Method and structure for improving fundamental frequency of array type large slenderness ratio component structure
By introducing high-stiffness structures and rigidly connecting them to the component sets in an array-type high slenderness ratio structure, and using elastic connections between adjacent component sets, the problem of fundamental frequency enhancement in array-type high slenderness ratio structures is solved, achieving fundamental frequency enhancement and thermal deformation release, and reducing the structural load.
Patent Information
- Application Number
- CN202511073640.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-01
- Publication Date
- 2025-11-25
AI Technical Summary
Existing technologies are insufficient to effectively increase the fundamental frequency of multi-array large aspect ratio structures, leading to an increased risk of resonance, especially when the spacing between adjacent structures is small, making traditional tuned mass damper solutions unsuitable.
By combining rigid and elastic connections, a connection mode of "rigid and flexible" is formed by introducing high-stiffness structures and rigidly connecting them to the component set, while elastic connections are used between adjacent component sets. A mathematical model is then established to optimize the structural configuration.
It effectively improves the fundamental frequency of the array-type large aspect ratio structure, reduces the thermal deformation of the structure, reduces the load-bearing burden, and provides a solution with high design freedom.
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Figure CN121009596A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of structural design, specifically to a method and structure for improving the fundamental frequency of an array-type high aspect ratio component structure. Background Technology
[0002] As structural height increases, the slenderness ratio also increases, ultimately leading to a decrease in the structural fundamental frequency. This makes the structure highly susceptible to resonance with low-frequency external excitation loads, potentially causing structural failure and impacting its normal use and safety. Current research on the resonance problem of single high slenderness ratio structures with external excitation loads is relatively mature, and reliable solutions exist, such as using tuned mass dampers to control the resonance risk. However, in some fields, multiple high slenderness ratio structures are arranged in an array, with small spacing between adjacent structures, making the use of tuned mass dampers unsuitable.
[0003] Currently, there is limited research on resonance control of multi-array high aspect ratio structures and external excitation loads. Existing patents, such as CN115238427A (titled "Structural Optimization Design Method for Improving the Natural Frequency of a Large-Aperture Antenna System") and CN220117823U (titled "Strengthening Structure for High-Rise Buildings to Reduce Wind Vibration Effects"), do not disclose solutions applicable to improving the fundamental frequency of array-type high aspect ratio structures. Summary of the Invention
[0004] To address the current lack of research on resonance control of multi-array large slenderness ratio structures and external excitation loads, which makes it difficult to improve the fundamental frequency of array-type large slenderness ratio structures, this invention provides a method and structure for improving the fundamental frequency of array-type large slenderness ratio component structures to solve the above problem.
[0005] A method for enhancing the fundamental frequency of an array-type high aspect ratio component structure includes the following steps: Step 1: Introduce an external high-rigidity structure; Step 2: Record n adjacent components as a component set to form one or more component sets; Step 3: Rigid connection between adjacent components within the same component set; any component set is rigidly connected to the high-rigidity structure, and adjacent component sets are elastically connected.
[0006] In a preferred embodiment of the fundamental frequency enhancement method for array-type high aspect ratio component structures provided by the present invention, the component is a sheet-like component with a high aspect ratio. Multiple components are arranged in a linear array.
[0007] In a preferred embodiment of the fundamental frequency enhancement method for array-type high slenderness ratio component structures provided by the present invention, the high-stiffness structure is a concrete structural wall. The high-stiffness structure is located near the end of the array and is rigidly connected to a component located at the very end of the array.
[0008] In a preferred embodiment of the fundamental frequency enhancement method for array-type high aspect ratio component structures provided by the present invention, as n increases in step 2, the structural fundamental frequency of the component set connecting the high stiffness structure in step 3 decreases.
[0009] A fundamental frequency boosting structure with arrayed high aspect ratio components includes multiple components arranged in a linear array and multiple high-stiffness structures. Every n adjacent components in the array are rigidly connected to form a component set, and adjacent component sets are elastically connected to each other. The multiple high-stiffness structures are rigidly connected to the multiple component sets respectively.
[0010] In a preferred embodiment of the array-type high aspect ratio component structure fundamental frequency boosting structure provided by the present invention, the high-stiffness structure is located near the beginning and end of the array and is rigidly connected to the outermost component of a component group located at the end of the array. The components are connected to each other and to the high-stiffness structure via rigid connectors; the component groups are connected to each other via elastic connectors.
[0011] In a preferred embodiment of the array-type high aspect ratio component structure fundamental frequency boosting structure provided by the present invention, the rigid connector includes a base, a rigid unit and another base connected in sequence, and the elastic connector includes a base, an elastic element, a rigid unit and another base connected in sequence, and the base is rigidly connected to the component.
[0012] Compared with existing technologies, the fundamental frequency enhancement method and structure of the array-type large aspect ratio component structure provided by the present invention have the following beneficial effects: 1. Use rigid connections and elastic units appropriately to reduce the load on the structure.
[0013] 2. The combination of rigid and flexible connectors can effectively solve the problem of thermal deformation not being released after a fully rigid connection. At the same time, a mathematical model of rigidity and flexibility has been established, which can scientifically and rationally realize the scientific configuration of rigidity and flexibility, and has a high degree of design freedom. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of an array-type high aspect ratio component structure for fundamental frequency boosting; Figure 2 This is a structural schematic diagram of an elastic connector.
[0015] The diagram is labeled as follows: Component 1, Component set 2, High stiffness structure 3, Rigid connector 4, Elastic connector 5, Base 51, Elastic element 52, Rigid unit 53. Detailed Implementation
[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0017] Please also refer to Figure 1 and Figure 2 These are schematic diagrams of the array-type high aspect ratio component structure fundamental frequency boosting structure and the elastic connector provided by the present invention.
[0018] The array-type high aspect ratio component structure for fundamental frequency enhancement includes component 1, component set 2, high stiffness structure 3, rigid connector 4, and elastic connector 5.
[0019] Component 1 is a sheet-like component with a large aspect ratio. Multiple components 1 are parallel to each other and arranged sequentially along a straight line to form a linear array. The high-stiffness structure 3 is a concrete structural wall with a structure similar to component 1. Two high-stiffness structures 3 are located at the beginning and end of the linear array, respectively.
[0020] Each group of four adjacent components 1 is designated as component set 2. Within the same component set 2, four adjacent components 1 are connected at their respective side edges by a set of rigid connectors 4. Between adjacent component sets 2, and between two components 1 located at similar end positions in different component sets 2, a set of elastic connectors 5 are connected at their respective side edges.
[0021] In the two component sets 2 located at the ends, the two components 1 located at the very end are connected to the nearby high-rigidity structure 3 on both sides by a set of rigid connectors 4.
[0022] The elastic connector 5 includes a base 51, elastic elements 52, and rigid units 53. One side of the base 51 is a steel plate, which is welded or anchored to the component 1 or the high-rigidity structure 3, and the other side is bolted to both ends of the elastic element 52. The elastic element 52 is an existing product, consisting of a mandrel whose two ends are bolted to the base 1, and is externally wrapped with rubber to provide elasticity. The rigid unit 53 is a steel plate, with each end connected to one of the two elastic elements 52.
[0023] The structure of the rigid connector 4 is similar to that of the elastic connector 5. The elastic element 52 is removed, and the base 51 is directly welded and fixed to the rigid unit 53.
[0024] Methods for improving the fundamental frequency of array-type high aspect ratio component structures include: Step 1: Introduce an external high-rigidity structure 3. In this embodiment, a wall structure similar to component 1 is used; other structures can be selected if space permits.
[0025] Step 2: Record n adjacent components as component sets to form multiple component sets.
[0026] Step 3.1: Rigid connection between adjacent components 1 within the same component set 2.
[0027] Assuming the stiffness of component 1 is k1 and its mass is m1, the fundamental frequency of a single component 1 is:
[0028] Assuming two components 1 are rigidly connected to form component set 2, and the stiffness and mass of each component 1 are consistent, and the axial stiffness of a set of rigid connectors 4 is k2 and the mass is m2, then the fundamental frequency of the structure of component set 2, which includes the two components 1, is:
[0029] Compared to a single component 1, the overall stiffness of the system consisting of two component sets 2 (components 1 and 2) is nearly doubled. However, since the total mass is also doubled, the fundamental frequency of the structure will not be significantly increased. Similarly, the fundamental frequency of a structure consisting of component sets 2 with an increased number of component 1s will not be significantly increased.
[0030] Step 3.2: Rigidly connect any component set 2 to the high-rigidity structure 3.
[0031] Assuming a component 1 is rigidly connected to a high-stiffness structure 3, and the stiffness coefficient of the high-stiffness structure 3 is k0 (k0→∞), the fundamental frequency of the entire structure is:
[0032] Since k0 >> k1, the overall stiffness increases significantly while the overall mass decreases; therefore, the fundamental frequency of the overall structure will increase significantly.
[0033] Therefore, we can conclude that: by using a rigid connection, k0 is maximized, which effectively improves the fundamental frequency of the structure.
[0034] Assume two components 1 are rigidly connected to form component set 2, and one of these components 1 is rigidly connected to a high-stiffness structure 3. Since the overall stiffness of series-connected rigid links tends to decrease, the overall stiffness of n series-connected components is k² / n, and the fundamental frequency of the overall structure is:
[0035] Compared to the case where one component 1 is rigidly connected to the high-stiffness structure 3, the case where two components 1 are rigidly connected to the high-stiffness structure 3 increases the stiffness k1 and mass m1 of one component 1, while k0 remains unchanged. This causes k0 to be distributed across the two components 1. Therefore, as the number of components 1 increases, the overall structural fundamental frequency shows a decreasing trend.
[0036] Therefore, conclusion 2 is drawn: an upper limit for n needs to be reasonably set to construct component set 2. By controlling the selection of n, the contribution of k0 to the fundamental frequency enhancement of component set 2 can be effectively preserved.
[0037] Similarly, n components 1 are rigidly connected to form component set 2, and one of these components 1 is rigidly connected to a high-stiffness structure 3. The fundamental frequency of the structure is:
[0038] Since m1 >> m2, simplifying the above equation, we get:
[0039] Therefore, we can conclude that: due to the small weight of k2, the core function of the elastic unit is to release the thermal deformation of the array of components (or component sets).
[0040] Step 3.3: Elastically connect adjacent component sets 2.
[0041] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A method for enhancing the fundamental frequency of an array-type high aspect ratio component structure, characterized in that, Includes the following steps: Step 1: Introduce an external high-rigidity structure; Step 2: Record n adjacent components as a component set to form one or more component sets; Step 3: Rigid connection between adjacent components within the same component set; any component set is rigidly connected to the high-rigidity structure, and adjacent component sets are elastically connected.
2. The method for enhancing the fundamental frequency of an array-type high aspect ratio component structure according to claim 1, characterized in that: The component is a sheet-like component with a large aspect ratio.
3. The method for enhancing the fundamental frequency of an array-type high aspect ratio component structure according to claim 2, characterized in that: The components are arranged in a linear array.
4. The method for enhancing the fundamental frequency of an array-type high aspect ratio component structure according to claim 3, characterized in that: The high-rigidity structure is a concrete structural wall.
5. The method for enhancing the fundamental frequency of an array-type high aspect ratio component structure according to claim 4, characterized in that: The high-rigidity structure is located near the end of the array and is rigidly connected to a component located at the very end of the array.
6. The method for enhancing the fundamental frequency of an array-type high aspect ratio component structure according to claim 1, characterized in that: As n increases in step 2, the fundamental frequency of the structural components connecting the high-stiffness structure in step 3 decreases.
7. A fundamental frequency boosting structure with arrayed high aspect ratio components, comprising multiple components arranged in a linear array, characterized in that: It also includes multiple high-rigidity structures, in which every n adjacent components in the array are rigidly connected to form a component set, and adjacent component sets are elastically connected to each other. The multiple high-rigidity structures are rigidly connected to the multiple component sets respectively.
8. The array-type high aspect ratio component structure fundamental frequency boosting structure according to claim 7, characterized in that: The high-rigidity structure is located near the beginning and end of the array and is rigidly connected to a component located at the very end of the array.
9. The array-type high aspect ratio component structure fundamental frequency boosting structure according to claim 1, characterized in that: The components are connected to each other, and the component sets are connected to the high-rigidity structure, by rigid connectors; the component sets are connected to each other by elastic connectors.
10. The array-type high aspect ratio component structure fundamental frequency boosting structure according to claim 9, characterized in that: The rigid connector includes a base, a rigid unit, and another base connected in sequence. The elastic connector includes a base, an elastic element, a rigid unit, and another base connected in sequence. The base is rigidly connected to the component.
Citation Information
Patent Citations
Structural optimization design method for improving inherent frequency of large-aperture antenna system
CN115238427A