Thermal management device
By designing a first flow channel plate with a spacer in the thermal management device, the leakage problem at the weld between the shell and the flow channel plate was solved, the pressure resistance was improved, and the stability of the structure was enhanced.
Patent Information
- Application Number
- CN202410638439.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-11-25
AI Technical Summary
In existing thermal management devices, leaks are prone to occur at the weld between the housing and the flow channel plate, resulting in low pressure resistance of the filter.
By designing the first flow channel plate to have a spacer portion located between the first receiving cavity and the second flow channel plate, the pressure resistance of the first receiving cavity is improved.
The pressure resistance of the thermal management device has been enhanced, the risk of leakage at the weld joints has been reduced, and the overall structural stability has been improved.
Smart Images
Figure CN121007402A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of thermal management technology, and more particularly to a thermal management device. Background Technology
[0002] A thermal management device is a device for managing heat, such as a multi-split air conditioner for regulating indoor temperature. In related technologies, a thermal management device includes a filter and a flow channel section. The flow channel section includes a first flow channel plate and a second flow channel plate, which are connected. The filter includes a housing and a filter element. The housing has a receiving cavity, and the filter element is located in the receiving cavity. The filter is integrated into the flow channel section, and the receiving cavity of the filter has low pressure resistance. Summary of the Invention
[0003] The inventors discovered that the shell part is integral with the first flow channel plate, and the other part of the shell is integral with the second flow channel plate. The first flow channel plate has a partial receiving cavity, and the second flow channel plate has another partial receiving cavity. The filter element is located in the receiving cavity. The first flow channel plate and the second flow channel plate are welded together, and the shell part is welded together with the other part of the shell. The filter may leak at the weld seam, resulting in low pressure resistance of the filter.
[0004] The purpose of this application is to provide a thermal management device, including a flow channel portion, the flow channel portion including a first flow channel plate and a second flow channel plate, the first flow channel plate being connected to the second flow channel plate, the flow channel portion having a flow channel, the first flow channel plate having a first receiving cavity, the flow channel being in communication with the first receiving cavity, the thermal management device including a first filter element, the first filter element being located in the first receiving cavity; the first flow channel plate having a spacer portion, the spacer portion being located between the first receiving cavity and the second flow channel plate, the spacer portion being integral with the first flow channel plate.
[0005] In this application, the first flow channel plate has a first receiving cavity and a spacer portion, which is located between the first receiving cavity and the second flow channel plate, thereby placing the first receiving cavity in the first flow channel plate and improving the pressure resistance of the first receiving cavity. Attached Figure Description
[0006] Figure 1 This is a schematic diagram of the thermal management device of this application.
[0007] Figure 2 yes Figure 1 A schematic diagram of the central flow channel.
[0008] Figure 3 yes Figure 2 A schematic diagram of the explosion structure.
[0009] Figure 4 yes Figure 1A schematic diagram of the structure of the central flow channel, the first multi-way valve, and the second multi-way valve.
[0010] Figure 5 yes Figure 4 Exploded view of the central flow channel and the first multi-way valve.
[0011] Figure 6 yes Figure 4 A schematic diagram of the structure of the middle flow channel, the first multi-way valve, and the other side of the second multi-way valve.
[0012] Figure 7 yes Figure 6 Exploded view of the structure of the second multi-way valve and the flow channel.
[0013] Figure 8 yes Figure 5 A schematic diagram of the exploded structure of the first pressure block and the flow channel.
[0014] Figure 9 yes Figure 1 A schematic diagram of the structure of the plate heat exchanger and the flow channel section.
[0015] Figure 10 yes Figure 9 A schematic diagram of the explosion structure.
[0016] Figure 11 yes Figure 9 Exploded structural diagram of the central flow divider and plate heat exchanger.
[0017] Figure 12 This is a schematic diagram of the structure on the other side of the plate heat exchanger.
[0018] Figure 13 yes Figure 1 A three-dimensional sectional view of the first flow channel plate.
[0019] Figure 14 yes Figure 1 A schematic diagram of the exploded structure of the first pressing block and the first flow channel plate.
[0020] Figure 15 yes Figure 13 A magnified structural diagram of point A in the middle circle.
[0021] Figure 16 yes Figure 13 A three-dimensional cross-sectional view of the first filter element.
[0022] Figure 17 yes Figure 1 A three-dimensional sectional view of the second flow channel plate.
[0023] Figure 18 yes Figure 12 A three-dimensional sectional view of a plate heat exchanger. Detailed Implementation
[0024] The exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can be combined with each other.
[0025] like Figures 1 to 17 The present invention illustrates a thermal management device comprising a first multi-way valve 2, the first multi-way valve 2 comprising a first valve body 21, a first connecting pipe 22 and a second connecting pipe 23, the first connecting pipe 22 and the second connecting pipe 23 being connected to the first valve body 21, the first connecting pipe 22 having a first conduit 221 and the second connecting pipe 23 having a second conduit 231.
[0026] Reference Figure 1 , Figure 2 as well as Figure 3 The thermal management device includes a flow channel section 1, which has a flow channel 11. A first connecting pipe 22 and a second connecting pipe 23 are both connected to the flow channel section 1, and a first pipe 221 and a second pipe 231 are both connected to the flow channel 11.
[0027] In some implementations, refer to Figure 4 as well as Figure 5 The first multi-way valve 2 includes a first sliding piston, a first valve body 21 having a first valve chamber, the first sliding piston being located in the first valve chamber and slidingly sealingly engaging with the wall forming the first valve chamber. The first sliding piston is used to control the communication state between the first pipe 221 and the second pipe 231. The first multi-way valve 2 includes a first driving part 24, which is used to drive the first sliding piston to slide within the first valve chamber. Specifically, the first driving part 24 may include a housing of the first driving part 24, four first capillary tubes 242, a first driving piston, and a first driving coil 243. The first driving piston is slidably connected inside the housing of the first driving part 24, and the first driving coil 243 is used to drive the first driving piston to slide. One end of each of the four first capillary tubes 242 is connected to the housing of the first driving part 24, the other end of two first capillary tubes 242 is connected to the first valve chamber, and the other two first capillary tubes 242 are respectively connected to the first connecting pipe 22 and the second connecting pipe 23.
[0028] In some implementations, refer to Figure 4 as well as Figure 5The thermal management device has a thickness direction Z, a first direction X, and a second direction Y. Both the first direction X and the second direction Y are perpendicular to the thickness direction Z. Along the thickness direction Z, a first valve body 21 is located on one side of the flow channel portion 1. Along the thickness direction Z, at least a portion of a first connecting pipe 22 and at least a portion of a second connecting pipe 23 are located between the flow channel portion 1 and the first valve body 21. Specifically, at least one of the first connecting pipe 22 and the second connecting pipe 23 has a bend 232.
[0029] In some implementations, refer to Figure 4 as well as Figure 5 The first multi-way valve 2 includes a first drive unit 24, which is connected to the first valve body 21. The first drive unit 24 is at least partially located between the first valve body 21 and the flow channel 1. By positioning the first drive unit 24 at least partially between the first valve body 21 and the flow channel 1, the gap between the first valve body 21 and the flow channel 1 is effectively utilized, reducing the overall thickness of the thermal management device.
[0030] In some implementations, refer to Figure 4 as well as Figure 5 The first valve body 21 has a first extending direction 211, and the first valve body 21 extends along the first extending direction 211. The flow channel portion 1 has a thickness direction Z, and the first extending direction 211 is inclined relative to the thickness direction Z. Specifically, the first valve chamber extends along the first extending direction 211, and the first sliding piston moves along the first extending direction 211. By setting the first extending direction 211 of the first valve body 21 inclined relative to the thickness direction Z, the overall thickness of the thermal management device is further reduced.
[0031] In some embodiments, the flow channel 1 has a through hole, and the first valve body 21 is at least partially located in the through hole. The first valve body 21 has a first extending direction 211, and the first valve body 21 extends along the first extending direction 211. The thermal management device has a thickness direction Z, and the first extending direction 211 is parallel to, inclined to, or perpendicular to the thickness direction Z. Along the thickness direction Z, the through hole penetrates the flow channel 1, or the through hole is recessed into the flow channel 1. Specifically, the first extending direction 211 is parallel to the thickness direction Z, and by placing a portion of the first valve body 21 in the through hole, the overall thickness of the thermal management device is further reduced.
[0032] In some implementations, refer to Figure 5 , Figure 6 as well as Figure 7The thermal management device includes a third connecting pipe 25, which is connected to the first valve body 21, and has a first connection port 251. Specifically, a first sliding piston is used to control the communication between the first connecting pipe 22, the second connecting pipe 23, and the third connecting pipe 25. Further, the first multi-way valve 2 can be a three-way valve or a two-way valve.
[0033] In some implementations, refer to Figure 4 as well as Figure 5 The first connection port 251 is connected to the outside of the thermal management device; or, the thermal management device includes a first valve, which is connected to the third connecting pipe 25, and the first valve is at least partially located in the first connection port 251. Specifically, the first valve is a shut-off valve 474. By connecting the third connecting pipe 25 and the first valve to the first valve body 21, installation is facilitated, and the first valve and the first multi-way valve 2 can be installed as a modular component. Specifically, the first connection port 251 is connected to the outside of the thermal management device.
[0034] In some implementations, refer to Figure 4 as well as Figure 5 The first connecting pipe 22 and the second connecting pipe 23 are located on different sides of the first valve body 21.
[0035] In some implementations, refer to Figure 4 as well as Figure 5 The thermal management device includes a fourth connecting pipe 26, which is connected to the first valve body 21, and has a second connection port. Specifically, the first multi-way valve 2 can be a four-way valve. Specifically, the first sliding piston is used to control the communication between the first connecting pipe 22, the second connecting pipe 23, the third connecting pipe 25, and the fourth connecting pipe 26.
[0036] In some implementations, refer to Figure 4 as well as Figure 5 The second connection port is connected to the outside of the thermal management device; or, the thermal management device includes a second valve 262, which is connected to the fourth connecting pipe 26, and the second valve 262 is at least partially located at the second connection port. Specifically, the second valve 262 is connected to the fourth connecting pipe 26, and the second valve 262 is at least partially located at the second connection port. Further, along the thickness direction Z, the first multi-way valve 2 and the second connection port are respectively located on both sides of the flow channel 1. Further, along the thickness direction Z, the first multi-way valve 2 and the second valve 262 are respectively located on both sides of the flow channel 1. The second valve 262 is an air pipe valve.
[0037] In some implementations, refer to Figure 4 as well as Figure 6The thermal management device includes a second multi-way valve 3, which includes a second valve body 31, a first pipe 32, and a second pipe 33. Both the first pipe 32 and the second pipe 33 are connected to the second valve body 31 and to the flow channel 1. The first pipe 32 has a third pipe 34 channel 321, and the second pipe 33 has a fourth pipe 331. Both the third pipe 34 channel 321 and the fourth pipe 331 communicate with the flow channel 11. Specifically, the second multi-way valve 3 includes a second sliding piston. The second valve body 31 has a second valve 262 chamber. The second sliding piston is located in the second valve 262 chamber and slides in a sealing fit with the wall forming the second valve 262 chamber. The second sliding piston is used to control the communication state between the second pipes 231 and 232. The second multi-way valve 3 includes a second driving part 35, which drives the second sliding piston to slide within the second valve 262 chamber.
[0038] Specifically, refer to Figure 6 as well as Figure 7 The second drive unit 35 may include a housing of the second drive unit 35, four second capillary tubes 352, a second drive piston, and a second drive coil 353. The second drive piston is slidably connected inside the housing of the second drive unit 35, and the second drive coil 353 is used to drive the second drive piston to slide. One end of each of the four second capillary tubes 352 is connected to the housing of the second drive unit 35, the other end of two second capillary tubes 352 is connected to the cavity of the second valve 262, and the other two second capillary tubes 352 are respectively connected to the first tube 32 and the second tube 33. Further, the second drive unit 35 may be a two-way valve, a three-way valve, or a four-way valve.
[0039] In some implementations, refer to Figure 6 as well as Figure 7 Along the thickness direction Z, the second valve body 31 is located between the second drive part 35 and the flow channel part 1. Specifically, the second valve body 31 has a second extension direction 311, the second valve body 31 extends along the second extension direction 311, the second extension direction 311 is inclined relative to the thickness direction Z, and the second extension direction 311 is inclined relative to the first direction X.
[0040] In some implementations, refer to Figure 6 as well as Figure 7 The flow channel 1 has a thickness direction Z, and along the thickness direction Z, the flow channel 1 is located between the first multi-way valve 2 and the second multi-way valve 3.
[0041] In some implementations, refer to Figure 6 as well as Figure 7 The thermal management device includes a third pipe 34, which is connected to the second valve body 31 and has an opening 341. Specifically, the third pipe 34 communicates with the cavity of the second valve 262.
[0042] In some implementations, refer to Figure 6 as well as Figure 7 The opening 341 is connected to the outside of the thermal management device; or, the thermal management device includes a third valve 342, which is connected to a third pipe 34, and the third valve 342 is at least partially located in the opening 341. Specifically, the third valve 342 is connected to the third pipe 34, and the third valve 342 is at least partially located in the opening 341. The third valve 342 is a high- or low-pressure gas pipe valve.
[0043] In some implementations, refer to Figure 6 as well as Figure 7 The third valve 342 and the second valve 262 are both located on the same side of the flow channel section 1. Specifically, the second valve 262, the third valve 342, and the second multi-way valve 3 are all located on the same side of the flow channel section 1.
[0044] In some implementations, refer to Figure 5 as well as Figure 8 The thermal management device includes a first pressing block 4 and a first sealing part 41. The first pressing block 4 has a first protrusion 42, and the flow channel 1 has a first groove 12. The first groove 12 communicates with the flow channel 11. The first protrusion 42 is at least partially located in the first groove 12. The first connecting pipe 22 is connected to the first pressing block 4. The flow channel 1 has a first wall 13, which is located in the first groove 12. The first sealing part 41 is at least partially located between the first protrusion 42 and the first wall 13. The thermal management device includes a first limiting part 43 and a first connecting part 44. The first limiting part 43 is connected to the first connecting part 44. The first pressing block 4 is located between the first limiting part 43 and the flow channel 1. The first connecting part 44 is connected to the flow channel 1.
[0045] In some embodiments, the first protrusion 42 has a first annular groove 421, and the first sealing part 41 is at least partially located in the first annular groove 421, thereby limiting the connection between the first sealing part 41 and the first protrusion 42.
[0046] In some implementations, refer to Figure 5 The thermal management device includes a second pressure block 46 and a second sealing part. The second pressure block 46 has a second protrusion 461, and the flow channel 1 has a second groove 121. The second groove 121 communicates with the flow channel 11. The second protrusion 461 is at least partially located in the second groove 121. The second connecting pipe 23 is connected to the second pressure block 46. The flow channel 1 has a second wall 122, which is located in the second groove 121. The second sealing part is at least partially located between the second protrusion 461 and the second wall 122. The thermal management device includes a second limiting part 463 and a second connecting part 464. The second limiting part 463 is connected to the second connecting part 464. The second pressure block 46 is located between the second limiting part 463 and the flow channel 1. The second connecting part 464 is connected to the flow channel 1.
[0047] In some embodiments, the second protrusion 461 has a second annular groove 462, and the second sealing portion is at least partially located in the second annular groove 462, thereby limiting the connection between the second sealing portion and the second protrusion 461 through the second annular groove 462.
[0048] In some implementations, refer to Figure 9 , Figure 10 , Figure 11 as well as Figure 12 The thermal management device includes a plate heat exchanger 5, which has a first heat exchange channel 51 and a second heat exchange channel 52. The plate heat exchanger 5 also has a first flow port 53, a first flow inlet 54, a second flow port 55, and a second flow inlet 56. The first flow port 53 and the first flow inlet 54 are both connected to the first heat exchange channel 51, and the second flow port 55 and the second flow inlet 56 are both connected to the second heat exchange channel 52. The thermal management device also includes a flow divider 6 and a flow throttling section 63. The flow divider 6 has a first connecting passage... The system includes a first connecting channel 61, a second connecting channel 62, and a connecting port 64. The first connecting channel 61 and the second connecting channel 62 are arranged in parallel and are both connected to the connecting port 64. The first connecting channel 61 is connected to the first flow port 53, and the second connecting channel 62 is connected to the second flow port 55. The throttling section 63 has a throttling channel 631, which is connected to the first connecting channel 61, the second connecting channel 62, the first heat exchange channel 51, or the second heat exchange channel 52.
[0049] Specifically, refer to Figure 11 as well as Figure 12 Along the thickness direction Z, the plate heat exchanger 5 is located on one side of the flow channel section 1. Furthermore, along the thickness direction Z, the plate heat exchanger 5 and the second multi-way valve 3 are located on the same side of the flow channel section 1. Along the second direction Y, the plate heat exchanger 5 is located on one side of the second multi-way valve 3.
[0050] In some implementations, refer to Figure 9 as well as Figure 10 The first flow port 53 and the second flow port 55 are both located on the same side of the plate heat exchanger 5, and the first flow port 54 and the second flow port 56 are both located on the same side of the plate heat exchanger 5. The first flow port 53 and the first flow port 54 are respectively located on different sides of the plate heat exchanger 5.
[0051] In some implementations, refer to Figure 9 as well as Figure 10 The thermal management device includes a flow channel section 1, which has a flow channel 11. A first flow port 54 and a second flow port 56 are both connected to the flow channel 11. The first flow port 54, the second flow port 56 and the flow channel section 1 are all located on the same side of the plate heat exchanger 5.
[0052] Specifically, refer to Figure 10 as well as Figure 11 Along the thickness direction Z, the first flow port 54 and the second flow port 56 are closer to the flow section than the first flow port 53 and the second flow port 55. Along the thickness direction Z, the plate heat exchanger 5 is located between the flow branch section 6 and the flow channel section 1. The flow branch section 6 is connected to the plate heat exchanger 5, and the plate heat exchanger 5 is connected to the flow channel section 1.
[0053] In some implementations, refer to Figure 10 as well as Figure 11 The throttling section 63 includes an expansion valve 632, which is connected to the flow divider 6. The expansion valve 632 has a throttling channel 631, and a portion of the expansion valve 632 is located in the first connecting channel 61, communicating with it. The thermal management device has a first direction X and a thickness direction Z, with the first direction X and thickness direction Z being perpendicular. Along the first direction X, a portion of the expansion valve 632 is located on one side of the flow divider 6. By placing a portion of the expansion valve 632 on one side of the flow divider 6, the overall thickness of the thermal management device is reduced.
[0054] Specifically, refer to Figure 10 as well as Figure 11 Along the first direction X, the connecting port 64 is located on one side of the diversion section 6, and the expansion valve 632 is located on the same side of the diversion section 6 as the connecting port 64.
[0055] In some implementations, refer to Figure 10 as well as Figure 11 The diversion section 6 includes a first mounting section 65 and a second mounting section 66, which are connected. The thermal management device has a first direction X and a thickness direction Z, with the first direction X and thickness direction Z being perpendicular. Along the first direction X, the first mounting section 65 is located on one side of the second mounting section 66. The first mounting section 65 has a portion of an opening 341, a first connecting channel 61, and a second connecting channel 62. The second mounting section 66 has the other portion of the second connecting channel 62. Specifically, the first mounting section 65 and the second mounting section 66 are integral components. The first mounting section 65 extends along the second direction Y, and the second mounting section 66 extends along the first direction X. Specifically, along the first direction X, the first mounting section 65 is located between the portion of the throttling section 63 and the second mounting section 66.
[0056] In some implementations, refer to Figure 10 as well as Figure 11 The thermal management device includes a pipe section 67, at least partially located at the communication port 64, and connected to the diversion section 6. Specifically, the pipe section 67 extends along a first direction X, and a portion of the pipe section 67 and a portion of the diversion section 63 are located on the same side of the first mounting section 65.
[0057] In some implementations, refer to Figure 10 as well as Figure 11 The second connecting channel 62 includes a first channel 621, a second channel 622, a throttling cavity 623, a third channel 624, and a fourth channel 625. The first channel 621 communicates with the first connecting channel 61, the second channel 622 communicates with the first channel 621, and the third channel 624 communicates with the second channel 622. The second channel 622 is located between the first channel 621 and the throttling cavity 623. The third channel 624 communicates with the throttling cavity 623, and the fourth channel 625 communicates with the third channel 624 and the second flow port 55. The first mounting part 65 has the first channel 621, the second channel 622, and the throttling cavity 623, and the second mounting part 66 has the third channel 624 and the fourth channel 625. Specifically, the first channel 621 and the second channel 622 both extend along the second direction Y. The third channel 624 extends along the first direction X. The first connecting channel 61 and the fourth channel 625 both extend along the thickness direction Z.
[0058] In some implementations, refer to Figure 10 as well as Figure 11 The throttling section 63 is at least partially located in the throttling cavity 623. The flow area of the first channel 621 is larger than that of the second channel 622, the flow area of the throttling cavity 623 is larger than that of the second channel 622, and the flow area of the throttling cavity 623 is larger than that of the third channel 624. By making the flow area of the first channel 621 larger than that of the second channel 622, the flow resistance before entering the throttling section 63 is reduced, allowing more fluid to enter the throttling section 63 quickly.
[0059] In some implementations, refer to Figure 10 as well as Figure 11 The flow divider 6 has a first machining hole 68 and a second machining hole 69. The first machining hole 68 communicates with a first channel 621, and the second machining hole 69 communicates with a third channel 624. The first channel 621 and the second channel 622 are both located between the first machining hole 68 and the throttling cavity 623, and the third channel 624 is located between the second machining hole 69 and the throttling cavity 623. The first machining hole 68 penetrates through the flow divider 6, and the second machining hole 69 penetrates through the flow divider 6. The thermal management device includes a first sealing part 691 and a second sealing part 692. The first sealing part 691 is at least partially located in the first machining hole 68, and the second sealing part 692 is at least partially located in the second machining hole 69. Specifically, both the first sealing part 691 and the second sealing part 692 are welded to the flow divider 6.
[0060] In some implementations, refer to Figure 10 as well as Figure 11The flow channel section 1 has a boss 14 with a connecting hole 141 communicating with the flow channel 11. The boss 14 protrudes from the surface of the flow channel section 1. The plate heat exchanger 5 is connected to the boss 14, and there is a gap between the plate heat exchanger 5 and the flow channel section 1. By mounting the plate heat exchanger 5 on the flow channel section 1 through the boss 14, heat exchange between the plate heat exchanger 5 and the flow channel section 1 is reduced, heat loss is reduced, and energy saving is achieved. Specifically, the boss 14 and the flow channel section 1 are integral parts. Four bosses 14 are provided, and all four bosses 14 are integral parts with the flow channel section 1.
[0061] In some implementations, refer to Figure 10 as well as Figure 11 The thermal management device includes an embedded portion 57 and an elastic portion 571. The embedded portion 57 is connected to the plate heat exchanger 5. The embedded portion 57 is at least partially located in the connecting hole 141, and the elastic portion 571 is at least partially located between the embedded portion 57 and the wall forming the connecting hole 141. Specifically, the embedded portion 57 has a third annular groove 572, and the elastic portion 571 is at least partially located in the third annular groove 572.
[0062] In some implementations, refer to Figure 10 as well as Figure 11 The thermal management device includes a limiting part 58 and a connecting part 59. The limiting part 58 is connected to the connecting part 59. The plate heat exchanger 5 is at least partially located between the limiting part 58 and the flow channel part 1. The connecting part 59 is connected to the flow channel part 1. Specifically, the connecting part 59 is partially located inside the flow channel part 1 and is threadedly connected to the flow channel part 1. There are four limiting parts 58 and four connecting parts 59, which connect the plate heat exchanger 5 to the flow channel part 1.
[0063] In some implementations, refer to Figure 10 as well as Figure 11 The boss 14 has a threaded hole 142, which is partially located inside the flow channel 1. The connecting part 59 is at least partially located in the threaded hole 142, and the connecting part is threaded into the wall forming the threaded hole 142. The plate heat exchanger 5 is at least partially located between the limiting part 58 and the boss 14.
[0064] In some implementations, refer to Figure 10 as well as Figure 11 The plate heat exchanger 5 is made of aluminum and includes several aluminum plates. Compared with stainless steel shell-and-tube heat exchangers in related technologies, the aluminum plate heat exchanger 5 has lower cost, higher heat exchange efficiency, and occupies less volume than the stainless steel shell-and-tube heat exchanger.
[0065] In some implementations, refer to Figure 13 as well as Figure 14The device includes a flow channel section 1, which includes a first flow channel plate 15 and a second flow channel plate 16 connected to each other. The flow channel section 1 has a flow channel 11, and the first flow channel plate 15 has a first receiving cavity 151 in communication with the flow channel 11. The thermal management device includes a first filter element 7 located in the first receiving cavity 151. The first flow channel plate 15 has a spacer portion 9 located between the first receiving cavity 151 and the second flow channel plate 16, and the spacer portion 9 and the first flow channel plate 15 are integrally formed. Specifically, the thermal management device has a thickness direction Z, and along the thickness direction Z, the spacer portion 9 is located between the first receiving cavity 151 and the second flow channel plate 16.
[0066] In some implementations, refer to Figure 13 as well as Figure 14 The first flow channel plate 15 has a first surface 152, which is exposed to the outside of the thermal management device. The first surface 152 has a first opening 153, which penetrates the flow channel portion 1 and communicates with the first receiving cavity 151. Specifically, the first surface 152 extends along the thickness direction Z, and the first receiving cavity 151 extends along the first direction X.
[0067] In some implementations, refer to Figure 13 as well as Figure 14 The thermal management device includes a first pressing block portion 45, which has a first protrusion 451. The first pressing block portion 45 is located outside the first receiving cavity 151, and the first protrusion 451 is at least partially located in the first receiving cavity 151. A first filter element 7 is located on one side of the first protrusion 451, and the first protrusion 451 contacts the first filter element 7. Specifically, along the first direction X, the first pressing block portion 45 is located on one side of the flow channel portion 1, and further, the first pressing block portion 45 is located on one side of the first flow channel plate 15.
[0068] In some implementations, refer to Figure 13 as well as Figure 15 The thermal management device includes a first protrusion 154, which is connected to a first flow channel plate 15 and is located within a first receiving cavity 151. Specifically, a portion of a first filter element 7 is located on one side of the first protrusion 154, and another portion of the first filter element 7 is located on the other side of the first protrusion 154, with the first filter element 7 in contact with the first protrusion 154. Further, the first protrusion 154 and the first flow channel plate 15 are integrally formed.
[0069] In some implementations, refer to Figure 13 as well as Figure 14The thermal management device includes a first pressing block portion 45, which has a first protrusion 451. The first protrusion 451 is at least partially located in a first receiving cavity 151 and contacts a first filter element 7. The first filter element 7 is at least partially located between the first protrusion 451 and a first protrusion 154. Specifically, along a first direction X, the first filter element 7 is at least partially located between the first protrusion 451 and the first protrusion 154. The first filter element 7 is positioned by the first protrusion 451 and the first protrusion 154.
[0070] In some implementations, refer to Figure 13 as well as Figure 16 The first filter element 7 has a first filter port 71 and a second filter port 72, with the flow area of the first filter port 71 being larger than that of the second filter port 72. Specifically, the first filter port 71 is closer to the first port 153 than the second filter port 72. Further, a first protrusion 154 is located between the first filter port 71 and the second filter port 72.
[0071] In some implementations, refer to Figure 13 as well as Figure 16 The first filter element 7 has a first end 73 and a second end 74. The first end 73 is closer to the first protrusion 451 than the second end 74, and the first end 73 contacts the first protrusion 451. Specifically, the first end 73 has a first filter port 71, and the second end 74 has a second filter port 72. Further, the first protrusion 154 is located between the first end 73 and the second end 74.
[0072] In some implementations, refer to Figure 13 The flow channel 11 includes a first flow path 111 and a second flow path 112. A first flow channel plate 15 has the first flow path 111, and a second flow channel plate 16 has the second flow path 112. The first flow path 111 and the second flow path 112 are connected. A first receiving cavity 151 is connected to the first flow path 111, and the first flow channel plate 15 and the second flow channel plate 16 are welded together. Specifically, the first flow path 111 and the second flow path 112 form the flow channel 11.
[0073] In some implementations, refer to Figure 13The thermal management device includes a throttling unit 17 connected to a first flow channel plate 15. The throttling unit 17 has a throttling flow path 171 communicating with a flow channel 11. The thermal management device has a first direction X and a thickness direction Z, with the first direction X and thickness direction Z being perpendicular. Along the first direction X, the throttling unit 17 is located on one side of the first flow channel plate 15. Specifically, the throttling unit 17 includes an expansion valve 632 with the throttling flow path 171. The expansion valve 632 is connected to the first flow channel plate 15, and a portion of the expansion valve 632 is located within the first flow channel 111. The throttling flow path 171 communicates with the first flow channel 111. Along the first direction X, another portion of the expansion valve 632 is located on one side of the first flow channel plate 15. By arranging the throttling unit 17 along the first direction X, the thickness of the thermal management device is further reduced, improving integration and miniaturization.
[0074] In some implementations, refer to Figure 13 as well as Figure 14 The thermal management device includes a first outer pipe 452, a first pressing block portion 45 having a first groove 453, a portion of the first outer pipe 452 located in the first groove 453, the first outer pipe 452 connected to the first pressing block portion 45, and the first outer pipe 452 communicating with the outside of the thermal management device; or the thermal management device includes a valve, and the first outer pipe 452 is connected to the valve. Specifically, the first outer pipe 452 communicates with the outside of the thermal management device, and the first outer pipe 452 is used to connect to an external heat exchanger or an indoor air conditioning unit.
[0075] In some implementations, refer to Figure 13 as well as Figure 17 The thermal management device includes a second filter element 75, a second flow channel plate 16 having a second receiving cavity 161, the second filter element 75 being at least partially located in the second receiving cavity 161, the thermal management device having a second direction Y and a thickness direction Z, the second direction Y being perpendicular to the thickness direction Z, along the second direction Y, a first receiving cavity 151 being located on one side of the second receiving cavity 161, and along the second direction Y, a first flow channel plate 15 being partially located on one side of the second flow channel plate 16.
[0076] In some implementations, refer to Figure 13 as well as Figure 14 The first flow channel plate 15 has a second surface 162, which is exposed to the outside of the thermal management device. The second surface 162 has a second opening 163, which penetrates the flow channel portion 1 and communicates with the second receiving cavity 161. Specifically, the second surface 162 extends along the thickness direction Z, and the second receiving cavity 161 extends along the first direction X.
[0077] In some implementations, refer to Figure 13 as well as Figure 17The thermal management device includes a second protrusion 164, which is connected to the second flow channel plate 16 and is located within the second receiving cavity 161. Specifically, a portion of the second filter element 75 is located on one side of the second protrusion 164, and another portion of the second filter element 75 is located on the other side of the second protrusion 164, with the second filter element 75 in contact with the second protrusion 164. Further, the second protrusion 164 and the second flow channel plate 16 are integrally formed.
[0078] In some implementations, refer to Figure 13 as well as Figure 17 The thermal management device includes a second pressing block portion 47, which has a second protrusion 471. The second protrusion 471 is at least partially located in the second receiving cavity 161 and contacts a second filter element 75. The second filter element 75 is at least partially located between the second protrusion 471 and the second protrusion 164. Specifically, along the first direction X, the second filter element 75 is at least partially located between the second protrusion 471 and the second protrusion 164. The second filter element 75 is positioned by the second protrusion 471 and the second protrusion 164.
[0079] In some implementations, refer to Figure 13 as well as Figure 17 The second filter element 75 has a third filter port 752 and a fourth filter port 753, with the flow area of the third filter port 752 being larger than that of the fourth filter port 753. Specifically, the third filter port 752 is closer to the second port 163 than the fourth filter port 753. Further, a second protrusion 164 is located between the third filter port 752 and the fourth filter port 753.
[0080] In some implementations, refer to Figure 13 as well as Figure 17 The second filter element 75 has a third end 754 and a fourth end 755. The third end 754 is closer to the second protrusion 471 than the fourth end 755, and the third end 754 contacts the second protrusion 471. Specifically, the third end 754 has a third filter port 752, and the fourth end 755 has a fourth filter port 753. Further, the second protrusion 164 is located between the third end 754 and the fourth end 755.
[0081] In some implementations, refer to Figure 13 as well as Figure 17The thermal management device includes a second outer tube 473, a second pressure block portion 47 having a second groove 472, a portion of the second outer tube 473 located in the second groove 472, the second outer tube 473 connected to the second pressure block portion 47, and the second outer tube 473 communicating with the outside of the thermal management device; or the thermal management device includes a shut-off valve 474, the second outer tube 473 connected to the shut-off valve 474. The shut-off valve 474 is a liquid line valve.
[0082] In some implementations, refer to Figure 13 as well as Figure 17 The thermal management device includes a detection element 751, which is connected to the second flow channel plate 16 and located on one side of the first flow channel plate 15 along the thickness direction Z. This further reduces the overall thickness of the thermal management device. Specifically, the detection element 751 can be a pressure sensor, a temperature sensor, or a temperature-pressure sensor.
[0083] In some embodiments, the flow channel 1 has a first compressor connection port 8 and a second compressor connection port 81, and the thermal management device includes a gas-liquid separator 82, which is connected to the flow channel 1 and communicates with the flow channel 11.
[0084] In some embodiments, the thermal management device includes a silencer 83, which communicates with and is connected to the flow channel 11. Specifically, the thermal management device includes a one-way valve 84 and a high-pressure switching valve 85, with the one-way valve 84 connected to the silencer 83 and the high-pressure switching valve 85 connected to the one-way valve 84. Further, the one-way valve 84 has a second compressor connection port 81.
[0085] This application also discloses a thermal management system, including a first compressor flow path and a second compressor flow path. The first compressor flow path is connected to the outlet of the compressor, and the second compressor flow path is connected to the inlet of the compressor. A high-pressure switching valve 85, a one-way valve 84, a silencer 83, a temperature sensor, and a high-pressure sensor are connected to the first compressor flow path.
[0086] In some embodiments, the thermal management system includes a first branch and a second branch, both of which are connected to the flow path of the first compressor. The first branch is connected to the first inlet of the first multi-way valve 2, and the second branch is connected to the second inlet of the second multi-way valve 3.
[0087] In some embodiments, the thermal management system includes a liquid pipe flow path connected to the first connection port 251 of the first multi-way valve 2 and to the indoor unit of the air conditioner. The thermal management system includes an outdoor heat exchanger, a first filter element 7, an electronic expansion valve 632, an electrically controlled liquid cooling plate, a plate heat exchanger 5, a second filter element 75, a temperature sensor, and a shut-off valve 474. The outdoor heat exchanger, the first filter element 7, the electronic expansion valve 632, the electrically controlled liquid cooling plate, the subcooling heat exchanger, the second filter element 75, the temperature sensor, and the shut-off valve 474 are all connected to the liquid pipe flow path. The subcooling heat exchanger is connected to the second compressor flow path. Specifically, the subcooling heat exchanger consists of the plate heat exchanger 5, the flow divider 6, and the throttling section 63 described above.
[0088] In some embodiments, the thermal management system includes a first connecting flow path, which is connected to a second connecting port of a first multi-way valve 2 and to a second compressor flow path. Specifically, the thermal management system includes a gas pipe flow path, which is connected to a third connecting port of the first multi-way valve 2, and to an indoor unit of the air conditioner. A second valve 262 is connected to the gas pipe flow path. Specifically, the second valve 262 is a gas pipe valve. Further, the first multi-way valve 2 is a four-way valve.
[0089] In some embodiments, the thermal management system includes high and low pressure gas pipes connected to the indoor unit of the air conditioner, and connected to the fourth connection port of the second multi-way valve 3. A third valve 342 is also connected to the high and low pressure gas pipes. Specifically, the third valve 342 is a high and low pressure gas pipe valve.
[0090] In some embodiments, the thermal management system includes a second connection flow path, which is connected to the fifth connection port of the second multi-way valve 3 and to the second compressor flow path.
[0091] In some embodiments, the thermal management system includes a low-pressure sensor, a gas-liquid separator 82, and a temperature sensor, all of which are connected to the flow path of the second compressor.
[0092] The above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. The understanding of this application should be based on those skilled in the art. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.
Claims
1. A thermal management device, characterized in that, The device includes a flow channel section (1), which includes a first flow channel plate (15) and a second flow channel plate (16). The first flow channel plate (15) is connected to the second flow channel plate (16). The flow channel section (1) has a flow channel (11). The first flow channel plate (15) has a first receiving cavity (151). The flow channel (11) communicates with the first receiving cavity (151). The thermal management device includes a first filter element (7), which is located in the first receiving cavity (151). The first flow channel plate (15) has a spacer (9), which is located between the first receiving cavity (151) and the second flow channel plate (16). The spacer (9) and the first flow channel plate (15) are integral parts.
2. The thermal management device as described in claim 1, characterized in that: The first flow channel plate (15) has a first surface (152) exposed to the outside of the thermal management device. The first surface (152) has a first opening (153) penetrating the flow channel portion (1) and communicating with the first receiving cavity (151).
3. The thermal management device as described in claim 1, characterized in that: The thermal management device includes a first pressing block (45) having a first protrusion (451) located outside the first receiving cavity (151), the first protrusion (451) being at least partially located in the first receiving cavity (151), the first filter element (7) being located on one side of the first protrusion (451), and the first protrusion (451) contacting the first filter element (7).
4. The thermal management device as described in claim 1, characterized in that: The thermal management device includes a first protrusion (154), which is connected to the first flow channel plate (15) and is located in the first receiving cavity (151). The thermal management device includes a first pressing block (45) having a first protrusion (451) at least partially located in the first receiving cavity (151), the first protrusion (451) contacting the first filter element (7), the first filter element (7) at least partially located between the first protrusion (451) and the first protrusion (154).
5. The thermal management device as described in claim 1, characterized in that: The first filter element (7) has a first filter port (71) and a second filter port (72), and the flow area of the first filter port (71) is larger than the flow area of the second filter port (72).
6. The thermal management device as described in claim 4, characterized in that: The first filter element (7) has a first end (73) and a second end (74), the first end (73) being closer to the first protrusion (451) than the second end (74), and the first end (73) contacting the first protrusion (451); The first protrusion (154) is located between the first end (73) and the second end (74).
7. The thermal management device as claimed in claim 1, characterized in that: The flow channel (11) includes a first flow path (111) and a second flow path (112). The first flow channel plate (15) has the first flow path (111), and the second flow channel plate (16) has the second flow path (112). The first flow path (111) and the second flow path (112) are connected. The first receiving cavity (151) is connected to the first flow path (111), and the first flow channel plate (15) and the second flow channel plate (16) are connected.
8. The thermal management device as described in claim 3, characterized in that: The thermal management device includes a throttling unit (17) connected to the first flow channel plate (15). The throttling unit (17) has a throttling flow path (171) connected to the flow channel (11). The thermal management device has a first direction (X) and a thickness direction (Z). The first direction (X) is perpendicular to the thickness direction (Z). Along the first direction (X), the throttling unit (17) is located on one side of the first flow channel plate (15).
9. The thermal management device as claimed in claim 3, characterized in that: The thermal management device includes a first outer tube (452), the first pressing block (45) has a first groove (453), the first outer tube (452) is partially located in the first groove (453), the first outer tube (452) is connected to the first pressing block (45), and the first outer tube (452) is in communication with the outside of the thermal management device. Alternatively, the thermal management device may include a valve, with the first outer tube (452) connected to the valve.
10. The thermal management device as claimed in claim 1, characterized in that: The thermal management device includes a second filter element (75), a second flow channel plate (16) having a second receiving cavity (161), the second filter element (75) being at least partially located in the second receiving cavity (161), the thermal management device having a second direction (Y) and a thickness direction (Z), the second direction (Y) being perpendicular to the thickness direction (Z), along the second direction (Y), the first receiving cavity (151) being located on one side of the second receiving cavity (161), and along the second direction (Y), the first flow channel plate (15) being partially located on one side of the second flow channel plate (16); The thermal management device includes a detection element (751) connected to the second flow channel plate (16) along the thickness direction (Z), and the detection element (751) is located on one side of the first flow channel plate (15). The thermal management device has a thickness direction (Z), and along the thickness direction (Z), the spacer (9) is located between the first receiving cavity (151) and the second flow channel plate (16).