Wire clamp fault monitoring device and method

Abstract

The invention relates to a wire clamp fault monitoring device and method. The device comprises a main control module, a charging and discharging management module, a power supply system, a temperature acquisition module, a magnetic field acquisition module and a communication module. The charging and discharging management module is electrically connected with the lithium ion capacitor and the lithium thionyl chloride battery, and the lithium ion capacitor supplies power through the charging and discharging management module when the voltage of the lithium ion capacitor exceeds the voltage of the lithium thionyl chloride battery; when the voltage of the lithium ion capacitor is lower than that of the lithium thionyl chloride battery, the lithium thionyl chloride battery is switched to supply power; the charging and discharging management module is electrically connected with the temperature acquisition module, the magnetic field acquisition module and the main control module respectively; the main control module is electrically connected with the communication module, and the fault type and the reporting period of the wire clamp are determined through the main control module based on the temperature information and the magnetic field signal. The fault type of the wire clamp is determined by comprehensively analyzing the temperature information and the magnetic field signal of the wire clamp, and the service life of the device is prolonged while the fault type of the wire clamp is monitored.

Description

Technical Field

[0001] This invention relates to the field of power detection technology, and in particular to a wire clamp fault monitoring device and method. Background Technology

[0002] As power systems continue to expand in scale and become increasingly complex, monitoring the operational status of power equipment has become a crucial link in ensuring the safe and stable operation of the power grid. As an important connecting component in power transmission, the temperature and load changes of line clamps directly affect the safety and transmission efficiency of the lines. Excessive temperature can lead to clamp aging, poor contact, and even serious accidents such as fires and line breaks. Line breaks can cause power outages, trigger secondary faults, threaten the safety of personnel and equipment, and disrupt the stability of the power grid structure.

[0003] Currently, manual inspection is one of the main methods for monitoring clamp temperature. However, manual inspection has the following problems: (1) Low efficiency: The inspection cycle is long, making it difficult to achieve real-time monitoring, especially for power transmission networks with wide spans and complex distribution. (2) Insufficient data accuracy: Due to the influence of subjective factors of personnel, measurement angle, ambient light, etc., the measurement results are inconsistent. (3) Blind spots exist: Inspection is difficult in areas with complex terrain (such as mountainous areas), the monitoring frequency of some clamps is reduced, and safety hazards are difficult to detect in time. Therefore, the existing technology urgently needs an intelligent clamp fault monitoring device and method to solve the problems in the existing technology. Summary of the Invention

[0004] The purpose of this invention is to provide a wire clamp fault monitoring device and method.

[0005] According to one aspect of this application, a wire clamp fault monitoring device is provided, the device including a main control module, a charge / discharge management module, a power supply system, a temperature acquisition module, a magnetic field acquisition module, and a communication module; wherein, the power supply system includes a lithium-ion capacitor and a lithium-ion battery; The charge / discharge management module is electrically connected to both the lithium-ion capacitor and the lithium-ion battery. The module enables the lithium-ion capacitor to supply power when its voltage exceeds that of the lithium-ion battery, and to switch to the lithium-ion battery when its voltage is lower than that of the lithium-ion battery. The charge / discharge management module is electrically connected to the temperature acquisition module, the magnetic field acquisition module, and the main control module, respectively. The charge / discharge management module supplies power to the temperature acquisition module, the magnetic field acquisition module, and the main control module; the temperature acquisition module acquires the temperature information of the wire clamp; and the magnetic field acquisition module acquires the magnetic field signal of the wire clamp. The main control module is electrically connected to the communication module. The main control module determines the fault information of the clamp and the reporting cycle based on temperature information and magnetic field signals, and sends the relevant information to the corresponding network device when the reporting cycle is reached.

[0006] According to another aspect of this application, a method for monitoring wire clamp faults using a wire clamp fault monitoring device is provided, characterized in that the wire clamp fault monitoring device includes the wire clamp fault monitoring device as described in any of the above claims, and the method includes: The voltage amplitude corresponding to each frequency component is extracted from the magnetic field signal by using Fast Fourier Transform; The fault information of the clamp is determined by fitting the current line current and temperature information based on the voltage amplitude corresponding to each frequency component.

[0007] According to another aspect of this application, a computer device is provided, including a memory and a processor, wherein a computer program capable of being loaded by the processor and executing the methods described above is stored in the memory.

[0008] According to another aspect of this application, a computer-readable storage medium is provided, storing a computer program that can be loaded by a processor and executed as described above.

[0009] Compared with existing technologies, the wire clamp fault monitoring device of this application includes a main control module, a charge / discharge management module, a power supply system, a temperature acquisition module, a magnetic field acquisition module, and a communication module. The power supply system provides power to the device. The power supply system includes lithium-ion capacitors and lithium-ion batteries, with the lithium-ion battery serving as a backup battery. The charge / discharge management module controls power supply by switching from lithium-ion capacitors when the lithium-ion capacitor voltage exceeds the lithium-ion battery voltage, and switching to lithium-ion battery power when the lithium-ion capacitor voltage is lower than the lithium-ion battery voltage. The magnetic field acquisition module acquires the magnetic field signal of the wire clamp to analyze and obtain the load information of the wire clamp. The fault type of the wire clamp is monitored by comprehensively considering the temperature and load information. The main control module determines the fault type and reporting cycle of the wire clamp based on the temperature information and magnetic field signal. While monitoring the fault type of the wire clamp in real time, the reporting cycle is dynamically adjusted based on the fault type. This real-time monitoring of the fault type saves the device's power, thereby extending the device's operating time.

[0010] Furthermore, the power supply system also includes amorphous silicon photovoltaic panels, which charge lithium-ion capacitors. The power supply scheme employs amorphous silicon photovoltaic panels, lithium-ion capacitors, and lithium-ion batteries. The voltage characteristics of amorphous silicon photovoltaic panels are determined by the material's bandgap, pn junction structure, and series design, and are less dependent on area. Therefore, high voltage can be achieved even with a small area, meeting the system's power supply voltage requirement of greater than 3V. Lithium-ion capacitors have an energy density 2 to 5 times that of supercapacitors, storing more energy in the same volume. Furthermore, due to their slow discharge characteristic, lithium-ion capacitors can provide energy to the system for a longer period, extending the overall system lifespan. Attached Figure Description

[0011] Figure 1 A schematic diagram of the structure of a wire clamp fault monitoring device according to an embodiment of this application is shown; Figure 2 A schematic diagram of the structure of a charge / discharge management module according to an embodiment of this application is shown; Figure 3 A schematic diagram of a temperature acquisition module according to an embodiment of this application is shown; Figure 4 A schematic diagram of a magnetic field acquisition module according to an embodiment of this application is shown; Figure 5 A flowchart of a method for monitoring wire clamp faults using a wire clamp fault monitoring device according to an embodiment of this application is shown; Figure 6 A schematic diagram of the main control module according to an embodiment of this application is shown; Figure 7 Exemplary systems that can be used to implement the various embodiments described in this application are shown.

[0012] Figure descriptions: 1. Charge / discharge management module; 2. Lithium-ion battery; 3. Lithium-ion capacitor; 4. Main control module; 5. Communication module; 6. Temperature acquisition module; 7. Magnetic field acquisition module; 8. Amorphous silicon photovoltaic panel. Detailed Implementation

[0013] The present application will now be described in further detail with reference to the accompanying drawings.

[0014] In a typical configuration of this application, the terminal, the device of the service network, and the trusted party all include one or more processors (e.g., a central processing unit (CPU)), input / output interfaces, network interfaces, and memory.

[0015] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash memory. Memory is an example of computer-readable media.

[0016] Computer-readable media, including both permanent and non-permanent, removable and non-removable media, can store information using any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PCM), programmable random access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0017] The devices referred to in this application include, but are not limited to, terminals, network devices, or devices formed by integrating terminals and network devices through a network. The terminals include, but are not limited to, any mobile electronic product capable of human-computer interaction (e.g., via a touchpad), such as smartphones and tablets. These mobile electronic products can use any operating system, such as Android or iOS. The network devices include electronic devices capable of automatically performing numerical calculations and information processing according to pre-set or stored instructions. Their hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), and embedded devices. The network devices include, but are not limited to, computers, network hosts, single network servers, multiple network server clusters, or clouds composed of multiple servers. Here, a cloud consists of a large number of computers or network servers based on cloud computing, where cloud computing is a type of distributed computing, consisting of a virtual supercomputer composed of a group of loosely coupled computer clusters. The network includes, but is not limited to, the Internet, wide area network, metropolitan area network, local area network, VPN network, wireless ad hoc network, etc. Preferably, the device can also be a program running on the terminal, network device, or a device formed by integrating the terminal and network device, network device, touch terminal, or network device and touch terminal through a network.

[0018] Of course, those skilled in the art should understand that the above-described devices are merely examples, and other existing or future devices that are applicable to this application should also be included within the scope of protection of this application, and are hereby incorporated by reference.

[0019] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.

[0020] refer to Figure 1This invention provides a wire clamp fault monitoring device, comprising a main control module 4, a charge / discharge management module 1, a power supply system, a temperature acquisition module 5, a magnetic field acquisition module 6, and a communication module 41. The power supply system includes a lithium-ion capacitor 3 and a lithium-ion battery 2. The charge / discharge management module 1 is electrically connected to both the lithium-ion capacitor 3 and the lithium-ion battery 2. The module 1 supplies power to the lithium-ion capacitor 3 when its voltage exceeds that of the lithium-ion battery 2, and switches to the lithium-ion battery 2 when its voltage is lower. The charge / discharge management module 1 is electrically connected to the temperature acquisition module 5, the magnetic field acquisition module 6, and the main control module 4, supplying power to all three modules. The temperature acquisition module 5 acquires the temperature information of the wire clamp, and the magnetic field acquisition module 6 acquires the magnetic field signal of the wire clamp. The main control module 4 is electrically connected to the communication module 41. Based on the temperature information and the magnetic field signal, the main control module 4 determines the fault type and reporting cycle of the wire clamp, and sends the relevant information to the corresponding network device when the reporting cycle is reached. In some embodiments, the main control module 4 includes, but is not limited to, an MCU chip with an integrated radio frequency core. Temperature information and magnetic field signals are collected by the temperature acquisition module 5 and the magnetic field acquisition module 6 and transmitted to the MCU chip. The MCU chip stores and processes the data and then transmits it wirelessly to the edge aggregation terminal via 433MHz. In this embodiment, the MCU and the radio frequency core (e.g., a communication module) responsible for wireless transmission are integrated into a single chip, avoiding the need for external circuitry and saving layout space and hardware costs. Real-time monitoring and remote display of clamp fault types are achieved, eliminating the need for regular manual inspections. This solves many drawbacks of traditional manual inspections and reduces the pressure on maintenance and inspection. In some embodiments, specifically, an SCM326 chip can be used as the main control module 4. The SCM326 chip integrates a Cortex-M0 core and a wireless radio frequency core into a QFN60 package, realizing the functions of main control and wireless communication, reducing the number of components and shrinking the circuit layout space. In some embodiments, the lithium-ion battery 2 in the power supply system serves as a backup battery. The charge and discharge management module 1 controls whether the device is powered by the lithium-ion capacitor 3 or by the lithium-ion battery 2. In some embodiments, the charge / discharge management module 1 is electrically connected to the temperature acquisition module 5, the magnetic field acquisition module 6, and the main control module 4, respectively. The charge / discharge management module 1 supplies power to the temperature acquisition module 5, the magnetic field acquisition module 6, and the main control module 4; the temperature acquisition module 5 acquires the temperature information of the clamp; and the magnetic field acquisition module 6 acquires the magnetic field signal of the clamp. For detailed descriptions of the charge / discharge management module 1, the power supply system, the temperature acquisition module 5, and the magnetic field acquisition module 6, please refer to the corresponding embodiments below; they will not be repeated here. In some embodiments, the specific model of the lithium-ion capacitor 3 includes SLA3R8L2060813.The specific model of the lithium-thionyl chloride battery 2 includes ER14250. In some embodiments, the device also includes an RTC (timer module). For example, the main control module 4 is normally in a low-power sleep state. After being woken up by the internal RTC at regular intervals, it turns on the power to the temperature acquisition module 5 and communicates with and acquires data from the temperature acquisition module 5. At the same time, the magnetic field acquisition module 6 is turned on, and the output signal of the magnetic field acquisition module 6 is acquired by the ADC on the main control module 4. The main control module 4 uses a fast Fourier transform to extract the fundamental and harmonic components of the current for data storage and fault type identification. In some embodiments, the relevant information includes, but is not limited to, fault type, temperature information, magnetic field signal, and other data information.

[0021] In some embodiments, continue to refer to Figure 1 The power supply system also includes an amorphous silicon photovoltaic panel 7, which charges the lithium-ion capacitor 3. The charge / discharge management module 1 is also electrically connected to the amorphous silicon photovoltaic panel. In this embodiment, a power supply scheme consisting of an amorphous silicon photovoltaic panel 7, a lithium-ion capacitor 3, and a lithium-ion battery 2 is adopted. The voltage characteristics of the amorphous silicon photovoltaic panel 7 are determined by the material's bandgap, pn junction structure, and series design, and are less related to the area. Therefore, a small area can achieve high voltage, meeting the system's power supply voltage requirement of greater than 3V. The energy density of the lithium-ion capacitor 3 is 2 to 5 times that of a supercapacitor. It can store more energy in the same volume, and due to its slow discharge characteristic, the lithium-ion capacitor 3 can provide energy to the system for a longer time, thus providing a longer service life for the entire system. In this embodiment, the amorphous silicon photovoltaic panel 7, the lithium-ion capacitor 3, and the lithium-ion battery 2 are electrically connected to the charge / discharge management module 1, which controls and manages the charge and discharge processes. For a detailed description of the charge / discharge management module 1, please refer to the corresponding embodiment below, which will not be repeated here.

[0022] In some embodiments, reference Figure 2The charge / discharge management module 1 includes a power supply input circuit and a power supply output circuit, which are connected via a power input node VCC_IN. The power supply input circuit includes an amorphous silicon photovoltaic panel interface P3, a lithium-ion battery interface BAT1, a first Schottky diode D3, a second Schottky diode D1, and a first voltage regulator chip U2. The amorphous silicon photovoltaic panel supplies power to the power input node VCC_IN through the first Schottky diode D3 and the first voltage regulator chip U2. The lithium-ion capacitor is connected in parallel with the power input node VCC_IN for energy storage. The lithium-ion battery is connected in parallel with the lithium-ion capacitor through the second Schottky diode D1. When the voltage of the lithium-ion capacitor is lower than that of the lithium-ion battery, the lithium-ion battery is powered on. In some embodiments, the Schottky diode can specifically be an MBR0530T1G, and the first voltage regulator chip can specifically be a linear voltage regulator chip CJ6101A39M. The amorphous silicon photovoltaic panel achieves all-weather charging and energy storage for the lithium-ion capacitor through the charge / discharge management module. The entire device is designed for ultra-low power consumption. During prolonged charging, it is necessary to maintain the energy storage of the lithium-ion capacitor at or below its rated operating voltage. Therefore, this embodiment uses the ultra-low power linear regulator chip CJ6101A39M to control the maximum voltage of the lithium-ion capacitor at around 3.9V, ensuring the safe and long-life operation of the lithium-ion capacitor.

[0023] In some embodiments, continue to refer to Figure 2The power supply output circuit includes a second voltage regulator chip U1, a capacitor C5, and a lithium-ion capacitor 3. The lithium-ion capacitor 3 is connected in parallel with capacitor C5 and electrically connected to the power input node VCC_IN and the second voltage regulator chip U1, respectively. In some embodiments, the second voltage regulator chip U1 can specifically be a linear voltage regulator chip H7230-1. For example, due to the unidirectional conductivity of diodes, when the voltage of the lithium-ion capacitor charged by the amorphous silicon photovoltaic panel exceeds the voltage of the backup lithium-ion battery, the circuit is powered by the lithium-ion capacitor. After being regulated to 3V by the linear voltage regulator chip H7230-1, it provides power to the overall system. When there are consecutive cloudy or rainy days, and the amorphous silicon photovoltaic panel cannot provide sufficient energy, causing the voltage of the lithium-ion capacitor to be lower than the voltage of the backup lithium-ion battery, the circuit automatically switches to power from the backup lithium-ion battery, which is also regulated by the linear voltage regulator chip H7230-1 before providing power to the overall system. The overall system power consumption is controlled within 0.075mAh. In some embodiments, the lithium-ion capacitor SLA3R8L2060813 has a storage capacity of 10mAh (3.8V-2.5V). Due to adjustments by the charge / discharge management module, power is only supplied when the lithium-ion capacitor voltage is higher than the backup lithium battery voltage (e.g., 3.6V). The discharge curve of the lithium-ion capacitor is nearly linear (voltage decreases approximately uniformly with capacity release), meaning the relationship between voltage drop and capacity release is more closely proportional. In other words, ideally, the voltage change is directly proportional to the capacity release. The lithium-ion capacitor can release approximately 2.3mAh of energy between 3.9V and 3.6V, enough for the system to operate continuously for 30 hours. Therefore, under sufficient sunlight during the day, the system can be fully powered by the lithium-ion capacitor at night. Assuming a predominantly cloudy or rainy year, accounting for approximately 30% of the year (122 days), and assuming, in the extreme case, 122 consecutive cloudy or rainy days, during which the system is entirely powered by the backup lithium-ion battery (ER14250) with a capacity of 1200mAh, the battery, combined with photovoltaic power generation, can provide power for 5.4 years. It meets the industry standard of 5 years of continuous working life.

[0024] In some embodiments, reference Figure 3 The temperature acquisition module includes a T-type thermocouple P1 and a thermocouple acquisition chip U4. The measuring end of the T-type thermocouple P1 is fixed to a wire clamp, and the cold end of the T-type thermocouple P1 is connected to the circuit board and then connected to the thermocouple acquisition chip U4 via internal wiring. The thermocouple acquisition chip U4 communicates with the main control module via a bus. In some embodiments, the thermocouple acquisition chip U4 can specifically be a MAX31850 chip, which communicates with the MCU via a 1-Wire bus to complete the measurement.

[0025] In some embodiments, reference Figure 4The magnetic field acquisition module includes a magnetic field sensor U7 and a differential operational amplifier U8. The magnetic field sensor U7 acquires the magnetic field signal from the wire clamp, and the differential operational amplifier U8 amplifies the signal before transmitting it to the main control module. In some embodiments, the specific model of the magnetic field sensor U7 includes, but is not limited to, TMR2583S, and the specific model of the differential operational amplifier U8 includes, but is not limited to, AD8206. For example, the magnetic field sensor TMR2583S and the differential operational amplifier AD8206 serve as the magnetic field strength acquisition module. The output signal of the TMR2583S is a millivolt-level differential voltage, which needs to be amplified by the high-precision differential operational amplifier AD8206 before being transmitted to the MCU. The MCU uses a Fast Fourier Transform (FFT) to extract the fundamental and harmonic components of the current, thereby analyzing the load change trend.

[0026] Figure 5 A flowchart illustrating a method for monitoring clamp faults using a clamp fault monitoring device according to another embodiment of this application is shown, wherein the clamp fault monitoring device includes the clamp fault monitoring device of any of the above embodiments. The method includes steps S11 and S12. In step S11, the voltage amplitude corresponding to each frequency component is extracted from the magnetic field signal using a fast Fourier transform; in step S12, the fault type and reporting period of the clamp are determined based on the voltage amplitude corresponding to each frequency component and temperature information. In some embodiments, the fault type includes, but is not limited to, clamp overload, poor contact, arcing, motor failure, etc. For the specific determination process of the fault type and reporting period, please refer to the corresponding embodiments below, which will not be repeated here.

[0027] In some embodiments, the frequency components include the fundamental frequency. Determining the fault type and reporting cycle of the clamp based on the voltage amplitude and temperature information corresponding to each frequency component includes: fitting the current fundamental current of the line based on the voltage amplitude corresponding to the fundamental frequency; if the fundamental current is greater than a first target threshold and the temperature rise rate is greater than a rate threshold, determining the fault type as clamp overload, and the reporting cycle as the first cycle; if the fundamental current is within a target range and the temperature information is greater than a second target threshold, determining the fault type as poor contact, and the reporting cycle as the second cycle; if the fundamental current amplitude is greater than a third target threshold and the local temperature difference is greater than a fourth target threshold, determining the fault type as electric arc, and the reporting cycle as the second cycle; if the proportion of the third harmonic is greater than a target percentage and the temperature rise rate is within a target rate range, determining the fault type as a nonlinear load alarm, and the reporting cycle as the third cycle. In some embodiments, the relationship between the first cycle, the second cycle, and the third cycle includes: second cycle < first cycle < third cycle. For example, the first cycle includes, but is not limited to, 1 minute; the second cycle includes, but is not limited to, 30 seconds; and the third cycle includes, but is not limited to, 5 minutes. In some embodiments, if no fault type exists, a fourth cycle is used for reporting. For example, the fourth cycle includes 1 hour, with relevant information reported every hour (e.g., the relevant information includes, but is not limited to, temperature information collected by the temperature acquisition module and magnetic field signals collected by the magnetic field acquisition module). In some embodiments, clamp overload is usually caused by long-term overcapacity operation of the clamp; poor clamp contact is usually caused by local overheating due to loose bolts; electric arc is usually caused by insulation breakdown or contact sparks; nonlinear load alarm is usually caused by third harmonics generated by nonlinear equipment such as single-phase rectifier equipment and arc-type loads. In some embodiments, temperature acquisition modules can be set at multiple locations of the clamp to collect temperature information at multiple locations of the clamp. Local temperature difference includes, but is not limited to, the difference between the temperature information of two locations. In this embodiment, the clamp fault monitoring device monitors the clamp fault type in real time. Furthermore, the reporting cycle is dynamically adjusted based on the fault type, saving energy and power while meeting the emergency needs of different fault types. For example, if no fault type is detected, the clamp fault monitoring device reports relevant information every hour (e.g., temperature information, magnetic field signals, etc. collected within that hour). If an overload fault is detected, relevant information (such as temperature, magnetic field signal, and overload fault type) will be reported every 30 seconds. If the overload fault is cleared, the system will automatically resume reporting relevant information every hour.

[0028] Figure 6A schematic diagram of the main control module according to an embodiment of this application is shown. The main control module includes a primary module and a secondary module. The primary module is used to extract the voltage amplitude corresponding to each frequency component from the magnetic field signal through a fast Fourier transform. The secondary module is used to determine the fault information of the clamp based on the voltage amplitude corresponding to each frequency component and temperature information.

[0029] Here, the specific implementation methods corresponding to the above-mentioned modules one and two are the same as or similar to the specific embodiments of steps S11 and S12, and therefore will not be repeated here, but are included by reference.

[0030] In addition to the methods and devices described in the above embodiments, this application also provides a computer-readable storage medium storing computer code that, when executed, performs the method described in any of the preceding embodiments.

[0031] This application also provides a computer program product that, when executed by a computer device, performs the method described in any of the preceding claims.

[0032] This application also provides a computer device, the computer device comprising: One or more processors; Memory, used to store one or more computer programs; When the one or more computer programs are executed by the one or more processors, the one or more processors cause the one or more processors to perform the method as described in any of the preceding methods.

[0033] Figure 7 Exemplary systems that can be used to implement the various embodiments described in this application are shown; like Figure 7 As shown in some embodiments, system 300 can function as any of the devices described in each of the embodiments. In some embodiments, system 300 may include one or more computer-readable media having instructions (e.g., system memory or NVM / storage device 320) and one or more processors (e.g., one or more processors 305) coupled to the one or more computer-readable media and configured to execute the instructions to implement the module and thus perform the actions described in this application.

[0034] In one embodiment, the system control module 310 may include any suitable interface controller to provide any suitable interface to at least one of the processors 305 and / or any suitable device or component communicating with the system control module 310.

[0035] The system control module 310 may include a memory controller module 330 to provide an interface to the system memory 315. The memory controller module 330 may be a hardware module, a software module, and / or a firmware module.

[0036] System memory 315 can be used, for example, to load and store data and / or instructions for system 300. In one embodiment, system memory 315 may include any suitable volatile memory, such as suitable DRAM. In some embodiments, system memory 315 may include double data rate type quad synchronous dynamic random access memory (DDR4 SDRAM).

[0037] In one embodiment, the system control module 310 may include one or more input / output (I / O) controllers to provide interfaces to the NVM / storage device 320 and (one or more) communication interfaces 325.

[0038] For example, NVM / storage device 320 may be used to store data and / or instructions. NVM / storage device 320 may include any suitable non-volatile memory (e.g., flash memory) and / or may include any suitable (one or more) non-volatile storage devices (e.g., one or more hard disk drives (HDDs), one or more optical disc drives (CDs), and / or one or more digital universal optical disc (DVD) drives).

[0039] NVM / storage device 320 may include storage resources that are physically part of a device on which system 300 is mounted, or that can be accessed by the device without necessarily being part of it. For example, NVM / storage device 320 may be accessed via a network through one or more communication interfaces 325.

[0040] One or more communication interfaces 325 may provide the system 300 with an interface to communicate over one or more networks and / or with any other suitable device. The system 300 may wirelessly communicate with one or more components of a wireless network in accordance with any of one or more wireless network standards and / or protocols.

[0041] In one embodiment, at least one of the processors 305 may be logically packaged with one or more controllers of the system control module 310 (e.g., memory controller module 330). In one embodiment, at least one of the processors 305 may be logically packaged with one or more controllers of the system control module 310 to form a system-in-package (SiP). In one embodiment, at least one of the processors 305 may be integrated with the logic of one or more controllers of the system control module 310 on the same die. In one embodiment, at least one of the processors 305 may be integrated with the logic of one or more controllers of the system control module 310 on the same die to form a system-on-a-chip (SoC).

[0042] In various embodiments, system 300 may be, but is not limited to, a server, workstation, desktop computing device, or mobile computing device (e.g., laptop computing device, handheld computing device, tablet computer, netbook, etc.). In various embodiments, system 300 may have more or fewer components and / or different architectures. For example, in some embodiments, system 300 includes one or more cameras, a keyboard, a liquid crystal display (LCD) screen (including a touchscreen display), a non-volatile memory port, multiple antennas, a graphics chip, an application-specific integrated circuit (ASIC), and a speaker.

[0043] It should be noted that this application can be implemented in software and / or a combination of software and hardware, for example, using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In one embodiment, the software program of this application can be executed by a processor to implement the steps or functions described above. Similarly, the software program of this application (including related data structures) can be stored in a computer-readable recording medium, such as RAM memory, a magnetic or optical drive, a floppy disk, or similar devices. Furthermore, some steps or functions of this application can be implemented in hardware, for example, as circuitry that cooperates with a processor to perform the various steps or functions.

[0044] Furthermore, a portion of this application can be applied as a computer program product, such as computer program instructions, which, when executed by a computer, can invoke or provide the methods and / or technical solutions according to this application through the operation of the computer. Those skilled in the art will understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executing the instructions, or the computer compiling the instructions and then executing the corresponding compiled program, or the computer reading and executing the instructions, or the computer reading and installing the instructions and then executing the corresponding installed program. Here, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to a computer.

[0045] Communication media include media through which communication signals containing, for example, computer-readable instructions, data structures, program modules, or other data are transmitted from one system to another. Communication media can include guided transmission media (such as cables and wires (e.g., optical fibers, coaxial cables, etc.)) and wireless (unguided transmission) media capable of propagating energy waves, such as sound, electromagnetic, RF, microwave, and infrared. Computer-readable instructions, data structures, program modules, or other data can be embodied as modulated data signals in, for example, wireless media (such as carrier waves or similar mechanisms embodied as part of spread spectrum technology). The term "modulated data signal" refers to a signal whose one or more characteristics are altered or set in a manner that encodes information in the signal. Modulation can be analog, digital, or a hybrid modulation technique.

[0046] By way of example and not limitation, computer-readable storage media may include volatile and non-volatile, removable and non-removable media implemented by any method or technique for storing information such as computer-readable instructions, data structures, program modules or other data. For example, computer-readable storage media include, but are not limited to, volatile memories such as random access memory (RAM, DRAM, SRAM); and non-volatile memories such as flash memory, various read-only memories (ROM, PROM, EPROM, EEPROM), magnetic and ferromagnetic / ferroelectric memories (MRAM, FeRAM); and magnetic and optical storage devices (hard disks, magnetic tapes, CDs, DVDs); or other media now known or hereafter developed capable of storing computer-readable information / data for use by a computer system.

[0047] Herein, one embodiment of this application includes an apparatus comprising a memory for storing computer program instructions and a processor for executing the program instructions, wherein when the computer program instructions are executed by the processor, the apparatus is triggered to run a method and / or technical solution based on the foregoing embodiments of this application.

[0048] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices recited in the apparatus claims may also be implemented by a single unit or device in software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

Claims

1. A wire clamp fault monitoring device, characterized in that, The device includes a main control module, a charge / discharge management module, a power supply system, a temperature acquisition module, a magnetic field acquisition module, and a communication module; wherein, the power supply system includes lithium-ion capacitors and lithium-ion batteries; The charge / discharge management module is electrically connected to the lithium-ion capacitor and the lithium-ion battery, respectively. The charge / discharge management module enables the lithium-ion capacitor to supply power when its voltage exceeds that of the lithium-ion battery, and switches to the lithium-ion battery to supply power when its voltage is lower than that of the lithium-ion battery. The charge / discharge management module is also electrically connected to the temperature acquisition module, the magnetic field acquisition module, and the main control module, respectively. The charge / discharge management module supplies power to the temperature acquisition module, the magnetic field acquisition module, and the main control module; the temperature acquisition module acquires the temperature information of the wire clamp; and the magnetic field acquisition module acquires the magnetic field signal of the wire clamp. The main control module is electrically connected to the communication module. The main control module determines the fault type and reporting cycle of the wire clamp based on the temperature information and magnetic field signal, and sends the relevant information to the corresponding network device when the reporting cycle is reached.

2. The apparatus according to claim 1, characterized in that, The power supply system also includes an amorphous silicon photovoltaic panel, which charges the lithium-ion capacitor; the charge and discharge management module is also electrically connected to the amorphous silicon photovoltaic panel.

3. The apparatus according to claim 2, characterized in that, The charge / discharge management module includes a power input circuit and a power output circuit, which are connected through a power input node. The power supply input circuit includes an amorphous silicon photovoltaic panel interface, a lithium-ion battery interface, a first Schottky diode, a second Schottky diode, and a first voltage regulator chip; The amorphous silicon photovoltaic panel supplies power to the power input node through the first Schottky diode and the first voltage regulator chip, and the lithium-ion capacitor is connected in parallel with the power input node for energy storage. The lithium-ion battery is connected in parallel with the lithium-ion capacitor through a second Schottky diode. When the voltage of the lithium-ion capacitor is lower than the voltage of the lithium-ion battery, the lithium-ion battery is turned on to supply power.

4. The apparatus according to claim 3, characterized in that, The power supply output circuit includes a second voltage regulator chip, a capacitor, and a lithium-ion capacitor. The lithium-ion capacitor is connected in parallel with the capacitor and is electrically connected to the power input node and the second voltage regulator chip, respectively.

5. The apparatus according to claim 1, characterized in that, The temperature acquisition module includes a T-type thermocouple and a thermocouple acquisition chip. The temperature measuring end of the T-type thermocouple is fixed to a wire clamp, and the cold end of the T-type thermocouple is connected to a circuit board and connected to the thermocouple acquisition chip through wiring inside the board. The thermocouple acquisition chip is connected to the main control module for communication via a bus.

6. The apparatus according to claim 1, characterized in that, The magnetic field acquisition module includes a magnetic field sensor and a differential operational amplifier. The magnetic field signal of the wire clamp is acquired by the magnetic field sensor, and the magnetic field signal is amplified by the differential operational amplifier and transmitted to the main control module.

7. A method for monitoring wire clamp faults using a wire clamp fault monitoring device, characterized in that, The wire clamp fault monitoring device includes the wire clamp fault monitoring device as described in any one of claims 1 to 6 above, and the method includes: The voltage amplitude corresponding to each frequency component is extracted from the magnetic field signal by using Fast Fourier Transform; The fault type and reporting cycle of the clamp are determined based on the voltage amplitude corresponding to each frequency component and the temperature information.

8. The method according to claim 7, characterized in that, The frequency components include a fundamental frequency. Determining the fault type and reporting cycle of the clamp based on the voltage amplitude corresponding to each frequency component and the temperature information includes: The current fundamental current of the current line is fitted based on the voltage amplitude corresponding to the fundamental wave; If the fundamental current is greater than the first target threshold and the temperature rise rate is greater than the rate threshold, the fault type is determined to be clamp overload, and the reporting cycle is the first cycle; if the fundamental current is within the target range and the temperature information is greater than the second target threshold, the fault type is determined to be poor contact, and the reporting cycle is the second cycle; if the fundamental current is greater than the third target threshold and the local temperature difference is greater than the fourth target threshold, the fault type is determined to be electric arc, and the reporting cycle is the second cycle; if the proportion of the third harmonic is greater than the target percentage and the temperature rise rate is within the target rate range, the fault type is determined to be nonlinear load alarm, and the reporting cycle is the third cycle.

9. A computer device, characterized in that, It includes a memory and a processor, wherein the memory stores a wire clamp fault monitoring method that can be loaded by the processor and executed as described in any one of claims 7 to 8.

10. A computer-readable storage medium, characterized in that, The storage contains a wire clamp fault monitoring method that can be loaded by a processor and executed as described in any one of claims 7 to 8.

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