Dust-removing wafer transfer robot and robot thereof

Abstract

The application provides a dust removal type wafer transfer manipulator and a robot thereof, wherein the manipulator comprises a finger base, an extender, a push rod and a dust removal assembly; the finger base is provided with an equipment cavity; one side of the equipment cavity is provided with a shaft hole; the dust removal assembly comprises a dust suction member and an air pipe; the dust suction member is provided with a dust suction cavity; the dust suction member is respectively provided with a purification hole penetrating through the dust suction cavity and a dust suction port communicating with the dust suction cavity; the dust suction member is arranged at the shaft hole; the purification hole communicates with the shaft hole; the extender is arranged in the equipment cavity; the push rod is connected with a driving end of the extender through the shaft hole and the purification hole; the air pipe communicates with the dust suction port and is connected with a negative pressure source; a negative pressure barrier is formed around the push rod through the purification hole to close the shaft hole. In this way, the leakage of the debris particle pollutants from the inner cavity of the manipulator is prevented.

Description

Technical Field

[0001] This invention relates to semiconductor wafer transport technology, and more particularly to a dust-removing wafer transport robot and the same. Background Technology

[0002] When existing wafer handling robots perform wafer clamping and transport operations, the reciprocating motion of the push rod drives the airflow within the robot arm cavity. This airflow flows through the push rod extension port to the wafer clamping position. During this process, as the clamping push rod reciprocates periodically, it inevitably causes wear and tear on the internal parts of the robot arm, resulting in the generation of debris particles. These particles then overflow and adhere to the wafer surface with the reciprocating airflow, causing wafer contamination.

[0003] Although the amount of such particulate contaminants generated is not large, the increasingly stringent requirements of advanced semiconductor manufacturing processes place higher demands on the cleanliness standards of wafer transfer robots. However, the existing structural design of wafer transfer robots cannot meet the long-term stable cleanliness requirements of advanced processes. Therefore, there is an urgent need in the field to design a new cleanroom solution to address the problem of particulate contaminant leakage from such wafer transfer robots. Summary of the Invention

[0004] Therefore, the main objective of this invention is to provide a dust-removing wafer transport robot and the robot thereof to prevent debris particles and contaminants from leaking out of the robot's internal cavity.

[0005] To achieve the above objectives, according to one aspect of the present invention, a dust-removing wafer transfer robot is provided, comprising: a finger base, a telescopic mechanism, a push rod, and a dust removal assembly, wherein the finger base has a device cavity, and one side of the device cavity has a shaft hole; the dust removal assembly includes: a dust-collecting component and an air pipe, wherein the dust-collecting component has a dust-collecting chamber, and the dust-collecting component has a purification hole penetrating the dust-collecting chamber and a dust-collecting port communicating with the dust-collecting chamber; wherein the dust-collecting component is disposed at the shaft hole, the purification hole is communicating with the shaft hole; the telescopic mechanism is disposed within the device cavity; the push rod passes through the shaft hole and the purification hole and is connected to the drive end of the telescopic mechanism; the air pipe is connected to the dust-collecting port and connected to a negative pressure source, and a negative pressure barrier is formed around the push rod through the purification hole to seal the shaft hole.

[0006] In a possible preferred embodiment, the dust collection component includes: an adsorption block and a sealing gasket. The adsorption block is provided with an air passage groove. The dust collection port is provided on the adsorption block and communicates with the air passage groove. The air passage groove is provided with a purification port. The sealing gasket is connected to the adsorption block and covers the air passage groove to define a dust collection chamber within the adsorption block. The sealing gasket is provided with a telescopic opening, which communicates with the purification port to form a purification hole that penetrates the dust collection chamber.

[0007] In a possible preferred embodiment, the finger base includes: a finger component, a cover plate, and a palm component, wherein the finger component is disposed at the front end of the palm component, the palm component is surrounded by a sealing wall, the cover plate is connected to the palm component and covers the sealing wall to define a device cavity within the sealing wall, and the shaft hole is formed on the front side of the sealing wall and communicates with the device cavity.

[0008] In a possible preferred embodiment, the top of the sealing wall is provided with a sealing groove, the sealing groove is embedded with a sealing strip, and the cover plate covers the sealing wall and presses the sealing strip tightly.

[0009] In a possible preferred embodiment, the telescopic device is a cleanroom-type slide cylinder, and the dust removal assembly further includes a T-shaped pipe connector, through which the air pipe branches and connects to the cleanroom-type slide cylinder and the dust suction port respectively.

[0010] In a possible preferred embodiment, the dust-removing wafer transfer robot further includes: a trigger and a sensor switch, wherein the trigger is connected to the drive end of the telescopic device, the sensor switch is disposed inside the device cavity and controlled by the telescopic device, and the sensing end of the sensor switch is disposed on the displacement path of the trigger.

[0011] In a possible preferred embodiment, the push rod has a Y-shaped head at its front end.

[0012] To achieve the above objectives, corresponding to the above examples, according to another aspect of the present invention, a robot is also provided, comprising: a main body, a robotic arm, a robotic hand, and a negative pressure vacuum pump, wherein the robotic arm is connected to and controlled by the main body, and the robotic hand is made of a dust-removing wafer transfer robotic hand as described above, which is disposed at the wrist end of the robotic arm and connected to the negative pressure vacuum pump via an air tube.

[0013] The dust-removing wafer transfer robot and its robot provided by this invention ingeniously design a dust removal component suitable for placement in confined spaces, such as at the push rod extension and retraction inlet, forming a negative pressure barrier to seal the robot's equipment cavity. This not only does not affect the push rod extension and retraction movement and maintain the robot's wafer clamping function, but also prevents contaminating particles in the equipment cavity from overflowing with the airflow and contaminating the wafer. This ensures that the wafer maintains sufficient cleanliness during the robot's transfer process, meeting the long-term stable cleanliness requirements of advanced semiconductor manufacturing processes. Attached Figure Description

[0014] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0015] Figure 1This is a schematic diagram of the overall structure of the dust-removing wafer transport robot of the present invention;

[0016] Figure 2 This is a three-dimensional half-section structural diagram of the dust-removing wafer transport robot of the present invention;

[0017] Figure 3 This is a top view of the dust-removing wafer transport robot of the present invention.

[0018] Figures 4 to 5 This is a schematic diagram of the assembly structure of the dust removal component and the push rod part in the dust removal wafer transfer robot of the present invention.

[0019] Figure 6 This is a schematic diagram of the overall structure of the robot of the present invention.

[0020] Explanation of reference numerals in the attached figures

[0021] 1. Finger base, 2. Telescopic device, 3. Push rod, 4. Dust removal assembly, 5. T-shaped pipe connector, 6. Trigger, 7. Sensor switch, 8. Main body, 9. Wafer, 11. Finger component, 12. Cover plate, 13. Palm component, 14. Sealing wall, 15. Equipment cavity, 16. Shaft hole, 31. Y-shaped rod head, 41. Dust collection component, 42. Air pipe, 81. Robotic arm, 82. Robotic hand, 83. Negative pressure vacuum pump, 111. Limiting protrusion, 112. Stroke notch, 141. Sealing groove, 411. Adsorption block, 412. Sealing gasket, 413. Air passage groove, 414. Dust collection port, 415. Purification port, 416. Telescopic port. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0026] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0027] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "lay out," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances and in conjunction with existing technology. Furthermore, unless otherwise specified, the embodiments and features in the embodiments of this invention can be combined with each other. One or more of the components shown in the figures may be necessary or not, and the relative positional relationships between the components shown in the figures can be adjusted according to actual needs.

[0028] To prevent debris particles from leaking from inside and outside the robotic arm 82 and contaminating the wafer, such as... Figures 1 to 5 As shown, the present invention provides a dust-removing wafer transfer robot 82, an example of which includes: a finger base 1, a telescopic device 2, a push rod 3, and a dust removal assembly 4.

[0029] Among them, such as Figures 2 to 4As shown, the finger base 1 example includes: a finger component 11, a cover plate 12, and a palm component 13. The finger component 11 is provided with a limiting protrusion 111 and a travel recess 112 at the rear end for the push rod 3 to extend and retract. The finger component 11 is connected to the front end of the palm component 13. The palm component 13 is surrounded by a sealing wall 14. The cover plate 12 is connected to the palm component 13 and covers the sealing wall 14 to define a device cavity 15 within the sealing wall 14. The front side of the sealing wall 14 has a shaft hole 16 communicating with the device cavity 15.

[0030] Among them, such as Figures 3 to 5 As shown, in order to be suitable for arrangement within the narrow equipment cavity 15 and to save space, the dust removal assembly 4 example includes: a dust collection component 41 and an air pipe 42, wherein the dust collection component 41 preferably includes: an adsorption block 411 and a sealing gasket 412. The adsorption block 411 is provided with an air passage groove 413, and a dust collection port 414 is provided on the adsorption block 411 and communicates with the air passage groove 413. The air passage groove 413 is provided with a purification port 415. The sealing gasket 412 is connected to the adsorption block 411 and covers the air passage groove 413 to define a dust collection cavity within the adsorption block 411. The sealing gasket 412 is provided with a telescopic opening 416, which communicates with the purification port 415 to form a purification hole penetrating the dust collection cavity.

[0031] With this design, the vacuum cleaner 41 can be fixed to the shaft hole 16 inside the equipment cavity 15 by screws, and the purification hole is connected to the shaft hole 16. The telescopic device 2 can be selected as a telescopic cylinder / electric cylinder, which is installed inside the equipment cavity 15. The push rod 3 passes through the shaft hole 16 and the purification hole and is connected to the telescopic drive end of the telescopic device 2. The air pipe 42 is connected to the suction port 414 via a barbed connector and connected to a negative pressure source, thereby creating a negative pressure inside the suction cavity. This negative pressure then forms a negative pressure barrier around the push rod 3 through the purification hole, sealing the shaft hole 16.

[0032] With this configuration, when the push rod 3 generates airflow during its extension and retraction, it causes particles inside the equipment cavity 15 to drift to the purification hole, the only outlet. These particles are then sucked into the dust collection chamber and extracted through the air pipe 42, thus preventing internal particles from overflowing and contaminating the wafer. At the same time, it does not hinder the extension and retraction of the push rod 3, and the wafer clamping function of the robotic arm 82 can still be maintained.

[0033] Furthermore, it is worth mentioning that, as can be seen from the above example, the dust removal component 4 occupies very little space, which can save a lot of space in the equipment cavity 15, providing a favorable environment for arranging other devices.

[0034] Furthermore, in order to improve the sealing performance of the equipment cavity 15, such as... Figures 2 to 4As shown, in an optional embodiment, the top of the sealing wall 14 may be provided with a sealing groove 141, and a sealing strip is embedded in the sealing groove 141. The cover plate 12 covers the sealing wall 14 and presses the sealing strip tightly to improve the sealing performance around the equipment cavity 15, prevent particulate matter from overflowing from the sealing wall 14 near the wafer, approaching and contaminating the wafer, thereby improving the cleanliness of the equipment.

[0035] Furthermore, considering that the expansion joint 2 is most prone to wear and particulate contaminants during its telescopic displacement, in an optional embodiment, the expansion joint 2 can be configured as a clean-type sliding cylinder, and the dust removal assembly 4, as... Figure 3 As shown, the example also includes: a T-shaped pipe connector 5, wherein the air pipe 42 is divided into two paths via the T-shaped pipe connector 5, which are respectively connected to the clean-type slide cylinder and the dust suction port 414, thereby directly removing the wear particles generated in the slide cylinder, so as to prevent the overflow of polluting particles from the source and further improve the cleanliness of the equipment cavity 15.

[0036] Furthermore, in order to better clamp the wafer, such as Figures 1 to 3 As shown, in an optional embodiment, the front end of the push rod 3 may be provided with a Y-shaped rod head 31 to form a multi-point clamping with the limiting protrusion 111 at the finger tip of the finger member 11 to prevent the wafer from shaking.

[0037] Furthermore, to prevent damage to the wafer, such as Figure 3 As shown, in an optional embodiment, the dust-removing wafer transfer robot 82 further includes: a trigger 6 and a sensor switch 7, wherein the trigger 6 is connected to the drive end of the telescopic device 2, and the sensor switch 7 is disposed within the device cavity 15 and controlled by the telescopic device 2. The sensing end of the sensor switch 7 is disposed on the displacement path of the trigger 6. With this configuration, the maximum extension stroke of the telescopic device 2 can be controlled by adjusting the initial position of the trigger 6 or adjusting the stroke of the sensor switch 7 according to the size of the wafer 9, so as to avoid excessive movement and damage to the wafer.

[0038] On the other hand, corresponding to the above example, such as Figure 6 As shown, the present invention also provides a robot, which includes: a main body 8, a robotic arm 81, a robotic hand 82, and a negative pressure vacuum pump 83, wherein the robotic arm 81 is connected to the main body and is controlled, and the robotic hand 82 is made of any of the dust removal wafer transfer robotic hands 82 described above. It is set at the wrist end of the robotic arm 81 and is connected to the negative pressure vacuum pump 83 via an air pipe 42 to provide negative pressure suction for the dust removal component 4, ensuring that a negative pressure barrier is formed around the push rod 3 to seal the shaft hole 16 and prevent particulate pollutants from overflowing from inside and outside the equipment cavity 15.

[0039] In summary, the dust-removing wafer transfer robot 82 and its robot provided by this invention ingeniously design a dust removal component 4, which is suitable for arrangement in confined spaces, such as at the telescopic entrance and exit of the push rod 3, forming a negative pressure barrier to seal the equipment cavity 15 of the robot 82. This not only does not affect the telescopic movement of the push rod 3 and maintain the wafer clamping function of the robot 82, but also prevents contaminant particles in the equipment cavity 15 from overflowing with the airflow and contaminating the wafer. This ensures that the wafer maintains sufficient cleanliness during the transfer process of the robot 82, so as to meet the long-term stable cleanliness requirements of the current advanced process technology in the semiconductor industry.

[0040] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

[0041] Furthermore, various different implementations of the present invention can be combined arbitrarily, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed in the present invention.

Claims

1. A dust-removing wafer transfer robot, comprising: The device comprises a finger base, a telescopic mechanism, a push rod, and a dust removal assembly. The finger base has a device cavity with a shaft hole on one side. The dust removal assembly includes a suction component and an air pipe. The suction component includes an adsorption block and a sealing gasket. The adsorption block has an air passage groove, and a suction port is located on the adsorption block and communicates with the air passage groove. The air passage groove has a purification port. The sealing gasket is connected to the adsorption block and covers the air passage groove to define a suction cavity within the adsorption block. The sealing gasket has a telescopic opening that communicates with the purification port to form a purification hole penetrating the suction cavity. The suction component is located at the shaft hole, and the purification hole communicates with the shaft hole. The telescopic mechanism is located inside the device cavity. The push rod passes through the shaft hole and the purification hole and is connected to the drive end of the telescopic mechanism. The air pipe communicates with the suction port and is connected to a negative pressure source. A negative pressure barrier is formed around the push rod through the purification hole to seal the shaft hole.

2. The dust-removing wafer transfer robot according to claim 1, wherein the finger base comprises: The device includes a finger component, a cover plate, and a palm component, wherein the finger component is located at the front end of the palm component, the palm component is surrounded by a sealing wall, the cover plate is connected to the palm component and covers the sealing wall to define a device cavity within the inner perimeter of the sealing wall, and the shaft hole is formed on the front side of the sealing wall and communicates with the device cavity.

3. The dust-removing wafer transfer robot according to claim 2, wherein the top of the sealing wall is provided with a sealing groove, the sealing groove is embedded with a sealing strip, and the cover plate covers the sealing wall and presses the sealing strip tightly.

4. The dust-removing wafer transfer robot according to claim 1, wherein the telescoping mechanism is a cleanroom-type slide cylinder, and the dust removal assembly further includes: The air pipe is branched off via the T-shaped pipe connector and connected to the cleanroom slide cylinder and the dust suction port, respectively.

5. The dust-removing wafer transfer robot according to claim 1, further comprising: The device includes a trigger and a sensor switch, wherein the trigger is connected to the drive end of the telescopic device, the sensor switch is disposed inside the equipment cavity and is connected to the control of the telescopic device, and the sensing end of the sensor switch is disposed on the displacement path of the trigger.

6. The dust-removing wafer transfer robot according to claim 1, wherein the front end of the push rod is provided with a Y-shaped rod head.

7. A robot comprising: The system comprises a main body, a robotic arm, a negative pressure vacuum pump, and a dust-removing wafer transfer robot as described in any one of claims 1 to 6, wherein the robotic arm is connected to the main body and is controlled, and the dust-removing wafer transfer robot is disposed at the wrist end of the robotic arm and connected to the negative pressure vacuum pump via an air pipe.

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