BSD experimental device for wafer processing and control method thereof

Abstract

The invention relates to a BSD experimental device for wafer processing and a control method thereof, and belongs to the technical field of wafer processing experimental equipment.The BSD experimental device comprises a spray gun, a grinding fluid pot communicated with the spray gun is arranged at the upper end of the spray gun, an air compression pump is arranged at the rear end of the spray gun, and a pressure regulating valve is arranged between the air compression pump and the spray gun; and air pipes are arranged between the pressure regulating valve and the air compression pump and between the pressure regulating valve and the spray gun. The device has the characteristics of simple structure and convenient operation. According to the device, grinding liquid is pressurized through compressed air and then sprayed to the surface of a wafer, a damaged layer is manufactured on the surface, and the purpose of absorbing metal impurities is achieved. And meanwhile, the replacement of the grinding liquid and the adjustment of parameters become simple and convenient, so that the overall efficiency of wafer processing is improved. The design not only considers the processing efficiency, but also considers the operation convenience and stability, and is indispensable key equipment in the wafer processing field.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing experiment equipment, in particular to a BSD experiment device for wafer processing and a control method thereof. BACKGROUND

[0002] In the wafer processing process, there are usually three major pollution sources: particles, metals and organic matter. Among them, metal is the main reason for the failure of components, short circuit and reduced service life. In order to improve product quality and reduce the failure rate, various means need to be used to control the metal content of the wafer, and the BSD process is one of them.

[0003] The main purpose of the BSD (Back Side Damage) process is to getter. Its principle is to use sand blasting to cause damage to the back of the silicon wafer to produce stress defects. This stress layer itself does not have the ability to directly attract metal impurities to defect, but when the wafer with the stress layer is subjected to high temperature process (> 900℃), the stress layer will cause the generation of defects, thereby having the ability to attract metal impurities. By controlling the sand blasting pressure, the depth of the stress layer and the defect density can be controlled.

[0004] The current BSD process equipment needs to pass through the delivery pump to stir the grinding liquid barrel, accompanied by compressed air through the pressure regulating valve, and finally use the spray gun to spray the back of the wafer. Since the grinding liquid stirring barrel is relatively large, a barrel needs to consume a large amount of materials during the experiment, and the cost is too high. SUMMARY

[0005] The present application mainly solves the problems existing in the prior art, and provides a BSD experiment device for wafer processing and a control method thereof, which solves the problem of material waste in the experiment process, greatly reduces the material consumption while ensuring the experimental effect, and reduces the research and development cost.

[0006] The above technical problems of the present application are mainly solved by the following technical scheme: A BSD experiment device for wafer processing, comprising a spray gun, wherein the upper end of the spray gun is provided with a grinding liquid pot connected with the spray gun, the rear end of the spray gun is provided with an air compression pump, the air compression pump and the spray gun are provided with a pressure regulating valve therebetween, and the pressure regulating valve and the air compression pump and the pressure regulating valve and the spray gun are both provided with an air pipe. The grinding liquid pot is used for storing grinding liquid and conveying the grinding liquid to the nozzle through the grinding liquid flow channel. The capacity and design of the grinding liquid pot need to meet the long-time processing requirement, and it is convenient to supplement and replace the grinding liquid.

[0007] As preferred, the spray gun comprises a spray gun shell, the front end of the spray gun shell is provided with a nozzle fixedly connected with the spray gun shell by plug-in connection, the spray gun shell is provided with a spray pipe communicated with the nozzle, the spray pipe is a compressed air spray channel, and the spray pipe and the spray gun shell are a polishing liquid flow channel.

[0008] The nozzle is used to form a spray outlet of the polishing liquid and the compressed air. The design of the nozzle ensures that the polishing liquid and the compressed air can be sprayed to the wafer surface at a precise angle and pressure, avoiding damage to the wafer caused by improper spraying. The spray gun shell fixes the nozzle by plug-in connection, improving the sealing performance and durability of the device. The polishing liquid flow channel is provided to enable the polishing liquid to be efficiently delivered to the nozzle, ensuring the continuity of the processing process.

[0009] As preferred, the front end of the spray gun is provided with a spray pipe fixedly connected with the nozzle by screwing, enhancing the accuracy of the spraying direction.

[0010] As preferred, the air compression pump is provided with a push frame on one side, and the push frame is provided with a spray gun rack. The push frame 7 is used to fix the spray gun rack, and facilitates the pushing and carrying of the air compression pump. The spray gun rack provides stable placement support for the spray gun, and facilitates the taking and placing of the spray gun by the operator.

[0011] The control method of the BSD experimental device comprises the following operation steps: First step: prepare the polishing liquid and pour it into the polishing liquid pot.

[0012] Second step: according to the requirements, the spray pipe is fixedly connected with the nozzle at the front end of the spray gun by screwing, and the spray pipe is used to enhance the accuracy of the spraying direction.

[0013] Third step: the air pipe is used to connect the pressure regulating valve with the air compression pump and the pressure regulating valve with the spray gun, ensuring the stable delivery of the air.

[0014] Fourth step: the air compression pump is turned on to provide a stable compressed air source for the spray gun, which is the power source for the polishing liquid spraying, and the pressure regulating valve is adjusted to accurately adjust the air pressure, meeting the requirements of different wafer processing processes on the spraying pressure.

[0015] Fifth step: the operator holds the spray gun and presses the handle of the spray gun to spray the pressurized polishing liquid to process the back surface of the wafer.

[0016] As preferred, the handle of the spray gun controls the polishing liquid in the polishing liquid pot to enter the polishing liquid flow channel through the spray gun shell, and controls the compressed air channel in the spray pipe to pressurize the polishing liquid and spray it out of the nozzle.

[0017] As preferred, the polishing liquid is mixed by water and abrasive particles (SiO2 or aluminum oxide) in a certain proportion.

[0018] The present invention can achieve the following effects: This invention provides a BSD experimental apparatus and its control method for wafer fabrication. Compared with existing technologies, the reduced size of the apparatus significantly reduces material consumption (from 95L to 0.5L), thereby lowering experimental costs. Furthermore, the reduced cost allows for more experiments to be conducted to test different process conditions without compromising cost.

[0019] With precise grinding and cleaning functions, it provides a high-quality foundation for subsequent wafer processing. Cleaning removes particles, organic matter, and metal ions from the wafer surface using chemical solutions or physical methods. Grinding removes tiny particles and contaminants from the wafer surface, improving surface smoothness. Its design not only considers processing efficiency but also operational convenience and stability, making it an indispensable key piece of equipment in the wafer fabrication field. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention.

[0021] Figure 2 This is a partial structural cross-sectional view of the spray gun of the present invention.

[0022] In the diagram: 1. Spray nozzle, 2. Grinding fluid container, 3. Air pipe, 4. Spray gun holder, 5. Pressure regulating valve, 6. Air compressor pump, 7. Pusher, 8. Spray gun, 9. Nozzle, 10. Spray gun housing, 11. Grinding fluid flow channel, 12. Air jet pipe, 13. Compressed air jet channel. Detailed Implementation

[0023] The technical solution of the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0024] Example: Figure 1 and Figure 2 As shown, a BSD experimental apparatus for wafer processing includes a spray gun 8. The spray gun 8 includes a spray gun housing 10. A nozzle 9 is fixedly connected to the front end of the spray gun housing 10 via an insert. An air jet pipe 12, connected to the nozzle 9, is located inside the spray gun housing 10. A compressed air jet channel 13 is located inside the air jet pipe 12, and a polishing slurry flow channel 11 is located between the air jet pipe 12 and the spray gun housing 10. A nozzle 1, threadedly connected to the nozzle 9, is located at the front end of the spray gun 8. A polishing slurry reservoir 2, connected to the polishing slurry flow channel 11, is located at the upper end of the spray gun 8. An air compressor pump 6 is located at the rear end of the spray gun 8. A pusher 7 is located on one side of the air compressor pump 6, and a spray gun holder 4 is located on the pusher 7. A pressure regulating valve 5 is located between the air compressor pump 6 and the spray gun 8. Air pipes 3 are located between the pressure regulating valve 5 and the air compressor pump 6, and between the pressure regulating valve 5 and the spray gun 8.

[0025] A BSD experimental setup and its control method, comprising the following operating steps: First step: prepare the grinding liquid and pour it into the grinding liquid pot 2.

[0026] The grinding liquid is mixed with water and abrasive particles, and its concentration is determined by specific gravity.

[0027] Second step: according to the requirements, thread the nozzle 1 to the front end of the spray gun 8, and fix it with the nozzle 9, and use the nozzle 1 to enhance the accuracy of the spray direction.

[0028] Third step: connect the air pipe 3 to the pressure regulating valve 5 and the air compressor pump 6, and connect the pressure regulating valve 5 to the spray gun 8, to ensure stable delivery of air.

[0029] Fourth step: turn on the air compressor pump 6 to provide a stable source of compressed air for the spray gun 8, which is the power source for the grinding liquid spray, and adjust the pressure regulating valve 5 to accurately adjust the air pressure to meet the requirements of different wafer processing technologies for spray pressure.

[0030] Fifth step: hold the spray gun 8 and press the handle to spray the pressurized grinding liquid to process the back of the wafer.

[0031] The handle of the spray gun 8 controls the grinding liquid in the grinding liquid pot 2 to enter the grinding liquid flow channel 11 through the spray gun shell 10, and controls the compressed air in the air pipe 12 to spray the pressurized grinding liquid from the nozzle 9.

[0032] In summary, the BSD experimental device for wafer processing and its control method have the characteristics of simple structure and convenient operation. It makes it easy to replace the grinding liquid and adjust the parameters, thereby improving the flexibility of the experiment.

[0033] The device sprays the grinding liquid on the wafer surface by compressed air, and manufactures a layer of damage layer on the surface to achieve the purpose of absorbing metal impurities. At the same time, it makes it easy to replace the grinding liquid and adjust the parameters, thereby improving the overall efficiency of wafer processing. Its design not only considers the processing efficiency, but also takes into account the convenience and stability of operation, which is an indispensable key equipment in the field of wafer processing.

[0034] The BSD experimental device for wafer processing adopts a small and compact structure of the grinding liquid pot, which can meet the experimental requirements and only needs a small amount of grinding liquid material at a time, reducing the experimental cost from 95L of grinding liquid stirring barrel to 0.5L of grinding liquid pot.

[0035] The above description is only a specific embodiment of the present application, but the structural features of the present application are not limited to this. Any changes or modifications made by those skilled in the art within the scope of the present application are covered by the patent scope of the present application.

Claims

1. A BSD experimental apparatus for wafer processing, characterized by: The utility model provides a kind of grinding liquid spraying device, including spray gun (8), the upper end of the spray gun (8) is equipped with with the grinding liquid pot (2) being communicated with spray gun (8), the rear end of the spray gun (8) is equipped with air compressor pump (6), air compressor pump (6) is equipped with pressure regulating valve (5) with spray gun (8) between, pressure regulating valve (5) is equipped with air pipe (3) between pressure regulating valve (5) and air compressor pump (6), pressure regulating valve (5) and spray gun (8).

2. The BSD experimental apparatus for wafer processing of claim 1, wherein: The spray gun (8) includes a spray gun housing (10), the spray gun housing (10) is provided with a nozzle (9) at the front end thereof and is fixedly connected with the spray gun housing (10) in an insert fitting manner, the spray gun housing (10) is provided with a gas jet pipe (12) therein and is communicated with the nozzle (9), the gas jet pipe (12) is provided with a compressed air jet (13) therein, and the gas jet pipe (12) is provided with a grinding liquid flow channel (11) between the gas jet pipe (12) and the spray gun housing (10).

3. The BSD test device for wafer processing according to claim 1, wherein: The spray gun (8) is provided with a spray pipe (1) at the front end thereof and is fixedly connected with the nozzle (9) in a threaded sleeve fitting manner.

4. The BSD test device for wafer processing according to claim 1, wherein: The air compressor pump (6) is provided with a push frame (7) at one side thereof, and the push frame (7) is provided with a spray gun shelf (4) thereon.

5. A control method of the BSD experiment apparatus according to claim 3, characterized by The utility model includes the following operation steps: First step: prepare the grinding liquid and pour it into the grinding liquid pot (2); Second step: according to the requirements, the spray pipe (1) is fixedly connected with the nozzle (9) at the front end of the spray gun (8) in a threaded sleeve fitting manner, and the spray pipe (1) is used to enhance the accuracy of the spraying direction; Third step: the air pipe (3) is used to connect the pressure regulating valve (5) and the air compressor pump (6) and the pressure regulating valve (5) and the spray gun (8), so as to ensure the stable delivery of air; Fourth step: the air compressor pump (6) is turned on to provide a stable compressed air source for the spray gun (8), which is the power source for the grinding liquid spraying, and the pressure regulating valve (5) is adjusted to accurately adjust the air pressure, so as to meet the requirements of different wafer processing technologies on the spraying pressure; Fifth step: the spray gun (8) is held by hand, the pressurized grinding liquid is sprayed out to process the back surface of the wafer by pressing the handle of the spray gun (8).

6. The control method of the BSD test device according to claim 5, wherein: The handle of the spray gun (8) controls the grinding liquid in the grinding liquid pot (2) to enter the grinding liquid flow channel (11) through the spray gun housing (10), and controls the compressed air jet (13) in the gas jet pipe (12) to pressurize the grinding liquid and spray it out from the nozzle (9).

7. The control method of the BSD experimental apparatus according to claim 5, characterized by: The grinding liquid is mixed by water and abrasive particles in a certain proportion.

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