Sensor packaging structure and sensing module thereof

Abstract

The invention discloses a sensor packaging structure and a sensing module thereof. The sensing module comprises a sensing chip, a light transmitting layer and an annular supporting layer clamped between the sensing chip and the light transmitting layer. The annular supporting layer comprises a plurality of edge strip sections and a plurality of round corner sections which are connected into an annular shape. The inner surface of the light-transmitting layer comprises a plurality of linear edges and a plurality of arc-shaped corners. The multiple linear edges are adjacent to and parallel to the multiple edging sections respectively, and a first inward shrinkage distance is arranged between any linear edge and the adjacent edging section. The plurality of circular arc-shaped corners are respectively adjacent to the plurality of circular bead sections, and a second indentation distance is arranged between any circular arc-shaped corner and the adjacent circular bead section and is 95-105% of the first indentation distance. Therefore, the gap between the light-transmitting layer and the sensing chip can be effectively shortened, so that the gap can be filled with the packaging body, and any bubbles are prevented from being formed.

Description

Technical Field

[0001] This application relates to the field of packaging structures, and more particularly to a sensor packaging structure and its sensing module. Background Technology

[0002] Existing sensor packaging structures include a glass panel, a sensing chip, and an adhesive layer sandwiched between the glass panel and the sensing chip. The corners of the glass panel form relatively narrow gaps with the adhesive layer. Therefore, when forming the package, the existing sensor packaging structure cannot fill the entire gap, easily resulting in voids.

[0003] Therefore, the applicant believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed this application with a reasonable design that effectively improves the above-mentioned defects. Summary of the Invention

[0004] This application provides a sensor packaging structure and its sensing module, which can effectively improve the defects that may arise from existing sensor packaging structures.

[0005] This application discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate and electrically coupled to the substrate; wherein a top surface of the sensing chip includes a sensing region and a support region surrounding the sensing region; an annular support layer disposed on the support region of the sensing chip and surrounding the sensing region; wherein the annular support layer includes a plurality of edge segments and a plurality of rounded corner segments, and any two adjacent edge segments are connected by a rounded corner segment; a light-transmitting layer disposed on the annular support layer, such that the light-transmitting layer, the annular support layer, and the top surface of the sensing chip together form a closed space; wherein the inner surface of the light-transmitting layer includes The device comprises: multiple straight edges, each adjacent to and parallel to multiple edge segments; wherein each straight edge is separated from an adjacent edge segment by a first recessed distance; and multiple rounded corners, each adjacent to multiple rounded corner segments, and any two adjacent straight edges are connected by a rounded corner; wherein each rounded corner is separated from an adjacent rounded corner segment by a second recessed distance, which is 95% to 105% of the first recessed distance; and a package formed on a substrate; wherein a sensing chip, an annular support layer, and a light-transmitting layer are embedded within the package, and the outer surface of the light-transmitting layer away from the substrate is at least partially exposed outside the package.

[0006] Optionally, the extensions of any two adjacent straight edges are defined to have an intersection point, which is separated from the adjacent rounded segment by an initial indentation distance, and the second indentation distance is 35% to 70% of the initial indentation distance.

[0007] Optionally, the center of any rounded corner is located inside the adjacent rounded corner segment.

[0008] Optionally, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a first radial direction, and the center of the adjacent rounded corner is located above the first radial direction.

[0009] Optionally, a second projection region formed by the orthographic projection of the inner arc surface of each rounded corner segment onto the inner surface has a second radial direction that overlaps with the first radial direction.

[0010] Optionally, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a first center that overlaps with the center of the adjacent arc-shaped corner.

[0011] Optionally, a second projection area formed by the orthographic projection of the inner arc surface of each rounded corner segment onto the inner surface has a second center that overlaps with the center of the first circle.

[0012] Optionally, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a radius that is 70% to 90% of the radius of the adjacent rounded corner.

[0013] Optionally, the sensing chip has multiple right angles, and each right angle is adjacent to a multiple rounded corner segment.

[0014] This application also discloses a sensing module with a sensor packaging structure, comprising: a sensing chip having a sensing area on its top surface and a support area surrounding the sensing area; an annular support layer disposed on the support area of ​​the sensing chip and surrounding the sensing area; wherein the annular support layer includes a plurality of edge segments and a plurality of rounded corner segments, and any two adjacent edge segments are connected by a rounded corner segment; and a light-transmitting layer disposed on the annular support layer, such that the light-transmitting layer, the annular support layer, and the top surface of the sensing chip together form a closed space; wherein the inner surface of the light-transmitting layer includes: a plurality of straight edges, respectively adjacent to and parallel to the plurality of edge segments; wherein any straight edge is separated from an adjacent edge segment by a first recessed distance; and a plurality of arc-shaped corners, respectively adjacent to the plurality of rounded corner segments, and any two adjacent straight edges are connected by an arc-shaped corner; wherein any arc-shaped corner is separated from an adjacent rounded corner segment by a second recessed distance, which is 95% to 105% of the first recessed distance.

[0015] Optionally, the extensions of any two adjacent straight edges are defined to have an intersection point, which is separated from the adjacent rounded segment by an initial indentation distance, and the second indentation distance is 35% to 70% of the initial indentation distance.

[0016] Optionally, the center of any arc-shaped corner is located inside the adjacent rounded corner segment; wherein, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a first radial direction, and the center of the adjacent arc-shaped corner is located above the first radial direction.

[0017] Optionally, a second projection region formed by the orthographic projection of the inner arc surface of each rounded corner segment onto the inner surface has a second radial direction that overlaps with the first radial direction.

[0018] Optionally, the center of any arc-shaped corner is located inside the adjacent rounded corner segment; wherein, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a first center, which overlaps with the center of the adjacent arc-shaped corner.

[0019] Optionally, a second projection area formed by the orthographic projection of the inner arc surface of each rounded corner segment onto the inner surface has a second center that overlaps with the center of the first circle.

[0020] Optionally, a first projection area formed by the orthographic projection of the outer arc surface of each rounded corner segment onto the inner surface has a radius that is 70% to 90% of the radius of the adjacent rounded corner.

[0021] Beneficial effects of the invention

[0022] The sensor packaging structure and sensing module disclosed in this application form a plurality of arc-shaped corners in the light-transmitting layer that meet specific conditions (e.g., the second inward distance is 95% to 105% of the first inward distance), so that the gap length between the light-transmitting layer and the sensing chip can be effectively shortened, thereby facilitating the flow of the package into and filling the gap, and thus preventing any air bubbles from forming in the gap.

[0023] Furthermore, the sensor packaging structure and sensing module disclosed in this application can effectively shorten the length of the gap, thereby reducing the volume of the package within the gap and thus reducing the stress on the annular support layer at any of the rounded corner segments.

[0024] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of this application.

[0026] Figure 2 for Figure 1 A top-down view.

[0027] Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III.

[0028] Figure 4 for Figure 3 A schematic diagram of another state.

[0029] Figure 5 for Figure 1 A three-dimensional schematic diagram of the package is omitted.

[0030] Figure 6 for Figure 5 A cross-sectional view along section line VI-VI.

[0031] Figure 7 for Figure 1 A three-dimensional sectional view.

[0032] Figure 8 This is a cross-sectional schematic diagram of the sensing lens in Embodiment 2 of this application. Detailed Implementation

[0033] The following specific embodiments illustrate the implementation of the "sensor packaging structure and sensing module" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0034] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0035] Example 1

[0036] Please see Figures 1 to 7 As shown, this is an embodiment of this application. Figure 1As shown, this embodiment discloses a sensor packaging structure 100; that is, the internal structure is not any structure for packaging a sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0037] like Figures 1 to 3 As shown, the sensor packaging structure 100 in this embodiment includes a substrate 1, a sensing chip 2 disposed on the substrate 1, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, an annular support layer 4 disposed on the sensing chip 2, a light-transmitting layer 5 disposed on the annular support layer 4, and a package 6 formed on the substrate 1. It should be noted that, in this embodiment, the annular support layer 4 is sandwiched between the sensing chip 2 and the light-transmitting layer 5, and together they can be referred to as a sensing module.

[0038] It should be noted that although the sensor packaging structure 100 in this embodiment is described as including the above-mentioned components, the sensor packaging structure 100 can also be adjusted and varied according to design requirements. For example, in other embodiments not shown in this application, the sensor packaging structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 by flip-chip or die-attach method; or, the sensing module may be used alone (e.g., for sale) or in combination with other components. The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

[0039] In this embodiment, the substrate 1 is square or rectangular, but this application is not limited to this. The substrate 1 has a chip fixing region 111 approximately at the center of its upper surface 11, and a plurality of bonding pads 112 are formed on the upper surface 11 of the substrate 1, located outside the chip fixing region 111. In this embodiment, the plurality of bonding pads 112 are generally arranged in a ring, but this application is not limited to this. For example, in other embodiments not shown in this application, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing region 111.

[0040] Furthermore, the substrate 1 may also have a plurality of solder balls (not shown in the figure) on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) through the plurality of solder balls, so that the sensor package structure 100 can be electrically connected to the electronic component through the plurality of solder balls.

[0041] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square) and has multiple right angles 23. The sensing chip 2 is described below as an image sensing chip, but this application is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1 by die-attach adhesive; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a support area 212 surrounding the sensing area 211 (in an annular shape). Both ends of each metal wire 3 are respectively connected to the substrate 1 and the support area 212 of the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

[0042] More specifically, the sensing chip 2 includes a plurality of connection pads 213 located in the bearing region 212 (that is, the plurality of connection pads 213 are located outside the sensing region 211). In this embodiment, the number and position of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and position of the plurality of bonding pads 112 of the substrate 1; that is, the plurality of connection pads 213 are also generally arranged in a ring shape in this embodiment. Furthermore, each metal wire 3 has its two ends connected to one bonding pad 112 and a corresponding connection pad 213.

[0043] The annular support layer 4 is disposed on the carrier region 212 of the sensing chip 2 and surrounds the outer side of the sensing region 211. In this embodiment, the annular support layer 4 is located inside the plurality of metal lines 3 and does not contact any of the metal lines 3 (that is, each metal line 3 is located outside the annular support layer 4 and is completely embedded within the package 6), but this application is not limited thereto. For example, such as Figure 4 As shown, each of the metal wires 3 may be partially embedded within the annular support layer 4, while the remaining portion of each of the metal wires 3 is embedded within the encapsulation body 6.

[0044] Furthermore, in this embodiment, the annular support layer 4 is generally square-ring shaped, and includes a plurality of side segments 41 and a plurality of rounded corner segments 42. Any two adjacent side segments 41 are orthogonal to each other, and are connected by a rounded corner segment 42. Moreover, the plurality of rounded corner segments 42 of the annular support layer 4 are respectively adjacent to a plurality of right angles 23 of the sensing chip 2; that is, each rounded corner segment 42 is adjacent to a right angle 23.

[0045] like Figure 3 and 5 to Figure 7As shown, the light-transmitting layer 5 in this embodiment is illustrated as a flat glass plate, but this application is not limited to this. The light-transmitting layer 5 has an outer surface 51 and an inner surface 52 located on opposite sides, and an annular side surface 53 perpendicularly connected to the outer surface 51 and the inner surface 52. The light-transmitting layer 5 (with the inner surface 52) is disposed on the annular support layer 4, so that the inner surface 52 of the light-transmitting layer 5, the annular support layer 4, and the top surface 21 of the sensing chip 2 together form a closed space E.

[0046] The inner surface 52 of the light-transmitting layer 5 (e.g., the junction of the inner surface 52 and the annular side surface 53) includes a plurality of straight edges 521 and a plurality of rounded corners 522, and any two adjacent straight edges 521 are connected by a rounded corner 522. It should be noted that the shape of the light-transmitting layer 5 can be formed by suitable means (e.g., grinding, laser engraving, etching) according to actual needs, and this application does not impose any limitations on it.

[0047] Furthermore, the plurality of straight edges 521 are respectively adjacent to and parallel to the plurality of edge segments 41, and each straight edge 521 is separated from the adjacent edge segment 41 by a first inward distance D1. The plurality of rounded corners 522 are respectively adjacent to the plurality of rounded corner segments 42, and each rounded corner 522 is separated from the adjacent rounded corner segment 42 by a second inward distance D2, which is 95% to 105% of the first inward distance D1.

[0048] Accordingly, in this embodiment, the sensor packaging structure 100 forms a plurality of arc-shaped corners 522 on the light-transmitting layer 5 that meet specific conditions (e.g., the second inward distance D2 is 95% to 105% of the first inward distance D1), so that the length of the gap G between the light-transmitting layer 5 and the sensing chip 2 can be effectively shortened, thereby facilitating the flow of the package 6 into and filling the gap G, and thus preventing any air bubbles from forming in the gap G.

[0049] Furthermore, since the length of the gap G can be effectively shortened in this embodiment, the volume of the package 6 located within the gap G is also relatively reduced, thereby reducing the stress it exerts on the annular support layer 4 at any of the rounded corner segments 42. For example, compared to a sensor package structure with right angles at the corners of the light-transmitting layer (not shown in the figure), the stress generated at any of the rounded corner segments 42 in the sensor package structure 100 disclosed in this embodiment can be effectively reduced by 22% to 27%.

[0050] It should be noted that, in this embodiment, the configuration relationship between any one of the arc-shaped corners 522 and the adjacent rounded corner segment 42 of the light-transmitting layer 5 is equivalent to the configuration relationship between the other arc-shaped corner 522 and the adjacent rounded corner segment 42, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, the configuration relationship between any one arc-shaped corner 522 and the adjacent rounded corner segment 42 may also be slightly different from the configuration relationship between the other arc-shaped corner 522 and the adjacent rounded corner segment 42.

[0051] Furthermore, in order for any of the arc-shaped corners 522 of the sensor package structure 100 to have a better effect with the adjacent rounded corner segments 42, their configuration includes at least some of the following features, but this application is not limited thereto.

[0052] The extensions of any two adjacent straight edges 521 are defined by an intersection point P, which is separated from the adjacent rounded corner segment 42 by an initial indentation distance D0, and the second indentation distance D2 is 35% to 70% of the initial indentation distance D0.

[0053] The center C522 of any of the rounded corners 522 is located inside the adjacent rounded corner segments 42. The first projection area formed by the orthographic projection of the outer arc surface 421 of each rounded corner segment 42 onto the inner surface 52 has a first radial direction R1, and the center C522 of the adjacent rounded corners 522 lies above the first radial direction R1. Furthermore, the first projection area formed by the orthographic projection of the outer arc surface 421 of each rounded corner segment 42 onto the inner surface 52 has radii R421 and R522, which are 70% to 90% of the radii R421 and R522 of the adjacent rounded corners 522. Moreover, a second projection area formed by the orthographic projection of the inner arc surface 422 of each rounded corner segment 42 onto the inner surface 52 has a second radial direction R2 overlapping the first radial direction R1.

[0054] Furthermore, the first projection area formed by the orthographic projection of the outer arc surface 421 of each rounded corner segment 42 onto the inner surface 52 has a first center C421, which overlaps with the center C522 of the adjacent rounded corner 522. The second projection area formed by the orthographic projection of the inner arc surface 422 of each rounded corner segment 42 onto the inner surface 52 has a second center C422 that overlaps with the first center C421.

[0055] In this embodiment, the encapsulation 6 is opaque to block visible light from passing through. The encapsulation 6 is described as a cured liquid encapsulation, and it is formed on the upper surface 11 of the substrate 1 with its edges flush with the edges of the substrate 1. At least a portion of each metal line 3, the sensing chip 2, the annular support layer 4, and the light-transmitting layer 5 are embedded within the encapsulation 6, and at least a portion of the outer surface 51 of the light-transmitting layer 5 is exposed outside the encapsulation 6; however, this application is not limited to this.

[0056] Example 2

[0057] Please see Figure 8 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0058] This embodiment provides a sensing lens, which includes a sensor package structure 100, an optical module 200 and at least one passive electronic component 300 coupled to the sensor package structure. The sensor package structure 100 is constructed in a manner similar to that in Embodiment 1, except that the substrate 1 of the sensor package structure 100 further has an extension block 13 that extends and protrudes from the package body 6. Other construction details of the sensor package structure 100 are as described in Embodiment 1 and will not be repeated here.

[0059] The optical module 200 includes a frame 201, at least one lens 202 mounted within the frame 201, and a filter 203 mounted within the frame 201. The bottom edge of the frame 201 is fixed to the expansion block 13, the central axis L of the at least one lens 202 passes through the sensing area 211, and the filter 203 is located on the central axis L. At least one passive electronic component 300 is mounted in the expansion block 13 and adjacent to the frame 21. Furthermore, the number of at least one passive electronic component 300 can be adjusted according to design requirements, and this application does not impose any limitations.

[0060] More specifically, in this embodiment, there are multiple lenses 202, and the central axes L of the multiple lenses 202 substantially overlap each other. The filter 203 is located between the multiple lenses 202 and the light-transmitting layer 5. The frame 201, the filter 203, and the upper surface 11 of the substrate 1 together form a configuration space 204, so that at least one passive electronic component 3, the sensing chip 2, the multiple metal lines 3, the annular support layer 4, the light-transmitting layer 5, and the package 6 are all located within the configuration space 204.

[0061] Technical effects of this application

[0062] In summary, the sensor packaging structure and sensing module disclosed in this application form multiple arc-shaped corners on the light-transmitting layer that meet specific conditions (e.g., the second inward distance is 95% to 105% of the first inward distance), thereby effectively shortening the gap length between the light-transmitting layer and the sensing chip. This facilitates the flow of the package into and fills the gap, thereby preventing any air bubbles from forming in the gap.

[0063] Furthermore, in the sensor packaging structure and sensing module disclosed in this application embodiment, since the length of the gap can be effectively shortened in this embodiment, the volume of the package within the gap will also be relatively reduced, thereby reducing the stress on the annular support layer at any of the rounded corner segments.

[0064] The content disclosed above is only a preferred and feasible embodiment of this application and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A sensor packaging structure, characterized in that, The sensor packaging structure includes: One substrate; A sensing chip is disposed on the substrate and electrically coupled to the substrate; wherein, a top portion of the sensing chip includes a sensing area and a bearing area surrounding the sensing area; An annular support layer is disposed on the carrier area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes a plurality of edge segments and a plurality of rounded corner segments, and any two adjacent edge segments are connected by a rounded corner segment. A light-transmitting layer is disposed on the annular support layer, such that the light-transmitting layer, the annular support layer, and the top surface of the sensing chip together form a closed space; wherein, the inner surface of the light-transmitting layer includes: Multiple straight edges, each adjacent to and parallel to one of the edge segments; wherein, Each of the linear edges is separated from the adjacent edge segment by a first indentation distance; and Multiple rounded corners are respectively adjacent to multiple rounded corner segments, and any two adjacent straight edges are connected by one of the rounded corners; wherein, any one of the rounded corners is separated from the adjacent rounded corner segment by a second inward distance, which is 95% to 105% of the first inward distance; and A package is formed on the substrate; wherein the sensing chip, the annular support layer, and the light-transmitting layer are embedded within the package, and the outer surface of the light-transmitting layer away from the substrate is at least partially exposed outside the package.

2. The sensor packaging structure according to claim 1, characterized in that, The extensions of any two adjacent straight edges are defined to have an intersection point, which is separated from the adjacent rounded segment by an initial indentation distance, and the second indentation distance is 35% to 70% of the initial indentation distance.

3. The sensor packaging structure according to claim 1, characterized in that, The center of any of the arc-shaped corners is located inside the adjacent arc-shaped corner segment.

4. The sensor packaging structure according to claim 3, characterized in that, A first projection area formed by the orthographic projection of the outer arc surface of each of the rounded corner segments toward the inner surface has a first radial direction, and the center of the adjacent rounded corner is located above the first radial direction.

5. The sensor packaging structure according to claim 4, characterized in that, The second projection area formed by the orthographic projection of the inner arc surface of each of the rounded corner segments toward the inner surface has a second radial direction that overlaps with the first radial direction.

6. The sensor packaging structure according to claim 3, characterized in that, Each of the rounded corner segments has a first projection area formed by the orthographic projection of its outer arc surface toward the inner surface, which overlaps with the center of the adjacent rounded corner.

7. The sensor packaging structure according to claim 6, characterized in that, The second projection area formed by the orthographic projection of the inner arc surface of each of the rounded corner segments toward the inner surface has a second center that overlaps with the center of the first circle.

8. The sensor packaging structure according to claim 1, characterized in that, A first projection area formed by the orthographic projection of the outer arc surface of each of the rounded corner segments toward the inner surface has a radius that is 70% to 90% of the radius of the adjacent rounded corner.

9. The sensor packaging structure according to claim 1, characterized in that, The sensing chip has multiple right angles, and each of the multiple right angles is adjacent to a multiple of the rounded corner segments.

10. A sensing module with a sensor packaging structure, characterized in that, The sensing module of the sensor packaging structure includes: A sensing chip, the top of which includes a sensing area and a carrying area surrounding the sensing area; An annular support layer is disposed on the carrier area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes a plurality of edge segments and a plurality of rounded corner segments, and any two adjacent edge segments are connected by a rounded corner segment; and A light-transmitting layer is disposed on the annular support layer, such that the light-transmitting layer, the annular support layer, and the top surface of the sensing chip together form a closed space; wherein, the inner surface of the light-transmitting layer includes: Multiple straight edges, each adjacent to and parallel to one of the edge segments; wherein, Each of the linear edges is separated from the adjacent edge segment by a first indentation distance; and Multiple arc-shaped corners are respectively adjacent to multiple rounded corner segments, and any two adjacent straight edges are connected by one of the arc-shaped corners; wherein, any one of the arc-shaped corners is separated from the adjacent rounded corner segment by a second inward distance, which is 95% to 105% of the first inward distance.

11. The sensing module with the sensor packaging structure according to claim 10, characterized in that, The extensions of any two adjacent straight edges are defined to have an intersection point, which is separated from the adjacent rounded segment by an initial indentation distance, and the second indentation distance is 35% to 70% of the initial indentation distance.

12. The sensing module with the sensor packaging structure according to claim 10, characterized in that, The center of any of the arc-shaped corners is located inside the adjacent rounded corner segments; wherein, a first projection area formed by the orthographic projection of an outer arc surface of each rounded corner segment onto the inner surface has a first radial direction, and the center of the adjacent arc-shaped corners is located above the first radial direction.

13. The sensing module with the sensor packaging structure according to claim 12, characterized in that, The second projection area formed by the orthographic projection of the inner arc surface of each of the rounded corner segments toward the inner surface has a second radial direction that overlaps with the first radial direction.

14. The sensing module with the sensor packaging structure according to claim 10, characterized in that, The center of any of the arc-shaped corners is located inside the adjacent arc segment; wherein, a first projection area formed by the orthographic projection of the outer arc surface of each arc segment onto the inner surface has a first center that overlaps with the center of the adjacent arc-shaped corner.

15. The sensing module with the sensor packaging structure according to claim 14, characterized in that, The second projection area formed by the orthographic projection of the inner arc surface of each of the rounded corner segments toward the inner surface has a second center that overlaps with the center of the first circle.

16. The sensing module with the sensor packaging structure according to claim 10, characterized in that, A first projection area formed by the orthographic projection of the outer arc surface of each of the rounded corner segments toward the inner surface has a radius that is 70% to 90% of the radius of the adjacent rounded corner.

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