Refrigeration type handheld observation device and dynamic temperature control method thereof

Abstract

The invention belongs to the technical field of photoelectric detection, and discloses a refrigeration type handheld observation device and a dynamic temperature control method thereof. An infrared thermal imager is installed at the cold end of a semiconductor chilling plate and is connected with a heat dissipation structure through a composite phase change structure and a heat pipe array; acquiring environment parameters and equipment thermal state parameters by using an environment and equipment parameter acquisition unit; and the dynamic temperature control unit is used for matching the refrigeration power in real time according to the environment parameters and the equipment thermal state parameters, and the working current of the semiconductor refrigeration sheet is adjusted according to the target refrigeration power obtained through matching. The cooling efficiency of the refrigeration type handheld observation device is actively adjusted, the temperature control precision is improved, and heat management of the refrigeration type handheld observation device is optimized.

Description

Technical Field

[0001] This invention belongs to the field of photoelectric detection technology, and more specifically, relates to a cooling handheld observation device and its dynamic temperature control method. Background Technology

[0002] In recent years, with the rapid development of technologies such as infrared imaging and laser ranging, cooled handheld observation devices have become one of the core equipment in the monitoring field. These devices typically integrate cooled infrared sensors, laser ranging, and positioning components, using high-precision sensors to achieve target identification and positioning at night or in harsh environments.

[0003] However, existing cooled handheld observation devices suffer from inadequate thermal management. Traditional semiconductor cooling relies on air cooling or heat pipes for heat dissipation. In high-temperature environments (e.g., above 40°C), the temperature difference between the heat sink and the environment decreases, reducing heat exchange efficiency by more than 60%. In low-temperature environments (e.g., below -10°C), frost formation on the heat sink further hinders heat transfer. This decreased heat dissipation efficiency leads to insufficient cooling power, and large temperature fluctuations in the core sensor (typically an infrared thermal imager, including the infrared detector) can cause pixel responsivity drift, thus affecting device performance. The low efficiency of semiconductor cooling also significantly increases power consumption and reduces battery life when heat dissipation is insufficient. Therefore, a dynamic temperature control technology is urgently needed to actively adjust the heat dissipation efficiency of cooled handheld observation devices in extreme environments by optimizing heat flow paths and heat dissipation strategies, thereby improving temperature control accuracy in extreme environments and enhancing the temperature stability of the core sensor.

[0004] In addition, existing cooled handheld observation devices suffer from poor operational stability and limited functionality. For example, the observation error caused by hand shake is generally >±0.1mm; existing devices mostly use single-spectrum detection (usually long-wave infrared), which cannot meet the requirements for simultaneous detection of multiple parameters. Summary of the Invention

[0005] This invention provides a cooling-type handheld observation device and its dynamic temperature control method, thereby solving the problem of insufficient thermal management in existing cooling-type handheld observation devices.

[0006] The present invention provides a cooling handheld observation device, comprising: an infrared thermal imager, a semiconductor cooling chip, a composite phase change structure, a heat pipe array, a heat dissipation structure, an environmental and equipment parameter acquisition unit, and a dynamic temperature control unit; The infrared thermal imager is mounted on the cold end of the semiconductor cooling chip and is connected to the heat dissipation structure through the composite phase change structure and the heat pipe array. The composite phase change structure adopts a layered composite structure composed of a paraffin-based composite phase change material and an aluminum nitride ceramic substrate; the paraffin-based composite phase change material is used to absorb the heat of the semiconductor cooling chip; the aluminum nitride ceramic substrate serves as a thermally conductive framework for directional heat conduction to the heat pipe array. The heat pipe array includes multiple sets of heat pipes arranged in a Fibonacci spiral. The environmental and equipment parameter acquisition unit is used to acquire environmental parameters and equipment thermal state parameters; The dynamic temperature control unit is used to match the cooling power in real time according to the environmental parameters and the thermal state parameters of the equipment, and to adjust the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching.

[0007] Preferably, the heat dissipation structure includes an adjustable fin group and a fan; the fin group includes multiple layers of fins, the fins are made of aluminum with a thickness of 0.08 mm to 0.15 mm, and the surface of the fins is coated with a graphene coating; the adjustable spacing of the fin group is in the range of 1 mm to 5 mm; the fan is used for forced air cooling.

[0008] Preferably, the dynamic temperature control unit calculates the target cooling power using the following formula:

[0009] In the formula, For the target cooling capacity, This is a material correction factor. For ambient temperature, This refers to the safe temperature threshold for semiconductor cooling chips. For the heat load of the cooling handheld observation device, This represents the maximum heat dissipation of the cooled handheld observation device.

[0010] Preferably, the operating modes of the dynamic temperature control unit include energy-saving mode, standard mode, and high-speed mode; when When the temperature is between [10℃ and 30℃], the energy-saving mode is executed, controlling the operation of some heat pipes in the heat pipe array; when - When the temperature is ≥15℃, the high-speed mode is executed, controlling the heat pipe array to run at full power and turning on the fan for forced air cooling; under other conditions, the standard mode is executed, controlling the heat pipe array to run at full power.

[0011] Preferably, a thermally conductive gap adjustment layer is further provided between the semiconductor cooling chip and the heat pipe array, and the thermally conductive gap adjustment layer is composed of indium foil and nano-ceramic powder.

[0012] Preferably, the environmental and equipment parameter acquisition unit includes an environmental sensing subunit and an equipment acquisition subunit; both the environmental sensing subunit and the equipment acquisition subunit are connected to the dynamic temperature control unit; the environmental sensing subunit includes a temperature and humidity sensor, and one or more of an ultrasonic wind speed sensor, a barometer, and a condensation early warning module; the equipment acquisition subunit includes a thermocouple array embedded inside the heat pipe array, a thin-film heat flux sensor mounted on the aluminum nitride ceramic substrate, and a heat flux sensor mounted on the surface of the infrared thermal imager.

[0013] Preferably, the cooled handheld observation device further includes: an observation compensation unit; the observation compensation unit includes a gyroscope, an accelerometer, a positioning module, a laser ranging module, and an image stabilization module; the image stabilization module includes a neural network model for predicting device jitter; the neural network model takes information obtained by the gyroscope, the accelerometer, the positioning module, and the laser ranging module as input, and takes reverse jitter compensation information as output.

[0014] Preferably, the cooled handheld observation device further includes at least one auxiliary detection channel selected from the visible light detection channel, the mid-wave infrared detection channel, and the ultraviolet detection channel, as well as a multispectral fusion module; the long-wave infrared detection channel included in the infrared thermal imager, the auxiliary detection channel, and the multispectral fusion module constitute a multispectral fusion detection unit.

[0015] Preferably, the cooled handheld observation device further includes: a power management unit, a display unit, and a storage unit; the power management unit includes a lithium battery and a dynamic voltage regulation module, the dynamic voltage regulation module is used to switch the power supply voltage according to the working mode of the dynamic temperature control unit; the display unit and the storage unit are respectively used to display and store the parameter information corresponding to the cooled handheld observation device in real time.

[0016] On the other hand, the present invention provides a dynamic temperature control method for the cooled handheld observation device as described above, comprising the following steps: The infrared thermal imager is mounted on the cold end of the semiconductor cooling chip and connected to the heat dissipation structure through a composite phase change structure and a heat pipe array. Environmental parameters and equipment thermal status parameters are acquired using the environmental and equipment parameter acquisition unit; The dynamic temperature control unit matches the cooling power in real time based on the environmental parameters and the thermal state parameters of the equipment, and adjusts the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching.

[0017] One or more technical solutions provided in this invention have at least the following technical effects or advantages: (1) The cooling-type handheld observation device provided by the present invention installs an infrared thermal imager on the cold end of a semiconductor cooling chip and connects it to a heat dissipation structure through a composite phase change structure, a heat pipe array, and a heat dissipation structure. It uses an environmental and equipment parameter acquisition unit to acquire environmental parameters and equipment thermal state parameters, and uses a dynamic temperature control unit to match the cooling power in real time according to the environmental parameters and equipment thermal state parameters, and adjusts the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching. Among them, the composite phase change structure adopts a layered composite structure composed of a paraffin-based composite phase change material and an aluminum nitride ceramic substrate; the paraffin-based composite phase change material is used to absorb the heat of the semiconductor cooling chip; the aluminum nitride ceramic substrate serves as a thermally conductive skeleton to conduct heat to the heat pipe array in a directional manner. Compared with the traditional scheme in which the filler is directly dispersed in paraffin, sacrificing latent heat for thermal conductivity, the composite phase change structure provided by the present invention, through a substrate-functional layer separation structure, retains both the high latent heat of paraffin and the high thermal conductivity of ceramic. The composite phase change structure can absorb the instantaneous heat load at the beginning of device startup, reducing the peak power consumption of the semiconductor cooling chip. The heat pipe array comprises multiple sets of heat pipes arranged in a Fibonacci spiral pattern. This arrangement offers significant advantages in space efficiency and thermodynamic performance in heat pipe array design. The golden ratio (φ≈1.618) enables gapless coverage and uniform heat flux density distribution. The spiral structure naturally forms a hierarchical heat conduction network, deeply synergizing with the composite phase change structure and semiconductor cooling chip, overcoming the trade-off between high power consumption, small size, and strong heat dissipation in handheld devices. Furthermore, the spiral arrangement can be achieved through 3D printing of conformal molds, resulting in significant cost-effectiveness. Through the synergistic effect of the composite phase change structure and heat pipe array, this invention enables the device to maintain a temperature control accuracy of ±0.2℃ even in extremely cold environments down to -25℃. In summary, this invention provides a dynamic temperature control technology that, by optimizing heat flow paths and heat dissipation strategies, actively adjusts the heat dissipation efficiency of the cooled handheld observation device, improves temperature control accuracy in extreme environments, enhances the temperature stability of the core sensor, and optimizes the thermal management of the cooled handheld observation device.

[0018] (2) The present invention utilizes the observation compensation unit to obtain reverse jitter compensation information based on the acquired parameter information, and can achieve real-time pose compensation within a 2ms delay, thereby improving operational stability.

[0019] (3) The present invention combines the long-wave infrared detection channel included in the infrared thermal imager, as well as the auxiliary detection channel (at least one of the visible light detection channel, mid-wave infrared detection channel, and ultraviolet detection channel) and the multispectral fusion module to form a multispectral fusion detection unit, which can support the synchronous acquisition of multiple spectra. Compared with the single spectrum detection of traditional equipment, it can meet the needs of multi-parameter detection.

[0020] (4) The present invention utilizes the dynamic voltage adjustment module in the power management unit to switch the power supply voltage according to the working mode of the dynamic temperature control unit, which can improve the equipment's battery life. Attached Figure Description

[0021] Figure 1 This is a schematic diagram illustrating the process of achieving dynamic temperature control in a cooling handheld observation device according to Embodiment 1 of the present invention. Figure 2 This is a cross-sectional view of the composite phase change structure, heat pipe array, semiconductor cooling chip, and thermally conductive gap adjustment layer in a cooling-type handheld observation device provided in Embodiment 1 of the present invention. Figure 3 This is a front view of the fin assembly in a refrigerated handheld observation device provided in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the heat dissipation structure in a cooling handheld observation device provided in Embodiment 1 of the present invention. Detailed Implementation

[0022] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0023] Example 1: Example 1 provides a cooled handheld observation device, see [link / reference] Figures 1 to 4 The system mainly includes: an infrared thermal imager, a semiconductor cooling chip 3, a composite phase change structure 1, a heat pipe array 2, a heat dissipation structure, an environmental and equipment parameter acquisition unit, and a dynamic temperature control unit. The infrared thermal imager is installed at the cold end of the semiconductor cooling chip 3 and is connected to the heat dissipation structure through the composite phase change structure 1 and the heat pipe array 2. The composite phase change structure 1 adopts a layered composite structure composed of a paraffin-based composite phase change material and an aluminum nitride ceramic substrate. The paraffin-based composite phase change material is used to absorb the heat of the semiconductor cooling chip 3. The aluminum nitride ceramic substrate serves as a thermally conductive framework for directional heat conduction to the heat pipe array 2. The heat pipe array 2 includes multiple sets of heat pipes arranged in a Fibonacci spiral. The environmental and equipment parameter acquisition unit is used to acquire environmental parameters and equipment thermal state parameters. The dynamic temperature control unit is used to match the cooling power in real time according to the environmental parameters and the equipment thermal state parameters, and adjust the operating current of the semiconductor cooling chip 3 according to the target cooling power obtained by matching.

[0024] The paraffin-based composite phase change material can absorb instantaneous heat load (latent heat of phase change ≥180J / g) during the initial startup of the device, thereby reducing the peak power consumption of the semiconductor refrigeration chip 3. The phase change temperature of the paraffin-based composite phase change material is 28±2℃, which is closer to the human comfort range. For example, the paraffin-based composite phase change material contains, by mass percentage: 60-75% octadecanoic acid, 15-25% expanded graphite, 5-10% nano-silica, and 2-5% boron carbide powder.

[0025] The heat pipe array 2 utilizes a three-dimensional conformal topology to achieve directional heat conduction, thereby improving the uniformity of heat flux density distribution to 92%. For example, the heat pipe array 2 can employ 6-12 groups of micro heat pipes arranged in a Fibonacci spiral, with a single heat pipe having a thermal conductivity ≥5000W / (m·K).

[0026] The heat dissipation structure includes an adjustable fin group and a fan 6; the fin group includes multiple layers of fins 5, which are made of aluminum with a thickness of 0.08 mm to 0.15 mm, and the surface of the fins 5 is coated with a graphene coating; the adjustable spacing of the fin group is 1 mm to 5 mm; the fan 6 is used for forced air cooling and mainly provides auxiliary heat dissipation.

[0027] This invention uses ultra-thin aluminum to prepare the fins 5. Compared to copper and carbon fiber, aluminum achieves a balance in four dimensions: thermal conductivity, lightweight, cost, and processability, especially meeting the extreme requirements of handheld devices for ultra-thin forming of the fins 5. A thickness of less than 0.08 mm in the fins 5 leads to a sharp decrease in the bending stiffness of the aluminum foil, making it prone to resonance fracture under vibration conditions; a thickness greater than 0.15 mm in the fins 5 results in a sharp reduction in the heat dissipation area per unit volume. Considering the above factors, this invention uses aluminum with a thickness of 0.08 mm to 0.15 mm to prepare the fins 5.

[0028] The surface of the fin 5 is coated with a graphene coating. Compared to conventional choices such as black anodizing or carbon nanotube coatings, the graphene used in this invention has high thermal emissivity, resulting in significantly increased radiative heat dissipation. When the fin 5 is bent, the graphene layer undergoes topological wrinkling deformation (not cracking). It has the advantages of maintaining >99% of its radiation efficiency after repeated exposure, strong adhesion, and high environmental stability.

[0029] The spacing of the fin assembly can be adjusted by a piezoelectric ceramic actuator and a bistable hinge. The voltage range of 0-100V corresponds to a displacement of 0-2mm, with a response time of <10ms. It is self-locking at three levels of 1 / 3 / 5mm, with zero power consumption, and can adapt to different environmental wind speeds.

[0030] The deployment speed of the fin assembly satisfies the following formula, and the response time is ≤2 seconds.

[0031]

[0032] In the formula, denoted as fin deployment speed, T as temperature at the junction of the fin root and the heat pipe, and k as structural response coefficient, which is set to 0.8.

[0033] The unfolding speed of the fin assembly is positively correlated with the rate of temperature change. For example, the fin assembly comprises three layers of 0.1mm ultra-thin aluminum fins, and the total surface area after unfolding reaches [missing information]. Storage volume The storage volume is reduced to 35% of the traditional design, and the heat dissipation surface area is increased by 270% when unfolded.

[0034] Furthermore, a thermally conductive gap adjustment layer 4 may be provided between the semiconductor cooling chip 3 and the heat pipe array 2. This thermally conductive gap adjustment layer 4 is composed of an indium foil and nano-ceramic powder. The thermally conductive gap adjustment layer 4 is mainly used to compensate for differences in thermal expansion and contraction, fill microscopic gaps, and reduce contact thermal resistance. It can automatically fill the tiny gaps between the semiconductor cooling chip 3 and the heat pipe array 2, allowing heat to be transferred with zero loss. For example, it can be composed of an indium foil with a thickness of 0.03 mm to 0.08 mm and nano-ceramic powder, reducing contact thermal resistance. .

[0035] Specifically, the dynamic temperature control unit calculates the target cooling power using the following formula:

[0036] In the formula, Target cooling capacity; This is a material correction factor. Take 0.82; For ambient temperature, This refers to the safe temperature threshold (i.e., the safety setting parameter) for the semiconductor cooling chip. The heat load of the cooled handheld observation device is the total power of all heat-generating components of the device. This is the maximum heat dissipation (in watts) of the cooled handheld observation device.

[0037] Furthermore, the operating modes of the dynamic temperature control unit may include energy-saving mode, standard mode, and high-speed mode. That is, the dynamic temperature control unit divides the cooling mode into three levels (energy-saving / standard / high-speed) according to the heat load intensity.

[0038] when When the temperature range is [10℃, 30℃], the energy-saving mode is executed, controlling the operation of a portion of the heat pipes in the heat pipe array. For example, only 30% of the heat pipe array is activated.

[0039] when - When the temperature is ≥15℃, the high-speed mode is executed, the heat pipe array is controlled to run at full power and the fan is turned on for forced air cooling.

[0040] In other cases, the standard mode is executed, controlling the heat pipe array to operate at full power.

[0041] The dynamic temperature control unit in this invention can be understood as having a built-in closed-loop control algorithm based on ambient temperature and device power consumption, enabling real-time matching of cooling power and heat load. After calculating the real-time cooling power requirement (i.e., the target cooling power), the dynamic temperature control unit outputs a PWM (Pulse Width Modulation) signal to control the operating current of the semiconductor cooling chip.

[0042] Specifically, the environmental and equipment parameter acquisition unit includes an environmental sensing subunit and an equipment acquisition subunit; both the environmental sensing subunit and the equipment acquisition subunit are connected to the dynamic temperature control unit; the environmental sensing subunit includes a temperature and humidity sensor, and one or more of an ultrasonic wind speed sensor, a barometer, and a condensation early warning module; the equipment acquisition subunit includes a thermocouple array embedded inside the heat pipe array, a thin-film heat flux sensor mounted on the aluminum nitride ceramic substrate, and a heat flux sensor mounted on the surface of the infrared thermal imager.

[0043] The temperature and humidity sensor has a temperature measurement range of -40℃ to 5℃ (±0.3℃) and a humidity measurement range of 0-100%RH (±2%). Enthalpy can also be detected using this sensor. The ultrasonic anemometer has a range of 0-60 m / s, a resolution of 0.1 m / s, and supports 16-directional wind direction detection. Through a Doppler frequency shift compensation algorithm, the ultrasonic anemometer maintains an accuracy of ±0.1 m / s even at wind speeds of 60 m / s. The barometer has a range of 300-1100 hPa (±0.1 hPa) and incorporates an altitude conversion algorithm. The barometer also features a built-in temperature compensation model to eliminate measurement drift at -40℃.

[0044] The condensation early warning module can calculate the condensation risk coefficient based on the following formula: when... The anti-condensation mode is triggered at 0.85.

[0045]

[0046] In the formula, To account for the condensation risk factor, This represents the enthalpy of saturated air corresponding to the dew point temperature. This represents the actual enthalpy of the air layer on the equipment surface. Dew point temperature, I is the surface temperature of the equipment casing. dew -I surface : Reflects the air's water content potential (the greater the enthalpy difference, the easier it is for condensation to form), T dew -T surfaceThis characterizes the temperature difference that drives condensation (a negative temperature difference indicates the surface is below the dew point). Furthermore, it can automatically switch to anti-condensation mode when ambient humidity is ≥85% or the rate of change in air pressure is ≥5 hPa / min. A detachable anti-condensation protective cover can also be added; for example, it can automatically trigger a heating dehumidification function (power ≤3W) when ambient humidity is ≥85%.

[0047] The thermocouple array enables precise, real-time multi-point temperature monitoring, providing crucial input for the dynamic temperature control module. With a response time ≤100ms, the thermocouples can capture instantaneous temperature rises caused by sudden power consumption changes (such as lens module startup). A thin-film heat flux sensor mounted on the aluminum nitride ceramic substrate monitors the temperature change rate of the paraffin-based composite phase change material (e.g., the duration of the 28±2℃ plateau period). When the phase change material reaches the phase change threshold, the forced convection cooling mode of the heat pipe array is activated; the melting / solidification progress of paraffin can be determined, quantifying the heat load absorption state. Since the infrared thermal imager generates significant heat during operation, a heat flux sensor is installed on its surface to obtain corresponding thermal state parameters.

[0048] In addition, the cooled handheld observation device may also include: an observation compensation unit; the observation compensation unit includes a gyroscope, an accelerometer, a positioning module, a laser ranging module, and an image stabilization module; the image stabilization module includes a neural network model for predicting device jitter; the neural network model takes information obtained by the gyroscope, the accelerometer, the positioning module, and the laser ranging module as input, and takes reverse jitter compensation information as output.

[0049] The observation compensation unit can generate a reverse compensation signal based on the equipment jitter frequency and amplitude, so that the observation error is ≤ ±0.05mm.

[0050] For example, a 6-axis MEMS gyroscope is used: sampling frequency ≥ 1 kHz, dynamic range ± 2000 dps.

[0051] The image stabilization module includes a neural network model for predicting device jitter, which can specifically be a jitter prediction model built based on an LSTM neural network. In the data acquisition layer, jitter data is collected (e.g., 100,000 sets of jitter data are collected, and the training dataset contains handheld jitter samples in the frequency range of 0.5Hz to 5Hz), and position and posture information are synchronized. In the data processing layer, the signal is denoised and filtered, multimodal data fusion processing is performed, and relevant data such as gyroscope, accelerometer, and laser rangefinder are fused. The obtained information is used to train an LSTM model. The obtained data is optimized by using model pruning to reduce the model size and improve speed, and using weight quantization to reduce the model and calculate its complexity. The data after training the model is optimized. The input layer includes multimodal sensor data, LSTM layer design, activation function selection, loss function selection, optimizer selection, etc. Finally, real-time prediction and sensor data are input into the fast preprocessed LSTM model to infer the pose compensation amount and output real-time jitter compensation. Online data buffering and lightweight incremental updates (fine-tuning with a few data points) are used to maintain real-time performance (latency ≤ 2ms). Finally, the trained network model is used for jitter prediction. The input layer receives data from gyroscopes, etc., and the output layer generates the compensation matrix.

[0052] For example, the compensation matrix can be represented as follows:

[0053] In the formula, For the compensation matrix, For the heading angle, / This is the amount of translation compensation.

[0054] The image stabilization module integrates spatiotemporal features from multiple sensors, dynamically calibrates historical errors, and processes jitter frequency bands in a layered manner, enabling handheld shooting with ultra-low power consumption and zero-shake performance that surpasses professional gimbals in stability in complex scenes.

[0055] In addition, the cooled handheld observation device may also include: at least one auxiliary detection channel among visible light (400-700nm) detection channel, mid-wave infrared (3-5μm) detection channel, and ultraviolet (250-380nm) detection channel, as well as a multispectral fusion module; the long-wave infrared (8-14μm) detection channel included in the infrared thermal imager, the auxiliary detection channel and the multispectral fusion module constitute a multispectral fusion detection unit.

[0056] The multispectral fusion detection unit may also include a wavelength self-calibration module, which corrects spectral shifts in real time using a Fabry-Perot etalon, achieving a wavelength accuracy of ±0.1 nm.

[0057] In addition, the cooled handheld observation device may also include: a power management unit, a display unit, and a storage unit; the power management unit includes a lithium battery and a dynamic voltage regulation module, the dynamic voltage regulation module is used to switch the power supply voltage according to the working mode of the dynamic temperature control unit; the display unit and the storage unit are respectively used to display and store the parameter information corresponding to the cooled handheld observation device in real time.

[0058] For example, using three 18650 batteries for power, the dynamic voltage regulation (DVFS) technology enables a battery life of ≥8 hours. Compared to existing observation instruments that require at least eight 18650 batteries to ensure normal power supply and a maximum operating time of no more than six hours, and which weigh at least 400 grams, significantly increasing the user's burden, this invention, through its built-in low-power thermal management system (including a composite phase change structure, heat pipe array, dynamic temperature control unit, etc.), not only effectively improves the battery life but also reduces the weight by more than half.

[0059] The display unit uses a 1920×1080 LCD screen, supports Chinese / English switching display, and displays multiple parameters in real time (temperature, humidity, wind speed, air pressure, altitude difference, horizontal distance, pitch angle, roll angle, rectangular coordinate system, BeiDou latitude and longitude, power display, positioning and orientation information, etc.); the display screen is equipped with an adaptive backlight adjustment function. It remains clearly visible even in bright light.

[0060] The storage unit supports up to 512GB of storage, with an adjustable recording interval of 1-240 minutes, and supports export via USB interface. The data storage unit supports export in both CSV and TXT formats, and is compatible with mainstream data analysis software.

[0061] In summary, Example 1 provides a cooled handheld observation device that integrates efficient cooling, multimodal sensing, and intelligent compensation, suitable for scenarios such as industrial inspection, environmental monitoring, and emergency rescue.

[0062] Example 2: Example 2 provides a dynamic temperature control method for a cooling handheld observation device as described in Example 1, comprising the following steps: The infrared thermal imager is mounted on the cold end of the semiconductor cooling chip and connected to the heat dissipation structure through a composite phase change structure and a heat pipe array. Environmental parameters and equipment thermal status parameters are acquired using the environmental and equipment parameter acquisition unit; The dynamic temperature control unit matches the cooling power in real time based on the environmental parameters and the thermal state parameters of the equipment, and adjusts the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching.

[0063] The dynamic temperature control unit can be used to dynamically calculate the target cooling power, execute multi-mode temperature control, and adjust the operating current of the semiconductor cooling chip.

[0064] The dynamic temperature control unit calculates the target cooling power using the following formula:

[0065] In the formula, For the target cooling capacity, This is a material correction factor. For ambient temperature, This refers to the safe temperature threshold for semiconductor cooling chips. For the heat load of the cooling handheld observation device, This represents the maximum heat dissipation of the cooled handheld observation device.

[0066] The dynamic temperature control unit has three operating modes: energy-saving mode, standard mode, and high-speed mode. When the temperature is between [10℃ and 30℃], the energy-saving mode is executed, controlling the operation of some heat pipes in the heat pipe array; when - When the temperature is ≥15℃, the high-speed mode is executed, controlling the heat pipe array to run at full power and turning on the fan for forced air cooling; under other conditions, the standard mode is executed, controlling the heat pipe array to run at full power.

[0067] according to The operating current of the thermoelectric cooler can be dynamically adjusted. Temperature stability can also be verified through a closed-loop sensor system.

[0068] Since the steps in the dynamic temperature control method of the cooling handheld observation device provided in Embodiment 2 correspond to the functions of each module or device in the cooling handheld observation device provided in Embodiment 1, Embodiment 2 can be understood by referring to the description of Embodiment 1, and will not be repeated here.

[0069] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A cooled handheld observation device, characterized in that, include: Infrared thermal imager, semiconductor cooling chip, composite phase change structure, heat pipe array, heat dissipation structure, environmental and equipment parameter acquisition unit, and dynamic temperature control unit; The infrared thermal imager is mounted on the cold end of the semiconductor cooling chip and is connected to the heat dissipation structure through the composite phase change structure and the heat pipe array. The composite phase change structure adopts a layered composite structure composed of a paraffin-based composite phase change material and an aluminum nitride ceramic substrate; the paraffin-based composite phase change material is used to absorb the heat of the semiconductor cooling chip; the aluminum nitride ceramic substrate serves as a thermally conductive framework for directional heat conduction to the heat pipe array. The heat pipe array includes multiple sets of heat pipes arranged in a Fibonacci spiral. The environmental and equipment parameter acquisition unit is used to acquire environmental parameters and equipment thermal state parameters; The dynamic temperature control unit is used to match the cooling power in real time according to the environmental parameters and the thermal state parameters of the equipment, and to adjust the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching.

2. The cooled handheld observation device according to claim 1, characterized in that, The heat dissipation structure includes an adjustable fin group and a fan; the fin group includes multiple layers of fins, which are made of aluminum with a thickness of 0.08 mm to 0.15 mm, and the surface of the fins is coated with a graphene coating; the adjustable spacing of the fin group is 1 mm to 5 mm; the fan is used for forced air cooling.

3. The cooled handheld observation device according to claim 2, characterized in that, The dynamic temperature control unit calculates the target cooling power using the following formula: In the formula, For the target cooling capacity, This is a material correction factor. For ambient temperature, This refers to the safe temperature threshold for semiconductor cooling chips. For the heat load of the cooling handheld observation device, This represents the maximum heat dissipation of the cooled handheld observation device.

4. The cooled handheld observation device according to claim 3, characterized in that, The dynamic temperature control unit has three operating modes: energy-saving mode, standard mode, and high-speed mode. When the temperature is between [10℃ and 30℃], the energy-saving mode is executed, controlling the operation of some heat pipes in the heat pipe array; when - When the temperature is ≥15℃, the high-speed mode is executed, controlling the heat pipe array to run at full power and turning on the fan for forced air cooling; under other conditions, the standard mode is executed, controlling the heat pipe array to run at full power.

5. The cooled handheld observation device according to claim 1, characterized in that, A thermally conductive gap adjustment layer is also provided between the semiconductor cooling chip and the heat pipe array. The thermally conductive gap adjustment layer is composed of indium foil and nano-ceramic powder.

6. The cooled handheld observation device according to claim 1, characterized in that, The environmental and equipment parameter acquisition unit includes an environmental sensing subunit and an equipment acquisition subunit; both the environmental sensing subunit and the equipment acquisition subunit are connected to the dynamic temperature control unit; the environmental sensing subunit includes a temperature and humidity sensor, and one or more of an ultrasonic wind speed sensor, a barometer, and a condensation early warning module; the equipment acquisition subunit includes a thermocouple array embedded inside the heat pipe array, a thin-film heat flux sensor mounted on the aluminum nitride ceramic substrate, and a heat flux sensor mounted on the surface of the infrared thermal imager.

7. The cooled handheld observation device according to claim 1, characterized in that, It also includes: an observation compensation unit; the observation compensation unit includes a gyroscope, an accelerometer, a positioning module, a laser ranging module, and an image stabilization module; the image stabilization module contains a neural network model for predicting device jitter; the neural network model takes the information obtained by the gyroscope, the accelerometer, the positioning module, and the laser ranging module as input, and takes the reverse jitter compensation information as output.

8. The cooled handheld observation device according to claim 1, characterized in that, Also includes: At least one auxiliary detection channel among the visible light detection channel, mid-infrared detection channel, and ultraviolet detection channel, and a multispectral fusion module; The infrared thermal imager includes a long-wave infrared detection channel, and the auxiliary detection channel and the multispectral fusion module together form a multispectral fusion detection unit.

9. The cooled handheld observation device according to claim 4, characterized in that, Also includes: The device includes a power management unit, a display unit, and a storage unit. The power management unit comprises a lithium battery and a dynamic voltage regulation module, which switches the power supply voltage according to the operating mode of the dynamic temperature control unit. The display unit and the storage unit are used to display and store the parameter information corresponding to the cooling handheld observation device in real time.

10. A dynamic temperature control method for a cooling-type handheld observation device as described in any one of claims 1-9, characterized in that, Includes the following steps: The infrared thermal imager is mounted on the cold end of the semiconductor cooling chip and connected to the heat dissipation structure through a composite phase change structure, a heat pipe array, and a heat dissipation structure. Environmental parameters and equipment thermal status parameters are acquired using the environmental and equipment parameter acquisition unit; The dynamic temperature control unit matches the cooling power in real time based on the environmental parameters and the thermal state parameters of the equipment, and adjusts the operating current of the semiconductor cooling chip according to the target cooling power obtained by matching.

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