CPU chip heat dissipation structure based on glass substrate and packaging method thereof
By using a liquid-cooled circulating heat dissipation structure with an internal channel based on a glass substrate and an external heat sink, the problem of insufficient heat dissipation in traditional CPU chips is solved, achieving efficient heat dissipation and miniaturized packaging, thereby improving chip performance and lifespan.
Patent Information
- Application Number
- CN202511138197.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-14
- Publication Date
- 2025-11-21
AI Technical Summary
Traditional substrates have poor heat dissipation and insufficient high-frequency performance. Ceramic substrates are expensive and brittle, making them difficult to popularize. Traditional CPU chip heat dissipation structures are large in size and have poor heat dissipation effect, affecting chip performance and power consumption.
The CPU chip heat dissipation structure adopts a glass substrate, with an internal glass channel and an external heat sink, combined with liquid cooling circulation heat dissipation. Through the design of the glass substrate and heat sink, efficient heat dissipation is achieved, and the glass substrate is formed by lamination process.
Significantly reduces the heat dissipation volume of CPU chips, improves computing performance, enables high-frequency communication, reduces signal loss, extends chip life, and achieves lower power consumption and higher performance.
Smart Images
Figure CN120998901A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of chip packaging, in particular to a CPU chip heat dissipation structure based on a glass substrate and a packaging method thereof. BACKGROUND
[0002] The traditional substrate has poor heat dissipation and insufficient high-frequency performance, and is only suitable for low-end applications. The ceramic substrate is high in cost and large in brittleness, and is difficult to popularize. The heat dissipation structure of the traditional CPU chip is large in size and poor in heat dissipation effect, thereby affecting the performance and power consumption of the chip. SUMMARY
[0003] The application provides a CPU chip heat dissipation structure based on a glass substrate and a packaging method thereof to overcome the defects of the prior art.
[0004] To achieve the above-mentioned purpose, a CPU chip heat dissipation structure based on a glass substrate is designed, which comprises a glass substrate, a glass channel in communication with the outside is arranged in the glass substrate, a chip is attached to one side surface of the glass substrate, a heat sink is arranged outside the glass substrate, the heat sink comprises a shell, a liquid cooling pipeline and a heat exchange device, the shell is arranged above the glass substrate, the heat exchange device is arranged in the shell, one end of the liquid cooling pipeline is connected to the outlet of the heat exchange device, and the other end of the liquid cooling pipeline penetrates through the glass channel and is connected to the inlet of the heat exchange device.
[0005] The glass substrate comprises glass plate one and glass plate two arranged in the up-down direction, a groove is arranged on the side surface of the glass plate one close to the glass plate two, and the groove between the glass plate one and the glass plate two forms the glass channel.
[0006] The shell is provided with heat dissipation holes on both sides and matched with the positions of the chip.
[0007] One end of the glass substrate is connected with a solder ball.
[0008] The cooling liquid in the liquid cooling pipeline flows out from the heat exchange device, passes through the glass channel, dissipates heat for the glass substrate and the chip, flows into the heat exchange device again to dissipate heat, and realizes liquid cooling circulation heat dissipation.
[0009] To achieve the above-mentioned purpose, a packaging method of a CPU chip heat dissipation structure based on a glass substrate is designed, which comprises the following steps. S1, providing a glass plate one, etching the surface of the glass plate one to form a groove; S2, providing a glass plate two, pressing the glass plate two on the glass plate one to obtain a glass core plate; S3, manufacturing a TGV on the glass core plate, and completing interconnection of the glass plate one and the glass plate two; S4, taking the glass core plate as a core layer, performing a lamination operation to obtain a glass substrate; S5, mounting the chip on the glass substrate and ball mounting; S6, mounting the heat sink on the glass substrate.
[0010] In the step S2, the groove is located between the first glass plate and the second glass plate to form the glass channel.
[0011] In the step S4, the ABF layer and the copper layer are pressed by the lamination operation.
[0012] Compared with the prior art, the glass substrate with the built-in cooling liquid channel is externally connected with the heat sink, so that the heat dissipation volume of the CPU chip is greatly reduced, the heat dissipation bottleneck of the high-performance chip is solved, the packaging volume is greatly reduced, the computing performance is improved, the high-frequency communication is enabled, the signal loss is reduced, the CPU chip technology is innovated, the lower power consumption and longer service life are realized, the chip performance is improved, and the service life of the chip is prolonged. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 The figure is a structural schematic diagram of the application.
[0014] Figure 2 The figure is a flowchart of the application. DETAILED DESCRIPTION
[0015] The application will be further described below with reference to the drawings.
[0016] The CPU chip heat dissipation structure based on the glass substrate in the embodiment is shown in the figure. Figure 1 The glass substrate 1 is internally provided with the glass channel 2 connected with the outside, the chip 3 is mounted on one side surface of the glass substrate 1, the heat sink 4 is provided outside the glass substrate 1, the heat sink 4 comprises the shell 4-1, the liquid cooling pipeline 4-2 and the heat exchange device 4-3, the shell 4-1 is arranged above the glass substrate 1, the heat exchange device 4-3 is arranged in the shell 4-1, one end of the liquid cooling pipeline 4-2 is connected with the outlet of the heat exchange device 4-3, and the other end of the liquid cooling pipeline 4-2 passes through the glass channel 2 and is connected with the inlet of the heat exchange device 4-3.
[0017] The glass substrate 1 comprises the first glass plate 1-1 and the second glass plate 1-2 arranged in the up-down direction, the groove 1-3 is arranged on one side surface of the first glass plate 1-1 close to the second glass plate 1-2, and the groove 1-3 forms the glass channel 2 between the first glass plate 1-1 and the second glass plate 1-2. The glass channel 2 is the built-in cooling liquid channel of the glass substrate 1, solves the heat dissipation bottleneck of the high-power chip, greatly reduces the packaging volume, and is beneficial to the miniaturization of the product.
[0018] The shell 4-1 is provided with the heat dissipation holes 4-4 matched with the positions of the chips 3 on both sides, the chips 3 are cooled, and the heat dissipation performance is enhanced.
[0019] The glass substrate 1 is connected with the soldering ball 5 at one end, so as to form electrical connection with the outside.
[0020] The cooling liquid in the liquid cooling pipeline 4-2 flows out from the heat exchange device, and then flows through the glass channel 2 to cool the glass substrate 1 and the chip 3, and then flows into the heat exchange device to be cooled, so as to realize liquid cooling circulation cooling.
[0021] The packaging method of the CPU chip cooling structure is shown in the figure, and includes the following steps: Figure 2 S1, a glass plate one 1-1 is provided, and the surface of the glass plate one 1-1 is etched to form a groove 1-3; S2, a glass plate two 1-2 is provided, and the glass plate two 1-2 is pressed on the glass plate one 1-1 to obtain a glass core plate 6; S3, a TGV is made on the glass core plate 6, and the glass plate one 1-1 and the glass plate two 1-2 are interconnected; S4, taking the glass core plate 6 as a core layer, a layer pressing operation is performed to press the ABF layer and the copper layer to obtain the glass substrate 1; S5, the chip 3 is attached to the glass substrate 1 and the ball is planted; and S6, the heat sink 4 is installed on the glass substrate 1.
[0022] In step S2, the groove 1-3 is located between the glass plate one 1-1 and the glass plate two 1-2 to form a glass channel 2. In specific use, the heat of the chip 3 can be taken away by directly contacting with the cooling fin, and the heat below can be transmitted downward to the glass channel 2 to be taken away by the cooling liquid.
[0023] The glass core is used as the substrate core layer, and the glass substrate has a low thermal expansion coefficient compared with the traditional organic core material, can better control the warping, has a higher thermal conductivity, has a better heat dissipation performance, and plays an important role in heat dissipation for large-size CPU chips. Moreover, the glass material is very suitable for microchannels, has good liquid sealing property, and has a low cost.
[0024] The traditional CPU chip needs to be externally connected with a cooling fin and a fan, which occupies a lot of space. The glass substrate with better heat dissipation and the heat sink with liquid cooling circulation are used in the application, so that the cooling fin and the fan are not needed, and the product volume is greatly reduced. Moreover, the FCBGA packaging will not increase additional processes.
Claims
1. A glass substrate based CPU chip heat dissipation structure comprising a glass substrate, characterized in that: The glass substrate (1) is internally provided with a glass channel (2) in communication with the outside, a chip (3) is attached to one side surface of the glass substrate (1), and a heat sink (4) is arranged outside the glass substrate (1), wherein the heat sink (4) comprises an outer shell (4-1), a liquid cooling pipe (4-2) and a heat exchange device (4-3), the outer shell (4-1) is arranged above the glass substrate (1), the heat exchange device (4-3) is arranged in the outer shell (4-1), one end of the liquid cooling pipe (4-2) is connected to the outlet of the heat exchange device (4-3), and the other end of the liquid cooling pipe (4-2) penetrates through the glass channel (2) and is connected to the inlet of the heat exchange device (4-3).
2. The CPU chip heat dissipation structure based on glass substrate according to claim 1, characterized in that: The glass substrate (1) comprises a glass plate one (1-1) and a glass plate two (1-2) arranged in an up-down direction, a recess (1-3) is arranged on the side surface of the glass plate one (1-1) close to the glass plate two (1-2), and the recess (1-3) forms the glass channel (2) between the glass plate one (1-1) and the glass plate two (1-2).
3. The CPU chip heat dissipation structure based on glass substrate according to claim 1, characterized in that: The outer shell (4-1) is provided with heat dissipation holes (4-4) on both sides and matched with the positions of the chip (3).
4. The CPU chip heat dissipation structure based on glass substrate according to claim 1, characterized in that: One end of the glass substrate (1) is connected to a solder ball (5).
5. The CPU chip heat dissipation structure based on glass substrate according to claim 1, characterized in that: The cooling liquid in the liquid cooling pipe (4-2) flows out from the heat exchange device, passes through the glass channel (2), cools the glass substrate (1) and the chip (3), and then flows into the heat exchange device to be cooled, thereby realizing liquid cooling circulation.
6. A method of packaging a glass substrate-based CPU chip heat dissipation structure according to any one of claims 1 to 5, characterized by: The method comprises the following steps: S1, providing a glass plate one (1-1), etching the surface of the glass plate one (1-1) to form a recess (1-3); S2, providing a glass plate two (1-2), pressing the glass plate two (1-2) on the glass plate one (1-1) to obtain a glass core plate (6); S3, manufacturing a TGV on the glass core plate (6), and completing the interconnection of the glass plate one (1-1) and the glass plate two (1-2); S4, taking the glass core plate (6) as a core layer, and performing a lamination operation to obtain a glass substrate (1); S5, attaching a chip (3) to the glass substrate (1) and planting a ball; S6, mounting a heat sink (4) on the glass substrate (1).
7. The method of packaging a CPU chip heat spreading structure based on a glass substrate according to claim 6, wherein: In the step S2, the recess (1-3) is arranged between the glass plate one (1-1) and the glass plate two (1-2) to form the glass channel (2).
8. The packaging method for a CPU chip heat dissipation structure based on a glass substrate according to claim 6, characterized in that: In the step S4, an ABF layer and a copper layer are laminated and pressed through the lamination operation.