Image sensor package and camera device including the same

Abstract

An image sensor package according to one embodiment of the present invention comprises: a board; a circuit board disposed on the board and including a hole; an image sensor disposed on the plate and disposed in the hole; a connection member disposed on the circuit board and the image sensor; and an optical filter disposed on the connection member in which a first groove is formed in an upper surface of the image sensor and a second groove is formed in an upper surface of the circuit board, and the connection member includes: a first adhesive layer disposed in a region from the first groove to the second groove; a conductive pattern layer disposed on the first adhesive layer; and a second adhesive layer disposed on the conductive pattern layer.

Description

TECHNICAL FIELD

[0001] The present application relates to a camera device, and more particularly, to an image sensor package and a camera device including the same. BACKGROUND

[0002] A camera captures an image or a video of an object, and is mounted in a mobile device, a drone, a vehicle, etc. In the case of a full screen and a narrow bezel trend of a portable device, ultra-high resolution, multi-camera, zoom function, and a fifth generation module, further miniaturization and high performance of a camera device are required.

[0003] According to a conventional camera device, an image sensor is disposed on a printed circuit board, the image sensor is wire-bonded on the printed circuit board, an infrared (IR) filter is disposed on the image sensor, and a lens assembly can be disposed on the IR filter.

[0004] Meanwhile, according to a need for a high chief ray angle (CRA), a distance from the lens assembly to the image sensor, that is, a flange back length (FBL), is decreasing. Structurally, the IR filter should be disposed in the FBL. In addition, in the case where the camera device has an auto-focusing function, an additional space is required for an optical system in the lens assembly to move toward the image sensor. In order to achieve a small FBL, it is crucial to reduce the thickness of structures other than the IR filter.

[0005] In addition, according to a need for high resolution, the area of the image sensor is continuously increasing, and thus the area of the printed circuit board is also continuously increasing. As the area of the printed circuit board increases, a heat problem during operation of the camera device and a warping problem of the printed circuit board during movement of the optical system can be serious. SUMMARY

[0006] TECHNICAL PROBLEM

[0007] The technical object to be achieved by the present application is to provide an image sensor package that is miniaturized, has high durability and toughness, and a camera device including the same.

[0008] TECHNICAL SOLUTION

[0009] An image sensor package according to one embodiment of the present application includes a board, a circuit board disposed on the board and including a hole, an image sensor disposed on the board and disposed in the hole, a connection member disposed on the circuit board and the image sensor, and a filter disposed on the connection member, wherein a first recess is formed in an upper surface of the image sensor, a second recess is formed in an upper surface of the circuit board, and the connection member includes a first adhesive layer disposed in a region from the first recess to the second recess, a conductive pattern layer disposed on the first adhesive layer, and a second adhesive layer disposed on the conductive pattern layer.

[0010] An upper surface of the first adhesive layer can include a flat surface and a recessed surface, the recessed surface can include a first recess disposed in the first recess, a second recess disposed in the second recess, and a third recess disposed between the first recess and the second recess, and the conductive pattern layer is disposed on the recessed surface.

[0011] A height of the flat surface can be greater than a height of the third recess, and the height of the third recess can be greater than a height of each of the first recess and the second recess.

[0012] A width of the first recess can be less than a width of the first recess, and a width of the second recess can be less than a width of the second recess.

[0013] The conductive pattern layer can include a first electrode disposed in the first recess, a second electrode disposed in the second recess, and a connection electrode disposed in the third recess and connecting the first electrode and the second electrode, wherein the first recess and the first electrode can be spaced apart from each other by the first adhesive layer, the second recess and the second electrode can be spaced apart from each other by the first adhesive layer, the image sensor and the first electrode can be electrically connected by the first adhesive layer, and the circuit board and the second electrode can be electrically connected by the first adhesive layer.

[0014] A thickness of each of the first electrode and the second electrode can be 1.5 times or more of a depth of each of the first recess and the second recess.

[0015] The image sensor, the first recess, the first electrode, and the filter can vertically overlap, and the circuit board, the second recess, the second electrode, and the filter can vertically overlap.

[0016] The first adhesive layer can include a first hole formed in a region corresponding to a center of the image sensor, and the conductive pattern layer can be disposed around the region in which the first hole is formed.

[0017] The second adhesive layer can include a second hole formed to correspond to the first hole of the first adhesive layer, and the filter can directly face the image sensor in an optical axis direction.

[0018] The first adhesive layer may include an anisotropic conductive layer.

[0019] The circuit board may include: a first rigid plate disposed on the plate; a flexible plate disposed on the first rigid plate; and a second rigid plate disposed on the flexible plate, wherein a second groove may be disposed in the second rigid plate.

[0020] A camera device according to an embodiment of the present invention includes an image sensor package and a lens assembly disposed on the image sensor package, wherein the image sensor package includes: a plate; a circuit board disposed on the plate and including a hole; an image sensor disposed on the plate and disposed in the hole; a connecting member disposed on the circuit board and the image sensor; and a filter disposed on the connecting member, a first groove formed in the upper surface of the image sensor, and a second groove formed in the upper surface of the circuit board, and the connecting member includes: a first adhesive layer disposed in a region from the first groove to the second groove; a conductive pattern layer disposed on the first adhesive layer; and a second adhesive layer disposed on the conductive pattern layer.

[0021] An image sensor package according to an embodiment of the present invention includes: a board; a circuit board disposed on the board and including a hole; an image sensor disposed on the board and disposed in the hole; a connecting member disposed on the circuit board and the image sensor; and a filter disposed on the connecting member, wherein the connecting member includes: a first adhesive layer disposed on the circuit board and the image sensor; a conductive pattern layer disposed on the first adhesive layer; and a second adhesive layer disposed on the conductive pattern layer, and the conductive pattern layer includes a first protrusion protruding toward the circuit board and a second protrusion protruding toward the image sensor.

[0022] An image sensor package according to an embodiment of the present invention includes: a board; a circuit board disposed on the board and including a hole; an image sensor disposed on the board and disposed in the hole; a connecting member disposed on the circuit board and the image sensor; and a filter disposed on the connecting member, wherein the connecting member includes: a first adhesive layer disposed on the circuit board and the image sensor and including a first hole formed on the image sensor; a second adhesive layer disposed on the circuit board and the image sensor and overlapping the first adhesive layer; and a conductive pattern layer disposed between the first adhesive layer and the second adhesive layer.

[0023] The filter can be attached to the second adhesive layer.

[0024] Beneficial effects

[0025] According to embodiments of the present invention, a miniaturized camera device with simple structure and manufacturing process can be obtained. In particular, according to embodiments of the present invention, a camera device with a small flange distance (FBL) can be obtained. Furthermore, according to embodiments of the present invention, a camera device with minimized circuit board warpage can be obtained. Attached Figure Description

[0026] Figure 1 This is an exploded perspective view showing a camera device according to an embodiment of the present invention.

[0027] Figure 2 This is a perspective view illustrating a camera device according to an embodiment of the present invention.

[0028] Figure 3 This is a cross-sectional view showing a camera device according to an embodiment of the present invention.

[0029] Figure 4 This is a perspective view illustrating an image sensor package according to an embodiment of the present invention.

[0030] Figure 5 This is an exploded perspective view showing an image sensor package according to an embodiment of the present invention.

[0031] Figure 6 It is along Figure 4 A cross-sectional view of line A-A'.

[0032] Figure 7 It is along Figure 4 A cross-sectional view of line B-B'.

[0033] Figure 8 It shows Figure 4 An enlarged cross-sectional view of a portion of the image sensor package.

[0034] Figure 9 This is a cross-sectional view showing an image sensor package according to another embodiment of the present invention.

[0035] Figure 10 shows the contents contained in Figure 9 A three-dimensional view of the second plate in the image sensor package.

[0036] Figure 11 This is a perspective view of a portable terminal including a camera device according to an embodiment of the present invention.

[0037] Figure 12 It is shown Figure 11 The diagram shows a block diagram of a portable terminal. Detailed Implementation

[0038] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0039] However, the technical concept of the present invention is not limited to the embodiments to be described, and can be implemented in various different forms. Furthermore, within the scope of the technical concept of the present invention, one or more components of the embodiments can be selectively combined, substituted, and used.

[0040] Furthermore, unless the context provides otherwise, all terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having the meaning commonly understood by those skilled in the art, and the meaning of commonly used terms (e.g., the meaning as defined in a dictionary) should be interpretable in light of the contextual meaning of the relevant art.

[0041] Furthermore, the terminology used in the embodiments of the present invention is considered to be descriptive only and does not limit the present invention.

[0042] In this specification, unless the context specifically indicates otherwise, the singular form includes the plural form, and in the case of describing “at least one (or one or more) of A, B and C”, this may include at least one combination of all possible combinations of A, B and C.

[0043] Furthermore, in the description of the components of the embodiments of the present invention, terms such as "first", "second", "A", "B", "(a)", "(b)" may be used.

[0044] These terms are only used to distinguish one component from another; the nature, order, etc., of the components are not limited by these terms.

[0045] Furthermore, it should be understood that when the first component is referred to as “connected,” “linked,” or “linked” to the second component, such description may include cases where the first component is directly connected, linked, or linked to the second component, as well as cases where the first component is connected, linked, or linked to the second component through a third component placed between the first and second components.

[0046] Furthermore, when the first component is described as being formed "above" or "below" the second component, this description includes cases where the two components are in direct contact with each other, as well as cases where one or more other components are formed or disposed between the two components. Additionally, when the first component is described as being formed "above" or "below" the second component, this description can include cases where the first component is formed on an upper or lower side relative to the second component.

[0047] In the following description, an image sensor package and a camera device including the image sensor package according to embodiments of the present invention will be described with reference to the accompanying drawings. For ease of description, in the drawings, the x-axis and y-axis may correspond to directions perpendicular to the z-axis (corresponding to the optical axis OA), the x-axis direction may be a first direction, the y-axis direction may be a second direction, and the z-axis direction may be a third direction.

[0048] The camera device according to an embodiment of the present invention may have an image stabilization function. The image stabilization function is a function that moves the lens in a direction perpendicular to the optical axis or tilts the lens relative to the optical axis to counteract vibrations or movements caused by the user's hand shaking.

[0049] The camera device according to an embodiment of the present invention may have an autofocus (AF) function. The AF function is a function that automatically focuses on the object by moving the lens in the optical axis direction according to the distance from the object to obtain a clear image of the object.

[0050] Figure 1 This is an exploded perspective view showing a camera device according to an embodiment of the present invention. Figure 2 This is a perspective view illustrating a camera device according to an embodiment of the present invention. Figure 3 This is a cross-sectional view showing a camera device according to an embodiment of the present invention.

[0051] Reference Figures 1 to 3 The camera device 1000 includes an image sensor package 100, a lens driving unit 200, and a lens assembly 300.

[0052] In this case, the camera device 1000 can be described as a camera module or an image capturing device.

[0053] Lens assembly 300 can be interchangeably described as a lens, lens component, lens module, optical system, etc. Lens assembly 300 may include at least one lens having a predetermined field of view and focal length, refracting incident light and transmitting the refracted light to image sensor package 100. Lens assembly 300 may be coupled to lens driving unit 200 and moved by lens driving unit 200. When lens assembly 300 includes multiple lenses, the lenses may be arranged based on a central axis to form an optical system. In this case, the central axis may be the same as the optical axis of the optical system.

[0054] The lens assembly 300 can be disposed in the opening of the lens driving unit 200 and moved in the optical axis direction by the lens driving unit 200.

[0055] The lens driving unit 200 can be either a lens driving unit for AF (autofocus) or a lens driving unit for optical image stabilization (OIS). The lens driving unit for AF can be a lens driving unit used solely for performing AF functions. The lens driving unit for OIS can be a lens driving unit used for performing both AF and OIS functions.

[0056] The lens drive unit 200 may include: a base 210; a housing 220 disposed on the base 210; a bobbin 230 disposed in the housing 220 and on which the lens assembly 300 is mounted; a plurality of coils (not shown) disposed on the bobbin 230; a plurality of magnets (not shown) disposed in the housing 220 and facing the plurality of coils; a guide member (not shown) for guiding the movement of at least one of the bobbin 230 and the housing 220; and a cover member 240 disposed on the base 210 and covering the internal components of the lens drive unit 200.

[0057] The guiding member can be a ball member, a pin member, or an elastic member, but is not limited thereto. Although it is described that the coil is disposed on the spool 230 and the magnet is disposed in the housing 220, the invention is not limited thereto. The magnet can be disposed on the spool 230, and the coil can be disposed in the housing 220.

[0058] The lens driving unit 200 is disposed on the image sensor package 100. For this purpose, an adhesive member can be provided between the lower surface of the base 210 of the lens driving unit 200 and the image sensor package 100, and the lens driving unit 200 and the image sensor package 100 can be bonded together by the adhesive member. In this case, the adhesive member can be an adhesive comprising epoxy resin or silicone resin. Alternatively, the adhesive member can be a film having two surfaces coated with an adhesive comprising epoxy resin or silicone resin.

[0059] The lens driving unit 200 may be disposed on the image sensor package 100 and receive electrical signals from the circuit board 130 of the image sensor package 100. For this purpose, the lens driving unit 200 may further include terminals 260, and the terminals 260 of the lens driving unit 200 may be electrically connected to the circuit board 130 of the image sensor package 100. For example, the lens driving unit 200 may include a flexible printed circuit board (FPCB) 270, and the terminals 260 extending from the FPCB 270 may be disposed on a side surface of the base 210 of the lens driving unit 200. Therefore, the terminals 260 of the lens driving unit 200 may be electrically connected to the circuit board 130 of the image sensor package 100 using solder. In this specification, electrical connection means electrical connection achieved through physical and direct contact as well as electrical connection achieved through a conductive medium.

[0060] The signal applied to each of the plurality of terminals 260 of the lens drive unit 200 may be a drive signal for one of the plurality of coils disposed on the housing 220 or the spool 230. The drive signal may be in the form of a current signal or a voltage signal, and may include at least one of a DC signal or an AC signal. When the lens drive unit 200 is a lens drive unit for AF, the spool 230 on which the lens assembly 300 is mounted may be moved in the optical axis direction by the interaction between the coil to which the drive signal is applied and a magnet of the plurality of magnets positioned to face the coil.

[0061] Although not shown in the figure, the lens drive unit 200 may also include a Hall sensor and a sensing magnet for AF feedback operation.

[0062] Figure 4 This is a perspective view illustrating an image sensor package according to an embodiment of the present invention. Figure 5 This is an exploded perspective view showing an image sensor package according to an embodiment of the present invention. Figure 6 It is along Figure 4 A cross-sectional view of line A-A'. Figure 7 It is along Figure 4 A cross-sectional view of line B-B'. Figure 8 It shows Figure 4 An enlarged cross-sectional view of a portion of the image sensor package.

[0063] Reference Figures 4 to 8 The image sensor package 100 includes: a plate 110; an image sensor 120 disposed on the plate 110; a circuit board 130 disposed on the plate 110 and surrounding the image sensor 120; a connecting member 190 disposed on the image sensor 120 and the circuit board 130; and a filter 150 attached to the connecting member 190. Specifically, the circuit board 130 is disposed on the plate 110 and includes holes, and the image sensor 120 is disposed on the plate 110 and disposed within the holes of the circuit board 130.

[0064] In this case, the rigidity of plate 110 can be greater than that of image sensor 120 and circuit board 130. Therefore, when the area of ​​circuit board 130 increases with the increasing area of ​​image sensor 120, the plate 110 supports circuit board 130, preventing warping of circuit board 130 even when lens assembly 300 moves repeatedly driven by lens drive unit 200. Therefore, plate 110 can be referred to as a reinforcing member or reinforcing plate.

[0065] The plate 110 can be formed of a metallic material with a stiffness greater than that of the image sensor 120 and the circuit board 130. Therefore, the heat generated by the image sensor 120 and the circuit board 130 can be radiated downwards from the image sensor package 100 through the plate 110.

[0066] In this configuration, an adhesive member 160 may be provided between the plate 110 and the image sensor 120 and circuit board 130. The image sensor 120 and circuit board 130 can be fixed to the plate 110 by the adhesive member 160. In this configuration, the adhesive member 160 may include epoxy resin or silicone resin, but is not limited thereto. In addition to epoxy resin or silicone resin, the adhesive member 160 may also include thermally conductive inorganic fillers, such as alumina or boron nitride. Alternatively, the adhesive member 160 may include thermal grease. Therefore, the heat generated by the image sensor 120 and circuit board 130 can be transferred to the plate 110 through the adhesive member 160.

[0067] According to an embodiment of the present invention, a circuit board 130 is arranged to surround an image sensor 120, and the image sensor 120 is electrically connected to the circuit board 130 via a connecting member 190. The image sensor 120 may be a sensor that collects incident light and generates an image signal. The semiconductor element used as the image sensor 120 may be a charge-coupled device (CCD) sensor or a complementary metal-oxide-semiconductor (CMOS) sensor, and may be a semiconductor element that captures an image of a person or object and generates an electrical signal.

[0068] Image sensor 120 may include a plurality of pixels arranged in a matrix. Each pixel may include a photoelectric conversion element and at least one transistor for subsequently outputting a voltage level of the photoelectric conversion element. The area where the plurality of pixels are disposed may be the active area 122 of image sensor 120. The active area of ​​image sensor 120 may be interchanged with a light receiving section. Image sensor 120 may also include a non-active area 124 surrounding the active area 122.

[0069] The circuit board 130 can be a rigid printed circuit board (RPCB), a flexible printed circuit board (FPCB), a rigid-flex printed circuit board (RFPCB), or a ceramic printed circuit board. Various passive components 132 can be disposed on the circuit board 130. For example, a multilayer ceramic capacitor (MLCC) can be disposed on the circuit board 130. As shown, when the circuit board is the RFPCB shown in the embodiment of the present invention, the circuit board 130 can include two rigid regions RA1 and RA2 and a flexible region FA disposed between these two rigid regions RA1 and RA2. In this case, the image sensor 120, the filter 150, the lens driving unit 200, and the lens assembly 300 can be disposed on one of the rigid regions RA1, other components (such as terminals) can be disposed on the other rigid region RA2, and the flexible region FA can be disposed between the rigid region RA1 and the other rigid region RA2.

[0070] In this case, each rigid region may include: a first rigid layer RL1; a flexible layer FL disposed on the first rigid layer RL1; and a second rigid layer RL2 disposed on the flexible layer FL, and the flexible region FL may be connected to the flexible layer FL in the rigid regions RA1 and RA2.

[0071] Therefore, due to the flexible region FA between the rigid regions RA1 and RA2, the circuit board 130 can be folded, and the camera device 1000 can be accommodated in a folded state within a small area.

[0072] According to an embodiment of the present invention, the circuit board 130 is arranged to surround the image sensor 120, and the image sensor 120 is electrically connected to the circuit board 130 via a connecting member 190.

[0073] Specifically, refer to Figure 5 and Figure 8 The connecting member 190 includes: a first adhesive layer 192; a conductive pattern layer 194 disposed on the first adhesive layer 192; and a second adhesive layer 196 disposed on the conductive pattern layer 194. According to an embodiment of the present invention, the first adhesive layer 192 may be an anisotropic conductive layer. Therefore, in this specification, the first adhesive layer 192 and the anisotropic conductive layer 192 may be used interchangeably.

[0074] An anisotropic conductive layer can be a layer through which current flows only in a specific direction, and can be an anisotropic conductive film or anisotropic conductive adhesive. An anisotropic conductive layer can be a layer in which tiny conductive particles are dispersed in a non-conductive adhesive, and when the anisotropic conductive layer is arranged and pressed between components that need to be connected, current can flow in the direction of pressing. Examples of the tiny particles contained in the anisotropic conductive layer can be metallic materials (such as Au, Ni, Pd, etc.). For example, tiny particles can be formed by coating a polymer with a metallic material (such as Au, Ni, Pd, etc.) and then coating the metallic material with an insulating layer, but the invention is not limited thereto. The adhesive contained in the anisotropic conductive layer can include thermosetting resins, such as epoxy resins, polyurethane resins, or acrylic resins.

[0075] Therefore, the conductive pattern layer 194 can be electrically connected to the circuit board 130 and the image sensor 120, but not in direct contact with them.

[0076] The conductive pattern layer 194 includes a conductive metal material (such as Cu) and is disposed on the upper surface of the first adhesive layer 192. One end of the conductive pattern layer 194 may be disposed on the upper surface of the first adhesive layer 192 located on the image sensor 120, and the other end of the conductive pattern layer 194 may be disposed on the upper surface of the first adhesive layer 192 located on the circuit board 130, so that the image sensor 120 can be electrically connected to the circuit board 130.

[0077] Meanwhile, according to an embodiment of the present invention, the first adhesive layer 192 may include a first hole 192h formed in a region corresponding to the center of the image sensor 120, and a conductive pattern layer 194 may be disposed on the upper surface of the first adhesive layer 192 and surrounding the region in which the first hole 192h is formed. In this case, the edge of the first hole 192h of the first adhesive layer 192 may be disposed on the non-active region 124 of the image sensor 120. Therefore, the first adhesive layer 192 and the conductive pattern layer 194 can connect the image sensor 120 and the printed circuit board 130 without reducing the light receiving efficiency of the active region 122 of the image sensor 120.

[0078] Furthermore, according to an embodiment of the present invention, a second adhesive layer 196 is disposed on the image sensor 120 and the circuit board 130, and overlaps with the first adhesive layer 192. The second adhesive layer 196 includes a second hole 196h, which is formed to correspond to the first hole 192h of the first adhesive layer 192. A conductive pattern layer 194 is disposed between the first adhesive layer 192 and the second adhesive layer 196. Therefore, the filter 150 can directly face the image sensor 120 in the optical axis direction without reducing the light receiving efficiency of the effective area 122 of the image sensor 120. The lower surface of the second adhesive layer 196 faces and is bonded to the first adhesive layer 192 and the conductive pattern layer 194, and the upper surface of the second adhesive layer 196 faces and is bonded to the filter 150. Therefore, the first adhesive layer 192, the conductive pattern layer 194, and the filter 150 can be stably bonded through the second adhesive layer 196.

[0079] More specifically, refer to Figure 8 A first groove 801 is formed in the upper surface of the image sensor 120, and a second groove 802 is formed in the upper surface of the circuit board 130. The first groove 801 can be formed in the inactive area 124 of the image sensor 120. The second groove 802 can be formed in the rigid layer RL2 of the circuit board 130. Although not shown in the figure, electrode pads can be disposed on the bottom surface of the first groove 801 and the bottom surface of the second groove 802.

[0080] According to an embodiment of the present invention, a first adhesive layer 192 of the connecting member 190 is disposed on the image sensor 120 and the circuit board 130. For example... Figure 5 As shown, the first adhesive layer 192 includes a first aperture 192h formed in a region corresponding to the center of the image sensor 120. The area of ​​the first aperture 192h can be larger than the area of ​​the effective region 122 of the image sensor 120, and smaller than the total area of ​​the image sensor 120 including the ineffective region 124. That is, the edge of the first aperture 192h can be disposed on the ineffective region 124 of the image sensor 120. Therefore, the first adhesive layer 192 can be effectively disposed on the electrode pads (not shown) in the ineffective region 124 of the image sensor 120 without reducing the light receiving efficiency of the effective region 122 of the image sensor 120.

[0081] Refer again Figure 8A first adhesive layer 192 is disposed in the region from the first recess 801 of the image sensor 120 to the second recess 802 of the circuit board 130. That is, the first adhesive layer 192 fills the interior portions of the second recess 802 of the circuit board 130 and the first recess 801 of the image sensor 120, and connects the first recess 801 and the second recess 802. The first adhesive layer 192 can be disposed on the upper surface of the image sensor 120, extending a predetermined distance from the first recess 801 of the image sensor 120 toward the center of the image sensor 120, and can be disposed on the upper surface of the circuit board 130, extending a predetermined distance from the second recess 802 of the circuit board 130 toward the outer side of the circuit board 130. Therefore, the entire lower surface of the first adhesive layer 192 can directly contact the upper surface of the image sensor 120 and the upper surface of the circuit board 130. The upper surface of the first adhesive layer 192 may include a flat surface 810 and a recessed surface, and the conductive pattern layer 194 can be accommodated in the recessed surface. In this case, the flat surface 810 can be a region that is disposed on the upper surface of the image sensor 120, extending a predetermined distance further from the first recess 801 of the image sensor 120 toward the center of the image sensor 120, and disposed on the upper surface of the circuit board 130, extending a predetermined distance further from the second recess 802 of the circuit board 130 toward the outer side of the circuit board 130. Furthermore, the recessed surface can be the region from the first recess 801 of the image sensor 120 to the second recess 802 of the circuit board 130. The recessed surface may include a first recess 811 disposed in the first recess 801, a second recess 812 disposed in the second recess 802, and a third recess 813 disposed between the first recess 811 and the second recess 812.

[0082] Meanwhile, the conductive pattern layer 194 includes protrusions protruding toward the image sensor 120 and protrusions protruding toward the circuit board 130. The conductive pattern layer 194 includes: a first electrode 821 disposed in a first recess 811; a second electrode 822 disposed in a second recess 812; and a connecting electrode 823 disposed in a third recess 813 and connecting the first electrode 821 to the second electrode 822. That is, the protrusion protruding toward the image sensor 120 can be the first electrode 821 disposed in the first recess 811, and the protrusion protruding toward the circuit board 130 can be the second electrode 822 disposed in the second recess 812. According to an embodiment of the present invention, the conductive pattern layer 194 may include a plurality of conductive patterns, and the conductive patterns may include the first electrode 821, the second electrode 822, and the connecting electrode 823. According to an embodiment of the present invention, the plurality of conductive patterns may extend parallel to each other in a direction from the image sensor 120 toward the circuit board 130. Therefore, the conductive pattern layer 194 can be electrically connected to the circuit board 130 and the image sensor 120 without directly contacting them.

[0083] In this case, the height of the flat surface 810 can be greater than the height of the third recess 813, and the height of the third recess 813 can be greater than the height of the first recess 811 and the second recess 812. In this case, the height can be based on a predetermined reference surface. For example, the predetermined reference surface can be the upper surface of the plate 110. That is, the thickness of the first adhesive layer 192 in the first recess 811 and the second recess 812 can be less than the thickness of the first adhesive layer 192 in the third recess 813, and the thickness of the first adhesive layer 192 in the third recess 813 can be less than the thickness of the first adhesive layer 192 on the flat surface 810. Therefore, the conductive pattern layer 194 can be stably accommodated in the first recess 811, the second recess 812, and the third recess 813 of the first adhesive layer 192, and the conductive pattern layer 194 can be surrounded by the first adhesive layer 192 and the second adhesive layer 194. Additionally, in the first recess 811, current can flow between the electrode pads (not shown) of the image sensor 120 and the first electrode 821, and in the second recess 812, current can flow between the electrode pads (not shown) of the circuit board 130 and the second electrode 822.

[0084] In this configuration, the width of the first recess 811 can be smaller than the width of the first groove 801, and the width of the second recess 812 can be smaller than the width of the second groove 802. The first groove 801 and the first electrode 821 can be separated from each other by the first adhesive layer 192, and the second groove 802 and the second electrode 822 can be separated from each other. In this configuration, the width can be horizontal, and the first groove 801 and the first electrode 821 can be vertically separated from each other, as can the second groove 802 and the second electrode 822. In this configuration, the distance between the bottom surface of the first groove 801 and the bottom surface of the first recess 811 can be smaller than the distance between the side surfaces of the first groove 801 and the side surfaces of the first recess 811, and the distance between the bottom surface of the second groove 802 and the bottom surface of the second recess 812 can be smaller than the distance between the side surfaces of the second groove 802 and the side surfaces of the second recess 812. Therefore, the electrode pads (not shown) on the bottom surface of the first recess 801 of the image sensor 120 can be electrically connected to the first electrode 811 via the first adhesive layer 192, and the electrode pads (not shown) on the bottom surface of the second recess 802 of the circuit board 130 can be electrically connected to the second electrode 812 via the first adhesive layer 192. That is, current can flow between the electrode pads (not shown) on the bottom surface of the first recess 801 of the image sensor 120 and the first electrode 821 facing each other, and current can flow between the electrode pads (not shown) on the bottom surface of the second recess 802 of the circuit board 130 and the second electrode 822 facing each other. Therefore, since the electrode pads of the image sensor 120 can be connected to the electrode pads of the circuit board 130 even without wire bonding, the wire bonding process can be omitted, preventing wire separation after wire bonding, and reducing the additional Z-direction length required for wire bonding. Therefore, the flange distance (FBL) can be further reduced.

[0085] According to an embodiment of the present invention, the thickness of the first electrode 821 and the second electrode 822 may be 1.5 times or more than the depth of the first groove 801 and the second groove 802, preferably 1.5 times to 10 times the depth, more preferably 1.5 times to 5 times the depth, and even more preferably 1.5 times to 3 times the depth. In this case, the thickness and depth may be in the vertical direction. Therefore, the first electrode 821 and the second electrode 822 may be stably disposed facing the bottom surface of the first groove 801 and the bottom surface of the second groove 802, respectively, with the first adhesive layer 192 therebetween. Thus, current may flow between the first electrode 821 and the electrode pad (not shown) disposed on the bottom surface of the first groove 801, and current may flow between the second electrode 822 and the electrode pad (not shown) disposed on the bottom surface of the second groove 802. When the thickness of the first electrode 821 and the second electrode 822 is less than the lower limit, the current may have difficulty flowing in the direction between the first electrode 821 and the bottom surface of the first groove 801, and in the direction between the second electrode 822 and the bottom surface of the second groove 801, due to the increased distance between the first electrode 821 and the bottom surface of the first groove 801, and in the direction between the second electrode 822 and the bottom surface of the second groove 801. When the thickness of the first electrode 821 and the second electrode 822 is greater than the upper limit, the total thickness of the image sensor package 100 will increase due to the corresponding increase in the thickness of the connecting electrode 813, thus making it difficult to reduce the FBL.

[0086] According to this structure, the image sensor 120, the first recess 811 and the first electrode 821 on the upper surface of the first adhesive layer 192, and the filter 150 can be vertically overlapped with each other, and the circuit board 130, the second recess 812 and the second electrode 822 on the upper surface of the first adhesive layer 192, and the filter 150 can also be vertically overlapped with each other. Therefore, when pressure is applied to the first adhesive layer 192 between the first electrode 821 and the image sensor 120 due to the weight of the filter 150, current can flow between the first electrode 821 and the electrode pads of the image sensor 120. Similarly, when pressure is applied to the first adhesive layer 192 between the second electrode 822 and the circuit board 130 due to the weight of the filter 150, current can flow between the second electrode 822 and the electrode pads of the circuit board 130. Therefore, the image sensor 120 and the circuit board 130 can be electrically connected via the conductive pattern layer 194 of the connecting member 190 instead of via wire bonding, thus eliminating the need for additional height for wire bonding and achieving a smaller FBL.

[0087] According to the structure of an embodiment of the present invention, the first adhesive layer 192 may include multiple regions with different thicknesses. That is, the thicknesses on the flat surface 810, the first recess 811, and the third recess 813 may be different from each other, and the thicknesses on the flat surface 810, the second recess 812, and the third recess 813 may also be different from each other. Furthermore, the conductive pattern layer 194 may include multiple regions with different thicknesses. In other words, the thickness of the first electrode 821 and the thickness of the second electrode 822 may be different from the thickness of the connecting electrode 823.

[0088] As described above, the lower surfaces of the image sensor package 100 and the base 210 of the lens driving unit 200 can be bonded to each other by an adhesive member. For this purpose, the adhesive member 180 can be as follows: Figure 4 and Figure 5 The setup is shown. The adhesive member 180 may include a hole formed in a region corresponding to the center of the image sensor 120 and may be disposed on the circuit board 130. In this case, the adhesive member 180 may be disposed between the pad 134 and the passive component 132 of the circuit board 130. Therefore, the passive component 132 of the circuit board 130 may be electrically insulated from the pads 134 and 136.

[0089] Figure 9 Figure 10 is a cross-sectional view illustrating an image sensor package according to another embodiment of the present invention. Figure 9 A perspective view of the second board in the image sensor package. (Omitted from reference) Figures 1 to 8 The content described is overlapping.

[0090] Reference Figure 9 A second board 140 may also be disposed on the printed circuit board 130. The second board 140 may be disposed on the printed circuit board 130 to surround the side surface of the filter 150 and the connecting member 190.

[0091] The rigidity of the second plate 140 can be greater than that of the circuit board 130. Therefore, when the area of ​​the circuit board 130 increases with the increasing area of ​​the image sensor 120, since the first plate 110 supports the lower surfaces of the circuit board 130 and the image sensor 120, and the second plate 140 supports the upper surface of the circuit board 130, even when the lens assembly 300 is repeatedly moved by the lens driving unit 200, the problem of warping of the circuit board 130 can be prevented. Therefore, the second plate 140 can be referred to as a reinforcing member or a reinforcing plate.

[0092] The thermal conductivity of the second plate 140 can be greater than that of the circuit board 130. Therefore, the heat generated from the circuit board 130 can be radiated upward from the image sensor package 100 not only through the first plate 110 but also through the second plate 140.

[0093] The second plate 140 may be formed of a metallic material to make it more rigid and thermally conductive than the circuit board 130. For example, the second plate 140 may contain copper, aluminum, stainless steel, etc., but is not limited to these.

[0094] An adhesive component (not shown) may also be provided between circuit board 130 and second board 140. In addition to epoxy or silicone resin, the adhesive component may also contain thermally conductive inorganic fillers, such as alumina or boron nitride. Optionally, the adhesive component may contain thermally conductive silicone grease. Therefore, heat generated by circuit board 130 can be transferred to second board 140 through the adhesive component.

[0095] The second plate 140 extends to the outside of the circuit board 130. That is, the entire outer side of the circuit board 130 is covered by the second plate 140. Therefore, since the second plate 140 supports the outer side of the upper surface of the circuit board 130, the problem of warping of the circuit board 130 can be prevented.

[0096] According to an embodiment of the present invention, the second plate 140 can extend to the outside of the circuit board 130 and further to the side surface of the circuit board 130, and the lower surface of the second plate 140 disposed on the side surface of the circuit board 130 can be configured to face the upper surface of the first plate 110. In this case, the first plate 110 and the second plate 140 can be directly connected or connected by an adhesive member (not shown). That is, the circuit board 130 may not be disposed between the lower surface of the second plate 140 located on the side surface of the circuit board 130 and the upper surface of the first plate 110. Therefore, the second plate 140 can prevent the side surface of the circuit board 130 from warping due to external impact or protect the side surface of the circuit board 130 from foreign objects. In addition, the rigidity of the image sensor package 100 can be further improved, and the heat radiated from the side surface of the circuit board 130 can be effectively transferred to the second plate 140 to achieve excellent thermal radiation effect.

[0097] The thickness of the second plate 140 can be from 0.1 mm to 0.5 mm, preferably from 0.1 mm to 0.4 mm, and more preferably from 0.1 mm to 0.3 mm. When the thickness of the second plate 140 is within this range, the FBL can be reduced while ensuring the minimum distance that should be maintained between the image sensor 120 and the filter 150. When the thickness of the second plate 140 is less than the lower limit of this range, it is difficult to manufacture the second plate 140, and when the thickness of the second plate 140 is greater than the upper limit of this range, it may not be possible to meet the requirement of reducing the FBL.

[0098] The second plate 140 includes a plurality of through holes. The second plate 140 includes a first through hole 142, which is disposed in a region including the center of the second plate 140, and the image sensor 130 is disposed in the first through hole. In this case, the area of ​​the first through hole 142 is larger than the area of ​​the image sensor 120. When the area of ​​the first through hole 142 is larger than the area of ​​the image sensor 120, the entire effective area of ​​the image sensor 120 can effectively receive incident light passing through the first through hole 142.

[0099] The second board 140 also includes a second through hole 144 disposed between the first through hole 142 and the outer side of the second board 140. As shown, the second through hole 144 can be provided as a plurality of second through holes 144, and the area of ​​each second through hole 144 can be smaller than the area of ​​the first through hole 142. As described above, a passive component 132 is also disposed on the circuit board 130. For example, the passive component 132 can be a capacitor, etc. The passive component 132 can be disposed in the second through hole 144.

[0100] Therefore, when the height (level) of the upper surface of one of the passive components 132 is higher than the height of the upper surface of the second plate 140, the passive component 132 can protrude upward from the second plate 140 through the second through hole 144. Thus, since no additional space is required below the lower surface of the second plate 140 to accommodate the passive component 132, the FBL can be reduced.

[0101] Although four second through holes 144 are shown, the invention is not limited thereto. The position and number of the second through holes 144 can be varied depending on the arrangement of the passive components 130.

[0102] As described above, the lens driving unit 200 of the camera device 1000 according to an embodiment of the present invention includes a plurality of coils and a plurality of magnets, and each coil is configured to face a magnet. When an electrical signal is applied to the coils, electrical interaction occurs between the coils and magnets configured to face each other, and the lens driving unit 200 can be driven to perform an AF function or an OIS function.

[0103] In this configuration, multiple coils and multiple magnets can be arranged symmetrically with respect to the lens assembly 300. For example, a pair of coils and magnets and another pair of coils and magnets can be arranged symmetrically, with the lens assembly 300 positioned between them. For this purpose, terminals 260 (through which electrical signals are applied to the coils) can be arranged symmetrically, with the lens assembly 300 positioned between them.

[0104] Terminal 260 (through which an electrical signal is applied to the coil) can be electrically connected to and receive electrical signals from circuit board 130. Terminal (through which an electrical signal is applied to the coil) can be electrically connected to pad 134 of circuit board 130 via solder (not shown).

[0105] According to an embodiment of the present invention, the second plate 140 further includes a 3-1 through hole 146 disposed between the first through hole 142 and the first outer side S1 of the second plate 140, and a 3-2 through hole 148 disposed between the first through hole 142 and the second outer side S2 of the second plate 140. The 3-1 through hole 146 and the 3-2 through hole 148 may be disposed symmetrically with respect to the first through hole 142. In addition, the first pad 134 and the second pad 136 may be disposed on the circuit board 130, the first pad 134 and the solder on the first pad 134 (not shown) may be disposed in the 3-1 through hole 146, and the second pad 136 and the solder on the second pad 136 (not shown) may be disposed in the 3-2 through hole 148. Therefore, the first pad 134 can be disposed between the first outer side of the circuit board 130 (which corresponds to the first outer side S1 of the second board 140) and the image sensor 120, and the second pad 136 can be disposed between the second outer side of the circuit board 130 (which corresponds to the second outer side S2 of the second board 140) and the image sensor 120, and the first pad 134 and the second pad 136 can be symmetrically disposed, with the image sensor 120 situated between them. In this case, the first pad 134 and the solder disposed on the first pad 134 electrically connect the terminal 260 (through which an electrical signal is applied to a pair of coils and magnets disposed on one side of the lens assembly 300) to the circuit board 130, and the second pad 136 and the solder disposed on the second pad 136 electrically connect the terminal 260 (through which an electrical signal is applied to another pair of coils and magnets disposed on the other side of the lens assembly 300) to the circuit board 130.

[0106] Therefore, when the upper surfaces of the solder on the first pad 134 and the second pad 136 are set at a height higher than the upper surface of the second board 140, the solder on the respective first pad 134 and the solder on the second pad 136 can protrude upward from the second board 140 through the 3-1 through hole 146 and the 3-2 through hole 148. Therefore, since there is no need to provide space on the second board 140 to accommodate the solder on the first pad 134 and the solder on the second pad 136, the FBL can be reduced, and the solder on the first pad 134 and the solder on the second pad 136 can be easily electrically connected to the terminals of the lens drive unit 200.

[0107] Alternatively, as shown in FIG10(b), the 3-1 through hole 146 may extend to the first outer side S1 of the second plate 140, and the 3-2 through hole 148 may extend to the second outer side S2 of the second plate 140. That is, the 3-1 through hole 146 may be replaced by a groove formed in the first outer side S1 of the second plate 140, and the 3-2 through hole 148 may be replaced by a groove formed in the second outer side S2 of the second plate 140.

[0108] Figure 11 This is a perspective view of a portable terminal including a camera device according to an embodiment of the present invention. Figure 12 It is shown Figure 11 A block diagram of a portable terminal is shown.

[0109] Reference Figure 11 and Figure 12 The portable terminal 1000A (hereinafter referred to as the "terminal") may include a main body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensor 740, an input / output (I / O) unit 750, a memory 760, an interface 770, a controller 780, and a power supply 790. The terminal 1000A may include the aforementioned camera device.

[0110] Figure 11 The body 850 shown is strip-shaped, but not limited to this, and can have one of various structures in which two or more sub-bodies are relatively movably connected, such as sliding type, folding type, swing type, and rotating type.

[0111] The body 850 may include a housing (outer shell, cover, cap, etc.) forming the exterior. For example, the body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be installed in the space formed between the front housing 851 and the rear housing 852.

[0112] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 1000A and the wireless communication system or between the terminal 1000A and the network in which the terminal 1000A resides. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a short-range communication module 714, and a location information module 715.

[0113] The A / V input unit 720 can be a unit for inputting audio or video signals, and includes a camera 721, a microphone 722, etc.

[0114] Camera 721 may include according to Figures 1 to 1 The camera device 1000 of the embodiment shown in Figure 0.

[0115] Sensor 740 can detect the current state of terminal 1000A, such as whether terminal 1000A is open or closed, the position of terminal 1000A, user touch, orientation of terminal 1000A, and acceleration / deceleration of terminal 1000A, and generate sensing signals for controlling the operation of terminal 1000A. For example, when terminal 1000A is a slider phone, sensor 740 can detect whether the slider phone is open or closed. In addition, sensor 740 performs sensing functions related to whether power supply 790 is providing power and whether interface 770 is connected to an external device.

[0116] I / O unit 750 generates inputs or outputs related to vision, hearing, or touch. I / O unit 750 can generate input data for operation control of terminal 1000A and display it on information processed in terminal 1000A.

[0117] The I / O unit 750 may include a keyboard 730, a display module 751, an audio output module 752, and a touch screen panel 753. When data is input via the keyboard, the keyboard 730 can generate input data.

[0118] Display module 751 may include a plurality of pixels, the colors of which change according to electrical signals. For example, display module 751 may include at least one of liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, and three-dimensional (3D) display.

[0119] The audio output module 752 can output audio data received from the wireless communication unit 710 in call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or it can output audio data stored in the memory 760.

[0120] The touchscreen panel 753 can convert the change in electrostatic capacitance generated when a user touches a specific area of ​​the touchscreen into an electrical input signal.

[0121] The memory 760 may store programs for processing and controlling the controller 780, and temporarily store I / O data (e.g., phone books, messages, audio, still images, pictures, videos, etc.). For example, the memory 760 may store images captured by the camera 721, such as pictures or videos.

[0122] Interface 770 serves as a channel through which terminal 1000A connects to an external device. Interface 770 receives data or power from the external device and transmits the received data or power to components in terminal 1000A, or allows data in terminal 1000A to be transmitted to an external device. For example, interface 770 may include a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connection to a device including an identification module, an audio I / O port, a video I / O port, an earphone port, etc.

[0123] The controller 780 can control the overall operation of the terminal 1000A. For example, the controller 780 can perform related control and processing for voice calls, data communication, video calls, etc.

[0124] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the controller 180 or separately from the controller 780.

[0125] The controller 780 can perform pattern recognition processing to recognize handwritten or drawing input performed via the touchscreen as text or an image, respectively.

[0126] The power supply 790 can receive external or internal power and provide the power required for the operation of the components according to the control of the controller 780.

[0127] Furthermore, the aforementioned camera device can be applied to electronic or optical devices, including terminals. The electronic or optical device can be any of a mobile phone, portable phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, personal digital assistant (PDA), portable multimedia player (PMP), and navigation device. However, the type of optical device is not limited to these, and any device used to capture images or take photographs can be included in the optical device.

[0128] Although the invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An image sensor package, comprising: plate; A circuit board, disposed on the board and including holes; An image sensor is mounted on the plate and disposed in the hole; A connecting component is disposed on the circuit board and the image sensor; as well as A filter is disposed on the connecting member. A first groove is formed in the upper surface of the image sensor. A second groove is formed in the upper surface of the circuit board, and The connecting member includes: a first adhesive layer disposed in the region from the first groove to the second groove; a conductive pattern layer disposed on the first adhesive layer; and a second adhesive layer disposed on the conductive pattern layer.

2. The image sensor package according to claim 1, wherein: The upper surface of the first adhesive layer includes a flat surface and a recessed surface; The recessed surface includes: a first recess disposed in the first groove; a second recess disposed in the second groove; and a third recess disposed between the first recess and the second recess; and The conductive pattern layer is disposed on the recessed surface.

3. The image sensor package according to claim 2, wherein: The height of the flat surface is greater than the height of the third recess; and The height of the third recess is greater than the heights of the first recess and the second recess.

4. The image sensor package according to claim 3, wherein: The width of the first recess is smaller than the width of the first groove; and The width of the second recess is smaller than the width of the second groove.

5. The image sensor package according to claim 4, wherein the conductive pattern layer comprises: The first electrode is disposed in the first recess; The second electrode is disposed in the second recess; as well as A connecting electrode is disposed in the third recess and connects the first electrode and the second electrode. The first groove and the first electrode are separated from each other by the first adhesive layer. The second groove and the second electrode are separated from each other by the first adhesive layer. The image sensor and the first electrode are electrically connected through the first adhesive layer, and The circuit board and the second electrode are electrically connected through the first adhesive layer.

6. The image sensor package of claim 5, wherein the thickness of each of the first electrode and the second electrode is 1.5 times or more the depth of each of the first groove and the second groove.

7. The image sensor package according to claim 5, wherein: The image sensor, the first recess, the first electrode, and the filter are vertically overlapped; and The circuit board, the second recess, the second electrode, and the filter are vertically overlapped.

8. The image sensor package according to claim 1, wherein: The first adhesive layer includes a first hole formed in a region corresponding to the center of the image sensor; and The conductive pattern layer is disposed around the region in which the first hole is formed.

9. The image sensor package according to claim 8, wherein: The second adhesive layer includes a second hole, which is formed to correspond to the first hole in the first adhesive layer; and The filter faces the image sensor directly along the optical axis.

10. The image sensor package of claim 1, wherein the first adhesive layer comprises an anisotropic conductive layer.

Images