Wafer rotating positioning device and wafer cleaning method

Abstract

The application provides a wafer rotating positioning device and a wafer cleaning method, and the wafer rotating positioning device comprises at least two groups of limiting components and a driving component; the limiting component comprises a rotating disc, at least three positioning pins, an upper magnetic driving part and a lower magnetic driving part, the bottom of the positioning pin is rotationally connected with the edge of the rotating disc, the bottom of the rotating disc is provided with a guide part with a first inclined surface, the top of the upper magnetic driving part is provided with a rotating block, the rotating block and the first inclined surface are offset arranged, and the upper magnetic driving part and the lower magnetic driving part are arranged in the same direction of magnetic poles; the driving component drives the lower magnetic driving part to move longitudinally upward alternately, the upper magnetic driving part moves longitudinally upward under the action of magnetic repulsion, the rotating block slides along the first inclined surface and pushes the rotating disc to rotate axially, and the positioning pin rotates axially and releases the wafer. Through the application, the dead angle area formed at the edge of the positioning pin and the wafer is cleaned and dried, and the wafer has good cleaning effect.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and in particular to a wafer rotation positioning device and a wafer cleaning method. Background Technology

[0002] Wafer cleaning is one of the most basic, frequent, and critical process steps in semiconductor manufacturing. Its fundamental purpose can be summarized as: to thoroughly remove various contaminants introduced during the manufacturing process without damaging or altering the wafer surface material, electrical properties, and microstructure, thereby ensuring the high performance, high yield, and long-term reliability of the device.

[0003] In wafer cleaning, the centrifugal force generated by high-speed rotation propels liquid from the center of the wafer to the edge, spreading it into a very thin and uniform liquid film on the wafer surface to achieve a uniform cleaning effect. Therefore, wafer cleaning relies on a positioning mechanism to control wafer rotation. Existing positioning mechanisms typically use multiple positioning pins around the wafer, which are pressed against the wafer edge to hold the wafer in place for rotation. However, precisely because the positioning pins are pressed against the wafer edge, the edge contact area obstructs the flow of liquid during cleaning, resulting in poor cleaning at the edge contact area and the presence of contaminant residue. Furthermore, the tiny gaps and dead angles formed between the positioning pins and the wafer edge act as capillaries, trapping liquid even during high-speed rotation and drying, resulting in liquid residue after drying.

[0004] In view of this, it is necessary to improve the positioning mechanism in the existing technology to solve the above problems.

[0005] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of the present invention. Summary of the Invention

[0006] The purpose of this invention is to solve the problems of poor cleaning effect and liquid and contaminant residue at the positioning pin and wafer edge in the existing positioning mechanism during wafer cleaning process, because the positioning pin needs to be close to the edge of the wafer to hold the wafer.

[0007] To achieve the above objectives, the present invention provides a wafer rotation positioning device, comprising:

[0008] At least two sets of limit components and drive components;

[0009] The limiting component includes: a turntable, at least three circumferentially positioned pins at the edge of the turntable, an upper magnetic drive component at the bottom of the turntable, and a lower magnetic drive component at the bottom of the upper magnetic drive component. The bottom of the positioning pins is rotatably engaged with the edge of the turntable. A guide component with a first inclined surface protrudes from the bottom of the turntable. A rotating block protrudes from the top of the upper magnetic drive component, and the rotating block is offset from the first inclined surface. The upper magnetic drive component and the lower magnetic drive component are arranged with their magnetic poles in the same direction.

[0010] The driving component alternately drives the lower magnetic drive member included in the single set of limiting components to move longitudinally upward. Under the magnetic repulsion of the upper magnetic drive member and the lower magnetic drive member, the upper magnetic drive member moves longitudinally upward. The rotating block slides along the first inclined plane and pushes the turntable to rotate axially, thereby driving the positioning pin to rotate axially and releasing the wafer.

[0011] As a further improvement of the present invention, the wafer rotation positioning device further includes: a reset disk disposed on the top of the turntable and at least one reset member disposed between the turntable and the reset disk, wherein a first hook portion is formed on the inner side of the reset disk, a second hook portion is formed inside the turntable, and the two ends of the reset member are respectively connected to the first hook portion and the second hook portion.

[0012] The driving component retracts the drive to move the lower magnetic drive member included in the limiting component longitudinally upward. The lower magnetic drive member and the upper magnetic drive member move longitudinally downward under the action of gravity. Under the elastic force of the reset member, the turntable rotates axially to drive the positioning pin to rotate axially and clamp the wafer.

[0013] As a further improvement of the present invention, the upper magnetic drive member is provided with a plurality of first mounting grooves circumferentially recessed on one side facing the lower magnetic drive member, and a first magnetic block is provided in the first mounting groove, wherein the first magnetic block and the lower magnetic drive member are arranged with their magnetic poles in the same direction.

[0014] As a further improvement of the present invention, the upper magnetic drive member is circumferentially recessed in a first guide groove on one side facing the lower magnetic drive member, a first guide rail is provided in the first guide groove, and a second magnetic block is movably sleeved on the outside of the first guide rail. The second magnetic block and the lower magnetic drive member are arranged with their magnetic poles in the same direction.

[0015] As a further improvement of the present invention, the lower magnetic drive member is provided with a plurality of second mounting grooves circumferentially recessed on one side facing the upper magnetic drive member, and a third magnetic block is provided in the second mounting groove, wherein the third magnetic block and the upper magnetic drive member are arranged with their magnetic poles in the same direction.

[0016] As a further improvement of the present invention, the lower magnetic drive member is circumferentially recessed in a second guide groove on one side facing the upper magnetic drive member, a second guide rail is provided in the second guide groove, and a fourth magnetic block is movably sleeved on the outside of the second guide rail. The fourth magnetic block and the upper magnetic drive member are arranged with their magnetic poles in the same direction.

[0017] As a further improvement of the present invention, the upper magnetic drive member and / or the lower magnetic drive member are configured as electromagnetic coils, and the magnetic force is controlled by energizing the electromagnetic coils to control the magnetic repulsion force.

[0018] As a further improvement of the present invention, a second inclined surface adapted to the first inclined surface is formed on the top of the rotating block, and a third inclined surface abutting the rotating block is formed near the end of the upper magnetic drive member on the first inclined surface.

[0019] As a further improvement of the present invention, the turntables included in the at least two sets of limiting components are arranged at the same horizontal position, and / or the positioning pins included in the at least two sets of limiting components are arranged at the same horizontal position, and / or the upper magnetic drive members included in the at least two sets of limiting components are arranged at the same horizontal position, and / or the lower magnetic drive members included in the at least two sets of limiting components are arranged at the same horizontal position.

[0020] Based on the same inventive concept, this invention also discloses a wafer cleaning method, employing the wafer rotation positioning device as described in any of the above inventions, the wafer cleaning method comprising:

[0021] After the wafer body is cleaned, keep the wafer rotating;

[0022] The driving component drives at least one set of limiting components to release the wafer, and cleans and dries the dead area formed by the positioning pins and the wafer contained in this set of limiting components;

[0023] The driving component cancels the drive to release the set of limiting components of the wafer, so that the set of limiting components clamps the wafer;

[0024] The driving component drives at least one other set of limiting components to release the wafer, and cleans and dries the dead zone area formed by the positioning pins and the wafer contained in this set of limiting components;

[0025] The driving component cancels the drive to release the set of limiting components of the wafer, so that the set of limiting components clamps the wafer;

[0026] Alternately clean and dry the dead zones formed by the positioning pins and wafers contained in different limiting components until all wafers are cleaned and dried.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] In this invention, the wafer rotation positioning device includes at least two sets of limiting components and a driving component. The limiting components include a turntable, at least three circumferentially positioned pins at the edge of the turntable, an upper magnetic drive component at the bottom of the turntable, and a lower magnetic drive component at the bottom of the upper magnetic drive component. The bottom of the positioning pins rotatably engages with the edge of the turntable. A guide component with a first inclined surface protrudes from the bottom of the turntable. A rotating block protrudes from the top of the upper magnetic drive component, and the rotating block and the first inclined surface are offset longitudinally. The upper and lower magnetic drive components are arranged with their magnetic poles aligned in the same direction. The driving component alternately drives the lower magnetic drive component included in a single set of limiting components to move longitudinally upward. Under the magnetic repulsion of the upper and lower magnetic drive components, the upper magnetic drive component moves longitudinally upward, and the rotating block slides along the first inclined surface, pushing the turntable to rotate axially, thereby driving the positioning pins to rotate axially and releasing the wafer. Based on this, the present invention alternately cleans and dries the dead-angle areas formed by the positioning pins and the wafer in a single set of limiting components until the entire wafer is cleaned and dried, ensuring the cleaning effect of the dead-angle areas in the wafer. Compared with existing positioning mechanisms, the present invention not only solves the problems of poor cleaning effect and contaminant residue caused by the positioning pins being close to the wafer edge and obstructing liquid flow, but also solves the problem of liquid residue after drying caused by the tiny gaps and dead angles formed between the positioning pins and the wafer edge becoming capillaries and trapping liquid, ultimately ensuring a better cleaning effect for the wafer. Attached Figure Description

[0029] Figure 1 This is a perspective view of the wafer rotation positioning device shown in the present invention.

[0030] Figure 2 A partial three-dimensional view of a wafer rotation positioning device from one perspective;

[0031] Figure 3 for Figure 2 The partial perspective view of the wafer rotation positioning device for the reset disk is omitted.

[0032] Figure 4 A partial 3D view of a wafer rotation positioning device from another perspective;

[0033] Figure 5 This is a perspective view of the upper magnetic drive member or the lower magnetic drive member in one embodiment;

[0034] Figure 6 This is a perspective view of the upper magnetic drive member or the lower magnetic drive member in another embodiment;

[0035] Figure 7 This is a perspective view of the upper magnetic drive member and the lower magnetic drive member in one embodiment;

[0036] Figure 8 Is a perspective view of the upper magnetic drive member and the lower magnetic drive member in another embodiment;

[0037] Figure 9 Is Figure 4 An enlarged view of part A in

[0038] Figure 10 Is a schematic diagram of the steps of a wafer cleaning method. Detailed implementation manners

[0039] The present invention will be described in detail below in conjunction with the various embodiments shown in the accompanying drawings. It should be noted that these embodiments are not limitations on the present invention, and any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present invention.

[0040] It should be noted that in the present invention, "longitudinal" refers to the direction along the Figure 1 Y-axis shown, and "lateral" refers to the direction along the Figure 1 X-axis shown.

[0041] Please refer to Figures 1 to 10 As shown, the present invention provides a specific implementation manner of a wafer rotation positioning device 100. The wafer rotation positioning device 100 is used to hold a wafer 200 during the cleaning process of the wafer 200 and rotate it at a high speed, so that the liquid can uniformly clean the surface of the wafer 200. Compared with the existing positioning mechanism, the present invention alternately holds and releases the wafer 200 by multiple groups of limiting components 10, so as to clean and dry the dead angle area formed by the wafer 200 and the positioning pin 12, thereby ensuring that the wafer 200 can finally have a good cleaning effect.

[0042] Refer to Figures 1 to 4 And Figure 9As shown, the wafer rotation positioning device 100 includes at least two sets of limiting components 10 and a driving component 20. The limiting component 10 includes a turntable 11, at least three circumferentially positioned pins 12 at the edge of the turntable 11, an upper magnetic drive member 13 at the bottom of the turntable 11, and a lower magnetic drive member 14 at the bottom of the upper magnetic drive member 13. The bottom of the positioning pins 12 rotatably engages with the edge of the turntable 11. A guide member 15 with a first inclined surface 151 protrudes from the bottom of the turntable 11. A rotating block 16 protrudes from the top of the upper magnetic drive member 13, and the rotating block 16 and the first inclined surface 151 are offset longitudinally. The upper magnetic drive member 13 and the lower magnetic drive member 14 are arranged with their magnetic poles aligned in the same direction. The driving assembly 20 alternately drives the lower magnetic drive member 14 included in the single set of limiting assembly 10 to move longitudinally upward. Under the magnetic repulsion of the upper magnetic drive member 13 and the lower magnetic drive member 14, the upper magnetic drive member 13 moves longitudinally upward. The rotating block 16 slides along the first inclined surface 151 and pushes the turntable 11 to rotate axially, thereby driving the positioning pin 12 to rotate axially and releasing the wafer 200.

[0043] Based on this, the present invention also provides a wafer cleaning method, which uses the wafer rotation positioning device 100 disclosed above to perform cleaning operations on the surface of the wafer 200. (See reference...) Figure 10 As shown, the wafer cleaning method includes the following steps S1 to S6.

[0044] Step S1: After the main body of wafer 200 is cleaned, keep wafer 200 rotating.

[0045] Step S2: The driving component 20 drives at least one set of limiting components 10 to release the wafer 200, and cleans and dries the dead corner area formed by the positioning pin 12 and the wafer 200 contained in the limiting components 10.

[0046] Step S3: The driving component 20 cancels the driving release of the limiting component 10 of the wafer 200, so that the limiting component 10 clamps the wafer 200.

[0047] Step S4: Drive component 20 drives at least one other set of limiting components 10 to release wafer 200, and cleans and dries the dead corner area formed by the positioning pin 12 and wafer 200 contained in this set of limiting components 10.

[0048] Step S5: The driving component 20 cancels the driving release of the set of limiting components 10 of the wafer, so that the set of limiting components 10 clamps the wafer 200.

[0049] Step S6: Alternately clean and dry the dead corner areas formed by the positioning pins 12 and wafers 200 contained in different limiting components 10 until all wafers 200 are cleaned and dried.

[0050] It should be noted that in this invention, the wafer rotation positioning device 100 includes at least two sets of limiting components 10, i.e., two, three, or more sets of limiting components 10 can be provided. Of course, regardless of the number of limiting components 10 provided, as long as it is possible to achieve the alternating release of the wafer 200 by at least two sets of limiting components 10, thereby cleaning and drying the dead corner area formed by the positioning pin 12 included in the set of limiting components 10 that releases the wafer 200 and the wafer 200, and ultimately ensuring that the wafer 200 has a good cleaning effect, this embodiment does not make a specific limitation in this regard. At the same time, only two sets of limiting components 10 (i.e., limiting components 10a and limiting components 10b) are shown in the following description for illustrative purposes, but this should not be construed as limiting the scope of protection of this invention.

[0051] Furthermore, the dead-angle area formed by the aforementioned positioning pin 12 and wafer 200 refers to the contact area between the positioning pin 12 and wafer 200 and its vicinity. Because the positioning pin 12 clamps the wafer 200, during the wafer 200 cleaning process, the contact portion between the positioning pin 12 and wafer 200 obstructs the flow of liquid, resulting in poor cleaning of the edge contact area and the presence of contaminant residue. Moreover, the tiny gaps and dead-angles formed at the edge contact area act as capillaries, trapping liquid even during high-speed rotation drying, leading to liquid residue after drying. Therefore, in this invention, by releasing the wafer 200 through the positioning pin 12 and cleaning and drying the dead-angle area formed by the positioning pin 12 and wafer 200, the cleaning effect of the dead-angle area in the wafer 200 can be guaranteed, thereby ensuring a better cleaning effect for the wafer 200.

[0052] Specifically, participants Figure 3 and Figure 4As shown, the wafer rotation positioning device 100 includes a limiting component 10a and a limiting component 10b. The limiting component 10a (or limiting component 10b) includes a turntable 11a (or turntable 11b), at least three circumferentially disposed at the edge of the turntable 11a (or turntable 11b), an upper magnetic drive member 13a (or upper magnetic drive member 13b) disposed at the bottom of the turntable 11a (or turntable 11b), and a lower magnetic drive member 14a (or lower magnetic drive member 14b) disposed at the bottom of the upper magnetic drive member 13a (or upper magnetic drive member 13b). The bottom of the positioning pin 12a (or positioning pin 12b) and the edge of the turntable 11a (or turntable 11b) are rotatably engaged. The bottom of the turntable 11a (or turntable 11b) is provided with a guide 15a (or guide 15b) having a first inclined surface 151a (or first inclined surface 151b). The top of the upper magnetic drive 13a (or upper magnetic drive 13b) is provided with a rotating block 16a (or rotating block 16b). The rotating block 16a (or rotating block 16b) and the first inclined surface 151a (or first inclined surface 151b) are offset along the longitudinal direction. The upper magnetic drive 13a (or upper magnetic drive 13b) and the lower magnetic drive 14a (or lower magnetic drive 14b) are arranged with the magnetic poles facing the same direction.

[0053] After the main body of wafer 200 is cleaned, the driving component 20 alternately drives the single set of limiting components 10 (i.e., limiting component 10a or limiting component 10b) to release wafer 200, so as to clean and dry the dead corner area formed by the positioning pin 12 included in the single set of limiting components 10 and wafer 200, thereby ensuring that wafer 200 as a whole has a good cleaning effect.

[0054] More specifically, firstly, the lower magnetic drive member 14a included in the limiting member 10a is driven by the drive component 20 to move longitudinally upward. Under the magnetic repulsion of the upper magnetic drive member 13a and the lower magnetic drive member 14a, the upper magnetic drive member 13a moves longitudinally upward, the rotating block 16a slides along the first inclined surface 151a and pushes the turntable 11a to rotate axially along the first direction 41, so as to drive the positioning pin 12a to rotate axially along the third direction 43 and release the wafer 200, that is, to move from the state of clamping the wafer 200 to the state of releasing the wafer 200.

[0055] Next, the dead zone area formed by the positioning pin 12a included in the limiting component 10a and the wafer 200 is cleaned and dried. After cleaning and drying, the driving component 20 retracts the driving force of the lower magnetic driving member 14a included in the limiting component 10a to move longitudinally upward. The upper magnetic driving member 13a and the lower magnetic driving member 14a move longitudinally downward under their own gravity, carrying the rotating block 16a to move longitudinally downward. The turntable 11a returns to its original state and rotates axially along the second direction 42 to drive the positioning pin 12a to rotate axially along the fourth direction 44 and clamp the wafer 200, that is, to move from the state of releasing the wafer 200 to the state of clamping the wafer 200.

[0056] Next, the lower magnetic drive member 14b included in the limiting component 10b is driven by the drive component 20 to move longitudinally upward. Under the magnetic repulsion of the upper magnetic drive member 13b and the lower magnetic drive member 14b, the upper magnetic drive member 13b moves longitudinally upward. The rotating block 16b slides along the first inclined surface 151b and pushes the turntable 11b to rotate axially along the first direction 41, so as to drive the positioning pin 12b to rotate axially along the third direction 43 and release the wafer 200, that is, from the state of clamping the wafer 200 to the state of releasing the wafer 200.

[0057] Finally, the dead zone area formed by the positioning pin 12b included in the limiting component 10b and the wafer 200 is cleaned and dried. After cleaning and drying, the driving component 20 retracts the driving force of the lower magnetic driving member 14b included in the limiting component 10b to move longitudinally upward. The upper magnetic driving member 13b and the lower magnetic driving member 14b move longitudinally downward under their own gravity, carrying the rotating block 16b to move longitudinally downward. The turntable 11b returns to its original state and rotates axially along the second direction 42 to drive the positioning pin 12b to rotate axially along the fourth direction 44 and clamp the wafer 200, that is, from the state of releasing the wafer 200 to the state of clamping the wafer 200.

[0058] Therefore, in this invention, the dead-angle area formed by the positioning pin 12 included in a single set of limiting components 10 and the wafer 200 is cleaned and dried alternately until the wafer 200 is completely cleaned and dried. Compared with existing positioning mechanisms, this invention not only solves the problems of poor cleaning effect and contaminant residue caused by the positioning pins being close to the wafer edge and obstructing liquid flow, but also solves the problem of liquid residue after drying caused by the tiny gaps and dead angles formed between the positioning pins and the wafer edge becoming capillaries and trapping liquid. Ultimately, this invention ensures that the wafer 200 has a better cleaning effect.

[0059] It should be noted that the aforementioned first direction 41 and second direction 42 refer to two completely opposite directions rotating around the central axis of the turntable 11, and the aforementioned third direction 43 and fourth direction 44 refer to two completely opposite directions rotating around the central axis of the positioning pin 12. Meanwhile, during the cleaning and drying process of the wafer 200, it is necessary to keep the wafer 200 rotating, which is achieved through the rotation drive 50 provided at the bottom. However, since the rotation drive 50 is not the inventive point of this invention, it will not be described in detail here.

[0060] In one implementation, the reference Figure 3 As shown, at least two sets of limiting components 10 each contain a turntable 11 positioned at the same horizontal level. For example, turntables 11a and 11b are arranged sequentially along the longitudinal direction. The outer periphery of the top turntable 11a extends laterally outward, while the outer periphery of the bottom turntable 11b first extends longitudinally upward to the same height as turntable 11a, and then extends laterally outward. This ensures that the edges of turntables 11a and 11b are at the same horizontal level, making the overall structure more compact.

[0061] In one implementation, the reference Figure 3 As shown, the positioning pins 12 included in at least two sets of limiting components 10 are respectively set at the same horizontal position. For example, if the edges of turntable 11a and turntable 11b are at the same horizontal position, positioning pins 12a and 12b with the same vertical height are set to ensure that the positioning plate 122 formed by the top of the positioning pin 12 is at the same horizontal position; if the edges of turntable 11a and turntable 11b are not at the same horizontal position, and turntable 11a is set on top of turntable 11b, then the vertical height of positioning pin 12b is higher than the vertical height of positioning pin 12a to ensure that the positioning plate 122 formed by the top of the positioning pin 12 is at the same horizontal position, thereby ensuring the stability of wafer 200 clamping and release.

[0062] In one implementation, the reference Figure 7 and Figure 8 As shown, the upper magnetic drive members 13 included in at least two sets of limiting components 10 are respectively arranged at the same horizontal position. For example, the upper magnetic drive members 13a and 13b are both arranged in a ring shape, and the upper magnetic drive member 13a is located inside the upper magnetic drive member 13b, thereby further ensuring the compactness of the overall structure.

[0063] In one implementation, the reference Figure 7 and Figure 8As shown, the lower magnetic drive members 14 included in at least two sets of limiting components 10 are respectively arranged at the same horizontal position. For example, both the lower magnetic drive members 14a and 14b are arranged in a ring shape, and the lower magnetic drive member 14a is located inside the lower magnetic drive member 14b, thereby further ensuring the compactness of the overall structure.

[0064] In one implementation, the reference Figure 2 and Figure 3 As shown, the wafer rotation positioning device 100 further includes: a reset disk 30 disposed on the top of the turntable 11 and at least one reset member 32 disposed between the turntable 11 and the reset disk 30. A first hook portion 31 is formed on the inner side of the reset disk 30, and a second hook portion 111 is formed inside the turntable 11. The two ends of the reset member 32 are respectively connected to the first hook portion 31 and the second hook portion 111. The lower magnetic drive member 14 included in the drive limiting assembly 10 is removed by the drive assembly 20 and moves longitudinally upward. The lower magnetic drive member 14 and the upper magnetic drive member 13 move longitudinally downward under the action of gravity. Under the elastic force of the reset member 32, the turntable 11 rotates axially to drive the positioning pin 12 to rotate axially and clamp the wafer 200.

[0065] Therefore, after the drive assembly 20 removes the drive limit assembly 10, the turntable 11 rotates axially along the second direction 42 under the action of the reset member 32, so as to drive the positioning pin 12 to rotate axially along the fourth direction 44 and clamp the wafer 200, that is, to move from the wafer 200 release state to the wafer 200 clamping state, so as to ensure the stability of the wafer 200 cleaning process.

[0066] More specifically, the drive assembly 20 is disposed at the bottom of the lower magnetic drive member 14, and the drive assembly 20 extends a drive shaft 21 toward the lower magnetic drive member 14. When the drive assembly 20 drives the lower magnetic drive member 14 to move longitudinally upward, the drive shaft 21 extends longitudinally upward to resist and push the lower magnetic drive member 14 to move longitudinally upward; when the drive assembly 20 stops driving the lower magnetic drive member 14 to move longitudinally upward, the drive shaft 21 retracts longitudinally downward and moves away from the lower magnetic drive member 14, and the lower magnetic drive member 14 moves longitudinally downward under its own gravity.

[0067] It should be noted that, in one embodiment, the driving component 20 is configured as one, with each single driving component 20 driving at least two sets of limiting components 10, thereby making the overall structure more compact. In one embodiment, the driving component 20 is configured as at least two, with each driving component 20 corresponding to a single limiting component 10, and each driving component 20 independently driving the single limiting component 10, without interfering with each other. In one embodiment, the driving component 20 is configured as at least four, with two driving components 20 corresponding to a single limiting component 10, and the two driving components 20 independently driving the single limiting component 10 on both sides, thereby ensuring the stability of the lower magnetic driving member 14 during movement. Regardless of the number of driving components 20, as long as the driving components 20 can drive the lower magnetic driving member 14 to move longitudinally upward, this embodiment does not specifically limit this, but it should not be construed as limiting the scope of protection of this invention.

[0068] Regarding the rotational fit between the bottom of the locating pin 12 and the edge of the turntable 11, in one embodiment, refer to Figure 3 As shown, the bottom of the positioning pin 12 meshes with the edge of the turntable 11. Specifically, a first gear 112 is formed at the edge of the turntable 11, a second gear 121 meshing with the first gear 112 is formed at the bottom of the positioning pin 12, and a positioning plate 122 for longitudinally restricting the wafer 200 and a positioning post 123 for laterally restricting the wafer 200 are formed at the top of the positioning pin 12. The axial rotation of the turntable 11 drives the axial rotation of the positioning pin 12, thereby adjusting the size of the lateral space formed between the positioning posts 123, so that the positioning pin 12 switches between the state of clamping the wafer 200 and the state of releasing the wafer 200.

[0069] More specifically, the positioning plate 122 and the positioning post 123 are both formed on the top of the positioning pin 12, and the positioning post 123 is formed on the side of the positioning plate 122. The wafer 200 is placed on the positioning plate 122 formed by at least three positioning pins 12 respectively to prevent the wafer 200 from falling under its own gravity, thereby achieving vertical restriction of the wafer 200; and the wafer 200 is clamped by the positioning post 123 formed on the side of the positioning plate 122, thereby achieving horizontal restriction of the wafer 200, thus achieving clamping of the wafer 200.

[0070] When the driving assembly 20 drives the lower magnetic drive member 14 included in the limiting assembly 10 to move longitudinally upward, the upper magnetic drive member 13 moves longitudinally upward under the action of magnetic repulsion. The rotating block 16 slides along the first inclined surface 151 and pushes the turntable 11 to rotate axially along the first direction 41, thereby driving the positioning pin 12 to rotate axially along the third direction 43. This makes the lateral space formed between the positioning posts 123 formed by the tops of at least three positioning pins 12 larger, until the side of the positioning post 123 and the wafer 200 no longer contact each other, thereby realizing the release of the wafer 200 by the limiting assembly 10. When the drive assembly 20 removes the lower magnetic drive member 14 included in the drive limiting assembly 10 and moves it vertically upward, the upper magnetic drive member 13 and the lower magnetic drive member 14 move vertically downward under their own gravity. The rotating block 16 moves vertically downward accordingly. Under the elastic force of the reset member 32, the turntable 11 rotates axially in the second direction 42 to drive the positioning pin 12 to rotate axially in the fourth direction 44. This reduces the lateral space formed between the positioning posts 123 formed by the tops of at least three positioning pins 12 until the side of the positioning post 123 contacts the wafer 200, thereby enabling the limiting assembly 10 to clamp the wafer 200.

[0071] Regarding the specific structure of the upper magnetic drive member 13 and the lower magnetic drive member 14, the upper magnetic drive member 13 and the lower magnetic drive member 14 can be magnets themselves, or they can have magnets such as the first magnetic block 132, the second magnetic block 134, the third magnetic block 142 or the fourth magnetic block 144 embedded inside them. This embodiment does not make specific limitations on this, as long as the upper magnetic drive member 13 and the lower magnetic drive member 14 can be arranged with the magnetic poles in the same direction, and the lower magnetic drive member 14 can push the upper magnetic drive member 13 to move vertically upward.

[0072] In one implementation, the reference Figure 7 As shown, the upper magnetic drive member 13 has several first mounting grooves 131 recessed circumferentially on the side facing the lower magnetic drive member 14, and first magnetic blocks 132 are disposed in the first mounting grooves 131. The first magnetic blocks 132 and the lower magnetic drive member 14 are arranged with their magnetic poles facing the same direction. By adjusting the number and density of the first mounting grooves 131, the number and density of the first magnetic blocks 132 can be adjusted to adjust the magnetic force at different positions of the upper magnetic drive member 13, thereby adjusting the magnetic repulsion between the upper magnetic drive member 13 and the lower magnetic drive member 14, and thus adapting to wafers 200 with different required strengths.

[0073] In one implementation, the reference Figure 8As shown, the upper magnetic drive member 13 has a first guide groove 133 recessed circumferentially on the side facing the lower magnetic drive member 14. A first guide rail 135 is disposed within the first guide groove 133, and a second magnetic block 134 is movably sleeved on the outside of the first guide rail 135. The second magnetic block 134 and the lower magnetic drive member 14 are arranged with their magnetic poles facing the same direction. The second magnetic block 134 can slide along the first guide rail 135 to adjust the magnetic force at different positions of the upper magnetic drive member 13, thereby adjusting the magnetic repulsion between the upper magnetic drive member 13 and the lower magnetic drive member 14, thus adapting to wafers 200 with different required strengths.

[0074] In one implementation, the reference Figure 7 As shown, the lower magnetic drive member 14 has several second mounting grooves 141 recessed circumferentially on the side facing the upper magnetic drive member 13, and a third magnetic block 142 is disposed in the second mounting groove 141. The third magnetic block 142 and the upper magnetic drive member 13 are arranged with their magnetic poles aligned in the same direction. By adjusting the number and density of the second mounting grooves 141 and the number and density of the third magnetic blocks 142, the magnetic force at different positions of the lower magnetic drive member 14 can be adjusted, thereby adjusting the magnitude of the magnetic repulsion between the upper magnetic drive member 13 and the lower magnetic drive member 14, thus adapting to wafers 200 with different required strengths.

[0075] In one implementation, the reference Figure 8 As shown, a second guide groove 143 is circumferentially recessed on the side of the lower magnetic drive member 14 facing the upper magnetic drive member 13. A second guide rail 145 is disposed within the second guide groove 143, and a fourth magnetic block 144 is movably sleeved on the outside of the second guide rail 145. The fourth magnetic block 144 and the upper magnetic drive member 13 are arranged with their magnetic poles aligned in the same direction. The fourth magnetic block 144 can slide along the second guide rail 145 to adjust the magnetic force at different positions of the lower magnetic drive member 14, thereby adjusting the magnetic repulsion between the upper magnetic drive member 13 and the lower magnetic drive member 14, and thus adapting to wafers 200 with different required strengths.

[0076] It should be noted that the present invention does not limit the specific size and shape of the first magnetic block 132 and / or the second magnetic block 134 and / or the third magnetic block 142 and / or the fourth magnetic block 144. The shape can be rectangular, circular, arc or other shapes to adapt to wafers 200 with different required forces (i.e., to meet the different requirements of magnetic force for wafers 200 of different sizes and different positions of support force).

[0077] In one embodiment, the upper magnetic drive member 13 and / or the lower magnetic drive member 14 are configured as electromagnetic coils. By applying an electric current to the electromagnetic coils, the magnetic force is controlled to control the magnetic repulsion force. By changing the magnetic force from a fixed physical state to an electrically signal that can be precisely controlled, non-contact precise control can be achieved. That is, by energizing or de-energizing the control electromagnetic coils, the generation and disappearance of the magnetic force can be controlled. In this way, the deployment of the drive assembly 20 can be omitted. When it is necessary to drive the upper magnetic drive member 13 to move longitudinally upward, energizing the lower magnetic drive member 14 and the upper magnetic drive member 13 can achieve this, thereby reducing the complexity of mechanical movement and reducing the response time. At the same time, the magnitude of the energizing current of the electromagnetic coils can also be controlled to linearly and precisely control the strength of the magnetic force, thereby controlling the magnitude of the magnetic repulsion force. Furthermore, the magnitude of the adapted magnetic repulsion force can be adjusted accordingly according to different wafers 200.

[0078] In one embodiment, a second inclined surface 161 adapted to the first inclined surface 151 is formed at the top of the rotating block 16, and a third inclined surface 152 for abutting against the rotating block 16 is formed at the end of the first inclined surface 151 close to the upper magnetic drive member 13. The second inclined surface 161 formed by the rotating block 16 slides along the first inclined surface 151, and during the sliding process, the contact area between the first inclined surface 151 and the second inclined surface 161 gradually decreases or gradually increases, so that the rotation process of the turntable 11 is smoother and more linear. At the same time, in order to adjust the maximum amplitude of the rotation of the turntable 11, by setting the third inclined surface 152 to abut against the rotating block 16, the stability during the rotation process of the turntable 11 is further ensured.

[0079] See Figure 7 As shown, in one embodiment, the upper magnetic drive members 13a and 13b are themselves magnets, and the lower magnetic drive member 14a is embedded with a third magnetic block 142a facing the upper magnetic drive member 13a, and the lower magnetic drive member 14b is embedded with a third magnetic block 142b facing the upper magnetic drive member 13b. The third magnetic block 142a and the upper magnetic drive member 13a are arranged with the same magnetic poles, and the third magnetic block 142b and the upper magnetic drive member 13b are arranged with the same magnetic poles.

[0080] See Figure 8 As shown, in one embodiment, the lower magnetic drive members 14a and 14b are themselves magnets, and the upper magnetic drive member 13a is embedded with a second magnetic block 134a facing the lower magnetic drive member 14a, and the upper magnetic drive member 13b is embedded with a second magnetic block 134b facing the lower magnetic drive member 14b. The second magnetic block 134a and the lower magnetic drive member 14a are arranged with the same magnetic poles, and the second magnetic block 134b and the lower magnetic drive member 14b are arranged with the same magnetic poles.

[0081] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0082] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0083] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer rotation positioning device, characterized in that, include: At least two sets of limit components and drive components; The limiting component includes: a turntable, at least three circumferentially positioned pins at the edge of the turntable, an upper magnetic drive component at the bottom of the turntable, and a lower magnetic drive component at the bottom of the upper magnetic drive component. The bottom of the positioning pins is rotatably engaged with the edge of the turntable. A guide component with a first inclined surface protrudes from the bottom of the turntable. A rotating block protrudes from the top of the upper magnetic drive component, and the rotating block is offset from the first inclined surface. The upper magnetic drive component and the lower magnetic drive component are arranged with their magnetic poles in the same direction. The driving component alternately drives the lower magnetic drive member included in the single set of limiting components to move longitudinally upward. Under the magnetic repulsion of the upper magnetic drive member and the lower magnetic drive member, the upper magnetic drive member moves longitudinally upward. The rotating block slides along the first inclined surface and pushes the turntable to rotate axially, thereby driving the positioning pin to rotate axially and releasing the wafer. The wafer rotation positioning device further includes: a reset disk disposed on the top of the turntable and at least one reset member disposed between the turntable and the reset disk, wherein a first hook portion is formed on the inner side of the reset disk, a second hook portion is formed inside the turntable, and the two ends of the reset member are respectively connected to the first hook portion and the second hook portion. The driving component retracts the drive to move the lower magnetic drive member included in the limiting component longitudinally upward. The lower magnetic drive member and the upper magnetic drive member move longitudinally downward under the action of gravity. Under the elastic force of the reset member, the turntable rotates axially to drive the positioning pin to rotate axially and clamp the wafer.

2. The wafer rotation positioning device according to claim 1, characterized in that, The upper magnetic drive member has several first mounting grooves recessed circumferentially on one side facing the lower magnetic drive member, and a first magnetic block is disposed in the first mounting groove. The first magnetic block and the lower magnetic drive member are arranged with their magnetic poles facing the same direction.

3. The wafer rotation positioning device according to claim 1, characterized in that, The upper magnetic drive member has a first guide groove recessed circumferentially on one side facing the lower magnetic drive member. A first guide rail is provided in the first guide groove, and a second magnetic block is movably sleeved on the outside of the first guide rail. The second magnetic block and the lower magnetic drive member are arranged with their magnetic poles facing the same direction.

4. The wafer rotation positioning device according to claim 1, characterized in that, The lower magnetic drive member has several second mounting grooves recessed circumferentially on one side facing the upper magnetic drive member, and a third magnetic block is arranged in the second mounting groove. The third magnetic block and the upper magnetic drive member are arranged with their magnetic poles in the same direction.

5. The wafer rotation positioning device according to claim 1, characterized in that, The lower magnetic drive member has a second guide groove recessed circumferentially on one side facing the upper magnetic drive member. A second guide rail is provided in the second guide groove, and a fourth magnetic block is movably sleeved on the outside of the second guide rail. The fourth magnetic block and the upper magnetic drive member are arranged with their magnetic poles in the same direction.

6. The wafer rotation positioning device according to claim 1, characterized in that, The upper magnetic drive member and / or the lower magnetic drive member are configured as electromagnetic coils, and the magnetic force is controlled by energizing the electromagnetic coils to control the magnetic repulsion force.

7. The wafer rotation positioning device according to claim 1, characterized in that, The top of the rotating block forms a second inclined surface that matches the first inclined surface, and the first inclined surface near the end of the upper magnetic drive member forms a third inclined surface that abuts against the rotating block.

8. The wafer rotation positioning device according to claim 1, characterized in that, The turntables included in the at least two sets of limiting components are respectively arranged at the same horizontal position, and / or the positioning pins included in the at least two sets of limiting components are respectively arranged at the same horizontal position, and / or the upper magnetic drive members included in the at least two sets of limiting components are respectively arranged at the same horizontal position, and / or the lower magnetic drive members included in the at least two sets of limiting components are respectively arranged at the same horizontal position.

9. A wafer cleaning method, employing the wafer rotation positioning device as described in any one of claims 1 to 8, characterized in that, The wafer cleaning method includes: After the wafer body is cleaned, keep the wafer rotating; The driving component drives at least one set of limiting components to release the wafer, and cleans and dries the dead area formed by the positioning pins and the wafer contained in this set of limiting components; The driving component cancels the drive to release the set of limiting components of the wafer, so that the set of limiting components clamps the wafer; The driving component drives at least one other set of limiting components to release the wafer, and cleans and dries the dead zone area formed by the positioning pins and the wafer contained in this set of limiting components; The driving component cancels the drive to release the set of limiting components of the wafer, so that the set of limiting components clamps the wafer; Alternately clean and dry the dead zones formed by the positioning pins and wafers contained in different limiting components until all wafers are cleaned and dried.

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