Sensing lens and housing thereof

Abstract

The invention discloses a sensing lens and a housing thereof. The sensing lens comprises a circuit carrier plate, a sensing module mounted on the circuit carrier plate, and a lens cover fixed on the circuit carrier plate and covering the sensing module. The lens cover includes a bottom frame fixed to the circuit board, a top frame fixed to the bottom frame, and at least one lens mounted in the top frame. The bottom frame comprises at least one unidirectional mirror which is annularly arranged, and the sensing module is positioned in a space surrounded by the at least one unidirectional mirror. When a light ray passes through the at least one lens, enters the space and enters the at least one one-way mirror, the light ray is reflected for multiple times in the at least one one-way mirror. Therefore, the sensing lens can limit the light in the at least one one-way mirror, so as to effectively reduce the glare phenomenon.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of sensing lens, in particular to a sensing lens and a shell thereof. BACKGROUND

[0002] The existing sensing lens often produces flare phenomenon because the light is projected inside the shell, but the existing sensing lens mostly focuses on the structural improvement of the sensing module to expect to reduce the generation of flare phenomenon. Therefore, the applicant believes that the above defects can be improved, and finally proposes the present application by dint of scientific principles. SUMMARY

[0003] The present application provides a sensing lens and a shell thereof, which can effectively improve the defects that may be generated by the existing sensing lens.

[0004] The present application discloses a sensing lens, comprising: a circuit carrier; a sensing module, comprising: a sensing chip, mounted on the circuit carrier and electrically coupled to each other, wherein the top surface of the sensing chip comprises a sensing area and a bearing area outside the sensing area; an annular support layer, arranged in the bearing area and surrounding the outside of the sensing area; and a light-transmitting layer, arranged on the annular support layer; and a lens cover, comprising: a bottom frame, fixed to the circuit carrier and comprising at least one one-way mirror arranged in a ring shape; wherein the sensing module is located in the space surrounded by the at least one one-way mirror; a top frame, fixed to the bottom frame; and at least one lens, mounted in the top frame, and the at least one lens faces the sensing area; wherein the lens cover and the circuit carrier jointly form a layout space in a closed shape, which accommodates the sensing module; wherein when a light passes through the at least one lens and enters the layout space, and is incident into the at least one one-way mirror, the light is reflected multiple times in the at least one one-way mirror.

[0005] Optionally, the number of the at least one one-way mirror is multiple, and the multiple one-way mirrors are connected to each other to jointly form a ring-shaped structure.

[0006] Optionally, the bottom frame comprises multiple light-absorbing adhesive materials, and the inner side of the connection between any two one-way mirrors connected to each other is connected by a light-absorbing adhesive material.

[0007] Optionally, the sensing chip comprises multiple corners, and the positions of the multiple corners correspond to the multiple light-absorbing adhesive materials respectively.

[0008] Optionally, the sensing module comprises a package formed on the circuit carrier, and the sensing chip, the annular support layer, and the light-transmitting layer are all embedded in the package, and the outer surface of the light-transmitting layer is at least partially exposed outside the package.

[0009] Optionally, the sensing module includes multiple metal wires, each of which is connected at both ends to a circuit board and a sensing chip, and each metal wire is at least partially embedded within the package.

[0010] This application also discloses a housing for a sensing lens, comprising: a circuit board; and a lens cover, comprising: a bottom frame fixed to the circuit board and including at least one one-way mirror arranged in a ring; a top frame fixed to the bottom frame; and at least one lens mounted within the top frame; wherein the lens cover and the circuit board together form a closed layout space; wherein when a light passes through at least one lens and enters the layout space and is incident on at least one one-way mirror, the light undergoes multiple reflections within at least one one-way mirror.

[0011] Optionally, the number of at least one one-way mirrors is multiple, and the multiple one-way mirrors are connected to each other to form a ring structure.

[0012] Optionally, the base frame includes multiple light-absorbing adhesive materials, and any two one-way mirrors connected to each other are connected at their joints by a light-absorbing adhesive material on their inner sides.

[0013] Optionally, the circuit board includes a plurality of bonding pads located within the layout space.

[0014] Beneficial effects of the invention

[0015] The sensing lens and its housing disclosed in this application, through the arrangement of at least one of the one-way mirrors, such that light entering the layout space is confined within at least one of the one-way mirrors after incident on it, thereby effectively reducing the generation of glare.

[0016] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the sensing lens according to an embodiment of this application.

[0018] Figure 2 for Figure 1 A schematic diagram of its breakdown.

[0019] Figure 3 for Figure 2 An exploded view of the lens cover.

[0020] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV.

[0021] Figure 5 FIG. 2 is a schematic view of another embodiment of the present application. Figure 4 FIG. 3 is a schematic view of another embodiment of the present application.

[0022] Figure 6 FIG. 4 is a schematic view of another embodiment of the present application. Figure 5 FIG. 5 is a schematic view of another embodiment of the present application.

[0023] Figure 7 FIG. 6 is a schematic view of another embodiment of the present application. Figure 1 FIG. 7 is a schematic view of another embodiment of the present application. DETAILED DESCRIPTION

[0024] The present application is described in detail by specific embodiments of the present application. Those skilled in the art can understand the advantages and effects of the present application from the disclosure of the present specification. The present application can be implemented or applied by other different embodiments, and the details in the present specification can be modified and changed in various ways based on different views and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations and are not actual size depictions. The following embodiments will further illustrate the related technical content of the present application, but the disclosed content is not intended to limit the protection scope of the present application.

[0025] It should be understood that although the terms "first", "second", "third", etc. can be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein can include any combination of one or more associated listed items.

[0026] Referring to FIG. 1, which is an embodiment of the present application. As shown in FIG. 1, the present embodiment discloses a sensing lens 100, which comprises a circuit board 1, a sensing module 2 mounted on the circuit board 1, a lens cover 3 fixed on the circuit board 1 and covering the sensing module 2, and at least one electronic component 4 mounted on the circuit board 1 and located outside the lens cover 3, but the present application is not limited thereto. Figures 1 to 7 Figures 1 to 3 Referring to FIG. 1, which is an embodiment of the present application. As shown in FIG. 1, the present embodiment discloses a sensing lens 100, which comprises a circuit board 1, a sensing module 2 mounted on the circuit board 1, a lens cover 3 fixed on the circuit board 1 and covering the sensing module 2, and at least one electronic component 4 mounted on the circuit board 1 and located outside the lens cover 3, but the present application is not limited thereto.

[0027] ​Wherein, the sensing lens 100 in this embodiment is described as including the above components, and the circuit board 1 and the lens cover 3 can be collectively defined as a housing 10, but the sensing lens 100 can also be adjusted and changed according to actual needs. For example, in other embodiments not shown in this application, the sensing lens 100 can omit at least one of the electronic components 4; or the housing 10 of the sensing lens 100 can be used alone (such as: sold) or in combination with other components.

[0028] As shown in Figures 4 to 7 The circuit board 1 in this embodiment can be a printed circuit board (PCB) or a flexible printed circuit (FPC). Wherein, the circuit board 1 has a first board surface 11 and a second board surface 12 opposite to the first board surface 11, the circuit board 1 forms a chip fixing area 111 and a plurality of bonding pads 112 adjacent to the chip fixing area 111 on the first board surface 11, and a plurality of the bonding pads 112 can be annularly surrounded outside the chip fixing area 111, but not limited to this. For example, in other embodiments not shown in this application, a plurality of the bonding pads 112 can also be arranged in two columns on opposite sides of the chip fixing area 111.

[0029] In addition, the circuit board 1 can further be provided with an electrical connector (not shown in the figure) for mounting, so that the circuit board 1 can be detachably connected to an electronic device (not shown in the figure) through the electrical connector, so that the sensing lens 100 can be mounted and electrically connected to the electronic device.

[0030] The sensing module 2 includes a sensing chip 21 mounted on the circuit board 1, a plurality of metal wires 22 electrically coupled to the sensing chip 21 and the circuit board 1, an annular support layer 23 disposed on the sensing chip 21, a light transmission layer 24 disposed on the annular support layer 23, and a package 25 formed on the circuit board 1.

[0031] It should be noted that the sensing module 2 in this embodiment is described as including the above components, but the sensing module 2 can also be adjusted and changed according to design needs. For example, in other embodiments not shown in this application, the sensing module 2 can omit the package 25 and / or a plurality of the metal wires 22, and the sensing chip 21 is fixed and electrically coupled to the circuit board 1 by flip-chip or die-bonding.

[0032] The sensing chip 21 is square (e.g., rectangular or square) and includes multiple corners 213 in the present embodiment. The sensing chip 21 is illustrated by an image sensing chip, but the present application is not limited thereto. The sensing chip 21 (bottom surface 212) is fixed to the chip fixing area 111 of the circuit board 1 (along a predetermined direction D and through die bonding glue); that is, the sensing chip 21 is located inside the multiple bonding pads 112.

[0033] Furthermore, a top surface 211 of the sensing chip 21 includes a sensing area 2111 and a bearing area 2112 surrounding the sensing area 2111 (and annular). Both ends of each metal wire 22 are connected to the circuit board 1 and the bearing area 2112 of the sensing chip 21, respectively, so that the circuit board 1 and the sensing chip 21 are electrically coupled to each other.

[0034] In more detail, the sensing chip 21 includes multiple connection pads 2113 located in the bearing area 2112 (that is, the multiple connection pads 2113 are located outside the sensing area 2111). The number and position of the multiple connection pads 2113 of the sensing chip 21 correspond to the number and position of the multiple bonding pads 112 of the circuit board 1, respectively, in the present embodiment; that is, the multiple connection pads 2113 are also roughly arranged in a ring shape in the present embodiment. Furthermore, both ends of each metal wire 22 are connected to one bonding pad 112 and the corresponding connection pad 2113, respectively.

[0035] The annular support layer 23 is disposed on the bearing area 2112 of the sensing chip 21 and surrounds the outside of the sensing area 2111. In the present embodiment, the annular support layer 23 is located inside the multiple metal wires 22 and does not contact any metal wire 22 (that is, each metal wire 22 is located outside the annular support layer 23 and is completely embedded in the encapsulant 25), but the present application is not limited thereto. For example, as shown in Figure 6 Each metal wire 22 can have a part embedded in the annular support layer 23, and the remaining part of each metal wire 22 is embedded in the encapsulant 25.

[0036] The light-transmissive layer 24 is illustrated by a flat glass in the present embodiment, but the present application is not limited thereto. The light-transmissive layer 24 has an outer surface 241 and an inner surface 242 on opposite sides, and the light-transmissive layer 24 (with the inner surface 242) is disposed on the annular support layer 23, so that the inner surface 242 of the light-transmissive layer 24, the annular support layer 23, and the top surface 211 of the sensing chip 21 collectively enclose a closed space E.

[0037] The package 25 is opaque to visible light in the present embodiment. The package 25 is illustrated by a liquid encapsulation, and the package 25 is formed on the first board surface 11 of the circuit board 1 and has edges flush with the edges of the circuit board 1. At least part of each metal wire 22, the sensing chip 21, the annular support layer 23, and the light-transmissive layer 24 are embedded in the package 25, and at least part of the outer surface 241 of the light-transmissive layer 24 is exposed outside the package 25, but the present application is not limited thereto.

[0038] The lens cover 3 and the circuit board 1 collectively enclose a layout space S in a closed manner, which accommodates the sensing module 2 (and the plurality of bonding pads 112) therein. Further, at least one electronic component 4 is located outside the layout space S, and at least one electronic component 4 can be electrically coupled to the sensing module 2 through the circuit board 1, but the present application is not limited thereto.

[0039] In more detail, the lens cover 3 includes a bottom frame 31, a top frame 32 fixed to the bottom frame 31, and at least one lens 33 mounted in the top frame 32. The fixing manner between the bottom frame 31 and the top frame 32 can be adjusted and changed according to actual needs, for example, the bottom frame 31 and the top frame 32 can be embedded and bonded with each other to achieve the fixed effect.

[0040] Further, the bottom frame 31 is fixed to the circuit board 1 and includes at least one one-way mirror 311 arranged in a ring shape, and the sensing module 2 is located in a space surrounded by at least one one-way mirror 311, but the sensing module 2 (such as the package 25) is preferably not touched at least one one-way mirror 311.

[0041] As described above, when a light ray L enters the layout space S through at least one of the lenses 33 and is incident on at least one of the one-way mirrors 311, the light ray L is reflected multiple times within at least one of the one-way mirrors 311. In this way, after being incident on at least one of the one-way mirrors 311, the light ray L entering the layout space S is confined within at least one of the one-way mirrors 311, effectively reducing the occurrence of glare. In addition, external light rays cannot enter the layout space S from the outside of at least one of the one-way mirrors 311.

[0042] In this embodiment, the lens cover 3 is fixed to the first plate surface 11 of the circuit board 1 by at least one of the one-way mirrors 311, and the inner side and the outer side of at least one of the one-way mirrors 311 are not covered by other components. That is, at least one of the one-way mirrors 311 has the function of supporting the top frame 32 and at least one of the lenses 33, and at least one of the lenses 33 faces the sensing area 2111.

[0043] It should be noted that the structure of the bottom frame 31 can be variously changed according to actual needs, and for the sake of understanding, only one of the preferred structures of the bottom frame 31 is introduced below. In this embodiment, the bottom frame 31 includes a plurality of light-absorbing adhesive materials 312, and the number of at least one of the one-way mirrors 311 included in the bottom frame 31 is a plurality, and the plurality of one-way mirrors 311 (through the plurality of light-absorbing adhesive materials 312) are connected to each other to form a ring structure.

[0044] Further, the inner side of the connection between any two one-way mirrors 311 is connected by one light-absorbing adhesive material 312, and the positions of the plurality of corners 213 of the sensing chip 21 correspond to the plurality of light-absorbing adhesive materials 312, respectively, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, any two one-way mirrors 311 can also be connected by other components or means; or the number of at least one of the one-way mirrors 311 included in the bottom frame 31 is one, and the one-way mirror 311 is in a ring structure, thereby being able to omit the plurality of light-absorbing adhesive materials 312.

[0045] The technical effects of the embodiments of the present application are summarized above. The sensor packaging structure and its shell disclosed in the embodiments of the present application are provided with at least one one-way mirror, so that after a light ray entering the layout space is incident on at least one one-way mirror, the light ray is confined within at least one one-way mirror, effectively reducing the occurrence of glare.

[0046] The above disclosed content is only the preferred feasible embodiments of the present application, and does not limit the patent scope of the present application, so any equivalent technical changes made according to the content of the present application and drawings are included in the patent scope of the present application.

Claims

1. A sensing lens, characterized in that, The sensing lens includes: A circuit board; A sensing module, comprising: A sensing chip is mounted on the circuit board and electrically coupled to each other; wherein, the top surface of the sensing chip includes a sensing area and a bearing area located outside the sensing area; A ring-shaped support layer is disposed in the bearing area and surrounds the outside of the sensing area; and A light-transmitting layer is disposed on the annular support layer; and A lens cover, comprising: A base frame, fixed to the circuit board, includes at least one one-way mirror arranged in a ring; wherein the sensing module is located within the space surrounded by at least one one-way mirror; A top frame, fixed to the bottom frame; and At least one lens is mounted within the top frame, and at least one of the lenses faces the sensing area; wherein the lens cover and the circuit board together form a closed layout space that accommodates the sensing module therein; When a ray of light passes through at least one of the lenses and enters the layout space, and then enters at least one of the one-way mirrors, the ray of light undergoes multiple reflections within at least one of the one-way mirrors.

2. The sensing lens according to claim 1, characterized in that, The number of at least one of the one-way mirrors is multiple, and the multiple one-way mirrors are connected to each other to form a ring structure.

3. The sensing lens according to claim 2, characterized in that, The base frame includes a plurality of light-absorbing adhesive materials, and any two of the one-way mirrors connected to each other are connected at their joint by one of the light-absorbing adhesive materials.

4. The sensing lens according to claim 3, characterized in that, The sensing chip has multiple corners, and the positions of the multiple corners correspond to the multiple light-absorbing adhesives.

5. The sensing lens according to claim 1, characterized in that, The sensing module includes a package formed on the circuit board, and the sensing chip, the annular support layer, and the light-transmitting layer are all embedded within the package, and the outer surface of the light-transmitting layer is at least partially exposed outside the package.

6. The sensing lens according to claim 5, characterized in that, The sensing module includes multiple metal wires, each of which is connected at both ends to the circuit board and the sensing chip, and at least partially embedded within the package.

7. A housing for a sensing lens, characterized in that, The housing of the sensing lens includes: a circuit board; and A lens cover, comprising: A base frame, fixed to the circuit board, includes at least one one-way mirror arranged in a ring; A top frame, fixed to the bottom frame; and At least one lens is mounted within the top frame; wherein the lens cover and the circuit board together form a closed layout space. When a ray of light passes through at least one of the lenses and enters the layout space, and then enters at least one of the one-way mirrors, the ray of light undergoes multiple reflections within at least one of the one-way mirrors.

8. The housing of the sensing lens according to claim 7, characterized in that, The number of at least one of the one-way mirrors is multiple, and the multiple one-way mirrors are connected to each other to form a ring structure.

9. The housing of the sensing lens according to claim 8, characterized in that, The base frame includes a plurality of light-absorbing adhesive materials, and any two of the one-way mirrors connected to each other are connected at their joint by one of the light-absorbing adhesive materials.

10. The housing of the sensing lens according to claim 7, characterized in that, The circuit board includes a plurality of bonding pads located within the layout space.

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