Tracker circuit, integrated circuit, and amplification method

Abstract

This tracker circuit (1) is provided with: a voltage generation circuit (60) configured so as to generate a plurality of discrete voltages on the basis of an input voltage; and a power supply modulation circuit (30) configured to select a voltage from the plurality of discrete voltages and simultaneously output the selected voltage to a power amplifier (71) configured to be connected to the antenna (3) and amplify the millimeter wave signal, and a power amplifier (72) configured to be connected to an antenna (4) different from the antenna (3) and amplify the millimeter wave signal.

Description

TECHNICAL FIELD

[0001] The present application relates to a tracker circuit, an integrated circuit, and an amplification method. BACKGROUND

[0002] In recent years, improvement in power added efficiency has been achieved by applying an envelope tracking (ET) mode in a power amplifier circuit. A tracker circuit for digital envelope tracking (D-ET) is disclosed in Patent Literature 1.

[0003] Patent Literature 1: U.S. Patent No. 8829993

[0004] It is desired to realize a small tracker circuit that can improve power added efficiency by a plurality of power amplifiers that can amplify millimeter wave signals. SUMMARY

[0005] Therefore, the present application provides a small tracker circuit that can improve power added efficiency by a plurality of power amplifiers that can amplify millimeter wave signals, and an integrated circuit and an amplification method that can contribute to the miniaturization of the tracker circuit.

[0006] The tracker circuit according to an aspect of the present application includes: a first power amplifier configured to be connected to a first antenna and amplify a millimeter wave signal; a second power amplifier configured to be connected to a second antenna different from the first antenna and amplify the millimeter wave signal; a voltage generation circuit configured to generate a plurality of discrete voltages based on an input voltage; and a power supply modulation circuit configured to select a voltage from the plurality of discrete voltages and simultaneously output the selected voltage to the first power amplifier and the second power amplifier.

[0007] The integrated circuit according to an aspect of the present application includes: a first external connection terminal and a second external connection terminal; at least one switch included in a voltage generation circuit configured to generate a plurality of discrete voltages based on an input voltage; and at least one switch included in a power supply modulation circuit configured to select a voltage from the plurality of discrete voltages and simultaneously output the selected voltage to the first external connection terminal and the second external connection terminal.

[0008] In the amplification method according to an aspect of the present application, a plurality of discrete voltages are generated based on an input voltage, a voltage is selected from the plurality of discrete voltages based on an envelope signal of a millimeter wave signal, the selected voltage is simultaneously supplied to a first power amplifier and a second power amplifier, and the first power amplifier and the second power amplifier amplify the millimeter wave signal using the supplied voltage and output to different antennas, respectively.

[0009] According to the present application, power addition efficiency can be improved by a plurality of power amplifiers capable of amplifying millimeter wave signals, and miniaturization of a tracker circuit can be facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1A is a graph showing an example of the change in power supply voltage in the APT (Average Power Tracking) mode.

[0011] Figure 1B is a graph showing an example of the change in power supply voltage in the AET (Analog Envelope Tracking) mode.

[0012] Figure 1C is a graph showing an example of the change in power supply voltage in the D-ET mode.

[0013] Figure 2 is a circuit configuration diagram of the communication device according to Embodiment 1.

[0014] Figure 3 is a circuit configuration diagram of the tracker circuit according to Embodiment 1.

[0015] Figure 4 is a plan view of the high-frequency module according to Embodiment 1.

[0016] Figure 5 is a sectional view of the high-frequency module according to Embodiment 1.

[0017] Figure 6 is a flowchart showing the amplification method according to Embodiment 1.

[0018] Figure 7A is a circuit configuration diagram of the first voltage adjustment circuit according to Embodiment 2.

[0019] Figure 7B is a circuit configuration diagram of the second voltage adjustment circuit according to Embodiment 2.

[0020] Figure 8 is a plan view of the high-frequency module according to Embodiment 3.

[0021] Figure 9 is a plan view of the high-frequency module according to Embodiment 3.

[0022] Figure 10 is a sectional view of the high-frequency module according to Embodiment 3. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the embodiments described below are general or specific examples. The numerical values, shapes, materials, constituent elements, arrangements of constituent elements, and connection methods shown in the following embodiments are examples and are not intended to limit the scope of the present invention.

[0024] The figures are schematic diagrams that have been appropriately emphasized, omitted, or proportionally adjusted for the purpose of illustrating the invention. They are not necessarily strictly illustrated structures and may differ from actual shapes, positional relationships, and proportions. In the figures, substantially identical structures are labeled with the same reference numerals, and sometimes repeated descriptions are omitted or simplified.

[0025] In the following figures, the x-axis and y-axis are mutually orthogonal axes on a plane parallel to the main surface of the module substrate. Specifically, when the module substrate is rectangular in top view, the x-axis is parallel to the first side of the module substrate, and the y-axis is parallel to the second side of the module substrate orthogonal to the first side. Additionally, the z-axis is perpendicular to the main surface of the module substrate, with its positive direction representing the upward direction and its negative direction representing the downward direction.

[0026] In the following description, the term "connection" includes not only direct connections via connection terminals and / or wiring conductors, but also connections via other circuit elements. A "direct connection" refers to a direct connection via connection terminals and / or wiring conductors without the use of other circuit elements. "C connected between A and B" means that one end of C is connected to A, and the other end of C is connected to B; it means that C is connected in series in the path connecting A and B. "The path connecting A and B" refers to the path formed by the conductors that electrically connect A and B.

[0027] A "terminal" refers to the point where a conductor within an element ends. Furthermore, when the impedance of the conductors between elements is sufficiently low, a terminal can be interpreted not only as a single point, but also as any point on the conductors between elements or the entire conductor.

[0028] The term "component disposed on a substrate" includes components disposed on the main surface of the substrate and components disposed within the substrate. "Component disposed on the main surface of the substrate" includes not only components disposed in contact with the main surface of the substrate, but also components disposed above the main surface without contact (e.g., components stacked on top of other components disposed in contact with the main surface). Additionally, "component disposed on the main surface of the substrate" can also include components disposed in recesses formed on the main surface. "Component disposed within the substrate" includes not only components encapsulated within a module substrate, but also components entirely disposed between two main surfaces of the substrate but with a portion of the component not covered by the substrate, and components with only a portion of the component disposed within the substrate.

[0029] "B is closer to A than C" means that the distance between A and B is shorter than the distance between A and C. Here, "the distance between A and B" refers to the shortest distance between A and B. In other words, "the distance between A and B" is the length of the shortest line segment among multiple line segments connecting any point on the surface of A and any point on the surface of B.

[0030] Terms like "parallel" and "perpendicular" that indicate the relationship between elements, and terms like "rectangle" that indicate the shape of elements, along with numerical ranges, mean not only strict but also substantially the same range, such as an error of a few percent.

[0031] Before describing the implementation method, the technique for efficiently amplifying high-frequency signals, namely the tracking mode, will be explained here. In the tracking mode, a power supply voltage that is dynamically adjusted based on the elapsed time of the high-frequency signal is supplied to the power amplifier. There are several types of tracking modes; here, refer to... Figures 1A-1C It also explains the APT, A-ET, and D-ET modes. Figures 1A-1C In the diagram, the horizontal axis represents time, and the vertical axis represents voltage. Additionally, the thick solid line represents the power supply voltage, and the thin solid line (waveform) represents the modulation signal.

[0032] Figure 1A This is a graph illustrating an example of power supply voltage shifts in APT mode. In APT mode, the power supply voltage is varied into multiple discrete voltage levels per frame, based on average power.

[0033] A frame is a unit that constitutes a high-frequency signal (modulated signal). For example, in 5G NR (5th Generation New Radio) and LTE (Long Term Evolution), a frame contains 10 subframes, each subframe contains multiple slots, and each slot consists of multiple symbols. The subframe length is 1ms, and the frame length is 10ms.

[0034] In addition, the mode that varies the voltage level based on the average power in units of 1 frame or larger than 1 frame is called the APT mode, which is distinguished from the mode that varies the voltage level in units smaller than 1 frame (such as subframes, slots, or symbol units).

[0035] Figure 1B This is a graph illustrating an example of power supply voltage shifts in A-ET mode. In A-ET mode, the power supply voltage is continuously varied based on the envelope signal to track the envelope of the modulated signal.

[0036] The envelope signal is the signal that represents the envelope of the modulated signal. The envelope value is, for example, derived from (I... 2 +Q 2The square root of (I, Q) represents the constellation point. A constellation point is a point on a constellation diagram that represents the digitally modulated signal. (I, Q) is, for example, determined by the BBIC (Baseband Integrated Circuit) based on the transmitted information.

[0037] Figure 1C This is a graph illustrating an example of power supply voltage shifts in D-ET mode. In D-ET mode, the power supply voltage is varied into multiple discrete voltage levels within one frame, based on the envelope signal, thereby tracking the envelope of the modulated signal. In other words, in D-ET, the power supply voltage varies at shorter time intervals than in APT.

[0038] (Implementation Method 1)

[0039] The following describes Embodiment 1. The communication device 5 described in this embodiment can be used to provide wireless connectivity. For example, the communication device 5 can be installed in a user equipment (UE) within a cellular network (also called a mobile network) of mobile phones, smartphones, tablets, wearable devices, etc. In other examples, by installing the communication device 5, wireless connectivity can be provided to IoT (Internet of Things) sensor devices, medical / healthcare devices, vehicles, unmanned aerial vehicles (UAVs), and automated guided vehicles (AGVs). Furthermore, in other examples, by installing the communication device 5, wireless connectivity can also be provided using a wireless access point or a wireless hotspot.

[0040] Communication device 5 uses millimeter-wave signals for transmission. Millimeter-wave signals are signals in the frequency band encompassing the range of 30 GHz to 300 GHz. In communication device 5, multiple antennas are used for transmitting millimeter-wave signals in order to achieve beamforming or beam control, etc.

[0041] [1.1 Circuit structure of communication device 5]

[0042] Reference Figure 2 The circuit structure of the communication device 5 involved in this embodiment will be described. Figure 2 This is a circuit diagram of the communication device 5 involved in this embodiment.

[0043] also, Figure 2 The circuit structure shown is illustrative; the communication device 5 can be installed using a variety of circuit mounting methods and any of the circuit technologies employed. Therefore, the following description of the communication device 5 should not be interpreted in a limiting way.

[0044] The communication device 5 according to this embodiment includes a tracker circuit 1, an RFIC (Radio Frequency Integrated Circuit) 2, an antenna 3, and an antenna 4. Alternatively, the communication device 5 may not include the antenna 3 and / or 4.

[0045] Tracker circuit 1 can simultaneously supply power voltages (Vcc1 and Vcc2) to power amplifiers 71 and 72 included in RFIC2. Based on the envelope signal of the millimeter-wave signal amplified by power amplifiers 71 and 72, the power supply voltage (Vcc1 and Vcc2) is selected from multiple discrete voltages. Figure 3 The circuit structure of tracker circuit 1 will be described later.

[0046] RFIC2 amplifies the millimeter-wave input transmit signal (RFin) and outputs it to antennas 3 and 4. RFIC2 can also amplify and output the millimeter-wave input receive signal (RFout) from antennas 3 and 4. The circuit structure of RFIC2 will be described later.

[0047] Antennas 3 and 4 are examples of a first antenna and a second antenna, respectively, capable of transmitting millimeter-wave signals supplied from RFIC2 to the outside. Additionally, antennas 3 and 4 can also supply millimeter-wave signals received from the outside to RFIC2. Furthermore, the communication device 5 may include more than one antenna besides antennas 3 and 4. Millimeter-wave signals with the same data in the same frequency band can be transmitted from antennas 3 and 4. In this case, the phase and / or polarization direction of the two millimeter-wave signals transmitted from antennas 3 and 4 may also be different.

[0048] [1.2 Circuit Structure of RFIC2]

[0049] Next, refer to Figure 2 The circuit structure of the RFIC2 included in the communication device 5 is described. The RFIC2 includes power amplifiers 71 and 72, low-noise amplifiers 73 and 74, external connection terminals 75 and 76, switching circuits 77 and 78, and phase shifting circuits 79 to 82.

[0050] Power amplifier 71, an example of a first power amplifier, is connected to antenna 3. Specifically, the input of power amplifier 71 is connected to phase shift circuit 79, and the output of power amplifier 71 is connected to antenna 3 via switching circuit 77. Power amplifier 71 is also connected to tracker circuit 1 via external connection terminal 75. Power amplifier 71 can amplify the millimeter-wave band transmission signal supplied via phase shift circuit 79 using the power supply voltage (Vcc1) supplied from tracker circuit 1.

[0051] Power amplifier 72, an example of a second power amplifier, is connected to antenna 4. Specifically, the input of power amplifier 72 is connected to phase shift circuit 81, and the output of power amplifier 72 is connected to antenna 4 via switching circuit 78. Power amplifier 72 is also connected to tracker circuit 1 via external connection terminal 76. Power amplifier 72 can amplify the millimeter-wave band transmission signal supplied via phase shift circuit 81 using the power supply voltage (Vcc2) supplied from tracker circuit 1.

[0052] The low-noise amplifier 73 is connected to the antenna 3. Specifically, the input of the low-noise amplifier 73 is connected to the antenna 3 via a switching circuit 77, and the output of the low-noise amplifier 73 is connected to the phase-shifting circuit 80. The low-noise amplifier 73 can amplify the millimeter-wave band received signal received via the antenna 3. Alternatively, the low-noise amplifier 73 may not be included in the RFIC2.

[0053] The low-noise amplifier 74 is connected to the antenna 4. Specifically, the input of the low-noise amplifier 74 is connected to the antenna 4 via a switching circuit 78, and the output of the low-noise amplifier 74 is connected to the phase-shifting circuit 82. The low-noise amplifier 74 can amplify the millimeter-wave band received signal received via the antenna 4. Alternatively, the low-noise amplifier 74 may not be included in the RFIC2.

[0054] External connection terminals 75 and 76 are input terminals for receiving power supply voltages (Vcc1 and Vcc2) from tracker circuit 1, respectively. External connection terminals 75 and 76 are externally connected to external connection terminals 61 and 62 of tracker circuit 1, respectively, and internally connected to power amplifiers 71 and 72, respectively.

[0055] Switching circuit 77 is connected between antenna 3 and power amplifier 71 and low noise amplifier 73. Switching circuit 77 is composed of SPDT (Single-Pole Double-Throw) type switching circuit, which can switch the connection of antenna 3 between power amplifier 71 and low noise amplifier 73.

[0056] A switching circuit 78 is connected between the antenna 4 and the power amplifier 72 and the low-noise amplifier 74. The switching circuit 78 is composed of an SPDT-type switching circuit, which can switch the connection of the antenna 4 between the power amplifier 72 and the low-noise amplifier 74.

[0057] Phase shift circuits 79 and 81 are connected to the inputs of power amplifiers 71 and 72, respectively, and can adjust the phase of the millimeter-wave signal (RFin). Phase shift circuits 80 and 82 are connected to the outputs of low-noise amplifiers 73 and 74, respectively, and can adjust the phase of the millimeter-wave signal (RFout). Alternatively, phase shift circuits 79 to 82 may not be included in RFIC2.

[0058] [1.3 Circuit structure of tracker circuit 1]

[0059] Next, refer to Figure 3 The circuit structure of the tracker circuit 1 included in the communication device 5 is described. Figure 3 This is a circuit structure diagram of the tracker circuit 1 involved in this embodiment.

[0060] also, Figure 3 The circuit structure shown is illustrative. Tracker circuit 1 can be installed using a variety of circuit mounting methods and any of the circuit techniques employed. Therefore, the following description of tracker circuit 1 should not be interpreted in a restrictive manner.

[0061] The tracker circuit 1 includes: a voltage generation circuit 60 comprising a pre-tuning circuit 10 and a switched capacitor circuit 20; a power modulation circuit 30; voltage adjustment circuits 41 and 42; a digital control circuit 50; and external connection terminals 61 and 62. Alternatively, the tracker circuit 1 may not include the pre-tuning circuit 10.

[0062] The pre-regulator circuit 10 is sometimes referred to as a magnetic regulator or a DC (Direct Current) / DC converter. In this embodiment, the pre-regulator circuit 10 is an input-output buck-boost converter capable of converting the input voltage (Vbat) into an output voltage (adjustment voltage). The pre-regulator circuit 10 can, for example, adjust the output voltage based on a digital control signal from RFIC2. The adjusted voltage is supplied to the switched capacitor circuit 20. Alternatively, the pre-regulator circuit 10 can also be a buck converter or a boost converter.

[0063] The switched capacitor circuit 20 can generate multiple discrete voltages based on the adjustment voltage supplied from the pre-adjuster circuit 10. The generated multiple discrete voltages are supplied to the power modulation circuit 30.

[0064] The voltage generation circuit 60 includes a pre-adjuster circuit 10 and a switched capacitor circuit 20, capable of generating multiple discrete voltages based on the input voltage (Vbat). Furthermore, the voltage generation circuit 60 can be any circuit structure as long as it can generate multiple discrete voltages based on the input voltage (Vbat), and is not limited to any specific type. Figure 3The circuit structure is as follows. For example, the voltage generation circuit 60 may include multiple pre-adjuster circuits 10, or it may not include the switched capacitor circuit 20.

[0065] The power modulation circuit 30 can selectively and simultaneously output at least one of a plurality of discrete voltages generated by the switched capacitor circuit 20 to power amplifiers 71 and 72. That is, the power modulation circuit 30 can select at least one voltage from a plurality of discrete voltages and supply the selected voltage to power amplifiers 71 and 72 simultaneously.

[0066] The voltage adjustment circuit 41 is connected between the power modulation circuit 30 and the external connection terminal 61. The voltage adjustment circuit 41 can adjust the level of the power supply voltage (Vcc1) supplied to the power amplifier 71. Alternatively, the voltage adjustment circuit 41 may not be included in the tracker circuit 1.

[0067] The voltage adjustment circuit 42 is connected between the power modulation circuit 30 and the external connection terminal 62. The voltage adjustment circuit 42 can adjust the level of the power supply voltage (Vcc2) supplied to the power amplifier 72. Alternatively, the voltage adjustment circuit 42 may not be included in the tracker circuit 1.

[0068] External connection terminal 61 is an example of a first external connection terminal and is an output terminal for supplying power supply voltage (Vcc1) to power amplifier 71. External connection terminal 61 is externally connected to external connection terminal 75 of RFIC2 and internally connected to power modulation circuit 30 via voltage adjustment circuit 41.

[0069] External connection terminal 62 is an example of a second external connection terminal and is an output terminal for supplying power supply voltage (Vcc2) to power amplifier 72. External connection terminal 62 is externally connected to external connection terminal 76 of RFIC2 and internally connected to power modulation circuit 30 via voltage adjustment circuit 42.

[0070] The digital control circuit 50 can control the pre-tuner circuit 10, the switched capacitor circuit 20, the power modulation circuit 30, and the voltage adjustment circuits 41 and 42 based on the digital control signals from RFIC2. Alternatively, the digital control circuit 50 may not be included in the tracker circuit 1.

[0071] Furthermore, the circuit structure of tracker circuit 1 is illustrative and not limited thereto. For example, tracker circuit 1 may also include a pulse shaping network (PSN) connected between power modulation circuit 30 and external connection terminals 61 and / or 62.

[0072] [1.3.1 Circuit structure of preset circuit 10]

[0073] Next, refer to Figure 3 The detailed circuit structure of the pre-tuning circuit 10 included in the tracker circuit 1 is described. The pre-tuning circuit 10 includes an input terminal T11, an output terminal T12, switches S11 to S14, a power inductor L11, and a capacitor C11.

[0074] Input terminal T11 is used to receive input voltage (Vbat). Input terminal T11 can be connected to an external DC power supply, for example, or internally to switch S11.

[0075] Output terminal T12 is used to supply an adjustment voltage to the switched capacitor circuit 20. Output terminal T12 is externally connected to input terminal T20 of the switched capacitor circuit 20 and internally connected to switch S13.

[0076] Power inductor L11 is used for boosting and bucking the input voltage (Vbat). One end of power inductor L11 is connected to switches S11 and S12, and the other end of power inductor L11 is connected to switches S13 and S14.

[0077] Switch S11 is connected between input terminal T11 and one end of power inductor L11. In this connection structure, switch S11 can switch the connection or disconnection between input terminal T11 and one end of power inductor L11 by switching it on and off.

[0078] Switch S12 is connected between one end of the power inductor L11 and ground. In this connection structure, switch S12 can switch the connection or disconnection between one end of the power inductor L11 and ground by switching it on and off.

[0079] Switch S13 is connected between the other end of power inductor L11 and output terminal T12. In this connection structure, switch S13 can switch the connection or disconnection between the other end of power inductor L11 and output terminal T12 by switching it on and off.

[0080] Switch S14 is connected between the other end of power inductor L11 and ground. In this connection structure, switch S14 can switch the connection or disconnection between the other end of power inductor L11 and ground by switching it on and off.

[0081] Capacitor C11 is connected between the path between switch S13 and output terminal T12 and ground. Specifically, one of the two electrodes of capacitor C11 is connected to switch S13 and output terminal T12, and the other of the two electrodes of capacitor C11 is connected to ground.

[0082] also, Figure 3The structure of the pre-tuner circuit 10 shown is an example and is not limited thereto. For example, a portion of switches S11 to S14 can be replaced with diodes. In addition, part or all of the pre-tuner circuit 10 may not be included in the tracker circuit 1.

[0083] [1.3.2 Circuit structure of switched capacitor circuit 20]

[0084] Next, refer to Figure 3 The detailed circuit structure of the switched capacitor circuit 20 included in the tracker circuit 1 is described.

[0085] The switched capacitor circuit 20 has a ladder-shaped circuit structure and can generate multiple discrete voltages (V1 to V4). Specifically, the switched capacitor circuit 20 includes capacitors C20 to C29, switches S20 to S2F, input terminal T20, and output terminals T21 to T24. Energy and charge are input from the pre-tuner circuit 10 to node N3 via input terminal T20, and are led out from nodes N1 to N4 to power modulation circuit 30 via output terminals T21 to T24.

[0086] Input terminal T20 is used to receive the adjusted voltage from the pre-adjustment circuit 10. Input terminal T20 is externally connected to the pre-adjustment circuit 10 and internally connected to node N3. Furthermore, the node to which input terminal T20 can be connected is not limited to node N3. Input terminal T20 can also be connected to any of nodes N1 to N4.

[0087] Output terminal T21 is used to supply voltage (V1) from a plurality of discrete voltages (V1 to V4) to the power modulation circuit 30. Output terminal T21 is externally connected to the power modulation circuit 30 and internally connected to node N1.

[0088] Output terminal T22 is used to supply voltage (V2) from a plurality of discrete voltages (V1 to V4) to the power modulation circuit 30. Output terminal T22 is externally connected to the power modulation circuit 30 and internally connected to node N2.

[0089] Output terminal T23 is used to supply voltage (V3) from a plurality of discrete voltages (V1 to V4) to the power modulation circuit 30. Output terminal T23 is externally connected to the power modulation circuit 30 and internally connected to node N3.

[0090] Output terminal T24 is used to supply voltage (V4) from a plurality of discrete voltages (V1 to V4) to the power modulation circuit 30. Output terminal T24 is externally connected to the power modulation circuit 30 and internally connected to node N4.

[0091] Capacitors C20 to C25 are flying capacitors (sometimes called transfer capacitors) used to boost and buck the adjustment voltage (V3) supplied from the pre-adjuster circuit 10. More specifically, capacitors C20 to C25 cause charge to move between capacitors C20 to C25 and nodes N1 to N4 and ground, so that at the four nodes N1 to N4, V1 to V4 are maintained at (V4-V3):(V3-V2):(V2-V1):(V1-VG) = 1:1:1:1 and V4 > V3 > V2 > V1 > VG. VG represents the ground potential.

[0092] One of the two electrodes of capacitor C20 is connected to one end of switch S20 and one end of switch S21. The other two electrodes of capacitor C20 are connected to one end of switch S24 and one end of switch S25.

[0093] One of the two electrodes of capacitor C21 is connected to one end of switch S22 and one end of switch S23. The other two electrodes of capacitor C21 are connected to one end of switch S26 and one end of switch S27.

[0094] One of the two electrodes of capacitor C22 is connected to one end of switch S24 and one end of switch S25. The other two electrodes of capacitor C22 are connected to one end of switch S28 and one end of switch S29.

[0095] One of the two electrodes of capacitor C23 is connected to one end of switch S26 and one end of switch S27. The other two electrodes of capacitor C23 are connected to one end of switch S2A and one end of switch S2B.

[0096] One of the two electrodes of capacitor C24 is connected to one end of switch S28 and one end of switch S29. The other two electrodes of capacitor C24 are connected to one end of switch S2C and one end of switch S2D.

[0097] One of the two electrodes of capacitor C25 is connected to one end of switch S2A and one end of switch S2B. The other two electrodes of capacitor C25 are connected to one end of switch S2E and one end of switch S2F.

[0098] Capacitors C26 to C29 are smoothing capacitors used to maintain and smooth the voltage (V1 to V4) in nodes N1 to N4.

[0099] Capacitor C26 is connected between node N1 and ground. Specifically, one of the two electrodes of capacitor C26 is connected to node N1. On the other hand, the other electrode of capacitor C26 is connected to ground.

[0100] Capacitor C27 is connected between nodes N1 and N2. Specifically, one of the two electrodes of capacitor C27 is connected to node N2. On the other hand, the other two electrodes of capacitor C27 are connected to node N1.

[0101] Capacitor C28 is connected between nodes N2 and N3. Specifically, one of the two electrodes of capacitor C28 is connected to node N3. On the other hand, the other two electrodes of capacitor C28 are connected to node N2.

[0102] Capacitor C29 is connected between nodes N3 and N4. Specifically, one of the two electrodes of capacitor C29 is connected to node N4. On the other hand, the other two electrodes of capacitor C29 are connected to node N3.

[0103] Switch S20 is connected between capacitor C20 and ground. Specifically, one end of switch S20 is connected to one of the two electrodes of capacitor C20. On the other hand, the other end of switch S20 is connected to ground.

[0104] Switch S21 is connected between capacitor C20 and node N1. Specifically, one end of switch S21 is connected to one of the two electrodes of capacitor C20. On the other hand, the other end of switch S21 is connected to node N1.

[0105] Switch S22 is connected between capacitor C21 and ground. Specifically, one end of switch S22 is connected to one of the two electrodes of capacitor C21. On the other hand, the other end of switch S22 is connected to ground.

[0106] Switch S23 is connected between capacitor C21 and node N1. Specifically, one end of switch S23 is connected to one of the two electrodes of capacitor C21. On the other hand, the other end of switch S23 is connected to node N1.

[0107] Switch S24 is connected between capacitors C20 and C22 and node N1. Specifically, one end of switch S24 is connected to the other side of the two electrodes of capacitor C20 and one side of the two electrodes of capacitor C22. On the other hand, the other end of switch S24 is connected to node N1.

[0108] Switch S25 is connected between capacitors C20 and C22 and node N2. Specifically, one end of switch S25 is connected to the other two electrodes of capacitor C20 and one of the two electrodes of capacitor C22. On the other hand, the other end of switch S25 is connected to node N2.

[0109] Switch S26 is connected between capacitors C21 and C23 and node N1. Specifically, one end of switch S26 is connected to the other side of the two electrodes of capacitor C21 and one side of the two electrodes of capacitor C23. On the other hand, the other end of switch S26 is connected to node N1.

[0110] Switch S27 is connected between capacitors C21 and C23 and node N2. Specifically, one end of switch S27 is connected to the other side of the two electrodes of capacitor C21 and one side of the two electrodes of capacitor C23. On the other hand, the other end of switch S27 is connected to node N2.

[0111] Switch S28 is connected between capacitors C22 and C24 and node N2. Specifically, one end of switch S28 is connected to the other side of the two electrodes of capacitor C22 and one side of the two electrodes of capacitor C24. On the other hand, the other end of switch S28 is connected to node N2.

[0112] Switch S29 is connected between capacitors C22 and C24 and node N3. Specifically, one end of switch S29 is connected to the other side of the two electrodes of capacitor C22 and one side of the two electrodes of capacitor C24. On the other hand, the other end of switch S29 is connected to node N3.

[0113] Switch S2A is connected between capacitors C23 and C25 and node N2. Specifically, one end of switch S2A is connected to the other side of the two electrodes of capacitor C23 and one side of the two electrodes of capacitor C25. On the other hand, the other end of switch S2A is connected to node N2.

[0114] Switch S2B is connected between capacitors C23 and C25 and node N3. Specifically, one end of switch S2B is connected to the other side of the two electrodes of capacitor C23 and one side of the two electrodes of capacitor C25. On the other hand, the other end of switch S2B is connected to node N3.

[0115] Switch S2C is connected between capacitor C24 and node N3. Specifically, one end of switch S2C is connected to the other end of the two electrodes of capacitor C24. On the other hand, the other end of switch S2C is connected to node N3.

[0116] Switch S2D is connected between capacitor C24 and node N4. Specifically, one end of switch S2D is connected to the other end of the two electrodes of capacitor C24. On the other hand, the other end of switch S2D is connected to node N4.

[0117] Switch S2E is connected between capacitor C25 and node N3. Specifically, one end of switch S2E is connected to the other end of the two electrodes of capacitor C25. On the other hand, the other end of switch S2E is connected to node N3.

[0118] Switch S2F is connected between capacitor C25 and node N4. Specifically, one end of switch S2F is connected to the other end of the two electrodes of capacitor C25. On the other hand, the other end of switch S2F is connected to node N4.

[0119] The switches in the first group, including switches S20, S23, S24, S27, S28, S2B, S2C and S2F, and the switches in the second group, including switches S21, S22, S25, S26, S29, S2A, S2D and S2E, switch in opposite directions based on the control signal CS20 from the digital control circuit 50.

[0120] Specifically, in the first stage, the switches of the first group are closed, and the switches of the second group are open. As a result, one of the two electrodes of capacitor C20 is connected to ground. The other two electrodes of capacitor C20, one of the two electrodes of capacitor C21, and one of the two electrodes of capacitor C22 are connected to node N1. The other two electrodes of capacitor C21, the other two electrodes of capacitor C22, one of the two electrodes of capacitor C23, and one of the two electrodes of capacitor C24 are connected to node N2. The other two electrodes of capacitor C23, the other two electrodes of capacitor C24, and one of the two electrodes of capacitor C25 are connected to node N3. The other two electrodes of capacitor C25 are connected to node N4.

[0121] Conversely, in the second stage, the switches of the first group are open, and the switches of the second group are closed. Thus, one of the two electrodes of capacitor C21 is connected to ground. One of the two electrodes of capacitor C20, the other of the two electrodes of capacitor C21, and one of the two electrodes of capacitor C23 are connected to node N1. The other of the two electrodes of capacitor C20, one of the two electrodes of capacitor C22, the other of the two electrodes of capacitor C23, and one of the two electrodes of capacitor C25 are connected to node N2. The other of the two electrodes of capacitor C22, one of the two electrodes of capacitor C24, and the other of the two electrodes of capacitor C25 are connected to node N3. The other of the two electrodes of capacitor C24 is connected to node N4.

[0122] By repeating this first and second stage, capacitors C20 to C25 can be charged and discharged complementaryly. For example, in one stage of the first and second stages, charging of capacitors C26 to C29 is performed from capacitors C20, C22, and C24; in the other stage of the first and second stages, charging of capacitors C26 to C29 is performed from capacitors C21, C23, and C25. That is, capacitors C26 to C29 are always charged from any one of capacitors C20 to C25. Therefore, even if current flows at high speed through any of nodes N1 to N4 into the power modulation circuit 30, charge can be rapidly replenished to any one of nodes N1 to N4, suppressing potential fluctuations in nodes N1 to N4.

[0123] By operating in this way, the switched capacitor circuit 20 can maintain approximately equal voltages across each of capacitors C26 to C29. Specifically, among the four nodes N1 to N4 labeled V1 to V4, V1 to V4 are maintained at a value satisfying (V4 - V3):(V3 - V2):(V2 - V1):(V1 - VG) = 1:1:1:1. For example, when the adjustment voltage supplied from the pre-adjustment circuit 10 is 3V, the switched capacitor circuit 20 can generate (1V, 2V, 3V, 4V) as multiple discrete voltages (V1 to V4).

[0124] Furthermore, (V4-V3) : (V3-V2) : (V2-V1) : (V1-VG) is not limited to 1:1:1:1, and can be designed as any ratio (e.g., 1:2:3:4, 4:3:2:1, etc.).

[0125] [1.3.3 Circuit structure of power modulation circuit 30]

[0126] Next, refer to Figure 3 The detailed circuit structure of the power modulation circuit 30 included in the tracker circuit 1 is described. The power modulation circuit 30 includes input terminals T31 to T34, switches S31 to S34, and output terminal T35.

[0127] Input terminals T31 to T34 are terminals used to receive multiple discrete voltages (V1 to V4) generated by the switched capacitor circuit 20. Input terminals T31 to T34 are externally connected to the output terminals T21 to T24 of the switched capacitor circuit 20, and internally connected to switches S31 to S34, respectively.

[0128] Output terminal T35 is used to output a voltage selected from multiple discrete voltages (V1 to V4). Output terminal T35 is externally connected to voltage adjustment circuits 41 and 42, and internally connected to switches S31 to S34.

[0129] Switch S31 is connected between input terminal T31 and output terminal T35. In this connection structure, switch S31 is switched on and off according to the control signal CS30 from digital control circuit 50, thereby switching the connection and non-connection between input terminal T31 and output terminal T35.

[0130] Switch S32 is connected between input terminal T32 and output terminal T35. In this connection structure, switch S32 is switched on and off according to the control signal CS30 from digital control circuit 50, thereby switching the connection or non-connection between input terminal T32 and output terminal T35.

[0131] Switch S33 is connected between input terminal T33 and output terminal T35. In this connection structure, switch S33 is switched on and off according to the control signal CS30 from digital control circuit 50, thereby switching the connection or non-connection between input terminal T33 and output terminal T35.

[0132] Switch S34 is connected between input terminal T34 and output terminal T35. In this connection structure, switch S34 is switched on and off according to the control signal CS30 from digital control circuit 50, thereby switching the connection or non-connection between input terminal T34 and output terminal T35.

[0133] In this embodiment, the switches S31 to S34 are controlled to be exclusively closed. That is, the control is such that only one of the switches S31 to S34 is closed, while the rest of the switches S31 to S34 are open. As a result, the power modulation circuit 30 can output a voltage selected from a plurality of discrete voltages (V1 to V4) to the external connection terminals 61 and 62 via the voltage adjustment circuits 41 and 42.

[0134] also, Figure 3 The structure of the power modulation circuit 30 shown is an example and is not limited thereto. In particular, switches S31 to S34 can be of any structure and can be arbitrarily controlled, as long as they can selectively connect at least one of the four input terminals T31 to T34 to the output terminal T35. For example, two of switches S31 to S34 can be closed, and the remaining switches S31 to S34 can be open.

[0135] [1.3.4 Circuit structure of voltage regulation circuits 41 and 42]

[0136] Next, refer to Figure 3 The circuit structures of voltage adjustment circuits 41 and 42 are described. Voltage adjustment circuits 41 and 42 respectively have variable resistors R41 and R42.

[0137] Variable resistor R41 is an example of a first variable resistor, connected between the output terminal T35 of the power modulation circuit 30 and the external connection terminal 61. Variable resistor R42 is an example of a second variable resistor, connected between the output terminal T35 of the power modulation circuit 30 and the external connection terminal 62. Variable resistors R41 and R42 can adjust the output voltage of the power modulation circuit 30 according to control signals CS41 and CS42 to reduce the level difference between the power supply voltages Vcc1 and Vcc2 supplied to RFIC2 from external connection terminals 61 and 62. Such output voltage adjustment is performed, for example, during calibration. Alternatively, for example, the output voltage adjustment can also be performed dynamically on a frame-by-frame basis.

[0138] Furthermore, voltage adjustment circuits 41 and 42 are arbitrary components, and one or both of voltage adjustment circuits 41 and 42 may not be included in tracker circuit 1.

[0139] [1.3.5 Circuit Structure of Digital Control Circuit 50]

[0140] Next, refer to Figure 3 The circuit structure of the digital control circuit 50 included in the tracker circuit 1 will be described. The digital control circuit 50 includes a first controller 51 and a second controller 52.

[0141] The first controller 51 processes the digital control signals based on the serial data transmission standard supplied from RFIC2 to generate control signals CS10, CS20, CS41, and CS42 for controlling the pre-tuner circuit 10, the switched capacitor circuit 20, and the voltage adjustment circuits 41 and 42. In this embodiment, source-synchronous digital control signals (clock signal (CLK) and data signal (DATA)) are used as the digital control signals based on the serial data transmission standard. Alternatively, clock-embedded digital control signals can also be used as the digital control signals based on the serial data transmission standard.

[0142] In D-ET mode, the second controller 52 processes the digital control signal based on the parallel data transmission standard supplied from RFIC2 and generates a control signal CS30 for controlling the power modulation circuit 30. In this embodiment, digital control level (DCL) signals (DCL1 and DCL2) are used as the digital control signal based on the parallel data transmission standard.

[0143] Each of the DCL signals (DCL1 and DCL2) is a bit signal generated based on the envelope signal of the millimeter-wave signal (RFin) amplified by RFIC2. Multiple discrete voltages (V1 to V4) are each represented by a combination of two bit signals. For example, the multiple discrete voltages (V1 to V4) are represented as "00", "01", "10", and "11", respectively. Furthermore, voltage levels can also be represented using gray code.

[0144] [1.4 Installation example of tracker circuit 1 and RFIC2]

[0145] Next, as an example of the installation of tracker circuit 1 and RFIC2, refer to... Figure 4 as well as Figure 5 The high-frequency module 100 is described in detail. Figure 4 This is a top view of the high-frequency module 100 involved in this embodiment. Figure 5 This is a cross-sectional view of the high-frequency module 100 involved in this embodiment. Figure 5 The cross-section of the high-frequency module 100 in the middle is Figure 4 The cross section at the v-v line.

[0146] In addition, Figure 4 The resin component 94, which covers multiple parts on the main surface 90a of the module substrate 90, is omitted from the illustration. Additionally, in... Figure 4 In order to facilitate understanding of the configuration relationship of each component, labels indicating reference numerals ("C20", etc.) are affixed to the components on the module substrate 90, and labels indicating their functions ("SC switch section", etc.) are affixed to the functional areas indicated by dashed lines within RFIC2 and integrated circuit 91. However, these labels may not be affixed to the actual components. Furthermore, in... Figure 4 In the diagram, the shaded components represent arbitrary components that are not required in this embodiment.

[0147] High-frequency module 100 is equipped with Figure 2 The tracker circuit 1 and RFIC 2 are shown on a module substrate 90. The module substrate 90 has opposing main surfaces 90a and 90b. Conductive vias, wiring, and a ground electrode layer are formed within the module substrate 90 and on the main surface 90a. Figure 4 as well as Figure 5 The diagram only shows the wiring 92 between external connection terminal 61 and external connection terminal 75, and the wiring 93 between external connection terminal 62 and external connection terminal 76.

[0148] As the module substrate 90, for example, a low-temperature co-fired ceramic (LTCC) substrate or a high-temperature co-fired ceramic (HTCC) substrate with a multi-dielectric layer stacked structure, a component-embedded substrate, a substrate with a redistribution layer (RDL), or a printed circuit board can be used, but it is not limited to these.

[0149] The RFIC2, integrated circuit 91, power inductor L11 and capacitor C11 included in the pre-tuning circuit 10, and capacitors C20 to C29 included in the switched capacitor circuit 20 are disposed on the main surface 90a of the module substrate 90. Alternatively, the power inductor L11 may also be disposed outside the module substrate 90.

[0150] RFIC2 includes power amplifiers 71 and 72, low-noise amplifiers 73 and 74, multiple external connection terminals including external connection terminals 75 and 76, switching circuits 77 and 78, and phase shifting circuits 79 to 82. Figure 4 The diagram only shows the parts where power amplifiers 71 and 72 are installed, and external connection terminals 75 and 76; other circuits are omitted.

[0151] The portions housing power amplifiers 71 and 72 are located near integrated circuit 91. Specifically, the portions housing power amplifiers 71 and 72 are arranged along the side of RFIC2 opposite to integrated circuit 91.

[0152] Multiple external connection terminals of RFIC2, for example made of copper electrodes or solder electrodes, are electrically connected to input / output terminals and / or ground terminals on the main surface 90a of the module substrate 90. Furthermore, in Figure 4 In the diagram, except for external connection terminals 75 and 76, the illustrations of multiple external connection terminals of RFIC2 are omitted.

[0153] External connection terminal 75 is electrically connected to external connection terminal 61 of integrated circuit 91 via wiring 92 of module substrate 90. Here, external connection terminal 75 is closer to external connection terminal 61 of integrated circuit 91 than external connection terminal 76. Preferably, external connection terminal 75 is the closest to external connection terminal 61 of integrated circuit 91 among the plurality of external connection terminals of RFIC2. As a result, the wiring length of wiring 92 can be shortened.

[0154] External connection terminal 76 is electrically connected to external connection terminal 62 of integrated circuit 91 via wiring 93 of module substrate 90. Here, external connection terminal 76 is closer to external connection terminal 62 of integrated circuit 91 than external connection terminal 75. Preferably, external connection terminal 76 is the closest to external connection terminal 62 of integrated circuit 91 among the plurality of external connection terminals of RFIC2. As a result, the wiring length of wiring 93 can be shortened.

[0155] Integrated circuit 91 includes a PR switch section 91a, an SC switch section 91b, an SM switch section 91c, a voltage adjustment section 91d, and multiple external connection terminals including external connection terminals 61 and 62. The PR switch section 91a includes switches S11 to S14. The SC switch section 91b includes switches S20 to S2F. The SM switch section 91c includes switches S31 to S34. The voltage adjustment section 91d includes variable resistors R41 and R42. Integrated circuit 91 may also include digital control circuitry 50.

[0156] Multiple external connection terminals of integrated circuit 91, for example composed of copper electrodes or solder electrodes, are electrically connected to input / output terminals and / or ground terminals on the main surface 90a of module substrate 90. Furthermore, in Figure 4 In the diagram, apart from external connection terminals 61 and 62, the multiple external connection terminals of integrated circuit 91 are omitted.

[0157] External connection terminal 61 is electrically connected to external connection terminal 75 of RFIC2 via wiring 92 of module substrate 90. Here, external connection terminal 61 is closer to external connection terminal 75 of RFIC2 than external connection terminal 62. Preferably, external connection terminal 61 is the closest to external connection terminal 75 of RFIC2 among the multiple external connection terminals of integrated circuit 91. This shortens the wiring length of wiring 92.

[0158] External connection terminal 62 is electrically connected to external connection terminal 76 of RFIC2 via wiring 93 of module substrate 90. Here, external connection terminal 62 is closer to external connection terminal 76 of RFIC2 than external connection terminal 61. Preferably, external connection terminal 62 is the closest to external connection terminal 76 of RFIC2 among the multiple external connection terminals of integrated circuit 91. As a result, the wiring length of wiring 93 can be shortened.

[0159] In addition, Figure 4In this circuit, the PR switch 91a, SC switch 91b, SM switch 91c, and voltage regulator 91d are included in one integrated circuit 91, but are not limited thereto. For example, the PR switch 91a, SC switch 91b, SM switch 91c, and voltage regulator 91d may also be independently included in multiple integrated circuits. Alternatively, for example, the PR switch 91a and SC switch 91b may be included in one integrated circuit, and the SM switch 91c and voltage regulator 91d may be included in another integrated circuit. Furthermore, multiple integrated circuits can be manufactured using different process technology nodes.

[0160] Integrated circuit 91 may also be constructed using CMOS (Complementary Metal Oxide Semiconductor), specifically, manufactured using SOI (Silicon on Insulator) technology. However, integrated circuit 91 is not limited to CMOS.

[0161] Each of capacitors C20 to C29 is mounted as a chip capacitor. A chip capacitor refers to a surface mount device (SMD) that constitutes a capacitor. However, the mounting of multiple capacitors is not limited to chip capacitors. For example, some or all of the multiple capacitors may also be included in an integrated passive device (IPD) or an integrated circuit 91.

[0162] Wiring 92 electrically connects the external connection terminal 61 of the tracker circuit 1 formed on the integrated circuit 91 and the external connection terminal 75 of the RFIC 2. Wiring 92 consists of a wiring pattern disposed on the main surface 90a of the module substrate 90, and / or via conductors disposed in the module substrate 90 and wiring patterns.

[0163] Wiring 93 electrically connects the external connection terminal 62 of the tracker circuit 1 formed on the integrated circuit 91 and the external connection terminal 76 of the RFIC 2. Wiring 93 consists of a wiring pattern disposed on the main surface 90a of the module substrate 90, and / or via conductors disposed in the module substrate 90 and wiring patterns.

[0164] The resin component 94 covers the components disposed on the main surface 90a of the module substrate 90. The resin component 94 is made of, for example, epoxy resin and has the function of ensuring the mechanical strength and moisture resistance of the multiple electronic components on the main surface 90a. Alternatively, the resin component 94 may not be included in the high-frequency module 100.

[0165] A plurality of external connection terminals 95 are disposed on the main surface 90b of the module substrate 90. The plurality of external connection terminals 95 are electrically connected to input / output terminals and / or ground terminals disposed on the mother substrate (not shown) in the negative z-axis direction of the high-frequency module 100. In addition, the plurality of external connection terminals 95 are electrically connected to a plurality of components disposed on the main surface 90a via through-hole conductors formed in the module substrate 90.

[0166] Copper electrodes can be used as multiple external connection terminals 95, but are not limited to this. For example, solder electrodes can also be used as multiple external connection terminals 95.

[0167] also, Figure 4 as well as Figure 5 The high-frequency module 100 shown is illustrative and not limited thereto. For example, the surface of the resin component 94 may also be covered by a shielding electrode layer, for example, formed by sputtering. The shielding electrode layer is connected to ground, thereby suppressing external noise from entering the components within the high-frequency module 100 and suppressing noise generated in the high-frequency module 100 from interfering with other modules or other devices.

[0168] [1.5 Magnification Method]

[0169] Next, refer to Figure 6 The scaling-up method involved in this embodiment will be explained. Figure 6 This is a flowchart illustrating the amplification method involved in this embodiment.

[0170] First, the voltage generation circuit 60 generates multiple discrete voltages (V1 to V4) based on the input voltage (Vbat) (S101). The power modulation circuit 30 selects a voltage from the multiple discrete voltages (V1 to V4) based on the envelope signal of the millimeter-wave signal (S102). The tracker circuit 1 simultaneously supplies the voltage selected by the power modulation circuit 30 to power amplifiers 71 and 72 (S103). Power amplifiers 71 and 72 use the voltages (Vcc1 and Vcc2) supplied from the tracker circuit 1 to amplify the millimeter-wave signal and output them to different antennas (S104).

[0171] [1.6 Effects, etc.]

[0172] As described above, the tracker circuit 1 according to this embodiment includes: a voltage generation circuit 60 configured to generate multiple discrete voltages based on an input voltage; and a power modulation circuit 30 configured to select a voltage from the multiple discrete voltages and simultaneously output the selected voltage to a power amplifier 71 and a power amplifier 72. The power amplifier 71 is configured to be connected to an antenna 3 to amplify millimeter-wave signals, and the power amplifier 72 is configured to be connected to an antenna 4 different from the antenna 3 to amplify millimeter-wave signals.

[0173] Accordingly, voltage is simultaneously supplied from the power modulation circuit 30 to power amplifiers 71 and 72, which are respectively connected to different antennas 3 and 4. Therefore, for example, in a communication device 5 that transmits millimeter-wave signals containing the same data simultaneously from two antennas 3 and 4 for beamforming, the power-added efficiency can be improved using two power amplifiers 71 and 72. Furthermore, reducing the level difference of the power supply voltages supplied to the two power amplifiers 71 and 72 reduces the error between the two millimeter-wave signals amplified by the two power amplifiers 71 and 72 respectively. Moreover, the voltage generation circuit 60 and the power modulation circuit 30 can be shared in the two power amplifiers 71 and 72, reducing the circuit size of the tracker circuit 1 and contributing to the miniaturization of the communication device 5.

[0174] Additionally, for example, the tracker circuit 1 according to this embodiment may also include a voltage adjustment circuit 41, which is configured to be connected between the power modulation circuit 30 and the power amplifier 71 to adjust the voltage output from the power modulation circuit 30.

[0175] Therefore, when there is a level difference between the power supply voltage Vcc1 supplied to power amplifier 71 and the power supply voltage Vcc2 supplied to power amplifier 72, the level of power supply voltage Vcc1 can be adjusted by voltage adjustment circuit 41, thereby reducing the level difference between power supply voltages Vcc1 and Vcc2. As a result, the error of the two millimeter-wave signals amplified by the two power amplifiers 71 and 72 can be reduced.

[0176] Alternatively, for example, in the tracker circuit 1 according to this embodiment, the voltage adjustment circuit 41 may also include a variable resistor R41.

[0177] Therefore, the voltage regulation circuit 41 can be implemented with a simple structure.

[0178] Additionally, for example, the tracker circuit 1 according to this embodiment may also include a voltage adjustment circuit 42, which is configured to be connected between the power modulation circuit 30 and the power amplifier 72 to adjust the voltage output from the power modulation circuit 30.

[0179] Therefore, when there is a level difference between the power supply voltage Vcc1 supplied to power amplifier 71 and the power supply voltage Vcc2 supplied to power amplifier 72, the level of power supply voltage Vcc2 can be adjusted by voltage adjustment circuit 42, thereby reducing the level difference between power supply voltages Vcc1 and Vcc2. As a result, the error of the two millimeter-wave signals amplified by the two power amplifiers 71 and 72 can be reduced.

[0180] Alternatively, for example, in the tracker circuit 1 according to this embodiment, the voltage adjustment circuit 42 may also include a variable resistor R42.

[0181] Therefore, the voltage regulation circuit 42 can be implemented with a simple structure.

[0182] In addition, the integrated circuit 91 according to this embodiment includes: external connection terminals 61 and 62; at least one switch included in the voltage generation circuit 60, which is configured to generate multiple discrete voltages based on the input voltage; and at least one switch included in the power modulation circuit 30, which is configured to select a voltage from the multiple discrete voltages and simultaneously output the selected voltage to the external connection terminals 61 and 62.

[0183] Accordingly, voltage is simultaneously output from the power modulation circuit 30 to the two external connection terminals 61 and 62. Therefore, for example, in a communication device 5 that simultaneously transmits the same data from two antennas 3 and 4 for beamforming, voltage can be simultaneously supplied from the two external connection terminals 61 and 62 to the two power amplifiers 71 and 72, thereby improving power-added efficiency using the power amplifiers 71 and 72. Furthermore, the level difference between the power supply voltages supplied from the two external connection terminals 61 and 62 to the two power amplifiers 71 and 72 can be reduced, thereby reducing errors in the two millimeter-wave signals amplified by the two power amplifiers 71 and 72. Moreover, the voltage generation circuit 60 and the power modulation circuit 30 can be shared in the two power amplifiers 71 and 72, thus enabling miniaturization of the integrated circuit 91.

[0184] Furthermore, in the amplification method of this embodiment, multiple discrete voltages are generated based on the input voltage (S101), and a voltage is selected from the multiple discrete voltages based on the envelope signal of the millimeter wave signal (S102). The selected voltage is simultaneously supplied to power amplifiers 71 and 72 (S103). Power amplifiers 71 and 72 use the supplied voltage to amplify the millimeter wave signal and output it to different antennas 3 and 4 respectively (S104).

[0185] Accordingly, the envelope signal based on the millimeter-wave signal is supplied with a voltage selected from multiple discrete voltages simultaneously to power amplifiers 71 and 72. Therefore, when transmitting millimeter-wave signals containing the same data from two antennas 3 and 4, D-ET mode can be applied to the two power amplifiers 71 and 72, improving power-added efficiency. Furthermore, the level difference between the power supply voltages supplied to the two power amplifiers 71 and 72 can be reduced, thereby reducing the error between the two millimeter-wave signals amplified by the two power amplifiers 71 and 72 respectively.

[0186] (Implementation Method 2)

[0187] Next, Embodiment 2 will be described. The main difference between this embodiment and Embodiment 1 lies in the structure of the voltage adjustment circuit. Hereinafter, this embodiment will be described with reference to the accompanying drawings, focusing on the differences from Embodiment 1.

[0188] The tracker circuit 1 according to this embodiment differs from the tracker circuit 1 according to Embodiment 1 in that it includes voltage adjustment circuits 41A and 42A instead of voltage adjustment circuits 41 and 42. Therefore, the description of circuits other than voltage adjustment circuits 41A and 42A is omitted.

[0189] [2.1 Circuit structure of voltage regulation circuits 41A and 42A]

[0190] Reference Figure 7A as well as Figure 7B The circuit structures of voltage adjustment circuits 41A and 42A are explained. Furthermore, Figure 7A as well as Figure 7B The circuit structures shown are illustrative. Voltage regulation circuits 41A and 42A can be installed using a variety of circuit mounting methods and techniques. Therefore, the following descriptions of voltage regulation circuits 41A and 42A should not be interpreted in a limiting way.

[0191] The voltage regulation circuit 41A includes a switched capacitor 411A and a selector 412A.

[0192] Switched capacitor 411A is an example of a first switched capacitor, capable of generating multiple voltages based on the voltage supplied from the power modulation circuit 30. The circuit structure of switched capacitor 411A is the same as that of switched capacitor circuit 20, therefore its illustration and description are omitted.

[0193] Selector 412A is an example of a first selector, capable of selecting one voltage from multiple voltages generated by switched capacitor 411A. The selected voltage is output to external connection terminal 61. The circuit structure of selector 412A is the same as that of power modulation circuit 30, therefore its description is omitted. Furthermore, the point by which selector 412A is controlled by digital control signals based on serial data transmission standards differs from that of power modulation circuit 30, which is controlled by digital control signals based on parallel data transmission standards.

[0194] The voltage regulation circuit 42A includes a switched capacitor 421A and a selector 422A.

[0195] Switched capacitor 421A is an example of a second switched capacitor, capable of generating multiple voltages based on the voltage supplied from power modulation circuit 30. The circuit structure of switched capacitor 421A is the same as that of switched capacitor circuit 20, therefore its illustration and description are omitted.

[0196] Selector 422A is an example of a second selector, capable of selecting one voltage from multiple voltages generated by switched capacitor 421A. The selected voltage is output to external connection terminal 62. The circuit structure of selector 422A is the same as that of power modulation circuit 30, therefore its description is omitted. Furthermore, the point controlled by digital control signals based on serial data transmission standards for selector 422A differs from that of power modulation circuit 30, which is controlled by digital control signals based on parallel data transmission standards.

[0197] [2.2 Effects, etc.]

[0198] As described above, in the tracker circuit 1 of this embodiment, the voltage adjustment circuit 41A may also include: a switched capacitor 411A configured to generate a first plurality of voltages based on the voltage output from the power modulation circuit 30; and a selector 412A configured to select a first voltage from the first plurality of voltages generated by the switched capacitor 411A.

[0199] Accordingly, the voltage adjustment circuit 41A can not only reduce the voltage output from the power modulation circuit 30, but also increase the voltage, thereby improving the flexibility of voltage adjustment.

[0200] As described above, in the tracker circuit 1 of this embodiment, the voltage adjustment circuit 42A may also include: a switched capacitor 421A configured to generate a second plurality of voltages based on the voltage output from the power modulation circuit 30; and a selector 422A configured to select a second voltage from the second plurality of voltages generated by the switched capacitor 421A.

[0201] Accordingly, the voltage adjustment circuit 42A can not only reduce the voltage output from the power modulation circuit 30, but also increase the voltage, thereby improving the flexibility of voltage adjustment.

[0202] (Implementation Method 3)

[0203] Next, Embodiment 3 will be described. The main difference between this embodiment and Embodiment 1 is that the tracker circuit 1 and the RFIC 2 are mounted on both sides of the module substrate 90. Hereinafter, this embodiment will be described with reference to the accompanying drawings, focusing on the differences from Embodiment 1.

[0204] Furthermore, the circuit structures of the communication device 5, the tracker circuit 1, and the RFIC2 are the same as those in Embodiment 1, therefore, illustrations and descriptions are omitted.

[0205] [3.1 Installation example of tracker circuit 1 and RFIC2]

[0206] As an example of the installation of tracker circuit 1 and RFIC2, refer to Figures 8-10 The high-frequency module 100A involved in this embodiment will be described.

[0207] Figure 8 This is a top view of the high-frequency module 100A involved in this embodiment. Figure 9 This is a top view of the high-frequency module 100A according to this embodiment, which is a view of the main surface 90b of the module substrate 90 from the z-axis positive side. Figure 10 This is a cross-sectional view of the high-frequency module 100A involved in this embodiment. Figure 10 The cross-section of the high-frequency module 100A in the middle is Figure 8 as well as Figure 9 The cross section at the x-x line.

[0208] exist Figure 8 as well as Figure 9 The resin component 94 covering the main surfaces 90a and 90b of the module substrate 90 is omitted from the illustration. Additionally, in... Figure 8 as well as Figure 9 In order to facilitate understanding of the configuration relationship of each component, labels indicating reference numerals ("C20", etc.) are affixed to the components on the module substrate 90, and labels indicating their functions ("SC switch section", etc.) are affixed to the functional areas indicated by dashed lines within RFIC2 and integrated circuit 91. However, these labels may not be affixed to the actual components. Furthermore, in... Figure 9 In the diagram, the shaded components represent arbitrary components that are not required in this embodiment.

[0209] The high-frequency module 100A is equipped with... Figure 2 The module substrate 90 of the tracker circuit 1 and RFIC2 is shown. The module substrate 90 is a double-sided mounting substrate with opposing main surfaces 90a and 90b. Conductive vias, wiring patterns, and ground electrode layers are formed in the module substrate 90 and on the main surface 90a. Only the wiring 92A between the external connection terminal 61 and the external connection terminal 75 is shown.

[0210] In this embodiment, the integrated circuit 91, the power inductor L11 and capacitor C11 included in the pre-tuner circuit 10, and the capacitors C20 to C29 included in the switched capacitor circuit 20 are disposed on the main surface 90b of the module substrate 90.

[0211] The external connection terminal 75 of RFIC2 is electrically connected to the external connection terminal 61 of integrated circuit 91 disposed on the main surface 90b via wiring 92A of module substrate 90. Here, external connection terminal 75 is closer to external connection terminal 61 of integrated circuit 91 than external connection terminal 76. As a result, the wiring length of wiring 92A can be shortened.

[0212] The external connection terminal 76 of RFIC2 is electrically connected to the external connection terminal 62 of integrated circuit 91 disposed on the main surface 90b via wiring (not shown) on the module substrate 90. Here, the external connection terminal 76 is closer to the external connection terminal 62 of integrated circuit 91 than the external connection terminal 75. As a result, the wiring length between the external connection terminals 76 and 62 can be shortened.

[0213] The external connection terminal 61 of integrated circuit 91 is electrically connected to the external connection terminal 75 of RFIC2 via wiring 92A of module substrate 90. Here, external connection terminal 61 is closer to external connection terminal 75 of RFIC2 than external connection terminal 62. As a result, the wiring length of wiring 92A can be shortened.

[0214] The external connection terminal 62 of integrated circuit 91 is electrically connected to the external connection terminal 76 of RFIC2 via wiring on module substrate 90. Here, external connection terminal 62 is closer to external connection terminal 76 of RFIC2 than external connection terminal 61. As a result, the wiring length between external connection terminals 62 and 76 can be shortened.

[0215] When viewed from above the module substrate 90, the voltage adjustment unit 91d within the integrated circuit 91 at least partially overlaps with the power amplifiers 71 and 72 within the RFIC2.

[0216] Wiring 92A electrically connects the external connection terminal 61 of the tracker circuit 1 formed on the integrated circuit 91 and the external connection terminal 75 of the RFIC 2. Wiring 92A consists of a wiring pattern disposed on the main surface 90a of the module substrate 90, and / or via conductors disposed in the module substrate 90 and wiring pattern.

[0217] Resin component 94 covers components disposed on the main surfaces 90a and 90b of the module substrate 90. Resin component 94, for example, is made of epoxy resin and functions to ensure the reliability of the mechanical strength and moisture resistance of the various electronic components on the main surfaces 90a and 90b. Alternatively, resin component 94 may not be included in the high-frequency module 100A.

[0218] As multiple external connection terminals 95, copper pillar electrodes can be used, but are not limited to this.

[0219] [3.2 Effects, etc.]

[0220] As described above, in the high-frequency module 100A of this embodiment, the tracker circuit 1 and RFIC2 can also be mounted on the opposing main surfaces 90a and 90b of the module substrate 90.

[0221] Therefore, the miniaturization of the high-frequency module 100A can be achieved.

[0222] (Other implementation methods)

[0223] The tracker circuit, integrated circuit, and amplification method of the present invention have been described above based on the embodiments. However, the tracker circuit, integrated circuit, and amplification method of the present invention are not limited to the above embodiments. Other embodiments implemented by combining any of the constituent elements in the above embodiments, variations obtained by implementing the above embodiments with various modifications that can be conceived by those skilled in the art without departing from the spirit of the present invention, and various devices that incorporate the above tracker circuit or integrated circuit are also included in the present invention.

[0224] For example, in the circuit structures of the various circuits involved in the above embodiments, other circuit elements and wiring may be inserted between the paths connecting the circuit elements and signal paths disclosed in the accompanying drawings. For example, a filter and / or impedance matching circuit may be inserted between the power amplifier 71 and the antenna 3.

[0225] Furthermore, in the above embodiments, the number of discrete voltages generated by the switched capacitor circuit 20 is illustrative and not limited to the number shown in the above embodiments. For example, in the above embodiments, the switched capacitor circuit 20 may generate three or fewer discrete voltages, or it may generate five or more discrete voltages. In this case, the number of stages in the ladder-shaped circuit structure of the switched capacitor circuit 20 may also be increased.

[0226] Furthermore, in the above embodiments, the communication device 5 may also include four power amplifiers and four antennas respectively connected to the four power amplifiers. In this case, the tracker circuit 1 may also include two power modulation circuits, each of which can simultaneously supply power voltage to two power amplifiers. Alternatively, the tracker circuit 1 may also include one power modulation circuit, which can simultaneously supply power voltage to all four power amplifiers. Furthermore, the four power amplifiers may be installed in one RFIC, or two may be installed in each of two RFICs.

[0227] Furthermore, in the above embodiments, voltage adjustment circuits 41 and 42 may not be included in tracker circuit 1. In this case, tracker circuit 1 may also supply power voltage to power amplifiers 71 and 72 from an external connection terminal. In this case, RFIC2 may include a shared external connection terminal for power amplifiers 71 and 72, or it may include two separate external connection terminals for power amplifiers 71 and 72, respectively.

[0228] Industrial applications

[0229] This invention can be widely used in communication devices such as mobile phones as a tracker circuit that selectively supplies multiple discrete voltages.

[0230] Explanation of reference numerals in the attached figures

[0231] 1… Tracker circuit; 2… RFIC; 3, 4… Antenna; 5… Communication device; 10… Presetter circuit; 20… Switched capacitor circuit; 30… Power modulation circuit; 41, 41A, 42, 42A… Voltage adjustment circuit; 50… Digital control circuit; 51… First controller; 52… Second controller; 60… Voltage generation circuit; 61, 62, 75, 76, 95… External connection terminals; 71, 72… Power amplifier; 73, 74… Low noise amplifier Large components; 77, 78… Switching circuits; 79, 80, 81, 82… Phase-shifting circuits; 90… Module substrate; 90a, 90b… Main surface; 91… Integrated circuit; 91a… PR switching section; 91b… SC switching section; 91c… SM switching section; 91d… Voltage adjustment section; 92, 92A, 93… Wiring; 94… Resin components; 100, 100A… High-frequency modules; 411A, 421A… Switching capacitors; 412A, 422A… Selectors.

Claims

1. A tracker circuit, comprising: The voltage generation circuit is configured to generate multiple discrete voltages based on the input voltage; and The power modulation circuit is configured to select a voltage from the plurality of discrete voltages and simultaneously output the selected voltage to both a first power amplifier and a second power amplifier. The first power amplifier is configured to be connected to the first antenna to amplify millimeter-wave signals. The second power amplifier is configured to be connected to a second antenna, which is different from the first antenna, to amplify the millimeter-wave signal.

2. The tracker circuit according to claim 1, wherein, The tracker circuit also includes a first voltage adjustment circuit, which is configured to be connected between the power modulation circuit and the first power amplifier to adjust the voltage output from the power modulation circuit.

3. The tracker circuit according to claim 2, wherein, The first voltage adjustment circuit includes a first variable resistor.

4. The tracker circuit according to claim 2, wherein, The first voltage adjustment circuit includes: A first switched capacitor is configured to generate a first plurality of voltages based on the voltage output from the power modulation circuit; and The first selector is configured to select a first voltage from the first plurality of voltages generated by the first switched capacitor.

5. The tracker circuit according to any one of claims 2 to 4, wherein, The tracker circuit also includes a second voltage adjustment circuit, which is configured to be connected between the power modulation circuit and the second power amplifier to adjust the voltage output from the power modulation circuit.

6. The tracker circuit according to claim 5, wherein, The second voltage adjustment circuit includes a second variable resistor.

7. The tracker circuit according to claim 5, wherein, The second voltage adjustment circuit includes: The second switched capacitor is configured to generate a second plurality of voltages based on the voltage output from the power modulation circuit; and The second selector is configured to select a second voltage from the second plurality of voltages generated by the second switched capacitor.

8. An integrated circuit, comprising: First external connection terminal and second external connection terminal; At least one switch included in a voltage generation circuit, the voltage generation circuit being configured to generate a plurality of discrete voltages based on an input voltage; and At least one switch is included in a power modulation circuit, the power modulation circuit being configured to select a voltage from the plurality of discrete voltages and simultaneously output the selected voltage to the first external connection terminal and the second external connection terminal.

9. A magnification method, wherein, Multiple discrete voltages are generated based on the input voltage. Based on the envelope signal of the millimeter-wave signal, a voltage is selected from the plurality of discrete voltages. The selected voltage is simultaneously supplied to both the first power amplifier and the second power amplifier. The first power amplifier and the second power amplifier use the supplied voltage to amplify the millimeter-wave signal and output it to different antennas respectively.

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