the control unit will drive the power adjustment device 2 to correct them in time to ensure that the power is always within the reference range. Since power changes may affect the beam focusing state, the focal length of the beam expander 4 is recalibrated based on stable power output to avoid excessive deviation in the spot size.

[0028] S3: Based on the calibrated spot size data and beam uniformity requirement data, perform beam shaping and collimation correction operations to obtain beam quality data.

[0029] Specifically, the control unit retrieves the beam uniformity index corresponding to the current processing from the process parameter library. This index is usually expressed as a percentage of energy distribution uniformity. Based on this index and the calibration spot size data, the target energy distribution curve is calculated using an energy distribution algorithm. If it is a processing of adhesive materials that requires uniform action, the target curve is usually a flat-top distribution. If it is a scenario where slightly higher energy is required at the edges, the target curve is a slightly convex distribution at the edges. The theoretical energy distribution data is obtained from this. Based on the calibration spot size data and the theoretical energy distribution data, the beam analyzer is connected to the laser optical path between the laser power monitoring device 7 and the galvanometer 8. The beam analyzer is started to collect the actual spot energy distribution data after adjustment by the beam expander 4 and the positioning mirror 5. The collection needs to cover the entire calibration spot range and record the energy values ​​at multiple points, including the spot center, half radius, and edge. Then, the actual collected energy data at each point is compared with the theoretical energy distribution data one by one, and the energy deviation value at each point is calculated. These deviation values ​​are arranged according to their spatial positions to form an energy distribution deviation matrix. Based on the energy distribution deviation matrix, the control unit sends adjustment commands to the drive mechanism of the positioning component. The tilt angle or slight displacement is adjusted by the two sets of positioning mirrors 5 respectively. The phase modulation effect of the positioning mirrors 5 is used to change the phase distribution of the beam, so that the beam part of the beam in the high energy area of ​​the beam spot is deflected to the low energy area, realizing energy redistribution. At the same time, the incident direction of the beam is corrected by fine-tuning the angle of the positioning mirrors 5 to ensure that the beam propagation direction is consistent with the preset path. After the adjustment is completed, the beam energy distribution and propagation direction data are collected again by the beam analyzer. When the uniformity reaches the process index and the beam propagation direction is not deviated, the beam quality data including uniformity, collimation and energy distribution curve are obtained.

[0030] Furthermore, based on the beam uniformity index required by the process, the system does not need to rely on external equipment for separate adjustment. It directly collects actual data through the built-in beam analyzer and compares it with the theoretical distribution to locate areas with uneven energy distribution. By adjusting the spatial configuration of the positioning mirror 5 in the positioning component, the beam uniformity is improved.

[0031] S4: Debonding scan is performed based on alignment coordinate data, beam quality data, and path planning data.

[0032] Specifically, the control unit first calls the alignment coordinate data obtained in step S1, and imports the machining path data generated from the CAD drawing based on this. The CAD path data is matched with the alignment coordinate data through a coordinate transformation algorithm to correct the path offset caused by the workpiece placement deviation. Then, the scanning trajectory planning operation is performed based on the corrected machining path data. The continuous path is decomposed into several small straight or arc trajectories. The reflection angle parameters of the galvanometer 8 corresponding to each trajectory segment are calculated, and a galvanometer control instruction set containing angle values ​​and switching times is generated. The instruction is sent to the galvanometer 8 through the drive circuit, so that the galvanometer 8 adjusts the reflection angle according to the instruction and guides the laser beam to move along the planned trajectory.

[0033] Based on the beam quality data obtained in step S3 and the power data collected in real time by the laser power monitoring device 7, the control unit dynamically adjusts the scanning speed of the galvanometer 8. When the beam energy uniformity is high and the power is stable within the reference range, the scanning speed is increased; when a slight decrease in beam energy or power is detected at the beam edge, the scanning speed is decreased to ensure consistent energy of the laser beam at each position. Simultaneously, based on the CCD positioning system, real-time images of the processing area are continuously acquired, and image processing algorithms are used to identify the boundary features between processed and unprocessed areas in the image. The processed areas may exhibit lighter color or color variations due to adhesive layer debonding. As reflectivity changes, unprocessed areas remain in their original state. By extracting the pixel coordinates of these boundaries and converting them into mechanical coordinates, the proportion of the area or length of the processed area to the total processed area is calculated to obtain real-time processing progress data. Based on the real-time processing progress data and the total processing volume in the processing path data, the completion rate is compared, and a deviation threshold is set. When the difference between the real-time progress and the theoretical progress exceeds the deviation threshold, it is determined that a processing omission or deviation has occurred. The control unit immediately pauses the current scan, calls the path data of the unprocessed area to generate a supplementary processing instruction, drives the galvanometer 8 to perform a second scan of the missed area, and continues to execute the remaining path after the supplementary processing is completed.

[0034] Furthermore, during the scanning phase, the CAD path is corrected based on the alignment coordinate data to ensure that the laser beam always moves along the area of ​​the workpiece that actually needs to be debonded. For example, when processing the adhesive layer on the edge of a mobile phone screen, it can avoid the laser scanning into non-adhesive layer areas due to the tilt of the screen. The scanning speed of the galvanometer 8 is dynamically adjusted by combining beam quality and real-time power data to adapt to subtle changes in beam energy. For example, the speed is increased when the energy at the center of the beam is slightly higher and decreased when the energy at the edge is slightly lower, ensuring that the debonding effect of each part of the adhesive layer is consistent. In addition, by acquiring images and extracting boundary features in real time through CCD, the processing progress can be intuitively grasped. If a section of the path is not scanned due to a brief malfunction of the galvanometer 8, the deviation between the real-time progress and the theoretical progress will exceed the threshold. The triggered reprocessing process can promptly cover the unprocessed area. Whether it is a local adhesive layer of a small electronic component or a whole ring adhesive layer of a large panel, this operation can ensure the integrity of the debonding process and reduce defective products caused by local missed processing or uneven energy.

[0035] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A laser module of a laser debonding and film tearing all-in-one machine, characterized in that, The device box is internally provided with a laser emitting device for emitting a laser beam and a control unit for controlling the laser module. A power adjusting device is installed at a position facing the laser emitting device and located on the propagation path of the laser beam, and is used to adjust the power of the laser beam according to process requirements. A beam expander is located on the propagation path of the laser beam through two groups of first refractive mirrors, and is used to adjust the spot size, reduce the energy density, and improve the collimation of the beam. A positioning assembly is installed on one side of the beam expander, and includes two groups of positioning mirrors for correcting the position and angle of the laser beam, and the two groups of positioning mirrors are located on the propagation path of the laser beam through two groups of second refractive mirrors. A laser power monitoring device is installed on one side of the positioning assembly, and is used to monitor and dynamically adjust the laser power of the laser beam in real time. A galvanometer is installed on one side of the laser power monitoring device, and is used to change the reflection angle of the laser beam to scan the processing area. The control method of the control unit for the laser module includes the following steps: 2.The laser module of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that: S1: based on device initialization data and real-time image data, laser light path calibration and power presetting operation is performed to obtain laser output data and alignment coordinate data; S2: based on laser output data and process requirement data, laser power dynamic adjustment and spot size control operation is performed to obtain power output data and calibrated spot size data; S3: based on calibrated spot size data and beam uniformity requirement data, beam shaping and collimation correction operation is performed to obtain beam quality data; S4: based on alignment coordinate data, beam quality data, and path planning data, debonding scanning is performed. The laser output data is obtained by acquiring factory pre-set laser data and optical component calibration data, and performing system preheating and component initialization operation based on the laser data and optical component calibration data. 3.The laser module of the laser debonding and film tearing all-in-one machine according to claim 2, characterized in that, Real-time image data of the workbench is collected based on a CCD positioning system, coordinate system conversion and feature point matching operation is performed based on the real-time image data, and relative position deviation data of the laser light path and the processing platform is obtained. The optical lens pose adjustment operation is performed based on the relative position deviation data, the angle offset of the positioning assembly is controlled to compensate for the position deviation, and the alignment coordinate data is obtained. The laser output data is obtained by reading the wavelength configuration data of the laser, performing laser working mode setting operation based on the wavelength configuration data, and obtaining mode confirmation signal. The optical component thermal expansion coefficient data is read, the preheating temperature curve is calculated based on the thermal expansion coefficient data, the components are preheated through the temperature control system according to the temperature curve, and the component stable state data is obtained.

4. The laser module of claim 3, wherein the laser module is configured to perform the laser debonding and the film tearing simultaneously. ​ ​ ​ The laser emitting device is started based on the mode confirmation signal and the component stable state data, the initial output power is collected through the power monitoring device, and the laser output data is obtained when the power fluctuation is less than a threshold.

5. The laser module of claim 3, wherein the laser module is configured to perform the laser debonding and the film tearing simultaneously. The CCD positioning system collects real-time image data of the workbench, performs coordinate system conversion and feature point matching operations based on the real-time image data, and obtains relative position deviation data of the laser light path and the machining platform, including: The CCD camera collects the workpiece table image containing the positioning marker points, extracts the marker point pixel coordinate data, performs pixel coordinate to mechanical coordinate conversion operation based on the CCD camera calibration data, and obtains the marker point mechanical coordinate data; The preset standard positioning coordinate data is read, the marker point mechanical coordinate data is difference calculated with the standard positioning coordinate data, the position deviation vector and the angle offset are obtained, and the relative position deviation data is obtained according to the position deviation vector and the angle offset.

6. The laser module of claim 2, wherein the laser module is configured to perform the laser debonding and the film tearing simultaneously. The laser power dynamic adjustment and the spot size control operations are performed based on the laser output data and the process requirement data, the power output data and the calibration spot size data are obtained, including: The material type and thickness data input by the user are received, the corresponding reference power range and reference spot size range are queried based on the material data database, and the initial process data set is obtained; The initial process data set is obtained based on the laser output data and the initial process data set, the reference power value is set through the power adjustment device, and the lens spacing of the beam expander is controlled to adjust the beam divergence angle to obtain the initial spot size data; Real-time laser power data is collected based on the laser power monitoring device, and when the real-time laser power data is not within the reference power range, the power of the laser beam is adjusted through the power adjustment device to obtain stable power output data; The focal length of the beam expander is recalibrated based on the stable power output data, and the actual spot size data is collected through the spot analyzer, and when the actual spot size data is within the reference spot size range, the actual spot size data is the calibration spot size data.

7. The laser module of claim 2, wherein the laser module is configured to perform the laser debonding and the film tearing simultaneously. The light beam shaping and collimation correction operations are performed based on the calibration spot size data and the light beam uniformity requirement data, and the light beam quality data is obtained, including: The light beam uniformity index required by the process is called, the target energy distribution curve is calculated based on the light beam uniformity index, and the theoretical energy distribution data is obtained; The actual spot energy distribution data is collected through the light beam analyzer based on the calibration spot size data and the theoretical energy distribution data, the actual data and the theoretical data are compared and analyzed, and the energy distribution deviation matrix is obtained; The positioning component spatial configuration is adjusted based on the energy distribution deviation matrix, the energy redistribution is realized by changing the light beam phase distribution, and the light beam incidence angle is adjusted, and the light beam quality data is obtained.

8. The laser module of claim 2, wherein the laser module is configured to perform the laser debonding and the film tearing simultaneously. The alignment coordinate data, the light beam quality data and the path planning data are used to perform un-bonding scanning, including: The machining path data generated by the CAD drawing is imported based on the alignment coordinate data, the scanning track planning operation is performed according to the machining path data, the galvanometer control instruction set is obtained and executed; The galvanometer scanning speed is dynamically adjusted based on the light beam quality data and the real-time power monitoring data. The CCD positioning system collects real-time images of the processing area, extracts the boundary features of the processed area and the unprocessed area according to the real-time images of the processing area, and obtains real-time processing progress data; Based on the real-time processing progress data and the processing path data, the completion degree comparison is carried out, and the reprocessing process is triggered when the deviation exceeds the threshold.

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